CN110103477A - A kind of preparation method of high-frequency copper-clad plate - Google Patents
A kind of preparation method of high-frequency copper-clad plate Download PDFInfo
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- CN110103477A CN110103477A CN201910384398.6A CN201910384398A CN110103477A CN 110103477 A CN110103477 A CN 110103477A CN 201910384398 A CN201910384398 A CN 201910384398A CN 110103477 A CN110103477 A CN 110103477A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/001—Joining in special atmospheres
- B29C66/0012—Joining in special atmospheres characterised by the type of environment
- B29C66/0014—Gaseous environments
- B29C66/00145—Vacuum, e.g. partial vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/026—Chemical pre-treatments
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
- B29C66/7428—Transition metals or their alloys
- B29C66/74281—Copper or alloys of copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
- C23C4/08—Metallic material containing only metal elements
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/134—Plasma spraying
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/137—Spraying in vacuum or in an inert atmosphere
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/002—Panels; Plates; Sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
- B29L2009/003—Layered products comprising a metal layer
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Abstract
The present invention provides a kind of preparation methods of high-frequency copper-clad plate, it is prepared including substrate, the processes such as plasma spraying metal layer and copper foil layer are cured, this method is in traditional high-frequency copper-clad plate preparation process, increase the setting of plasma spraying, the shortcomings that overcoming the preparation of existing high frequency plate, plasma spray coating process is high-efficient, simple process and not by exemplar geomery constrain, alloy interlayer can form good metallurgical bonding with substrate and copper foil respectively simultaneously, alloy interlayer is thin and uniform, crackle and hole defect are few, bond strength is high, use high-frequency copper-clad plate prepared by the present invention, its high-temperature service is had excellent performance, processing performance is excellent, impact resistance is high, heat resistance is good, preparation cost is low.
Description
Technical field
The present invention relates to technical field of copper clad laminate, more particularly, to a kind of preparation method of high-frequency copper-clad plate.
Background technique
Today's society has entered the society of advanced IT application, and IT industry becomes the powerful motive force of social informatization.5G
Arriving, automatic Pilot, anti-collision system for automobile, high-speed high capacity memory, positioning system, the Internet of Things in epoch etc. are widely applied,
Being required to electronic material and electronic component etc. used has the function of high frequency, high speed and massive store and transmission signal.Closely
Nian Lai, with the fast development of electronic information technology, to ensure that ever-increasing traffic capacity, electronic product communication frequency are more next
It is higher.The high speed that information processing and information are propagated, it is desirable that copper-clad plate has higher high frequency characteristics, lower dielectric constant and Jie
Matter loss.The rapid development of modern communication industry has welcome unprecedented big market for the manufacture of high-frequency copper-clad plate.
It is various for influencing the factor of high-frequency copper-clad plate dielectric property.It is main from the point of view of the technical standpoint that copper-clad plate manufactures
Have the following aspects, i.e., resin system, reinforcing material, packing material, component material volume content in a substrate and its
Interface and used process route and technological parameter.The design of high-frequency copper-clad plate seeks to the suitable resinite of selection
System, former, auxiliary material develop reasonable formula, and the reasonable process route of utilitarian design is resolved various interfaces in different processes and asked
Topic, various assistants and additives are used with caution in the fabrication process, introduce impurity less in system as far as possible.At present since copper-clad plate exists
The application in each side field is mainly reflected in so that also higher and higher to its performance requirement: dielectric constant and dielectric loss, by
Thermal stability, excellent mechanical property and good processing performance etc..But the high-frequency copper-clad plate developed at present still has scarce
Point, as its interface bond strength performance, especially interface bond strength is unstable under worst hot case, need to further mention
It is high.
Summary of the invention
It is an object of the invention to overcome the deficiency of the above-mentioned prior art, a kind of preparation side of high-frequency copper-clad plate is provided
Method has many advantages, such as that good mechanical performance, processing performance are good, especially using high-frequency copper-clad plate prepared by the technical program
Interface bond strength stability is good under worst hot case, while being still able to maintain good dielectric properties.
The purpose of the present invention is achieved by the following technical programs:
A kind of preparation method of high-frequency copper-clad plate, comprising the following steps:
The preparation of 01. substrate；
02. plasma spraying metal layer: uniform plasma spraying is carried out in substrate surface, plasma spray is coated in substrate surface
Obtain composite substrate after forming alloy interlayer, the alloy interlayer with a thickness of 10-50 μm；
03. copper foil layer is cured: the composite substrate overlayed between copper foil, it is cured in vacuum pressure heat engine middle layer,
High-frequency copper-clad plate is obtained after the alloy interlayer and the copper foil diffusion bond.
Further, the plasma spraying metal layer in step 03, spray voltage 40-60V, electric current 500-700A,
Plasma gas flow is 30-50L/min, and auxiliary gas flow amount is 3-10L/min, powder feeding gas flow 5-20g/min.
One of as a preferred solution of the present invention, the plasma gas is Ar gas, and the auxiliary gas is H2.Ar pneumoelectric
Ionization potential is lower, and plasma arc is stable and is easy to ignite, and arc flame is shorter, and suitable for the spraying of smallclothes or thin pieces, furthermore Ar gas is also
Good protective effect, the significant raising arc voltage of hydrogen energy, makes hydrogen plasma jet have very high enthalpy, mixes when with argon gas
In use, greatly improving the cutting power of plasma jet.
One of as a preferred solution of the present invention, the alloy interlayer is appointing for metallic aluminium, nickel, aluminium alloy or nickel alloy
Anticipate it is a kind of or at least two it is compound.
Further, the plasma spraying metal layer in step 03, spray-painting gun and substrate surface distance are 10-20cm,
Spraying operation window height range is 5-15cm.
Further, the hot pressing condition in step 03 is pressure 20-40Kg/cm2, and temperature is 190-230 DEG C, time 100-
180min。
Further, the copper thickness is 5-130 μm, and the copper foil is in copper, brass, copper alloy or brass alloys
Any one or at least two it is compound.
Further, the substrate preparation specifically includes following steps,
001. is dissolved in matrix resin, crosslinking agent, initiator in toluene, sufficiently dissolves；
002. is added filler, is mixed to get glue at room temperature；
003. impregnates the glue using glass-fiber-fabric, and then the baking-curing in 150-170 DEG C of baking oven, obtains substrate.
There are more excellent dielectric properties using substrate prepared by the method.
One of as a preferred solution of the present invention, described matrix resin includes butadiene styrene resin and polybutadiene；It is described
Crosslinking agent is triallyl cyanurate, and the filler is mass fraction 40%, the barium titanate that partial size degree is 0.5.
As another preferred embodiment of the invention, described matrix resin includes butadiene styrene resin and polybutadiene；It is described
Crosslinking agent is triallyl cyanurate, and the filler is mass fraction 30%, the barium titanate that partial size degree is 5.
The invention has the following beneficial effects: the present invention provides a kind of preparation methods of high-frequency copper-clad plate, including substrate
Preparation, plasma spraying metal layer and the processes such as copper foil layer is cured, this method in traditional high-frequency copper-clad plate preparation process,
The setting for increasing plasma spraying, the shortcomings that overcoming the preparation of existing high frequency plate, plasma spray coating process is high-efficient, technique
It simply and is not constrained by exemplar geomery, while alloy interlayer can form good metallurgical junction with substrate and copper foil respectively
It closes, alloy interlayer is thin and uniform, and crackle and hole defect are few, and bond strength is high, covers copper using high frequency prepared by the present invention
Plate, processing performance is excellent, impact resistance is high, heat resistance is good, preparation cost is low；Prepared high frequency covers through the invention
Copper sheet has excellent high-temperature service performance, and plasma spraying alloy interlayer, which compares the substrate not sprayed, has higher fusing point
And mechanical property, it is still able to maintain high intensity under worst hot case, there is no softening and interface debonding phenomenons, cover to significantly increase
The high temperature peel strength of copper sheet, so that high-frequency copper-clad plate material has heat-resist, mechanical behavior under high temperature and good stability of the dimension, Jie
The advantages that electrical loss is small；In addition, it is normal that design dielectric can be met by rationally designing the volume fraction of each component material in a substrate
Several sizes and requirement.
Specific embodiment
Below with reference to embodiment, invention is further described in detail.
A kind of preparation method of high-frequency copper-clad plate, comprising the following steps:
The preparation of 01. substrate；Specifically, substrate preparation includes the following steps, 001. by matrix resin, crosslinking agent, draw
Hair agent is dissolved in toluene, is sufficiently dissolved；002. is added filler, is mixed to get glue at room temperature；003. is soaked using glass-fiber-fabric
Glue described in stain, then the baking-curing in 150-170 DEG C of baking oven, obtains substrate.Had using substrate prepared by the method
More excellent dielectric properties；
02. plasma spraying metal layer: uniform plasma spraying is carried out in substrate surface, plasma spray is coated in substrate surface
Obtain composite substrate after forming alloy interlayer, the alloy interlayer with a thickness of 10-50 μm；
03. copper foil layer is cured: the composite substrate overlayed between copper foil, it is cured in vacuum pressure heat engine middle layer,
High-frequency copper-clad plate is obtained after the alloy interlayer and the copper foil diffusion bond.
Further, the plasma spraying metal layer in step 03, spray voltage 40-60V, electric current 500-700A,
Plasma gas flow is 30-50L/min, and auxiliary gas flow amount is 3-10L/min, powder feeding gas flow 5-20g/min.
One of as a preferred solution of the present invention, the plasma gas is Ar gas, and the auxiliary gas is H2.Ar pneumoelectric
Ionization potential is lower, and plasma arc is stable and is easy to ignite, and arc flame is shorter, and suitable for the spraying of smallclothes or thin pieces, furthermore Ar gas is also
Good protective effect, the significant raising arc voltage of hydrogen energy, makes hydrogen plasma jet have very high enthalpy, mixes when with argon gas
In use, greatly improving the cutting power of plasma jet.
One of as a preferred solution of the present invention, the alloy interlayer is appointing for metallic aluminium, nickel, aluminium alloy or nickel alloy
Anticipate it is a kind of or at least two it is compound.
Further, the plasma spraying metal layer in step 03, spray-painting gun and substrate surface distance are 10-20cm,
Spraying operation window height range is 5-15cm.
Further, the hot pressing condition in step 03 is pressure 20-40Kg/cm2, and temperature is 190-230 DEG C, time 100-
180min。
Further, the copper thickness is 5-130 μm, and the copper foil is in copper, brass, copper alloy or brass alloys
Any one or at least two it is compound.
One of as a preferred solution of the present invention, described matrix resin includes butadiene styrene resin and polybutadiene；It is described
Crosslinking agent is triallyl cyanurate, and the filler is mass fraction 40%, the barium titanate that partial size degree is 0.5.
As another preferred embodiment of the invention, described matrix resin includes butadiene styrene resin and polybutadiene；It is described
Crosslinking agent is triallyl cyanurate, and the filler is mass fraction 30%, the barium titanate that partial size degree is 5.
Preferred embodiment of the invention is given below, following embodiment is the technical scheme is that premise, is described in detail
Specific embodiment and operating procedure, but protection scope of the present invention is not limited only to following example.
Embodiment 1
11. 160g butadiene styrene resin, 80g polybutadiene, 40g crosslinking agent (triallyl cyanurate) and 5g are caused
Agent is dissolved in toluene, after completely dissolution, filler (mass fraction 40%, the barium titanate that partial size degree is 0.5) is added, then in room
Lower be uniformly mixed of temperature stirs to get glue.NE- glass-fiber-fabric is used to impregnate above-mentioned glue as reinforcing material, then in 150-160
DEG C baking oven in baking 4-10min solidification, obtain substrate；
12. starting plasma spray apparatus power supply, spray voltage 50V, electric current 600A, plasma gas (Ar) flow 40L/
Min assists gas (H2) flow 6L/min, powder feeding gas (Ar) flow 8g/min, nozzle and substrate surface distance 15cm, it realizes
To the even application of substrate surface, the alloy interlayer with a thickness of 20 μm is formed.Alloy interlayer is that the nickel aluminium containing aluminium 5% closes
Gold；
13. the composite substrate of production is neatly overlayed between copper foil, the two-sided copper foil coated with 40 μ m thicks, in vacuum pressure
High-frequency copper-clad plate is obtained after hot pressing in hot press, nickel layer and copper foil diffusion bond, hot pressing condition is pressure 30Kg/cm2, temperature is
210 DEG C, time 120min.
Embodiment 2
A kind of high-frequency copper-clad plate preparation method comprising following steps:
21. 160g butadiene styrene resin, 80g polybutadiene, 40g crosslinking agent (triallyl cyanurate) and 5g are caused
Agent is dissolved in toluene, after completely dissolution, filler (mass fraction 40%, the barium titanate that partial size degree is 0.5) is added, then in room
Lower be uniformly mixed of temperature stirs to get glue.NE- glass-fiber-fabric is used to impregnate above-mentioned glue as reinforcing material, then 150-160 again
DEG C baking oven in baking 4-10min solidification, obtain substrate；
22. starting plasma spray apparatus power supply, spray voltage 50V, electric current 600A, plasma gas (Ar) flow 40L/
Min assists gas (H2) flow 6L/min, powder feeding gas (Ar) flow 8g/min, nozzle and substrate surface distance 15cm, it realizes
To the even application of substrate surface, the alloy interlayer with a thickness of 20 μm is formed.Alloy interlayer be commercial-purity aluminium (≤
99.79wt.%)；
23. the composite substrate of production is neatly overlayed between copper foil, the two-sided copper foil coated with 40 μ m thicks, in vacuum pressure
High-frequency copper-clad plate is obtained after hot pressing in hot press, aluminium layer and copper foil diffusion bond, hot pressing condition is pressure 30Kg/cm2, temperature is
210 DEG C, time 120min.
Embodiment 3
A kind of high-frequency copper-clad plate preparation method comprising following steps:
31. 160g butadiene styrene resin, 60g polybutadiene, 20g crosslinking agent (triallyl cyanurate) and 5g are caused
Agent is dissolved in toluene, after completely dissolution, filler (mass fraction 30%, the barium titanate that partial size degree is 5) is added, then in room temperature
Lower be uniformly mixed stirs to get glue.NE- glass-fiber-fabric is used to impregnate above-mentioned glue as reinforcing material, then again 150-160 DEG C
Baking oven in baking 4-10min solidification, obtain substrate；
32. starting plasma spray apparatus power supply, spray voltage 50V, electric current 600A, plasma gas (Ar) flow 40L/
Min assists gas (H2) flow 6L/min, powder feeding gas (Ar) flow 8g/min, nozzle and substrate surface distance 15cm, it realizes
To the even application of substrate surface, the alloy interlayer with a thickness of 20 μm is formed.Alloy interlayer be commercial-purity aluminium (≤
99.79wt.%)；
33. the composite substrate of production is neatly overlayed between copper foil, the two-sided copper foil coated with 60 μ m thicks, in vacuum pressure
High-frequency copper-clad plate is obtained after hot pressing in hot press, aluminium layer and copper foil diffusion bond, hot pressing condition is pressure 30Kg/cm2, temperature is
210 DEG C, time 150min.
Following table covers copper with the high frequency for not spraying alloy interlayer for high frequency copper sheet the performance test results made from embodiment 1-3
Plate the performance test results:
Compared by upper table analysis it can be concluded that, using obtained by plasma spraying alloy interlayer in embodiment 1-3
High-frequency copper-clad plate relative to the high-frequency copper-clad plate for not spraying alloy interlayer, peel strength improves about 10%, and bending is strong
Degree has been turned up about 8.5%, that is, the mechanics of high-frequency copper-clad plate can be effectively improved by showing increase plasma spraying alloy interlayer
Performance.
As described above, only presently preferred embodiments of the present invention, when cannot be limited the scope of implementation of the present invention with this,
All still belong to this hair according to simple equivalent changes and modifications made by scope of the present invention patent and invention description content generally
In the range of bright patent covers.
Claims (10)
1. a kind of preparation method of high-frequency copper-clad plate, comprising the following steps:
The preparation of 01. substrate；
02. plasma spraying metal layer: uniform plasma spraying is carried out in substrate surface, plasma spray is coated in substrate surface and is formed
Obtain composite substrate after alloy interlayer, the alloy interlayer with a thickness of 10-50 μm；
03. copper foil layer is cured: the composite substrate overlayed between copper foil, it is cured in vacuum pressure heat engine middle layer, and it is described
High-frequency copper-clad plate is obtained after alloy interlayer and the copper foil diffusion bond.
2. a kind of preparation method of high-frequency copper-clad plate as described in claim 1, it is characterised in that: the plasma spray in step 03
Matel coated layer, spray voltage 40-60V, electric current 500-700A, plasma gas flow are 30-50L/min, assist gas
Flow is 3-10L/min, powder feeding gas flow 5-20g/min.
3. a kind of preparation method of high-frequency copper-clad plate as claimed in claim 2, it is characterised in that: the plasma gas is Ar
Gas, the auxiliary gas are H2。
4. a kind of preparation method of high-frequency copper-clad plate as described in claim 1, it is characterised in that: the alloy interlayer is gold
Belong to aluminium, nickel, aluminium alloy or nickel alloy any one or at least two it is compound.
5. a kind of preparation method of high-frequency copper-clad plate as described in claim 1, it is characterised in that: the plasma spray in step 03
Matel coated layer, spray-painting gun and substrate surface distance are 10-20cm, and spraying operation window height range is 5-15cm.
6. a kind of preparation method of high-frequency copper-clad plate as described in claim 1, it is characterised in that: the hot pressing condition in step 03
For pressure 20-40Kg/cm2, temperature is 190-230 DEG C, time 100-180min.
7. a kind of preparation method of high-frequency copper-clad plate as described in claim 1, it is characterised in that: the copper thickness is 5-
130 μm, the copper foil be copper, brass, copper alloy or brass alloys in any one or at least two it is compound.
8. a kind of preparation method of high-frequency copper-clad plate as described in claim 1, it is characterised in that: the specific packet of substrate preparation
Include following steps,
001. is dissolved in matrix resin, crosslinking agent, initiator in toluene, sufficiently dissolves；
002. is added filler, is mixed to get glue at room temperature；
003. impregnates the glue using glass-fiber-fabric, and then the baking-curing in 150-170 DEG C of baking oven, obtains substrate.
9. a kind of preparation method of high-frequency copper-clad plate as claimed in claim 8, it is characterised in that: described matrix resin includes fourth
Benzene resin and polybutadiene；The crosslinking agent is triallyl cyanurate, and the filler is mass fraction 40%, partial size
The barium titanate that degree is 0.5.
10. a kind of preparation method of high-frequency copper-clad plate as claimed in claim 8, it is characterised in that: described matrix resin includes
Butadiene styrene resin and polybutadiene；The crosslinking agent is triallyl cyanurate, and the filler is mass fraction 30%, grain
The barium titanate that diameter degree is 5.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104908400A (en) * | 2015-03-13 | 2015-09-16 | 福建新世纪电子材料有限公司 | High frequency-characteristic copper-clad plate manufacturing method |
| CN106379006A (en) * | 2016-08-29 | 2017-02-08 | 陕西生益科技有限公司 | High frequency copper-clad plate |
| CN108684151A (en) * | 2018-06-29 | 2018-10-19 | 南京大学 | A kind of PTFE bases PCB copper-clad plates and cover copper method |
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2019
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| CN104908400A (en) * | 2015-03-13 | 2015-09-16 | 福建新世纪电子材料有限公司 | High frequency-characteristic copper-clad plate manufacturing method |
| CN106379006A (en) * | 2016-08-29 | 2017-02-08 | 陕西生益科技有限公司 | High frequency copper-clad plate |
| CN108684151A (en) * | 2018-06-29 | 2018-10-19 | 南京大学 | A kind of PTFE bases PCB copper-clad plates and cover copper method |
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