CN114267706A - Flexible display panel and manufacturing method thereof - Google Patents

Flexible display panel and manufacturing method thereof Download PDF

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Publication number
CN114267706A
CN114267706A CN202111531924.0A CN202111531924A CN114267706A CN 114267706 A CN114267706 A CN 114267706A CN 202111531924 A CN202111531924 A CN 202111531924A CN 114267706 A CN114267706 A CN 114267706A
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layer
metal
metal layer
display panel
flexible substrate
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CN114267706B (en
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周黎斌
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Abstract

The embodiment of the application provides a flexible display panel and a manufacturing method thereof, wherein the flexible display panel comprises: a first flexible substrate layer; a first inorganic layer disposed on the first flexible substrate layer; the first metal layer is arranged on the first inorganic layer and covers part of the first inorganic layer; a second flexible substrate layer covering the first inorganic layer and the first metal layer; a second inorganic layer disposed on the second flexible substrate layer; and the second metal layer is arranged on the second inorganic layer and is electrically connected with the first metal layer. According to the flexible display panel and the manufacturing method thereof, the two flexible substrate layers and the two metal layers are arranged and electrically connected, so that bending stress on the metal layers during bending is reduced, meanwhile, after any metal layer is broken, the other metal layer can still keep signal transmission, the reliability of a bending area is further improved, and the quality of the display panel is improved.

Description

Flexible display panel and manufacturing method thereof
Technical Field
The invention relates to the technical field of display, in particular to a flexible display panel and a manufacturing method thereof.
Background
In the flat panel display technology, the OLED display panel receives wide attention and application with its advantages of high contrast, wide viewing angle, low power consumption, being able to realize bending, etc., and especially the bending property of the OLED display panel attracts the eyes of consumers, and as the technology becomes more mature, the flexible and foldable OLED display panel gradually becomes a new generation of display technology.
In the prior art, a flexible display panel needs to bend a bending area between a display area and a non-display area, but a large amount of metal wires for transmitting signals are integrated at the bending area of the display panel. The action of buckling and the folding in-process of fixing to the display panel back, the metal of buckling zone is walked the line and also can follow and buckle, because the effect of the stress of buckling leads to the metal wire fracture easily or the problem of microcrack appears to cause the signal to lose to ally oneself with and show badly, seriously reduce the yield and the quality of product.
Therefore, it is necessary to provide a new flexible display panel and a method for manufacturing the same to solve the above technical problems.
Disclosure of Invention
The embodiment of the application provides a flexible display panel and a manufacturing method thereof, and aims to solve the technical problems that when metal wiring in a bending area of an existing flexible display panel is bent for multiple times or is kept in a bending state for a long time, microcracks or fractures occur in metal lines due to the effect of bending stress, and then signal loss and poor display are caused.
In order to solve the above problem, an embodiment of the present application provides a flexible display panel, including:
a first flexible substrate layer;
a first inorganic layer disposed on the first flexible substrate layer;
the first metal layer is arranged on the first inorganic layer and covers part of the first inorganic layer;
a second flexible substrate layer covering the first inorganic layer and the first metal layer;
a second inorganic layer disposed on the second flexible substrate layer;
and the second metal layer is arranged on the second inorganic layer and is electrically connected with the first metal layer.
In some embodiments, at least one through via is disposed on the second inorganic layer and the second flexible substrate layer, a conductor is disposed in the through via, and the second metal layer is electrically connected to the first metal layer through the conductor in the through via.
In some embodiments, the flexible display panel includes a bending region and a non-bending region, and the via hole is located in the non-bending region.
In some embodiments, the first metal layer includes a first metal line, the second metal layer includes a second metal line, and the first metal line is electrically connected to the second metal line.
In some embodiments, the number of the first metal lines is a plurality of first metal lines, the plurality of first metal lines are spaced apart from each other, the number of the second metal lines is a plurality of second metal lines, the plurality of second metal lines are spaced apart from each other, and each of the first metal lines is electrically connected to one of the second metal lines.
In some embodiments, each of the first metal lines includes a plurality of first sub-lines connected in parallel with each other, and each of the second metal lines includes a plurality of second sub-lines connected in parallel with each other.
In some embodiments, ends of a plurality of first sub-wires of each of the first metal wires are connected together, and ends of a plurality of second sub-wires of each of the second metal wires are connected together.
The embodiment of the present application further provides a method for manufacturing a flexible display panel, including:
providing a first flexible substrate layer;
disposing a first inorganic layer on the first flexible substrate layer;
disposing a first metal layer on the first inorganic layer, the first metal layer covering a portion of the first inorganic metal layer;
providing a second flexible substrate layer on the first metal layer and the first inorganic layer not covered by the first metal layer;
disposing a second inorganic layer on the second flexible substrate layer;
and arranging a second metal layer on the second inorganic layer, wherein the second metal is electrically connected with the first metal layer.
In some embodiments, after disposing the first metal layer on the first inorganic layer, further comprising:
and etching the first metal layer to form a first metal circuit.
In some embodiments, after disposing the second metal layer on the second inorganic layer, the method further comprises:
and etching the second metal layer to form a second metal circuit.
The embodiment of the application provides a flexible display panel and a manufacturing method thereof, and the flexible display panel is provided with two flexible substrate layers and two metal layers, wherein the two metal layers are electrically connected, so that the reliability of a metal layer in a bending area is improved, the bending stress of the metal layer during bending is reduced, meanwhile, after any metal layer is broken, the other metal layer still can keep signal transmission, the problem that signals cannot be transmitted due to microcracks or breakage of the metal layer during bending is solved, and the yield and the quality of the display panel are improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, wherein like reference numerals represent like parts in the following description.
Fig. 1 is a schematic diagram of a film layer of a flexible display panel according to an embodiment of the present invention.
Fig. 2 is a first schematic diagram of a first metal line of the first metal layer shown in fig. 1.
Fig. 3 is a first schematic diagram of a second metal line of the second metal layer shown in fig. 1.
Fig. 4 is a second schematic diagram of the first metal line of the first metal layer shown in fig. 1.
Fig. 5 is a second schematic diagram of a second metal line of the second metal layer shown in fig. 1.
Fig. 6 is a third schematic diagram of the first metal line of the first metal layer shown in fig. 1.
FIG. 7 is a third schematic diagram of a second metal line of the second metal layer shown in FIG. 1.
Fig. 8 is a schematic flow chart of a method for manufacturing a flexible display panel according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present application.
To current flexible display panel, because the metal of a large amount of transmission signals is walked the integration and is located at display panel's bending zone, at the action of buckling and folding the in-process of fixing to the display panel back, the metal of bending zone is walked and also can be followed and is buckled, thereby because the effect of the stress of buckling leads to the metal wire fracture or the microcrack appears and cause the signal to lose the antithetical couplet and show badly, this application embodiment can solve this defect.
Referring to fig. 1, fig. 1 is a schematic diagram of a film layer of a flexible display panel according to an embodiment of the present invention. The flexible display panel provided by the embodiment of the application has the bending area 20 and the non-bending area 30, the non-bending area 30 may be a display area or an area without bending, and the bending area 20 may be a binding area connected with the display area.
The flexible display panel includes: a first flexible substrate layer 11; a first inorganic layer 12 disposed on the first flexible base layer 11; a first metal layer 13 arranged on a side of the first inorganic layer 12 facing away from the first flexible substrate layer 11, the first metal layer 13 covering a part of the first inorganic layer 12; a second flexible base layer 14 covering the first inorganic layer 12 and the first metal layer 13; a second inorganic layer 15 disposed on the second flexible substrate layer 14; a second metal layer 16 arranged on the side of the second inorganic layer 15 facing away from the second flexible substrate layer 14. The second metal layer 16 is electrically connected to the first metal layer 13.
In practical applications, the first flexible base layer 11 is disposed on a glass substrate, and the material of the first flexible base layer 11 may be at least one of PI (polyimide), PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PC (polycarbonate), PES (polyethersulfone), PAR (aromatic fluorotoluene containing polyarylate), or PCO (polycyclic olefin). Preferably, the material of the first flexible substrate layer 11 is PI (polyimide), which may be common type polyimide or photosensitive type polyimide.
In the embodiment of the present application, the film thickness of the first flexible substrate layer 11 ranges from 3 to 20 μm.
And a first inorganic layer 12 disposed on a side of the first flexible substrate layer 11 facing away from the glass substrate, wherein the first inorganic layer 12 may be made of silicon nitride, silicon oxide, or silicon oxynitride. Because the first inorganic layer 12 has high compactness, water vapor and oxygen can be well isolated, the water vapor and the oxygen in the air are prevented from permeating from the side surface of the flexible substrate, and the water and oxygen corrosion resistance of the display panel is improved.
In the embodiment, the thickness of the first inorganic layer 12 is in the range of 0.1 to 2 μm.
A first metal layer 13, arranged on a side of the first inorganic layer 12 facing away from the first flexible substrate layer 11, and covering a part of the first inorganic layer 12. The first metal layer 13 may be made of conductive material such as MoTi, MoTiCu, Cu, Al, or the like. In the embodiment of the present application, the thickness of the first metal layer 13 is in a range of 0.01 to 1 μm.
The second flexible base layer 14 covers the first inorganic layer 12 and the first metal layer 13, and the material of the second flexible base layer 14 may be the same as the first flexible base layer 11 or may be different from the first flexible base layer 11. In the embodiment of the present application, the second flexible substrate layer 14 is made of PI (polyimide), which may be a common polyimide or a photosensitive polyimide, and the thickness of the second flexible substrate layer 14 is 3 to 10 μm. Preferably, the film thickness of the second flexible substrate layer 14 is smaller than the film thickness of the first flexible substrate layer 11. Illustratively, the film thickness of the first flexible substrate layer 11 is set to 10 microns and the film thickness of the second flexible substrate layer 14 is set to 5 microns.
It should be noted that, in the embodiment of the present application, two stacked flexible base layers are used as the substrate, so that the bearing capacity of the substrate can be improved, the tensile force can be slowed down, and the base plate structure can be prevented from being damaged.
It can be understood that the first metal layer 13 is located between two flexible substrate layers, the first inorganic layer 12 is disposed on the first flexible substrate layer 11, the first metal layer 13 is disposed on a side of the first inorganic layer 12 departing from the first flexible substrate layer 11, and the adhesion between the first metal layer 13 and the first inorganic layer 12 is stronger, so as to prevent the first metal layer 13 from falling off.
With continued reference to fig. 1, a second inorganic layer 15 is disposed on the second flexible substrate layer 14. The material of the second inorganic layer 15 may be the same as the material of the first inorganic layer 12, or may be different from the material of the first inorganic layer 12, in this embodiment, the material of the second inorganic layer 15 is silicon nitride or silicon oxide, and the film thickness of the second inorganic layer 15 is in a range of 0.1 to 2 μm.
And a second metal layer 16 disposed on a side of the second inorganic layer 15 away from the second flexible substrate layer 14, in this embodiment, the second metal layer 16 is made of the same material as the first metal layer 13, and a thickness of the second metal layer 16 ranges from 0.01 to 1 μm. The second metal layer 16 is electrically connected to the first metal layer 13.
It can be understood that the second inorganic layer 15 is disposed to further improve the resistance to water and oxygen erosion of the flexible display panel, and the second metal layer 16 is disposed on a side of the second inorganic layer 15 away from the second flexible substrate layer 14, so that the adhesion between the second metal layer 16 and the second inorganic layer 15 is stronger, and the second metal layer 16 can be prevented from falling off.
In the embodiment of the present application, at least one through hole is disposed on the second flexible substrate layer 14 and the second inorganic layer 15, a conductor is disposed in the through hole, and the second metal layer 16 is electrically connected to the first metal layer 13 through the conductor in the through hole. It will also be appreciated that vias extend through the second inorganic layer 15 and the second flexible substrate layer 14 and expose the first metal layer 13 at the location of the vias, thereby forming pads for the first metal layer 13. The metal conductor of the second metal layer 16 may be filled in the via hole and contact the pad, thereby electrically connecting the second metal layer 16 and the first metal layer 13.
It should be noted that the via is disposed in the non-bending region 30 to avoid the via from cracking during bending, which results in poor contact between the first metal layer 13 and the second metal layer 16, and further affects electrical conduction between the first metal layer 13 and the second metal layer 16.
Referring to fig. 1, the bending region 20 sequentially includes, from bottom to top, a first flexible substrate layer 11, a first inorganic layer 12, a first metal layer 13, a second flexible substrate layer 14, a second inorganic layer 15, and a second metal layer 16 according to a film forming sequence; the first metal layer 13 and the second metal layer 16 are electrically connected to each other, so as to perform signal transmission. The bending region 20 may be formed by a double-layer metal on part or all of the data signal lines, so as to prevent a metal layer in a data signal line at a certain position from being broken due to bending and then failing to transmit data. Through setting up the two-layer metal that switches on each other, reduce because of the cracked risk of bending stress lead to the metal level, improve the reliability of bending zone 20, and then improve flexible display panel's yield and quality.
Furthermore, bending zone 20 keeps two-layer flexible stratum basale, not only can improve bending zone 20's performance, reduces because of the cracked risk of bending stress lead to the metal level, but also can prevent that follow-up display panel from appearing the Mura phenomenon.
Referring to fig. 2 and 3, fig. 2 is a first schematic diagram of a first metal line of the first metal layer shown in fig. 1;
fig. 3 is a first schematic diagram of a second metal line of the second metal layer shown in fig. 1.
The first metal line 131 may be formed by etching the first metal layer 13, the second metal line 161 may be formed by etching the second metal layer 16, and the first metal line 131 and the second metal line 161 are electrically connected. The number of the first metal lines 131 is multiple, and the multiple first metal lines 131 are spaced from each other; the number of the second metal lines 161 is multiple, the second metal lines 161 are spaced from each other, and each of the first metal lines 131 is electrically connected to one of the second metal lines 161.
A first hollow area 132 is disposed between adjacent first metal lines 131, and a metal layer of the first hollow area 132 is etched away. Each first metal wire 131 includes a first wire body 1311 and a first connection portion 1312; second hollow areas 162 are disposed between adjacent second metal lines 161, metal layers of the second hollow areas 162 are also etched away, and each second metal line 161 includes a second line body 1611, a second connection portion 1612 and a third connection portion 1613. The first connection portion 1312 and the second connection portion 1612 are electrically connected through a through via disposed on the second flexible substrate layer 14 and the second inorganic layer 15, and the third connection portion 1613 is connected to an external circuit.
It should be noted that the first circuit body 1311 and the second circuit body 1611 are located in the bending region 20, and the first connection portion 1312, the second connection portion 1612 and the third connection portion 1613 are located in the non-bending region 30. When buckling flexible display panel, through setting up the two-layer metal circuit that switches on each other to the metal circuit of preventing a certain layer can't carry out signal transmission because of buckling after the fracture. For example, when the first circuit body 1311 is partially broken, the second circuit body 1611 may still transmit signals, or when the second circuit body 1611 is partially broken, the first circuit body 1311 may still transmit signals, so as to improve the stability of the metal circuit transmitting signals, improve the reliability of the bending region 20, and further improve the yield and quality of the flexible display panel.
Referring to fig. 4 to 7, fig. 4 is a second schematic diagram of the first metal line of the first metal layer shown in fig. 1, fig. 5 is a second schematic diagram of the second metal line of the second metal layer shown in fig. 1, fig. 6 is a third schematic diagram of the first metal line of the first metal layer shown in fig. 1, and fig. 7 is a third schematic diagram of the second metal line of the second metal layer shown in fig. 1.
As shown in fig. 4 and 5, the first circuit body 1311 includes a plurality of first sub-circuits connected to each other, and as shown in fig. 4 and 5, the first circuit body 1311 includes a first sub-circuit 13111 and a second sub-circuit 13112, the two first sub-circuits are hinged to each other in a crossing manner to form a parallel telescopic structure or a double spiral structure, end portions of the two first sub-circuits are connected together and are connected to and conducted with the first connection portion 1312, and the first hollow area 132 is located between the two first sub-circuits. In the embodiment of the present application, the first hollow-out area 132 is a hexagon.
The second line body 1611 includes a first second sub-line 16111 and a second sub-line 16112, the two second sub-lines are hinged in a crossing manner to form a parallel telescopic structure or a double-spiral structure, the ends of the two second sub-lines are connected together and connected to and conducted with the second connection portion 1612, and the second hollow region 162 is located between the two second sub-lines. In the embodiment of the present application, the second hollow-out region 162 is a hexagon.
In other embodiments, the first and second hollow-out regions 132 and 162 may be in the shape of a diamond, a circle, a parallelogram, a rectangle, or the like. The shape of the first hollow area 132 may be the same as the shape of the second hollow area 162, or may be different from the shape of the second hollow area 162.
Through setting up two interconnect's sub-circuit, and two sub-circuits form parallelly connected extending structure or double helix structure, can improve first line body 1311 and second line body 1611's pliability, can effectively avoid first line body 1311 and second line body 1611 stress concentration or inhomogeneous problem in bending zone 20, it is less to make metal line's the stress of buckling at the in-process of buckling, reduces the cracked risk of metal line to metal line's pliability has been improved. In addition, one part of the parallel structures is broken, the other part of the parallel structures can still conduct electricity to transmit signals, the stability of the metal lines for transmitting the signals is further improved, and meanwhile, the risk of signal transmission interruption caused by breakage or microcracks of the metal lines in the bending process is further reduced because the first line body 1311 and the second line body 1611 are also in the parallel structures.
As shown in fig. 6 and 7, the first circuit body 1311 includes a first sub-circuit 13111, a second sub-circuit 13112, and a third sub-circuit 13113, the three sub-circuits are hinged to each other in a crossing manner to form a parallel telescopic structure, ends of the three sub-circuits are connected together and are connected to and conducted with the first connection portion 1312, and the first hollow area 132 is located between every two sub-circuits. The second line body 1611 includes a first second sub-line 16111, a second sub-line 16112, and a third second sub-line 16113, the three second sub-lines are hinged in a crossing manner to form a parallel telescopic structure, end portions of the three second sub-lines are connected together and connected to the second connection portion 1612, and the second hollow region 162 is located between every two second sub-lines.
Through setting up many interconnect's sub-circuit, and many sub-circuits form parallelly connected extending structure, can improve first line body 1311 and second line body 1611's pliability, effectively avoid first line body 1311 and second line body 1611 stress concentration or inhomogeneous problem in the district 20 of buckling to make metal line's the stress of buckling less in the messenger buckles, reduce the cracked risk of metal line, thereby improved metal line's pliability. In addition, one part of the parallel structures is broken, the other part of the parallel structures can still conduct electricity to transmit signals, the stability of the metal lines for transmitting the signals is further improved, and meanwhile, the risk of signal transmission interruption caused by breakage or microcracks of the metal lines in the bending process is further reduced because the first line body 1311 and the second line body 1611 are also in the parallel structures.
Referring to fig. 8, fig. 8 is a schematic flow chart illustrating a method for manufacturing a flexible display panel according to an embodiment of the present invention.
The embodiment of the application further provides a manufacturing method of the flexible display panel, which comprises the following steps:
s1: providing a first flexible substrate layer 11;
the first flexible substrate layer 11 is uniformly coated on the glass substrate, and the material of the first flexible substrate layer 11 is PI (polyimide), which may be a common type polyimide or a photosensitive type polyimide. The film thickness of the first flexible substrate layer 11 is in the range of 3 to 20 μm.
S2: providing a first inorganic layer 12 on the first flexible substrate layer 11;
a first inorganic layer 12 is formed on the first flexible substrate layer 11 using a chemical vapor deposition method. The material of the first inorganic layer 12 may be silicon nitride, silicon oxide, or silicon oxynitride. The thickness of the first inorganic layer 12 is 0.1 to 2 μm. The first inorganic layer 12 has high compactness, can better isolate water vapor and oxygen, prevents the water vapor and the oxygen in the air from permeating from the side surface of the flexible substrate, and improves the water and oxygen corrosion resistance of the display panel.
S3: disposing a first metal layer 13 on the first inorganic layer 12, the first metal layer 13 covering a portion of the first inorganic layer 12;
a first metal layer 13 is deposited on the first inorganic layer 12 using chemical vapor deposition. The first metal layer 13 may be made of conductive material such as MoTi, MoTiCu, Cu, Al, or the like. The thickness of the first metal layer 13 is in the range of 0.01 to 1 μm.
S4: providing a second flexible substrate layer 14 on the first metal layer 13 and the first inorganic layer 12 not covered by the first metal layer 13;
the second flexible substrate layer 14 is disposed on the first metal and the first inorganic layer 12 not covered by the first metal layer 13, and the material of the second flexible substrate layer 14 is PI (polyimide), which may be a common type polyimide or a photosensitive type polyimide. The second flexible substrate layer 14 has a film thickness in the range of 3 to 20 μm. At the same time, the second flexible substrate layer 14 is etched and at least one via is formed.
Preferably, the film thickness of the second flexible base layer 14 is smaller than the film thickness of the first flexible base layer 11, for example, the film thickness of the first flexible base layer 11 is 10 micrometers, and the film thickness of the second flexible pole layer is 5 micrometers.
S5, disposing a second inorganic layer 15 on the second flexible substrate layer 14;
a second inorganic layer 15 is formed on the second flexible substrate layer 14 using a chemical vapor deposition process. The material of the second inorganic layer 15 may be silicon nitride, silicon oxide, or silicon oxynitride. The second inorganic layer 15 has a film thickness in the range of 0.1 to 2 μm. The second inorganic layer 15 has high compactness, can better isolate water vapor and oxygen, prevent the water vapor and the oxygen in the air from permeating from the side surface of the flexible substrate, and improve the water and oxygen corrosion resistance of the display panel. At the same time, the second inorganic layer 15 is etched and at least one via is formed, the via penetrating through the second inorganic layer 15 and the second flexible substrate layer 14.
S6: a second metal layer 16 is disposed on the second inorganic layer 15, and the second metal is electrically connected to the first metal layer 13.
A second metal layer 16 is deposited on the second inorganic layer 15 by chemical vapor deposition, and the second metal is electrically connected to the first metal layer 13. The second metal layer 16 may be made of conductive material such as MoTi, MoTiCu, Cu, Al, etc. The thickness of the second metal layer 16 is in the range of 0.01 to 1 μm. Preferably, the material of the second metal layer 16 is the same as that of the first metal layer 13.
In the embodiment of the present application, at least one through hole is formed on the second flexible substrate layer 14 and the second inorganic layer 15, a conductor is disposed in the through hole, and the second metal layer 16 is electrically connected to the first metal layer 13 through the conductor in the through hole. It will also be appreciated that vias extend through the second inorganic layer 15 and the second flexible substrate layer 14 and expose the first metal layer 13 at the location of the vias, thereby forming pads for the first metal layer 13. The metal conductor of the second metal layer 16 may be filled in the via hole and contact the pad, thereby electrically connecting the second metal layer 16 and the first metal layer 13.
In the embodiment of the present application, after disposing the first metal layer 13 on the first inorganic layer 12, the method further includes: the first metal layer 13 is etched to form a first metal line 131.
After the first metal layer 13 is etched, a plurality of first metal lines 131 are formed, and the plurality of first metal lines 131 are spaced from each other.
In the embodiment of the present application, after disposing the second metal layer 16 on the second inorganic layer 15, the method further includes: the second metal layer 16 is etched to form a second metal line 161, and the second metal line 161 is electrically connected to the first metal line 131.
After the second metal layer 16 is etched, a plurality of second metal lines 161 are formed, the plurality of second metal lines 161 are spaced from each other, and each of the first metal lines 131 is electrically connected to one of the second metal lines 161. Therefore, the first metal line 131 and the second metal line 161 are electrically connected in parallel. Through setting up the two-layer parallelly connected metal circuit that switches on each other to the metal circuit of preventing a certain layer can't carry out signal transmission after breaking because of buckling, thereby promotes the stability of metal circuit transmission signal, and improves the reliability of bending zone 20, and then improves flexible display panel's yield and quality.
The embodiment of the application provides a flexible display panel and preparation scheme thereof, through setting up two-layer flexible stratum basale and two-layer metal level, and two-layer metal level electric connection, can improve the reliability of bending district metal level, reduce the bending stress that the metal level received when buckling, simultaneously, arbitrary metal level fracture back, another metal level still can keep signal transmission, thereby solve the metal level and appear the problem that the unable transmission of signal that crazing line or fracture caused in the bending process, improve display panel's yield and quality.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments. In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features.
The flexible display panel and the manufacturing method thereof provided by the embodiment of the present application are described in detail above, and a specific example is applied in the description to explain the principle and the embodiment of the present application, and the description of the embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (10)

1. A flexible display panel, comprising:
a first flexible substrate layer;
a first inorganic layer disposed on the first flexible substrate layer;
the first metal layer is arranged on the first inorganic layer and covers part of the first inorganic layer;
a second flexible substrate layer covering the first inorganic layer and the first metal layer;
a second inorganic layer disposed on the second flexible substrate layer;
and the second metal layer is arranged on the second inorganic layer and is electrically connected with the first metal layer.
2. The flexible display panel of claim 1, wherein the second inorganic layer and the second flexible substrate layer have at least one via hole formed therethrough, wherein a conductor is disposed in the via hole, and the second metal layer is electrically connected to the first metal layer through the conductor in the via hole.
3. The flexible display panel of claim 2, wherein the flexible display panel comprises a bending region and a non-bending region, and the via hole is located in the non-bending region.
4. The flexible display panel according to any one of claims 1 to 3, wherein the first metal layer comprises a first metal line, the second metal layer comprises a second metal line, and the first metal line is electrically connected to the second metal line.
5. The flexible display panel according to claim 4, wherein the number of the first metal lines is a plurality of first metal lines, the plurality of first metal lines are spaced apart from each other, the number of the second metal lines is a plurality of second metal lines, the plurality of second metal lines are spaced apart from each other, and each of the first metal lines is electrically connected to one of the second metal lines.
6. The flexible display panel of claim 5, wherein each of the first metal lines comprises a plurality of first sub-lines connected in parallel with each other, and wherein each of the second metal lines comprises a plurality of second sub-lines connected in parallel with each other.
7. The flexible display panel of claim 6, wherein ends of a plurality of first sub-lines of each of the first metal lines are connected together and ends of a plurality of second sub-lines of each of the second metal lines are connected together.
8. A method for manufacturing a flexible display panel is characterized by comprising the following steps:
providing a first flexible substrate layer;
disposing a first inorganic layer on the first flexible substrate layer;
disposing a first metal layer on the first inorganic layer, the first metal layer covering a portion of the first inorganic metal layer;
providing a second flexible substrate layer on the first metal layer and the first inorganic layer not covered by the first metal layer;
disposing a second inorganic layer on the second flexible substrate layer;
and arranging a second metal layer on the second inorganic layer, wherein the second metal is electrically connected with the first metal layer.
9. The method of claim 8, wherein after disposing the first metal layer on the first inorganic layer, further comprising:
and etching the first metal layer to form a first metal circuit.
10. The method for manufacturing a flexible display panel according to claim 8 or 9, wherein after the disposing the second metal layer on the second inorganic layer, the method further comprises:
and etching the second metal layer to form a second metal circuit.
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CN108598142A (en) * 2018-06-28 2018-09-28 上海天马微电子有限公司 Flexible display substrates, flexible display panels and flexible display apparatus
CN110071124A (en) * 2019-04-22 2019-07-30 武汉华星光电半导体显示技术有限公司 Display panel and preparation method thereof
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Publication number Priority date Publication date Assignee Title
CN106783872A (en) * 2016-11-28 2017-05-31 友达光电(昆山)有限公司 A kind of flexible display panels
CN108389869A (en) * 2018-03-01 2018-08-10 上海天马微电子有限公司 Flexible display panels
CN108598142A (en) * 2018-06-28 2018-09-28 上海天马微电子有限公司 Flexible display substrates, flexible display panels and flexible display apparatus
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