CN110060988A - A kind of LED support array, LED support, LED component and display screen - Google Patents
A kind of LED support array, LED support, LED component and display screen Download PDFInfo
- Publication number
- CN110060988A CN110060988A CN201910302910.8A CN201910302910A CN110060988A CN 110060988 A CN110060988 A CN 110060988A CN 201910302910 A CN201910302910 A CN 201910302910A CN 110060988 A CN110060988 A CN 110060988A
- Authority
- CN
- China
- Prior art keywords
- led
- led support
- support
- cup
- metal framework
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 48
- 238000009434 installation Methods 0.000 claims description 6
- 239000003381 stabilizer Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000005253 cladding Methods 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000005286 illumination Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 16
- 239000011265 semifinished product Substances 0.000 description 13
- 238000005520 cutting process Methods 0.000 description 10
- 238000000465 moulding Methods 0.000 description 10
- 238000005452 bending Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 210000000481 breast Anatomy 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The present invention provides a kind of LED support array, LED support, LED component and display screen, the support array includes metal framework and multiple carrier units, and the multiple carrier unit goes into battle in the metal framework and is classified as M row * N column, in which: M, N are more than or equal to 1；Any carrier unit in the multiple carrier unit includes the bracket groove and LED support being provided on the metal framework；The bracket groove includes two opposite long side inner walls and two opposite short side inner walls；The LED support is arranged between described two long side inner walls, and the LED support is different from the distance between described two short side inner walls.The LED support Array Design is structurally reasonable, has good effect in asymmetric LED support production operation；Based on the LED component of the LED support array production, there is outstanding illumination effect.
Description
Technical field
The present invention relates to LED fields, and in particular to arrives a kind of LED support array, LED support, LED component and display screen.
Background technique
Have a down dip angie type LED component bottom surface relative to LED chip mounting surface be inclined-plane, due to LED support pin needs lead to
LED component bottom is to realize patch or welding, and the opposite LED support pin of angie type LED component that causes to have a down dip is with different length
Degree；Similarly, the LED component of part special construction due to the structure of LED support pin it is inconsistent, cause opposite LED support to draw
Foot length is different；This opposite unequal LED component of pin length is known as asymmetric device.In order to realize such device
Quickly production can be used the general LED support array of one kind and be produced；Since such device and conventional LED device have one
Fixed structural difference, it is necessary to which existing LED support array is improved.
Summary of the invention
In order to realize the purpose for quickly producing asymmetric device by LED support array, the present invention provides a kind of LED
Support array, LED support, LED component and display screen, the LED support Array Design is structurally reasonable, in asymmetric LED support
There is good effect in production operation.
Corresponding, it is described the present invention provides a kind of LED support array, including metal framework and multiple carrier units
Multiple carrier units array arrangement on the metal framework is M row * N column, in which: M, N are more than or equal to 1；
Any carrier unit in the multiple carrier unit includes the bracket groove and LED being provided on the metal framework
Bracket；
The bracket groove includes two opposite long side inner walls and two opposite short side inner walls；The LED support setting
Between described two long side inner walls, and the distance between the LED support and described two short side inner walls are unequal.
Optional embodiment, it is convex towards the LED support direction that described two long side inner walls are respectively arranged at least two
The detent protrusion risen, the LED support are based on the detent protrusion and are arranged between described two long side inner walls.
Optional embodiment, the bracket groove are through slot.
Optional embodiment is respectively arranged with location hole on the top edge on the metal framework surface and lower edge.
The positioning hole number of optional embodiment, metal framework surface top edge and lower edge is different.
Optional embodiment, the metal framework lower edges are provided with the stabilizers of multiple recess；
And/or multiple stable holes are provided between the adjacent stent unit on the lateral central axes of the metal framework.
Correspondingly, any of the above item bracket battle array is arranged in the LED support the present invention also provides a kind of LED support
In the bracket groove of column, the LED support includes metallic support and the cup cover for wrapping up the metallic support, and the cup cover includes reflection
Cup, the cup cover are bevel structure away from the one side of the rim of a cup of the reflector, and the metallic support includes more and is embedded in institute
It states in cup cover and both ends exposes to the LED support pin of the cup cover, the reflector bottom surface is the peace installed for LED chip
Dress face.
Optional embodiment, the reflector include cup inner wall and bottom of a cup face, and the cup inner wall includes that position is opposite
First inner wall and the second inner wall, the angle in first inner wall and the bottom of a cup face be less than or equal to second inner wall with it is described
The angle in bottom of a cup face.
Optional embodiment, the cup cover include opposite first side and second side, opposite third side and
4th side, the first side height are greater than the second side；
The LED support pin exposes to the cup cover from the first side and second side；,
Be provided with multiple detent slots on the third side and the 4th side, the detent slot and the first side away from
From less than the distance between the detent slot and the second side.
Optional embodiment, the LED support pin include inner end, outer end and linkage section, the inner end and outer end group
It is connected in the linkage section；
The inner end exposes on the mounting surface, the outer end be arranged on LED support bottom surface and with LED support bottom surface
Equal, the cup cover lateral surface is directed toward in the outer end end.
Correspondingly, the LED component is based on LED branch described in any of the above item the present invention also provides a kind of LED component
Frame encapsulates to be formed, the encapsulated layer including LED chip, the cladding LED chip.
Optional embodiment, the LED chip include red light chips, green light chip and blue chip, the LED support
Pin number is six；
The setting of the inner end mutually insulated of six LED support pins forms pad on the mounting surface, and described six
The bond pad surface product that one of LED support pin inner end of a LED support pin is formed is compared with LED support pin described in other
The bond pad surface product that inner end is formed is big；The red light chips, green light chip, at least two LED chips setting in blue chip
On the big pad of surface area.
Correspondingly, the display screen includes LED described in multiple any of the above items the present invention also provides a kind of display screen
Device and pcb board, multiple LED components are mounted on the pcb board.
The embodiment of the invention provides a kind of LED support array, LED support, LED component and display screen, the LED support battle arrays
Column design structure is reasonable, has good effect in asymmetric LED support production operation；It is raw based on the LED support array
The LED component of production, light emitting angle and axis runout angle are larger, have outstanding illumination effect；Using made of the LED component
Display screen has good display effect in the fields such as city displaying.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 shows the LED support array top view of the embodiment of the present invention；
Fig. 2 shows the partial enlargement diagrams of carrier unit；
Fig. 3 shows the LED support array front view of the embodiment of the present invention；
Fig. 4 shows the three dimensional structure diagram of metal framework carrier unit in bracket state；
Fig. 5 shows the LED support three dimensional structure diagram of the embodiment of the present invention；
Fig. 6 shows the LED support perspective view of the embodiment of the present invention；
Fig. 7 shows the LED support use state diagram of the embodiment of the present invention；
Fig. 8 shows the LED support pin positive structure diagram of the embodiment of the present invention；
Fig. 9 shows the LED component overlooking structure diagram of the embodiment of the present invention；
Figure 10 shows the display screen light emitting angle schematic diagram of the embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
Embodiment one
The present embodiment discloses a kind of LED support array.
Fig. 1 shows the LED support array top view of the embodiment of the present invention, and Fig. 2 shows the partial enlargements of carrier unit
Schematic diagram, Fig. 3 show the LED support array front view of the embodiment of the present invention.
The LED support array of the embodiment of the present invention includes metal framework 1 and multiple carrier units 2.The embodiment of the present invention
Metal framework 1 is plank frame, is provided with multiple carrier units 2.Multiple carrier units 2 array on metal framework 1 is arranged
Cloth is M row * N column, and M, N are more than or equal to 1.Wherein, the distance between adjacent rows carrier unit 2 or adjacent two column carrier unit 2
It can be equal, or it is unequal, it can be designed according to actual needs.Appointing in the multiple carrier unit 2
One carrier unit includes the bracket groove 4 and LED support 3 being provided on the metal framework；The bracket groove 4 includes two opposite
Long side inner wall and two opposite short side inner walls；The LED support 3 is arranged between described two long side inner walls, and described
The distance between LED support 3 and described two short side inner walls are unequal.
As shown in Figure 1,1 lower edges of metal framework are provided with location hole, there are many setting forms of location hole, such as
Non-circular structure is set by location hole, or is arranged to circular locating openings structure, wherein on the lower edges on metal framework surface
Positioning hole number can be different, in the present embodiment, by the upper of each carrier unit on the top edge on 1 surface of metal framework
Side's setting be provided with below each carrier unit there are two location hole 16, on the lower edge on 1 surface of metal framework 1 it is fixed
Position hole 14, wherein the diameter of two location holes 16 on the top edge on 1 surface of metal framework is more following than 1 surface of metal framework
The diameter of location hole 14 on edge is small, in the present embodiment, the diameter of the location hole 16 on the top edge on 1 surface of metal framework
Equal, the diameter of the location hole 14 on the lower edge on 1 surface of metal framework is also equal.In embodiments of the present invention, metal
Positioning hole number on the lower edges on 1 surface of frame is different, can be used to identify the direction of bracket, meanwhile, in metal framework
The lower edges on surface are both provided with location hole, position metal framework in entire stent procedures.
Further, since metal framework 1 is plank frame, in process, local deformation is easy to spread and then influence
To block of metal frame 1, therefore, in order to eliminate the local deformation influence whole to metal framework 1, the wave of metal framework 1 is reduced
Unrestrained waviness, the embodiment of the present invention are provided with the stabilizers 15 of multiple recess, the present embodiment in the lower edges of metal framework 1
In, the shape of the stabilizers is spaced rectangle and triangle；Based on same purpose, the lateral axis of metal framework
Multiple stable holes 17 are provided between adjacent stent unit 2 on line, the shape in the stable hole is spaced triangle
And arch door shape, wherein triangle is stablized hole and is arranged between adjacent stent unit, and arch door shape is stablized hole and is arranged two neighboring three
Between angular stable hole.The multiple stable hole 17 and the multiple stabilizers 15 are parallel to each other.
It should be noted that heaving of the sea degree can be understood as local deformation to the capability of influence of overall deformation.Daily life
In work, a full size more easily whole can hold up or pick up, but if cutting is portalled in paper, slot or to paper
Inside is sheared, and since power cannot effectively be transmitted along paper, is difficult to pick up on paper by way of locally holding；
In other words, power caused by the deformation of paper part cannot be transmitted on paper well, therefore, local on paper
The appearance due to the hole, slot or crack is deformed, full size will not be affected greatly.Similarly, the embodiment of the present invention is logical
The mode that multiple stabilizers 15 and multiple stable holes 17 are set is crossed, the heaving of the sea degree of metal framework 1 is reduced, can be effectively reduced
The local deformation influence whole to metal framework 1.
Fig. 4 shows the three dimensional structure diagram of metal framework carrier unit in machining state 101.Metal framework 1 is not
It is one piece of complete sheet metal before processing, sheet metal forms multiple independent carrier units after mold is punched, and attached drawing Fig. 4 is
The three dimensional structure diagram of one of carrier unit.Wherein, carrier unit periphery is the unit framework (unit frame without punching
Frame is a part of sheet metal), the non-LED support material in part is removed, and middle part is according to required molding LED support pin number
Form a plurality of pin semi-finished product 10.
In subsequent job, each pin semi-finished product 10 are operated along 11 segmentation of cutting seam by punch forming, cutting etc.
LED support pin needed for being formed.
It should be noted that the punching profile of pin semi-finished product 10 is related to the LED support pin configuration of final molding, cut
The setting position of slot 11 is configured based on required LED support structure.
Specifically, in final molding, respectively two LED supports draw the pin semi-finished product 10 positioned at 11 two sides of die cut
The inner end of foot, positioned at the inside of LED support, for being attached for LED chip.Since each bracket pin is an electricity
Pole, in order to avoid the wire length of LED chip is too long, the bad problem such as cause to breast the tape, in the design of pin semi-finished product 10, phase
For adjacent two pin semi-finished product 10 under conditions of keeping insulation, the spacing at cutting seam 11 is smaller, to guarantee to be bonded wire length
Degree will not be too long.
Correspondingly, the outer end of 10 both ends of pin semi-finished product respectively two LED support pins in final molding, exposes to
LED support surface, for carrying out the installation exercises such as patch, welding for outside, therefore, and in the design of pin semi-finished product 10, phase
Spacing of the adjacent two pin semi-finished product 10 at both ends is big compared with the spacing at bonding line, to guarantee the convenience of external installation exercise
Property.
In addition, pin semi-finished product 10, after cutting, 11 two sides of cutting seam are respectively formed two LED support pins, in this hair
In bright embodiment, two LED support pin lengths that pin semi-finished product are formed through same 11 cutting of cutting seam are not identical, make final
Molding LED support pin has asymmetric pin configuration, so that finally formed LED support and LED component be made to have not
Symmetrical structure, to realize special illumination effect.
Specifically, in embodiments of the present invention, as shown in attached drawing Fig. 2 and Fig. 4, pin semi-finished product 10 are through 11 cutting of cutting seam
Afterwards, the LED support pin that total length is a and the LED support pin that total length is b are formed, a is unequal with b, such as attached drawing Fig. 4 institute
Show that structure, the length of a are greater than the length of b.Correspondingly, after the molding of LED support 2, in LED support pin setting direction, such as
Shown in Fig. 2 and Fig. 4, since the length of a is greater than the length of b, so between the long side and bracket groove of 3 pin of LED support away from
It is greater than the distance between the short side and bracket groove of 3 pin of LED support b1 from a1, i.e., between 3 two sides of LED support and bracket groove 4
Distance it is unequal.
In addition, it is contemplated that the outer end of LED support pin needs to be bent after LED support injection molding, in order to avoid LED branch
Frame falls off from metal framework 1, is provided at least on the carrier unit frame opposite with the pin semi-finished product 10 of two sides are located at
Two detent protrusions 12, as shown in Figure 4；After LED support injection molding, detent protrusion 12 can block LED support, avoid LED
Bracket falls off.
In sheet metal punching, the LED support structure division not being related to can be punched out, to recycle extra metal
Material.
With reference to the partial enlargement diagram of attached drawing carrier unit shown in Fig. 2, in conjunction with above embodiment, of the invention real
It applies in example, the bracket groove 4 of the embodiment of the present invention is through slot structure, and LED support 3 is based on detent raised (invisible in figure) and is fixed on
In bracket groove 4.
Embodiment two
A kind of LED support is also disclosed in the present embodiment, which is arranged in the bracket groove of support array described in embodiment one
In.
Fig. 5 shows the LED support three dimensional structure diagram of the embodiment of the present invention.The LED support 3 of the embodiment of the present invention wraps
It includes metallic support and wraps up the cup cover 301 of the metallic support, the cup cover includes reflector 303, and cup cover 301 is based on injection molding manner
Molding, the cup cover 301 is away from the side of the rim of a cup of the reflector 303, i.e. 301 bottom surface of cup cover is relative to reflector 303
Rim of a cup is bevel structure, and the cup cover 301 has the first side and second side being oppositely arranged；Due to the embodiment of the present invention
301 bottom surfaces of cup cover are bevel structure, and first side and second side have different height, and for the ease of distinguishing, the present invention is real
The first side height for applying example is greater than the height on the second inclined-plane.The metallic support includes more and is embedded in cup cover and outside both ends
It is exposed to the LED support pin 302 of the cup cover, the LED support pin 302 exposes to the first side and second of the cup cover
On side.The cup cover 301 is additionally provided with the third side and the 4th side being oppositely arranged, the third side and the 4th side
On be provided at least two detent slots 304 corresponding to detent protrusion；Due to detent slot 304 from the third side of cup cover 301 and
4th side-facing depressions are formed, and detent slot 304 and metallic support, which are formed, in order to prevent interferes, the detent slot 304 and described first
The distance of side is less than the distance between the detent slot and the second side, since cup cover 301 is close to first side one
Height of the height of side compared with cup cover 301 in second side side is big, and cup cover 301 is larger in the space close to first side side,
Detent slot 304 is not easy to generate interference with metallic support.
Fig. 6 shows the LED support perspective view of the embodiment of the present invention, wherein heavy line is bracket profile, supplemented by fine line
Index contour, the structure in conjunction with shown in attached drawing Fig. 5 are provided with reflector 303,303 bottom surface of reflector on the cup cover 301 of the embodiment of the present invention
For the mounting surface 602 installed for LED chip, as shown in attached drawing Fig. 6, in the case where mounting surface 602 is horizontally disposed, cup cover bottom
Face 603 is inclined-plane.
Specifically, mounting surface 602 is 0 ° of benchmark of angle, and the reflector includes in cup for the section shown in attached drawing Fig. 6
Wall and bottom of a cup face, the cup inner wall include opposite the first inner wall 606 and the second inner wall 605 in position, 606 He of the first inner wall
Second inner wall 605 is tilted to the cup cover outer wall for being located at the same side respectively, wherein the angle of first inner wall 606 and bottom of a cup face
For d, the second inner wall 605 and the angle in bottom of a cup face are c, and first inner wall 606 and the angle d in the bottom of a cup face are less than or equal to
The angle c of second inner wall 605 and the bottom of a cup face.
Fig. 7 shows the LED support use state diagram of the embodiment of the present invention.LED branch provided in an embodiment of the present invention
Frame, by cup cover bottom surface 603 relative to the inclined set-up mode of mounting surface 602, makes the LED device compared with existing LED support
When part is installed in a plane based on LED support bottom surface, light-emitting surface is not re-directed towards surface, but according to LED support bottom surface
Inclined direction deviates former direction；By the inclined design of LED support bottom surface 603, the light direction of LED component can be changed.
In addition, central symmetry used by reflector inner wall relative to existing LED support designs, the embodiment of the present invention
Reflector is designed using asymmetric, specifically, the inclination angle between the second inner wall 605 and mounting surface 602 is bigger, is conducive to reinforce
Observing effect in this direction.
Fig. 8 shows the LED support pin positive structure diagram of the embodiment of the present invention.
Specifically, each LED support pin 302 includes inner end 801, outer end 803 and linkage section 802；Inner end 801 is exposed
In on the mounting surface, for being electrically connected for LED chip, outer end 803 be arranged on LED support bottom surface and with LED support bottom surface
Equal, for connecting for LED component with external circuit, linkage section 802 is embedded in cup cover, for connecting inner end 801 and outer end
803。
Optionally, as shown in figure 8,801 top surface of inner end of the LED support pin 302 of the embodiment of the present invention and the installation
Face is equal, which can guarantee the smooth of mounting surface, places and is electrically connected convenient for LED chip；Outer end 803 and cup cover bottom surface
It is equal, guarantee the planarization of cup cover bottom surface, when LED component carries out external installation, what bottom surface can be relatively stable is placed on outside
On device, it is easily installed.
Further, in actual processing, the bending between inner end 801 and linkage section 802 is carried out before cup cover forms
, the bending between outer end 803 and linkage section 802 is carried out after the molding of cup cover, and bending times are twice；It is formed in cup cover
Afterwards, the bending times of LED support pin are fewer, and LED support pin and the binding force of cup cover are stronger, therefore, the embodiment of the present invention
Outer end 803 on the basis of linkage section 802, directly towards bending and molding on the outside of cup cover, bending times are primary, on the one hand, single
Secondary bending advantageously reduces the influence to LED support pin and cup cover binding force, on the other hand, the bottom surface after bending of outer end 803
Product is larger, is conducive to the external installation of LED component.
Further, by extending to LED support pin outside LED support, LED support pin is extended to outside LED support
Part be close to the bottom plane of LED support to excision forming is flattened on the outside of LED support, by the way that pin is extended to LED support
Outer part directly flattens excision forming, avoid because mould bending radian and angle can not completely control it is consistent, lead to pin
Appearance is stuck up outside or internal buckle phenomenon, irregular, so that occurring screen body surface irregularity situation after patch on the whole screen of display screen.
LED support array provided in an embodiment of the present invention is directed to light emitting end surface (i.e. with LED chip largest light intensity direction
For normal plane) LED component not parallel with the welding plane of its LED support pin carried out the design of carrier unit, can be used for
High-volume quickly produces the inclined LED support of cradle bottom surface；LED support is using bottom angled and reflector inner wall is inclined sets
Meter can be used for producing the LED component at big luminous inclination angle；The special construction of LED support pin designs, and is conducive to enhance LED support
The binding force of pin and cup cover increases the use reliability of LED support.
Embodiment three
A kind of LED component is also disclosed in the present embodiment, is encapsulated by the LED support in embodiment two.Fig. 9 shows this
The LED component overlooking structure diagram of inventive embodiments.Correspondingly, the embodiment of the invention also provides a kind of LED component,
Specifically, the LED component includes the chip of three different colours, respectively red light chips 501, blue chip 502
With green light chip 503；Due to needing independently to control three kinds of chips, each chip needs independent two LED branch
Frame pin is attached；Therefore, the LED component of the embodiment of the present invention needs six LED support pins altogether.
Optionally, the inner end 801 of six LED support pins is arranged on mounting surface, forms pad, one of LED branch
The surface area for the pad that the inner end 801 of frame pin is formed is compared with the bond pad surface product that the inner end 801 of other LED support pins is formed
Greatly, for the two of them chip of three kinds of chips to be arranged；Specifically, each LED chip can be based on bonding wire mode, point
It is not electrically connected with two LED support pin formation.
Further, it is contemplated that the convenience installed outside LED component, three LED in six LED support pins
The outer end 803 of bracket pin is located on the same side of cup cover bottom surface 603, its excess-three in six LED support pins
The outer end 803 of a LED support pin is located on the other side of cup cover bottom surface 603.
Further, outer end be located at the same side three LED support pin polarity it is identical, carried out convenient for external circuit board
Wiring.In specific implementation, after the LED chip completes bonding wire, encapsulation is formed in reflector by modes such as packaging plastics
Layer, coats the LED chip, is formed and is protected to LED chip, LED component molding.
It should be noted that the setting side of set-up mode and LED support pin inner end of the LED chip on mounting surface
Formula can carry out adaptability design based on actual conditions, be not limited to embodiment described in the embodiment of the present invention.
Example IV
Figure 10 shows the display screen structure schematic diagram of the embodiment of the present invention.A kind of display screen is also disclosed in the present embodiment,
It is made of multiple LED components in embodiment three, including multiple LED components 5 and pcb board 6, multiple LED components 5 are mounted on
On the pcb board 6.
Specifically, display screen is arranged vertically on certain altitude, internal multiple LED components are arranged in pcb board 6
On, when observer on the ground observes display screen, since LED component uses LED support inclined bottom surface and reflector
The inclined design of inner wall greatly increases the visible angle towards observer bottom surface side, the person's of facilitating look at viewing, specific
There is good practicability in.Meanwhile the angle by controlling the first reflector inner wall and the second reflector inner wall, it can be with
It avoids the observer that other are in the same height of display screen from impacting, forms light pollution.
The embodiment of the invention provides a kind of LED support array, LED support, LED component and display screen, the LED support battle arrays
Column design structure is reasonable, is directed to the LED component that frame bottom is inclined-plane and has carried out the design of carrier unit, can be used for high-volume
Quickly production asymmetric LED support；Based on the LED component of the LED support array production, light emitting angle and axis runout angle
It is larger, there is outstanding illumination effect；Using display screen made of the LED component, have in the fields such as city displaying good
Display effect.
A kind of LED support array, LED support, LED component and display screen is provided for the embodiments of the invention above to carry out
It is discussed in detail, used herein a specific example illustrates the principle and implementation of the invention, above embodiments
Explanation be merely used to help understand method and its core concept of the invention；At the same time, for those skilled in the art,
According to the thought of the present invention, there will be changes in the specific implementation manner and application range, in conclusion in this specification
Appearance should not be construed as limiting the invention.
Claims (13)
1. a kind of LED support array, which is characterized in that including metal framework and multiple carrier units, the multiple carrier unit
Array arrangement is M row * N column on the metal framework, in which: M, N are more than or equal to 1；
Any carrier unit in the multiple carrier unit includes the bracket groove being provided on the metal framework and LED branch
Frame；
The bracket groove includes two opposite long side inner walls and two opposite short side inner walls；The LED support is arranged in institute
It states between two long side inner walls, and the distance between the LED support and described two short side inner walls are unequal.
2. support array as described in claim 1, which is characterized in that described two long side inner walls are respectively arranged at least two
Towards the detent protrusion of the LED support direction protrusion, the LED support is based on the detent protrusion and is arranged in described two long sides
Between inner wall.
3. support array as described in claim 1, which is characterized in that the bracket groove is through slot.
4. support array as described in claim 1, which is characterized in that on the top edge and lower edge on the metal framework surface
It is respectively arranged with location hole.
5. support array as claimed in claim 4, which is characterized in that metal framework surface top edge and lower edge are determined
Position hole number is different.
6. support array as described in claim 1, which is characterized in that the metal framework lower edges are provided with multiple recessed
Sunken stabilizers；
And/or multiple stable holes are provided between the adjacent stent unit on the lateral central axes of the metal framework.
7. a kind of LED support, which is characterized in that the LED support setting is in any one of claim 1 to 6 support array
Bracket groove in, the LED support include metallic support and wrap up the metallic support cup cover, the cup cover includes reflector,
The cup cover is bevel structure away from the one side of the rim of a cup of the reflector, and the metallic support includes more and is embedded in the cup
In cover and both ends expose to the LED support pin of the cup cover, and the reflector bottom surface is the installation installed for LED chip
Face.
8. LED support as claimed in claim 7, which is characterized in that the reflector includes cup inner wall and bottom of a cup face, the cup
Inner wall includes opposite the first inner wall and the second inner wall in position, and first inner wall and the angle in the bottom of a cup face are less than or equal to
The angle of second inner wall and the bottom of a cup face.
9. LED support as claimed in claim 7, which is characterized in that the cup cover includes opposite first side and second side
Face, opposite third side and the 4th side, the first side height are greater than the second side；
The LED support pin exposes to the cup cover from the first side and second side；,
The cup, which covers on third side and the 4th side, is provided with multiple detent slots, the detent slot and the first side
Distance is less than the distance between the detent slot and the second side.
10. LED support as claimed in claim 7, which is characterized in that the LED support pin includes inner end, outer end and connection
Section, the inner end are based on the linkage section with outer end and connect；
The inner end exposes on the mounting surface, the outer end be arranged on LED support bottom surface and with LED support bottom surface phase
Flat, the cup cover lateral surface is directed toward in the outer end end.
11. a kind of LED component, which is characterized in that the LED component is based on the described in any item LED supports of claim 7 to 10
Encapsulation is formed, the encapsulated layer including LED chip, the cladding LED chip.
12. LED component as claimed in claim 11, which is characterized in that the LED chip includes red light chips, green light chip
And blue chip, the LED support pin number are six；
The setting of the inner end mutually insulated of six LED support pins forms pad, six LED on the mounting surface
Inner end of the bond pad surface product that one of LED support pin inner end of bracket pin is formed compared with LED support pin described in other
The bond pad surface product of formation is big；The red light chips, green light chip, at least two LED chips in blue chip are arranged in table
On the big pad of area.
13. a kind of display screen, which is characterized in that the display screen include LED component described in multiple claims 11 or 12 and
Pcb board, multiple LED components are mounted on the pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910302910.8A CN110060988A (en) | 2019-04-15 | 2019-04-15 | A kind of LED support array, LED support, LED component and display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910302910.8A CN110060988A (en) | 2019-04-15 | 2019-04-15 | A kind of LED support array, LED support, LED component and display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110060988A true CN110060988A (en) | 2019-07-26 |
Family
ID=67319182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910302910.8A Pending CN110060988A (en) | 2019-04-15 | 2019-04-15 | A kind of LED support array, LED support, LED component and display screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110060988A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112815276A (en) * | 2021-02-04 | 2021-05-18 | 谷麦光电科技股份有限公司 | LED packaging structure capable of emitting light obliquely |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562227A (en) * | 2005-05-30 | 2009-10-21 | 夏普株式会社 | Light emitting device and method of manufacturing the same |
| CN202905781U (en) * | 2012-11-15 | 2013-04-24 | 深圳市九洲光电科技有限公司 | LED full-color surface-mounting device and LED support thereof |
| CN203260632U (en) * | 2013-01-18 | 2013-10-30 | 博罗承创精密工业有限公司 | LED support and terminal material strip |
| CN204516794U (en) * | 2015-01-20 | 2015-07-29 | 河北立翔慧科电子设备有限公司 | A kind of Surface Mount LED |
| CN105322069A (en) * | 2014-05-30 | 2016-02-10 | 惠州市华瑞光源科技有限公司 | LED lamp filament support material plate |
| CN205488205U (en) * | 2016-02-01 | 2016-08-17 | 佛山市国星光电股份有限公司 | Piece formula support, piece formula device array and piece formula device |
| CN205900581U (en) * | 2016-05-17 | 2017-01-18 | 佛山市顺德区赛威实业有限公司 | Display screen is with SMD LED lamp pearl |
| CN206301833U (en) * | 2016-10-10 | 2017-07-04 | 佛山市蓝箭电子股份有限公司 | A kind of indoor TOP types LED component and its support |
| CN208460326U (en) * | 2018-04-19 | 2019-02-01 | 潘尚法 | Have a down dip LED element of the shell with care-supporting |
-
2019
- 2019-04-15 CN CN201910302910.8A patent/CN110060988A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562227A (en) * | 2005-05-30 | 2009-10-21 | 夏普株式会社 | Light emitting device and method of manufacturing the same |
| CN202905781U (en) * | 2012-11-15 | 2013-04-24 | 深圳市九洲光电科技有限公司 | LED full-color surface-mounting device and LED support thereof |
| CN203260632U (en) * | 2013-01-18 | 2013-10-30 | 博罗承创精密工业有限公司 | LED support and terminal material strip |
| CN105322069A (en) * | 2014-05-30 | 2016-02-10 | 惠州市华瑞光源科技有限公司 | LED lamp filament support material plate |
| CN204516794U (en) * | 2015-01-20 | 2015-07-29 | 河北立翔慧科电子设备有限公司 | A kind of Surface Mount LED |
| CN205488205U (en) * | 2016-02-01 | 2016-08-17 | 佛山市国星光电股份有限公司 | Piece formula support, piece formula device array and piece formula device |
| CN205900581U (en) * | 2016-05-17 | 2017-01-18 | 佛山市顺德区赛威实业有限公司 | Display screen is with SMD LED lamp pearl |
| CN206301833U (en) * | 2016-10-10 | 2017-07-04 | 佛山市蓝箭电子股份有限公司 | A kind of indoor TOP types LED component and its support |
| CN208460326U (en) * | 2018-04-19 | 2019-02-01 | 潘尚法 | Have a down dip LED element of the shell with care-supporting |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112815276A (en) * | 2021-02-04 | 2021-05-18 | 谷麦光电科技股份有限公司 | LED packaging structure capable of emitting light obliquely |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106898601A (en) | LED circuit board, triangle LED component and display screen that triangle is combined | |
| CN102842667A (en) | Light-emitting diode packaging structure and method for producing same | |
| CN110060988A (en) | A kind of LED support array, LED support, LED component and display screen | |
| CN103168321B (en) | Substrate gap supporter and manufacture method thereof | |
| CN103872219B (en) | A kind of LED package support and LED illuminator | |
| CN101761788B (en) | Luminous module | |
| CN109411588B (en) | Parallel mounting LED element, transparent display screen module and production method thereof | |
| CN208460786U (en) | A kind of LED packaging and display panel | |
| CN103047575B (en) | Light-emitting diode light bar and manufacture method thereof | |
| CN108565326A (en) | LED support, LED component and LED display | |
| CN208460326U (en) | Have a down dip LED element of the shell with care-supporting | |
| CN208923121U (en) | A kind of rgb light source device and display screen | |
| CN106871078A (en) | A kind of integrated substrates of surface-adhered type RGB LED and its manufacture method | |
| CN207852220U (en) | A kind of LED transparent display screens structure | |
| CN206377628U (en) | Row's pin of LED batten and its it is welded and fixed structure | |
| CN207316509U (en) | Light-emitting module | |
| CN206040687U (en) | COB light source base plate | |
| CN205319189U (en) | Improve LED lead frame of firm degree of packaging structure | |
| CN102829369B (en) | Light-emitting diode light bar and manufacturing method thereof | |
| CN205960021U (en) | Novel CHIPLED device | |
| CN216133862U (en) | Packaging structure | |
| CN217280827U (en) | Non-uniformly arranged mini LED backlight module | |
| CN102214767B (en) | High-reliability packaging support structure of light emitting device | |
| CN201663180U (en) | High-reliability light-emitting device package support structure | |
| CN212991097U (en) | Lamp bead support, lamp bead, LED display screen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190726 |
|
| RJ01 | Rejection of invention patent application after publication |