CN110082494B - Bonding wire quality detection method - Google Patents

Bonding wire quality detection method Download PDF

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CN110082494B
CN110082494B CN201910369085.3A CN201910369085A CN110082494B CN 110082494 B CN110082494 B CN 110082494B CN 201910369085 A CN201910369085 A CN 201910369085A CN 110082494 B CN110082494 B CN 110082494B
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wire
test
bonding
detection method
arc
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CN110082494A (en
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谢海涛
薛子夜
赵义东
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ZHEJIANG GPILOT TECHNOLOGY CO LTD
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/60—Investigating resistance of materials, e.g. refractory materials, to rapid heat changes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/20—Metals
    • G01N33/207—Welded or soldered joints; Solderability
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0016—Tensile or compressive
    • G01N2203/0017—Tensile
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/006—Crack, flaws, fracture or rupture
    • G01N2203/0067—Fracture or rupture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/026—Specifications of the specimen
    • G01N2203/0262—Shape of the specimen
    • G01N2203/0278—Thin specimens
    • G01N2203/028—One dimensional, e.g. filaments, wires, ropes or cables

Abstract

The invention relates to a bonding wire quality detection method, which belongs to the technical field of bonding wires and comprises a stability test and a reliability test, wherein the stability of a bonding process is controlled by detecting the wire breakage times of a wire arc of a whole axis material bonding and the time needing to be stopped and adjusted, performing a tension test and a cold-hot impact test on the wire arc, eliminating the bonding wires with lower quality, screening out the bonding wires with guaranteed quality, feeding the bonding wires back to the production of the bonding wires, adjusting and improving the process in time, and ensuring that the bonding wires have stable working state under the action of mechanical force and in extreme environments.

Description

Bonding wire quality detection method
Technical Field
The invention relates to the technical field of bonding wires, in particular to a bonding wire quality detection method.
Background
The gold bonding wire for semiconductor package is one of the basic materials in the package industry, and determines the development level of integrated circuits, and the alloy wire required by the bonding wire has the characteristics of good mechanical strength, good balling property, good connectivity, and easy operation and welding.
With the advance of semiconductor packaging technology entering the continental china, higher requirements are also put forward for continental gold bonding wire manufacturers, and the requirements for electrical parameters, strength parameters, balling parameters and the like of the gold bonding wire are higher and higher.
However, the thinner diameter of the bonding wire may result in an increase of wire breakage rate, a decrease of bonding stability, an influence on working efficiency and productivity of bonding, and a decrease of stability of a packaged product, and more technologies are to improve a manufacturing process of the bonding wire to obtain a bonding wire with better performance, however, in an actual application process, besides properties of the bonding wire itself, screening and quality control of the bonding wire may also significantly improve bonding efficiency and productivity, thereby improving quality of the packaged product.
Disclosure of Invention
Therefore, the invention provides a quality detection method of a bonding wire, aiming at solving the technical problems of low productivity and poor stability after bonding in the prior art.
The invention discloses a bonding wire quality detection method, which comprises a stability test and a reliability test, wherein the stability test comprises the steps of taking a whole axis wire, welding wire arcs with the same length, detecting the wire breakage times, wherein the length of each wire arc is 2.5mm, the welding time is 12-15 hours; the reliability test comprises the steps of carrying out tension test on the wire arc and carrying out cold and hot impact test on the wire arc after packaging, and respectively detecting the data concentration ratio (CPK) of the tension and the reject ratio of the wire arc packaging.
Preferably, the method further comprises a breaking strength test, an elongation test, a wire diameter test and a push-pull force test.
Preferably, the method comprises the following steps in sequence:
(4) sequentially detecting the breaking strength, the elongation and the wire diameter of the bonding wire;
(5) carrying out stability test on the bonding wire;
(6) and carrying out wire arc tension test and cold and hot impact test on the bonding wire in sequence.
Preferably, the length of the whole axis wire is 500-3000 m.
Preferably, the wire arc length comprises wires for ball burning, and each wire arc corresponds to two welding points.
Preferably, ultrasonic hot-pressing bonding equipment is adopted during the wire arc welding.
Preferably, in the tension test, the tension test and the thrust test are respectively carried out on the head, the middle and the tail of the wire arc of 25-35pcs, and the data concentration CPK of the tension is detected.
Preferably, the reliability test comprises the following steps:
packaging: randomly packaging 100pcs of the wire arc to obtain a packaged product;
cold and hot impact: the wire arc of the package is acted for 15 minutes at 100 ℃, then the temperature is reduced to-40 ℃ within 10 seconds, the action is carried out for 15 minutes, and the 100 times and 1000 times are repeated to obtain the reject ratio of the packaged product.
Preferably, the breaking strength and elongation test is carried out according to the GB/T10573 non-ferrous metal wire tensile test method.
Preferably, the wire diameter test is detected according to a GB/T10577 precious metal and alloy material set size measurement method.
The invention also discloses application of the quality detection method in the fields of production and application of bonding wires.
The technical scheme of the invention has the following advantages:
1. the method for detecting the quality of the bonding wire comprises the steps of stability testing, detecting the wire breakage frequency of the wire arc of the whole axial wire bonding and the time needing to be stopped and adjusted, further controlling the stability of the bonding process, removing the bonding wire with lower quality, feeding the bonding wire back to the production of the bonding wire, and timely adjusting and improving the process, so that the time of stopping and adjusting in the bonding process is finally reduced, and the bonding capacity and the working efficiency are improved; the reliability test comprises a tension test and a cold and hot impact test, the data concentration of tension borne by the wire arc is detected through the tension test, the capacity of resisting thermal expansion and cold contraction fracture of the bonding wire in the extreme high and low temperature change process is judged by using the failure of the packaging material such as the shortage of the LED lamp beads as a bad condition through the cold and hot impact test, the bonding wire with guaranteed quality is screened out, and the bonding wire is guaranteed to have a stable working state under the action of mechanical force and in an extreme environment through the working stability after the bonding wire is used for packaging products.
2. The bonding wire quality detection method also comprises a breaking strength test, an elongation test and a wire diameter test, wherein the judging strength test and the elongation test are carried out according to a GB/T10573 non-ferrous metal wire tensile test method, the test result directly relates to the physical performance of the wire, and the wire diameter test is carried out according to a GB/T10577 precious metal and alloy material set size measurement method, so that the bonding wire is ensured to have uniform wire diameter, and the stability of the physical performance is maintained.
3. The bonding wire control method is applied to the field of production and application of bonding wires, products with unstable quality can be effectively eliminated, better bonding capacity and bonding wires are obtained, and the functional stability of products prepared by using the bonding wires is ensured.
Detailed Description
The following examples are provided to further understand the present invention, not to limit the scope of the present invention, but to provide the best mode, not to limit the content and the protection scope of the present invention, and any product similar or similar to the present invention, which is obtained by combining the present invention with other prior art features, falls within the protection scope of the present invention.
The examples do not show the specific experimental steps or conditions, and can be performed according to the conventional experimental steps described in the literature in the field. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products commercially available.
Example 1
An alloy wire with a wire diameter of 23 μm was prepared by melting, rough drawing, fine drawing, ultra fine drawing, annealing, and winding with 80% gold (99.99% purity) and 20% silver (99.99% purity), and then tested at once.
Breaking strength and elongation test: the method comprises the steps of selecting 10 alloy wire samples which are already put on the market in different batches, wherein 7-10 batches are after-sale problems of low bonding productivity and poor stability of packaged products in different degrees after being put on the market, testing according to the GB/T10573 nonferrous metal wire tensile test method, repeating for 3 rounds to obtain the average breaking strength and the elongation percentage range, and as shown in Table 1, the result shows that the average breaking strength is lower than 7.4Cn, so that the quality risk exists.
Table 1 tensile test results for bonding wire samples
Sample batches 1 2 3 4 5 6 7 8 9 10
Average breaking strength (Cn) 7.8 7.8 7.6 7.4 7.8 7.8 7.2 7.2 7.0 6.8
Elongation Range (%) 5～10 5～10 5～10 5～10 5～10 5～10 5～10 4～10 5～10 4～10
Example 2
And (3) testing the wire diameter: according to the method for measuring the geometric dimensions of the noble metal and the alloy material thereof in GB/T15077, 10 samples of the bonding wires in different batches in the embodiment 1 are respectively selected and tested to obtain the wire diameter floating range of the bonding wires, and as shown in Table 2, the result shows that the difference value between the maximum value and the minimum value in the wire diameter floating range is greater than 0.5 μm, so that the quality risk exists.
Table 2 wire diameter floating range test results of bonding wire samples
Sample batches 1 2 3 4 5
Line diameter fluctuation range (μm) 22.7-23.2 22.8-23.2 22.8-23.1 22.7-23.1 22.9-23.3
Sample batches 6 7 8 9 10
Line diameter fluctuation range (μm) 22.9-23.2 22.7-23.3 22.5-23.3 22.5-23.1 22.6-23.4
Example 3
And (3) stability testing: taking a whole-axis wire (500M/axis) sample (3000M/axis bonding wire is adopted in some embodiments) of 10 different batches of bonding wires described in embodiment 1, adopting an ultrasonic hot-pressing bonding device (KS-CONNX high-speed automatic bonding device), welding 200000 wire arcs with the same welding length, wherein the length of each wire arc is 2.5mm, each wire arc comprises a wire used for ball burning, each wire arc corresponds to two welding points, the welding time is 12-15 hours, and detecting the wire breakage times and the machine halt adjusting time, wherein as shown in Table 3, the result shows that the wire breakage times are more than 5 times, and the machine halt adjusting time is more than 30 min.
Table 3 stability test results for bonding wire samples
Sample batches 1 2 3 4 5 6 7 8 9 10
Number of wire breaks 1 0 2 5 1 3 9 13 11 25
Downtime adjustment time (min) 10 0 15 25 10 15 50 60 60 120
Example 4
And (3) testing process capability: selecting 25pcs,30pcs and 35pcs of wire arcs, respectively carrying out tension test and thrust test on the heads, the middles and the tails of the wire arcs, wherein the middle is the highest point in the middle of the wire arcs, detecting tension and thrust required by wire breakage of the wire arcs, and calculating data concentration, and the reference of a thrust standard method is as follows: EIA/JESD22-B116, tension MIL-STD-883G method reference: the calculation formula is as follows:
CPK：Cpk＝Cp(1-|Ca|)
ca (capability of Accuracy): the accuracy of the process;
cp (capability of precision) process precision;
the calculation results are shown in table 4 below, and show that there is a quality risk for bonding wires with GPK less than 1.33.
TABLE 4 bonding wire sample tension and thrust range
Sample batches 1 2 3 4 5 6 7 8 9 10
Thrust CPK (25pcs) 1.35 1.40 1.38 1.45 1.46 1.44 0.92 0.55 0.62 0.68
Tension force CPK (25pcs) 1.56 1.42 1.48 1.38 1.48 1.55 0.85 0.65 0.54 0.65
Thrust CPK (30pcs) 1.36 1.39 1.36 1.47 1.49 1.41 0.89 0.58 0.82 0.65
Tension CPK (30pcs) 1.54 1.43 1.49 1.35 1.43 1.54 0.91 0.69 0.74 0.63
Thrust CPK (35pcs) 1.37 1.41 1.39 1.47 1.44 1.46 0.92 0.50 0.64 0.58
Tension CPK (35pcs) 1.52 1.41 1.47 1.39 1.48 1.45 0.88 0.75 0.64 0.69
Example 5
And (3) testing cold and hot impact: randomly taking the 100pcs arc wire of the embodiment 3, and packaging to prepare an LED lamp; the encapsulated wire was exposed to 100 c for 15 minutes and then cooled to-40 c within 10 seconds for 15 minutes, and the process was repeated for 100, 200, 300, 400, 500 cycles (in some embodiments 800 or 1000 cycles) to determine the failure rate of the LED lamp due to the breakage of the wire, as shown in table 5.
TABLE 5 Cold thermal shock test results for bonding wire samples
Sample batches 1 2 3 4 5 6 7 8 9 10
Reject ratio (100 round) 0％ 0％ 0％ 0％ 0％ 0％ 0％ 0％ 0％ 0％
Reject ratio (200 round) 0％ 0％ 0％ 0％ 0％ 0％ 0％ 0％ 0％ 0％
Reject ratio (300 round) 0％ 0％ 0％ 0％ 0％ 0％ 0％ 0％ 0％ 0％
Reject ratio (400 round) 0％ 0％ 0％ 0％ 0％ 0％ 5％ 10％ 11％ 8％
Reject ratio (500 round) 0％ 0％ 0％ 0％ 0％ 0％ 15％ 20％ 30％ 26％
Example 6
Quality control of non-shipped products: 10 batches of samples of the bonding wire of example 1 were selected and quality control was performed on the samples using the detection methods of examples 1-5, with the results shown in table 6:
table 6 quality control results for bonding wire samples
Figure GDA0003289131940000071
Figure GDA0003289131940000081
Through testing, the quality risk of the sample of No. 2 batch in the using process is considered to be eliminated, and the feedback of the quality problem does not occur after other products are put on the market.
The above examples are merely illustrative for clarity and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.

Claims (9)

1. A bonding wire quality detection method is characterized by comprising a stability test and a reliability test, wherein the stability test comprises the steps of taking a whole axis wire, welding wire arcs with the same length, wherein the length of each wire arc is 2.5mm, the length of each wire arc comprises a wire used for ball burning, each wire arc corresponds to two welding points, the welding time is 12-15 hours, the wire breakage frequency and the shutdown adjustment time are detected, the wire breakage frequency is more than 5, and the shutdown adjustment time is more than 30 min;
the reliability test comprises the steps of carrying out a tension test on the wire arc and carrying out a cold and hot impact test on the wire arc after the wire arc is packaged, and respectively detecting the CPK of the tension and the reject ratio of the wire arc package; in the tension test, the head, the middle and the tail of the wire arc of 25-35pcs are respectively subjected to tension test and thrust test, the CPK of the tension is detected, and the bonding wire with the CPK smaller than 1.33 has quality risk.
2. The bonding wire quality detection method according to claim 1, further comprising a breaking strength test, an elongation test, and a wire diameter test.
3. The bonding wire quality detection method according to claim 2, characterized by sequentially performing the following steps:
(1) sequentially detecting the breaking strength, the elongation and the wire diameter of the bonding wire;
(2) carrying out stability test on the bonding wire;
(3) and carrying out wire arc tension test and cold and hot impact test on the bonding wire in sequence.
4. The bonding wire quality detection method as claimed in claim 1, wherein the length of the whole axis wire is 500-3000 m.
5. The bonding wire quality detection method according to any one of claims 1 to 4, wherein ultrasonic thermocompression bonding equipment is used for the wire arc welding.
6. The bonding wire quality detection method according to any one of claims 1 to 4, wherein the reliability test further comprises the steps of:
packaging: randomly packaging 100pcs of the wire arc to obtain a packaged product;
cold and hot impact: the wire arc of the package is acted for 15 minutes at 100 ℃, then the temperature is reduced to-40 ℃ within 10 seconds, the action is carried out for 15 minutes, and the 100 times and 1000 times are repeated to obtain the reject ratio of the packaged product.
7. The bonding wire quality detection method according to claim 2, wherein the breaking strength and elongation test is performed according to a GB/T10573 non-ferrous metal wire tensile test method, and bonding wires with average breaking strength lower than 7.4Cn have quality risk.
8. The bonding wire quality detection method according to claim 2, wherein the wire diameter test is performed according to a GB/T10577 precious metal and alloy material set size measurement method, and quality risk exists when the wire passes through the bonding wire with the difference value between the maximum value and the minimum value being larger than 0.5 μm in a floating range.
9. Use of the quality detection method according to any one of claims 1 to 8 in the production and application fields of bonding wires.
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101862897A (en) * 2010-02-11 2010-10-20 深圳市贵鸿达电子有限公司 Method for bonding copper wire of power device

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* Cited by examiner, † Cited by third party
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US5275058A (en) * 1992-10-30 1994-01-04 Ford Motor Company Method and apparatus for detecting wire bond pull test failure modes
JPH0997822A (en) * 1995-09-28 1997-04-08 Sumitomo Metal Mining Co Ltd Method of evaluating bonding wire
CN1730233A (en) * 2005-07-12 2006-02-08 天津世星电子材料有限公司 Production technique for integrated circuit used bonding aluminum wire extra fine filament
CN105296789B (en) * 2015-11-13 2018-02-02 汕头市骏码凯撒有限公司 A kind of high reliability silver alloy bonding wire and its manufacture method
CN107907414A (en) * 2017-11-23 2018-04-13 江阴苏阳电子股份有限公司 A kind of radian rupture strength test method
CN208410290U (en) * 2018-06-07 2019-01-22 江苏聚成金刚石科技有限公司 A kind of diamond wire torsion wire breakage detector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101862897A (en) * 2010-02-11 2010-10-20 深圳市贵鸿达电子有限公司 Method for bonding copper wire of power device

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