CN110052954A - Grinding polisher - Google Patents
Grinding polisher Download PDFInfo
- Publication number
- CN110052954A CN110052954A CN201810042776.8A CN201810042776A CN110052954A CN 110052954 A CN110052954 A CN 110052954A CN 201810042776 A CN201810042776 A CN 201810042776A CN 110052954 A CN110052954 A CN 110052954A
- Authority
- CN
- China
- Prior art keywords
- abrasive disk
- mill
- axis
- polisher lapper
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000227 grinding Methods 0.000 title abstract description 18
- 238000001816 cooling Methods 0.000 claims abstract description 38
- 238000005498 polishing Methods 0.000 claims abstract description 19
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000012530 fluid Substances 0.000 claims description 9
- 238000003801 milling Methods 0.000 claims description 7
- 238000011068 loading method Methods 0.000 claims description 6
- 238000004064 recycling Methods 0.000 claims description 5
- 210000000078 claw Anatomy 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 claims description 2
- 239000013078 crystal Substances 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract description 4
- 239000007769 metal material Substances 0.000 abstract description 4
- 239000010980 sapphire Substances 0.000 abstract description 4
- 229910052594 sapphire Inorganic materials 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 239000005304 optical glass Substances 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000005357 flat glass Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
- 239000003921 oil Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 5
- 230000005484 gravity Effects 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
- B24B47/06—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by liquid or gas pressure only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a grinding and polishing machine which comprises a rack, an oil-immersed integrated transmission machine core, a water basin, a water retaining ring, a central small shaft, a lower grinding shaft, a top wheel, a lower grinding disc, a cooling grinding disc, a water tank, a floating seat, a rotary joint, a cross beam, an upright post and a main cylinder. The grinding and polishing machine is mainly used for grinding and polishing piezoelectric crystals, compound semiconductors, silicon crystals, optical glass, ceramic wafers, window glass, metal materials, sapphire and other hard and brittle materials, and has high precision and high efficiency.
Description
Technical field
The present invention relates to polishing grinding equipment technical fields more particularly to one kind to be mainly used for piezo-electric crystal, compound half
Conductor, silicon crystal, optical glass, potsherd, sight glass, metal material, sapphire and other hard brittle materials it is high-precision
Degree and efficient polisher lapper.
Background technique
The grinding machine that grinder grinds workpiece surface with the lap tool for coating or being embedded in abrasive material, is mainly used for grinding work-piece
In high precision plane, inside and outside cylindrical surface, circular conical surface, spherical surface, flank and its alloytype face.Grinding is a kind of in Ultra-precision Turning
Important processing method, its advantage is that machining accuracy is high, rapidoprint range is wide.But tradition grinding exists, and processing efficiency is low, processing
At high cost, noise is greatly, vibration is big, transmission efficiency is low, the loss of unstable product quality, polishing fluid is fast, cabinet inside temperature height is scattered
The disadvantages of hot slow, machining accuracy and processing quality are unstable, this makes traditional abrasive application receive certain restrictions.
Summary of the invention
The main object of the present invention is to provide one kind and is mainly used for piezo-electric crystal, compound semiconductor, silicon crystal, optics glass
High-precision and the efficient grinding throwing of glass, potsherd, sight glass, metal material, sapphire and other hard brittle materials
Ray machine.
In order to realize the main object of the present invention, it includes rack, oil immersed type one that the present invention, which provides a kind of polisher lapper,
Driver core, basin, retaining ring, the small axis in center, lower mill axis, top wheel, lower abrasive disk, cooling abrasive disk, sink, floating seat, rotation
Adapter, crossbeam, column and master cylinder, oil immersed type integrated transmission machine core are located at the bottom of rack, oil immersed type integrated transmission machine
Core provides driving force for polisher lapper, and crossbeam connect and is located at column the top of rack, main gas is equipped with above crossbeam
Cylinder, cooling abrasive disk is provided with below crossbeam, and the mobile shaft tail end of master cylinder is connect with cooling abrasive disk by floating seat, led
Cylinder can control shifting axle vertical shift, and rotary joint covers on the outer wall of floating seat, and sink is located at the top of cooling abrasive disk,
Lower abrasive disk is located at the lower section of cooling abrasive disk, and the small axis in center extends rotatably through the axle center setting of lower abrasive disk, and top wheel case exists
The one end in the small cooling abrasive disk direction of axis direction in center, the axis hole of cooling abrasive disk can cover on the wheel of top, and lower mill axis is rotatably
Cover in the outside of the small axis in center, lower mill axis rotatably covers in the outside of the small axis in center, and lower mill axis is connect with lower abrasive disk, under grind
The workpiece jig of clamping workpiece can be placed on mill, water blocking snare is located under lower abrasive disk in the periphery of lower abrasive disk, basin
Side, and the outer wall of basin is aligned in the axial direction with the outer ring of retaining ring.
Further scheme is that polisher lapper further includes security lock arrangement and safety collar, and safe ring set connects in rotation
On head, security lock arrangement is mounted on crossbeam, and the claw of security lock arrangement is connect with being vertically movable with safety collar.
Further scheme is that polisher lapper further includes time small axis, sun tooth, mill drags and erratic star wheel, wandering star
Wheel is located on lower abrasive disk, and workpiece jig is mounted on erratic star wheel, and secondary small axle position is and secondary between the small axis in center and lower mill axis
Small axis rotatably covers in the outside of the small axis in center, and sun tooth covers on secondary small axis, and secondary small axis control sun tooth spiral turns, and mill drags
It covers on lower mill axis, lower mill axis control mill drags rotation, and lower abrasive disk is placed on mill and drags.
Further scheme is that polisher lapper further includes that lifting device for gear ring, ring gear and gear ring drag, and gear ring drags
It covers on lifting device for gear ring, lifting device for gear ring can control gear ring to drag vertical shift and transmit power, and internal tooth snare is ground under
The outside of mill and dragging with gear ring is connect.
Further scheme is that polisher lapper further includes milling bucket, and be milled bucket removably external polisher lapper,
Milling bucket is for loading, stirring, providing, recycling, filtering polishing fluid.
Further scheme is that polisher lapper further includes electronic box, and electronic box is mounted on column, and electronic box is for placing electricity
Gas components.
By above scheme as it can be seen that rack mainly carries the gravity and operating pressure of whole polisher lapper, oil immersed type one
Driver core mainly provides the driving force of whole polisher lapper, and basin mainly provides the loading of polishing fluid, recycling, and retaining ring exists
Can play when work prevents polishing fluid from splashing out.When work, master cylinder control shifting axle moves straight down, drives cooling
Abrasive disk synchronizes to be moved down vertically, up to the shaft hole sleeve of cooling abrasive disk is on the wheel of top, so that the small axis in center gives cooling grinding
Disk transmits power.Secondary little axle sleeve transmits power to sun tooth outside the small axis in center, and lower mill axle sleeve is ground under giving outside secondary small axis
Mill transmits power, and gear ring, which drags to cover, transmits power to ring gear outside lifting device for gear ring.Lifting device for gear ring is for controlling
Ring gear moves up and down vertically and transmits power, to improve the service life of ring gear.Mill is dragged for loading lower abrasive disk,
Carrying operating pressure prevents lower abrasive disk from deforming.Top wheel transmits power to cooling abrasive disk, and erratic star wheel is placed on lower abrasive disk
And engaged respectively with sun tooth, ring gear, sun tooth is consistent with ring gear direction of rotation.Lower abrasive disk and ring gear direction of rotation
Unanimously, on the contrary, erratic star wheel provides workpiece jig for clamping workpiece, workpiece is placed on for lower abrasive disk and cooling abrasive disk direction of rotation
Polishing grinding is carried out in erratic star wheel.Cooling abrasive disk at work cools down to workpiece, reduces workpiece deflection.Sink is work
Uniformly provide polishing fluid when making, floating seat provides compensation rate, rotary joint when being more preferably bonded for cooling abrasive disk and lower abrasive disk
Cooling water is provided for cooling abrasive disk.Safety collar and safety device are after completing entire polishing, when manually to take out product,
One safety precautions is provided.It is suspended on safety device and is not fallen by the cooling abrasive disk of master cylinder pull-up and safety collar, it is horizontal
Beam, column, electronic box are combined into gantry structure carrying gravity and operating pressure.Above-mentioned polisher lapper be mainly used for piezo-electric crystal,
Compound semiconductor, silicon crystal, optical glass, potsherd, sight glass, metal material, sapphire and other hard brittleness materials
The grinding and polishing of material, precision are high and high-efficient.
Detailed description of the invention
Fig. 1 is the structure chart of polisher lapper embodiment of the present invention.
Fig. 2 is the main view of polisher lapper embodiment of the present invention.
Fig. 3 is the side view of polisher lapper embodiment of the present invention.
Fig. 4 is the top view of polisher lapper embodiment of the present invention.
Fig. 5 is cross-sectional view of the Fig. 4 at A-A.
The invention will be further described with reference to the accompanying drawings and embodiments.
Specific embodiment
Referring to Fig. 1 to Fig. 5, polisher lapper 1 include rack 2, oil immersed type integrated transmission machine core 3, basin 4, retaining ring 5,
The small axis 6 in center, lower mill axis 8, top wheel 12, mill drag 11, lower abrasive disk 14, cooling abrasive disk 17, sink 18, floating seat 19, rotation
Adapter 20, crossbeam 22, column 23, security lock arrangement 26, safety collar 21, secondary small axis 7, sun tooth 13, ring gear 15, gear ring drag
9, erratic star wheel 16, lifting device for gear ring 10, milling bucket 27, electronic box 24 and master cylinder 25, oil immersed type integrated transmission machine core 3 are located at
The bottom of rack 2, oil immersed type integrated transmission machine core 3 are that polisher lapper 1 provides driving force.
Crossbeam 22 connect and is located at the top of rack 2 with column 23, and the top of crossbeam 22 is equipped with master cylinder 25, crossbeam 22
Lower section be provided with cooling abrasive disk 17, the mobile shaft tail end of master cylinder 25 is connect by floating seat 19 with abrasive disk 17 is cooled down,
Master cylinder 25 can control shifting axle vertical shift, 20 sets of rotary joint on the outer wall of floating seat 19, sink 18 be located at cooling grinds
The top of mill 17.21 sets of safety collar on rotary joint 20, security lock arrangement 26 is mounted on crossbeam 22, security lock arrangement 26
Claw connect with safety collar 21 with being vertically movable, the quantity of the present embodiment security lock arrangement 26 is two.
Lower abrasive disk 14 is located at the lower section of cooling abrasive disk 17, and the small axis 6 in center extends rotatably through the axis of lower abrasive disk 14
12 sets of one end in the small axis 6 in center towards cooling 17 direction of abrasive disk are taken turns on heart setting, top, and the axis hole of cooling abrasive disk 17 can cover
On top wheel 12.Lower mill axis 8 rotatably covers in the outside of the small axis 6 in center, and mill drags 11 sets on lower mill axis 8, and lower mill axis 8 controls
Mill drags 11 rotations, and lower abrasive disk 14 is placed on mill and drags on 11, and the workpiece jig of clamping workpiece can be placed on lower abrasive disk 14
(not indicating).5 sets of the retaining ring peripheries in lower abrasive disk 14, basin 4 is located at the lower section of lower abrasive disk 14, and basin 4 is outer
Wall is aligned in the axial direction with the outer ring of retaining ring 5.
Erratic star wheel 16 is located on lower abrasive disk 14, and workpiece jig is mounted on erratic star wheel 16.Secondary small axis 7 is located at the small axis in center
Between 6 and lower mill axis 8, and secondary small axis 7 rotatably covers in the outside of the small axis 6 in center.13 sets of sun tooth on secondary small axis 7,
Secondary small axis 7 controls sun tooth 13 and rotates.Gear ring drags 9 sets on lifting device for gear ring 10, and lifting device for gear ring 10 can control gear ring
Drag 9 vertical shifts and transmit power, 15 sets of ring gear lower abrasive disk 14 outside and drag 9 connections with gear ring.Being milled bucket 27 can
Releasably external polisher lapper 1, milling bucket 27 is for loading, stirring, providing, recycling, filtering polishing fluid.Electronic box 24 is mounted on
On column 23, electronic box 24 is for placing electric components.
Rack 2 mainly carries the gravity and operating pressure of whole polisher lapper 1, and oil immersed type integrated transmission machine core 3 is main
The driving force of whole polisher lapper 1 is provided, basin 4 mainly provides the loading of polishing fluid, recycling, retaining ring 5 work when
Time, which can play, prevents polishing fluid from splashing out.When work, master cylinder 25 controls shifting axle and moves straight down, drives cooling abrasive disk
17 synchronize and move down vertically, until the shaft hole sleeve of cooling abrasive disk 17 is on top wheel 12, so that the small axis 6 in center is to cooling grinding
Disk 17 transmits power.7 sets of secondary small axis are transmitted power to sun tooth 13 outside the small axis 6 in center, and 8 sets of lower mill axis outside secondary small axis 7
Power is transmitted to lower abrasive disk 14 in face, and gear ring drags 9 sets to transmit power to ring gear 15 outside lifting device for gear ring 10.Gear ring liter
Falling unit 10 moves up and down and provides power vertically for controlling ring gear 15, to improve the service life of ring gear 15.Mill
Disk drags 11 to be used to load lower abrasive disk 14, and carrying operating pressure prevents lower abrasive disk 14 from deforming.Top wheel 12 is to cooling abrasive disk 17
Power is transmitted, erratic star wheel 16 is placed on lower abrasive disk 14 and respectively with sun tooth 13, ring gear 15 and engages, sun tooth 13 and interior
15 direction of rotation of gear ring is consistent.Lower abrasive disk 14 is consistent with 15 direction of rotation of ring gear, lower abrasive disk 14 and cooling abrasive disk 17
On the contrary, erratic star wheel 16 provides workpiece jig for clamping workpiece, workpiece, which is placed in erratic star wheel 16, carries out polishing grinding for direction of rotation.
Cooling abrasive disk 17 at work cools down to workpiece, reduces workpiece deflection.Sink 18 uniformly provides polishing when being work
Liquid, floating seat 19 provide compensation rate when being more preferably bonded for cooling abrasive disk 17 and lower abrasive disk 14, and rotary joint 20 is that cooling is ground
Mill 17 provides cooling water.Safety collar 21 and safety device 26 when manually to take out product, mention after completing entire polishing
For a safety precautions.It is suspended on safety device 26 not fall by the cooling abrasive disk 17 of 25 pull-up of master cylinder and safety collar 21
It falls, crossbeam 22, column 23, electronic box 24 are combined into gantry structure carrying gravity and operating pressure.
Above embodiments, only preferred embodiments of the invention, be not to limit the scope of the present invention, therefore it is all according to the present invention
The equivalent change or modification that structure, feature and principle described in claim is done should be included in the invention patent Shen
It please be in range.
Claims (6)
1. polisher lapper, it is characterised in that:
Including rack, oil immersed type integrated transmission machine core, basin, retaining ring, the small axis in center, lower mill axis, top wheel, lower abrasive disk, cold
But abrasive disk, sink, floating seat, rotary joint, crossbeam, column and master cylinder, the oil immersed type integrated transmission machine core are located at
The bottom of the rack, the oil immersed type integrated transmission machine core provide driving force for the polisher lapper；
The crossbeam connect with the column and is located at the top of the rack, and master cylinder, institute are equipped with above the crossbeam
It states and is provided with cooling abrasive disk below crossbeam, the mobile shaft tail end of the master cylinder is ground by the floating seat and the cooling
Mill connection, the master cylinder can control the shifting axle vertical shift, and the rotary joint covers the outer wall in the floating seat
On, the sink is located at the top of the cooling abrasive disk；
The lower abrasive disk is located at the lower section of the cooling abrasive disk, and the small axis in center extends rotatably through the lower abrasive disk
Axle center setting, the top wheel case in the small axis in the center towards the one end in the cooling abrasive disk direction, it is described cooling to grind
The axis hole of disk can cover on the wheel of the top；
The lower mill axis rotatably covers in the outside of the small axis in the center, and the lower mill axis is connect with the lower abrasive disk, institute
State the workpiece jig that clamping workpiece can be placed on lower abrasive disk；
The water blocking snare is located at the lower section of the lower abrasive disk in the periphery of the lower abrasive disk, the basin, and described
The outer wall of basin is aligned in the axial direction with the outer ring of the retaining ring.
2. polisher lapper according to claim 1, it is characterised in that:
The polisher lapper further includes security lock arrangement and safety collar, and the safe ring set is described on the rotary joint
Security lock arrangement is mounted on the crossbeam, and the claw of the security lock arrangement is connect with being vertically movable with the safety collar.
3. polisher lapper according to claim 1 or 2, it is characterised in that:
The polisher lapper further includes time small axis, sun tooth, mill drags and erratic star wheel, the erratic star wheel be located at it is described under grind
On mill, the workpiece jig is mounted on the erratic star wheel；
Described small axle position is between the small axis in the center and the lower mill axis, and described small axis is rotatably covered described
The outside of the small axis in center；
The sun tooth covers on described small axis, and described small axis controls the sun tooth spiral and turn；
The mill, which drags, to be covered on the lower mill axis, and the lower mill axis controls the mill and drags rotation, and the lower abrasive disk is placed
It is dragged in the mill.
4. polisher lapper according to claim 3, it is characterised in that:
The polisher lapper further includes that lifting device for gear ring, ring gear and gear ring drag, and the gear ring, which drags, to be covered in the gear ring
On lifting device, the lifting device for gear ring can control the gear ring to drag vertical shift and transmit power, and the internal tooth snare exists
The outside of the lower abrasive disk and dragging with the gear ring is connect.
5. polisher lapper according to claim 4, it is characterised in that:
The polisher lapper further includes milling bucket, the milling bucket removably external polisher lapper, the milling
Bucket is for loading, stirring, providing, recycling, filtering polishing fluid.
6. polisher lapper according to claim 5, it is characterised in that:
The polisher lapper further includes electronic box, and the electronic box is mounted on the column, and the electronic box is for placing electrical zero
Component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810042776.8A CN110052954A (en) | 2018-01-17 | 2018-01-17 | Grinding polisher |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810042776.8A CN110052954A (en) | 2018-01-17 | 2018-01-17 | Grinding polisher |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110052954A true CN110052954A (en) | 2019-07-26 |
Family
ID=67314824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810042776.8A Withdrawn CN110052954A (en) | 2018-01-17 | 2018-01-17 | Grinding polisher |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110052954A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112621395A (en) * | 2021-01-14 | 2021-04-09 | 嘉兴学院 | Sapphire crystal precision grinding device |
| CN112935996A (en) * | 2021-01-29 | 2021-06-11 | 温州市全越科技有限公司 | High-precision polishing machine for optical lens and grinding device on high-precision polishing machine |
| CN112935995A (en) * | 2021-01-29 | 2021-06-11 | 温州市全越科技有限公司 | Optical lens high-precision polishing machine and power transmission device thereof |
| CN112936087A (en) * | 2021-01-29 | 2021-06-11 | 温州市全越科技有限公司 | High-precision grinding and polishing processing equipment and polishing processing technology for optical lens |
| CN112959170A (en) * | 2021-01-29 | 2021-06-15 | 温州市全越科技有限公司 | Optical lens piece high accuracy burnishing machine and damper and go up grinder thereof |
| CN112963463A (en) * | 2021-01-29 | 2021-06-15 | 温州市全越科技有限公司 | Optical lens polishing machine and large gear ring clutch mechanism and power transmission device thereof |
| CN113696091A (en) * | 2021-10-27 | 2021-11-26 | 江苏华兴激光科技有限公司 | Rapid grinding method and device for epitaxial wafer |
| CN114750068A (en) * | 2021-04-01 | 2022-07-15 | 苏州椿桔五金制品有限公司 | Plane grinding machine with quick cooling structure |
| CN117086774A (en) * | 2023-10-19 | 2023-11-21 | 新乡市斯凯夫机械有限公司 | Special grinding machine and grinding process for ceramic parts |
-
2018
- 2018-01-17 CN CN201810042776.8A patent/CN110052954A/en not_active Withdrawn
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112621395A (en) * | 2021-01-14 | 2021-04-09 | 嘉兴学院 | Sapphire crystal precision grinding device |
| CN112621395B (en) * | 2021-01-14 | 2022-02-01 | 嘉兴学院 | Sapphire crystal precision grinding device |
| CN112935996A (en) * | 2021-01-29 | 2021-06-11 | 温州市全越科技有限公司 | High-precision polishing machine for optical lens and grinding device on high-precision polishing machine |
| CN112935995A (en) * | 2021-01-29 | 2021-06-11 | 温州市全越科技有限公司 | Optical lens high-precision polishing machine and power transmission device thereof |
| CN112936087A (en) * | 2021-01-29 | 2021-06-11 | 温州市全越科技有限公司 | High-precision grinding and polishing processing equipment and polishing processing technology for optical lens |
| CN112959170A (en) * | 2021-01-29 | 2021-06-15 | 温州市全越科技有限公司 | Optical lens piece high accuracy burnishing machine and damper and go up grinder thereof |
| CN112963463A (en) * | 2021-01-29 | 2021-06-15 | 温州市全越科技有限公司 | Optical lens polishing machine and large gear ring clutch mechanism and power transmission device thereof |
| CN112963463B (en) * | 2021-01-29 | 2022-09-02 | 佛山市协亮光电制品有限公司 | Optical lens polishing machine and large gear ring clutch mechanism and power transmission device thereof |
| CN114750068A (en) * | 2021-04-01 | 2022-07-15 | 苏州椿桔五金制品有限公司 | Plane grinding machine with quick cooling structure |
| CN113696091B (en) * | 2021-10-27 | 2022-02-08 | 江苏华兴激光科技有限公司 | Rapid grinding method and device for epitaxial wafer |
| CN113696091A (en) * | 2021-10-27 | 2021-11-26 | 江苏华兴激光科技有限公司 | Rapid grinding method and device for epitaxial wafer |
| CN117086774A (en) * | 2023-10-19 | 2023-11-21 | 新乡市斯凯夫机械有限公司 | Special grinding machine and grinding process for ceramic parts |
| CN117086774B (en) * | 2023-10-19 | 2024-01-05 | 新乡市斯凯夫机械有限公司 | Special grinding machine and grinding process for ceramic parts |
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