CN110098141A - The manufacturing method of electronic component kit - Google Patents
The manufacturing method of electronic component kit Download PDFInfo
- Publication number
- CN110098141A CN110098141A CN201810392443.8A CN201810392443A CN110098141A CN 110098141 A CN110098141 A CN 110098141A CN 201810392443 A CN201810392443 A CN 201810392443A CN 110098141 A CN110098141 A CN 110098141A
- Authority
- CN
- China
- Prior art keywords
- electronic component
- antistatic layer
- component kit
- organic solvent
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
- H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0067—Devices for protecting against damage from electrostatic discharge
Abstract
It is a kind of manufacture electronic component kit method include: respectively include fabric sheet base upper and lower surfaces on form the first antistatic layer and the second antistatic layer；Multiple receiving slits of matrix form are formed by carrying out air-pressure forming to the base and the first antistatic layer and the second antistatic layer；The result of web state with receiving slit is cut into M × N number of receiving slit unit electronic component kit, wherein M and N is natural number；And conductive layer is automatically or manually formed on the cutting surfaces in the cutting surfaces of the unit electronic component kit and comprising being contacted and being rubbed between conductor or the synthetic resin of conducting polymer materials by contact friction member, so that first antistatic layer and the second antistatic layer are electrically connected to each other.
Description
Cross reference to related applications
It is required that being enjoyed to Korean Intellectual Property Office according to U.S.C. § 119 in the Korean Patent Shen that on January 29th, 2018 submits
Please be No. 10-2018-0010885, on 2 7th, 2018 South Korea patent applications submitted the 10-2018-0015100th, and
On March 3rd, 2018 South Korea patent application submitted the 10-2018-0026654th priority, entire contents pass through reference
It is hereby incorporated by.
Technical field
The embodiment of inventive concept described herein is related to the method for manufacturing electronic component kit (magazine), and more
The method for being related to body manufacturing electronic component kit, the electronic component kit include pallet or carrier band to pack such as semiconductor devices
Etc electronic component.
Background technique
In order to be that unit encapsulates individual electronic component, such as semiconductor devices, Huo Zhetong using M × N (M and N is natural numbers)
The electronic component for assembling mutually different electronic component in the module and being formed is crossed, pallet or carrier band are used for.It is each this
Kind packing container has the first antistatic layer and the second antistatic layer, and first antistatic layer and the second antistatic layer are by conduction
Material is formed in the upper and lower surfaces of base, and the base constitutes main body and including non-conductive synthetic resin, and
With antistatic property to prevent electrostatic breakdown electronic component, such as semiconductor devices, or it is mutual by assembling in the module
Different electronic components and the electronic component formed.Even if electrostatic also can be by including that electrostatic occurs for the container of pallet or carrier band
First antistatic layer and the second antistatic layer are transferred to and are discharged into outside, without the electronic component being accommodated in receiving slit,
And thus electronic component is prevented to be destroyed.
Pallet or carrier band are formed in the following manner: in the base formed by the fabric sheet containing non-conductive synthetic resin
Upper and lower surfaces on form conductive the first antistatic layer and the second antistatic layer；Heat fabric sheet；When
When sheet material reaches tray die, vacuum forming process or air-pressure forming mistake are executed to the sheet material between top mold and bottom die
Journey, to form the receiving slit for receiving electronic component；It and using M × N (M and N is natural numbers) receiving slit is unit cutting sheet
Material.
When result is cut into element tray or unit carrier band after the molding process, formed on cutting surfaces by base
Fine, soft fur thorn caused by one or more layers any remainder in layer and the first antistatic layer and the second antistatic layer, without
Base and the first antistatic layer and the second antistatic layer can be completely removed.In addition, cutting surfaces are rough and coarse, so as to cause
Fine particle.This burr and fine particle adhere to the electronic component being contained in receiving slit, make electronic component short circuit or damage
It is bad.
Therefore, burr and fine particle must be from the cutting surfaces for the electronic component kit for including element tray or unit carrier band
Removal.
According to the relevant technologies, in the South Korea of entitled " electronic component kit and its manufacturing method " that present applicant is submitted
Flash removed and fine particle has been disclosed in patent application the 2017-0023538th.
According to the relevant technologies, the method for manufacturing electronic component kit includes: in the upper surface of the base formed by fabric sheet
With the process for forming the first antistatic layer and the second antistatic layer on lower surface；By to the base and the first antistatic layer and
Second antistatic layer carries out air pressure molding to form the process of multiple receiving slits of matrix form；By the textile-like with receiving slit
The result of state is cut into the unit electronic component kit with a receiving slit of M × N (M be with N natural number)；In the unit electronics member
The marginal portions of the upper and lower surfaces of the cutting surfaces of part box and the unit electronic component kit formed with it is described
The process of first antistatic layer and the conductive layer of the second antistatic layer electrical connection.
It, can when fabric sheet to be cut into the unit electronic component kit with a receiving slit of M × N (M be with N natural number)
Multiple burrs can be formed on cutting surfaces, and cutting surfaces may be unsmooth and coarse.Therefore, in electroconductive polymer material
In the state that material is mixed with organic solvent, conductive layer and unit that the first antistatic layer and the second antistatic layer are electrically connected to each other
The marginal portion of the upper and lower surfaces of electronic component kit is formed together on cutting surfaces.Conductive layer by impregnation method or
Spray pattern automatic or manual is formed.It is automatically or manually coated and shape in addition, cloth, sponge or brush can be used in conductive layer
At.When forming conductive layer, conductive layer can be formed in the state that multiple cutter unit electronic component kits overlap each other to mention
High production rate.
Impregnation method is by the way that cutting surfaces are immersed in the organic solvent mixed with conducting polymer materials and are put into
Conductive layer is formed in container, the marginal portion of the upper and lower surfaces of wherein one or more cutter unit electronic component kits
It overlaps each other.Spray pattern is by cutting surfaces and the one or more cutter unit electronic component kits to overlap each other
Sprinkling includes the organic solvent of conducting polymer materials and forms conductive layer on the marginal portion of upper and lower surfaces.In addition,
Using cloth, sponge or brush formed conductive layer mode be the organic solvent mixed with conducting polymer materials is applied to cloth,
Sponge paints, and one or more cutter unit electronic component kits that organic solvent is applied to cutting surfaces and is overlapped each other
Upper and lower surfaces marginal portion.
However, the organic solvent mixed with conducting polymer materials can be applied when forming conductive layer according to the prior art
It is added on the outer surface of receiving slit, that is, in the contact surface between adjacent cells electronic component kit, without being applied with preset width
Onto the marginal portion of the upper and lower surfaces of cutter unit electronic component kit.Therefore, after drying treatment, adjacent list
First electronic component kit may be bonded to each other without being separated from each other.In addition, may be generated when forming conductive layer by using cloth
The foreign matter of such as villus etc and the coating surface for adhering to unit electronic component kit.
Summary of the invention
The embodiment of present inventive concept provides the method for manufacture electronic component kit, can be by being formed simultaneously multiple lead
Electric layer improves productivity.
The embodiment of present inventive concept provides the method for manufacture electronic component kit, even if the shape on multiple electronic component kits
In the case where conductive layer, this method also can prevent adjacent cells electronic component kit to be bonded to each other, so that adjacent cells electronics
Subassembly wrapper is separated from each other.
The method that the embodiment of present inventive concept provides manufacture electronic component kit can be prevented when forming conductive layer
The foreign matter of such as villus etc adheres on the coating surface of unit electronic component kit.
The one embodiment conceived according to the present invention, it is a kind of manufacture electronic component kit method include: respectively include knit
The first antistatic layer and the second antistatic layer are formed in the upper and lower surfaces of the base of object sheet material；By to the base with
And first antistatic layer and the second antistatic layer carry out air-pressure forming to form multiple receiving slits of matrix form；There to be reception
The result of the web state of slot is cut into M × N number of receiving slit unit electronic component kit, and wherein M and N is natural number；With
And automatically or manually in the cutting surfaces of the unit electronic component kit and include conductor or conduction by contacting friction member
It is contacted and is rubbed between the synthetic resin of polymer material and form conductive layer on the cutting surfaces, so that described
One antistatic layer and the second antistatic layer are electrically connected to each other.
Another embodiment conceived according to the present invention, it is a kind of manufacture electronic component kit method include: to include respectively
The first antistatic layer and the second antistatic layer are formed in the upper and lower surfaces of the base of fabric sheet；By to the base
And first antistatic layer and the second antistatic layer carry out air-pressure forming to form multiple receiving slits of matrix form；To have and connect
The result for receiving the web state of slot is cut into M × N number of receiving slit unit electronic component kit, and wherein M and N is natural number；
And conductive layer is formed in the following manner: transmitting and overlap each other on one or more rollers in the container for constituting apparatus for coating
One or more unit electronic component kits cutting surfaces, the roller constitutes the apparatus for coating and is infected with organic solvent, institute
It states dissolved with the synthetic resin containing conductor or conducting polymer materials in organic solvent, and the organic solvent is applied to institute
It states on cutting surfaces, while removing the burr and fine particle generated on the side of the base.
Another embodiment conceived according to the present invention, it is a kind of manufacture electronic component kit method include: to include respectively
The first antistatic layer and the second antistatic layer are formed in the upper and lower surfaces of the base of fabric sheet；By to the base
And first antistatic layer and the second antistatic layer carry out air-pressure forming to form multiple receiving slits of matrix form；To have and connect
The result for receiving the web state of slot is cut into M × N number of receiving slit unit electronic component kit, and wherein M and N is natural number；
And conductive layer is formed in the following manner: strangling on (Mayer) stick in one or more wheats in the container for constituting apparatus for coating
Transmit the cutting surfaces of one or more unit electronic component kits to overlap each other, it includes swingle and around institute that the wheat, which strangles stick,
The line for stating the peripheral surface of swingle constitutes the apparatus for coating and is infected with organic solvent, dissolved with packet in the organic solvent
Synthetic resin containing conductor or conducting polymer materials, and the organic solvent is applied on the cutting surfaces, it goes simultaneously
Except the burr and fine particle generated on the side of the base.
The conductor for constituting the conductive layer includes conductive material or conductive metal.
The conducting polymer materials for constituting the conductive layer include 3,4- ethyldioxythiophene (PEDOT), polyphenyl
One of vinyl sulfonic acid ester (PSS), pyrroles and polyaniline.
When forming the conductive layer, the organic solvent includes toluene, methyl ethyl ketone (MEK), acetone, acetic acid, three chloroethenes
One of alkene (TCE), dimethyl sulfoxide (DMSO), methylene chloride (DCM), hexafluoro -2- propyl alcohol (HFP) and alcohol.
The contact friction member includes ink pad, and the ink pad includes absorption component and mesh network, and the absorption component is inhaled
Receive the organic solvent for being dissolved with the synthetic resin comprising the conductor or the conducting polymer materials, the mesh network packet
Enclose the absorption component.
The absorption component includes one of adhesive-bonded fabric, cloth, sponge and metallic brush.
The mesh network includes the metal mesh with 100-500 mesh.
One or more of rollers with the sender of one or more of unit electronic component kits in the opposite direction
Upper rotation, so that one or more of rollers are engaged with one or more of unit electronic component kits.
One or more of rollers include metal, ceramics, silicone resin, synthetic resin, in rubber and Teflon (Teflon)
One kind.
It is multiple thin in the surface of one or more of rollers that there is one or more of rollers coining or engraving to be formed in
Small protrusion.
One or more of wheats strangle stick opposite with the direction of transfer of one or more of unit electronic component kits
It is rotated on direction, so that one or more of wheats strangle stick and engage with one or more of unit electronic component kits.
The swingle includes one of metal, ceramics, silicone resin, synthetic resin, rubber and Teflon.
The line is formed by one of metal and synthetic resin.
Detailed description of the invention
By reference to being described below for the following drawings, above and other object and feature be will become obvious, wherein removing
Non- otherwise indicated, otherwise identical appended drawing reference refers to identical component in various figures, and wherein:
Fig. 1 is the top view for showing the electronic component kit conceived according to the present invention；
Fig. 2 is the cross-sectional view intercepted along the line A-A of Fig. 1；
Fig. 3 A to Fig. 3 D is the flow chart for showing the method for the manufacture electronic component kit conceived according to the present invention；
Fig. 4 is the perspective view for showing the ink pad used in one embodiment of the inventive；
Fig. 5 is the side view for showing the state of the art of Fig. 3 D；
Fig. 6 is the perspective view for showing the apparatus for coating used in another embodiment of present inventive concept；
Fig. 7 and Fig. 8 is to carry out pictorial image 3D by using apparatus for coating used in another embodiment in present inventive concept
State of the art side view；
Fig. 9 is the perspective view for showing the apparatus for coating used in the another embodiment of present inventive concept；With
Figure 10 is to show to coat dress used in the another embodiment of the present inventive concept for the state of the art for applying Fig. 3 D
The perspective view set.
Specific embodiment
Hereinafter, present inventive concept will be described in detail with reference to the attached drawings.
Fig. 1 is the top view for showing the electronic component kit 10 conceived according to the present invention, and Fig. 2 is the line A-A along Fig. 1
The cross-sectional view of interception.
Conceive according to the present invention, electronic component kit 10 include base 11, the first antistatic layer 13 and the second antistatic layer 15,
Receiving slit 19 and conductive layer 17.
Base 11 is enough to maintain by being formed with a thickness of the synthetic resin of about 0.5mm to 3mm so that electronic component kit 10 has
The hardness of its shape.Base 11 can be by such as polyethylene (PE), the polypropylene (PP), poly terephthalic acid insoluble in organic solvent
Any one of solvent resistant resin of glycol ester (PET) and polycarbonate (PC) etc is formed, or can be by being dissolved in
Such as polystyrene (PS), polyvinyl chloride (PVC) or acronitrile-butadiene-styrene (ABS) etc in organic solvent it is solvable
Property any one of resin formed.In addition, base 11 may include the compound resin layer of soluble resin and solvent resistant resin.
First antistatic layer 13 and the second antistatic layer 15 are extruded from the upper and lower surfaces of base 11 respectively, and
With about 0.005mm to the thickness of about 0.3mm.First antistatic layer 13 and the second antistatic layer 15 are by identical with base 11
The formation of any one of solvent resistants resin such as material, i.e. PE, PP, PET, PC, to obtain excellent bonding force, or by by
Comprising conductive material (such as carbon nanotube or conductive carbon) or leading in any one of soluble resin (such as PS, PVC and ABS)
Electric metal (such as golden (Au), silver-colored (Ag), copper (Cu) or aluminium (Al)) and the material obtained is formed so that 13 He of the first antistatic layer
The surface resistivity of second antistatic layer 15 is in the range of about 106 Ω/sq. to about 109 Ω/sq..
In addition, the upper and lower surfaces that the first antistatic layer 13 and the second antistatic layer 15 can be formed as base 11 apply
It is covered with any one of conducting polymer materials, such as 3,4- ethyldioxythiophene (PEDOT), polystyrenesulfonate
(PSS), pyrroles and polyaniline.
When the first antistatic layer 13 and the second antistatic layer 15 by solvent resistant resin or include conductive material or conductive metal
Soluble resin formation when, the first antistatic layer 13 and the second antistatic layer 15 are by the conductive material or conductive gold that are included
Belong to and is opaquely formed.In addition, when the first antistatic layer 13 and the second antistatic layer 15 are formed by conducting polymer materials,
First antistatic layer 13 and the second antistatic layer 15 are pellucidly formed.Therefore, it can according to need that be formed selectively first anti-
Electrostatic layer 13 and the second antistatic layer 15.In other words, when base 11 synthesizes tree by the transparent of such as PE, PP, PET, PC or PVC
When rouge formation, the first antistatic layer 13 and the second antistatic layer 15 can be formed by conducting polymer materials to obtain transparent electron
Subassembly wrapper 10.
Receiving slit 19 is formed as base 11, the first antistatic layer 13 and the second antistatic layer 15 and is molded into matrix form cloth
It sets.Though it is shown that forming 1 × 2 receiving slit 19, it may form part of M × N number of receiving slit 19, wherein M and N is natural number.
Conductive layer 17 is formed on the side of base 11 with the thickness of about 0.005mm to about 0.3mm, and at about 25 DEG C to about
It is dry under 90 DEG C of lower temperature, so that conductive layer 17 is electrically connected with the first antistatic layer 13 and the second antistatic layer 15.Therefore,
First antistatic layer 13 and the second antistatic layer 15 are electrically connected to each other by conductive layer 17, while covering the side of the exposure of base 11
Face.
Conductive layer 17 is by such as polyurethane resin, polyester resin, acrylic resin, vinylite and butyral resin
Etc any one of synthetic resin formed, the synthetic resin includes the conduction material of such as carbon nanotube and conductive carbon etc
Material, or any one of conductive metal of such as Au, Ag, Cu and Al etc.In other words, including above-mentioned conductive material
Synthetic resin and such as toluene, methyl ethyl ketone (MEK), acetone, acetic acid, trichloro ethylene (TCE), dimethyl sulfoxide
(DMSO), the mixed state of any one of organic solvents such as methylene chloride (DCM), hexafluoro -2- propyl alcohol (HFP) and alcohols
Under, conductive layer 17 is formed when mixture is applied to the side of electronic component kit 10.Conductive layer 17 with ink pad 30 by connecing
Ink pad 330 shown in Fig. 4 is passed through while touching and is formed.Ink pad 30 is formed as the net that wherein absorption component 31 is formed by metal
The structure that shape net 33 encapsulates, the absorption component 31 include adhesive-bonded fabric, cloth, sponge or metallic brush, and containing with containing upper
State the organic solvent of the synthetic resin mixing of conductive metal.
In addition, the apparatus for coating 40 as shown in Fig. 6 of conductive layer 17 is formed.Apparatus for coating 40 includes one or more (examples
Such as from about 1-10) roller 41 and container 45, container 45 contain the organic solvent mixed with the synthetic resin containing conductive metal.Cause
This, conductive layer 17 while contacting with about 1-10 roller 41 by transmitting the one or more to overlap each other (for example, about 1-
200) cutting surfaces of unit electronic component kit 10 and formed.Roller 41 may include metal, ceramics, silicone resin, synthetic resin
Any one of with rubber, and the tiny protrusions 43 that can have multiple coinings or be carved on the surface of roller 41.In addition,
Roller 41 can be formed by Teflon.
In addition, conductive layer 17 can be by conducting polymer materials (for example, 3,4- ethyldioxythiophenes (PEDOT), polyphenyl
Vinyl sulfonic acid ester (PSS), pyrroles and polyaniline) any one of with organic solvent (for example, toluene, methyl ethyl ketone (MEK), third
Ketone, acetic acid, trichloro ethylene (TCE), dimethyl sulfoxide (DMSO), methylene chloride (DCM), hexafluoro -2- propyl alcohol (HFP) and alcohols)
Any one of mixing and formed.
Since the first antistatic layer 13 and the second antistatic layer 15 are electrically connected to each other by conductive layer 17, so even if multiple electricity
Subcomponent box 10 stacks, and conductive layer 17 can also be readily removable electrostatic.Accordingly it is possible to prevent the electronic component in receiving slit 19
By electrostatic breakdown.In addition, since conductive layer 17 is formed by the organic solvent comprising conductive material, it is thus possible to be generated in side
Burr 21 is dissolved to be removed or be buried and be capped and be not exposed.
In other words, when base 11 and the first antistatic layer 13 and the second antistatic layer 15 are by such as PS, PVC and ABS
When any one of equal soluble resins are formed, and when forming conductive layer 17, burr 21 is by having comprising conductive material
Therefore solvent dissolution is simultaneously removed.In addition, when base 11 and the first antistatic layer 13 and the second antistatic layer 15 are by such as
When the formation of any one of solvent resistants resin such as PE, PP, PET and PC, and when forming conductive layer 17, even if 21 He of burr
Fine particle is insoluble, and burr 21 and fine particle are also embedded to inside without being externally exposed.
In addition, when forming conductive layer 17, due to organic burr 21 at a lower temperature and fine particle
Solvent dissolution and removing, so can prevent electronic component kit from deforming due to heat.In addition, working as base 11 and the first antistatic layer
13 and second antistatic layer 15 when being formed by solvent resistant resin, and when forming conductive layer 17, even if burr 21 and tiny
Grain is insoluble, and burr 21 and fine particle are also embedded to inside conductive layer 17 without being externally exposed.Therefore, flash removed 21 and thin is removed
The short grained time is reduced, and thus improves productivity.
Fig. 3 A to Fig. 3 D is the flow chart for showing the method for the manufacture electronic component kit conceived according to the present invention.
Referring to Fig. 3 A, the first antistatic layer 13 and the second antistatic layer 15 are formed in the upper of the base 11 including fabric sheet
On surface and lower surface.Base 11 can be by the solvent resistant resin or such as PS, PVC and ABS of such as PE, PP, PET and PC etc
Etc any one of soluble resin formed, and can have the thickness of about 0.5mm to about 3mm.
In addition, the first antistatic layer 13 and the second antistatic layer 15 can be identical as base 11 by being squeezed out with sheet form
Material (that is, the soluble resin of the solvent resistant resin of such as PE, PP, PET and PC etc or such as PS, PVC and ABS etc
Any one of) and be formed in the upper and lower surfaces of basal layer 11.In addition, according to the disclosure, base 11 can be by
Compound resin layer comprising soluble resin and solvent resistant resin is formed.
In this case, comprising such as in the synthetic resin for being used to form the first antistatic layer and the second antistatic layer
The conductive material of carbon nanotube or conductive carbon etc or the conductive metal of such as Au, Ag, Cu or Al etc, and with about
The thickness of 0.005mm to about 0.3mm squeezes out, and conductive layer 17 is consequently formed.First antistatic layer 13 and the second antistatic layer 15
Surface resistivity is about 106Ω/sq. is to about 109In the range of Ω/sq..
In addition, the first antistatic layer 13 and the second antistatic layer 15 can by coating conducting polymer materials (such as 3,
4- ethyldioxythiophene (PEDOT), polystyrenesulfonate (PSS), pyrroles and polyaniline) any one of and formed.
Referring to Fig. 3 B, by executing air-pressure forming to base 11 and the first antistatic layer 13 and the second antistatic layer 15,
Receiving slit 19 is formed as matrix form.
Forming M × N number of receiving slit (M be with N natural number) is to form pallet.It is one since receiving slit 19 is continuously formed
Capable and more (for example, about 1-5) column, it is possible to form the carrier band on roller.
Referring to Fig. 3 C, the result of the web state with multiple receiving slits 19 is cut into M × N number of receiving slit 19
Unit electronic component kit 10, wherein M and N is natural number.There may be multiple burrs 21, unit electronic components on cutting surfaces
Box 10 may be unsmooth and coarse.Therefore, fine particle may be adhered to slightly on cutting surfaces.Burr 21 can because base 11,
Or first antistatic layer 13 and the second antistatic layer 15 be not completely removed and retain and formed.
With reference to Fig. 3 D, conductive layer 17 is formed on the cutting surfaces of unit electronic component kit 10, so that conductive layer 17 and
One antistatic layer 13 and the electrical connection of the second antistatic layer 15.Formation conductive layer 17 in the one embodiment conceived according to the present invention
Mode, conductive layer 17 is formed to have to the thickness of about 0.005mm to about 0.3mm by using ink pad 30 shown in Fig. 4, and
And it is dry under about 25 DEG C to about 90 DEG C of lower temperature.In other words, as shown in figure 5, being accommodated by the way that ink pad 30 to be put into
In the container 35 of organic solvent, wherein being dissolved with the synthetic resin comprising conductive material or conductive metal, and by allowing to print
The surface of platform 30 automatically or manually with one or more (for example, about 1-200) unit electronic component kit for overlapping each other
10 cutting surfaces contact friction forms conductive layer 17 to be coated with.Therefore, the about 1-200 unit electronic component to overlap each other
The cutting surfaces of each of box 10 are coated with the organic solvent mixed with conducting polymer materials, soak the suction of ink pad 30
Component 31 is received, conductive layer 17 is consequently formed.In this case, burr 21 and the base 11 in each unit electronic component kit 10
Side on the organic solvent dissolution that is mixed with conducting polymer materials of the fine particle that generates and netted with ink pad 30
Net 33 rubs mechanically to be removed.In addition, when forming conductive layer 17, due to unit electronic component kit 10 coating surface not
It can be contacted by mesh network 33 with absorption component 31, so can prevent the foreign matter of such as villus etc from adhering on coating surface.
The absorption component 31 of ink pad 30, which absorbs in container 35, is wherein dissolved with the conjunction comprising conductive material or conductive metal
Contact rubbing at the organic solvent of resin, and with the cutting surfaces of 1 to the 200 unit electronic component kit to overlap each other
It wipes.In this case, absorption component 31 will wherein be dissolved with the organic of the synthetic resin comprising conductive material or conductive metal
Solvent is applied to cutting surfaces to form conductive layer 17.The mesh network 33 for surrounding absorption component 31, which will be wherein dissolved with, includes conduction
The organic solvent of the synthetic resin of material or conductive metal is coated on the upper and lower surface of unit electronic component kit with preset width
On marginal portion, to prevent organic solvent to be applied to the outer surface of receiving slit 19, i.e., between adjacent cells electronic component kit 10
Contact surface so that unit electronic component kit does not combine each other, but is separated from each other.Absorption component 31 can use on-woven
Any one of object, cloth, sponge and metallic brush.In addition, mesh network 33 may include the mesh network with about 100-500 mesh.
The conductive material for constituting conductive layer 17 may include any one of carbon nanotube and conductive carbon, and conductive gold
Category may include any one of Au, Ag, Cu and Al.In addition, the synthetic resin for constituting conductive layer 17 may include polyurethane
Any one of resin, polyester resin, acrylic resin, vinylite and butyral resin.Organic solvent may include toluene,
Methyl ethyl ketone (MEK), acetone, acetic acid, trichloro ethylene (TCE), dimethyl sulfoxide (DMSO), methylene chloride (DCM), hexafluoro -2- third
Any one of alcohol (HFP) and alcohol.
In addition, conductive layer 17 can by by conducting polymer materials (for example, 3,4- ethyldioxythiophenes (PEDOT),
Polystyrenesulfonate (PSS), pyrroles and polyaniline) any one of mix and formed with above-mentioned organic solvent.
When forming conductive layer 17, the mesh network 33 of ink pad 30 prevents from contacting with the cutting surfaces of unit electronic component kit 10
Absorption component 31 deform.Wherein the organic solvent dissolved with the synthetic resin comprising conductive material or conductive metal is with pre- fixed width
Degree be applied to the upper and lower surface of one or more unit electronic component kits 10 marginal portion and overlap each other one or
The cutting surfaces of multiple unit electronic component kits 10, the outer surface without being applied to receiving slit 19, that is, adjacent cells electronics member
Contact surface 10 between part box.
In addition, due to forming conductive layer 17 in the state that the synthetic resin comprising conductive material is mixed with organic solvent,
So burr 21 and the fine particle generated on the side of base 11 be dissolved to be removed or be embedded in conductive layer 17 without
It is externally exposed.
In other words, when base 11 and the first antistatic layer 13 and the second antistatic layer 15 are by such as PS, PVC and ABS
When any one of equal soluble resins are formed, and when forming conductive layer 17, burr 21 and fine particle are by organic molten
Agent is dissolved to be removed.In addition, when base 11 and the first antistatic layer 13 and the second antistatic layer 15 are by such as PE, PP, PET
When being formed with any one of the solvent resistants resin such as PC, and when forming conductive layer 17, even if burr 21 and fine particle
Insoluble, burr 21 and fine particle are also embedded to inside conductive layer 17 without being externally exposed.
In addition, when forming conductive layer 17, burr 21 and the fine particle generated on side can by with mesh
It removes to 33 friction mechanism, although burr 21 and fine particle can be dissolved by the organic solvent mixed with synthetic resin and be gone
It removes.
The mode of formation conductive layer 17 in the one embodiment conceived according to the present invention, by using print shown in Fig. 4
Conductive layer 17 is formed to have the thickness of about 0.005mm to about 0.3mm by platform 30, and about 25 DEG C to about 90 DEG C compared with
It is dry under low temperature.
In addition, another embodiment conceived according to the present invention, conductive layer 17 can be arranged by using painting shown in fig. 6
Set 40 formation.In other words, as shown in FIG. 7 and 8, conductive layer 17 by with the one or more of apparatus for coating 40 (for example, about
1-10) one or more (for example, about 1-200) the unit electronic component kit 10 that transmission overlaps each other while contact of roller 41
Cutting surfaces and formed.When one or more (for example, about 1-10) rollers 41 rotate, while by the wherein dissolution in container 45
There is the organic solvent of the synthetic resin comprising conductive material or conductive metal to be applied to one or more unit electronic component kits 10
The cutting surfaces of (for example, about 1-200 overlapped unit electronic component kit 10).
In this case, the direction of rotation of one or more (for example, about 1-10) rollers 41 and overlap each other one
Or multiple (for example, about 1-200) unit electronic component kits 10 direction of transfer on the contrary, make one or more rollers and one or
Multiple electronic component kits 10 engage.In other words, when the about 1-200 unit electronic component kit 10 to overlap each other passes from right to left
When sending, about 1-10 roller 41 is rotated clockwise.Therefore, with the about 1-200 unit electronic component to overlap each other transmitted
Frictional force between the cutting surfaces of box 10 and one or more rollers 41 increases, in the burr 21 that the side of each base 11 generates
It can not only be dissolved by an organic solvent, but also can be mechanically removed by frictional force with fine particle.In addition, including metal
Roller 41 will not generate the foreign matters such as villus when removing flash removed 21 and fine particle.In addition, due to passing through frictional force mechanically
The burr 21 and fine particle of removal, which are dissolved, has the organic solvent of the synthetic resin comprising conductive material or conductive metal to dissolve
Inside container 45, the roller 41 that can prevent burr 21 and fine particle from being rotated is again applied to unit electronic component kit
10.Roller 41 may include any one of metal, ceramics, silicone resin, synthetic resin and rubber, and can have multiple pressures
The tiny protrusion 43 for printing or being carved on the surface of roller 41.In addition, roller 41 can be formed by Teflon.
The tiny protrusion 43 in the surface of one or more (for example, about 1-10) rollers 41 is imprinted or is carved in more to increase
With the frictional force of the cutting surfaces of the about 1-200 unit electronic component kit 43 to overlap each other.Therefore, burr 21 and in base 11
Side on the fine particle that generates can more easily mechanical removal.In addition, roller 41 allows it due to its tiny protrusion 43
In the organic solvent dissolved with the synthetic resin comprising conductive material or conductive metal applied with stable and uniform thickness.Cause
This, organic solvent by being applied to the sides of the upper and lower surfaces of unit electronic component kit 10 by conductive layer 17 with preset width
The cutting surfaces of edge point and unit electronic component kit 10 and formed, prevent organic solvent to be applied to the appearance of receiving slit 19
Face, that is, the contact surface between adjacent cells electronic component kit 10.
When forming conductive layer 17, since the roller 41 of apparatus for coating 40 is due to the cutting surfaces with unit electronic component kit 10
It contacts and is prevented from deforming, therefore be dissolved with the organic solvent of the synthetic resin comprising conductive material or conductive metal wherein with equal
Even width is applied to the cutting surfaces of the one or more unit electronic component kits 10 to overlap each other, and is not applied to receiving slit
19 outer surface, that is, the contact surface between adjacent cells electronic component kit 10.Therefore, by by organic solvent with uniform
Width is applied to the upper and lower surfaces around the cutting surfaces of the one or more unit electronic component kits 10 to overlap each other
Marginal portion form conductive layer 17.Therefore, after drying treatment, adjacent cells electronic component kit 10 can be prevented each other
In conjunction with.
In addition, according to another embodiment of the present invention, conductive layer 17 can be by using 50 shape of apparatus for coating shown in Fig. 9
At.In other words, conductive layer 17 with the one or more of apparatus for coating 50 (for example, about 1-10) wheat by strangling stick 51 and contacting
While the cutting surfaces of one or more (for example, about 1-200) unit electronic component kit 10 that overlap each other of transmission and shape
At as shown in Figure 10.When swingle 53, one or more (for example, about 1-10) wheats Le sticks 51 will be wherein molten by line 54
One to overlap each other or more that solution has the organic solvent of the synthetic resin comprising conductive material or conductive metal to be applied to transmission
The cutting surfaces of a (for example, about 1-200) unit electronic component kit 10.
In this case, the rotation side that one or more (for example, about 1-10) wheats strangle the swingle 53 of stick 51 is constituted
To the direction of transfer with one or more (for example, about 1-200) the unit electronic component kit 10 to overlap each other on the contrary, to revolve
Bull stick 53 is engaged with one or more electronic component kits 10.In other words, when the about 1-200 unit electronic component to overlap each other
When box 10 transmits from right to left, swingle 53 is rotated clockwise.Therefore, as about 1-200 to overlap each other transmitted is single
Frictional force between the cutting surfaces of first electronic component kit 10 and the line 54 for constituting wheat Le stick 51 increases, in the side of each base 11
The burr 21 and fine particle that face generates can be not only dissolved by an organic solvent, but also can mechanically be removed by frictional force.
In addition, line 54 will not generate the foreign matters such as villus when removing flash removed 21 and fine particle.In addition, due to passing through frictional force machine
The burr 21 and fine particle removed to tool is dissolved the organic solvent for having the synthetic resin comprising conductive material or conductive metal
It is dissolved in inside container 45, the line 54 that can prevent burr 21 and fine particle from being rotated is again applied to unit electronics member
Part box 10.It may include any in metal, ceramics, silicone resin, synthetic resin and rubber for constituting wheat and strangling the swingle 53 of stick 51
One kind, and line 54 can be formed by one of metal and synthetic resin.In addition, swingle 53 may include Teflon.Separately
Outside, the line 54 with about 0.005mm to about 0.5mm diameter can be according to the thickness of diameter adjustment conductive layer 17.In other words, work as line
54 have minor diameter when, conductive layer 17 be coated and be formed to have relatively thin thickness.When line 54 has major diameter, conductive layer
17 are coated and are formed to have thicker thickness.
The line 54 that is formed on the surface of one or more (for example, about 1-10) swingles 53 can increase and transmit
The frictional force of the cutting surfaces of the about 1-200 unit electronic component kit 10 to overlap each other, to be easier mechanically from base
Flash removed 21 and fine particle are removed in 11 side.In addition, the line 54 being formed on the surface of swingle 53 is with stable and uniform
Thickness coating is wherein dissolved with the organic solvent of the synthetic resin comprising conductive material or conductive metal.Therefore, conductive layer 17 with
Preset width is coated and is formed on the marginal portion of the upper and lower surfaces of unit electronic component kit 10, organic molten to prevent
Agent is applied to the outer surface of the receiving slit 19 of unit electronic component kit 10, that is, connecing between adjacent cells electronic component kit 10
Touch surface.
Even if in another embodiment or another embodiment of present inventive concept, such as 3,4- ethyldioxythiophene
(PEDOT), any one of conducting polymer materials of polystyrenesulfonate (PSS), pyrroles and polyaniline etc can be with
It is mixed with above-mentioned organic solvent, the conductive layer 17 as described in one embodiment of present inventive concept is consequently formed.
Since the first antistatic layer 13 and the second antistatic layer 15 are electrically connected to each other by conductive layer 17, so even if multiple electricity
Subcomponent box 10 stacks, and conductive layer 17 can also be readily removable electrostatic.Accordingly it is possible to prevent the electronic component in receiving slit 19
By electrostatic breakdown.
In addition, after forming conductive layer 17, since conductive layer 17 is done under about 25 DEG C to about 90 DEG C of lower temperature
It is dry, so can prevent electronic component kit from deforming due to heat.In addition, when base 11 and the first antistatic layer 13 and second resist it is quiet
When electric layer 15 is formed by solvent resistant resin, and when forming conductive layer 17, even if burr 21 and fine particle are insoluble, burr
21 and fine particle be also embedded to inside conductive layer 17 without being externally exposed.Therefore, the time of flash removed 21 and fine particle is gone
It reduces, thus improves productivity.
As noted previously, as conductive layer can be formed simultaneously in the one or more unit electronic component kits to overlap each other
On cutting surfaces, it is possible to improve productivity.In addition, being wherein dissolved with the synthetic resin comprising conductive material or conductive metal
Organic solvent be applied to preset width unit electronic component kit upper and lower surfaces marginal portion, thus prevent list
First electronic device is bonded to each other, so that unit electronic component kit is easily separated from each other.In addition, when forming conductive layer, unit electricity
The coating surface of subcomponent box does not pass through mesh network and contacts with absorption component, to prevent the foreign matter of such as villus etc from adhering to
Coating surface.In addition, when forming conductive layer, the coating surface of unit electronic component kit is not contacted with roller, to prevent such as
The foreign matter of villus etc adheres to coating surface.
Although describing present inventive concept referring to embodiment, it will be apparent to those skilled in the art that
, can be made various changes and modifications in the case where not departing from the spirit and scope of present inventive concept.Therefore, it should manage
Solution, above-described embodiment are not limiting, but illustrative.
Claims (15)
1. a kind of method for manufacturing electronic component kit, comprising:
The first antistatic layer and the second antistatic layer are formed in the upper and lower surfaces of base for including fabric sheet respectively；
Rectangular is formed by carrying out air-pressure forming to the base and first antistatic layer and the second antistatic layer
Multiple receiving slits of formula；
The result of web state with the receiving slit is cut into M × N number of receiving slit unit electronic component kit,
Middle M and N is natural number；And
Automatically or manually or in the cutting surfaces of the unit electronic component kit and comprising conductor led by contacting friction member
It is contacted and is rubbed between the synthetic resin of electric polymer material and form conductive layer on the cutting surfaces, so that described
First antistatic layer and the second antistatic layer are electrically connected to each other.
2. a kind of method for manufacturing electronic component kit, comprising:
The first antistatic layer and the second antistatic layer are formed in the upper and lower surfaces of base for including fabric sheet respectively；
Rectangular is formed by carrying out air-pressure forming to the base and first antistatic layer and the second antistatic layer
Multiple receiving slits of formula；
The result of web state with the receiving slit is cut into M × N number of receiving slit unit electronic component kit,
Middle M and N is natural number；And
Conductive layer is formed in the following manner: being transmitted and is overlapped each other on one or more rollers in the container for constituting apparatus for coating
One or more unit electronic component kits cutting surfaces, the roller constitutes the apparatus for coating and is infected with organic solvent, institute
It states dissolved with the synthetic resin containing conductor or conducting polymer materials in organic solvent, and the organic solvent is applied to institute
It states on cutting surfaces, while removing the burr and fine particle generated on the side of the base.
3. a kind of method for manufacturing electronic component kit, comprising:
The first antistatic layer and the second antistatic layer are formed in the upper and lower surfaces of base for including fabric sheet respectively；
Matrix form is formed by carrying out air-pressure forming to the base and the first antistatic layer and the second antistatic layer
Multiple receiving slits；
The result of web state with the receiving slit is cut into M × N number of receiving slit unit electronic component kit,
Middle M and N is natural number；And
Conductive layer is formed in the following manner: being strangled in one or more wheats in the container for constituting apparatus for coating and is transmitted each other on stick
The cutting surfaces of one or more unit electronic component kits of overlapping, it includes swingle and around the swingle that the wheat, which strangles stick,
Peripheral surface line, constitute the apparatus for coating and be infected with organic solvent, in the organic solvent dissolved with comprising conductor or
The synthetic resin of conducting polymer materials, and the organic solvent is applied on the cutting surfaces, while removing the base
The burr and fine particle generated on the side of layer.
4. according to the method in any one of claims 1 to 3, wherein the conductor for constituting the conductive layer includes conduction
Material or conductive metal.
5. according to the method in any one of claims 1 to 3, wherein constituting the conducting polymer material of the conductive layer
Material includes one of 3,4- ethyldioxythiophene (PEDOT), polystyrenesulfonate (PSS), pyrroles and polyaniline.
6. according to the method in any one of claims 1 to 3, wherein when forming the conductive layer, the organic solvent
Including toluene, methyl ethyl ketone (MEK), acetone, acetic acid, trichloro ethylene (TCE), dimethyl sulfoxide (DMSO), methylene chloride (DCM),
One of hexafluoro -2- propyl alcohol (HFP) and alcohol.
7. the ink pad includes absorbing structure according to the method described in claim 1, wherein the contact friction member includes ink pad
Part and mesh network, the absorption component, which absorbs, is dissolved with the synthesis tree comprising the conductor or the conducting polymer materials
The organic solvent of rouge, the mesh network surround the absorption component.
8. according to the method described in claim 1, wherein the absorption component includes in adhesive-bonded fabric, cloth, sponge and metallic brush
One kind.
9. according to the method described in claim 1, wherein the mesh network includes the metal mesh with 100-500 mesh.
10. according to the method described in claim 2, wherein one or more of rollers with one or more of unit electronics
The sender of subassembly wrapper upper rotation in the opposite direction, so that one or more of rollers and one or more of unit electronics
Subassembly wrapper engagement.
11. according to the method described in claim 2, wherein one or more of rollers include metal, ceramics, silicone resin, synthesis
One of resin, rubber and Teflon.
12. according to the method described in claim 2, wherein there is one or more of rollers coining or engraving to be formed in described one
Multiple tiny protrusions in the surface of a or multiple rollers.
13. according to the method described in claim 3, wherein one or more of wheats strangle sticks with one or more of units
The sender of electronic component kit upper rotation in the opposite direction so that one or more of wheats strangle stick with it is one or more of
The engagement of unit electronic component kit.
14. according to the method described in claim 3, wherein the swingle includes metal, ceramics, silicone resin, synthetic resin, rubber
One of glue and Teflon.
15. according to the method described in claim 3, wherein the line is formed by one of metal and synthetic resin.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180010885A KR102072286B1 (en) | 2018-01-29 | 2018-01-29 | Fabricating method for electronic components magazine |
| KR10-2018-0010885 | 2018-01-29 | ||
| KR10-2018-0015100 | 2018-02-07 | ||
| KR1020180015100A KR102186468B1 (en) | 2018-02-07 | 2018-02-07 | Fabricating method for electronic components magazine |
| KR1020180026654A KR102154895B1 (en) | 2018-03-07 | 2018-03-07 | Fabricating method for electronic components magazine |
| KR10-2018-0026654 | 2018-03-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110098141A true CN110098141A (en) | 2019-08-06 |
| CN110098141B CN110098141B (en) | 2023-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810392443.8A Active CN110098141B (en) | 2018-01-29 | 2018-04-27 | Method for manufacturing electronic component box |
Country Status (2)
| Country | Link |
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| JP (1) | JP6578033B2 (en) |
| CN (1) | CN110098141B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111010788A (en) * | 2019-12-17 | 2020-04-14 | 深圳市麦捷微电子科技股份有限公司 | Method for eliminating electrostatic adsorption of surface acoustic wave filter |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0102185A1 (en) * | 1982-08-26 | 1984-03-07 | Minnesota Mining And Manufacturing Company | Transparent container for electrostatic sensitive electronic components |
| JPS6059077A (en) * | 1983-09-12 | 1985-04-05 | Aronshiya:Kk | Method for removing punching burr after stamping |
| KR20000063759A (en) * | 2000-08-02 | 2000-11-06 | 윤덕용 | High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| JP2002347831A (en) * | 2001-05-28 | 2002-12-04 | Denki Kagaku Kogyo Kk | Carrier tape unit |
| WO2002096773A1 (en) * | 2001-05-28 | 2002-12-05 | Denki Kagaku Kogyo Kabushiki Kaisha | Electronic component container |
| JP2003094382A (en) * | 2001-09-27 | 2003-04-03 | Mitsui Mining & Smelting Co Ltd | Metal foil slitting method and slitter |
| WO2003034508A1 (en) * | 2001-10-12 | 2003-04-24 | Nichia Corporation | Light emitting device and method for manufacture thereof |
| US20030150770A1 (en) * | 2002-02-13 | 2003-08-14 | Berkley Industries Llc | Chip clamshell packaging |
| CN1741885A (en) * | 2001-11-27 | 2006-03-01 | 诚实公司 | Semiconductor component handling device having an electrostatic dissipating film |
| JP2010158795A (en) * | 2009-01-06 | 2010-07-22 | Regulus Co Ltd | Storage container for electronic component, and antistatic resin sheet |
| US20150083641A1 (en) * | 2013-09-25 | 2015-03-26 | Texas Instruments Incorporated | Selective heat seal wafer cover tape (has tape) |
| KR101773530B1 (en) * | 2016-09-13 | 2017-08-31 | 윤세원 | Retroreflective sheet and fabricating method thereof |
-
2018
- 2018-04-02 JP JP2018071100A patent/JP6578033B2/en active Active
- 2018-04-27 CN CN201810392443.8A patent/CN110098141B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0102185A1 (en) * | 1982-08-26 | 1984-03-07 | Minnesota Mining And Manufacturing Company | Transparent container for electrostatic sensitive electronic components |
| CA1224445A (en) * | 1982-08-26 | 1987-07-21 | Gerald E. Mueller | Transparent container for electrostatic sensitive electronic components |
| JPS6059077A (en) * | 1983-09-12 | 1985-04-05 | Aronshiya:Kk | Method for removing punching burr after stamping |
| KR20000063759A (en) * | 2000-08-02 | 2000-11-06 | 윤덕용 | High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| JP2002347831A (en) * | 2001-05-28 | 2002-12-04 | Denki Kagaku Kogyo Kk | Carrier tape unit |
| WO2002096773A1 (en) * | 2001-05-28 | 2002-12-05 | Denki Kagaku Kogyo Kabushiki Kaisha | Electronic component container |
| JP2003094382A (en) * | 2001-09-27 | 2003-04-03 | Mitsui Mining & Smelting Co Ltd | Metal foil slitting method and slitter |
| WO2003034508A1 (en) * | 2001-10-12 | 2003-04-24 | Nichia Corporation | Light emitting device and method for manufacture thereof |
| CN1741885A (en) * | 2001-11-27 | 2006-03-01 | 诚实公司 | Semiconductor component handling device having an electrostatic dissipating film |
| US20030150770A1 (en) * | 2002-02-13 | 2003-08-14 | Berkley Industries Llc | Chip clamshell packaging |
| JP2010158795A (en) * | 2009-01-06 | 2010-07-22 | Regulus Co Ltd | Storage container for electronic component, and antistatic resin sheet |
| US20150083641A1 (en) * | 2013-09-25 | 2015-03-26 | Texas Instruments Incorporated | Selective heat seal wafer cover tape (has tape) |
| KR101773530B1 (en) * | 2016-09-13 | 2017-08-31 | 윤세원 | Retroreflective sheet and fabricating method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110098141B (en) | 2023-06-16 |
| JP6578033B2 (en) | 2019-09-18 |
| JP2019131286A (en) | 2019-08-08 |
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