CN210756185U - Multi-slit assembly - Google Patents

Multi-slit assembly Download PDF

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Publication number
CN210756185U
CN210756185U CN201920617172.1U CN201920617172U CN210756185U CN 210756185 U CN210756185 U CN 210756185U CN 201920617172 U CN201920617172 U CN 201920617172U CN 210756185 U CN210756185 U CN 210756185U
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Prior art keywords
slit
cover plate
upper cover
lower cover
etching
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CN201920617172.1U
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武登山
张兆会
李立波
贾昕胤
王�锋
李思远
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XiAn Institute of Optics and Precision Mechanics of CAS
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XiAn Institute of Optics and Precision Mechanics of CAS
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Abstract

The utility model provides a many slits subassembly, its slit length of slit is short, the width is big in order to solve traditional machinery sword limit concatenation slit to be difficult to process longer high accuracy slit to and its slit plane degree of laser etching shaping integration slit and straightness accuracy are difficult to the problem that meets the requirements. The component comprises a slit upper cover plate, a slit lower cover plate fixedly connected with the slit upper cover plate, and a multi-slit etching substrate arranged between the slit upper cover plate and the slit lower cover plate; a first through groove is formed in the slit upper cover plate, a second through groove matched with the first through groove is formed in the slit lower cover plate, and nonlinear elastic gaskets are respectively arranged between the multi-slit etching base material and the slit upper cover plate and between the multi-slit etching base material and the slit lower cover plate; a trimming pad is arranged between the slit upper cover plate and the slit lower cover plate; and the slit upper cover plate or the slit lower cover plate is provided with a glue injection hole, and glue injection for fixing the multi-slit etching base material is injected into the glue injection hole.

Description

Multi-slit assembly
Technical Field
The utility model relates to a slit subassembly, concretely relates to many slit subassemblies.
Background
The spectral imaging technology is used for acquiring spectral information while acquiring target spatial information, acquiring images while performing fingerprint identification on substances, completing qualitative analysis and quantitative calculation of the substances and realizing comprehensive detection and identification of target characteristics.
The key technology for realizing spectral imaging is light splitting and light selecting technology. In the dispersive grating spectral imaging technology, the slit component is used as a key component for realizing space dimension slit stripe push-broom imaging and is widely applied to various push-broom imaging spectrometers.
At present, according to the slit forming mechanism, the slits are basically divided into two types, namely a mechanical edge splicing slit and a laser etching forming integrated slit. The width of a common slit of the traditional mechanical edge splicing slit is micron-sized, the processing difficulty is high, the yield is low, and the time consumption is limited by the processing and splicing process, so that the produced slit has short length and large width, and the high-precision slit with long length is difficult to produce. The laser etching and forming integrated slit is formed by burning and cutting materials through light and temperature, so that the thickness of a slit base material is required to be thin, and meanwhile, the properties of the materials can be changed at high temperature, and the influence on the flatness and the straightness of the long slit is large.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming its slit length of traditional mechanical sword limit concatenation slit short, the width is big, is difficult to process longer high accuracy slit to and its slit plane degree of laser etching shaping integration slit and straightness accuracy are difficult to the problem that satisfies the requirement, and provide a many slits subassembly.
In order to achieve the above object, the present invention provides a multi-slit assembly, which is characterized in that,
the slit etching device comprises a slit upper cover plate, a slit lower cover plate fixedly connected with the slit upper cover plate, and a multi-slit etching base material arranged between the slit upper cover plate and the slit lower cover plate; a first through groove is formed in the slit upper cover plate, a second through groove matched with the first through groove is formed in the slit lower cover plate, and nonlinear elastic gaskets are respectively arranged between the multi-slit etching base material and the slit upper cover plate and between the multi-slit etching base material and the slit lower cover plate; a trimming pad is arranged between the slit upper cover plate and the slit lower cover plate; and the slit upper cover plate or the slit lower cover plate is provided with a glue injection hole, and glue injection for fixing the multi-slit etching base material is injected into the glue injection hole.
Furthermore, the slit upper cover plate and the slit lower cover plate are both made of invar steel, and the etching base material is made of a molybdenum alloy material with the thickness of 0.3-1 mm.
Furthermore, the slit upper cover plate and the slit lower cover plate are respectively provided with an annular groove for mounting the nonlinear elastic gasket, so that the elastic gasket is conveniently mounted, and the elastic gasket is prevented from moving relatively.
Furthermore, the trimming pads are arranged at four corners of the slit lower cover plate, the slit upper cover plate is provided with a sinking platform matched with the trimming pads, and the straightness and the flatness of the multi-slit etching base material can meet the requirements by researching the height of the trimming pads.
Furthermore, the glue injection holes are formed in the slit upper cover plate, glue is injected through the glue injection holes in the slit upper cover plate, the multi-slit etching base material is fixed, and the fixing mode is simple.
Further, the multi-slit etching substrate is manufactured by the following steps:
1.1) according to the set requirement of the multi-slit shape and position relation index, manufacturing an acid corrosion resistant mask template, carrying out contrast precision inspection on the mask template, and if the mask template is qualified, carrying out the step 1.2); if not, returning to the step 1.1);
1.2) overlapping and bonding the mask template and the etching substrate by adopting acid corrosion resistant glue;
1.3) placing the etching substrate adhered with the mask template in acid liquor for etching, detecting the precision of the etching substrate by microscopic radiography after etching is finished, and performing the step 1.4 if the etching substrate is qualified; if not, returning to the step 1.1);
1.4) separating the etched substrate from the mask template by using a released solvent to obtain a multi-slit etched substrate, respectively checking the substrate slit forming precision and the mask template holding precision, if the substrate slit forming precision and the mask template holding precision are qualified, storing the substrate slit forming precision and the mask template holding precision for standby, and if the substrate slit forming precision and the mask template holding precision are not qualified, returning to the step 1.1).
Further, the multi-slit etching substrate is subjected to gold plating and/or surface anodization black dyeing.
Compared with the prior art, the utility model has the advantages that:
1. the multi-slit component of the utility model assembles and fixes the multi-slit etching base material, and can ensure that the straightness and the planeness of the multi-slit etching base material meet the requirements by repairing, grinding and trimming the height of the pad; non-linear elastic washers are respectively arranged between the multi-slit etching base material and the slit upper cover plate and the slit lower cover plate, so that tiny deformation under severe mechanical conditions and a large temperature gradient environment is guaranteed; the defect that the optical imaging quality of a system is easily reduced due to the fact that an etched slit with high linearity requirement in the traditional single-slit laser etching forming process is greatly influenced by environmental mechanics and thermal property is overcome.
2. The utility model discloses many slits subassembly adopts mask template protection sculpture forming process to obtain many slits sculpture substrate, and the sculpture substrate adopts thickness to be 0.3 ~ 1 mm's molybdenum alloy material for fashioned many slits subassembly overall dimension is little, weight is little, the whole optical system's of being convenient for subtract heavy.
3. The utility model discloses many slits of many slits subassembly are through mask template protection etching process shaping, and the mask template can be used repeatedly, and the height that fills up is pruned in the adjustment, guarantees that straightness accuracy and the plane degree of many slits sculpture substrate satisfy the designing requirement, can realize long 90mm, and wide 30 um's many slits subassembly plane degree is superior to 1um, and the straightness accuracy is superior to 2 um.
4. The multi-slit etching substrate is subjected to gold plating and/or surface anodization blackening treatment, so that full-spectrum cut-off of the slit assembly can be realized, the influence of slit imaging stray light is avoided, and the application of slit visible and infrared full-spectrum is realized.
5. The utility model discloses apron all adopts the invar steel to make under slit upper cover plate and the slit, and the coefficient of thermal expansion of invar steel is extremely low, can keep the fixed length in very wide temperature range, can effectively avoid leading to the straightness accuracy loss of slit because of environment hot wire expansion.
6. The utility model discloses many slits subassembly forming method, be different from single slit of tradition one by one shaping, whole concatenation, many slits sculpture substrate passes through mask template protection sculpture forming process shaping, and the mask template is than slit substrate workable and can use repeatedly, can guarantee on the single many slits sculpture substrate that relative coordinate position degree, and the slit size uniformity of the many slits sculpture substrate of polylith between single slit position degree, good, slit that workable length is long, the width is narrow.
Drawings
FIG. 1 is a process flow diagram of the multi-slit assembly forming method of the present invention;
FIG. 2 is a flow chart of a process for fabricating a multi-slit etched substrate according to an embodiment of the present invention;
FIG. 3 is an exploded view of one embodiment of the multi-slot assembly of the present invention;
FIG. 4 is a schematic view of one orientation of a slotted upper cover plate of the multi-slot assembly of FIG. 3;
FIG. 5 is a diagram of a multi-slit pattern of a multi-slit etching substrate according to an embodiment of the present invention;
the reference numerals in the drawings are explained as follows:
1-slit upper cover plate, 11-first through groove, 2-nonlinear elastic gasket, 3-multi-slit etching substrate, 5-slit lower cover plate, 51-second through groove, 6-trimming pad, 7-sinking platform, 9-annular groove, 10-glue injection hole and 12-mounting hole.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
As shown in fig. 3 and 4, a multi-slit assembly includes a slit upper cover plate 1, a slit lower cover plate 5, and a multi-slit etching substrate 3 disposed between the slit upper cover plate 1 and the slit lower cover plate 5;
the slit upper cover plate 1 is provided with a first through groove 11, the slit lower cover plate 5 is provided with a second through groove 51 matched with the first through groove 11, the first through groove 11 and the second through groove 51 have the same shape and are matched with the multi-slit etching base material 3, so that light can sequentially pass through the first through groove 11 on the slit upper cover plate 1, the slit on the multi-slit etching base material 3 and the second through groove 51 on the slit lower cover plate 5, nonlinear elastic gaskets 2 are respectively arranged between the slit upper cover plate 1 and the slit lower cover plate 5 and are arranged along the periphery of the multi-slit etching base material 3, and the isolation and vibration reduction effects of the multi-slit etching base material 3 are realized; in order to conveniently install the nonlinear elastic gasket 2, annular grooves 9 for installing the nonlinear elastic gasket 2 are respectively arranged on the slit upper cover plate 1 and the slit lower cover plate 5, trimming pads 6 are arranged between the slit upper cover plate 1 and the slit lower cover plate 5, the straightness and the flatness of the multi-slit etching substrate 3 meet requirements by trimming and grinding the heights of the trimming pads 6, the trimming pads 6 are usually arranged on four corners of the slit lower cover plate 5, a sinking platform 7 matched with the trimming pads 6 is arranged on the slit upper cover plate 1, the heights of the four trimming pads 6 need to be determined through assembly, and the heights of 4 trimming pads 6 are continuously trimmed according to the straightness and flatness requirements of the multi-slit etching substrate 3 during assembly until the straightness and the flatness of the multi-slit etching substrate 3 meet design requirements; the slit upper cover plate 1 is provided with glue injection holes 10 used for fixing the multi-slit etching base material 3, the multi-slit etching base material 3 is fixed through glue injection of the glue injection holes 10, the slit upper cover plate 1 and the slit lower cover plate 5 are provided with mounting holes 11, and the slit upper cover plate 1 and the slit lower cover plate 5 are completely fixed through matching of screws and the mounting holes 11.
As shown in fig. 1, the present embodiment provides a method for forming a multi-slit assembly, which includes the following steps:
1) as shown in FIG. 2, a multi-slit etching substrate 3 is fabricated
Etching the etching base material according to the set multi-slit shape and position relation index requirement to obtain a multi-slit etching base material, wherein the shape and position relation index requirement comprises position, size and width; the method comprises the following specific steps:
1.1) according to the set requirement of the multi-slit shape and position relation index, manufacturing an acid corrosion resistant mask template, carrying out contrast precision inspection on the mask template, and if the mask template is qualified, carrying out the step 1.2); if not, returning to the step 1.1);
1.2) overlapping and bonding the mask template and an etching substrate by adopting acid corrosion resistant glue, wherein the etching substrate is made of a molybdenum alloy material with the thickness of 0.3-1 mm, so that the formed multi-slit component is small in overall size and weight, and the whole optical system is convenient to reduce weight;
1.3) placing the etching substrate adhered with the mask template in acid liquor for etching, detecting the precision of the etching substrate by microscopic radiography after etching is finished, and performing the step 1.4 if the etching substrate is qualified; if not, returning to the step 1.1);
1.4) separating the etching substrate from the mask template by using a release solvent to obtain a multi-slit etching substrate 3, respectively detecting the substrate slit forming precision and the mask template holding precision, if the substrate slit forming precision and the mask template holding precision are qualified, storing the substrate slit forming precision and the mask template holding precision for standby, and if the substrate slit forming precision and the mask template holding precision are not qualified, returning to the step 1.1);
1.5) the multi-slit etching substrate 3 to be stored for use is subjected to gold plating and/or surface anodization blackening treatment, so that the full-spectrum cut-off of the slit assembly can be realized, the influence of slit imaging stray light is avoided, and the application of the slit visible and infrared full-spectrum is realized.
2) Assembling multiple slit etched substrates
2.1) a first through groove 11 is formed in the slit upper cover plate 1, a second through groove 51 matched with the first through groove 11 is formed in the slit lower cover plate 5, and the slit upper cover plate 1 and the slit lower cover plate 5 are both made of invar steel;
2.2) arranging the multi-slit etching base material 3 between the slit upper cover plate 1 and the slit lower cover plate 5, so that light sequentially passes through the first through groove 11 on the slit upper cover plate 1, the slit on the multi-slit etching base material 3 and the second through groove 51 on the slit lower cover plate 5; a nonlinear elastic gasket 2 is respectively arranged between the multi-slit etching base material 3 and the slit upper cover plate 1 and the slit lower cover plate 5, and the nonlinear elastic gasket 2 is made of a material with a small thermal expansion coefficient; in order to facilitate installation of the nonlinear elastic gasket 2, annular grooves 9 for installation of the nonlinear elastic gasket 2 are formed in the slit upper cover plate 1 and the slit lower cover plate 5, and the nonlinear elastic gasket is arranged on the annular grooves 9;
in step 2.2), the nonlinear elastic gasket 2 is made of a material with a small thermal expansion coefficient, such as silicon rubber.
2.3) the straightness and the flatness of the multi-slit etching base material 3 meet the requirements by repairing and grinding the height of a trimming pad 6 between the slit upper cover plate 1 and the slit lower cover plate 5; trimming pads 6 are arranged at four corners of a slit lower cover plate 5, and a sinking platform 7 matched with the trimming pads 6 is arranged on a slit upper cover plate 1;
3) fixed multi-slit etching substrate
3.1) injecting glue into glue injection holes 10 on the slit upper cover plate 1 or the slit lower cover plate 5, and fixing the multi-slit etching base material 3, wherein the slit upper cover plate 1 is provided with the glue injection holes 10 to fix the multi-slit etching base material;
and 3.2) forming threaded holes in the slit upper cover plate 1 and the slit lower cover plate 5, and fixing the slit upper cover plate 1 and the slit lower cover plate 5 through screw connection.
The embodiment provides a multi-slit etching forming requirement as follows, as shown in fig. 5:
1) slit width: less than or equal to 30 mu m
2) Length of slit: the single component is more than or equal to 30mm, and the whole component is more than or equal to 90mm
3) Slit distribution: S1-S3
4) Straightness accuracy: less than or equal to 3 mu m
5) The parallelism between the slits: less than or equal to 6 mu m
The slit upper cover plate 1 and the slit lower cover plate 5 are both made of invar steel materials, so that the straightness loss caused by thermal expansion of the environment can be effectively avoided, and finite element analysis shows that the assembly design of vibration isolation and self-adaptive adjustment of an etching base material by adopting a nonlinear elastic gasket (a flexible self-adaptive spring) can ensure that the flatness of the slit is better than 1 mu m, the length of the slit can be more than or equal to 30mm, the straightness is better than 2 mu m, and meanwhile, under severe mechanical conditions, the multi-slit component only slightly deforms under a large temperature gradient environment; by adopting an invar steel and nonlinear spring stress-free clamping structure, the maximum deformation of the slit is only 1.0363 μm.

Claims (6)

1. A multi-slot assembly, comprising: the slit etching device comprises a slit upper cover plate (1), a slit lower cover plate (5) fixedly connected with the slit upper cover plate (1), and a multi-slit etching base material (3) arranged between the slit upper cover plate (1) and the slit lower cover plate (5);
a first through groove (11) is formed in the slit upper cover plate (1), a second through groove (51) matched with the first through groove (11) is formed in the slit lower cover plate (5), and nonlinear elastic gaskets (2) are respectively arranged between the multi-slit etching base material (3) and the slit upper cover plate (1) and between the multi-slit etching base material and the slit lower cover plate (5);
a trimming pad (6) is arranged between the slit upper cover plate (1) and the slit lower cover plate (5);
and the slit upper cover plate (1) or the slit lower cover plate (5) is provided with a glue injection hole (10), and glue injection for fixing the multi-slit etching base material (3) is injected into the glue injection hole (10).
2. A multi-slot assembly according to claim 1, wherein: the slit upper cover plate (1) and the slit lower cover plate (5) are both made of invar steel, and the etching base material is made of a molybdenum alloy material with the thickness of 0.3-1 mm.
3. A multi-slot assembly according to claim 2, wherein: and the slit upper cover plate (1) and the slit lower cover plate (5) are respectively provided with an annular groove (9) for mounting the nonlinear elastic gasket (2).
4. A multi-slot assembly according to claim 3, wherein: the trimming pads (6) are arranged at four corners of the slit lower cover plate (5), and the slit upper cover plate (1) is provided with a sinking platform (7) matched with the trimming pads (6).
5. A multi-slot assembly according to claim 4, wherein: the glue injection hole (10) is formed in the slit upper cover plate (1).
6. A multi-slot assembly according to claim 5, wherein: the multi-slit etching substrate (3) is subjected to gold plating and/or surface anodization black dyeing.
CN201920617172.1U 2019-04-30 2019-04-30 Multi-slit assembly Active CN210756185U (en)

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110052789A (en) * 2019-04-30 2019-07-26 中国科学院西安光学精密机械研究所 A kind of more slit component forming methods and more slit components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110052789A (en) * 2019-04-30 2019-07-26 中国科学院西安光学精密机械研究所 A kind of more slit component forming methods and more slit components
CN110052789B (en) * 2019-04-30 2024-04-05 中国科学院西安光学精密机械研究所 Multi-slit assembly forming method and multi-slit assembly

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