CN110112148A - 发光二极管模组及其制造方法、显示装置 - Google Patents
发光二极管模组及其制造方法、显示装置 Download PDFInfo
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- CN110112148A CN110112148A CN201910419429.7A CN201910419429A CN110112148A CN 110112148 A CN110112148 A CN 110112148A CN 201910419429 A CN201910419429 A CN 201910419429A CN 110112148 A CN110112148 A CN 110112148A
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- emitting diode
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- 229910003437 indium oxide Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910419429.7A CN110112148A (zh) | 2019-05-20 | 2019-05-20 | 发光二极管模组及其制造方法、显示装置 |
| PCT/CN2020/082400 WO2020233242A1 (fr) | 2019-05-20 | 2020-03-31 | Module de diode électroluminescente et son procédé de fabrication et dispositif d'affichage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910419429.7A CN110112148A (zh) | 2019-05-20 | 2019-05-20 | 发光二极管模组及其制造方法、显示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110112148A true CN110112148A (zh) | 2019-08-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910419429.7A Pending CN110112148A (zh) | 2019-05-20 | 2019-05-20 | 发光二极管模组及其制造方法、显示装置 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110112148A (fr) |
| WO (1) | WO2020233242A1 (fr) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020233242A1 (fr) * | 2019-05-20 | 2020-11-26 | 京东方科技集团股份有限公司 | Module de diode électroluminescente et son procédé de fabrication et dispositif d'affichage |
| CN112102740A (zh) * | 2020-09-29 | 2020-12-18 | 厦门天马微电子有限公司 | 显示面板及其驱动方法、显示装置 |
| WO2021051462A1 (fr) * | 2019-09-20 | 2021-03-25 | 深圳市华星光电半导体显示技术有限公司 | Procédé de fabrication de dispositif d'affichage et dispositif d'affichage |
| CN112864290A (zh) * | 2020-04-09 | 2021-05-28 | 镭昱光电科技(苏州)有限公司 | 发光二极管结构及其制造方法 |
| CN113629095A (zh) * | 2021-07-19 | 2021-11-09 | 深圳市华星光电半导体显示技术有限公司 | 发光显示装置以及发光显示装置的制作方法 |
| CN113782553A (zh) * | 2021-09-01 | 2021-12-10 | 吉安市木林森显示器件有限公司 | 巨量转移Micro LED模块、显示屏及制造方法 |
| CN115458645A (zh) * | 2022-10-21 | 2022-12-09 | 福建兆元光电有限公司 | 一种集成式彩色Micro LED的防串扰结构制造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115207186B (zh) * | 2022-09-15 | 2022-12-13 | 江西兆驰半导体有限公司 | 一种Mini-LED芯片及其制备方法 |
| CN116387419B (zh) * | 2023-05-29 | 2023-08-11 | 惠科股份有限公司 | Led灯珠的巨量转移方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107507845A (zh) * | 2016-06-14 | 2017-12-22 | 群创光电股份有限公司 | 显示装置 |
| CN107731864A (zh) * | 2017-11-20 | 2018-02-23 | 开发晶照明（厦门）有限公司 | 微发光二极管显示器和制作方法 |
| CN107910414A (zh) * | 2017-11-21 | 2018-04-13 | 歌尔股份有限公司 | Led显示器制备方法及led显示器 |
| CN108447795A (zh) * | 2018-04-16 | 2018-08-24 | 歌尔股份有限公司 | Led晶片的键合方法 |
| CN208240671U (zh) * | 2018-02-26 | 2018-12-14 | 山东晶泰星光电科技有限公司 | 一种具有虚拟隔离区的rgb-led封装模组及其显示屏 |
| CN109742200A (zh) * | 2019-01-11 | 2019-05-10 | 京东方科技集团股份有限公司 | 一种显示面板的制备方法、显示面板及显示装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101125605B1 (ko) * | 2010-06-04 | 2012-03-27 | 세종대학교산학협력단 | 고휘도 마이크로 어레이 발광 다이오드 소자의 구조 및 그 제조 방법 |
| CN105826435B (zh) * | 2016-04-28 | 2018-05-01 | 歌尔股份有限公司 | 红光微发光二极管的形成方法、制造方法、背板及电子设备 |
| US10325893B2 (en) * | 2016-12-13 | 2019-06-18 | Hong Kong Beida Jade Bird Display Limited | Mass transfer of micro structures using adhesives |
| CN108735865B (zh) * | 2018-05-26 | 2019-11-01 | 矽照光电（厦门）有限公司 | 一种显示结构生产方法 |
| CN110112148A (zh) * | 2019-05-20 | 2019-08-09 | 京东方科技集团股份有限公司 | 发光二极管模组及其制造方法、显示装置 |
-
2019
- 2019-05-20 CN CN201910419429.7A patent/CN110112148A/zh active Pending
-
2020
- 2020-03-31 WO PCT/CN2020/082400 patent/WO2020233242A1/fr active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107507845A (zh) * | 2016-06-14 | 2017-12-22 | 群创光电股份有限公司 | 显示装置 |
| CN107731864A (zh) * | 2017-11-20 | 2018-02-23 | 开发晶照明（厦门）有限公司 | 微发光二极管显示器和制作方法 |
| CN107910414A (zh) * | 2017-11-21 | 2018-04-13 | 歌尔股份有限公司 | Led显示器制备方法及led显示器 |
| CN208240671U (zh) * | 2018-02-26 | 2018-12-14 | 山东晶泰星光电科技有限公司 | 一种具有虚拟隔离区的rgb-led封装模组及其显示屏 |
| CN108447795A (zh) * | 2018-04-16 | 2018-08-24 | 歌尔股份有限公司 | Led晶片的键合方法 |
| CN109742200A (zh) * | 2019-01-11 | 2019-05-10 | 京东方科技集团股份有限公司 | 一种显示面板的制备方法、显示面板及显示装置 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020233242A1 (fr) * | 2019-05-20 | 2020-11-26 | 京东方科技集团股份有限公司 | Module de diode électroluminescente et son procédé de fabrication et dispositif d'affichage |
| WO2021051462A1 (fr) * | 2019-09-20 | 2021-03-25 | 深圳市华星光电半导体显示技术有限公司 | Procédé de fabrication de dispositif d'affichage et dispositif d'affichage |
| CN112864290A (zh) * | 2020-04-09 | 2021-05-28 | 镭昱光电科技(苏州)有限公司 | 发光二极管结构及其制造方法 |
| CN112102740A (zh) * | 2020-09-29 | 2020-12-18 | 厦门天马微电子有限公司 | 显示面板及其驱动方法、显示装置 |
| CN113629095A (zh) * | 2021-07-19 | 2021-11-09 | 深圳市华星光电半导体显示技术有限公司 | 发光显示装置以及发光显示装置的制作方法 |
| CN113629095B (zh) * | 2021-07-19 | 2022-09-27 | 深圳市华星光电半导体显示技术有限公司 | 发光显示装置以及发光显示装置的制作方法 |
| CN113782553A (zh) * | 2021-09-01 | 2021-12-10 | 吉安市木林森显示器件有限公司 | 巨量转移Micro LED模块、显示屏及制造方法 |
| CN115458645A (zh) * | 2022-10-21 | 2022-12-09 | 福建兆元光电有限公司 | 一种集成式彩色Micro LED的防串扰结构制造方法 |
| CN115458645B (zh) * | 2022-10-21 | 2023-08-11 | 福建兆元光电有限公司 | 一种集成式彩色Micro LED的防串扰结构制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020233242A1 (fr) | 2020-11-26 |
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Application publication date: 20190809 |
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