CN110112092A - Device transfer device, transfer system and transfer method - Google Patents
Device transfer device, transfer system and transfer method Download PDFInfo
- Publication number
- CN110112092A CN110112092A CN201910418812.0A CN201910418812A CN110112092A CN 110112092 A CN110112092 A CN 110112092A CN 201910418812 A CN201910418812 A CN 201910418812A CN 110112092 A CN110112092 A CN 110112092A
- Authority
- CN
- China
- Prior art keywords
- transferred
- base board
- transfer device
- device transfer
- membrane layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012546 transfer Methods 0.000 title claims abstract description 82
- 238000000034 method Methods 0.000 title claims description 23
- 239000012528 membrane Substances 0.000 claims abstract description 41
- 239000012530 fluid Substances 0.000 claims abstract description 17
- 230000000694 effects Effects 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 46
- 239000012790 adhesive layer Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 14
- 229920000954 Polyglycolide Polymers 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 239000004633 polyglycolic acid Substances 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
Abstract
This disclosure relates to which field of display technology, proposes a kind of device transfer device, which includes: main structure body, flexible membrane layer and two electrodes.Main structure body has the accommodating chamber and working face for accommodating high-pressure fluid, is provided with the opening for being connected to the accommodating chamber on the working face；Flexible membrane layer is set on the working face；Two electrodes are respectively arranged at the two sides that the flexible membrane layer is located at the aperture position, and two electrodes are used to squeeze the flexible membrane layer under charges of different polarity effect, so that the flexible membrane layer is thinning positioned at the aperture position.The switching speed of part to be transferred can be improved in the device transfer device that the disclosure provides.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of device transfer devices, part transfer system to be transferred and side
Method.
Background technique
In various sophisticated product manufacturing processes, the transfer operation to device is all referred to.For example, in display production
In, need for chip to be transferred to the predeterminated position of substrate, to realize the assembling of display.
In the related technology, sucker grabber piece is usually utilized, and the device of crawl is transferred to preset position, for example,
The predeterminated position of substrate is transferred to using sucker grab chips and by chip.
However, in the related technology, can only be shifted one by one to device using the method for sucker transferring device, this method turns
Move low efficiency.
It should be noted that the information in the invention of above-mentioned background technology part is only used for reinforcing the reason to background of the invention
Solution, therefore may include the information not constituted to the prior art known to persons of ordinary skill in the art.
Summary of the invention
The purpose of the present invention is to provide a kind of device transfer device, part transfer system to be transferred and methods.The disclosure mentions
The technical issues of device transfer device of confession is able to solve in the related technology, sucker transferring device low efficiency.
Other characteristics and advantages of the invention will be apparent from by the following detailed description, or partially by the present invention
Practice and acquistion.
According to an aspect of the present invention, a kind of device transfer device is provided, which includes: structure master
Body, flexible membrane layer, two electrodes.Main structure body has the accommodating chamber and working face for accommodating high-pressure fluid, sets on the working face
It is equipped with the opening for being connected to the accommodating chamber；Flexible membrane layer is set on the working face；Two electrodes are respectively arranged at the flexibility
Film layer is located at the two sides of the aperture position, and two electrodes are used to squeeze the flexible membrane layer under charges of different polarity effect, with
Make the thinning positioned at the aperture position of the flexible membrane layer.
In a kind of exemplary embodiment of the invention, the main structure body is additionally provided with the aperture for being connected to the accommodating chamber,
The device transfer device further includes pressure pump, and pressure pump is connected to the aperture, for providing the high pressure to the accommodating chamber
Fluid.
In a kind of exemplary embodiment of the invention, it is described opening be it is multiple, two electrode be it is multipair, each pair of described two
Electrode is respectively arranged at the two sides that the flexible membrane layer is located at the aperture position.
In a kind of exemplary embodiment of the invention, two electrode includes being set to the flexible membrane layer first side
First electrode and the second electrode for being set to the flexible membrane layer second side；Multiple first electrodes are integral film layer
Public electrode；Multiple second electrodes are arranged in a one-to-one correspondence with the opening respectively.
In a kind of exemplary embodiment of the invention, the high-pressure fluid is gas or liquid.
In a kind of exemplary embodiment of the invention, the main structure body is rectangular configuration, and the working face is the square
The one side of shape structure；Or the main structure body is a cylindrical structure, the working face is the arcuate flanks of the cylindrical structure.
In a kind of exemplary embodiment of the invention, the flexible membrane layer include polyacrylate, Polyglycolic acid fibre,
One of Kynoar is a variety of.
According to an aspect of the present invention, a kind of device transfer system is provided, which includes: flexible base
Plate, at least one part to be transferred, target base plate, adhesive layer, above-mentioned device transfer device.At least one part to be transferred, bonding
In on the flexible base board；Target base plate is oppositely arranged with the flexible base board, and is located at the flexible base board and is bonded with wait turn
Move the side of part；Adhesive layer is set to side of the target base plate towards the part to be transferred, and the bonding of the adhesive layer
Power is greater than the cohesive force between the part to be transferred and the flexible base board；Device transfer device is set to the flexible base board back
Side from the part to be transferred, the position for being bonded with part to be transferred for squeezing flexible base board setting so that it is described to
Transfer member is transferred in the target base plate.
In a kind of exemplary embodiment of the invention, the device transfer device includes multiple openings of array setting, and
The opening area of the device transfer device is less than the area of the part to be transferred, and the part position to be transferred is correspondingly arranged
There are multiple openings.
According to an aspect of the present invention, a kind of element transfer method is provided, this method comprises:
Part to be transferred is bonded in a flexible base board；
Adhesive layer is set in target base plate, and the cohesive force of the adhesive layer is greater than the part to be transferred and the flexible base
Cohesive force between plate；
Using above-mentioned device transfer device, the part to be transferred is transferred to the target base plate from the flexible base board
On.
In a kind of exemplary embodiment of the invention, the part to be transferred is chip, and part to be transferred is bonded in a flexibility
Substrate, comprising:
The flexible base board is bonded on the substrate for being formed with the chip；
Using laser-stripping method by the strippable substrate.
The disclosure proposes a kind of device transfer device, which includes: main structure body, flexible membrane layer and two
Electrode.Main structure body has the accommodating chamber and working face for accommodating high-pressure fluid, and the connection appearance is provided on the working face
Receive the opening of chamber；Flexible membrane layer is set on the working face；Two electrodes are respectively arranged at the flexible membrane layer and are located at described open
The two sides of mouth position, two electrodes are used to squeeze the flexible membrane layer under charges of different polarity effect, so that the flexible membrane layer
To be located at the aperture position thinning, simultaneously because the constancy of volume of flexible membrane layer, fexible film along its layer to expansion deformation, should
The flexible membrane layer of aperture position is protruded under the action of high-pressure fluid outward simultaneously, to squeeze part to be transferred with will be to be transferred
Part is transferred in target base plate.On the one hand, the device transfer device that the disclosure provides quickly can be transferred to mesh by part to be transferred
It marks on substrate；On the other hand, the device transfer device structure that the disclosure provides is simple, cost is relatively low.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
It can the limitation present invention.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows and meets implementation of the invention
Example, and be used to explain the principle of the present invention together with specification.It should be evident that the accompanying drawings in the following description is only the present invention
Some embodiments for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 is a kind of structural schematic diagram of exemplary embodiment of disclosure device transfer device；
Fig. 2 is a kind of structural schematic diagram of exemplary embodiment of disclosure device transfer system；
Fig. 3 is the structural schematic diagram of disclosure device transfer device another kind exemplary embodiment；
Fig. 4 is the structural schematic diagram of disclosure device transfer device another kind exemplary embodiment；
Fig. 5 is the structural schematic diagram of disclosure device transfer device another kind exemplary embodiment；
Fig. 6 is the structural schematic diagram of disclosure device transfer system another kind exemplary embodiment；
Fig. 7 is a kind of flow chart of exemplary embodiment of disclosure element transfer method.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be real in a variety of forms
It applies, and is not understood as limited to example set forth herein；On the contrary, these embodiments are provided so that the present invention will more comprehensively and
Completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.Identical appended drawing reference indicates in figure
Same or similar structure, thus the detailed description that them will be omitted.
Although the term of relativity, such as "upper" "lower" is used to describe a component of icon for another in this specification
The relativeness of one component, but these terms are in this manual merely for convenient, for example, with reference to the accompanying drawings described in show
The direction of example.It is appreciated that, if making it turn upside down the device overturning of icon, the component described in "upper" will
As the component in "lower".Term of other relativities, such as "high" " low " "top" "bottom" " left side " " right side " etc. are also made to have similar
Meaning.When certain structure is at other structures "upper", it is possible to refer to that certain structural integrity is formed in other structures, or refer to certain structure
It is " direct " to be arranged in other structures, or refer to that certain structure is arranged in other structures by the way that another structure is " indirect ".
Term "one", " one ", " described " to indicate there are one or more elements/component part/etc.；Term " packet
Include " and " having " to indicate the open meaning being included and refer to that the element/component part/in addition to listing waits it
Outside also may be present other element/component part/etc..
The present exemplary embodiment provides a kind of device transfer device, as shown in Figure 1, a kind of for disclosure device transfer device
The structural schematic diagram of exemplary embodiment.The device transfer device includes: main structure body 1, flexible membrane layer 2, two electrodes 31,32.
Main structure body 1 has the accommodating chamber 11 and working face for accommodating high-pressure fluid, and the connection receiving is provided on the working face
The opening 12 of chamber；Flexible membrane layer 2 is set on the working face；Two electrodes 31,32 are respectively arranged at the flexible membrane layer 2 and are located at
The two sides of 12 positions of the opening, two electrodes 31,32 are used to squeeze the flexible membrane layer 2 under charges of different polarity effect, with
Make the thinning positioned at the aperture position of the flexible membrane layer.Wherein, the pressure of high-pressure fluid is greater than the pressure in 2 outside of flexible membrane layer
Power.
As shown in Fig. 2, being a kind of structural schematic diagram of exemplary embodiment of disclosure device transfer system.Device transfer
System includes: flexible base board 4, at least one part 5, target base plate 6, adhesive layer 7 and above-mentioned device transfer device to be transferred.
Wherein, part 5 to be transferred can be chip.Part 5 to be transferred is bonded on the flexible base board 4；Target base plate 6 and the flexible base
Plate 4 is oppositely arranged, and is located at the side that the flexible base board 4 is bonded with part 5 to be transferred；Adhesive layer 7 is set to the target base
Side of the plate 6 towards the part 5 to be transferred, and the cohesive force of the adhesive layer 7 is greater than the part to be transferred and the flexible base
Cohesive force between plate；Device transfer device is set to the side that the flexible base board 4 deviates from the part 5 to be transferred.When described
Flexible membrane layer is located at that the aperture position is thinning, and due to the constancy of volume of flexible membrane layer, fexible film becomes along its layer to extension
The flexible membrane layer of shape, the aperture position is protruded under the action of high-pressure fluid outward simultaneously, the flexible membrane layer protruded outward
Flexible base board 4 is squeezed so that flexible base board 4 deforms, so that part to be transferred 5 can be bonded in target base plate 6 by adhesive layer 7.
On the one hand, the device transfer device that the disclosure provides can quickly part to be transferred be transferred in target base plate；On the other hand, originally
The open device transfer device structure provided is simple, cost is relatively low.
In the present exemplary embodiment, as shown in Figure 1, the main structure body can be rectangular configuration, the working face is institute
State the one side of rectangular configuration.It should be understood that in other exemplary embodiments, the main structure body can also be other
Shape, for example, the main structure body can be a cylindrical structure, the working face is the arcuate flanks of the cylindrical structure.This
The protection scope of the disclosure is belonged to a bit.
In the present exemplary embodiment, the flexible membrane layer has certain deformability, which can be by elasticity
Material is made.For example, the flexible membrane layer may include one of polyacrylate, Polyglycolic acid fibre, Kynoar
Or it is a variety of.
In the present exemplary embodiment, as shown in figure 3, being the knot of disclosure device transfer device another kind exemplary embodiment
Structure schematic diagram.A kind of embodiment that high-pressure fluid is formed in the accommodating chamber 11 can be, and the main structure body can be with
It is provided with the aperture 13 for being connected to the accommodating chamber 11, the device transfer device can also include pressure pump (being not drawn into figure),
Pressure pump is connected to the aperture 13, for persistently providing the high-pressure fluid to the accommodating chamber.It should be understood that at other
In exemplary embodiment, there are also more implementations for formation high-pressure fluid in the accommodating chamber 11, for example, in accommodating chamber
Pre-stored high-pressure fluid.Wherein, high-pressure fluid can be high pressure gas, be also possible to highly pressurised liquid.For example, high-pressure fluid can
To use nitrogen or water.
In the present exemplary embodiment, the opening 12 can be multiple, corresponding two electrode may be it is multipair, often
The two sides that the flexible membrane layer is located at the aperture position are respectively arranged to two electrode.The setting may be implemented it is multiple to
Transfer shifts simultaneously.
In the present exemplary embodiment, as shown in figure 4, being the knot of disclosure device transfer device another kind exemplary embodiment
Structure schematic diagram.Two electrode may include being set to the first electrode 31 of the flexible membrane layer upper side and being set to described soft
The second electrode 32 of property film layer downside；To simplify Fabrication Technology of Electrode, multiple first electrodes 31 can be integral film
The public electrode of layer；Multiple second electrodes 32 are arranged in a one-to-one correspondence with the opening respectively.Wherein, multiple second electricity
Pole 32 is arranged in a one-to-one correspondence with the opening respectively and refers specifically to, and second electrode 32 is located in the orthographic projection of the opening.
It should be understood that in other exemplary embodiments, as shown in figure 5, another for disclosure device transfer device
The structural schematic diagram of kind exemplary embodiment.Multiple second electrodes 32 can be integral the public electrode of film layer；It is multiple
The first electrode 31 is arranged in a one-to-one correspondence with the opening respectively.These belong to the protection scope of the disclosure.
The present exemplary embodiment also provides a kind of device transfer system, as shown in Fig. 2, the device transfer system includes: soft
Property substrate 4, at least one part 5 to be transferred, target base plate 6, adhesive layer 7, above-mentioned device transfer device.Part 5 to be transferred bonds
In on the flexible base board 4；Target base plate 6 is oppositely arranged with the flexible base board 4, and is located at the flexible base board 4 and is bonded with
The side of part 5 to be transferred；Adhesive layer 7 is set to side of the target base plate 6 towards the part 5 to be transferred, and the bonding
The cohesive force of layer is greater than the cohesive force between the part to be transferred and the flexible base board；Device transfer device is set to described soft
Property substrate deviate from the side of the part to be transferred, the position for being bonded with part to be transferred for squeezing flexible base board setting, with
It is transferred to the part to be transferred in the target base plate.
The device transfer system and above-mentioned device transfer device technical characteristic having the same that the present exemplary embodiment provides
And working principle, above content have been described in detail, details are not described herein again.
As shown in Fig. 2, the opening area of device transfer device can be close with the area of part to be transferred, device transfer device
Opening be arranged in a one-to-one correspondence with part to be transferred, at one opening realize a part to be transferred switching.However, being turned using the device
When moving device realizes part to be transferred switching, need the opening of device transfer device and part to be transferred aligning setting one by one.However,
The alignment process is complicated for operation, so that causing the switching yield of part to be transferred reduces.In the present exemplary embodiment, as shown in fig. 6,
For the structural schematic diagram of disclosure device transfer system another kind exemplary embodiment.The device transfer device includes that array is set
The multiple openings set, and the opening area of the device transfer device is less than the area of the part to be transferred, the part to be transferred
Position is correspondingly arranged on multiple openings.The device transfer device is treated transfer member and is realized in switching process, does not need
Contraposition setting is carried out with part to be transferred to opening, it is only necessary to control to the electrode at different openings position and apply the charges of different polarity, both
The part to be transferred switching at different location may be implemented.
The present exemplary embodiment also provides a kind of element transfer method, as shown in fig. 7, being disclosure element transfer method one
The flow chart of kind exemplary embodiment.This method comprises:
Step S1: part to be transferred is bonded in a flexible base board；
Step S2: being arranged adhesive layer in target base plate, and the cohesive force of the adhesive layer is greater than the part to be transferred and institute
State the cohesive force between flexible base board；
Step S3: utilizing above-mentioned device transfer device, the part to be transferred is transferred to from the flexible base board described
In target base plate.
In the present exemplary embodiment, the part to be transferred can be chip, and part to be transferred is bonded in a flexible base board, can
To include:
The flexible base board is bonded on the substrate for being formed with the chip；
Using laser-stripping method by the strippable substrate.
Chip in the fabrication process, is generally formed on substrate in array structure, which can directly will be on substrate
Chip is transferred on flexible base board, simple process.
The element transfer method and above-mentioned device transfer system technical characteristic having the same that the present exemplary embodiment provides
And working principle, above content have been described in detail, details are not described herein again.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to its of the disclosure
His embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Adaptive change follow the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure or
Conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by claim
It points out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by the attached claims.
Claims (10)
1. a kind of device transfer device characterized by comprising
Main structure body has the accommodating chamber and working face for accommodating high-pressure fluid, and the connection appearance is provided on the working face
Receive the opening of chamber；
Flexible membrane layer is set on the working face；
Two electrodes, are respectively arranged at the two sides that the flexible membrane layer is located at the aperture position, and two electrodes are used in the opposite sex
The flexible membrane layer is squeezed under charge effect, so that the flexible membrane layer is thinning positioned at the aperture position.
2. device transfer device according to claim 1, which is characterized in that the main structure body is additionally provided with described in connection
The aperture of accommodating chamber, the device transfer device further include:
Pressure pump is connected to the aperture, for providing the high-pressure fluid to the accommodating chamber.
3. device transfer device according to claim 1, which is characterized in that it is described opening be it is multiple, two electrode is
Multipair, each pair of two electrode is respectively arranged at the two sides that the flexible membrane layer is located at the aperture position.
4. device transfer device according to claim 3, which is characterized in that two electrode includes being set to the flexibility
The first electrode of film layer first side and the second electrode for being set to the flexible membrane layer second side；
Multiple first electrodes are integral the public electrode of film layer；
Multiple second electrodes are arranged in a one-to-one correspondence with the opening respectively.
5. device transfer device according to claim 1-4, which is characterized in that the main structure body is rectangle knot
Structure, the working face are the one side of the rectangular configuration；
Or the main structure body is a cylindrical structure, the working face is the arcuate flanks of the cylindrical structure.
6. device transfer device according to claim 1-4, which is characterized in that the flexible membrane layer includes poly- third
One of olefin(e) acid ester, Polyglycolic acid fibre, Kynoar are a variety of.
7. a kind of device transfer system characterized by comprising
Flexible base board；
At least one part to be transferred, is bonded on the flexible base board；
Target base plate is oppositely arranged with the flexible base board, and is located at the side that the flexible base board is bonded with part to be transferred；
Adhesive layer is set to side of the target base plate towards the part to be transferred, and the cohesive force of the adhesive layer is greater than
Cohesive force between the part to be transferred and the flexible base board；
Device transfer device described in any one of claims 1-6 is set to the flexible base board away from the part to be transferred
Side, the position for being bonded with part to be transferred for squeezing flexible base board setting so that the part to be transferred be transferred to it is described
In target base plate.
8. device transfer system according to claim 7, which is characterized in that the device transfer device includes array setting
Multiple openings, and the opening area of the device transfer device be less than the part to be transferred area, the part institute to be transferred
Multiple openings are correspondingly arranged in position.
9. a kind of element transfer method characterized by comprising
Part to be transferred is bonded in a flexible base board；
Adhesive layer is set in target base plate, the cohesive force of the adhesive layer be greater than the part to be transferred and the flexible base board it
Between cohesive force；
Using device transfer device described in any one of claims 1-6, the part to be transferred is transferred from the flexible base board
Onto the target base plate.
10. element transfer method according to claim 9, which is characterized in that the part to be transferred is chip, will be to be transferred
Part is bonded in a flexible base board, comprising:
The flexible base board is bonded on the substrate for being formed with the chip；
Using laser-stripping method by the strippable substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910418812.0A CN110112092B (en) | 2019-05-20 | 2019-05-20 | Device transfer apparatus, transfer system, and transfer method |
| PCT/CN2020/077855 WO2020233191A1 (en) | 2019-05-20 | 2020-03-04 | Device transfer apparatus, system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910418812.0A CN110112092B (en) | 2019-05-20 | 2019-05-20 | Device transfer apparatus, transfer system, and transfer method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110112092A true CN110112092A (en) | 2019-08-09 |
| CN110112092B CN110112092B (en) | 2021-05-14 |
Family
ID=67491180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910418812.0A Expired - Fee Related CN110112092B (en) | 2019-05-20 | 2019-05-20 | Device transfer apparatus, transfer system, and transfer method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110112092B (en) |
| WO (1) | WO2020233191A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020233191A1 (en) * | 2019-05-20 | 2020-11-26 | 京东方科技集团股份有限公司 | Device transfer apparatus, system and method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538344A (en) * | 2014-12-22 | 2015-04-22 | 华中科技大学 | Device and method for ultrathin and flexible electronic device transfer and application of device |
| CN107863316A (en) * | 2017-11-06 | 2018-03-30 | 上海天马微电子有限公司 | Micro LED transporters, conveyer method and preparation method thereof |
| US9978629B1 (en) * | 2017-04-12 | 2018-05-22 | Acer Incorporated | Method of transferring micro devices and micro device transfer apparatus |
| CN108807213A (en) * | 2017-04-27 | 2018-11-13 | 宏碁股份有限公司 | The transfer method and micro component transfer device of micro component |
| CN108962015A (en) * | 2018-07-25 | 2018-12-07 | 京东方科技集团股份有限公司 | A kind of device transfer device and element transfer method |
| CN109449260A (en) * | 2018-11-13 | 2019-03-08 | 京东方科技集团股份有限公司 | Micro- light emitting diode transfer base substrate and transfer method, display panel and preparation method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7608989B2 (en) * | 1999-07-20 | 2009-10-27 | Sri International | Compliant electroactive polymer transducers for sonic applications |
| US8237324B2 (en) * | 2008-12-10 | 2012-08-07 | The Regents Of The University Of California | Bistable electroactive polymers |
| TWI587421B (en) * | 2016-07-29 | 2017-06-11 | 財團法人工業技術研究院 | An apparatus for assembling devices |
| CN110112092B (en) * | 2019-05-20 | 2021-05-14 | 京东方科技集团股份有限公司 | Device transfer apparatus, transfer system, and transfer method |
-
2019
- 2019-05-20 CN CN201910418812.0A patent/CN110112092B/en not_active Expired - Fee Related
-
2020
- 2020-03-04 WO PCT/CN2020/077855 patent/WO2020233191A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538344A (en) * | 2014-12-22 | 2015-04-22 | 华中科技大学 | Device and method for ultrathin and flexible electronic device transfer and application of device |
| US9978629B1 (en) * | 2017-04-12 | 2018-05-22 | Acer Incorporated | Method of transferring micro devices and micro device transfer apparatus |
| CN108807213A (en) * | 2017-04-27 | 2018-11-13 | 宏碁股份有限公司 | The transfer method and micro component transfer device of micro component |
| CN107863316A (en) * | 2017-11-06 | 2018-03-30 | 上海天马微电子有限公司 | Micro LED transporters, conveyer method and preparation method thereof |
| CN108962015A (en) * | 2018-07-25 | 2018-12-07 | 京东方科技集团股份有限公司 | A kind of device transfer device and element transfer method |
| CN109449260A (en) * | 2018-11-13 | 2019-03-08 | 京东方科技集团股份有限公司 | Micro- light emitting diode transfer base substrate and transfer method, display panel and preparation method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020233191A1 (en) * | 2019-05-20 | 2020-11-26 | 京东方科技集团股份有限公司 | Device transfer apparatus, system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020233191A1 (en) | 2020-11-26 |
| CN110112092B (en) | 2021-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110061106B (en) | Chip, target substrate, chip transfer method and display device | |
| CN106340523B (en) | A kind of flexible display panels and preparation method thereof, flexible display apparatus | |
| CN105474419B (en) | Plural layers piezoelectric device and the method for manufacturing the equipment | |
| US11616043B2 (en) | Chip transfer method, display device, chip and target substrate | |
| EP3890014A3 (en) | Display device and method for fabricating the same | |
| CN109905833B (en) | MEMS microphone manufacturing method | |
| TWI801984B (en) | Vibration apparatus and electronic apparatus including the same | |
| CN106449498B (en) | For shifting the transposition head of microcomponent and the transfer method of microcomponent | |
| CN110112092A (en) | Device transfer device, transfer system and transfer method | |
| US10716221B2 (en) | Method of manufacturing electronic device | |
| CN106409578A (en) | Button device using piezoelectric element | |
| CN109891569B (en) | Element pickup device, and preparation method and application method thereof | |
| CN108242424B (en) | Production method, flexible panel and the display device of flexible panel | |
| JP7214804B2 (en) | Vibration devices and devices containing them | |
| JP2020528161A (en) | Flexible display panel and equipment | |
| JP2013025317A (en) | Process substrate using thin glass substrate, method of manufacturing the same, and method of fabricating liquid crystal display device using the same | |
| WO2020087801A1 (en) | Micro-component transfer device and manufacturing method therefor | |
| KR101640743B1 (en) | A flexible vacuum chuck | |
| CN108962015A (en) | A kind of device transfer device and element transfer method | |
| TWI677952B (en) | Lead frame-based chip carrier used in the fabrication of mems transducer packages | |
| US10310648B2 (en) | Method for fabricating reinforced glass substrate, method for fabricating display device and the display device | |
| CN107219649B (en) | Direct jointing machine | |
| US20160052019A1 (en) | Piezoelectric device and electronic device including the same | |
| CN210245498U (en) | Microchip transfer equipment | |
| CN106209013B (en) | Piezo-electric device and electronic device comprising piezo-electric device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210514 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |