CN110112082A - It is a kind of for solving the brushing device and application method of silicon chip back side circle printing - Google Patents
It is a kind of for solving the brushing device and application method of silicon chip back side circle printing Download PDFInfo
- Publication number
- CN110112082A CN110112082A CN201910321407.7A CN201910321407A CN110112082A CN 110112082 A CN110112082 A CN 110112082A CN 201910321407 A CN201910321407 A CN 201910321407A CN 110112082 A CN110112082 A CN 110112082A
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- Prior art keywords
- back side
- wear resistant
- bracket
- silicon chip
- resistant sponge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention relates to a kind of for solving the brushing device and application method of silicon chip back side circle printing, including shaft, pp bracket and back side brush, pp bracket is in the form of annular discs, it is vertically-mounted in the middle part of the lower end of pp bracket to have shaft, rotary shaft hollow, pp pedestal upper end is equipped with back side brush, back side brush includes stainless steel disk and polyurethane wear resistant sponge, stainless steel disk lower end is fixed with pp bracket, stainless steel disk upper end is equipped with the polyurethane wear resistant sponge of matching, polyurethane wear resistant sponge is in the form of annular discs, pp bracket and stainless steel disk are internally provided with overflow ducts, overflow ducts one end is connected with the opening of shaft upper end, the overflow ducts other end is connected with polyurethane wear resistant sponge.Manipulator of the present invention adsorbs front side of silicon wafer, and silicon chip back side is contacted with back side brush, then slow transits through the back side brush of rotation, scrubs off the scuffing and contamination for remaining in silicon chip back side edge circle printing shape after being thinned.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, more particularly to a kind of for solving the scrub of silicon chip back side circle printing
Device and application method.
Background technique
The continuous increase and the reduction of characteristic line breadth of die size, IC manufacture largely use large-diameter silicon wafer, therefore
Requirement to silicon chip surface flatness will be increasingly stringent, because this is the key that realize large scale integrated circuit three-dimensional structure.
And in numerous planarization techniques, chemically mechanical polishing is uniquely to obtain the planarization techniques of leveling effect.It wants
Meet higher and higher flatness requirement, semiconductor processing industry carries out thinned, raising polishing usually before chemically mechanical polishing
Preceding burnishing parameters.
Thinned common practice, which is that silicon wafer is adsorbed on workbench, to be rotated, and grinding wheel is moved downward with higher speed,
Silicon wafer is carried out thinned.It is vacuum area among usually thinned machine worktable, edge one encloses to avoid silicon chip edge turned-down edge after being thinned
It is vacuum insulation band.It is thinned to rotate by grinding wheel in silicon chip surface and presses, damage, rupture, removes and realize wafer thinning, technique
In unavoidably generate silicon bits and grinding wheel bits etc. granule foreigns.Partial particulate can penetrate into work edge of table in thinning process, very
Sky can cause silicon chip edge after being thinned the scuffing of circle printing shape occur the interface of granular absorption to vacuum belt and vacuum insulation band
And contamination.
Summary of the invention
The brushing device that technical problem to be solved by the invention is to provide a kind of for solving silicon chip back side circle printing and
Application method, manipulator adsorb front side of silicon wafer, and silicon chip back side is contacted with back side brush, then slow transit through the back side brush of rotation, brush
Wash off the scuffing and contamination for remaining in silicon chip back side edge circle printing shape after being thinned.
The technical solution adopted by the present invention to solve the technical problems is: providing a kind of for solving silicon chip back side circle printing
Brushing device, including shaft, pp bracket and back side brush, the pp bracket is in the form of annular discs, vertical in the middle part of the lower end of the pp bracket
Shaft, the rotary shaft hollow are installed, the pp pedestal upper end is equipped with back side brush, and back side brush includes stainless steel disk
With polyurethane wear resistant sponge, the stainless steel disk lower end is fixed with pp bracket, which is equipped with matching
Polyurethane wear resistant sponge, the polyurethane wear resistant sponge is in the form of annular discs, inside the pp bracket and stainless steel disk
Overflow ducts are provided with, which is connected with the opening of shaft upper end, the overflow ducts other end and poly-
The wear-resisting sponge of urethane is connected, and the upper side of the back side brush is provided with manipulator.
As a supplement to the technical solution of the present invention, the diameter range of the polyurethane wear resistant sponge exists
Between 150-350mm.
As a supplement to the technical solution of the present invention, around circumference on the polyurethane wear resistant sponge
It is disposed with several strip hole groups.
As a supplement to the technical solution of the present invention, each strip hole group includes three length being evenly arranged
Through-hole.
As a supplement to the technical solution of the present invention, the overflow ducts include sprue and shunting
Road, the pp bracket, which is located in the middle part of the lower section of each long strip through hole, is provided with sprue, and the sprue is along long strip through hole
Length direction arrangement, the sprue upper end homogeneous vertical are disposed with several runners, and the upper end of the runner is connected to length
Through-hole, described sprue one end seal, and the other end is connected with the opening of shaft upper end.
As a supplement to the technical solution of the present invention, solid by screw between the pp bracket and shaft
It is fixed.
As a supplement to the technical solution of the present invention, the polyurethane wear resistant sponge and stainless steel disk
Between fixed by glue.
As a supplement to the technical solution of the present invention, sucker is installed on the manipulator.
It is a kind of for solving the application method of the brushing device of silicon chip back side circle printing, specific operating procedure is as follows:
(a) manipulator contacts with polyurethane wear resistant sponge by sucker suction front side of silicon wafer, silicon chip back side and pushes 1-
5mm；
(b) the polyurethane wear resistant sponge for then slow transitting through rotation scrubs off and remains in silicon chip back side edge circle after being thinned
The scuffing and contamination for printing shape, in scrubbing process, from lower to upper constantly toward the injection cleaning of polyurethane wear resistant sponge inside shaft
Water source, clear water flows successively through sprue and runner is eventually flowed into and absorbed in long strip through hole by polyurethane wear resistant sponge.
The utility model has the advantages that the present invention relates to a kind of for solving the brushing device and application method of silicon chip back side circle printing, brush
Cleaning device be mounted on after thinned machine wafer thinning with before silicon wafer drying between position；Manipulator adsorbs front side of silicon wafer, silicon wafer back
Face is contacted with back side brush, is then slow transitted through the back side brush of rotation, is scrubbed off and remain in silicon chip back side edge circle printing shape after being thinned
Scuffing and contamination；Back side brush includes stainless steel disk and polyurethane wear resistant sponge, and overflow water soaks always polyurethane when scrub
Wear-resisting sponge, washes away granule foreign in time.The present invention is reliable with simple and practical in structure, easy to use and structure, runs smoothly
The characteristics of, can scrub off completely and remain in the scuffing and contamination of silicon chip back side edge circle printing shape after being thinned, advantageously reduce 8 cun and
The impurity and metal of 12 cun of CMP planarizations introduce, and are conducive to the silicon chip surface quality for improving 8 cun and 12 cun CMP planarizations.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is the top view of pp bracket of the present invention and back side brush；
Fig. 3 is the schematic diagram of internal structure of pp bracket of the present invention and back side brush.
Diagram: 1, shaft, 2, pp bracket, 3, back side brush, 4, strip hole group, 5, manipulator, 6, silicon wafer, 7, sprue, 8,
Runner.
Specific embodiment
Present invention will be further explained below with reference to specific examples.It should be understood that these embodiments are merely to illustrate the present invention
Rather than it limits the scope of the invention.In addition, it should also be understood that, after reading the content taught by the present invention, those skilled in the art
Member can make various changes or modifications the present invention, and such equivalent forms equally fall within the application the appended claims and limited
Range.
Embodiments of the present invention be related to it is a kind of for solving the brushing device of silicon chip back side circle printing, as shown in Figure 1-3, packet
Shaft 1, pp bracket 2 and back side brush 3 are included, the pp bracket 2 is in the form of annular discs, vertically-mounted in the middle part of the lower end of the pp bracket 2 to have
Shaft 1, the shaft 1 is hollow, and 2 upper end of pp bracket is equipped with back side brush 3, and back side brush 3 includes stainless steel disk
With polyurethane wear resistant sponge, the stainless steel disk lower end and pp bracket 2 are fixed, which is equipped with matching
Polyurethane wear resistant sponge, the polyurethane wear resistant sponge is in the form of annular discs, inside the pp bracket 2 and stainless steel disk
Overflow ducts are provided with, which is connected with the opening of 1 upper end of shaft, the overflow ducts other end and poly-
The wear-resisting sponge of urethane is connected, and the upper side of the back side brush 3 is provided with manipulator 5.Pp is exactly polypropylene, a kind of plastics,
It is a kind of high density, unprotected side chain, it is highly crystalline must linear polymer, there is excellent comprehensive performance.Common product: basin, bucket,
Furniture, film, woven bag, bottle cap, bumper etc..
The diameter range of the polyurethane wear resistant sponge is between 150-350mm.
There are several strip hole groups 4 around circumference on the polyurethane wear resistant sponge.
Each strip hole group 4 includes three long strip through hole being evenly arranged.
The overflow ducts include sprue 7 and runner 8, and the pp bracket 2 is located under each long strip through hole
Side middle part is provided with sprue 7, which arranges along long strip through hole length direction, and 7 upper end of sprue is uniform
It is disposed with several runners 8 vertically, the upper end of the runner 8 is connected to long strip through hole, and described 7 one end of sprue seals, separately
One end is connected with the opening of 1 upper end of shaft.
It is fixed between the pp bracket 2 and shaft 1 by screw.
It is fixed between the polyurethane wear resistant sponge and stainless steel disk by glue.
Sucker is installed on the manipulator 5.
Brushing device be mounted on after thinned machine wafer thinning with before silicon wafer drying between position；Manipulator 5 adsorbs silicon wafer 6
Front, 6 back side of silicon wafer are contacted with back side brush 3, are then slow transitted through the back side brush 3 of rotation, are scrubbed off and remain in silicon wafer after being thinned
The scuffing and contamination of 6 edge circle printing shape of the back side；Back side brush 3 includes stainless steel disk and polyurethane wear resistant sponge, overflow when scrub
Water soaks always polyurethane wear resistant sponge, washes away granule foreign in time.
The present invention has the characteristics that simple and practical in structure, easy to use and structure is reliable, runs smoothly, and can scrub off completely
Remain in the scuffing and contamination of silicon chip back side edge circle printing shape after being thinned, advantageously reduce the impurity of 8 cun and 12 cun CMP planarizations with
Metal introduces, and is conducive to the silicon chip surface quality for improving 8 cun and 12 cun CMP planarizations.
It is a kind of for solving the application method of the brushing device of silicon chip back side circle printing, specific operating procedure is as follows:
(a) by 6 front of sucker suction silicon wafer, 6 back side of silicon wafer contacts with polyurethane wear resistant sponge and pushes 1- manipulator 5
5mm；
(b) the polyurethane wear resistant sponge for then slow transitting through rotation scrubs off and remains in 6 dorsal edge circle of silicon wafer after being thinned
The scuffing and contamination for printing shape, in scrubbing process, from lower to upper constantly toward the injection cleaning of polyurethane wear resistant sponge inside shaft 1
Water source, clear water flows successively through sprue 7 and runner 8 is eventually flowed into and absorbed in long strip through hole by polyurethane wear resistant sponge.It shunts
Road 8 is cylindrical.
Claims (9)
1. it is a kind of for solving the brushing device of silicon chip back side circle printing, including shaft (1), pp bracket (2) and back side brush (3),
Be characterized in that: the pp bracket (2) is in the form of annular discs, vertically-mounted in the middle part of the lower end of the pp bracket (2) to have shaft (1), described
Shaft (1) it is hollow, described pp bracket (2) upper end be equipped with the back side brush (3), the back side brush (3) include stainless steel disk and
Polyurethane wear resistant sponge, the stainless steel disk lower end and pp bracket (2) are fixed, which is equipped with matching
Polyurethane wear resistant sponge, the polyurethane wear resistant sponge is in the form of annular discs, in the pp bracket (2) and stainless steel disk
Portion is provided with overflow ducts, which is connected with the opening of shaft (1) upper end, the overflow ducts other end
It is connected with polyurethane wear resistant sponge, is provided with manipulator (5) at the upper side of the back side brush (3).
2. according to claim 1 a kind of for solving the brushing device of silicon chip back side circle printing, it is characterised in that: described
The diameter range of polyurethane wear resistant sponge is between 150-350mm.
3. according to claim 1 a kind of for solving the brushing device of silicon chip back side circle printing, it is characterised in that: described
There are several strip hole groups (4) around circumference on polyurethane wear resistant sponge.
4. according to claim 3 a kind of for solving the brushing device of silicon chip back side circle printing, it is characterised in that: Mei Gechang
Hole group (4) includes three long strip through hole being evenly arranged.
5. according to claim 4 a kind of for solving the brushing device of silicon chip back side circle printing, it is characterised in that: described
Overflow ducts include sprue (7) and runner (8), and the pp bracket (2) is located in the middle part of the lower section of each long strip through hole
Sprue (7) are provided with, which arranges that the sprue (7) upper end is uniformly erected along long strip through hole length direction
Several runners (8) are directly disposed with, the upper end of the runner (8) is connected to long strip through hole, (7) one end seal of sprue
Firmly, the other end is connected with the opening of shaft (1) upper end.
6. according to claim 1 a kind of for solving the brushing device of silicon chip back side circle printing, it is characterised in that: described
It is fixed between pp bracket (2) and shaft (1) by screw.
7. according to claim 1 a kind of for solving the brushing device of silicon chip back side circle printing, it is characterised in that: described
It is fixed between polyurethane wear resistant sponge and stainless steel disk by glue.
8. according to claim 1 a kind of for solving the brushing device of silicon chip back side circle printing, it is characterised in that: described
Manipulator is equipped with sucker on (5).
9. a kind of use is as described in claim 1 a kind of for solving the application method of the brushing device of silicon chip back side circle printing,
Specific operating procedure is as follows:
(a) by sucker suction silicon wafer (6) front, silicon wafer (6) back side contacts and pushes with polyurethane wear resistant sponge manipulator (5)
1-5mm；
(b) the polyurethane wear resistant sponge for then slow transitting through rotation scrubs off and remains in silicon wafer (6) dorsal edge circle printing after being thinned
The scuffing and contamination of shape, in scrubbing process, shaft (1) is internal from lower to upper constantly toward the injection cleaning of polyurethane wear resistant sponge
Water source, clear water flows successively through sprue (7) and runner (8) is eventually flowed into and absorbed in long strip through hole by polyurethane wear resistant sponge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910321407.7A CN110112082A (en) | 2019-04-22 | 2019-04-22 | It is a kind of for solving the brushing device and application method of silicon chip back side circle printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910321407.7A CN110112082A (en) | 2019-04-22 | 2019-04-22 | It is a kind of for solving the brushing device and application method of silicon chip back side circle printing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110112082A true CN110112082A (en) | 2019-08-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910321407.7A Pending CN110112082A (en) | 2019-04-22 | 2019-04-22 | It is a kind of for solving the brushing device and application method of silicon chip back side circle printing |
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| Country | Link |
|---|---|
| CN (1) | CN110112082A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117878026A (en) * | 2024-03-12 | 2024-04-12 | 西安奕斯伟材料科技股份有限公司 | Silicon wafer cleaning equipment and silicon wafer cleaning method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101620987A (en) * | 2008-07-02 | 2010-01-06 | 东京毅力科创株式会社 | substrate cleaning apparatus |
| CN207086165U (en) * | 2017-06-29 | 2018-03-13 | 广州桦航机械制造有限公司 | A kind of laminating machine |
| CN210015840U (en) * | 2019-04-22 | 2020-02-04 | 金瑞泓科技(衢州)有限公司 | A brushing device for solving silicon chip back circle seal |
-
2019
- 2019-04-22 CN CN201910321407.7A patent/CN110112082A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101620987A (en) * | 2008-07-02 | 2010-01-06 | 东京毅力科创株式会社 | substrate cleaning apparatus |
| CN207086165U (en) * | 2017-06-29 | 2018-03-13 | 广州桦航机械制造有限公司 | A kind of laminating machine |
| CN210015840U (en) * | 2019-04-22 | 2020-02-04 | 金瑞泓科技(衢州)有限公司 | A brushing device for solving silicon chip back circle seal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117878026A (en) * | 2024-03-12 | 2024-04-12 | 西安奕斯伟材料科技股份有限公司 | Silicon wafer cleaning equipment and silicon wafer cleaning method |
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