CN110052789A - A kind of more slit component forming methods and more slit components - Google Patents
A kind of more slit component forming methods and more slit components Download PDFInfo
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- CN110052789A CN110052789A CN201910363561.0A CN201910363561A CN110052789A CN 110052789 A CN110052789 A CN 110052789A CN 201910363561 A CN201910363561 A CN 201910363561A CN 110052789 A CN110052789 A CN 110052789A
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 238000005530 etching Methods 0.000 claims abstract description 77
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- 239000003292 glue Substances 0.000 claims description 25
- 230000008439 repair process Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 10
- 229910001374 Invar Inorganic materials 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 9
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 6
- 238000002601 radiography Methods 0.000 claims description 6
- 238000002048 anodisation reaction Methods 0.000 claims description 4
- 238000003860 storage Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 abstract description 9
- 238000000608 laser ablation Methods 0.000 abstract description 5
- 238000000227 grinding Methods 0.000 abstract description 3
- 230000003595 spectral effect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000701 chemical imaging Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 208000020442 loss of weight Diseases 0.000 description 1
- 238000004451 qualitative analysis Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/26—Acidic compositions for etching refractory metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F17/00—Multi-step processes for surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by subclass C21D or C22F or class C25
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/26—Anodisation of refractory metals or alloys based thereon
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/04—Slit arrangements slit adjustment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1847—Manufacturing methods
- G02B5/1857—Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
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Abstract
In order to solve, tradition machinery sword side splicing its slit length of slit is short, width is big, it is difficult to longer high-accuracy slit, and its slit plane degree of the moulding integrated slit of laser ablation and straightness are difficult to the problem of meeting the requirements, the present invention provides a kind of more slit component forming methods and more slit components.Wherein method etches substrate the following steps are included: 1) making more slits；2) more slits are assembled and etches substrate；Specially 2.1) on slit upper cover plate and through slot is offered on slit lower cover plate；Setting, which is repaired, on the slit upper cover plate or slit lower cover plate cuts pad；2.2) more slits etching substrate is arranged between slit upper cover plate and slit lower cover plate；It is etched in more slits and nonlinear elasticity washer is respectively set between substrate and slit upper cover plate and slit lower cover plate；2.3) by repairing the height for grinding and repairing between slit upper cover plate and slit lower cover plate and cutting pad, meet the requirements the straightness of more slit etching substrates and flatness；3) fixed more slits etch substrate.
Description
Technical field
The present invention relates to a kind of slit components, and in particular to a kind of more slit component forming methods and utilizes the forming method
More slit components of production.
Background technique
Spectral imaging technology is that spectral information is obtained while obtaining object space information, obtains image simultaneously to substance
It carries out " fingerprint recognition ", completes the qualitative analysis and quantitative calculating of substance, realize the comprehensive survey to target property and identification.
The key technology for realizing light spectrum image-forming is to be divided and select light technology.In dispersion astigmatism grid spectrophotometric spectra imaging technique
In, the key component that slit component is realized as space dimension slit band push-scanning image is widely used in various push-scanning images
In spectrometer.
Currently, slit is divided into mechanical sword side splicing slit and laser ablation molding one substantially according to slit formation mechenism
Change two class of slit.Slit is spliced since common slit width is micron order in tradition machinery sword side, and difficulty of processing is larger, yields
Low, the used time is processed and splicing process is limited, therefore slit length produced is short, width is big, it is difficult to the longer height of production length
Accurate slit.The moulding integrated slit of laser ablation requires the thinner thickness of slit substrate by light temperature burning and cutting material, simultaneously
High temperature can change the property of material, be affected for the flatness of long slit, straightness.
Summary of the invention
The purpose of the present invention is overcoming the splicing of tradition machinery sword side, its slit length of slit is short, width is big, it is difficult to processing compared with
What long high-accuracy slit and its slit plane degree of the moulding integrated slit of laser ablation and straightness were difficult to meet the requirements asks
Topic, and a kind of more slit component forming methods and more slit components are provided.
To achieve the above object, the present invention provides a kind of more slit component forming methods, is characterized in that, including such as
Lower step:
1) more slits are made and etches substrate
According to more slit morpheme relationship index requests of setting, etching substrate is performed etching, obtains more slit etching bases
Material, the morpheme relationship index request include position, size, width；
2) more slits are assembled and etches substrate
2.1) the first through slot is opened up on slit upper cover plate, is opened up on slit lower cover plate and is led to the second of the cooperation of the first through slot
Slot；Setting, which is repaired, on the slit upper cover plate or slit lower cover plate cuts pad；
2.2) more slits etching substrate is arranged between slit upper cover plate and slit lower cover plate, light is successively worn
Cross the first through slot on slit upper cover plate, the slit on more slits etching substrate, the second through slot on slit lower cover plate；How narrow
Nonlinear elasticity washer is respectively set between seam etching substrate and slit upper cover plate and slit lower cover plate；
2.3) by repairing the height for grinding and repairing between slit upper cover plate and slit lower cover plate and cutting pad, make more slit etching substrates
Straightness and flatness are met the requirements；
3) fixed more slits etch substrate
Slit upper cover plate and slit lower cover plate are fixed.
Further, step 1) makes in more slit etching substrates, and the etching substrate uses with a thickness of 0.3~1mm's
Molybdenum alloy material；
In step 2.1), the slit upper cover plate and slit lower cover plate are all made of invar and are made.
Further, in step 2.1), setting, which is repaired, on four angles of the slit lower cover plate cuts pad, on slit upper cover plate
It is provided with and repairs the heavy platform for cutting pad cooperation.
Further, it in step 2.2), is equipped on the slit upper cover plate and slit lower cover plate non-linear for installing
The annular groove of elastic washer, facilitates elastic washer to install, and prevents elastic washer from relatively moving.
Further, step 1) makes more slits and etches substrate, specific as follows:
1.1) according to more slit morpheme relationship index requests of setting, the exposure mask template of acid corrosion-resistant is made, to exposure mask mould
Plate carries out radiography accuracy checking, if qualified, carries out step 1.2)；If unqualified, return step 1.1)；
1.2) using acid corrosion-resistant glue that exposure mask template is Nian Jie with etching substrate overlapping；
1.3) the etching substrate for being bonded exposure mask template is placed in acid solution and is performed etching, after the completion of etching, micro- radiography inspection
Etching substrate precision is surveyed, if qualified, carries out step 1.4)；If unqualified, return step 1.1)；
1.4) substrate will be etched using release solvent to separate with exposure mask template, obtain more slit etching substrates, examine respectively
Substrate slit formed precision and exposure mask template keep precision, if qualified, storage is stand-by, if unqualified, return step 1.1).
It further, further include that step 1.5) is gold-plated to stand-by more slits etching substrate progress is stored after step 1.4)
And/or surface anodization contaminates black processing.
Further, the fixed more slits of step 3) etch substrate, specific as follows:
3.1) the hole for injecting glue injecting glue on slit upper cover plate or slit lower cover plate, fixed more slits etch substrate；
3.2) it is connected by screw to and fixes slit upper cover plate and slit lower cover plate.
In addition, being characterized in that the present invention also provides a kind of more slit components made using the forming method, wrap
It includes slit upper cover plate, the slit lower cover plate that is fixedly connected with slit upper cover plate and be arranged in slit upper cover plate and slit lower cover plate
Between more slits etch substrate；
The first through slot is opened up on the slit upper cover plate, slit lower cover plate is equipped with the second through slot cooperated with the first through slot,
Nonlinear elasticity washer is respectively arranged between more slit etching substrates and slit upper cover plate and slit lower cover plate；
It is equipped with to repair between the slit upper cover plate and slit lower cover plate and cuts pad, the height of pad is cut by repairing advanced study and training, how narrow is made
The straightness and flatness of seam etching substrate are met the requirements；
The slit upper cover plate or slit lower cover plate are equipped with hole for injecting glue, are marked in the hole for injecting glue and carve for fixing more slits
Lose the injecting glue of substrate.
Further, the slit upper cover plate is all made of invar with slit lower cover plate and is made, and the etching substrate is using thick
Degree is the molybdenum alloy material of 0.3~1mm.
Further, the ring for installing nonlinear elasticity washer is equipped on the slit upper cover plate and slit lower cover plate
Connected in star facilitates elastic washer to install, and prevents elastic washer from relatively moving；
Described repair is cut pad and is arranged on four angles of slit lower cover plate, is provided with and repairs on slit upper cover plate and cuts the heavy of pad cooperation
Platform；The hole for injecting glue is arranged on slit upper cover plate, and by the hole for injecting glue injecting glue on slit upper cover plate, more slits are etched base
Material is fixed, and fixed form is simple.
Compared with prior art, the invention has the advantages that
1, the more slit component forming methods of the present invention, being different from tradition, individually slit forms one by one, entirety is spliced, more slits
Substrate is etched by exposure mask template protection etching molding technological forming, exposure mask template is than slit substrate easy processing and can make repeatedly
With can guarantee on monolithic more slits etching substrates relative coordinate position degree and the more slits etching substrates of muti-piece between single slit
Slit sizes consistent degree it is good, the narrow slit of length length and width degree can be processed；More slits etching substrate is assembled and is fixed,
The height that pad is cut by repairing advanced study and training can guarantee that the straightness of more slit etching substrates and flatness are met the requirements；It is carved in more slits
Erosion substrate and slit upper cover plate and slit lower cover plate between nonlinear elasticity washer is respectively set, guarantee severe mechanical condition,
Miniature deformation under big temperature gradient environment；Traditional single slit laser ablation moulding process is effectively overcome in straightness requirement
Higher etching slits are influenced by environmental mechanics, calorifics, the defect for easily causing system optics image quality to decline.
2, the more slit component forming methods of the present invention etch moulding process using exposure mask template protection, obtain more slit etchings
Substrate, etching substrate uses the molybdenum alloy material with a thickness of 0.3~1mm, so that molding more slit component overall dimensions are small, again
Measure it is small, convenient for the loss of weight of entire optical system.
3, the more slit component forming methods of the present invention carry out gold-plated and/or surface anodization to more slits etching substrate and contaminate
Black processing can be realized the full spectral coverage cut-off of slit component, slit image stray light be avoided, to realize that slit is visible, red
The application of outer full spectral coverage.
4, more slits of the more slit components of the present invention are formed by exposure mask template protection etching technics, and exposure mask template can be anti-
Multiple to use, the height for cutting pad is repaired in adjustment, guarantee the straightness of more slits etching substrates and flatness meet design requirement, it can be achieved that
More slit component flatnesses of long 90mm, wide 30um are better than 1um, and straightness is better than 2um.
5, slit upper cover plate and slit lower cover plate of the present invention are all made of invar and are made, and the thermal expansion coefficient of invar is extremely low, energy
It is kept fixed length within the scope of very wide temperature, can effectively avoid because environment thermal linear expansion causes the straightness of slit to lose.
Detailed description of the invention
Fig. 1 is the process flow chart of the more slit component forming methods of the present invention；
Fig. 2 is the process flow chart that more slit etching substrates are made in embodiment of the present invention method；
Fig. 3 is the explosive view of the more slit component one embodiment of the present invention；
Fig. 4 is the structural schematic diagram in one direction of slit upper cover plate in the more slit components of Fig. 3；
Fig. 5 is more slit morpheme relational graphs of the more slit etching substrates of the embodiment of the present invention；
Each label is described as follows in figure:
1-slit upper cover plate, the first through slot of 11-, 2- nonlinear elasticity washer, the more slits of 3- etch substrates, under 5- slit
Cover board, the second through slot of 51-, 6-, which is repaired, cuts pad, 7- heavy platform, 9- annular groove, 10- hole for injecting glue, 12- mounting hole.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.
As shown in Figure 1, a kind of more slit component forming methods, include the following steps:
1) as shown in Fig. 2, making more slit etching substrates 3
According to more slit morpheme relationship index requests of setting, etching substrate is performed etching, obtains more slit etching bases
Material, the morpheme relationship index request include position, size, width；Specific step is as follows:
1.1) according to more slit morpheme relationship index requests of setting, the exposure mask template of acid corrosion-resistant is made, to exposure mask mould
Plate carries out radiography accuracy checking, if qualified, carries out step 1.2)；If unqualified, return step 1.1)；
1.2) using acid corrosion-resistant glue that exposure mask template is Nian Jie with etching substrate overlapping, etching substrate uses with a thickness of 0.3
The molybdenum alloy material of~1mm, so that molding more slit component overall dimensions are small, weight is small, convenient for subtracting for entire optical system
Weight；
1.3) the etching substrate for being bonded exposure mask template is placed in acid solution and is performed etching, after the completion of etching, micro- radiography inspection
Etching substrate precision is surveyed, if qualified, carries out step 1.4)；If unqualified, return step 1.1)；
1.4) substrate will be etched using release solvent to separate with exposure mask template, obtain more slit etching substrates 3, examine respectively
Substrate slit formed precision and exposure mask template keep precision, if qualified, storage is stand-by, if unqualified, return step 1.1)；
1.5) the more slits etching substrate 3 stand-by to storage carries out the black processing of gold-plated and/or surface anodization dye, Neng Goushi
The existing full spectral coverage cut-off of slit component, avoids slit image stray light, to realize that slit is visible, infrared full spectral coverage answers
With.
2) more slits are assembled and etches substrate
2.1) the first through slot 11 is opened up on slit upper cover plate 1, is opened up on slit lower cover plate 5 and the cooperation of the first through slot 11
Second through slot 51, slit upper cover plate 1 and slit lower cover plate 5 are all made of invar and are made；
2.2) more slits etching substrate 3 is arranged between slit upper cover plate 1 and slit lower cover plate 5, so that light is successively worn
Cross the first through slot 11 on slit upper cover plate 1, the slit on more slits etching substrate 3, the second through slot on slit lower cover plate 5
51；It is etched in more slits and nonlinear elasticity washer 2 is respectively set between substrate 3 and slit upper cover plate 1 and slit lower cover plate 5, it is non-
Linear elasticity washer 2 uses the lesser material of thermal expansion coefficient；Nonlinear elasticity washer 2 in order to facilitate the installation of, in slit upper cover
The annular groove 9 for installing nonlinear elasticity washer 2, the setting of nonlinear elasticity washer are respectively provided on plate 1 and slit lower cover plate 5
On annular groove 9；
In step 2.2), the non-linear nonlinear elasticity washer 2 uses the lesser material of thermal expansion coefficient, such as silicon rubber
Glue.
2.3) by repairing the height for grinding and repairing between slit upper cover plate 1 and slit lower cover plate 5 and cutting pad 6, make more slit etching bases
The straightness and flatness of material 3 are met the requirements；It is typically employed in be arranged to repair on four angles of slit lower cover plate 5 and cuts pad 6, on slit
Cover board 1 is equipped with and repairs the heavy platform 7 for cutting the cooperation of pad 6；
3) fixed more slits etch substrate
3.1) 10 injecting glue of hole for injecting glue on slit upper cover plate 1 or slit lower cover plate 5, fixed more slits etch substrate 3, lead to
More slits etching substrate is fixed frequently with hole for injecting glue 10 is opened up on slit upper cover plate 1；
3.2) threaded hole is opened up on slit upper cover plate 1 and slit lower cover plate 5, be connected by screw to slit upper cover plate 1
It is fixed with slit lower cover plate 5.
As shown in Figure 3 and Figure 4, a kind of more slit components, including slit upper cover plate 1, slit lower cover plate 5 and setting are narrow
Sew on more slits etching substrate 3 between cover board 1 and slit lower cover plate 5；
It is provided with the first through slot 11 on slit upper cover plate 1, is provided on slit lower cover plate 5 and leads to the second of the cooperation of the first through slot 11
Slot 51, the first through slot 11 is identical with the shape of the second through slot 51, matches with more slits etching substrate 3, so that luminous energy is successively worn
Cross the first through slot 11 on slit upper cover plate 1, the slit on more slits etching substrate 3, the second through slot on slit lower cover plate 5
51, it is respectively arranged with nonlinear elasticity washer 2 between slit upper cover plate 1 and slit lower cover plate 5, is etched substrate 3 weeks along more slits
Side arrangement realizes the isolation damper effect of more slit etching substrates 3；In order to install 2 convenience of nonlinear elasticity washer, on slit
It is equipped with the annular groove 9 for installing nonlinear elasticity washer 2 on cover board 1 and slit lower cover plate 5, slit upper cover plate 1 and narrow
It is equipped with to repair between seam lower cover plate 5 and cuts pad 6, the height of pad 6 is cut by repairing advanced study and training, make the straightness peace of more slit etching substrates 3
Face degree is met the requirements, and four angles for being typically employed in slit lower cover plate 5, which are equipped with to repair, cuts pad 6, and slit upper cover plate 1 is equipped with and repairs
Cut pad 6 cooperation heavy platform 7, four repair cut pad 6 height need by assembly be determined, assembly when according to more slits etch
The straightness and planarity requirements of substrate 3 are constantly repaired and grind 4 and repair the height for cutting pad 6, until the straight line of more slits etching substrate 3
Degree and flatness meet design requirement；Slit upper cover plate 1 is equipped with the hole for injecting glue 10 for fixing more slit etching substrates 3, leads to
10 injecting glue of hole for injecting glue is crossed to complete to fix more slit etching substrates 3, slit upper cover plate 1 and slit lower cover plate 5 are equipped with mounting hole
11, slit upper cover plate 1 and slit lower cover plate 5 are completely fixed by the cooperation of screw and mounting hole 11.
The present embodiment provides a kind of more slits etching forming requirements are as follows, as shown in Figure 5:
1) slit width :≤30 μm
2) slit length: single component >=30mm, entire component >=90mm
3) slit is distributed: S1~S3
4) straightness :≤3 μm
5) depth of parallelism between slit :≤6 μm
Slit upper cover plate 1 and slit lower cover plate 5 are all made of invar material and are made, it is possible to prevente effectively from because of environment thermal linear expansion
Caused straightness loss, it is by finite element analysis as can be seen that right using nonlinear elasticity washer (flexible adaptive spring)
Etching substrate carries out vibration isolation and the trim designs that adaptively adjust, it is ensured that slit plane degree is better than 1 μm, and slit length can be with
Reach >=30mm, straightness is better than 2um, while under severe mechanical condition, more slit components are only sent out under big temperature gradient environment
Raw micro-strain；Using invar and the unstressed clamp structure of nonlinear spring, slit maximum distortion is only 1.0363 μm.
Claims (10)
1. a kind of more slit component forming methods, which comprises the steps of:
1) more slits are made and etches substrate
According to more slit morpheme relationship index requests of setting, etching substrate is performed etching, obtains more slit etching substrates
(3), the morpheme relationship index request includes position, size, width；
2) more slits are assembled and etches substrate
2.1) it is opened up on slit upper cover plate (1) the first through slot (11), opens up on slit lower cover plate (5) and match with the first through slot (11)
The second through slot (51) closed；Setting, which is repaired, on the slit upper cover plate (1) or slit lower cover plate (5) cuts pad (6)；
2.2) more slits etching substrate (3) is arranged between slit upper cover plate (1) and slit lower cover plate (5), enables light
Sequentially pass through the first through slot (11) on slit upper cover plate (1), the slit in more slits etching substrate (3), slit lower cover plate (5)
On the second through slot (51)；It is set respectively between more slits etching substrate (3) and slit upper cover plate (1) and slit lower cover plate (5)
Set nonlinear elasticity washer (2)；
2.3) height for cutting pad (6) is repaired between slit upper cover plate (1) and slit lower cover plate (5) by repairing to grind, etches more slits
The straightness and flatness of substrate (3) are met the requirements；
3) fixed more slits etch substrate
Slit upper cover plate (1) and slit lower cover plate (5) is fixed.
2. a kind of more slit component forming methods according to claim 1, it is characterised in that:
Step 1) makes in more slit etchings substrate (3), and the etching substrate uses the molybdenum alloy material with a thickness of 0.3~1mm；
In step 2.1), the slit upper cover plate (1) and slit lower cover plate (5) are all made of invar and are made.
3. a kind of more slit component forming methods according to claim 2, it is characterised in that: in step 2.1), described
Setting, which is repaired, on four angles of slit lower cover plate (5) cuts pad (6), is provided with and repairs the heavy platform for cutting pad (6) cooperation on slit upper cover plate (1)
(7)。
4. a kind of more slit component forming methods according to claim 1, it is characterised in that: described narrow in step 2.2)
Sew on the annular groove (9) being equipped on cover board (1) and slit lower cover plate (5) for installing nonlinear elasticity washer (2).
5. a kind of more slit component forming methods according to any one of claims 1 to 4, which is characterized in that step 1) production
More slits etch substrate, specific as follows:
1.1) according to more slit morpheme relationship index requests of setting, make the exposure mask template of acid corrosion-resistant, to exposure mask template into
Row radiography accuracy checking carries out step 1.2) if qualified；If unqualified, return step 1.1)；
1.2) using acid corrosion-resistant glue that exposure mask template is Nian Jie with etching substrate overlapping；
1.3) the etching substrate for being bonded exposure mask template is placed in acid solution and is performed etching, after the completion of etching, micro- radiography detection is carved
Substrate precision is lost, if qualified, carries out step 1.4)；If unqualified, return step 1.1)；
1.4) substrate will be etched using release solvent to separate with exposure mask template, obtain more slit etchings substrate (3), examine base respectively
Material slit formed precision and exposure mask template keep precision, if qualified, storage is stand-by, if unqualified, return step 1.1).
6. a kind of more slit component forming methods according to claim 5, it is characterised in that: further include after step 1.4)
Step 1.5) carries out the black processing of gold-plated and/or surface anodization dye to stand-by more slits etching substrate (3) is stored.
7. a kind of more slit component forming methods according to claim 6, it is characterised in that: the fixed more slits of step 3) are carved
Substrate is lost, specific as follows:
3.1) hole for injecting glue (10) injecting glue on slit upper cover plate (1) or slit lower cover plate (5), fixed more slits etch substrate
(3)；
3.2) it is connected by screw to slit upper cover plate (1) and slit lower cover plate (5) is fixed.
8. a kind of more slit components, it is characterised in that: be fixedly connected including slit upper cover plate (1), with slit upper cover plate (1) narrow
It stitches lower cover plate (5) and the more slits being arranged between slit upper cover plate (1) and slit lower cover plate (5) etches substrate (3)；
It is opened up the first through slot (11) on the slit upper cover plate (1), slit lower cover plate (5), which is equipped with, to be cooperated with the first through slot (11)
Second through slot (51) is respectively arranged with non-between more slit etchings substrate (3) and slit upper cover plate (1) and slit lower cover plate (5)
Linear elasticity washer (2)；
It is equipped with to repair between the slit upper cover plate (1) and slit lower cover plate (5) and cuts pad (6)；
The slit upper cover plate (1) or slit lower cover plate (5) are equipped with hole for injecting glue (10), are marked in the hole for injecting glue (10) for solid
The injecting glue of fixed more slit etchings substrate (3).
9. a kind of more slit components according to claim 8, it is characterised in that: under the slit upper cover plate (1) and slit
Cover board (5) is all made of invar and is made, and the etching substrate uses the molybdenum alloy material with a thickness of 0.3~1mm.
10. a kind of more slit components according to claim 9, it is characterised in that: under the slit upper cover plate (1) and slit
The annular groove (9) for installing nonlinear elasticity washer (2) is equipped on cover board (5)；
It is described repair cut pad (6) be arranged on four angles of slit lower cover plate (5), be provided with and repair on slit upper cover plate (1) and cut pad (6)
The heavy platform (7) of cooperation；
The hole for injecting glue (10) is arranged on slit upper cover plate (1).
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| CN201910363561.0A CN110052789B (en) | 2019-04-30 | 2019-04-30 | Multi-slit assembly forming method and multi-slit assembly |
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| CN110052789B CN110052789B (en) | 2024-04-05 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110319932A (en) * | 2019-07-09 | 2019-10-11 | 中国科学院光电研究院 | A kind of high light spectrum image-forming optics system |
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| CN107167240A (en) * | 2017-05-26 | 2017-09-15 | 中国科学院光电研究院 | A kind of mechanical double aperture slit |
| CN210756185U (en) * | 2019-04-30 | 2020-06-16 | 中国科学院西安光学精密机械研究所 | Multi-slit assembly |
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| DE2838758A1 (en) * | 1978-09-06 | 1980-03-27 | Balco Filtertechnik Gmbh | Screen for continuously operating centrifuge - produced by electroplating onto matrix formed using PVA-chromium photosensitive lacquer |
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| CN110052789B (en) | 2024-04-05 |
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