CN110132561B - Extreme environment-oriented blade stress/strain dynamic testing method - Google Patents
Extreme environment-oriented blade stress/strain dynamic testing method Download PDFInfo
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- CN110132561B CN110132561B CN201910404487.2A CN201910404487A CN110132561B CN 110132561 B CN110132561 B CN 110132561B CN 201910404487 A CN201910404487 A CN 201910404487A CN 110132561 B CN110132561 B CN 110132561B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
- G01B7/22—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in capacitance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M13/00—Testing of machine parts
Abstract
The invention discloses a blade stress/strain dynamic testing method facing an extreme environment, which comprises the following steps: s1, sputtering high-temperature-resistant sensitive chip films on blades of the aero-engine/thermal power generation gas turbine by adopting a magnetron sputtering process, and respectively sputtering high-temperature-resistant reading antenna films on the surface of a shell of the aero-engine/thermal power generation gas turbine; s2, connecting two ends of the high-temperature-resistant reading antenna film with a rear-end processing module integrating a power supply unit, a data reading unit and a data storage unit; s3, when the blade rotates at high speed, the interdigital capacitor in the high temperature resistant sensitive chip film changes due to sensing the stress deformation of the blade, resulting in the resonant frequency f in the LC loop0Change the resonant frequency f0The test data is transmitted to a back-end processing module in a wireless non-contact mode, and the real-time test of the surface stress/strain parameters of the rotating blade can be realized through the analysis and the processing of a data reading unit. The invention can realize dynamic measurement of the surface stress/strain parameters of the rotating blade in severe environment.
Description
Technical Field
The invention relates to the technical field of stress-strain testing, in particular to a blade stress/strain dynamic testing method facing an extreme environment.
Background
For civil aircraft engines and thermal power generation gas turbines, the internal blades are in extremely severe environments (such as high temperature, high rotation, strong vibration, impact, corrosion and the like) in working states, and the reliable working life of the blades is a key technical index for the performance of the civil aircraft engines and the thermal power generation gas turbines, so that the real-time detection of the surface stress/strain parameters of the blades in the working states is very important. Because the rotating blade is in complex and severe environments such as high temperature, high rotation, strong vibration, impact, corrosion and the like, the working condition is extremely harsh, and the traditional stress/strain sensor cannot be arranged on the surface of the blade and cannot directly/indirectly realize the real-time dynamic test of the stress/strain parameters of the surface of the blade. Therefore, it is necessary to invent a brand-new blade stress/strain dynamic testing method facing extreme environments to achieve dynamic measurement of surface stress/strain parameters of a rotating blade in severe environments such as high temperature, high rotation, strong vibration, impact, corrosion and the like.
Disclosure of Invention
The invention provides a blade surface stress/strain testing method facing an extreme environment, and aims to solve the problems in the background art so as to realize real-time dynamic measurement of blade surface stress/strain parameters in severe environments such as high temperature, high rotation, strong vibration, impact, corrosion and the like.
In order to achieve the purpose, the invention adopts the technical scheme that:
a blade stress/strain dynamic testing method facing extreme environments comprises the following steps:
s1, sputtering a high-temperature-resistant sensitive chip film on a blade of the aero-engine/thermal power generation gas turbine by adopting a magnetron sputtering process, and respectively sputtering high-temperature-resistant reading antenna films on the surface of a shell of the aero-engine/thermal power generation gas turbine, wherein the middle layer of the high-temperature-resistant sensitive chip film and the middle layer of the high-temperature-resistant reading antenna films are coupled through inductance to realize wireless non-contact transmission of data; the middle layer of the high-temperature-resistant sensitive chip film is an electrical performance element film, an LC loop is formed by connecting the interdigital capacitors and the spiral inductor in series, the outer ends of the spiral inductors are directly connected with one ends of the interdigital capacitors, and the inner ends of the spiral inductors are spirally wound out to be connected with the other ends of the interdigital capacitors; the middle layer of the high-temperature-resistant reading antenna film is a coaxial spiral inductance film;
s2, connecting two ends of the high-temperature-resistant reading antenna film with a rear-end processing module integrating a power supply unit, a data reading unit and a data storage unit respectively;
s3, when the blade rotates at high speed, the power supply unit in the back-end processing module provides energy for the high-temperature-resistant sensitive chip film through mutual inductance coupling between inductors, and the interdigital capacitor in the high-temperature-resistant sensitive chip film changes due to the sensing of the stress deformation of the blade, so that the resonant frequency f in the LC loop0Change the resonant frequency f0The test data is transmitted to a back-end processing module in a wireless non-contact mode, and the real-time test of the surface stress/strain parameters of the rotating blade can be realized through the analysis and the processing of a data reading unit.
Furthermore, the top layer and the bottom layer of the high-temperature-resistant sensitive chip film and the top layer and the bottom layer of the high-temperature-resistant reading antenna film are both Al2O3A film.
Further, the coaxial spiral inductance film is made of high-temperature-resistant metal Pt.
Further, the Al2O3The film was prepared by the following steps:
a. sequentially cleaning the surface of the blade by using acetone, ethanol and deionized water to prevent the adhesion of the film from being reduced due to unclean surface of the blade;
b. respectively placing a metal Al target material and a clean blade on a corresponding target position and a sample rotating platform;
c. vacuumizing the coating chamber until the vacuum degree of the coating chamber reaches 1 x 10-3When Pa, closing the vacuum gauge and stopping vacuum treatment;
d. will be mixed withSynthesis of uniform Ar and O2Introducing into a vacuum coating chamber, stopping introducing air when the working air pressure of the chamber reaches 0.1Pa and maintaining stability;
e. starting a sputtering power supply to start sputtering, and ionizing Ar in the vacuum coating chamber into Ar+And e-And starting the sample rotation stage to ensure Al2O3Uniformly forming a film on the surface of the blade;
surface of Al metal target by Ar+Bombarding out Al particles, and reacting the Al particles with oxygen in the vacuum coating cavity to form Al2O3And moves towards the blade, and Al particles deposited on the surface of the blade are also subjected to O2Influence to form Al2O3A film;
g. when Al on the surface of the blade2O3When the film reaches 1 μm, the sputtering power is turned off, the sputtering stops, the blade stops rotating, Al2O3And finishing the film sputtering.
Further, the electric performance element film is prepared by the following steps:
a. in order to ensure the cleanness of the blade surface in the gluing process, Al is firstly sputtered on the blade surface2O3Cleaning and dehydrating the surface of the thin film blade, wherein during dehydration, the blade is placed in a box type drying furnace at the temperature of 150-200 ℃ for 30min, and the residual solution on the surface of the blade is dried;
b. placing the blade on a rotating table for standing, and dropping the photoresist on Al2O3Accelerating the rotation of the blade on the surface of the film to make the photoresist be uniformly coated on Al2O3After photoresist is coated on the surface of the film in a spin mode, the blade is dried by using a box type drying furnace to remove the solvent in the photoresist, and the adhesive property of the photoresist is enhanced;
c. preparing a graphic mask plate of a required electrical property element, placing the graphic mask plate above a blade coated with photoresist, and irradiating the mask plate by using exposure light for 3-5 s to completely transfer the graphic of the mask plate to the surface of the blade;
d. drying the exposed blades again at 100 ℃ by using a box type drying furnace to reduce standing wave reaction between an exposure area and a non-exposure area, so as to avoid influence on the resolution of the pattern of the electrical property element after development and enable the photoresist in a photosensitive area to fully react;
e. soaking the exposed blade in a developing solution for 5-10 s, and removing the photosensitive photoresist to display the electrical property element graph;
f. at a vacuum degree of 3 x 10-3In a coating cavity with the working pressure of 0.5Pa and the high-temperature resistant metal Pt as a sputtering target material, and Ar as sputtering gas, preparing a metal Pt film with the thickness of 0.5 mu m;
g. soaking the blade sputtered with the Pt film in an organic solution which is mutually soluble with the photoresist, cleaning the blade with deionized water to remove the redundant photoresist, and removing the photoresist by using the organic solution to prevent the blade from being corroded.
Further, the coaxial spiral inductance film is prepared by the following steps:
a. after the metal Pt target material is placed on a sample rotating table, the coating cavity is vacuumized until the air pressure of the cavity is 3 multiplied by 10-3Stopping vacuumizing when Pa;
b. slowly introducing Ar into the vacuum chamber, stopping introducing the Ar when the air pressure in the vacuum chamber reaches 0.5Pa required by sputtering, and keeping the Ar stable;
C. after the ventilation is finished, a sputtering power supply is started to start sputtering, and ionized Ar is generated+Moving towards the Pt target material direction and bombarding the target material, wherein Pt particles are bombarded out to move towards the shell and deposit on the surface of the shell to form a Pt film, and the power supply is turned off to stop sputtering when the Pt film is deposited to be 0.5 mu m thick.
The invention has the following beneficial effects:
aiming at the problems of the traditional stress/strain sensor in the application process, the invention selects the magnetron sputtering process to directly sputter the high-temperature-resistant sensitive chip film of the sensor on the surface of the rotating blade of the aero-engine/thermal power generation gas turbine, and the film prepared by the process has high film forming rate and light weight and meets the high requirement of the rotating blade of the aero-engine/thermal power generation gas turbine on the quality.
In electrical performance of the device thin filmAxial spiral inductorRespectively sputtering a layer of high-temperature resistant Al on the upper and lower surfaces of the film2O3Film, bottom surface of Al2O3The film improves the adhesiveness of the film of the electrical element and the metal blade as well as the film of the coaxial spiral inductor and the metal shell and insulates the film of the electrical element and the metal blade, so that the high-temperature-resistant sensitive chip film and the high-temperature-resistant reading antenna film in work can be very firmly arranged on the surfaces of the high-speed rotating blade and the shell without falling off, and the Al on the upper surface2O3The film enables the high-temperature-resistant sensitive chip film and the high-temperature-resistant reading antenna film not to be influenced by severe environments such as high temperature, high rotation, strong vibration, impact, corrosion and the like when the aero-engine/thermal power generation gas turbine works.
The high-temperature resistant reading antenna is in electromagnetic coupling with the high-temperature resistant sensitive chip to achieve energy and signal transmission, the signal to be detected is transmitted to the rear-end processing module connected with the high-temperature resistant reading antenna in a non-contact mode, and wireless dynamic acquisition of surface stress/strain parameters of the rotating blade in a special environment can be achieved.
The high-temperature-resistant sensitive chip film prepared by the magnetron sputtering process is light and thin (less than 0.1g) in quality, is placed on the surface of a blade of an aeroengine and a gas turbine, and meets the quality requirement.
Drawings
FIG. 1 is a schematic diagram of a blade stress/strain dynamic testing method for extreme environments according to an embodiment of the invention.
FIG. 2 is a schematic structural diagram of a high temperature resistant sensitive chip film in an embodiment of the present invention.
FIG. 3 is a cross-sectional view of a thin film of a refractory sensitive chip in an embodiment of the invention.
FIG. 4 is a schematic structural diagram of a back-end processing module according to an embodiment of the present invention
Fig. 5 is a schematic structural diagram of an electrical device film of a high temperature resistant sensitive chip in an embodiment of the invention.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications can be made by persons skilled in the art without departing from the spirit of the invention. All falling within the scope of the present invention.
As shown in fig. 1, the extreme environment-oriented dynamic blade stress/strain testing method of the present invention is implemented based on a high temperature resistant sensitive chip film, a high temperature resistant reading antenna film, and a back-end processing module, wherein the high temperature resistant sensitive chip film is sputtered on the surface of a rotating blade of an aircraft engine/thermal power gas turbine, the high temperature resistant reading antenna film is sputtered on the surface of a casing of the aircraft engine/thermal power gas turbine, and the two methods implement dynamic measurement of the surface stress/strain parameters of the rotating blade in a wireless non-contact manner. The structure and cross-sectional view of the high temperature-resistant sensitive chip film are shown in FIG. 2 and FIG. 3, the top layer and the bottom layer are made of high temperature-resistant Al2O3The thickness of the thin film is 1 μm, the middle layer is an electric performance element thin film with the thickness of 0.5 μm, the structural schematic diagram of the electric performance element thin film is shown in fig. 5, an LC loop is formed by connecting the interdigital capacitor and the spiral inductor in series, the outer end of the spiral inductor is directly connected with one end of the interdigital capacitor, and the inner end of the spiral inductor is spirally wound out to be connected with the other end of the interdigital capacitor; the top layer and the bottom layer of the high-temperature resistant reading antenna are the same as the high-temperature resistant sensitive chip film and are made of Al2O3The middle layer of the film is a coaxial spiral inductance film made of high-temperature-resistant metal Pt; the high-temperature-resistant reading antenna film is characterized in that two ends of the high-temperature-resistant reading antenna film are connected with the rear-end processing module, a power supply unit in the rear-end processing module provides energy for the high-temperature-resistant sensitive chip film through mutual inductance coupling among inductors, and when the blade rotates to work, interdigital capacitors in the high-temperature-resistant sensitive chip sputtered on the surface of the blade change due to stress deformation of the blade, so that the resonant frequency f of the sensitive chip is changed0The change can be transmitted to a sensor rear-end processing module connected with a high-temperature resistant reading antenna in a wireless non-contact mode and stored in a data storage unit in real time, and the data reading unit can realize real-time analysis of stress/strain parameters of the surface of the rotating blade by processing and analyzing data in the data storage unit. As shown in fig. 4, the back-end processing module includes a power supply unit, a data reading unit and a data storage unitThe units are integrated.
Examples
A blade stress/strain dynamic testing method facing extreme environments comprises the following steps:
s1, sputtering high-temperature-resistant sensitive chip films on blades of the aero-engine/thermal power generation gas turbine by adopting a magnetron sputtering process, and respectively sputtering high-temperature-resistant reading antenna films on the surface of a shell of the aero-engine/thermal power generation gas turbine;
s11, sputtering a high-temperature-resistant sensitive chip film on the surface of a blade of an aircraft engine/thermal power generation gas turbine by adopting a magnetron sputtering process;
s111, sputtering Al with the thickness of 1 mu m on the cleaned blade by adopting a magnetron sputtering process2O3A film;
s112, adopting a magnetron sputtering process to form Al2O3On the film, high temperature resistant metal Pt is used as a sputtering target material, Ar is used as sputtering gas, and an electrical performance element film with the thickness of 0.5 mu m is prepared;
s113, sputtering Al with the thickness of 1 mu m on the electric performance element film by adopting a magnetron sputtering process2O3A film;
s12, sputtering a high-temperature-resistant reading antenna film on the surface of the shell of the aircraft engine/thermal power generation gas turbine by adopting a magnetron sputtering process;
s121, sputtering Al with the thickness of 1 mu m on the cleaned shell by adopting a magnetron sputtering process2O3A film;
s122, adopting a magnetron sputtering process to form Al2O3On the film, a coaxial spiral inductance film with the thickness of 0.5 mu m is prepared by taking high-temperature-resistant metal Pt as a sputtering target material and Ar as sputtering gas;
s123, sputtering Al with the thickness of 1 mu m on the coaxial spiral inductance film by adopting a magnetron sputtering process2O3A film;
s2, connecting two ends of the high-temperature-resistant reading antenna film with a rear-end processing module respectively;
s3, when the blade rotates at high speed, the power supply sheet in the back-end processing moduleThe mutual inductance coupling between the inductors provides energy for the high-temperature-resistant sensitive chip film, and the interdigital capacitance in the high-temperature-resistant sensitive chip film changes due to the stress deformation of the sensing blade, so that the resonant frequency f in the LC loop0Change the resonant frequency f0The test data is transmitted to a back-end processing module in a wireless non-contact mode, and the real-time test of the surface stress/strain parameters of the rotating blade can be realized through the analysis and the processing of a data reading unit.
In this example, Al is mentioned2O3The main principle of film preparation is by Ar+Bombarding the metallic aluminum target to obtain aluminum particles, the aluminum particles and O in the vacuum coating chamber2React to form Al2O3A film. The preparation process comprises the following steps:
a. sequentially cleaning the surface of the blade by using acetone, ethanol and deionized water to prevent the adhesion of the film from being reduced due to unclean surface of the blade;
b. respectively placing the metal Al target material and the cleaned blade on corresponding target positions and a sample table for fixing;
c. the coating chamber is vacuumized to reach the vacuum condition required by coating, namely 1 x 10-3When Pa, closing the vacuum gauge and stopping vacuum treatment;
d. introducing Ar and O which are uniformly mixed into the vacuum coating chamber2Controlling the ventilation rate to control the air pressure of the vacuum coating chamber, stopping ventilation when the required working air pressure reaches 0.1Pa and maintaining stability;
e. starting a sputtering power supply to start sputtering, and ionizing Ar in the vacuum coating chamber into Ar+And e-And starting the sample rotation stage to ensure Al2O3Uniformly forming a film on the surface of the blade;
surface of Al metal target by Ar+Bombarding Al particles, and reacting the Al particles with oxygen in the vacuum coating chamber to obtain Al2O3And moves towards the blade, and Al particles deposited on the surface of the blade are also subjected to O2Influence to form Al2O3A film;
g. when Al on the surface of the blade2O3When the thickness of the film reaches 1 μm, the sputtering power supply is turned off, the sputtering stops, the blade stops rotating, and Al2O3And finishing the film sputtering.
In this embodiment, the preparation process of the electrical property element thin film includes patterning of an electrical property element and preparation of a Pt thin film, and the specific preparation method is as follows:
a. in order to ensure the cleanness of the blade surface in the gluing process, Al is sputtered on the blade surface2O3Cleaning and dehydrating the surface of the leaf of the film, and during dehydration, placing the leaf in a box type drying furnace at the temperature of 150-200 ℃ for about 30min to dry the residual solution on the surface of the leaf;
b. placing the clean blade on a rotating table for standing until the photoresist drops on Al2O3After the surface of the film is coated, the blade is accelerated to rotate so that the photoresist is uniformly coated on Al2O3After photoresist is spun on the surface of the film, drying the blade by using a box type drying furnace to remove a solvent in the photoresist, and enhancing the adhesive property of the photoresist;
c. preparing a graphic mask plate of a required electrical component, placing the graphic mask plate above the blade coated with the photoresist, and irradiating the mask for 3-5 seconds by using the light of an explosion lamp to completely transfer the graphic of the mask plate to the surface of the blade;
d. drying the exposed blades again at 100 ℃ by using a box type drying furnace to reduce standing wave reaction between an exposure area and a non-exposure area, so as to avoid influence on the resolution of the pattern of the electrical property element after development and enable the photoresist in a photosensitive area to fully react;
e. soaking the exposed blade in a developing solution for 5-10 s, and removing the photosensitive photoresist to display the electrical property element graph;
f. at a vacuum degree of 3 x 10-3Pa, under the condition that the working air pressure of the chamber is 0.5Pa, preparing a metal Pt film with the thickness of 0.5 mu m by taking high-temperature-resistant metal Pt as a sputtering target material and Ar as sputtering gas;
g. soaking the blade sputtered with the Pt film in an organic solution (such as acetone) which is mutually soluble with the photoresist, cleaning the blade with deionized water to remove the redundant photoresist, and removing the photoresist by using the organic solution to prevent the blade from being corroded.
In this embodiment, the coaxial spiral inductor thin film is prepared by using a high-temperature-resistant metal Pt as a sputtering target material and adopting a magnetron sputtering process with a compact film formation and a light weight, and the specific preparation process includes:
d. after the metal Pt target material is placed on a sample rotating table, the coating cavity is vacuumized until the air pressure of the cavity is 3 multiplied by 10-3Stopping vacuumizing when Pa;
e. slowly introducing Ar into the vacuum chamber, stopping introducing the Ar when the air pressure in the vacuum chamber reaches 0.5Pa, and maintaining the Ar stably;
f. after ventilation, the sputtering power supply is started to start sputtering, and Ar ionized+Moving towards the Pt target material direction and bombarding the target material, wherein Pt particles are bombarded out to move towards the shell and deposit on the surface of the shell to form a Pt film; the sputtering process was carried out at a constant rate under power control, and the power was turned off to stop sputtering when the thickness of the Pt film to be deposited reached 0.5 μm.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (6)
1. A blade stress/strain dynamic testing method facing extreme environments is characterized by comprising the following steps:
s1, sputtering a high-temperature-resistant sensitive chip film on a blade of the aero-engine/thermal power generation gas turbine by adopting a magnetron sputtering process, and respectively sputtering high-temperature-resistant reading antenna films on the surface of a shell of the aero-engine/thermal power generation gas turbine, wherein the middle layer of the high-temperature-resistant sensitive chip film and the middle layer of the high-temperature-resistant reading antenna films are coupled through inductance to realize wireless non-contact transmission of data; the middle layer of the high-temperature-resistant sensitive chip film is an electrical performance element film, an LC loop is formed by connecting the interdigital capacitors and the spiral inductor in series, the outer ends of the spiral inductors are directly connected with one ends of the interdigital capacitors, and the inner ends of the spiral inductors are spirally wound out to be connected with the other ends of the interdigital capacitors; the middle layer of the high-temperature-resistant reading antenna film is a coaxial spiral inductance film;
s2, connecting two ends of the high-temperature-resistant reading antenna film with a rear-end processing module integrating a power supply unit, a data reading unit and a data storage unit respectively;
s3, when the blade rotates at high speed, the power supply unit in the back-end processing module provides energy for the high-temperature-resistant sensitive chip film through mutual inductance coupling between inductors, and the interdigital capacitor in the high-temperature-resistant sensitive chip film changes due to the sensing of the stress deformation of the blade, so that the resonant frequency f in the LC loop0Change the resonant frequency f0The test data is transmitted to a back-end processing module in a wireless non-contact mode, and the real-time test of the surface stress/strain parameters of the rotating blade can be realized through the analysis and the processing of a data reading unit.
2. The extreme environment-oriented blade stress/strain dynamic testing method of claim 1, wherein the top layer and the bottom layer of the high temperature-resistant sensitive chip film and the top layer and the bottom layer of the high temperature-resistant reading antenna film are both Al2O3Thin film of Al2O3The film thickness was 1 μm.
3. The extreme environment-oriented blade stress/strain dynamic testing method as claimed in claim 1, wherein the material of the coaxial spiral inductance thin film is a high temperature resistant metal Pt, and the thickness of the thin film is 0.5 μm.
4. The extreme environment-oriented blade stress/strain dynamic testing method of claim 2, wherein the Al is2O3The film was prepared by the following steps:
a. sequentially cleaning the surface of the blade by using acetone, ethanol and deionized water to prevent the adhesion of the film from being reduced due to unclean surface of the blade;
b. respectively placing a metal Al target material and a clean blade on a corresponding target position and a sample rotating platform;
c. carrying out vacuum pumping treatment on the coating cavity, wherein the vacuum degree of the coating cavity reaches 1 x 10-3When Pa, closing the vacuum gauge and stopping vacuum treatment;
d. introducing Ar and O which are uniformly mixed into the vacuum coating chamber2Controlling the ventilation rate to control the air pressure of the vacuum coating chamber, stopping ventilation when the working air pressure reaches 0.1Pa and maintaining stability;
e. starting a sputtering power supply to start sputtering, and ionizing Ar in the vacuum coating chamber into Ar+And e-And starting the sample rotation stage to ensure Al2O3Uniformly forming a film on the surface of the blade;
surface of Al metal target by Ar+Bombarding out Al particles, and reacting the Al particles with oxygen in the vacuum coating cavity to form Al2O3And moves towards the blade, and Al particles deposited on the surface of the blade are also subjected to O2Influence to form Al2O3A film;
g. when Al on the surface of the blade2O3When the film reaches 1 μm, the sputtering power is turned off, the sputtering stops, the blade stops rotating, Al2O3And finishing the film sputtering.
5. The extreme environment-oriented blade stress/strain dynamic testing method as claimed in claim 1, wherein the electrical device thin film is prepared by the following steps:
a. firstly to sputter Al2O3Cleaning and dehydrating the surface of the blade of the film to remove stains on the surface of the blade, and during dehydration, placing the blade in a box type drying furnace at the temperature of 150-200 ℃ for 30min, and drying the residual solution on the surface of the blade;
b. the blade is placed on a rotating table in a stationary manner, and Al is present in the blade2O3After the photoresist is dropped on the surface of the film, the blade is accelerated to rotate so that the photoresist is uniformly coated on Al2O3After the photoresist is coated on the surface of the film in a spin coating mode, the blade is dried by a box type drying furnace to remove the solvent in the photoresistAn agent that enhances the adhesion of the photoresist;
c. preparing a graphic mask plate of a required electrical component, placing the graphic mask plate above the blade, and irradiating the mask plate for 3-5 s by using the light of an explosion lamp to completely transfer the graphic of the mask plate to the surface of the blade;
d. drying the exposed blades again at 100 ℃ by using a box type drying furnace to reduce standing wave reaction between an exposure area and a non-exposure area, so as to avoid influence on the resolution of the pattern of the electrical property element after development and enable the photoresist in a photosensitive area to fully react;
e. soaking the exposed blade in a developing solution for 5-10 s, and removing the photosensitive photoresist to display the electrical property element graph;
f. setting the working condition required by the magnetron sputtering process, namely the vacuum degree of the coating film is 3 x 10-3Pa, the working pressure is 0.5Pa, and under the condition, a high-temperature resistant metal Pt is used as a sputtering target material and Ar is used as sputtering gas to prepare a metal Pt film with the thickness of 0.5 mu m;
g. soaking the blade sputtered with the Pt film in an organic solution mutually soluble with the photoresist, and then cleaning the surface of the blade by using deionized water to remove the redundant photoresist.
6. The extreme environment-oriented blade stress/strain dynamic testing method as claimed in claim 1, wherein the coaxial spiral inductance film is prepared by the following steps:
a. after the metal Pt target material is placed on a sample rotating table, the coating cavity is vacuumized until the air pressure of the cavity is 3 multiplied by 10-3Stopping vacuumizing when Pa;
b. slowly introducing Ar into the vacuum chamber, stopping introducing the Ar when the air pressure in the vacuum chamber reaches 0.5Pa and maintaining the Ar stably;
c. after the ventilation is finished, a sputtering power supply is started to start sputtering, and ionized Ar is generated+Moving towards the Pt target material direction and bombarding the target material, wherein Pt particles are bombarded out to move towards the shell and deposit on the surface of the shell to form a Pt film; the sputtering process is carried out at a constant rate under the control of a power supply, and the power supply is turned off and stopped when the Pt film is deposited to a required thicknessAnd (4) sputtering.
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