CN110071124A - Display panel and preparation method thereof - Google Patents
Display panel and preparation method thereof Download PDFInfo
- Publication number
- CN110071124A CN110071124A CN201910322480.6A CN201910322480A CN110071124A CN 110071124 A CN110071124 A CN 110071124A CN 201910322480 A CN201910322480 A CN 201910322480A CN 110071124 A CN110071124 A CN 110071124A
- Authority
- CN
- China
- Prior art keywords
- layer
- organic insulator
- hole
- inorganic insulation
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
Abstract
The present invention provides a kind of display panel and preparation method thereof.Display panel definition has viewing area and bent area, and the display panel includes the flexible substrate being stacked, the first inorganic insulation layer, the first organic insulator, the first metal layer, the second organic insulator, the second inorganic insulation layer, second metal layer and third organic insulator.Display panel production method is comprising steps of provide a flexible substrate, the first inorganic insulation layer of production, the first organic insulator of production, production the first metal layer, the second organic insulator of production, the second inorganic insulation layer of production, production second metal layer and production third organic insulator.The present invention is by the way that the second inorganic insulation layer of bent area to be set on the second organic insulator, the residue of the second inorganic insulation layer is generated in through-hole to avoid the first metal layer, to prevent the first signal line under bending stress from generating the risk that stress is concentrated or film layer is removed, product yield is improved.
Description
Technical field
The present invention relates to display fields more particularly to a kind of display panel and preparation method thereof.
Background technique
It as shown in Figure 1 and Figure 2, is existing flexible display panels planar structure and cross section structure schematic diagram, Flexible Displays face
Plate 90 includes viewing area 91 and non-display area 92, and non-display area 92 includes the external zones 921 for surrounding viewing area 91, bent area 922
With circuit board area 923.Flexible display panels 90 generally use the plastic base of soft flexible, and narrow frame is suitble to show equipment
Production.Flexible display panels 90 are by designing a bent area 922 in peripheral signal cabling area, thus by signal cabling area and electricity
Road plate area 923 is folded and placed to 90 side of flexible display panels or lower section, to reduce the accounting of non-display area 92, realizes narrow frame
Design.
As shown in Figure 3, Figure 4, it is the structural schematic diagram of bent area 922, from bottom to up successively includes: flexible substrate 901, the
One inorganic insulation layer 902, the first organic insulator 903, the first metal layer 904 (including a plurality of first signal line 914), the second nothing
Machine insulating layer 905, the second organic insulator 906, second metal layer 907 (including a plurality of second signal line 917), third are organic absolutely
Edge layer 908.Wherein, the first inorganic insulation layer 902 is buffer layer, barrier layer, gate insulator in laminated construction, with viewing area 91
Layer, interlayer insulating film etc. are identical film layer.Second inorganic insulation layer, 905 purpose is in the part without the second organic insulator 906
Region still maintains the mutually insulated of the first metal layer 904 and second metal layer 907.First inorganic insulation layer 902 and the second nothing
Machine insulating layer 905 is removed in bent area 912 by all etchings.First signal line 914, the second signal line 917 are data signals line
With Power signal line.And circular through hole 93 is provided in the first signal line 914 and the second signal line 917, it is therefore an objective to reduce news
Suffered bending stress, reduces the risk of its buckling failure when the bending of number line.
However, this aperture design is but easy to cause another problem, i.e., generated at the through-hole 93 of the first signal line 904
The residue 94 of second inorganic insulation layer 905.The residue 94 plays reaction to the stress release of signal line, and can deteriorate
The adhesive force of two organic insulators 906 and the first signal line 914.So as to cause under bending stress, the first signal line 914 is answered
Power is concentrated or the risk of film layer removing, reduces product yield.
It would therefore be highly desirable to provide a kind of display panel and preparation method thereof, so as to overcome the problems existing in the prior art.
Summary of the invention
The object of the present invention is to provide a kind of display panels and preparation method thereof, to solve the first news in the prior art
The through hole of number line leads to the problem of the residue of the second inorganic insulation layer.To prevent the first signal line under bending stress from producing
Raw stress is concentrated or the risk of film layer removing, improves product yield.
To solve the above-mentioned problems, the present invention provides a kind of display panel, and definition has viewing area and bent area, the display
Panel includes the flexible substrate being stacked, the first inorganic insulation layer, the first organic insulator, the first metal layer, second organic
Insulating layer, the second inorganic insulation layer, second metal layer and third organic insulator.In particular, first inorganic insulation layer
In the flexible substrate；First organic insulator is set on first inorganic insulation layer of the bent area；Institute
The first metal layer is stated on first organic insulator, the first metal layer of the bent area is equipped with interval setting
First through hole；Second organic insulator is set on the first metal layer, filling described second in the first through hole
Organic insulator；Second inorganic insulation layer is set on second organic insulator of the viewing area；Second gold medal
Belong to layer to be set on second inorganic insulation layer, it is logical that the second metal layer of the bent area is equipped with spaced second
Hole；The third organic insulator is set in the second metal layer, filling second organic insulation in second through-hole
Layer.
Further, wherein the first through hole, second through-hole are rounded.
Further, wherein second through-hole is oppositely arranged with the first through hole.
Further, wherein first inorganic insulation layer includes that the buffer layer being cascading, barrier layer grid are exhausted
Edge layer and interlayer insulating film.In particular, the buffer layer is set in the flexible substrate；The barrier layer is set to the buffering
On layer；The gate insulating layer is set on the barrier layer；The interlayer insulating film is set on the gate insulating layer.
Further, wherein the first metal layer includes a plurality of first signal line, first signal line is equidistantly sowed discord
Every setting.
Further, wherein the second metal layer includes a plurality of second signal line, second signal line is equidistantly sowed discord
Every setting.
Further, wherein first inorganic insulation layer of the bent area further includes third through-hole, described first has
Machine insulating layer is set in the third through-hole；First organic insulator is equal with the thickness of first inorganic insulation layer.
The present invention also provides a kind of production methods of display panel, comprising the following steps:
One flexible substrate is provided；
The first inorganic insulation layer is made, first inorganic insulation is made by depositional mode in the flexible substrate
Layer；
The first organic insulator is made, etching production third is logical on first inorganic insulation layer of the bent area
Hole, and first organic insulator is made by being coated with organic object space formula in the third through-hole；
The first metal layer is made, passes through deposition and patterned way production described first on first organic insulator
Metal layer, the first metal layer are equipped with spaced first through hole；
The second organic insulator is made, passes through coating and patterned way production described second on the first metal layer
Organic insulator, interior filling second organic insulator of the first through hole；
The second inorganic insulation layer is made, it is inorganic by depositional mode to make described second on second organic insulator
Insulating layer removes second organic insulator of the bent area by etching；
Second metal layer is made, passes through deposition and patterned way production described second on second inorganic insulation layer
Metal layer, the second metal layer are equipped with spaced second through-hole；And
Third organic insulator is made, the third is made by coating and patterned way in the second metal layer
Organic insulator, interior filling second organic insulator of second through-hole.
Further, wherein the first inorganic insulation layer of the production specifically includes the following steps:
Buffer layer is made, the buffer layer is made by depositional mode in the flexible substrate；
Barrier layer is made, the barrier layer is made by depositional mode on the buffer layer；
Gate insulating layer is made, the gate insulating layer is made by depositional mode on the barrier layer；And
Interlayer insulating film is made, the interlayer insulating film is made by depositional mode on the gate insulating layer.
Further, wherein the first metal layer forms a plurality of first signal line by patterned way；Described second
Metal layer forms a plurality of second signal line by patterned way.
Further, wherein the production the first metal layer step further includes being patterned mode in the first metal layer
Lead to oxygen afterwards to be handled, for aoxidizing the first metal layer surface layer.
The beneficial effects of the present invention are: the production method of a kind of display panel and its display panel is provided, by that will bend
Second inorganic insulation layer in area is set on the second organic insulator, and it is inorganic exhausted that second is generated in the through-hole to avoid the first metal layer
The residue of edge layer improves to prevent the first signal line under bending stress from generating the risk that stress is concentrated or film layer is removed
Product yield.
Detailed description of the invention
Fig. 1 is existing flexible display panels planar structure schematic diagram；
Fig. 2 is the flexible display panels sectional view in Fig. 1；
Fig. 3 is the bending region structure schematic diagram of the flexible display panels in Fig. 1；
Fig. 4 is the direction A-A sectional view in Fig. 3；
Fig. 5 is the structural schematic diagram of the display panel in one embodiment of the invention；
Fig. 6 is the direction B-B sectional view in Fig. 5；
Fig. 7 is the direction C-C sectional view in Fig. 5；
Fig. 8 is the production flow diagram of the display panel in one embodiment of the invention；
Fig. 9 is the production flow diagram of step S2 in Fig. 8.
Component mark is as follows in figure:
100, display panel, 10, viewing area, 20, bent area；
1, flexible substrate, the 2, first inorganic insulation layer, the 3, first organic insulator, 4, the first metal layer,
5, the second organic insulator, the 6, second inorganic insulation layer, 7, second metal layer,
8, third organic insulator, 11, first through hole, the 12, second through-hole, 13, third through-hole,
21, buffer layer, 22, barrier layer, 23, gate insulating layer, 24, interlayer insulating film,
41, the first signal line, the 71, second signal line.
Specific embodiment
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
It please refers to shown in Fig. 5, the present invention provides a kind of display panel 100, and definition has viewing area 10 and bent area 20, described
Display panel 100 includes the flexible substrate 1 being stacked, the first inorganic insulation layer 2, the first organic insulator 3, the first metal layer
4, the second organic insulator 5, the second inorganic insulation layer 6, second metal layer 7 and third organic insulator 8.In particular, described
First inorganic insulation layer 2 is set in the flexible substrate 1；First organic insulator 3 is set to the described of the bent area 20
On first inorganic insulation layer 2；The first metal layer 4 is set on first organic insulator 3, wherein in the bent area 20
The first metal layer 4 be equipped with spaced first through hole 11；Second organic insulator 5 is set to first gold medal
Belong on layer 4, filling second organic insulator 5 in the first through hole 11；Second inorganic insulation layer 6 is set to described aobvious
Show on second organic insulator 5 in area 10；The second metal layer 7 is set on second inorganic insulation layer 6, wherein
The second metal layer 7 of the bent area 20 is equipped with spaced second through-hole 12；The third organic insulator 8 is set
In in the second metal layer 7, second organic insulator 5 is filled in second through-hole 12.It is inorganic to be arranged described second
6 purpose of insulating layer is to still maintain the first metal layer 4 and described in the partial region without second organic insulator 5
The mutually insulated of two metal layers 7.
In embodiments of the present invention, the first through hole 11, second through-hole 12 are rounded.It is logical to be arranged described first
Hole 11,12 purpose of the second through-hole are that reduce the first metal layer 4 and the second metal layer 7 suffered curved in bending
Transverse stress reduces the risk of its buckling failure.
In embodiments of the present invention, second through-hole 12 is oppositely arranged with the first through hole 11.
In embodiments of the present invention, first inorganic insulation layer 2 of the bent area 20 further includes third through-hole 13, institute
The first organic insulator 3 is stated in the third through-hole 13 or first organic insulator 3 is filled in the third and leads to
In hole 13；First organic insulator 3 is equal with the thickness of first inorganic insulation layer 2.
It please refers to shown in Fig. 5, in embodiments of the present invention, first inorganic insulation layer 2 includes being cascading
Buffer layer 21, barrier layer 22, gate insulating layer 23 and interlayer insulating film 24.In particular, the buffer layer 21 is set on described soft
On property substrate 1；The barrier layer 22 is set on the buffer layer 21；The gate insulating layer 23 is set on the barrier layer 22；
The interlayer insulating film 24 is set on the gate insulating layer 23.
It please refers to shown in Fig. 6, in embodiments of the present invention, the first metal layer 4 includes a plurality of first signal line 41, institute
The first signal line 41 is stated to be equidistantly spaced.First signal line 41 is data signals line, realizes data signal transmission.To the greatest extent
Two the first signal line 41 are only shown in pipe figure, but indeed, it is possible to change first signal line according to actual needs
41 quantity.
It please refers to shown in Fig. 7, in embodiments of the present invention, the second metal layer 7 includes a plurality of second signal line 71, institute
The second signal line 71 is stated to be equidistantly spaced.Second signal line 71 is Power signal line, realizes scanning signal transmission.
Similarly, although only showing two the second signal line 71 in figure, indeed, it is possible to change described according to actual needs
The quantity of two signal line 71.
It please refers to shown in Fig. 8, the present invention also provides a kind of production methods of display panel 100, comprising the following steps:
S1, a flexible substrate 1 is provided；
S2, the first inorganic insulation layer 2 of production, it is inorganic in the flexible substrate 1 by depositional mode to make described first
Insulating layer 2；
S3, the first organic insulator 3 of production, etch production on first inorganic insulation layer 2 of the bent area 20
Third through-hole 13, and first organic insulator 3 is made by being coated with organic object space formula in the third through-hole 13；
S4, production the first metal layer 4, make institute by deposition and patterned way on first organic insulator 3
The first metal layer 4 is stated, the first metal layer 4 is equipped with spaced first through hole 11；
S5, the second organic insulator 5 of production, make institute by coating and patterned way on the first metal layer 4
The second organic insulator 5 is stated, filling second organic insulator 5 in the first through hole 11；
S6, the second inorganic insulation layer 6 of production, make described the by depositional mode on second organic insulator 5
Two inorganic insulation layers 6 remove second organic insulator 5 of the bent area 20 by etching；
S7, production second metal layer 7, make institute by deposition and patterned way on second inorganic insulation layer 6
Second metal layer 7 is stated, the second metal layer 7 is equipped with spaced second through-hole 12；And
S8, production third organic insulator 8, make institute by coating and patterned way in the second metal layer 7
Third organic insulator 8 is stated, filling second organic insulator 5 in second through-hole 12.
It please refers to shown in Fig. 9, in embodiments of the present invention, 2 step S2 of the first inorganic insulation layer of the production is specifically included
Following steps:
S21, production buffer layer 21, make the buffer layer 21 by depositional mode in the flexible substrate 1；
S22, production barrier layer 22, make the barrier layer 22 by depositional mode on the buffer layer 21；
S23, production gate insulating layer 23, make the gate insulating layer by depositional mode on the barrier layer 22
23；And
S24, production interlayer insulating film 24, make the layer insulation by depositional mode on the gate insulating layer 23
Layer 24.
It please refers to shown in Fig. 6, Fig. 7, in embodiments of the present invention, the first metal layer 4 is formed by patterned way
A plurality of first signal line 41；The second metal layer 7 forms a plurality of second signal line 71 by patterned way.
In embodiments of the present invention, the production the first metal layer step S4 further includes being schemed in the first metal layer 4
Lead to oxygen after shape mode to be handled, for aoxidizing 4 surface layer of the first metal layer, prevents short circuit.
The beneficial effects of the present invention are: providing the production method of a kind of display panel 100 and its display panel 100, pass through
Second inorganic insulation layer 6 of bent area 20 is set on the second organic insulator 5, to avoid first on the first metal layer 4
The residue of the second inorganic insulation layer 6 is generated in the first through hole 11 of signal line 41, to prevent the first news under bending stress
Number line 41 generates stress and concentrates or the risk of film layer removing, improves product yield.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (10)
1. a kind of display panel, definition has viewing area and bent area, which is characterized in that the display panel includes:
Flexible substrate；
First inorganic insulation layer is set in the flexible substrate；
First organic insulator, on first inorganic insulation layer of the bent area；
The first metal layer is set on first organic insulator, wherein setting on the first metal layer of the bent area
There is spaced first through hole；
Second organic insulator is set on the first metal layer, filling second organic insulator in the first through hole；
Second inorganic insulation layer, on second organic insulator of the viewing area；
Second metal layer is set on second inorganic insulation layer, wherein setting in the second metal layer of the bent area
There is spaced second through-hole；And
Third organic insulator is set in the second metal layer, filling second organic insulator in second through-hole.
2. display panel according to claim 1, which is characterized in that
The first through hole, second through-hole are rounded.
3. display panel according to claim 1, which is characterized in that
Second through-hole is oppositely arranged with the first through hole.
4. display panel according to claim 1, which is characterized in that
First inorganic insulation layer includes
Buffer layer is set in the flexible substrate；
Barrier layer is set on the buffer layer；
Gate insulating layer is set on the barrier layer；And
Interlayer insulating film is set on the gate insulating layer.
5. display panel according to claim 1, which is characterized in that the first metal layer includes a plurality of first signal
Line, first signal line are equidistantly spaced.
6. display panel according to claim 1, which is characterized in that the second metal layer includes a plurality of second signal
Line, second signal line are equidistantly spaced.
7. display panel according to claim 1, which is characterized in that first inorganic insulation layer of the bent area is also
Including third through-hole, first organic insulator is set in the third through-hole；First organic insulator and described the
The thickness of one inorganic insulation layer is equal.
8. a kind of production method of such as described in any item display panels of claim 1-7, comprising the following steps:
One flexible substrate is provided；
The first inorganic insulation layer is made, first inorganic insulation layer is made by depositional mode in the flexible substrate；
The first organic insulator is made, the etching production third through-hole on first inorganic insulation layer of the bent area, and
First organic insulator is made by being coated with organic object space formula in the third through-hole；
The first metal layer is made, first metal is made by deposition and patterned way on first organic insulator
Layer, the first metal layer are equipped with spaced first through hole；
The second organic insulator is made, it is organic by coating and patterned way production described second on the first metal layer
Insulating layer, interior filling second organic insulator of the first through hole；
The second inorganic insulation layer is made, second inorganic insulation is made by depositional mode on second organic insulator
Layer removes second organic insulator of the bent area by etching；
Second metal layer is made, second metal is made by deposition and patterned way on second inorganic insulation layer
Layer, the second metal layer are equipped with spaced second through-hole；And
Third organic insulator is made, it is organic by coating and the patterned way production third in the second metal layer
Insulating layer, interior filling second organic insulator of second through-hole.
9. the production method of display panel according to claim 8, which is characterized in that the first inorganic insulation layer of the production
Specifically includes the following steps:
Buffer layer is made, the buffer layer is made by depositional mode in the flexible substrate；
Barrier layer is made, the barrier layer is made by depositional mode on the buffer layer；
Gate insulating layer is made, the gate insulating layer is made by depositional mode on the barrier layer；And
Interlayer insulating film is made, the interlayer insulating film is made by depositional mode on the gate insulating layer.
10. the production method of display panel according to claim 8, which is characterized in that the production the first metal layer step
It suddenly further include leading to oxygen after the first metal layer is patterned mode to be handled, for aoxidizing the first metal layer table
Layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910322480.6A CN110071124B (en) | 2019-04-22 | 2019-04-22 | Display panel and manufacturing method thereof |
| PCT/CN2019/092945 WO2020215479A1 (en) | 2019-04-22 | 2019-06-26 | Display panel and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910322480.6A CN110071124B (en) | 2019-04-22 | 2019-04-22 | Display panel and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110071124A true CN110071124A (en) | 2019-07-30 |
| CN110071124B CN110071124B (en) | 2020-09-01 |
Family
ID=67368287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910322480.6A Active CN110071124B (en) | 2019-04-22 | 2019-04-22 | Display panel and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110071124B (en) |
| WO (1) | WO2020215479A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110444578A (en) * | 2019-08-14 | 2019-11-12 | 京东方科技集团股份有限公司 | Flexible display panels and its manufacturing method |
| CN110865732A (en) * | 2019-10-28 | 2020-03-06 | 武汉华星光电半导体显示技术有限公司 | Flexible touch display panel and flexible touch display device |
| CN111048530A (en) * | 2019-12-25 | 2020-04-21 | 合肥维信诺科技有限公司 | Flexible display panel, preparation method thereof and curved surface display screen |
| CN111276495A (en) * | 2020-02-12 | 2020-06-12 | 武汉华星光电半导体显示技术有限公司 | Array substrate and preparation method thereof |
| WO2021027066A1 (en) * | 2019-08-13 | 2021-02-18 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| CN114267706A (en) * | 2021-12-14 | 2022-04-01 | 深圳市华星光电半导体显示技术有限公司 | Flexible display panel and manufacturing method thereof |
| CN114333577A (en) * | 2021-12-17 | 2022-04-12 | 深圳市华星光电半导体显示技术有限公司 | Flexible display panel and display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050059190A1 (en) * | 2003-09-16 | 2005-03-17 | Industrial Technology Research Institute | Method of fabricating thin film transistor TFT array |
| CN107946317A (en) * | 2017-11-20 | 2018-04-20 | 京东方科技集团股份有限公司 | A kind of flexible array substrate and preparation method, display base plate, display device |
| CN109378318A (en) * | 2018-10-15 | 2019-02-22 | 武汉华星光电半导体显示技术有限公司 | A kind of display panel and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108550612B (en) * | 2018-05-29 | 2020-11-13 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
-
2019
- 2019-04-22 CN CN201910322480.6A patent/CN110071124B/en active Active
- 2019-06-26 WO PCT/CN2019/092945 patent/WO2020215479A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050059190A1 (en) * | 2003-09-16 | 2005-03-17 | Industrial Technology Research Institute | Method of fabricating thin film transistor TFT array |
| CN107946317A (en) * | 2017-11-20 | 2018-04-20 | 京东方科技集团股份有限公司 | A kind of flexible array substrate and preparation method, display base plate, display device |
| CN109378318A (en) * | 2018-10-15 | 2019-02-22 | 武汉华星光电半导体显示技术有限公司 | A kind of display panel and preparation method thereof |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021027066A1 (en) * | 2019-08-13 | 2021-02-18 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| CN110444578A (en) * | 2019-08-14 | 2019-11-12 | 京东方科技集团股份有限公司 | Flexible display panels and its manufacturing method |
| CN110444578B (en) * | 2019-08-14 | 2021-11-09 | 京东方科技集团股份有限公司 | Flexible display panel and manufacturing method thereof |
| CN110865732A (en) * | 2019-10-28 | 2020-03-06 | 武汉华星光电半导体显示技术有限公司 | Flexible touch display panel and flexible touch display device |
| CN111048530A (en) * | 2019-12-25 | 2020-04-21 | 合肥维信诺科技有限公司 | Flexible display panel, preparation method thereof and curved surface display screen |
| CN111048530B (en) * | 2019-12-25 | 2022-08-19 | 合肥维信诺科技有限公司 | Flexible display panel, preparation method thereof and curved surface display screen |
| CN111276495A (en) * | 2020-02-12 | 2020-06-12 | 武汉华星光电半导体显示技术有限公司 | Array substrate and preparation method thereof |
| CN111276495B (en) * | 2020-02-12 | 2022-06-07 | 武汉华星光电半导体显示技术有限公司 | Array substrate and preparation method thereof |
| CN114267706A (en) * | 2021-12-14 | 2022-04-01 | 深圳市华星光电半导体显示技术有限公司 | Flexible display panel and manufacturing method thereof |
| CN114333577A (en) * | 2021-12-17 | 2022-04-12 | 深圳市华星光电半导体显示技术有限公司 | Flexible display panel and display device |
| CN114333577B (en) * | 2021-12-17 | 2024-03-15 | 深圳市华星光电半导体显示技术有限公司 | Flexible display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110071124B (en) | 2020-09-01 |
| WO2020215479A1 (en) | 2020-10-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110071124A (en) | Display panel and preparation method thereof | |
| CN108231800B (en) | A kind of flexible display panels and preparation method thereof, display device | |
| CN107579081B (en) | Display panel and display device | |
| US9357638B2 (en) | Flexible display device and fabrication method thereof | |
| US11127804B2 (en) | Display panel, method for manufacturing the same and display device | |
| US11006519B2 (en) | Flexible circuit board and display panel | |
| US20110017524A1 (en) | Dual-substrate capacitive touch panel | |
| US10886340B2 (en) | Display panel and display device with reduced frame width | |
| CN108878484A (en) | Display panel and display device | |
| CN108470762A (en) | A kind of flexible display panels and display device | |
| JP2011118494A5 (en) | Touch panel | |
| WO2015032198A1 (en) | Array substrate and manufacturing method therefor, flexible display, and electronic device | |
| WO2021227424A1 (en) | Touch-control display panel and touch-control display apparatus | |
| CN106783872A (en) | A kind of flexible display panels | |
| KR20080087501A (en) | Plasma display device | |
| TW202032226A (en) | Structure of flexible circuits | |
| CN109638062A (en) | Array substrate row driving structure and production method, array substrate, display panel | |
| TWI627879B (en) | Flexible circuit board module | |
| CN102356703B (en) | Circuit board and mother laminated body | |
| CN105280648A (en) | Array substrate and manufacturing method thereof, display panel, and display device | |
| KR20140084622A (en) | Flexible display device | |
| JP2018513413A (en) | Thin film transistor array substrate and manufacturing method thereof | |
| US20050184664A1 (en) | Plasma display device | |
| CN110429107A (en) | A kind of flexible display panels and preparation method thereof | |
| CN109273411B (en) | Flexible electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |