KR102154895B1 - Fabricating method for electronic components magazine - Google Patents

Abstract

The present invention relates to a method of manufacturing an electronic component container, comprising a process of forming first and second antistatic layers on upper and lower surfaces of a base layer made of sheet fabric, and forming the base layer and the first and second antistatic layers by air. A process of forming a plurality of receiving grooves in a matrix shape by pressing and molding, and cutting the fabric state in which the plurality of receiving grooves are formed into a unit electronic component container having each M × N (M and N are natural numbers) receiving grooves. The process, and the cutting surface of the unit electronic component container in a state of overlapping one or more of the above, a rotating rod constituting a coating apparatus containing an organic solvent in which a conductive material or a synthetic resin containing a conductive polymer is dissolved in a water tank constituting the coating apparatus; It includes a step of removing burrs and fine particles formed on the side surface of the base while forming a conductive layer by transferring and applying from one or a plurality of rotating Mayer bars including a wire formed to wind the outer peripheral surface of the rotating rod. Therefore, it is possible to simultaneously form a conductive layer on the cut surface of a unit electronic component container in which one or more units are stacked, thereby improving productivity. An organic solvent in which a conductive material or a synthetic resin containing a conductive metal is dissolved is used in the unit electronic component container. It can be easily separated by preventing adjoining unit electronic component containers from being attached by applying a certain width to the edge portions of the upper and lower surfaces.

Description

Manufacturing method of electronic component container {Fabricating method for electronic components magazine}

The present invention relates to a method of manufacturing an electronic component container, and more particularly, to a method of manufacturing an electronic component container including a tray or carrier tape for packaging electronic components such as semiconductor devices.

Trays or carrier tapes are used to package M × N (M and N are natural numbers) each individual electronic component such as a semiconductor device or an electronic component that is assembled into a module. These packaging containers are made of non-conductive synthetic resin constituting the body to prevent destruction by static electricity of individual electronic components such as packaged semiconductor devices or electronic components that are assembled into modules. First and second antistatic layers each having antistatic properties including a conductive material are formed on the upper and lower surfaces of the base layer. In the above, even if static electricity is generated in a container including a tray or a carrier tape by the first and second antistatic layers, the electronic component is not transmitted to the electronic component accommodated in the receiving groove and is discharged to the outside to prevent the electronic component from being destroyed.

In the above, the tray or carrier tape forms conductive first and second antistatic layers on the upper and lower surfaces of the base layer made of a non-conductive synthetic resin sheet fabric, respectively, and then heats the sheet and reaches the tray mold. Between the molds, vacuum forming or pressure forming is performed to form receiving grooves in which electronic parts are accommodated, and the receiving grooves are cut into units having M × N (M and N are natural numbers).

In the above, when the unit tray or carrier tape is cut after molding, the base layer, the first and second antistatic layers are not all removed, and a fine burr is created in which a part of one layer or a part of a plurality of layers remains on the cut surface. In addition, the cut surface is not smooth and roughened, resulting in weakly attached fine particles. When used, such burrs and fine particles are attached to the electronic components accommodated in the receiving grooves, thereby shorting the electronic components and destroying them.

Therefore, the electronic component container including the unit tray or the carrier tape must remove burrs and fine particles formed on the cut surface.

Removal of burrs and fine particles according to the prior art is disclosed in Korean Patent Application No. 2017-0023538 filed by the present applicant (name of the invention: electronic component container and manufacturing method thereof).

The method of manufacturing an electronic component container according to the prior art includes a process of forming first and second antistatic layers on upper and lower surfaces of a base layer made of a sheet fabric, and forming the base layer and the first and second antistatic layers with air. A process of forming a plurality of receiving grooves in a matrix by pressing molding, and a process of cutting the fabric state in which the plurality of receiving grooves are formed into a unit electronic component container having each M × N (M and N are natural numbers) receiving grooves And forming a conductive layer electrically connected to the first and second antistatic layers on a cut surface including edge portions of the upper and lower surfaces of the unit electronic component container.

In the above, when the fabric state is cut into a unit electronic component container having M × N (M and N are natural numbers) receiving grooves, respectively, a plurality of burrs are generated on the cut surface, and the cut surface is not smooth and rough. Accordingly, a conductive layer electrically connecting the first antistatic layer and the second antistatic layer is formed on the cut surface including the edge portions of the upper and lower surfaces of the unit electronic component container in a state in which a conductive polymer is mixed with an organic solvent. In the above, the conductive layer is formed by an automatic or manual immersion method or a spray method. In addition, the conductive layer is formed by applying the conductive layer automatically or manually with a cloth, sponge, or brush. When forming the conductive layer above, in order to improve productivity, a plurality of cut unit electronic component containers may be overlapped.

In the above, the immersion method is to form a conductive layer by immersing the cut surface of a container including one or a plurality of overlapping upper and lower surfaces in an organic solvent mixed with a conductive polymer contained in a water tank. . In addition, the spray method is formed by spraying an organic solvent in which a conductive polymer is mixed on the cut surface including one or a plurality of overlapping top and bottom edges of the cut unit electronic component container with a sprayer. In addition, the method of forming the conductive layer with a cloth, sponge or brush is to apply an organic solvent mixed with a conductive polymer to the cloth, sponge, or brush, and the cut unit electronic component container is formed at the edge of one or a plurality of overlapping upper and lower surfaces. Apply to the cut surface including the part.

However, when the conductive layer is formed according to the prior art described above, the organic solvent mixed with the conductive polymer is not applied to the edges of the upper and lower surfaces of the cut unit electronic component container with a certain width, and the outer side of the receiving groove, that is, However, since it can be applied to the contact surfaces of adjacent unit electronic component containers, adjacent unit electronic component containers are attached after drying and are not separated. In addition, when the conductive layer is formed of cloth or the like, foreign substances such as lint are generated, and there is a problem that the coating surface of the unit electronic component container is buried.

Accordingly, an object of the present invention is to provide a method of manufacturing an electronic component container capable of improving productivity by simultaneously forming a plurality of conductive layers.

Another object of the present invention is to provide a method of manufacturing an electronic component container capable of preventing adjacent ones from being attached to each other and not separated even when a conductive layer is formed on a plurality of unit electronic component containers.

Another problem of the present invention is to provide a method of manufacturing an electronic component container that can prevent foreign matters such as lint from getting back onto the coated surface of the unit electronic component container when forming a conductive layer.

The method of manufacturing an electronic component container according to the present invention for achieving the above objects includes a process of forming first and second antistatic layers on upper and lower surfaces of a base layer made of a sheet fabric, and the base layer and the first and second antistatic layers. 2 A process of forming a plurality of receiving grooves in a matrix shape by pressing the antistatic layer with air, and a unit electron having M × N (M and N are natural numbers) receiving grooves, respectively, for the state of the fabric in which the plurality of receiving grooves are formed. A process of cutting into a component container, and a coating device in which the cut surface of the unit electronic component container in a state in which one or more of the above are stacked is coated with an organic solvent in which a synthetic resin containing a conductive material or a conductive polymer is dissolved in a water tank constituting the coating device. A process of removing burrs and fine particles formed on the side of the base while forming a conductive layer by transferring and applying from one or a plurality of rotating Mayer bars including a rotating rod constituting a rotating rod and a wire formed to wind the outer peripheral surface of the rotating rod. Include.

In the above, a conductive material or a conductive metal is used as the conductor forming the conductive layer.

As the conductive polymer forming the conductive layer, any one of PEDOT (3,4-Ethylene Di Oxy Thiophene), PSS (Poly Stylene Sulfonate), Pyrrole, and Poly Aniline is used.

When forming the conductive layer in the above, toluene, MEK (methyl ethyl ketone), acetone, acetic acid ethyl, TCE (Tri Chloro Ethylene), DMSO (Di Methyl Sulfoxide), DCM (Di Chloro Methane), HFP (Hexa Fluoro -2- Propanol) and alcohols are used.

In the above, one or more Meyer bars rotate so as to engage with each other in an opposite direction to the transport direction of the one or more unit electronic component containers.

In the above, the rotating rod is composed of any one of metal, ceramic, silicon, synthetic resin, rubber, and Teflon.

In the above, the wire is formed of either metal or synthetic resin.

Accordingly, in the present invention, since a conductive layer can be simultaneously formed on the cut surface of a unit electronic component container in which one or a plurality of pieces are stacked, productivity can be improved. In addition, an organic solvent in which a conductive material or a synthetic resin containing a conductive metal is dissolved There is an advantage in that the unit electronic component containers can be easily separated by preventing adjoining unit electronic component containers from being attached by applying a constant width to the edge portions of the upper and lower surfaces of the unit electronic component container. In addition, when forming the conductive layer, there is an advantage in that it is possible to prevent foreign matters from getting back onto the coated surface of the unit electronic component container.

1 is a plan view of an electronic component container according to the present invention.
2 is a cross-sectional view taken along line AA of FIG. 1.
3A to 3D are manufacturing process diagrams of an electronic component container according to the present invention.
Figure 4 is a perspective view of the coating device used in the present invention.
Fig. 5 is a perspective view showing a process state of Fig. 3D.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of an electronic component container 10 according to the present invention, and FIG. 2 is a cross-sectional view of FIG. 1 taken along line A-A.

The electronic component container 10 according to the present invention includes a base layer 11, first and second antistatic layers 13 and 15, a receiving groove 19 and a conductive layer 17.

The base layer 11 is formed of a synthetic resin having a thickness of about 0.5 to 3 mm so that the electronic component container has a strength enough to maintain its shape. In the above, the base layer 11 is formed of any one of solvent-resistant resins that are not dissolved in organic solvents such as polyethylene, polypropylene, polyester, and polycarbonate, or , Or, it may be formed of any one of a solvent resin soluble in an organic solvent such as polystyrene (Poly Stylene), polyvinyl chloride (Poly Vinyl Chloride) and ABS (Acrylonitrile Butadiene Styrene). Further, the base layer 11 may be formed of a composite resin layer of a solvent and solvent resistant resin.

The first and second antistatic layers 13 and 15 are each extruded on the upper and lower surfaces of the base layer 11 to have a thickness of about 0.05 to 0.3 mm. In the above, the first and second antistatic layers 13 and 15 are the same material, that is, polyethylene (PE), polypropylene (PP), PET (polyethylene terephthalate), and polycarbonate so as to have good adhesion with the base layer 11. A carbon nanotube or a conductive carbon in any one of solvent-resistant resins such as polystyrene (PS), polyvinyl chloride (PVC), and ABS (Acrylonitrile Butadiene Styrene) A conductive material such as, or a conductive metal such as gold, silver, copper, or aluminum is included, and the surface resistance is formed to be about 10 ⁶ to 10 ⁹ Ω/sq.

In addition, the first and second antistatic layers 13 and 15 are formed on the upper and lower surfaces of the base layer 11 by PEDOT (3,4-Ethylene Di Oxy Thiophene), PSS (Poly Stylene Sulfonate), and pyrrole ( Pyrrole) and polyaniline (Poly Aniline) may be formed by coating with any one of conductive polymers.

In the above, when the first and second antistatic layers 13 and 15 are formed of a conductive material or a solvent-resistant resin or a solvent-resistant resin containing a conductive metal, they are formed opaquely by the conductive material or conductive metal. In addition, when formed by coating with a conductive polymer, it is formed transparently. Accordingly, the first and second antistatic layers 13 and 15 may be selectively formed as needed. That is, when the base layer 11 is formed of a transparent synthetic resin such as polyethylene (PE), polypropylene (PP), PET (polyethylene terephthalate), polycarbonate (PC) or polyvinyl chloride (PVC), a transparent electronic component container is obtained. For this purpose, the first and second antistatic layers 13 and 15 may be formed of a conductive polymer.

The receiving groove 19 is formed by molding the base layer 11 and the first and second antistatic layers 13 and 15 to be arranged in a matrix shape. The receiving groove 19 is shown to be formed in 2 × 2 in FIG. 1, but M × N (M and N are natural numbers) may be formed.

The conductive layer 17 is formed with a thickness of about 0.005 to 0.3 mm to be electrically connected to the first and second antistatic layers 13 and 15 on the side of the base layer 11 and at a low temperature of about 25 to 90°C. It is dried. Therefore, the conductive layer 17 electrically connects the first and second antistatic layers 13 and 15 while covering the exposed side surfaces of the base layer 11.

In the above, the conductive layer 17 is a polyurethane resin, polyester resin, or acrylic resin containing any one of conductive materials such as carbon nanotubes or conductive carbon, or conductive metals such as gold, silver, copper, or aluminum. It is formed of any one of synthetic resins such as resin, vinyl resin, and butyral resin. That is, the conductive layer 17 includes toluene, MEK (methyl ethyl ketone), acetone, acetic acid ethyl, TCE (Tri Chloro Ethylene), DMSO (Di Methyl Sulfoxide), DCM ( Di Chloro Methane), HFP (Hexa Fluoro -2- Propanol), and an organic solvent such as alcohol is mixed with any one of the mixed state, and formed by coating on the side of the electronic component container 10. The conductive layer 17 is formed by the applicator 50 shown in FIG. 4. In the above, the coating device 50 is a water tank 55 containing an organic solvent in which one or more, for example, 1 to 10 Mayer bars 51 and a synthetic resin containing a conductive metal are mixed. ). In the above, the Mayer bar 51 is referred to as a wire bar and has a structure in which a wire 54 is wound around the outer circumferential surface of the rotating rod 53. Thus, the conductive layer 17 is one or more, for example, 1 to 200 cut surfaces of the unit electronic component container 10 overlapping one or more, for example, about 1 to 10 It is formed by conveying in contact with the Mayer bar 51 of the. In the above, the Mayer bar 51 is formed of any one of metal, ceramic, silicon, synthetic resin, and rubber, and the wire 51 may be formed of any one of metal and synthetic resin.

In addition, in the conductive layer 17, any one of conductive polymers such as PEDOT (3,4-Ethylene Di Oxy Thiophene), PSS (Poly Stylene Sulfonate), Pyrrole, and Poly Aniline is toluene, Organic solvents such as MEK (methyl ethyl ketone), acetone, acetate, TCE (Tri Chloro Ethylene), DMSO (Di Methyl Sulfoxide), DCM (Di Chloro Methane), HFP (Hexa Fluoro -2- Propanol) and alcohols. It may be formed by mixing with any one of.

In the above, since the conductive layer 17 electrically connects the first and second antistatic layers 13 and 15, the static electricity generated even when a plurality of electronic component containers 10 are stacked can be easily removed and accommodated. Electronic components in the groove 19 can be prevented from being destroyed by static electricity. In addition, since the conductive layer 17 is formed of an organic solvent including a conductive material, burrs 21 that may be formed on the side surfaces are dissolved and removed or covered to be buried so as not to be exposed.

That is, when the base layer 11 and the first and second antistatic layers 13 and 15 are formed of any one of solvent-based resins such as polystyrene (PS), polyvinyl chloride (PVC), and ABS (Acrylonitrile Butadiene Styrene), it is conductive. When the layer 17 is formed, the burr 21 is dissolved and removed by an organic solvent containing a conductive material. In addition, the base layer 11 and the first and second antistatic layers 13 and 15 are among solvent resistant resins such as polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), and polycarbonate (PC). If any one is formed, when the conductive layer 17 is formed, the burrs 21 and fine particles are not dissolved by the organic solvent containing the conductive material, but are buried inside and not exposed.

In addition, when the conductive layer 17 is formed, burrs 21 and fine particles are dissolved and removed by an organic solvent at a low temperature, so that the electronic component container 10 is prevented from being deformed by heat. In addition, when the base layer 11 and the first and second antistatic layers 13 and 15 are formed of solvent-resistant resin and the conductive layer 17 is formed, burrs and fine particles are dissolved and removed. Even if it is not, since the conductive layer 17 is buried and not exposed, the removal time is reduced and productivity is improved.

3A to 3D are manufacturing process diagrams of an electronic component container according to the present invention.

Referring to FIG. 3A, first and second antistatic layers 13 and 15 are formed on upper and lower surfaces of the base layer 11 made of a sheet fabric. In the above, the base layer 11 is formed of any one of solvent-resistant resins such as polyethylene (PE), polypropylene (PP), PET (polyethylene terephthalate), and polycarbonate (PC), or polystyrene (PS), polychlorinated It can be formed to have a thickness of about 0.5 ~ 3mm with any one of solvent resins such as vinyl (PVC) and ABS (Acrylonitrile Butadiene Styrene).

In addition, the first and second antistatic layers 13 and 15 are made of the same material as the base layer 11, that is, polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), polycarbonate (PC), etc. Any one of solvent-resistant resins of, or any one of solvent-resistant resins such as polystyrene (PS), polyvinyl chloride (PVC) and ABS (Acrylonitrile Butadiene Styrene), in a sheet state on the upper and lower surfaces of the base layer 11 It can also be formed by extrusion. In addition, in the present invention, the base layer 11 may be formed of a composite resin layer of solvent- and solvent-resistant resin.

At this time, the synthetic resin for forming the first and second antistatic layers 13 and 15 contains a conductive material such as carbon nanotubes or conductive carbon, or a conductive metal such as gold, silver, copper, or aluminum, and is 0.05 to It is formed by extrusion to a thickness of about 0.3mm. Accordingly, the first and second antistatic layers 13 and 15 have a surface resistance of about 10 ⁶ to 10 ⁹ Ω/sq.

In addition, the first and second antistatic layers 13 and 15 are formed to be conductive such as PEDOT (3,4-Ethylene Di Oxy Thiophene), PSS (Poly Stylene Sulfonate), Pyrrole, and Poly Aniline. It may be formed by coating any one of the polymers.

Referring to FIG. 3B, the base layer 11 and the first and second antistatic layers 13 and 15 are press-molded with air between the upper and lower molds to form the receiving groove 19 in a matrix shape.

In the above, forming the M × N (M and N are natural numbers) receiving grooves 19 is to form a tray, and the receiving grooves 19 are continuously formed in a number of columns with about 1 to 5 receiving grooves in one row. It can also be formed of a carrier tape that can be wound on a roll.

Referring to FIG. 3C, a state of a distal end having a plurality of receiving grooves 19 is cut into a unit electronic component container 10 having M × N (M and N are natural numbers) receiving grooves 19. In the above, not only a plurality of burrs (21) are generated on the cut surface of the unit electronic component container 10, as well as fine particles that are weakly attached to the cut surface because the cut surface is not smooth and rough. In the above, the burr 21 may be formed by remaining without completely removing the base layer 11 or the first and second antistatic layers 13 and 15.

Referring to FIG. 3D, a conductive layer 17 is formed on the surface of the cut surface of the unit electronic component container 10 to be electrically connected to the first and second antistatic layers 13 and 15. After forming the conductive layer 17 to a thickness of about 0.005 to 0.3 mm using the coating device 50 shown in FIG. 4, it is dried at a low temperature of about 25 to 90°C. That is, as shown in FIG. 5, one or more conductive layers 17, for example, 1 to 200, are overlapped with the cut surface of the unit electronic component container 10 by one of the coating device 50 Alternatively, it is formed while being brought into contact with a plurality of, for example, about 1 to 10 Mayer bars (51). In the above, one or more, for example, about 1 to 10 Meyer bars 51 contain a conductive material or a conductive metal in which the wire 54 is contained in the water tank 55 while the rotating rod 53 rotates. The cut surface of the unit electronic component container 10 in which one or more, for example, 1 to 200 pieces, which are transferred by applying the organic solvent in which the synthetic resin is dissolved, is applied is applied.

At this time, one or more rotational directions of the rotating rods 53 constituting the Mayer bars 51 of 1 to 10, for example, 1 to 10, are 1 or more, for example, 1 to 200. The unit electronic component container 10 is opposite to the conveying direction of the overlapped unit electronic component container 10 so that they are engaged. That is, one or more, for example, 1 to 200 unit electronic component containers 10 overlapped from right to left. When transferred to one or more, for example, about 1 to 10, the rotating rod 53 constituting the Mayer bar 51 rotates clockwise. Thereby, the cut surface of the unit electronic component container 10 in which one or a plurality of pieces, for example, 1 to 200 pieces, to be transferred is overlapped with the wire 54 constituting the Mayer bar 51 and the frictional force is increased, respectively. The burrs 21 and fine particles formed on the side surfaces of the base layer 11 of are not only dissolved by an organic solvent, but can be physically removed by frictional force. In addition, when removing the burrs 21 and fine particles, the wire 54 does not generate foreign substances such as lint, and the burrs 21 and fine particles physically removed by frictional force are removed by the rotating wire 54. As a result, since the conductive material or the synthetic resin containing the conductive metal in the water tank 55 is dissolved in the dissolved organic solvent, it is possible to prevent the unit electronic component container 10 from being buried back. In the above, the rotating rod 53 constituting the Mayer bar 51 is formed of any one of metal, ceramic, silicon, synthetic resin, and rubber, and the wire 54 may be formed of any one of metal and synthetic resin. In addition, the rotating rod 53 may be composed of Teflon. Further, the wire 54 has a diameter of about 0.005 to 0.5 mm, and the thickness of the conductive layer 17 can be adjusted according to this diameter. That is, when the diameter of the wire 54 is small, the conductive layer 17 is formed by applying a thin thickness, and when the diameter of the wire 54 is large, the conductive layer 17 is formed by applying a thick thickness.

In the above, one or more wires 51 formed on the surface of the rotating rod 53 of, for example, 1 to 10, are conveyed one or more, for example, 1 to 200 overlapped. The cutting surface of the unit electronic component container 10 and frictional force are further increased, so that the burrs 21 and fine particles formed on the side surfaces of the base layer 11 can be physically removed more easily. In addition, the wire 51 formed on the surface of the rotating rod 53 has a stable and uniform thickness of an organic solvent in which a conductive material or synthetic resin containing a conductive metal is dissolved, so that the conductive layer 17 is attached to the unit electronic component container ( 10) is applied to the outer side of the receiving groove 19, that is, the edge portion of the upper surface and the lower surface with a certain width so as not to be applied to the contact surface of the adjacent unit electronic component container 10.

As the conductive material forming the conductive layer 17 above, any one of carbon nanotubes or conductive carbon may be used, and any one of gold, silver, copper, or aluminum may be used as a conductive metal. In addition, any one of polyurethane resin, polyester resin, acrylic resin, vinyl resin, butyral resin, etc. can be used as the synthetic resin forming the conductive layer 17, and toluene, MEK (methyl Ethyl ketone), acetone, ethyl acetate, TCE (Tri Chloro Ethylene), DMSO (Di Methyl Sulfoxide), DCM (Di Chloro Methane), HFP (Hexa Fluoro -2- Propanol), alcohol, etc. have.

In addition, the conductive layer 17 is formed of any one of conductive polymers such as PEDOT (3,4-Ethylene Di Oxy Thiophene), PSS (Poly Stylene Sulfonate), Pyrrole, and Poly Aniline. It can also be formed by mixing with a solvent.

When forming the conductive layer 17 above, the wire 54 is prevented from being deformed by contact with the cut surface of the unit electronic component container 10 in which one or more wires, for example, 1 to 200 are overlapped. Therefore, one or more organic solvents in which a conductive material or a synthetic resin containing a conductive metal is dissolved, for example, 1 to 200, are overlapped on the cut surface of the unit electronic component container 10 to the outside of the receiving groove 19. It is not applied to the side surface, that is, the contact surface of the adjacent unit electronic component container 10. Thereby, one or more conductive layers 17, for example, 1 to 200, are applied to the edge portions of the upper and lower surfaces near the cut surface of the unit electronic component container 10 with a constant width. Is formed and dried to prevent adjacent unit electronic component containers 10 from adhering to each other.

In addition, since the conductive layer 17 is formed in a state in which the synthetic resin including the conductive material is mixed with an organic solvent, burrs and fine particles formed on the side of the base layer 11 are dissolved and removed or buried. It is formed so that it is not exposed to the outside.

That is, when the base layer 11 and the first and second antistatic layers 13 and 15 are formed with any one of solvent-based resins such as polystyrene (PS), polyvinyl chloride (PVC), and ABS (Acrylonitrile Butadiene Styrene), it is conductive. When the layer 17 is formed, burrs 21 and fine particles are dissolved and removed by an organic solvent. In addition, the base layer 11 and the first and second antistatic layers 13 and 15 are among solvent resistant resins such as polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), and polycarbonate (PC). If formed with either one, when the conductive layer 17 is formed, burrs 21 and fine particles are not dissolved by the organic solvent, but are buried inside and not exposed to the outside.

In addition, when forming the conductive layer 17, the burrs 21 and fine particles formed on the side of the base layer 11 may be dissolved and removed in an organic solvent mixing the synthetic resin, but may be removed due to friction with the wire 54. It can also be removed.

In the above, since the conductive layer 17 electrically connects the first and second antistatic layers 13 and 15, static electricity generated even when a plurality of electronic component containers are stacked can be easily removed. ) It is possible to prevent the electronic components in the inside from being destroyed by static electricity.

In addition, since the conductive layer 17 is applied and dried at a low temperature of about 25 to 90°C, the electronic component container is prevented from being deformed by heat. In addition, when the base layer 11 and the first and second antistatic layers 13 and 15 are formed of a solvent-resistant resin to form the conductive layer 17, the burr and fine particles do not dissolve. Since the conductive layer 17 is buried inside and is not exposed, the removal time is reduced and productivity is improved.

In the technical field to which the present invention pertains, the present invention described above is not limited by the above-described embodiments and the accompanying drawings, and that various substitutions, modifications and changes can be made without departing from the technical spirit of the present invention. It will be obvious to those of ordinary skill.

11: base layer 13: first conductive layer
15: second conductive layer 17: conductive layer
19: receiving groove 21: burr
50: coating device 51: Mayer bar
53: rotating rod 54: wire
55: water tank

Claims (7)

Forming first and second antistatic layers on upper and lower surfaces of the base layer made of sheet fabric, and
Forming a plurality of receiving grooves in a matrix shape by pressing the base layer and the first and second antistatic layers with air;
A process of cutting the fabric state in which the plurality of receiving grooves are formed into a unit electronic component container having each M × N (M and N are natural numbers) receiving grooves,
The cutting surface of the unit electronic component container in the state of overlapping one or more of the above is a rotating rod constituting the coating apparatus and the outer circumferential surface of the rotating rod coated with an organic solvent in which a conductive material or a synthetic resin containing a conductive polymer is dissolved in a water tank constituting the coating apparatus. It includes a step of removing burrs and fine particles formed on a side surface of the base while forming a conductive layer by transferring and applying from one or a plurality of rotating Mayer bars including a wire formed to wind a wire,
The method of manufacturing an electronic component container in which the one or more Meyer bars rotate so as to engage with each other in an opposite direction to the transfer direction of the one or more unit electronic component containers.
The method of claim 1, wherein a conductive material or a conductive metal is used as a conductor forming the conductive layer.
The method according to claim 1, wherein any one of PEDOT (3,4-Ethylene Di Oxy Thiophene), PSS (Poly Stylene Sulfonate), Pyrrole, and Poly Aniline is used as the conductive polymer forming the conductive layer. Method of manufacturing an electronic component container.
The method according to claim 1, wherein when forming the conductive layer, the organic solvent is used as toluene, MEK (methyl ethyl ketone), acetone, acetic acid ethyl, TCE (Tri Chloro Ethylene), DMSO (Di Methyl Sulfoxide), DCM (Di Chloro Methane). ), HFP (Hexa Fluoro -2- Propanol), and a method of manufacturing an electronic component container using any one of alcohols.
delete The method of claim 1, wherein the rotating rod is made of any one of metal, ceramic, silicon, synthetic resin, rubber, and Teflon.
The method of claim 1, wherein the wire is formed of any one of metal and synthetic resin.

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