CN110118615A - A kind of calculation method of the shell maximum temperature of power chip - Google Patents
A kind of calculation method of the shell maximum temperature of power chip Download PDFInfo
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- CN110118615A CN110118615A CN201910435571.0A CN201910435571A CN110118615A CN 110118615 A CN110118615 A CN 110118615A CN 201910435571 A CN201910435571 A CN 201910435571A CN 110118615 A CN110118615 A CN 110118615A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R21/00—Arrangements for measuring electric power or power factor
- G01R21/02—Arrangements for measuring electric power or power factor by thermal methods, e.g. calorimetric
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Abstract
The present invention provides a kind of calculation method of the shell maximum temperature of power chip, comprising: step S1 provides test environment, and temperature meter is arranged in cooling fin in testing under environment；Step S2, calculate first consumption power of the power chip under the first power mode, and temperature meter measurement obtains the first temperature for corresponding to the first consumption power, with calculate power chip under the second power mode second consumption power, and temperature meter measurement obtain correspond to second consumption power second temperature；The thermal resistance of cooling fin is calculated according to the difference of the first temperature and second temperature, the first consumption power and the second consumption power according to the first formula by step S3；The shell maximum temperature of power chip is calculated according to calorific value and maximum consumption power according to the second formula by step S4.Beneficial effects of the present invention are to save evaluation time and improve production efficiency, and reduce production cost.
Description
Technical field
The present invention relates to chip technology field more particularly to a kind of calculation methods of the shell maximum temperature of power chip.
Background technique
Current electronic equipment is in order to guarantee the stable operation of system, usually by cooling fin to the biggish chip of power dissipation ratio
(such as SOC master chip, PowerIC etc.) carries out cooling processing, and the use due to increasing cooling fin will increase cost, but reduce
The use of cooling fin will increase the risk of system stability, therefore how fast estimate that above-mentioned cooling fin thermal resistance becomes urgently to be resolved
The problem of.
Cooling fin is calculated using following two ways in the prior art:
Mode one: simulation calculation is carried out by thermal resistance of the emulation tool to cooling fin needed for power chip, however is carried out
Simulation calculation needs to acquire each affecting parameters, and entire simulation calculation process is cumbersome, time-consuming and laborious；It is especially needed to more
When the different series of a product and identical product carry out simulation calculation, calculating process is excessively cumbersome；And above-mentioned simulation calculation
It is excessively high to calculate site requirements, greatly increases testing cost.
Mode two: the thermal resistance of cooling fin, and root are calculated by formula TCmax=Tj-PD* (θ jc+ θ cs+ θ sa)
It constantly modifies according to above-mentioned thermal resistance and/or cuts fin shape size, and then measure the shell maximum temperature of chip, and make it
The skin temperature of the chip of actual test is less than the shell maximum temperature of chip；
Wherein, TCmax is used to indicate the shell maximum temperature of power chip, and Tj is used to indicate the inside of the power chip
Junction temperature, PD is for indicating consumption power, and for indicating the node of the power chip to the thermal resistance of shell, θ cs is used for θ jc
The shell of the power chip is indicated to the thermal resistance between the cooling fin, θ sa is for indicating the thermal resistance of the cooling fin；
However the above method can have following problems:
The precision of problem one, the shell maximum temperature for the chip being calculated is poor, and reason is: standard rule
(spec) the TCmax value being calculated in is to be obtained under the pcb board of standard and the laboratory environment of standard by simulation calculation
It arrives, but all there is not small difference in product structure dissipating-heat environment of mainboard PCB size and actual use in practical application etc., from
And the TCmax value being calculated is caused to have error；
Problem two does not determine the test position of chip, and the test position of chip will lead to TCmax value difference, such as
The edge temperature of chip is generally lower than central point temperature.
Therefore by increasing drop volume nargin, (i.e. heat sink sizes increase aforesaid way, will increase allowance in actual items and arrive
10%~30%) it is just avoided that the appearance of the above problem, however increases drop volume nargin and will lead to cooling fin increased costs.
Summary of the invention
For the above-mentioned problems in the prior art, one kind is now provided and is intended to save evaluation time and improves production effect
Rate, and reduce the calculation method of the shell maximum temperature of the power chip of production cost.
Specific technical solution is as follows:
A kind of calculation method of the shell maximum temperature of power chip is applied in electronic equipment, and electronic equipment includes function
Rate chip, the cooling fin being arranged in above power chip；
Wherein, calculation method the following steps are included:
Step S1 provides a test environment, and a temperature meter is arranged in cooling fin in testing under environment；
Step S2 calculates first consumption power of the power chip under the first power mode, and temperature meter measures
The first temperature for corresponding to the first consumption power is obtained, and
Second consumption power of the power chip under the second power mode is calculated, and temperature meter measurement is corresponded to
In the second temperature of the second consumption power；
Step S3, according to the difference of the first temperature and second temperature, first consumption power and second consumption power according to
The thermal resistance of cooling fin is calculated in one first formula；
The shell of power chip is calculated most according to one second formula according to calorific value and a maximum consumption power in step S4
High-temperature.
Preferably, calculation method, wherein calculate the shell of the power chip of multiple accordant configuration informations of electronic equipment most
High-temperature, and calculate best shell maximum temperature of its average value as power chip.
Preferably, calculation method, wherein step S1 specifically includes the following steps:
Step S11 provides a test environment；
A mounting hole is arranged in testing under environment in step S12 on a heat sink；
Temperature meter is arranged in mounting hole step S13.
Preferably, calculation method, wherein the temperature meter in step S13 is fixed at installation by a heat-conducting glue
In hole.
Preferably, calculation method, wherein the first formula are as follows:
θ sa=(TS2-TS1)/P2-P1；
Wherein, θ sa is used to indicate the thermal resistance of cooling fin；
TS1 is for indicating the first temperature；
TS2 is for indicating second temperature；
P1 is for indicating the first consumption power；
P2 is for indicating the second consumption power.
Preferably, calculation method, wherein the second formula are as follows:
TCmax=Tj-Pmax (θ jc+ θ cs+ θ sa)；
Wherein, TCmax is used to indicate the shell maximum temperature of power chip；
Tj is used to indicate the internal node temperature of power chip；
Pmax is for indicating maximum consumption power；
θ jc is for indicating the node of power chip to the thermal resistance of shell；
θ cs is used to indicate the shell of power chip to the thermal resistance between cooling fin.
Preferably, calculation method, wherein power chip is provided with multiple power supplys.
Preferably, calculation method, wherein electric current by calculate each power supply of the power chip under the first power mode
With the independent consumption power of voltage, and it is overlapped the independent consumption power of each power supply to obtain the first consumption power；And/or
The independent consumption power of electric current and voltage by calculate each power supply of the power chip under the second power mode,
And it is overlapped the independent consumption power of each power supply to obtain the second consumption power；And/or
The independent consumption power of electric current and voltage by calculate each power supply of the power chip under maximum power mode,
And it is overlapped the independent consumption power of each power supply to obtain maximum consumption power.
Preferably, calculation method, wherein power chip is the System on Chip/SoC for being provided with processor.
Preferably, calculation method, wherein the frequency of the processor in the first power mode is 500MHz；And/or
The frequency of processor in second power mode is 2GHz.
Above-mentioned technical proposal has the following advantages that or the utility model has the advantages that is calculated by consumption power according to the first formula scattered
The thermal resistance of backing, is then calculated the shell maximum temperature of power chip according to the second formula, to save evaluation time simultaneously
Production efficiency is improved, and then reduces production cost.
Detailed description of the invention
With reference to appended attached drawing, more fully to describe the embodiment of the present invention.However, appended attached drawing be merely to illustrate and
It illustrates, and is not meant to limit the scope of the invention.
Fig. 1 is the flow chart of the calculation method embodiment of the shell maximum temperature of power chip of the present invention；
Fig. 2 is the flow chart of the step S1 of the calculation method embodiment of the shell maximum temperature of power chip of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art without creative labor it is obtained it is all its
His embodiment, shall fall within the protection scope of the present invention.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
The present invention will be further explained below with reference to the attached drawings and specific examples, but not as the limitation of the invention.
The present invention includes a kind of calculation method of the shell maximum temperature of power chip, is applied in electronic equipment, electronics
The cooling fin that equipment includes power chip, is arranged in above power chip；
As shown in Figure 1, calculation method the following steps are included:
Step S1 provides a test environment, and a temperature meter is arranged in cooling fin in testing under environment；
Step S2 calculates first consumption power of the power chip under the first power mode, and temperature meter measures
The first temperature for corresponding to the first consumption power is obtained, and
Second consumption power of the power chip under the second power mode is calculated, and temperature meter measurement is corresponded to
In the second temperature of the second consumption power；
Step S3, according to the difference of the first temperature and second temperature, first consumption power and second consumption power according to
The thermal resistance of cooling fin is calculated in one first formula；
The shell of power chip is calculated most according to one second formula according to calorific value and a maximum consumption power in step S4
High-temperature.
It in above-described embodiment but realizes the thermal resistance that consumption power is calculated to cooling fin by the first formula, then counts
Calculation obtains the shell maximum temperature of power chip, to save evaluation time and improve production efficiency, and then reduces production cost.
In the above-described embodiments, the consumption power and measurement that need to only calculate under each power mode obtain corresponding temperature
Shell maximum temperature can be obtained by calculation, so that user does not need using professional emulation tool, and then save
Evaluation time, and improve production efficiency.
It, can be using set-top box or System on Chip/SoC (SOC, the System on of smart television as preferred embodiment
Chip) it is used as power chip；
Therefore it can be calculated by the thermal resistance of the cooling fin above the System on Chip/SoC of estimation set-top box or smart television
To the shell maximum temperature of System on Chip/SoC；The above method is not needed using professional emulation tool, thus increase operability, and
The power consumption of element in addition to System on Chip/SoC is bottomed out, so as to ignore the element in addition to System on Chip/SoC
Power consumption, to improve testing efficiency, and by repeatedly measuring and increasing allowance, on the basis of reducing measurement error
Guarantee the stability of product, and then improves the precision of cooling fin thermal resistance and TCmax value.
Further, in the above-described embodiments, the outer of the power chip of multiple accordant configuration informations of electronic equipment is calculated
Shell maximum temperature, and calculate best shell maximum temperature of its average value as power chip.
In the above-described embodiments, can be by the information of record muti-piece set-top box or smart television, and use identical information
Set-top box or smart television tested, to avoid the different computational accuracies reduced of set-top box or smart television.
Further, it as preferred embodiment, can be tested, and be obtained using three set-top boxes or smart television
The shell maximum temperature of each set-top box or the corresponding power chip of smart television is obtained, and takes above three shell maximum temperature
Average value then increases by 5% allowance on the basis of above-mentioned average value, to guarantee the steady of product on the basis of reducing measurement error
It is qualitative, and then improve the precision of cooling fin thermal resistance and TCmax value.
Further, in the above-described embodiments, as shown in Fig. 2, step S1 specifically includes the following steps:
Step S11 provides a test environment；
A mounting hole is arranged in testing under environment in step S12 on a heat sink；
Temperature meter is arranged in mounting hole step S13.
Above-mentioned test environment includes:
Environment temperature: can be 25 degrees Celsius；
Environmental condition: can be gravity-flow ventilation；
System testing: the system setting of default, such as when test board is set-top box or smart television, system can be stopped
At the interface home；
It may be implemented to exclude the influence of environment temperature and condition, and the system setting defaulted by setting can will remove function
The power consumption of element other than rate chip bottoms out, so as to ignore the power of the element in addition to power chip
Consumption, to improve testing efficiency, and by repeatedly measuring and increasing allowance, to guarantee to produce on the basis of reducing measurement error
The stability of product, and then improve computational accuracy.
Further, in the above-described embodiments, the temperature meter in step S13 is fixed at peace by a heat-conducting glue
It fills in hole.Realize the good contact of temperature measurement probe and power chip.
Further, in the above-described embodiments, the first formula are as follows:
θ sa=(TS2-TS1)/P2-P1；
Wherein, θ sa is used to indicate the thermal resistance of cooling fin；
TS1 is for indicating the first temperature；
TS2 is for indicating second temperature；
P1 is for indicating the first consumption power；
P2 is for indicating the second consumption power.
Further, in the above-described embodiments, the second formula are as follows:
TCmax=Tj-Pmax (θ jc+ θ cs+ θ sa)；
Wherein, TCmax is used to indicate the shell maximum temperature of power chip；
Tj is used to indicate the internal node temperature of power chip；
Pmax is for indicating maximum consumption power；
θ jc is for indicating the node of power chip to the thermal resistance of shell；
θ cs is used to indicate the shell of power chip to the thermal resistance between cooling fin.
Further, in the above-described embodiments, power chip is provided with multiple power supplys.
Further, in the above-described embodiments, power chip under the first power mode by calculating each power supply
The independent consumption power of electric current and voltage, and be overlapped the independent consumption power of each power supply to obtain the first consumption power；
And/or
The independent consumption power of electric current and voltage by calculate each power supply of the power chip under the second power mode,
And it is overlapped the independent consumption power of each power supply to obtain the second consumption power；And/or
The independent consumption power of electric current and voltage by calculate each power supply of the power chip under maximum power mode,
And it is overlapped the independent consumption power of each power supply to obtain maximum consumption power.
In the above-described embodiments, power chip can be worked under different power modes by serial ports tool；And lead to
The electric current and voltage swing of each power supply of the power chip under test different capacity mode are crossed, to calculate in different power consumption mode
Corresponding consumption power further calculates to obtain the cooling fin above the center position of the power chip under the power consumption mode
Temperature, to further be calculated.
Further, in the above-described embodiments, power chip is the System on Chip/SoC for being provided with processor.
Further, in the above-described embodiments, the frequency of the processor in the first power mode can be 500MHz；With/
Or
The frequency of processor in second power mode can be 2GHz.
Wherein, the frequency of the processor in maximum power mode may be 2GHz.
The foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention and protection model
It encloses, to those skilled in the art, should can appreciate that all with made by description of the invention and diagramatic content
Equivalent replacement and obviously change obtained scheme, should all be included within the scope of the present invention.
Claims (10)
1. a kind of calculation method of the shell maximum temperature of power chip is applied in electronic equipment, the electronic equipment includes
Power chip, the cooling fin being arranged in above the power chip；
It is characterized in that, the calculation method the following steps are included:
Step S1 provides a test environment, and a temperature meter is arranged in the cooling fin under the test environment；
Step S2 calculates first consumption power of the power chip under the first power mode, and the temperature meter
Measurement obtains the first temperature for corresponding to the first consumption power, and
Second consumption power of the power chip under the second power mode is calculated, and the temperature meter measurement obtains
Second temperature corresponding to the second consumption power；
Step S3, according to the difference of first temperature and the second temperature, the first consumption power and described second
The thermal resistance of the cooling fin is calculated according to one first formula for consumption power；
The outer of the power chip is calculated according to one second formula according to the calorific value and a maximum consumption power in step S4
Shell maximum temperature.
2. calculation method as described in claim 1, which is characterized in that calculate multiple accordant configuration informations of the electronic equipment
The power chip shell maximum temperature, and calculate the best shell highest temperature of its average value as the power chip
Degree.
3. calculation method as described in claim 1, which is characterized in that the step S1 specifically includes the following steps:
Step S11 provides a test environment；
A mounting hole is arranged in step S12 under the test environment on the cooling fin；
Step S13, in the mounting hole by temperature meter setting.
4. calculation method as claimed in claim 3, which is characterized in that the temperature meter in the step S13 passes through
One heat-conducting glue is fixedly installed in the mounting hole.
5. calculation method as described in claim 1, which is characterized in that first formula are as follows:
θ sa=(TS2-TS1)/P2-P1；
Wherein, θ sa is used to indicate the thermal resistance of the cooling fin；
TS1 is for indicating the first temperature；
TS2 is for indicating second temperature；
P1 is for indicating the first consumption power；
P2 is for indicating the second consumption power.
6. calculation method as described in claim 1, which is characterized in that second formula are as follows:
TCmax=Tj-Pmax (θ jc+ θ cs+ θ sa)；
Wherein, TCmax is used to indicate the shell maximum temperature of the power chip；
Tj is used to indicate the internal node temperature of the power chip；
Pmax is for indicating the maximum consumption power；
θ jc is for indicating the node of the power chip to the thermal resistance of shell；
θ cs is used to indicate the shell of the power chip to the thermal resistance between the cooling fin.
7. calculation method as described in claim 1, which is characterized in that the power chip is provided with multiple power supplys.
8. calculation method as claimed in claim 7, which is characterized in that the power chip passing through under the first power mode
The electric current of each power supply and the independent consumption power of voltage are calculated, and the independent consumption power of each power supply is carried out
Superposition obtains the first consumption power；And/or
The independent consumption of electric current and voltage by calculate each power supply of the power chip under the second power mode
Power, and the independent consumption power of each power supply is overlapped to obtain the second consumption power；And/or
The independent consumption of electric current and voltage by calculate each power supply of the power chip under maximum power mode
Power, and be overlapped the independent consumption power of each power supply to obtain the maximum consumption power.
9. calculation method as described in claim 1, which is characterized in that the power chip is the system core for being provided with processor
Piece.
10. calculation method as claimed in claim 9, which is characterized in that the processor in first power mode
Frequency is 500MHz；And/or
The frequency of the processor in second power mode is 2GHz.
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