CN110054999A - The preparation method of anti-residue glue heat-conducting double-sided adhesive tape - Google Patents
The preparation method of anti-residue glue heat-conducting double-sided adhesive tape Download PDFInfo
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- CN110054999A CN110054999A CN201910109602.3A CN201910109602A CN110054999A CN 110054999 A CN110054999 A CN 110054999A CN 201910109602 A CN201910109602 A CN 201910109602A CN 110054999 A CN110054999 A CN 110054999A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/14—Glass
- C09J2400/143—Glass in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses a kind of preparation methods of anti-residue glue heat-conducting double-sided adhesive tape, the following steps are included: hydroxy-terminated polysiloxane, epoxy resin, MQ resin, tetraethoxysilane, isobutyl triethoxy silane, vinyltoluene and organic solvent are added in reaction kettle S1., isopropyl titanate and organic tin catalyst is added in heating, reacts to obtain silicone pressure sensitive glue；S2. graphene powder, nm-class boron nitride, 3- mercaptopropyltriethoxysilane, ethyoxyl acetylenic glycols and organic solvent are added in stirred tank, then silicone pressure sensitive glue is added in stirred tank, stirred and thermal conductive adhesive is made；S3. thermal conductive adhesive is coated on glass-fiber-fabric substrate layer two sides, baking and curing forms heat-conducting glue layer；S4. release film layer is covered on heat-conducting glue layer surface, winding cutting；Anti- residue glue heat-conducting double-sided adhesive tape thermal coefficient produced by the present invention is high, can be used for the heat dissipation and bonding of electronic component.
Description
Technical field
The present invention relates to adhesive tape area more particularly to a kind of preparation methods of anti-residue glue heat-conducting double-sided adhesive tape.
Background technique
With the fast development of electronics industry, electronic product tends to be light, and volume is smaller and smaller, thus the collection of electronic component
Cheng Du is with regard to higher and higher, so to the requirement for leading heat dissipation performance of electronic component with regard to higher and higher.Heat-conducting glue band is led because having
Heat and the function that is bonded as one and be widely used, and it is with flexibility, compressibility, docile property and adaptive temperature range
The characteristics such as big and in occupation of biggish Heat Conduction Material market.
At present prepare heat-conducting glue band method be that heat filling is added in colloid, achieve the purpose that it is thermally conductive, but at present
Bond plies thermal coefficient it is generally smaller, and colloid is easy to happen when removing after working under high temperature environment for a long time
The case where residue glue.Therefore, a kind of good heat conductivity how is provided, and the anti-residue glue after hydrothermal aging without obvious residue glue is thermally conductive double
Face adhesive tape becomes the direction of those skilled in the art's effort.
Summary of the invention
It is an object of that present invention to provide a kind of preparation method of anti-residue glue heat-conducting double-sided adhesive tape, the glue that this method is prepared
Band good heat conductivity, and without obvious residue glue after hydrothermal aging, removable property is good.
In order to achieve the above objectives, the technical solution adopted by the present invention is that: a kind of preparation side of anti-residue glue heat-conducting double-sided adhesive tape
Method, the anti-residue glue heat-conducting double-sided adhesive tape include glass-fiber-fabric substrate layer, the heat-conducting glue layer for being coated on glass-fiber-fabric substrate layer two sides, with
And heat-conducting glue layer is covered on opposite to each other in the release film layer of the one side of glass-fiber-fabric substrate layer；
The preparation method of the anti-residue glue heat-conducting double-sided adhesive tape the following steps are included:
S1. by 30 ~ 45 parts of hydroxy-terminated polysiloxane, 10 ~ 18 parts of epoxy resin, 30 ~ 40 parts of MQ resin, tetraethoxysilane 2 ~ 5
In part, 1 ~ 3 part of isobutyl triethoxy silane, 2 ~ 6 parts of vinyltoluene and 30 ~ 40 parts of addition reaction kettles of organic solvent, heating
0.1 ~ 1 part of isopropyl titanate and 0.1 ~ 3 part of organic tin catalyst are added after to 130 ~ 135 DEG C, react 2 at 140 ~ 150 DEG C ~
3 hours, silicone pressure sensitive glue is made after cooling；
S2. by 25 ~ 40 parts of graphene powder, 5 ~ 10 parts of nm-class boron nitride, 5 ~ 10 parts of 3- mercaptopropyltriethoxysilane, ethoxy
0.1 ~ 1 part of base acetylenic glycols and remaining organic solvent are added in stirred tank, and high speed dispersion 40 ~ 60 minutes, then will be made in S1
Silicone pressure sensitive glue be slowly added in stirred tank, stir 30 ~ 40 points, be made thermal conductive adhesive；
S3. thermal conductive adhesive obtained in S2 is coated on glass-fiber-fabric substrate layer two sides, drying, solidification form heat-conducting glue layer；
S4. release film layer is covered on heat-conducting glue layer opposite to each other in the one side of glass-fiber-fabric substrate layer, winding cutting obtains described
Anti- residue glue heat-conducting double-sided adhesive tape；
The number is parts by weight, uses the total amount of solvent for 55 ~ 70 parts by weight in S1 and S2.
Further improved technical solution is as follows in above-mentioned technical proposal:
1. in above scheme, the molecular weight of the hydroxy-terminated polysiloxane is 20 ~ 300,000, the hydroxyl of the hydroxy-terminated polysiloxane
Base content is 0.3 ~ 1.5%.
2. in above scheme, the organic tin catalyst is selected from dibutyl tin dilaurate, tin dilaurate dioctyl
At least one of tin, dibutyl tin dilaurate or stannous octoate.
3. in above scheme, the organic solvent is ethyl acetate.
4. in above scheme, the glass-fiber-fabric substrate layer with a thickness of 20 ~ 50 μm.
5. in above scheme, the heat-conducting glue layer with a thickness of 5 ~ 20 μm.
Due to the application of the above technical scheme, compared with the prior art, the invention has the following advantages:
1. the preparation method of the anti-residue glue heat-conducting double-sided adhesive tape of the present invention, heat-conducting glue layer is using 25 ~ 40 parts of graphene powder and receives
Rice 5 ~ 10 parts of formation composite heat-conducting systems of boron nitride, and it is added to 0.1 ~ 1 part of ethyoxyl acetylenic glycols and 3- mercapto propyl triethoxy
5 ~ 10 parts of silane are played heat filling addition few as far as possible with heat filling common distribution further to improve its heating conduction
Amount achievees the effect that high thermal conductivity, and the thermal coefficient that glue-line is made reaches 3W/ (m.K) or more, avoids heat filling and adds
Add excessive the problem of influencing colloid mechanical property and insulation performance.
2. the preparation method of the anti-residue glue heat-conducting double-sided adhesive tape of the present invention, heat-conducting glue layer formula is with hydroxy-terminated polysiloxane
30 ~ 45 parts are basic resin and introduce 10 ~ 18 parts of epoxy resin, on this basis, also added tetraethoxysilane 2 ~ 5
1 ~ 3 part and 2 ~ 6 parts of vinyltoluene of part, isobutyl triethoxy silane, and use 0.1 ~ 1 part of isopropyl titanate and organic tin
The mixed catalyst system that 0.1 ~ 3 part of catalyst, glue-line crosslink density obtained is big, cohesive force with higher, therefore the present invention
For the anti-residue glue heat-conducting double-sided adhesive tape of preparation without obvious residue glue after hydrothermal aging, removable property is good.
Detailed description of the invention
Attached drawing 1 is residue glue heat-conducting double-sided adhesive tape schematic diagram of the present invention.
Specific embodiment
The present invention will be further described below with reference to examples:
Embodiment 1 ~ 4: a kind of preparation method of anti-residue glue heat-conducting double-sided adhesive tape, the anti-residue glue heat-conducting double-sided adhesive tape includes glass
Cloth base material layer, the heat-conducting glue layer for being coated on glass-fiber-fabric substrate layer two sides and heat-conducting glue layer is covered on opposite to each other in glass-fiber-fabric substrate
The release film layer of the one side of layer；
Above-mentioned glass-fiber-fabric substrate layer with a thickness of 30 μm, above-mentioned heat-conducting glue layer with a thickness of 15 μm；
The preparation method of above-mentioned anti-residue glue heat-conducting double-sided adhesive tape the following steps are included:
S1. by 30 ~ 45 parts of hydroxy-terminated polysiloxane, 10 ~ 18 parts of epoxy resin, 30 ~ 40 parts of MQ resin, tetraethoxysilane 2 ~ 5
In part, 1 ~ 3 part of isobutyl triethoxy silane, 2 ~ 6 parts of vinyltoluene and 30 ~ 40 parts of addition reaction kettles of organic solvent, heating
0.1 ~ 1 part of isopropyl titanate and 0.1 ~ 3 part of organic tin catalyst are added after to 130 ~ 135 DEG C, react 2 at 140 ~ 150 DEG C ~
3 hours, silicone pressure sensitive glue is made after cooling；
S2. by 25 ~ 40 parts of graphene powder, 5 ~ 10 parts of nm-class boron nitride, 5 ~ 10 parts of 3- mercaptopropyltriethoxysilane, ethoxy
0.1 ~ 1 part of base acetylenic glycols and remaining organic solvent are added in stirred tank, and high speed dispersion 40 ~ 60 minutes, then will be made in S1
Silicone pressure sensitive glue be slowly added in stirred tank, stir 30 ~ 40 points, be made thermal conductive adhesive；
S3. thermal conductive adhesive obtained in S2 is coated on glass-fiber-fabric substrate layer two sides, drying, solidification form heat-conducting glue layer；
S4. release film layer is covered on heat-conducting glue layer opposite to each other in the one side of glass-fiber-fabric substrate layer, winding cutting obtains described
Anti- residue glue heat-conducting double-sided adhesive tape；
Heat-conducting glue layer in each embodiment is specifically made of following parts by weight of component:
Table 1
The molecular weight of above-mentioned hydroxy-terminated polysiloxane is 20 ~ 300,000, the hydroxy radical content of above-mentioned hydroxy-terminated polysiloxane is 0.3 ~
1.5%。
The organic tin catalyst of above-described embodiment 1 is dibutyl tin dilaurate, the organic tin catalyst of embodiment 2
For tin dilaurate dioctyl tin, the organic tin catalyst of embodiment 3 is dibutyl tin dilaurate, the organotin of embodiment 4
Class catalyst is stannous octoate.
Above-mentioned organic solvent is ethyl acetate.
Comparative example 1 ~ 3, a kind of preparation method of heat-conducting double-sided adhesive tape, the heat-conducting double-sided adhesive tape include glass-fiber-fabric substrate
Layer is coated on the heat-conducting glue layer on glass-fiber-fabric substrate layer two sides and is covered on heat-conducting glue layer opposite to each other in the one of glass-fiber-fabric substrate layer
The release film layer in face；
Above-mentioned glass-fiber-fabric substrate layer with a thickness of 30 μm, above-mentioned heat-conducting glue layer with a thickness of 15 μm；
The preparation method of above-mentioned heat-conducting double-sided adhesive tape the following steps are included:
S1. by hydroxy-terminated polysiloxane, epoxy resin, MQ resin, tetraethoxysilane, isobutyl triethoxy silane, ethylene
Base toluene and part organic solvent are added in reaction kettle, and isopropyl titanate is added after being warming up to 130 ~ 135 DEG C and organic tin is urged
Agent is reacted 2 ~ 3 hours at 140 ~ 150 DEG C, and silicone pressure sensitive glue is made after cooling；
S2. by graphene powder, nm-class boron nitride, 3- mercaptopropyltriethoxysilane, ethyoxyl acetylenic glycols and remaining organic
Solvent is added in stirred tank, and high speed dispersion 40 ~ 60 minutes, then silicone pressure sensitive glue obtained in S1 is slowly added to stir
In kettle, 30 ~ 40 points are stirred, thermal conductive adhesive is made；
S3. thermal conductive adhesive obtained in S2 is coated on glass-fiber-fabric substrate layer two sides, drying, solidification form heat-conducting glue layer；
S4. release film layer is covered on heat-conducting glue layer opposite to each other in the one side of glass-fiber-fabric substrate layer, winding cutting obtains described
Heat-conducting double-sided adhesive tape；
The heat-conducting glue layer of each comparative example is specifically made of following parts by weight of component:
Table 2
The molecular weight of above-mentioned hydroxy-terminated polysiloxane is 20 ~ 300,000, the hydroxy radical content of above-mentioned hydroxy-terminated polysiloxane is 0.3 ~
1.5%。
The organic tin catalyst of above-mentioned comparative example 1 is dibutyl tin dilaurate, the organic tin catalyst of comparative example 2
For dibutyl tin dilaurate, the organic tin catalyst of comparative example 3 is stannous octoate.
Above-mentioned organic solvent is ethyl acetate.
The heat-conducting glue layer performance of heat-conducting double-sided adhesive tape made from above-described embodiment 1 ~ 4 and comparative example 1 ~ 3 is as shown in table 3:
Table 3
In table 3, "×" indicates that obvious residue glue, " △ " indicate slight residue glue, and "○" indicates no residue glue.
As shown in the evaluation result of table 3, the heat-conducting glue layer of the anti-residue glue heat-conducting double-sided adhesive tape of various embodiments of the present invention preparation
Thermal coefficient be above each comparative example, and also without obvious residue glue after hydrothermal aging, adhesive tape removable property obtained is good.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (6)
1. a kind of preparation method of anti-residue glue heat-conducting double-sided adhesive tape, it is characterised in that: the anti-residue glue heat-conducting double-sided adhesive tape includes
Glass-fiber-fabric substrate layer, the heat-conducting glue layer for being coated on glass-fiber-fabric substrate layer two sides and heat-conducting glue layer is covered on opposite to each other in glass-fiber-fabric
The release film layer of the one side of substrate layer；
The preparation method of the anti-residue glue heat-conducting double-sided adhesive tape the following steps are included:
S1. by 30 ~ 45 parts of hydroxy-terminated polysiloxane, 10 ~ 18 parts of epoxy resin, 30 ~ 40 parts of MQ resin, tetraethoxysilane 2 ~ 5
In part, 1 ~ 3 part of isobutyl triethoxy silane, 2 ~ 6 parts of vinyltoluene and 30 ~ 40 parts of addition reaction kettles of organic solvent, heating
0.1 ~ 1 part of isopropyl titanate and 0.1 ~ 3 part of organic tin catalyst are added after to 130 ~ 135 DEG C, react 2 at 140 ~ 150 DEG C ~
3 hours, silicone pressure sensitive glue is made after cooling；
S2. by 25 ~ 40 parts of graphene powder, 5 ~ 10 parts of nm-class boron nitride, 5 ~ 10 parts of 3- mercaptopropyltriethoxysilane, ethoxy
0.1 ~ 1 part of base acetylenic glycols and remaining organic solvent are added in stirred tank, and high speed dispersion 40 ~ 60 minutes, then will be made in S1
Silicone pressure sensitive glue be slowly added in stirred tank, stir 30 ~ 40 points, be made thermal conductive adhesive；
S3. thermal conductive adhesive obtained in S2 is coated on glass-fiber-fabric substrate layer two sides, drying, solidification form heat-conducting glue layer；
S4. release film layer is covered on heat-conducting glue layer opposite to each other in the one side of glass-fiber-fabric substrate layer, winding cutting obtains described
Anti- residue glue heat-conducting double-sided adhesive tape；
The number is parts by weight, uses the total amount of solvent for 55 ~ 70 parts by weight in S1 and S2.
2. the preparation method of anti-residue glue heat-conducting double-sided adhesive tape according to claim 1, it is characterised in that: the terminal hydroxy group is poly-
The molecular weight of siloxanes is 20 ~ 300,000, and the hydroxy radical content of the hydroxy-terminated polysiloxane is 0.3 ~ 1.5%.
3. the preparation method of anti-residue glue heat-conducting double-sided adhesive tape according to claim 1, it is characterised in that: the organic tin
Catalyst is in dibutyl tin dilaurate, tin dilaurate dioctyl tin, dibutyl tin dilaurate or stannous octoate
It is at least one.
4. the preparation method of anti-residue glue heat-conducting double-sided adhesive tape according to claim 1, it is characterised in that: the organic solvent
For ethyl acetate.
5. the preparation method of anti-residue glue heat-conducting double-sided adhesive tape according to claim 1, it is characterised in that: the glass fiber fabric base
Material layer with a thickness of 20 ~ 50 μm.
6. the preparation method of anti-residue glue heat-conducting double-sided adhesive tape according to claim 1, it is characterised in that: the heat-conducting glue layer
With a thickness of 5 ~ 20 μm.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113736383A (en) * | 2021-08-26 | 2021-12-03 | 深圳市明粤科技有限公司 | Organic silicon heat-conducting adhesive film and preparation method and application thereof |
| CN115710472A (en) * | 2022-10-31 | 2023-02-24 | 福建友谊胶粘带集团有限公司 | High-thermal-conductivity adhesive tape with good heat dissipation effect and preparation method thereof |
| CN116376395A (en) * | 2023-03-21 | 2023-07-04 | 广东长大道路养护有限公司 | Steel bar antirust coating and construction method thereof |
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| CN113736383A (en) * | 2021-08-26 | 2021-12-03 | 深圳市明粤科技有限公司 | Organic silicon heat-conducting adhesive film and preparation method and application thereof |
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| CN115710472B (en) * | 2022-10-31 | 2024-06-18 | 福建友谊胶粘带集团有限公司 | High-heat-conductivity adhesive tape with good heat dissipation effect and preparation method thereof |
| CN116376395A (en) * | 2023-03-21 | 2023-07-04 | 广东长大道路养护有限公司 | Steel bar antirust coating and construction method thereof |
| CN116376395B (en) * | 2023-03-21 | 2024-01-12 | 广东长大道路养护有限公司 | Steel bar antirust coating and construction method thereof |
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