CN110071093A - Display panel - Google Patents
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- CN110071093A CN110071093A CN201810062069.5A CN201810062069A CN110071093A CN 110071093 A CN110071093 A CN 110071093A CN 201810062069 A CN201810062069 A CN 201810062069A CN 110071093 A CN110071093 A CN 110071093A
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- Prior art keywords
- bit patterns
- length
- pair
- display panel
- line segment
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a kind of display panels, and wherein first substrate is provided with multiple first pair of bit patterns in non-display area, each first pair of bit patterns has the first part being connected to each other and second part.The light shield layer of the second substrate has multiple second pair of bit patterns in non-display area, each second pair of bit patterns has Part III and Part IV.The length of each first part in a first direction differs the first length difference with the length of corresponding Part III in a first direction, and the first length difference is differing from each other.The length of each second part in a second direction differs the second length difference with the length of corresponding Part IV in a second direction, and the second length difference is differing from each other.Whereby, by the way that bit patterns may determine that with the displacement between substrate.
Description
Technical field
The invention relates to a kind of display panels, and can assist the aobvious of upper and lower base plate contraposition in particular to one kind
Show panel.
Background technique
In general, display panel includes two substrates, and one of substrate (also referred to as array substrate) includes picture
Pixel array, another substrate include color filter (color filter, CF) and black matrix" (black matrix) etc..
After the two substrate in batch found (assemble), it is necessary to judge the contraposition feelings between the two substrates by some mechanism
Shape.In some embodiments, it can extraly be arranged in the non-display area of display panel to bit patterns and judge that two substrates exist
Displacement after group is vertical, however since current industry is directed towards narrow margo frontalis (narrow border) development, it is above-mentioned additional
Bit patterns will limit with the diminution of margo frontalis.How this is solved the problems, such as, thus field technical staff subject under discussion of concern.
Summary of the invention
The purpose of the present invention is to provide a kind of display panels, without in the additional installation space configuration contraposition of display panel
Pattern and contraposition ruler.
The embodiment of the present invention proposes a kind of display panel, has viewing area and non-display area.Display panel includes first
Substrate and the second substrate.Metal layer is set on first substrate, this metal layer has multiple first pair of bitmap in non-display area
Case, each first pair of bit patterns have the first part being connected to each other and second part.Light shield layer is set to the second base
On plate, this light shield layer has multiple second pair of bit patterns in non-display area, each second pair of bit patterns has Part III
And Part IV.Second pair of bit patterns is to be respectively corresponding to first pair of bit patterns, and Part III is corresponding respectively to first
Point, and Part IV is corresponding respectively to second part.The length of each first part in a first direction with it is corresponding
The length of Part III in a first direction differs the first length difference, and the first length difference is differing from each other.Each second
Length difference second length difference of the length of part in a second direction with corresponding Part IV in a second direction, and the
Two length differences are differing from each other.Light shield layer has multiple openings in non-display area, and opening covers first pair of bit patterns and the
Two pairs of bit patterns.
In some embodiments, first part is the first metal wire extended toward second direction, and second part is toward first
The second metal wire that direction extends, the first metal wire and the second metal wire are connected to each other.
In some embodiments, Part III extends toward second direction, and Part IV extends toward first direction.
In some embodiments, each first pair of bit patterns also has the Part V and Part VI being connected to each other,
Part V extends toward the direction relative to second direction, and Part VI extends toward the direction relative to first direction.
In some embodiments, each second pair of bit patterns also has Part VII and Part VIII, and Part VII is past
Direction relative to second direction extends, and Part VIII extends toward the direction relative to first direction.
In some embodiments, the length of each Part V in a first direction is with corresponding Part VII first
Length on direction differs third length difference, and third length difference is differing from each other.Each Part VI is in second direction
On length and corresponding Part VIII length in a second direction differ the 4th length difference, and the 4th length difference is each other not
It is identical.
In some embodiments, above-mentioned multiple first pair of bit patterns are electrically connected to each other.
In some embodiments, light shield layer has frame portion, is set in non-display area, each second pair of bit patterns
There is gap area between frame portion.
In some embodiments, above-mentioned metal layer belongs to the first metal layer, and the second metal is additionally provided on first substrate
Layer, second metal layer include multiple thirds to bit patterns, and third is to be set to non-display area and be respectively corresponding to the to bit patterns
A pair of of bit patterns.
In some embodiments, each third is partly to be overlapped in corresponding first pair of bit patterns to bit patterns.
In some embodiments, each third to bit patterns include the first line segment and second line segment, the first line segment along
Second direction extends, and second line segment extends toward first direction.
In some embodiments, each length of the first line segment in a first direction is differing from each other, and each
The length of two line segments in a second direction is differing from each other.
In some embodiments, the first line segment is at least partially overlap on first part, and second line segment is at least partly
Ground is overlapped in second part.
In some embodiments, each third further includes third line segment and the 4th line segment to bit patterns, and third line segment is past
Direction relative to second direction extends, and the 4th line segment extends toward the direction relative to first direction.
In some embodiments, the length of each first part in a first direction is differing from each other, each second
The length of part in a second direction is differing from each other.
In some embodiments, the length of each Part III in a first direction is differing from each other, and each
The length of Part IV in a second direction is differing from each other.
In some embodiments, above-mentioned metal layer includes a plurality of first metal wire and a plurality of second metal wire, at least portion
The first metal wire divided intersects at least part of second metal wire.First pair of bit patterns is located at the first different metal wires
From the infall between the second different metal wires.
In some embodiments, the Part III in each second pair of bit patterns is connected with each other with Part IV.
In some embodiments, there is gap between the Part III and Part IV in each second pair of bit patterns.
In some embodiments, the length of the Part III in each second pair of bit patterns in a first direction be greater than pair
The length of first part in a first direction in the first pair of bit patterns answered.Part IV in each second pair of bit patterns exists
Length in second direction is greater than the length of second part in a second direction in corresponding first pair of bit patterns.
Compared with prior art, display panel of the invention can use the peripheral metal cabling setting in non-display area
Specifically have to judge displacement in x-direction and y-direction of the two substrates after group is vertical without non-aobvious to bit patterns
Show the additional installation space configuration in area to the beneficial effect of bit patterns and contraposition ruler.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and it is detailed to cooperate attached drawing to make
Carefully it is described as follows.
Detailed description of the invention
Fig. 1 is the top view that display panel is painted according to an embodiment.
Fig. 2A and Fig. 2 B is to be painted according to an embodiment to judge the schematic diagram being displaced between substrate according to bit patterns.
Fig. 3 is the top view being painted on first substrate to bit patterns according to an embodiment.
Fig. 4 is the top view being painted in the second substrate to bit patterns according to an embodiment.
Fig. 5 A and Fig. 5 B is the schematic top plan view being painted according to an embodiment by two substrate in batch after vertical.
Fig. 6 is the schematic top plan view being painted according to an embodiment by two substrate in batch after vertical.
Fig. 7 is the schematic top plan view being painted according to an embodiment by two substrate in batch after vertical.
Fig. 8 is the top view being painted in the first metal layer and second metal layer to bit patterns according to an embodiment.
Fig. 9 is the schematic top plan view being painted according to an embodiment by two substrate in batch after vertical.
Figure 10 is painted in non-display area according to an embodiment to the schematic diagram of the setting position of bit patterns.
Figure 11 is the schematic top plan view being painted according to an embodiment by two substrate in batch after vertical.
Specific embodiment
About " first " used herein, " second " ... etc., not refer in particular to the meaning of order or cis-position, only
In order to distinguish with the element of same technique term description or operation.
Fig. 1 is the top view that display panel is painted according to an embodiment.Fig. 1 is please referred to, display panel 100 has viewing area
110 with non-display area 120.There is multiple pixels, scan line and data line in viewing area 110.For example, pixel 130 includes
Thin film transistor (TFT) 131, the grid of thin film transistor (TFT) 131 are to be connected to scan line 132, and source electrode is to be connected to data line 133.So
And Fig. 1 is only an example, the present invention is not intended to limit the number of pixel in viewing area 110, structure and setting position, does not also limit
The shape of viewing area 110.
There is netted metal routing 122, these metal routings 122 can connect in some embodiments in non-display area 120
Any conducting wire (such as gate lines, data lines or touch-control sensing line) being connected in viewing area 110.Above-mentioned netted metal
Primarily in process because of the fitting demand of two plate bases, edge region needs to solidify with light binding work cabling 122,
This process needs certain light transmittance, therefore reticulates in peripheral wiring production with sharp light transmission.Letter is needed certain
Under the match condition of number line impedence, the matched demand of impedance can be also realized using netted cabling, especially in specific rule
The driving circuit of lattice may have this demand in the resistance value of signal wire.In Fig. 1, netted metal routing 122 is to be set to display
The lower section in area 110, but also can be set in other embodiments in top, right side, left side or any other position.These gold
Belonging to cabling 122 can be using redundancy (dummy) route that technique is made with along with, be also possible to be connected to driving circuit (figure
Do not show) cabling, driving circuit can be gate driving circuit, source electrode drive circuit or other suitable circuits.In some realities
It applies in example, driving circuit may be provided on bendable (flexible) circuit board, such as carry encapsulation (Tape in winding
Carrier Package, TCP) or crystal grain soft mode encapsulates on (Chip on Film, COF) or driving circuit also can be set
On thin film transistor base plate.In addition, driving circuit can be touch-control and (Touch and Display Driver is integrated in display
Integration, TDDI) single wafer, while the function of display and touch-control being provided.Alternatively, also may include in driving circuit
Multiple chips provide the function of display with touch-control respectively.Driving circuit is also possible to panel inner brake and driver (Gate-
Driver In Plane, GIP), integrate gate drivers (Integrated Gate Driver, IGD).In addition, driving circuit
Number can also be greater than one, be separately positioned on the upper and lower or left and right sides of panel, or the one of panel can also be positioned only at
Side.
In metal routing 122, the infall of horizontal wire and longitudinal metal line be provided with multiple pairs of bit patterns (such as
To bit patterns 141,142), these to bit patterns are arranged between two vertical substrates of opposite group, can be used to judge display surface
In plate 100 between two substrates displacement (but due to Fig. 1 be top view, only see overlapping to bit patterns).Citing comes
It says, Fig. 2A and Fig. 2 B is to be painted according to an embodiment to judge the schematic diagram being displaced between substrate according to bit patterns.It please refers to
Fig. 2A is provided with to bit patterns 141a, 142a on substrate 210, and is provided on substrate 220 to bit patterns 141b, 142b, these
Bit patterns can be formed by metal or other opaque materials.It is wherein big to the length of bit patterns 142a in the X direction
In the length to bit patterns 141a in the X direction.In fig. 2, right at this time there is no displacement between substrate 210 and substrate 220
The right hand edge of bit patterns 141b is the right hand edge being aligned in bit patterns 141a；And to the right hand edge of bit patterns 142b, there is no right
Right hand edge of the Qi Yu to bit patterns 142a, the two difference distance t.In fig. 2b, substrate 220 has been displaced distance t toward X-direction, this
When the right hand edge to bit patterns 141a is not aligned in the right hand edge of bit patterns 141b, the two differs distance t；And to bitmap
The right hand edge of case 142b is then aligned in the right hand edge to bit patterns 142a.Therefore, it if observing the situation of Fig. 2 B, may determine that
Substrate 220 is for substrate 210 out, it will be appreciated that has been displaced distance t at toward X-direction.In other words, since these are to bit patterns
Position with length be it is known that therefore have the situation being aligned to bit patterns by observing which group, can judge X-direction or
Displacement in Y-direction.Specifically, what following embodiment was proposed can measure in X-direction and Y-direction bit patterns simultaneously
Displacement.
The material of above-mentioned substrate 210 and/or substrate 220 is for example including glass, polymer (polymer), poly- pair
Polyethylene terephthalate (polyethylene terephthalate, PET), gathers polycarbonate (polycarbonate, PC)
Ether sulfone (polyether sulfone, PES), Triafol T (triacetyl cellulose, TAC), polymethyl
Sour methyl esters (PMMA), polyethylene (polyethylene), cyclic olefin polymer (COP), polyimide (polyimide, PI), with
And the composite material etc. that polycarbonate (PC) and polymethyl methacrylate (PMMA) are constituted, the present invention is simultaneously not subject to the limits.This
Outside, substrate 210 is also referred to as lower substrate either array substrate, and substrate 220 is also referred to as upper substrate or colorized optical filtering chip base
Plate.
Fig. 3 is the top view being painted on first substrate to bit patterns according to an embodiment.Referring to figure 3., in substrate 210
It is provided in non-display area on (not being illustrated in Fig. 3) to bit patterns 310,320,330,340 (also referred to as first pair of bit patterns),
These are to be arranged in a metal layer and be located at the netted metal routing area in periphery to bit patterns, this metal layer is, for example, first
Metal layer.Each has four parts being connected to each other to bit patterns 310,320,330,340.Specifically, to bitmap
Case 310 has the first part 311 being connected to each other, second part 312, Part V 315 and Part VI 316；To bit patterns
320 have the first part 321 being connected to each other, second part 322, Part V 325 and Part VI 326；To bit patterns 330
With first part 331, second part 332, Part V 335 and the Part VI 336 being connected to each other；Have to bit patterns 340
There are the first part 341 being connected to each other, second part 342, Part V 345 and Part VI 346.First part 311,321,
331,341 be to extend along the Y direction, but length in the X direction is different from each other and towards gradually increasing in X-direction；Second
Points 312,322,332,342 be extend along the X direction, but length in the Y direction it is different from each other and towards in -Y direction gradually
Increase；Part V 315,325,335,345 be extend along -Y direction, but length in the X direction it is different from each other and towards-
It is gradually increased in X-direction；Part VI 316,326,336,346 is to extend along -X direction, but length in the Y direction is each other
It is different and towards gradually increasing in Y-direction.
To bit patterns 310,320,330,340 be electrically connected to each other by metal wire 350, wherein second part 312,
322,332,342 and Part VI 316,326,336,346 all be arranged on metal wire 350.In addition, first part 311 with
Part V 315 is arranged on metal wire 361；First part 321 and Part V 325 are arranged on metal wire 362；The
A part 331 with Part V 335 is arranged on metal wire 363；First part 341 and Part V 345 are arranged in gold
Belong on line 364.Metal wire 350 and metal wire 361~364 are to be connected to each other.
Fig. 4 is the top view being painted in the second substrate to bit patterns according to an embodiment.Referring to figure 4., substrate 220 is not (
Be illustrated in Fig. 4) on be provided with light shield layer BM.In the display area, light shield layer BM is this screening to cover scan line and data line etc.
Photosphere BM is, for example, black matrix" (black matrix) or other opaque materials.Light shield layer BM has in non-display area
Frame portion 402, frame portion 402 have been respectively included to bit patterns 420,430,440,450 (also referred to as second pair of bit patterns), on
It states and opening 411~414 is respectively provided with to bit patterns.Be open 411~414 cover in the range of each to bit patterns 420,
430, there is gap area (such as gap area 403) between 440,450 and frame portion 402.It include to bit patterns 420
Three parts 423, Part IV 424, Part VII 427 and Part VIII 428；To bit patterns 430 include Part III 433,
Part IV 434, Part VII 437 and Part VIII 438；It include Part III 443, Part IV to bit patterns 440
444, Part VII 447 and Part VIII 448；It include Part III 453, Part IV 454, the 7th to bit patterns 450
Divide 457 and Part VIII 458.
In the fig. 4 embodiment, Part III 423,433,443,453 is past Y-direction extension, and in the X direction
Length is all；Part IV 424,434,444,454 is to extend toward X-direction, and length in the Y direction is all；7th
Part 427,437,447,457 is to extend toward -Y direction, and length in the X direction is all；Part VIII 428,438,
448,458 be to extend toward -X direction, and length in the Y direction is all.
Referring to figure 3. with Fig. 4, be respectively to bit patterns 310,320,330,340 it is corresponding to bit patterns 420,430,
440,450.Specifically, Part III 423,433,443,453 is to be respectively corresponding to first part 311,321,331,341；
Part IV 424,434,444,454 is to be respectively corresponding to second part 312,322,332,342；Part VII 427,437,
447,457 be to be respectively corresponding to Part V 315,325,335,345；Part VIII 428,438,448,458 is to respectively correspond
To Part VI 316,326,336,346.Due to each section in bit patterns 310,320,330,340 in X-direction or Y-direction
Length can gradually change, therefore can judge two substrates whereby by judging which group is to be in alignment with each other to bit patterns
Between displacement.Specifically, referring to figure 3., Fig. 4, Fig. 5 A, Fig. 5 A is to be painted two substrate in batch standing it according to an embodiment
Schematic top plan view afterwards.For simplicity, the symbol of various pieces is not indicated in fig. 5, these symbols please refer to
Fig. 3 and Fig. 4.Opening 411~414 in light shield layer BM is also covered respectively to bit patterns 310,320,330 and 340.From Fig. 5 A
As can be seen that each length of first part 311,321,331,341 in the X direction and corresponding Part III 423,433,
443,454 length in the X direction differs the first length difference, and these first length differences are not identical.For example, first
Part 311 and the length difference of Part III 423 in the X direction are relatively smaller, and first part 341 and Part III 453 are in X
Length difference on direction is then relatively larger, and so on.On the other hand, each second part 312,322,332,342 is in Y
Length on direction differs the second length difference with the length of corresponding Part IV 424,434,444,454 in the Y direction, and
These second length differences are not identical.For example, second part 312 is opposite with the length difference of Part IV 424 in the Y direction
Ground is smaller, and second part 342 and the length difference of Part IV 454 in the Y direction are then relatively larger.Each Part V
315, length of 325,335,345 length in the X direction with corresponding Part VII 427,437,447,457 in the X direction
Third length difference is differed, and these third length differences are not identical.For example, Part V 315 and Part VII 427 exist
Length difference in X-direction is relatively smaller, and Part V 345 and the length difference of Part VII 457 in the X direction are then relatively
It is larger.Each length of Part VI 316,326,336,346 in the Y direction and corresponding Part VIII 428,438,448,
458 length in the Y direction differs the 4th length difference, and these the 4th length differences are not identical.For example, Part VI
316 is relatively smaller with the length difference of Part VIII 428 in the Y direction, and Part VI 346 and Part VIII 458 are in X-direction
On length difference it is then relatively larger.
About the displacement in X-direction, can by judge which group first part be aligned to corresponding Part III come
It determines；It, can be by judging which group Part V is to be aligned to corresponding Part VII to determine about the displacement in -X direction
It is fixed；It, can be by judging which group Part VI is to be aligned to corresponding Part VIII to determine about the displacement in Y-direction；
It, can be by judging which group second part is to be aligned to corresponding Part IV to determine about the displacement in -Y direction.It lifts
For example, to bit patterns 310 and to the group Rob Roy interpretation of bit patterns 420 in the embodiment of Fig. 5 A: the right of first part 311
The right hand edge of edge and Part III 423 is vertically aligned；The lower edge of second part 312 and the lower edge of Part IV 424
It is to be horizontally aligned；The left edge of Part V 315 and the left edge of Part VII are vertically aligned；Part VI 316
Top edge and the top edge of Part VIII 428 are to be horizontally aligned.It follows that may determine that between two substrates not
Displacement.Fig. 5 B is the schematic top plan view being painted according to an embodiment by two substrate in batch after vertical.Referring to figure 3., Fig. 4 and figure
5B does not similarly for simplicity indicate the symbol of various pieces in figure 5B.For example, in the reality of Fig. 5 B
It applies in example, the right hand edge between the right hand edge and Part III 443 of first part 331 is vertically aligned；Second part 312
The lower edge of lower edge and Part IV 424 is to be horizontally aligned；The top edge of Part VI 316 is upper with Part VIII 428
Edge is to be horizontally aligned.In this way, may determine that upper substrate 220 has the displacement in X-direction relative to lower substrate 210,
And it is not displaced in the Y direction.If each length of first part 311,321,331,341 in the X direction be with
It is incrementally increased every t, then in the embodiment of Fig. 5 B, upper substrate 220 has twice of interval relative to lower substrate 210 in the X direction
The displacement of 2t.Similarly, the displacement in -X direction, Y-direction, -Y direction can be judged according to aforesaid way, herein
And it is no longer described in detail.
In some embodiments, the metal layer in Fig. 3 belongs to the first metal layer, and the second gold medal is additionally provided on substrate 210
Belong to layer, wherein the first metal layer is set between substrate 210 and second metal layer.Fig. 6 is to be painted second according to an embodiment
To the top view of bit patterns on metal layer.Please refer to Fig. 6, include on second metal layer M2 to bit patterns 610,620,630,640,
Each there are to bit patterns the multiple portions being connected to each other.Specifically, there is the part being connected to each other to bit patterns 610
611~614；There is the part 621~624 being connected to each other to bit patterns 620；There is the part being connected to each other to bit patterns 630
631~634；There is the part 641~644 being connected to each other to bit patterns 640.Part 611,621,631,641 is along the Y direction
Extend, but length in the X direction is different from each other and towards gradually increasing in -X direction；Part 612,622,632,642 is edge
X-direction extend, but length in the Y direction is different from each other and towards gradually increasing in Y-direction；Part 613,623,633,
643 be to extend along -Y direction, but length in the X direction is different from each other and towards gradually increasing in positive X direction；Part 614,
624,634,644 be to extend along -X direction, but length in the Y direction is different from each other and towards gradually increasing in -Y direction.
Fig. 7 is the schematic top plan view being painted according to an embodiment by two substrate in batch after vertical.It draws in the example of figure 7
It is shown with the first metal layer M1, second metal layer M2 and light shield layer BM.Fig. 6 and Fig. 7 are please referred to, it can be by judging in Fig. 7
Shape is aligned between bit patterns 610,620,630,640 and 420,430,440,450 on light shield layer on two metal layer M2
State judges the displacement between two substrates.However, this judgment mode is similar to the machine for judging displacement according to the first metal layer
System, therefore and repeat no more.
It in the embodiment in fig 6, is to be connected to each other to each section in bit patterns 610,620,630,640, but at other
It each also may include multiple line segments being separated to bit patterns in embodiment.Fig. 8 is to be painted the first gold medal according to an embodiment
Belong to the top view in layer and second metal layer to bit patterns.It is not painted in Fig. 8 for simplicity with Fig. 8 referring to figure 3.
To the symbol of bit patterns on the first metal layer.Second metal layer M2 includes to 810,820,830,840 (also referred to as third of bit patterns
To bit patterns), these to bit patterns be respectively corresponding on the first metal layer M1 to bit patterns 310,320,330,340.It is right
Bit patterns 810 include the first line segment 811, second line segment 812, third line segment 813 and the 4th line segment 814；Include to bit patterns 820
First line segment 821, second line segment 822, third line segment 823 and the 4th line segment 824；To bit patterns 830 include the first line segment 831,
Second line segment 832, third line segment 833 and the 4th line segment 834；To bit patterns 840 include the first line segment 841, second line segment 842,
Third line segment 843 and the 4th line segment 844.First line segment 811,821,831,841 is to extend along the Y direction, length in the X direction
It spends differing from each other and along being gradually increased in -X direction.Second line segment 812,822,832,842 is to extend along the X direction, in Y
Length on direction it is differing from each other and along the Y direction on gradually increase.Third line segment 813,823,833,843 is along the side-Y
To extension, length in the X direction it is differing from each other and along the X direction on gradually increase.4th line segment 814,824,834,844
It is to extend along -X direction, length in the Y direction is differing from each other and along gradually increasing in -Y direction.
Each to bit patterns 810,820,830,840 be partly be overlapped in it is corresponding to bit patterns 310,320,330,
340.Specifically, the first line segment 811,821,831,841 is to be overlapped in first part 311,321,331,341 respectively；Second
Line segment 812,822,832,842 is to be overlapped in second part 312,322,332,342 respectively；Third line segment 813,823,833,
843 be to be overlapped in Part V 315,325,335,345 respectively；4th line segment 814,824,834,844 is to be overlapped in respectively
A part 316,326,336,346.
Fig. 9 is the schematic top plan view being painted according to an embodiment by two substrate in batch after vertical.For simplicity, scheming
The symbol of each pair of bit patterns is not indicated in 9.Referring to figure 4., the opening 411~414 on Fig. 8 and Fig. 9, light shield layer BM
It is covered respectively to bit patterns 810,820,830,840.By judge to bit patterns 810,820,830,840 whether with it is corresponding
Bit patterns 420,430,440,450 are aligned, it can be determined that go out the displacement between two substrates.Specifically, by judging
Whether the left edge of one line segment 811,821,831,841 is aligned with the left edge of corresponding Part III 442,433,443,453,
It may determine that the displacement of upper substrate in the-x direction relative to lower substrate；By judging second line segment 812,822,832,842
Top edge whether be aligned with the top edge of Part IV 444,434,444,454, it can be determined that go out upper substrate relative to lower base
The displacement of plate in the Y direction；By judge third line segment 813,823,833,843 right hand edge and Part VII 427,437,
447, whether 457 right hand edge is aligned, it can be determined that goes out displacement of the upper substrate relative to lower substrate in the X direction；Pass through judgement
Whether the lower edge of the 4th line segment 814,824,834,844 is aligned with the lower edge of Part VIII 428,438,448,458, can be with
Judge the displacement of upper substrate in the-y direction relative to lower substrate.
In the embodiment of above-mentioned Fig. 4, be to each section in bit patterns 420,430,440,440 be connected to each other, but
It each also can have gap between each section in bit patterns in other embodiments, i.e., be not connected to each other.Specifically, it asks
Referring to Fig.1 0, for simplicity, only depicted in Figure 10 on the first metal layer and light shield layer to bit patterns, but be appreciated that
Be in the embodiment of Figure 10 also may include in second metal layer to bit patterns.In the embodiment in figure 10, to bit patterns 420
In part 423,424,427,428 be not connected with each other, and between these parts and frame portion 402 all have gap.
To bit patterns 420,430,440,440 be respectively corresponding on the first metal layer to bit patterns 1001~1004, these contrapositions
The structure of pattern 1001~1004 be identical to respectively in Fig. 3 to bit patterns 310,320,330,340.For simplicity,
In Figure 10, there is no shows in detail to go out to each section in bit patterns 1001~1004.The first metal layer has to be extended in X-direction
Metal wire 1011~1022 and the metal wire 1031~1034 that extends in the Y direction, some of metal wires 1011~1022
Intersect with the metal wire 1031~1034 of part.Specifically, on the first metal layer to bit patterns 1001,1002,1003,
1004 be the infall between different horizontal wires and different longitudinal metal lines.For example, to bit patterns
1001 be the infall between metal wire 1012 and metal wire 1031；It is to be located at metal wire 1015 and gold to bit patterns 1002
Belong to the infall between line 1032, and so on.In other words, multiple pairs of bit patterns on the first metal layer can be set same
In metal line (embodiment of such as Fig. 3), also it can be set on different metal wires.
As long as it is noted that in the same layer to certain part/line segment of bit patterns in X-direction or Y-direction
Length gradually changes, and may serve to judge the displacement between two substrates.For example, in some embodiments, the first gold medal
Belong to layer on it is all constant in the length of X-direction and Y-direction to bit patterns, but on light shield layer to bit patterns in X-direction and the side Y
Upward length gradually changes.Those skilled in the art is appreciated that above-described embodiment, and to these to bit patterns
Make other designs.For example, referring to figure 3., Fig. 4 and Figure 11, in the embodiment in figure 11, on light shield layer BM to bitmap
Case the length of X-direction and Y-direction be both greater than in the first metal layer to bit patterns X-direction and Y-direction length.It is specific next
It says, the length of Part III 423 in the X direction is greater than the length of first part 311 in the X direction；Part IV 424 is in Y
Length on direction is greater than the length of second part 312 in the Y direction；The length of Part VII 427 in the X direction is greater than
The length of Part V 315 in the X direction；The length of Part VIII 428 in the Y direction is greater than Part VI 316 in the Y direction
On length.For other to bit patterns and design having the same, and repeat no more.
The metal layer mentioned in the present specification can for the single metal layer such as aluminium, copper, titanium, tungsten either molybdenum/aluminium/molybdenum, titanium/
Aluminium titanium, titanium/copper/titanium, titanium/copper ... wait complex metal layers, and the present invention is simultaneously not subject to the limits.
Although the present invention is disclosed as above with embodiment, however, it is not to limit the invention, any technical field
In technical staff, without departing from the spirit and scope of the present invention, when can make some changes and embellishment, therefore guarantor of the invention
Subject to shield range ought be defined depending on claim.
Claims (20)
1. a kind of display panel, there is viewing area and non-display area, which is characterized in that the display panel includes:
First substrate, wherein metal layer is set on the first substrate, and the metal layer has more in the non-display area
A first pair of bit patterns, each described first pair of bit patterns have the first part being connected to each other and second part；With
And
The second substrate, wherein light shield layer is set in the second substrate, and the light shield layer has more in the non-display area
A second pair of bit patterns, each described second pair of bit patterns have Part III and Part IV,
Wherein second pair of bit patterns are to be respectively corresponding to first pair of bit patterns, and the Part III is to correspond to extremely respectively
The first part, and the Part IV is corresponded to the second part respectively,
Wherein each length of the first part in a first direction is with the corresponding Part III in the first party
Upward length differs the first length difference, and first length difference is differing from each other,
Wherein each length of the second part in a second direction is with the corresponding Part IV in the second party
Upward length differs the second length difference, and second length difference is differing from each other,
Wherein the light shield layer has multiple openings in the non-display area, and one of the multiple opening covers described
One of multiple first pair of bit patterns and one of the multiple second pair of bit patterns.
2. display panel as described in claim 1, which is characterized in that the first part is to extend toward the second direction
First metal wire, the second part be toward the first direction extend the second metal wire, first metal wire with it is described
Second metal wire is connected to each other.
3. display panel as claimed in claim 2, which is characterized in that the Part III extends toward the second direction, institute
Part IV is stated to extend toward the first direction.
4. display panel as described in claim 1, which is characterized in that each described first pair of bit patterns also has to be connected each other
The Part V and Part VI connect, the Part V extend toward the direction relative to the second direction, and described 6th
Divide and extends toward the direction relative to the first direction.
5. display panel as claimed in claim 4, which is characterized in that each described second pair of bit patterns also has the 7th
Point and Part VIII, the Part VII toward relative to the second direction direction extend, the Part VIII toward relative to
The direction of the first direction extends.
6. display panel as claimed in claim 5, which is characterized in that
Each length of the Part V in said first direction is with the corresponding Part VII in the first party
Upward length differs a third length difference, and the third length difference is differing from each other,
Each length of the Part VI in this second direction is with the corresponding Part VIII in the second party
Upward length differs one the 4th length difference, and the 4th length difference is differing from each other.
7. display panel as described in claim 1, which is characterized in that first pair of bit patterns are electrically connected to each other.
8. display panel as described in claim 1, which is characterized in that the light shield layer has frame portion, is set to described
In non-display area, there is gap area between each second pair of bit patterns and the frame portion.
9. display panel as described in claim 1, which is characterized in that the metal layer belongs to the first metal layer, and described first
Second metal layer is additionally provided on substrate, the second metal layer includes multiple thirds to bit patterns, and the third is to bit patterns
It is to be set to the non-display area and be respectively corresponding to first pair of bit patterns.
10. display panel as claimed in claim 9, which is characterized in that each described third is partly heavy to bit patterns
It is laminated on one of corresponding the multiple first pair of bit patterns.
11. display panel as claimed in claim 10, which is characterized in that each described third includes First Line to bit patterns
Section and second line segment, first line segment extend along the second direction, and the second line segment extends toward the first direction.
12. display panel as claimed in claim 11, which is characterized in that each described first line segment is in the first direction
On length it is differing from each other, and each length of the second line segment in this second direction is differing from each other.
13. display panel as claimed in claim 12, which is characterized in that first line segment is at least partially overlap on institute
First part is stated, the second line segment is at least partially overlap on the second part.
14. display panel as claimed in claim 13, which is characterized in that each described third further includes third to bit patterns
Line segment and the 4th line segment, the third line segment extend toward the direction relative to the second direction, and the 4th line segment is toward relatively
Extend in the direction of the first direction.
15. display panel as described in claim 1, which is characterized in that each described first part is in the first direction
On length it is differing from each other, each length of the second part in this second direction is differing from each other.
16. display panel as described in claim 1, which is characterized in that each described Part III is in the first direction
On length it is differing from each other, and each length of the Part IV in this second direction is differing from each other.
17. display panel as described in claim 1, which is characterized in that the metal layer includes a plurality of first metal wire and more
The second metal wire of item, and at least part of first metal wire intersects at least part of second metal wire,
Wherein first pair of bit patterns be located at different first metal wire and different second metal wires it
Between infall.
18. display panel as described in claim 1, which is characterized in that described in each described second pair of bit patterns
Three parts are connected with each other with the Part IV.
19. display panel as described in claim 1, which is characterized in that described in each described second pair of bit patterns
There is gap between three parts and the Part IV.
20. display panel as described in claim 1, which is characterized in that described in each described second pair of bit patterns
The length of three parts in said first direction is greater than first part described in corresponding first pair of bit patterns described the
Length on one direction,
And the length of the Part IV in each described second pair of bit patterns in this second direction, which is greater than, to be corresponded to
First pair of bit patterns described in the length of second part in this second direction.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810062069.5A CN110071093B (en) | 2018-01-23 | 2018-01-23 | Display panel |
| US16/154,739 US10431552B2 (en) | 2018-01-23 | 2018-10-09 | Display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810062069.5A CN110071093B (en) | 2018-01-23 | 2018-01-23 | Display panel |
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| Publication Number | Publication Date |
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| CN110071093A true CN110071093A (en) | 2019-07-30 |
| CN110071093B CN110071093B (en) | 2020-11-27 |
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| CN201810062069.5A Active CN110071093B (en) | 2018-01-23 | 2018-01-23 | Display panel |
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| CN (1) | CN110071093B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931464A (en) * | 2019-12-10 | 2020-03-27 | 深圳市华星光电半导体显示技术有限公司 | Array substrate and display panel |
| WO2021102934A1 (en) * | 2019-11-29 | 2021-06-03 | 京东方科技集团股份有限公司 | Alignment mark, mask, and display substrate master |
| US11908804B2 (en) | 2019-12-10 | 2024-02-20 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Array substrate and display panel |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102538411B1 (en) | 2018-07-25 | 2023-05-31 | 삼성디스플레이 주식회사 | Display device |
| KR20210041674A (en) * | 2019-10-07 | 2021-04-16 | 삼성디스플레이 주식회사 | Color conversion panel and display device including the same |
| KR20240080638A (en) | 2022-11-30 | 2024-06-07 | 엘지디스플레이 주식회사 | Display device and method of manufacturing the same |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5017514A (en) * | 1988-11-25 | 1991-05-21 | Nec Corporation | Method of manufacturing a semiconductor device using a main vernier pattern formed at a right angle to a subsidiary vernier pattern |
| CN101278237A (en) * | 2005-09-30 | 2008-10-01 | 先进微装置公司 | Structure and method for simultaneously determining an overlay accuracy and pattern placement error |
| CN101718932A (en) * | 2009-12-10 | 2010-06-02 | 友达光电股份有限公司 | Displaying panel |
| CN104078446A (en) * | 2013-03-27 | 2014-10-01 | 中芯国际集成电路制造(上海)有限公司 | Bonding alignment mark and method for calculating offset |
| CN104637395A (en) * | 2013-11-13 | 2015-05-20 | 上海和辉光电有限公司 | Identification structure used for substrate, substrate and method for forming identification structure of substrate |
| CN104979330A (en) * | 2014-04-10 | 2015-10-14 | 上海和辉光电有限公司 | A multilayer structure having offset measurement marks and an offset measurement method thereof |
| US20150380358A1 (en) * | 2014-06-30 | 2015-12-31 | Texas Instruments Incorporated | Methods and Apparatus Using Front-to-Back Alignment Mark and Placement for Narrow Wafer Scribe Lines |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5418613A (en) * | 1990-11-20 | 1995-05-23 | Canon Kabushiki Kaisha | Method and apparatus for detecting the position of a substrate having first and second patterns of different sizes |
| JP3953355B2 (en) * | 2002-04-12 | 2007-08-08 | Ｎｅｃエレクトロニクス株式会社 | Image processing alignment method and semiconductor device manufacturing method |
| JP3967701B2 (en) * | 2003-09-10 | 2007-08-29 | 沖電気工業株式会社 | Semiconductor device |
| WO2007055010A1 (en) * | 2005-11-10 | 2007-05-18 | Renesas Technology Corp. | Semiconductor device manufacturing method and semiconductor device |
| NL2002954A1 (en) * | 2008-06-11 | 2009-12-14 | Asml Netherlands Bv | Sub-segmented alignment mark arrangement. |
| US9704822B2 (en) * | 2015-11-10 | 2017-07-11 | International Business Machines Corporation | Bonding substrates using solder surface tension during solder reflow for three dimensional self-alignment of substrates |
| JP7163577B2 (en) * | 2017-12-28 | 2022-11-01 | 富士電機株式会社 | Semiconductor device manufacturing method |
-
2018
- 2018-01-23 CN CN201810062069.5A patent/CN110071093B/en active Active
- 2018-10-09 US US16/154,739 patent/US10431552B2/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5017514A (en) * | 1988-11-25 | 1991-05-21 | Nec Corporation | Method of manufacturing a semiconductor device using a main vernier pattern formed at a right angle to a subsidiary vernier pattern |
| CN101278237A (en) * | 2005-09-30 | 2008-10-01 | 先进微装置公司 | Structure and method for simultaneously determining an overlay accuracy and pattern placement error |
| CN101718932A (en) * | 2009-12-10 | 2010-06-02 | 友达光电股份有限公司 | Displaying panel |
| CN104078446A (en) * | 2013-03-27 | 2014-10-01 | 中芯国际集成电路制造(上海)有限公司 | Bonding alignment mark and method for calculating offset |
| CN104637395A (en) * | 2013-11-13 | 2015-05-20 | 上海和辉光电有限公司 | Identification structure used for substrate, substrate and method for forming identification structure of substrate |
| CN104979330A (en) * | 2014-04-10 | 2015-10-14 | 上海和辉光电有限公司 | A multilayer structure having offset measurement marks and an offset measurement method thereof |
| US20150380358A1 (en) * | 2014-06-30 | 2015-12-31 | Texas Instruments Incorporated | Methods and Apparatus Using Front-to-Back Alignment Mark and Placement for Narrow Wafer Scribe Lines |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021102934A1 (en) * | 2019-11-29 | 2021-06-03 | 京东方科技集团股份有限公司 | Alignment mark, mask, and display substrate master |
| US11994810B2 (en) | 2019-11-29 | 2024-05-28 | Boe Technology Group Co., Ltd. | Alignment mark, mask and display substrate motherboard |
| CN110931464A (en) * | 2019-12-10 | 2020-03-27 | 深圳市华星光电半导体显示技术有限公司 | Array substrate and display panel |
| WO2021114326A1 (en) * | 2019-12-10 | 2021-06-17 | 深圳市华星光电半导体显示技术有限公司 | Array substrate and display panel |
| CN110931464B (en) * | 2019-12-10 | 2021-07-23 | 深圳市华星光电半导体显示技术有限公司 | Array substrate and display panel |
| US11908804B2 (en) | 2019-12-10 | 2024-02-20 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Array substrate and display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110071093B (en) | 2020-11-27 |
| US20190229066A1 (en) | 2019-07-25 |
| US10431552B2 (en) | 2019-10-01 |
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