CN110045583A - A kind of dual surface lithography work stage based on dual masks alignment - Google Patents

A kind of dual surface lithography work stage based on dual masks alignment Download PDF

Info

Publication number
CN110045583A
CN110045583A CN201910411096.3A CN201910411096A CN110045583A CN 110045583 A CN110045583 A CN 110045583A CN 201910411096 A CN201910411096 A CN 201910411096A CN 110045583 A CN110045583 A CN 110045583A
Authority
CN
China
Prior art keywords
mask
plate
mask plate
lower mask
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910411096.3A
Other languages
Chinese (zh)
Inventor
杜婧
冯金花
刘俊伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Optics and Electronics of CAS
Original Assignee
Institute of Optics and Electronics of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institute of Optics and Electronics of CAS filed Critical Institute of Optics and Electronics of CAS
Priority to CN201910411096.3A priority Critical patent/CN110045583A/en
Publication of CN110045583A publication Critical patent/CN110045583A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention discloses a kind of dual surface lithography work stages based on dual masks alignment, including pedestal, lower mask levelling mechanism, upper mask elevating mechanism；Pedestal is the reference for installation of entire work stage, is made of bottom plate and guide rail mounting base；Lower mask levelling mechanism is connect with bottom plate, and hemisphere, ball bowl and spring mechanism realize upper leveling of mask during decline with lower mask, and cylinder locking and ball bowl vacuum adsorption mechanism realize the locking to levelling mechanism；Upper mask elevating mechanism is driven by a motor precision ball screw and realizes driving, and rolling guide is used as guiding, the descending motion in realization when ascending motion of the mask in film releasing and alignment exposure.The present invention arranges in pairs or groups video to Barebone, lighting system, can be used for two-sided single exposure and two-sided while alignment, has the advantages that high production efficiency, easy to operate, exposure resolution ratio is higher.

Description

一种基于双掩模对准的双面光刻工件台A double-sided lithography workpiece stage based on double-mask alignment

技术领域technical field

本发明涉及微电子专用设备技术领域，具体涉及一种基于双掩模对准的双面光刻工件台，可对正反面有相应位置要求的基片实现双面一次曝光和双面同时套刻。The invention relates to the technical field of special equipment for microelectronics, in particular to a double-sided lithography workpiece table based on double-mask alignment, which can realize double-sided one-time exposure and double-sided simultaneous overlay for substrates with corresponding position requirements on the front and back sides .

背景技术Background technique

双面光刻机是在基片正反面制作出有相应位置要求图形的设备。现有的双面光刻工件台的设计主要是基于底部对准原理，其在工件台底部放置对准显微镜左右物镜，采集掩模板上的标记成像于显示器，再放入基片，其图形面朝下，调整基片使其下图形的标记与掩模标记对准，此类型的双面光刻工件台可实现真空接触，消除衍射效应，具有很高的曝光分辨率和对准精度，但其对准时间很长且生产效率很低。A double-sided lithography machine is a device that produces patterns with corresponding position requirements on the front and back sides of the substrate. The design of the existing double-sided lithography workpiece stage is mainly based on the principle of bottom alignment. The left and right objective lenses of the alignment microscope are placed at the bottom of the workpiece stage, and the marks on the mask are collected and imaged on the display, and then placed in the substrate. Face down, adjust the substrate so that the mark of the lower pattern is aligned with the mask mark. This type of double-sided lithography workpiece stage can achieve vacuum contact, eliminate diffraction effects, and have high exposure resolution and alignment accuracy, but The alignment time is long and the production efficiency is low.

双掩模对准原理是首先将两块掩模板进行对准，再放入基片，对基片正反面同时进行曝光。此原理生产效率高，适合研制生产线设备。目前市场上基于双掩模对准的双面光刻机只可实现双面一次曝光，即在基片正反面单次制作出有相应位置要求的图形，无法进行多次双面同时套刻，用于生产具有一定局限性。The principle of double mask alignment is to first align two masks, then put them into the substrate, and expose the front and back sides of the substrate at the same time. This principle has high production efficiency and is suitable for the development of production line equipment. At present, the double-sided lithography machine based on double-mask alignment on the market can only realize double-sided one-time exposure, that is, a pattern with corresponding position requirements can be produced on the front and back of the substrate at a time, and multiple double-sided simultaneous overlay cannot be performed. There are certain limitations for production use.

发明内容SUMMARY OF THE INVENTION

本发明的目的在于提供一种基于双掩模对准的双面光刻工件台，主要服务于对生产效率要求很高的双面光刻设备中，该发明与双曝光头、视频图像对准系统组成双面光刻机，可对基片进行双面一次曝光和双面同时套刻，具有生产效率高、操作方便、对准精度和曝光分辨率较高的优点。The purpose of the present invention is to provide a double-sided lithography workpiece table based on double-mask alignment, which is mainly used in double-sided lithography equipment that requires high production efficiency. The invention is aligned with double exposure heads and video images. The system consists of a double-sided lithography machine, which can perform double-sided exposure and double-sided simultaneous overlay on the substrate, and has the advantages of high production efficiency, convenient operation, high alignment accuracy and high exposure resolution.

本发明采用的技术方案是：一种基于双掩模对准的双面光刻工件台，包括：基座、下掩模调平机构和上掩模升降机构，所述基座是整个工件台安装的基准；所述下掩模调平机构布置在基座的底板上方，实现上掩模在下降过程中与下掩模的调平；所述上掩模升降机构布置在基座的导轨安装座上，实现上掩模在放片时的上升运动和对准曝光时的下降运动。The technical scheme adopted in the present invention is: a double-sided lithography workpiece stage based on double-mask alignment, comprising: a base, a lower mask leveling mechanism and an upper mask lifting mechanism, and the base is the entire workpiece stage The reference for installation; the lower mask leveling mechanism is arranged above the bottom plate of the base to realize the leveling of the upper mask and the lower mask during the descending process; the upper mask lifting mechanism is arranged on the guide rail of the base for installation On the seat, the upward movement of the upper mask during film placement and the downward movement during alignment and exposure are realized.

进一步的，所述基座由底板和导轨安装座组成，所述底板是工件台的基板，所述导轨安装座与底板连接。Further, the base is composed of a bottom plate and a guide rail mounting seat, the bottom plate is the base plate of the workpiece table, and the guide rail mounting seat is connected with the bottom plate.

进一步的，所述下掩模调平机构由锁紧气缸座、支撑圆柱、支撑圆柱弹簧、钢球保持架、钢球、活塞、密封圈、密封垫、气缸座端盖、气缸气嘴、球碗转接件、球碗、半球、球碗气嘴、球碗防转钉、下掩模架、下掩模板、基片真空气嘴、下掩模真空气嘴、调平光电开关、调平光电开关挡片、下掩模板定位销组成；所述锁紧气缸座固定于底板上；所述三个支撑圆柱放置在锁紧气缸座内，两者之间用支撑圆柱弹簧连接，支撑圆柱可在锁紧气缸座内做上下运动，钢球保持架与钢球作为其运动导向；所述三个活塞放置在锁紧气缸座侧面的三个圆孔内，密封圈套在活塞外圆沟槽内，气缸座端盖与锁紧气缸座之间加密封垫连接，以防止漏气；所述气缸气嘴安装在气缸座端盖上，用于锁紧气缸座与正压气源的连接；所述球碗转接件固定在三个支撑圆柱上，球碗布置在球碗转接件上，半球放置在球碗内，球碗气嘴布置在球碗上，用于球碗与正压气源和真空气源的连接；两个球碗防转钉呈180°布置在球碗上，与半球下的两个圆孔大间隙配合，防止半球底部在气浮工况下转动角度过大；所述下掩模架固定在半球上，下掩模真空气嘴固定在下掩模架侧面，用于下掩模架与真空气源的连接，此真空用于下掩模板的吸附，下掩模板放置在下掩模架上，下掩模架上安装三个下掩模板定位销，用于下掩模板外轮廓的定位；基片真空气嘴安装在下掩模架上，并与真空气源的连接，此真空通过下掩模架、下掩模板上的两个小孔可以达到下掩模板上表面，用于曝光基片的真空吸附；所述调平光电开关固定在锁紧气缸座一侧，调平光电开关挡片固定在球碗转接件一侧，当下掩模调平机构调平过程中，调平光电开关与调平光电开关挡片起下限位作用。Further, the lower mask leveling mechanism is composed of a locking cylinder base, a supporting cylinder, a supporting cylinder spring, a steel ball cage, a steel ball, a piston, a sealing ring, a sealing gasket, an end cover of the cylinder base, a cylinder gas nozzle, and a ball. Bowl adapter, ball bowl, hemisphere, ball bowl air nozzle, ball bowl anti-rotation nail, lower mask frame, lower mask plate, substrate vacuum air nozzle, lower mask vacuum air nozzle, leveling photoelectric switch, leveling The photoelectric switch block and the lower mask plate positioning pin are composed; the locking cylinder base is fixed on the bottom plate; the three supporting cylinders are placed in the locking cylinder base, and the two are connected by a supporting cylinder spring, and the supporting cylinder can be Move up and down in the locking cylinder seat, and the steel ball cage and the steel ball serve as its movement guide; the three pistons are placed in the three round holes on the side of the locking cylinder seat, and the sealing ring is sleeved in the outer groove of the piston , A gasket is added between the end cover of the cylinder seat and the locking cylinder seat to prevent air leakage; the cylinder air nozzle is installed on the end cover of the cylinder seat to lock the connection between the cylinder seat and the positive pressure air source; The ball bowl adapter is fixed on three supporting cylinders, the ball bowl is arranged on the ball bowl adapter, the hemisphere is placed in the ball bowl, and the ball bowl air nozzle is arranged on the ball bowl, which is used for the ball bowl and the positive pressure air. The connection between the air source and the vacuum air source; the two ball bowl anti-rotation pins are arranged on the ball bowl at 180°, and cooperate with the two round holes under the hemisphere with a large gap to prevent the bottom of the hemisphere from turning too large under the air flotation condition; The lower mask frame is fixed on the hemisphere, and the lower mask vacuum air nozzle is fixed on the side of the lower mask frame, which is used for the connection between the lower mask frame and the vacuum air source, and the vacuum is used for the adsorption of the lower mask plate. It is placed on the lower mask frame, and three lower mask plate positioning pins are installed on the lower mask frame, which are used for the positioning of the outer contour of the lower mask plate; the substrate vacuum air nozzle is installed on the lower mask frame and connected with the vacuum air source , the vacuum can reach the upper surface of the lower mask plate through the two small holes on the lower mask frame and the lower mask plate, which is used for vacuum adsorption of the exposure substrate; the leveling photoelectric switch is fixed on the side of the locking cylinder seat, The leveling photoelectric switch block is fixed on one side of the ball and bowl adapter. During the leveling process of the current mask leveling mechanism, the leveling photoelectric switch and the leveling photoelectric switch block play a lower limit role.

进一步的，所述上掩模升降机构由电机、电机架、联轴器、滚珠丝杠、轴承固定侧支撑单元、轴承支撑侧支撑单元、丝杠螺母套、Z带动杆、Z带动杆套、滚动导轨、上掩模连接板、上掩模架、上掩模架锁紧手轮、上掩模架气嘴、上掩模板、Z向上光电开关、Z向光电开关挡片、Z向下光电开关组成。所述电机是上掩模升降的动力源，固定在电机架上，电机架固定在导轨安装座上；电机与滚珠丝杠通过联轴器连接，滚珠丝杠一端固定在轴承固定侧支撑单元内，另一端固定在轴承支撑侧支撑单元内；所述轴承固定侧支撑单元和轴承支撑侧支撑单元安装在导轨安装座上；所述丝杠螺母套与滚珠丝杠上的螺母同轴心固定安装；所述Z带动杆螺纹部分与丝杆螺母套连接，其球头部分与Z带动杆套(309)2至3微米过盈配合；所述Z带动杆套固定在上掩模连接板上，滚动导轨安装在导轨安装座上，上掩模连接板安装在滚动导轨上，滚动导轨作为上掩模连接板上下运动的导向；所述上掩模架通过上掩模架锁紧手轮固定在上掩模连接板上，上掩模架气嘴安装在上掩模架的侧端面，用于上掩模架与真空气源的连接；所述Z向上光电开关与Z向下光电开关固定在导轨安装座上，用于上掩模连接板Z向运动的上下限位，Z向光电开关挡片固定在上掩模连接板的侧面。Further, the upper mask lifting mechanism is composed of a motor, a motor frame, a coupling, a ball screw, a bearing fixed side support unit, a bearing support side support unit, a screw nut sleeve, a Z driving rod, a Z driving rod sleeve, Rolling guide rail, upper mask connecting plate, upper mask frame, upper mask frame locking handwheel, upper mask frame air nozzle, upper mask plate, Z-up photoelectric switch, Z-direction photoelectric switch cover, Z-down photoelectric switch composition. The motor is the power source for lifting and lowering the upper mask, which is fixed on the motor frame, and the motor frame is fixed on the guide rail mounting seat; the motor and the ball screw are connected by a coupling, and one end of the ball screw is fixed in the bearing fixed side support unit , the other end is fixed in the bearing support side support unit; the bearing fixed side support unit and the bearing support side support unit are installed on the guide rail mounting seat; the screw nut sleeve and the nut on the ball screw are coaxially fixed and installed ; The threaded part of the Z-driven rod is connected with the screw nut sleeve, and its ball head part is an interference fit of 2 to 3 microns with the Z-driven rod sleeve (309); the Z-driven rod sleeve is fixed on the upper mask connecting plate, The rolling guide rail is installed on the guide rail mounting seat, the upper mask connecting plate is installed on the rolling guide rail, and the rolling guide rail is used as a guide for the up and down movement of the upper mask connecting plate; On the upper mask connecting plate, the upper mask frame air nozzle is installed on the side end face of the upper mask frame, which is used for the connection between the upper mask frame and the vacuum air source; the Z-up photoelectric switch and the Z-down photoelectric switch are fixed on The guide rail mounting seat is used for the upper and lower limit of the Z-direction movement of the upper mask connecting plate, and the Z-direction photoelectric switch block is fixed on the side of the upper mask connecting plate.

进一步的，该工件台使用时，下掩模板真空吸附于下掩模架上，上掩模板真空吸附于上掩模架上，上掩模升降机构带动上掩模板下降直至与下掩模板接触，此时上掩模升降机构带动上掩模板继续下降的同时，下掩模调平机构中的球碗内输入正压气体，半球在球碗内气浮从而实现下掩模板与上掩模板的调平，并且支撑圆柱向下运动，其下端支撑圆柱弹簧开始压缩，直至调平光电开关感应到调平光电开关挡片，上掩模升降机构停止下降运动，此时球碗内输入负压气体，半球在球碗内锁紧，同时锁紧气缸座内输入正压气体推动活塞运动从而对支撑圆柱进行锁紧；上掩模升降机构带动上掩模板向上运动一段距离L，将上掩模板取下后放置在下掩模板上，手动调整上掩模板相对下掩模板的位置，在视频图像对准系统的视场内将两块掩模板的标记进行对准，对准后打开基片真空气嘴内的真空，此真空通过下掩模架、下掩模板上的两个小孔可以达到下掩模板上表面，将上掩模板与下掩模板吸附在一起；上掩模升降机构带动上掩模架向下运动距离L与上掩模板接触，关闭基片真空气嘴内的真空，打开上掩模架气嘴，此时上掩模板真空吸附于上掩模架上，上掩模升降机构带动上掩模板向上运动一段距离L。以上完成上掩模板与下掩模板标记的对准。Further, when the workpiece table is in use, the lower mask plate is vacuum adsorbed on the lower mask frame, the upper mask plate is vacuum adsorbed on the upper mask frame, and the upper mask lifting mechanism drives the upper mask plate to descend until it contacts the lower mask plate, At this time, while the upper mask lifting mechanism drives the upper mask plate to continue to descend, positive pressure gas is input into the ball bowl in the lower mask leveling mechanism, and the hemisphere floats in the ball bowl to realize the adjustment of the lower mask plate and the upper mask plate. It is flat, and the supporting cylinder moves downward, and the supporting cylinder spring at its lower end begins to compress until the leveling photoelectric switch senses the leveling photoelectric switch baffle, and the upper mask lifting mechanism stops the downward movement. At this time, the negative pressure gas is input into the ball bowl. The hemisphere is locked in the ball bowl, and at the same time, the positive pressure gas is input in the locking cylinder seat to push the piston to move to lock the support cylinder; the upper mask lifting mechanism drives the upper mask plate to move upward for a distance L, and the upper mask plate is removed. Then place it on the lower mask, manually adjust the position of the upper mask relative to the lower mask, align the marks of the two masks in the field of view of the video image alignment system, and open the substrate vacuum after alignment. The vacuum can reach the upper surface of the lower mask plate through the two small holes on the lower mask frame and the lower mask plate, and adsorb the upper mask plate and the lower mask plate together; the upper mask lifting mechanism drives the upper mask frame The downward movement distance L is in contact with the upper mask plate, the vacuum in the vacuum nozzle of the substrate is closed, and the air nozzle of the upper mask frame is opened. At this time, the upper mask plate is vacuum adsorbed on the upper mask frame, and the upper mask lifting mechanism drives the upper mask frame. The reticle moves up a distance L. The above completes the alignment of the marks on the upper reticle and the lower reticle.

进一步的，该工件台与双曝光头、对准系统组成双面光刻机，可对基片进行双面一次曝光和双面同时套刻。双面一次曝光时，在完成掩模板对准后，在下掩模板上放置基片，上掩模升降机构带动上掩模板向下运动直至与基片上表面接触，后续便可进行基片的双面同时曝光操作；双面同时套刻时，在完成掩模板对准后，在下掩模板上放置基片，手动调整基片的位置，将基片上的标记与下掩模板上的标记进行对准，对准后打开基片真空气嘴内的真空，此真空通过下掩模架、下掩模板上的两个小孔可以达到下掩模板上表面，将基片吸附在下掩模板的上表面，此时上掩模升降机构带动上掩模板向下运动直至与基片上表面接触，后续便可进行基片的双面同时曝光操作，完成双面同时套刻。Further, the workpiece table, the double exposure head and the alignment system form a double-sided lithography machine, which can perform one-time exposure and double-sided simultaneous overlay on the substrate. When double-sided one-time exposure, after the mask alignment is completed, the substrate is placed on the lower mask, and the upper mask lifting mechanism drives the upper mask to move downward until it is in contact with the upper surface of the substrate. Simultaneous exposure operation; when double-sided simultaneous overlay, after the mask alignment is completed, place the substrate on the lower mask, manually adjust the position of the substrate, and align the marks on the substrate with the marks on the lower mask. After alignment, open the vacuum in the vacuum nozzle of the substrate. This vacuum can reach the upper surface of the lower mask plate through the lower mask frame and two small holes on the lower mask plate, and the substrate is adsorbed on the upper surface of the lower mask plate. At the same time, the upper mask lifting mechanism drives the upper mask plate to move downward until it contacts with the upper surface of the substrate, and subsequently, the simultaneous exposure operation of both sides of the substrate can be performed to complete the simultaneous double-sided engraving.

本发明与现有技术相比的优点在于：The advantages of the present invention compared with the prior art are:

(1)、本发明是基于双掩模对准原理的双面光刻工件台，采用双掩模对准方式，对准时间短；(1), the present invention is a double-sided lithography workpiece stage based on the double-mask alignment principle, adopts a double-mask alignment method, and the alignment time is short;

(2)、本发明可对正反面有相应位置要求的基片实现双面一次曝光和双面同时套刻，生产效率高；(2), the present invention can realize double-sided one-time exposure and double-sided simultaneous overlay to substrates with corresponding position requirements on the front and back, and the production efficiency is high;

(3)、本发明与双曝光头、对准系统组成双面光刻机，具有操作方便、对准精度和曝光分辨率较高的优点。(3) The present invention forms a double-sided lithography machine with a double exposure head and an alignment system, and has the advantages of convenient operation, high alignment accuracy and high exposure resolution.

附图说明Description of drawings

图1为本发明一种基于双掩模对准的双面光刻工件台的总体结构图，其中，100-基座；101-底板；102-导轨安装座；200-下掩模调平机构；300-上掩模升降机构；1 is a general structural diagram of a double-sided lithography workpiece stage based on double-mask alignment of the present invention, wherein 100-base; 101-base plate; 102-rail mounting seat; 200-lower mask leveling mechanism ;300-upper mask lifting mechanism;

图2为下掩模调平机构结构图，其中，图2(a)为下掩模调平机构的等轴侧视图，图2(b)为下掩模调平机构的剖视图，图2(c)为下掩模调平机构的正视图。图中，201-锁紧气缸座、202-支撑圆柱、203-支撑圆柱弹簧、204-钢球保持架、205-钢球、206-活塞、207-密封圈、208-密封垫、209-气缸座端盖、210-气缸气嘴、211-球碗转接件、212-球碗、213-半球、214-球碗气嘴、215-球碗防转钉、216-下掩模架、217-下掩模板、218-基片真空气嘴、219-下掩模真空气嘴、220-调平光电开关、221-调平光电开关挡片、222-下掩模板定位销。Fig. 2 is a structural diagram of the lower mask leveling mechanism, wherein Fig. 2(a) is an isometric side view of the lower mask leveling mechanism, Fig. 2(b) is a cross-sectional view of the lower mask leveling mechanism, Fig. 2 ( c) is the front view of the lower mask leveling mechanism. In the figure, 201-lock cylinder seat, 202-support cylinder, 203-support cylinder spring, 204-steel ball cage, 205-steel ball, 206-piston, 207-sealing ring, 208-gasket, 209-cylinder Seat end cover, 210-air cylinder valve, 211-ball bowl adapter, 212-ball bowl, 213-hemisphere, 214-ball bowl valve, 215-ball bowl anti-rotation nail, 216-lower mask frame, 217 - Lower mask, 218 - Substrate vacuum air nozzle, 219 - Lower mask vacuum air nozzle, 220 - Leveling photoelectric switch, 221 - Leveling photoelectric switch shutter, 222 - Lower mask positioning pin.

图3为上掩模升降机构结构图，其中，图3(a)为上掩模升降机构的等轴侧视图，图3(b)为上掩模升降机构的正视图，图3(c)为上掩模升降机构的剖视图，图中，301-电机、302-电机架、303-联轴器、304-滚珠丝杠、305-轴承固定侧支撑单元、306-轴承支撑侧支撑单元、307-丝杠螺母套、308-Z带动杆、309-Z带动杆套、310-滚动导轨、311-上掩模连接板、312-上掩模架、313-上掩模架锁紧手轮、314-上掩模架气嘴、315-上掩模板、316-Z向上光电开关、317-Z向光电开关挡片、318-Z向下光电开关。Fig. 3 is a structural diagram of the upper mask lifting mechanism, wherein Fig. 3(a) is an isometric side view of the upper mask lifting mechanism, Fig. 3(b) is a front view of the upper mask lifting mechanism, and Fig. 3(c) It is a sectional view of the upper mask lifting mechanism. In the figure, 301-motor, 302-motor frame, 303-coupling, 304-ball screw, 305-bearing fixed side support unit, 306-bearing support side support unit, 307 -Screw nut cover, 308-Z driving rod, 309-Z driving rod cover, 310-rolling guide rail, 311-upper mask connecting plate, 312-upper mask frame, 313-upper mask frame locking handwheel, 314-upper mask frame air nozzle, 315-upper mask plate, 316-Z up photoelectric switch, 317-Z up photoelectric switch shutter, 318-Z down photoelectric switch.

具体实施方式Detailed ways

为了使本发明的特点和优点更加明显易懂，下面对本发明的具体实施做详细说明。In order to make the features and advantages of the present invention more obvious and easy to understand, the specific implementation of the present invention will be described in detail below.

如图所示，本发明一种双面光刻工件台，包括基座100，下掩模调平机构200和上掩模升降机构300，所述基座100是整个工件台安装的基准，由底板101和导轨安装座102组成，所述底板101是工件台的基板，所述导轨安装座102与底板101连接；所述下掩模调平机构200布置在基座100的底板101上方，实现上掩模在下降过程中与下掩模的调平；所述上掩模升降机构300布置在基座100的导轨安装座102上，实现上掩模在放片时的上升运动和对准曝光时的下降运动。As shown in the figure, a double-sided lithography workpiece stage of the present invention includes a base 100, a lower mask leveling mechanism 200 and an upper mask lifting mechanism 300. The base 100 is the reference for the entire workpiece stage to be installed, and is composed of The bottom plate 101 and the guide rail mounting seat 102 are composed, the bottom plate 101 is the base plate of the workpiece table, and the guide rail mounting seat 102 is connected with the bottom plate 101; the lower mask leveling mechanism 200 is arranged above the bottom plate 101 of the base 100 to realize The upper mask is leveled with the lower mask during the descending process; the upper mask lifting mechanism 300 is arranged on the guide rail mounting seat 102 of the base 100 to realize the upward movement and alignment exposure of the upper mask during film placement descending movement.

如图2(a)、图2(b)和图2(c)所示，下掩模调平机构200由锁紧气缸座201、支撑圆柱202、支撑圆柱弹簧203、钢球保持架204、钢球205、活塞206、密封圈207、密封垫208、气缸座端盖209、气缸气嘴210、球碗转接件211、球碗212、半球213、球碗气嘴214、球碗防转钉215、下掩模架216、下掩模板217、基片真空气嘴218、下掩模真空气嘴219、调平光电开关220、调平光电开关挡片221、下掩模板定位销222组成；所述锁紧气缸座201固定于底板101上；所述三个支撑圆柱202放置在锁紧气缸座201内，两者之间用支撑圆柱弹簧203连接，支撑圆柱202可在锁紧气缸座201内做上下运动，钢球保持架204与钢球205作为其运动导向；所述三个活塞206放置在锁紧气缸座201侧面的三个圆孔内，密封圈207套在活塞206外圆沟槽内，气缸座端盖209与锁紧气缸座201之间加密封垫208连接，以防止漏气；所述气缸气嘴210安装在气缸座端盖209上，用于锁紧气缸座201与正压气源的连接；所述球碗转接件211固定在三个支撑圆柱202上，球碗212布置在球碗转接件211上，半球213放置在球碗212内，球碗气嘴214布置在球碗212上，用于球碗212与正压气源和真空气源的连接；两个球碗防转钉215呈180°布置在球碗212上，与半球213下的两个圆孔大间隙配合，防止半球213底部在气浮工况下转动角度过大；所述下掩模架216固定在半球213上，下掩模真空气嘴219固定在下掩模架216侧面，用于下掩模架216与真空气源的连接，此真空用于下掩模板217的吸附，下掩模板217放置在下掩模架216上，下掩模架216上安装三个下掩模板定位销222，用于下掩模板217外轮廓的定位；基片真空气嘴218安装在下掩模架216上，并与真空气源的连接，此真空通过下掩模架216、下掩模板217上的两个小孔可以达到下掩模板217上表面，用于曝光基片的真空吸附；所述调平光电开关220固定在锁紧气缸座201一侧，调平光电开关挡片221固定在球碗转接件211一侧，当下掩模调平机构200调平过程中，调平光电开关220与调平光电开关挡片221起下限位作用。As shown in Figures 2(a), 2(b) and 2(c), the lower mask leveling mechanism 200 consists of a locking cylinder block 201, a supporting cylinder 202, a supporting cylinder spring 203, a steel ball cage 204, Steel ball 205, piston 206, sealing ring 207, gasket 208, cylinder block end cover 209, cylinder air nozzle 210, ball bowl adapter 211, ball bowl 212, hemisphere 213, ball bowl valve 214, ball bowl anti-rotation Nail 215, lower mask frame 216, lower mask plate 217, substrate vacuum air nozzle 218, lower mask vacuum air nozzle 219, leveling photoelectric switch 220, leveling photoelectric switch baffle 221, lower mask plate positioning pin 222 ; The locking cylinder base 201 is fixed on the bottom plate 101; The three supporting cylinders 202 are placed in the locking cylinder base 201, and the two are connected by a supporting cylinder spring 203, and the supporting cylinder 202 can be used in the locking cylinder base. 201 moves up and down, and the steel ball cage 204 and the steel ball 205 serve as its movement guides; the three pistons 206 are placed in the three circular holes on the side of the locking cylinder base 201, and the sealing ring 207 is sleeved on the outer circle of the piston 206 In the groove, a gasket 208 is added between the cylinder block end cover 209 and the locking cylinder block 201 to prevent air leakage; the cylinder air nozzle 210 is installed on the cylinder block end cover 209 for locking the cylinder block 201 The connection with the positive pressure air source; the spherical bowl adapter 211 is fixed on the three supporting cylinders 202, the spherical bowl 212 is arranged on the spherical bowl adapter 211, the hemisphere 213 is placed in the spherical bowl 212, and the spherical bowl air The mouth 214 is arranged on the ball bowl 212 for the connection between the ball bowl 212 and the positive pressure air source and the vacuum air source; The round holes are matched with a large gap to prevent the bottom of the hemisphere 213 from turning too large under the air-floating condition; the lower mask frame 216 is fixed on the hemisphere 213, and the lower mask vacuum air nozzle 219 is fixed on the side of the lower mask frame 216. Used for the connection between the lower mask frame 216 and the vacuum air source, this vacuum is used for the adsorption of the lower mask plate 217, the lower mask plate 217 is placed on the lower mask frame 216, and three lower mask plates are installed on the lower mask frame 216 for positioning The pin 222 is used for the positioning of the outer contour of the lower mask plate 217; the substrate vacuum air nozzle 218 is installed on the lower mask frame 216, and is connected with the vacuum air source, and this vacuum passes through the lower mask frame 216 and the lower mask plate 217. The two small holes can reach the upper surface of the lower mask plate 217 for vacuum adsorption of the exposure substrate; the leveling photoelectric switch 220 is fixed on the side of the locking cylinder base 201, and the leveling photoelectric switch blocking plate 221 is fixed on the ball On the side of the bowl adapter 211, during the leveling process of the lower mask leveling mechanism 200, the leveling photoelectric switch 220 and the leveling photoelectric switch blocking plate 221 play a lower limit role.

如图3(a)、图3(b)和图3(c)所示，上掩模升降机构300由电机301、电机架302、联轴器303、滚珠丝杠304、轴承固定侧支撑单元305、轴承支撑侧支撑单元306、丝杠螺母套307、Z带动杆308、Z带动杆套309、滚动导轨310、上掩模连接板311、上掩模架312、上掩模架锁紧手轮313、上掩模架气嘴314、上掩模板315、Z向上光电开关316、Z向光电开关挡片317、Z向下光电开关318组成。所述电机301是上掩模升降的动力源，固定在电机架302上，电机架302固定在导轨安装座102上；电机301与滚珠丝杠304通过联轴器303连接，滚珠丝杠304一端固定在轴承固定侧支撑单元305内，另一端固定在轴承支撑侧支撑单元306内；所述轴承固定侧支撑单元305和轴承支撑侧支撑单元306安装在导轨安装座102上；所述丝杠螺母套307与滚珠丝杠304上的螺母同轴心固定安装；所述Z带动杆308螺纹部分与丝杆螺母套307连接，其球头部分与Z带动杆套309两至三微米过盈配合；所述Z带动杆套固定在上掩模连接板311上，滚动导轨310安装在导轨安装座102上，上掩模连接板311安装在滚动导轨310上，滚动导轨310作为上掩模连接板311上下运动的导向；所述上掩模架312通过上掩模架锁紧手轮313固定在上掩模连接板311上，上掩模架气嘴314安装在上掩模架312的侧端面，用于上掩模架312与真空气源的连接；所述Z向上光电开关316与Z向下光电开关318固定在导轨安装座102上，用于上掩模连接板311Z向运动的上下限位，Z向光电开关挡片317固定在上掩模连接板311的侧面。As shown in FIGS. 3( a ), 3 ( b ) and 3 ( c ), the upper mask lifting mechanism 300 is composed of a motor 301 , a motor frame 302 , a coupling 303 , a ball screw 304 , and a bearing fixing side support unit 305, bearing support side support unit 306, screw nut sleeve 307, Z driving rod 308, Z driving rod sleeve 309, rolling guide 310, upper mask connecting plate 311, upper mask frame 312, upper mask frame locking handle Wheel 313 , upper mask frame air nozzle 314 , upper mask plate 315 , Z-up photoelectric switch 316 , Z-direction photoelectric switch shutter 317 , and Z-down photoelectric switch 318 . The motor 301 is a power source for lifting and lowering the upper mask, and is fixed on the motor frame 302, which is fixed on the guide rail mounting seat 102; the motor 301 and the ball screw 304 are connected through a coupling 303, and one end of the ball screw 304 is fixed in the bearing fixed side support unit 305, and the other end is fixed in the bearing support side support unit 306; the bearing fixed side support unit 305 and the bearing support side support unit 306 are installed on the guide rail mounting seat 102; the lead screw nut The sleeve 307 is fixed and installed coaxially with the nut on the ball screw 304; the threaded part of the Z driving rod 308 is connected with the screw nut sleeve 307, and the ball head part is two to three microns interference fit with the Z driving rod sleeve 309; The Z driving rod sleeve is fixed on the upper mask connecting plate 311 , the rolling guide rail 310 is installed on the guide rail mounting seat 102 , the upper mask connecting plate 311 is installed on the rolling guide rail 310 , and the rolling guide rail 310 serves as the upper mask connecting plate 311 Guidance of up and down movement; the upper mask frame 312 is fixed on the upper mask connecting plate 311 by the upper mask frame locking handwheel 313, and the upper mask frame air nozzle 314 is installed on the side end face of the upper mask frame 312, It is used for the connection between the upper mask frame 312 and the vacuum air source; the Z-up photoelectric switch 316 and the Z-down photoelectric switch 318 are fixed on the guide rail mounting seat 102, and are used for the upper and lower limit positions of the Z-direction movement of the upper mask connecting plate 311 , the Z-direction photoelectric switch blocking plate 317 is fixed on the side surface of the upper mask connecting plate 311 .

本发明未详细阐述部分属于本领域的公知技术。The parts not described in detail in the present invention belong to the well-known technologies in the art.

Claims (4)

1. a kind of dual surface lithography work stage based on dual masks alignment, it is characterised in that: including pedestal (100), lower mask leveling Mechanism (200) and upper mask elevating mechanism (300), the pedestal (100) are the benchmark of entire work stage installation；The lower mask Levelling mechanism (200) is arranged in above the bottom plates (101) of pedestal (100), in realization mask during decline with lower mask Leveling；The upper mask elevating mechanism (300) is arranged in the guide rail mounting base (102) of pedestal (100), and mask is being put in realization Descending motion when ascending motion and alignment when piece expose；
The pedestal (100) is made of bottom plate (101) and guide rail mounting base (102), and the bottom plate (101) is the base of work stage Plate, the guide rail mounting base (102) connect with bottom plate (101)；
The lower mask levelling mechanism (200) by locking cylinder seat (201), support cylinder (202), support cylindrical spring (203), Ball retainer (204), steel ball (205), piston (206), sealing ring (207), gasket (208), cylinder block end cap (209), Cylinder gas nozzle (210), ball bowl adapter (211), ball bowl (212), hemisphere (213), ball bowl gas nozzle (214), ball bowl anti-rotation nail (215), lower mask holder (216), lower mask plate (217), substrate vacuum gas nozzle (218), lower mask vacuum gas nozzle (219), leveling Optoelectronic switch (220), leveling optoelectronic switch baffle (221), lower mask plate positioning pin (222) composition；The locking cylinder seat (201) it is fixed on bottom plate (101)；Three support cylinders (202) are placed in locking cylinder seat (201), between the two With support cylindrical spring (203) connection, support cylinder (202) can move up and down in locking cylinder seat (201), and steel ball is kept Frame (204) and steel ball (205) are used as its motion guide；Three pistons (206) are placed on locking cylinder seat (201) side In three circular holes, sealing ring (207) covers in piston (206) outer circle groove, cylinder block end cap (209) and locking cylinder seat (201) packing (208) connection is encrypted between, to prevent gas leakage；The cylinder gas nozzle (210) is mounted on cylinder block end cap (209) On, it is used for the connection of locking cylinder seat (201) and positive pressure gas source；The ball bowl adapter (211) is fixed on three support cylinders (202) on, ball bowl (212) is arranged on ball bowl adapter (211), and hemisphere (213) is placed in ball bowl (212), ball bowl gas nozzle (214) it is arranged on ball bowl (212), is used for the connection of ball bowl (212) and positive pressure gas source and vacuum source；Two ball bowl anti-rotation nails (215) it is arranged on ball bowl (212) in 180 °, cooperates with two circular hole wide arc gaps under hemisphere (213), prevent hemisphere (213) Bottom rotational angle under air bearing operating condition is excessive；The lower mask holder (216) is fixed on hemisphere (213), lower mask vacuum gas Mouth (219) is fixed on lower mask holder (216) side, is used for the connection of lower mask holder (216) and vacuum source, this vacuum is used for down The absorption of mask plate (217), lower mask plate (217) are placed on lower mask holder (216), and three are installed on lower mask holder (216) Lower mask plate positioning pin (222) is used for the positioning of lower mask plate (217) outer profile；Substrate vacuum gas nozzle (218), which is mounted on down, to be covered On mould bases (216), and the connection with vacuum source, this vacuum pass through two on lower mask holder (216), lower mask plate (217) Aperture can achieve lower mask plate (217) upper surface, for exposing the vacuum suction of substrate；The leveling optoelectronic switch (220) It is fixed on locking cylinder seat (201) side, leveling optoelectronic switch baffle (221) is fixed on ball bowl adapter (211) side, instantly During mask levelling mechanism (200) leveling, leveling optoelectronic switch (220) and leveling optoelectronic switch baffle (221) play lower limit Effect；
The upper mask elevating mechanism (300) by motor (301), motor rack (302), shaft coupling (303), ball-screw (304), Bearing affixed side support unit (305), bearing support side support unit (306), screw nut sleeve (307), Z driven rod (308), Z drives rod set (309), rolling guide (310), upper mask connecting plate (311), upper mask holder (312), upper mask holder to lock handwheel (313), upper mask holder gas nozzle (314), upper mask plate (315), optoelectronic switch (316), Z-direction optoelectronic switch baffle in Z-direction (317), optoelectronic switch (318) forms under Z-direction；The motor (301) is the power source of upper mask lifting, is fixed on motor rack (302) on, motor rack (302) is fixed on guide rail mounting base (102)；Motor (301) and ball-screw (304) pass through shaft coupling (303) it connects, ball-screw (304) one end is fixed in bearing affixed side support unit (305), and the other end is fixed on bearing branch It supports in side support unit (306)；The bearing affixed side support unit (305) and bearing support side support unit (306) installation On guide rail mounting base (102)；The concentric fixed installation of nut on the screw nut sleeve (307) and ball-screw (304)； Z driven rod (308) threaded portion covers (307) with feed screw nut and connect, and bulb part and Z drive rod set (309) 2 to 3 Micron interference fit；The Z drives rod set to be fixed on mask connecting plate (311), and rolling guide (310) is mounted on guide rail peace It fills on seat (102), upper mask connecting plate (311) is mounted on rolling guide (310), and mask connects in rolling guide (310) conduct The guiding that fishplate bar (311) moves up and down；The upper mask holder (312) is fixed on by upper mask holder locking handwheel (313) and is covered On mould connecting plate (311), upper mask holder gas nozzle (314) is mounted on the side end face of mask holder (312), is used for upper mask holder (312) with the connection of vacuum source；Optoelectronic switch (316) is fixed on guide rail peace with optoelectronic switch (318) under Z-direction in the Z-direction It fills on seat (102), for the limit up and down of upper mask connecting plate (311) Z-direction movement, Z-direction optoelectronic switch baffle (317) is fixed on The side of upper mask connecting plate (311).
2. a kind of dual surface lithography work stage based on dual masks alignment according to claim 1, it is characterised in that: the workpiece Platform is in use, lower mask plate (217) vacuum suction is on lower mask holder (216), and upper mask plate (315) vacuum suction is in upper mask On frame (312), mask plate (315) declines up to contacting with lower mask plate (217) in upper mask elevating mechanism (300) drive, this When on while mask plate (217) continues decline in mask elevating mechanism (300) drive, in lower mask levelling mechanism (200) Input barotropic gas in ball bowl (212), hemisphere (213) ball bowl (212) interior air bearing under realizing mask plate (217) with above cover The leveling of template (315), and cylinder (202) is supported to move downward, lower end support cylindrical spring (203) starts to compress, directly Leveling optoelectronic switch baffle (221) is sensed to leveling optoelectronic switch (220), and upper mask elevating mechanism (300) stops decline fortune It is dynamic, input negative-pressure gas in ball bowl (212) at this time, hemisphere (213) is in ball bowl (212) internal locking, while locking cylinder seat (201) Interior input barotropic gas pushes piston (206) movement to lock to support cylinder (202)；Upper mask elevating mechanism (300) mask plate (315) moves upwards a distance L in drive, is placed on lower mask plate after upper mask plate (315) is removed (217) on, the position that mask plate (315) descends mask plate (217) relatively is manually adjusted, in video image to the visual field of Barebone The interior label by two mask plates is aligned, and the vacuum in substrate vacuum gas nozzle (218) is opened after alignment, under this vacuum passes through Two apertures on mask holder (216), lower mask plate (217) can achieve lower mask plate (217) upper surface, by upper mask plate (315) it is attached together with lower mask plate (217)；In upper mask elevating mechanism (300) drive mask holder (312) move downward away from It is contacted from L with upper mask plate (315), the vacuum in closing substrate vacuum gas nozzle (218), mask holder gas nozzle (314) in opening, this When on mask plate (315) vacuum suction on upper mask holder (312), mask plate (315) in upper mask elevating mechanism (300) drive A distance L is moved upwards, the alignment of mask plate (315) and lower mask plate (217) label in the above completion.
3. a kind of dual surface lithography work stage based on dual masks alignment according to claim 1 or 2, it is characterised in that: should Work stage and double-exposure head form double face photoetching machine to Barebone, and two-sided single exposure can be carried out to substrate and two-sided is covered simultaneously It carves；When two-sided single exposure, after completing mask plate alignment, substrate, upper mask elevating mechanism are placed on lower mask plate (217) (300) mask plate (315) moves downward until contact with substrate upper surface in drive, it is subsequent can carry out substrate it is two-sided simultaneously Exposing operation；When two-sided while alignment, after completing mask plate alignment, substrate is placed on lower mask plate (217), is manually adjusted Label on substrate is aligned by the position of substrate with the label on lower mask plate (217), and substrate vacuum gas is opened after alignment Vacuum in mouth (218), this vacuum be can achieve down by two apertures on lower mask holder (216), lower mask plate (217) and covered Substrate, is adsorbed on the upper surface of lower mask plate (217) by template (217) upper surface, and upper mask elevating mechanism (300) drive at this time Upper mask plate (315) moves downward up to contacting with substrate upper surface, the subsequent two-sided while exposing operation that can carry out substrate, Complete two-sided while alignment.
4. a kind of dual surface lithography work stage based on dual masks alignment according to claim 1 or 2, it is characterised in that: should Work stage and double-exposure head form double face photoetching machine to Barebone, and two-sided single exposure can be carried out to substrate and two-sided is covered simultaneously It carves.
CN201910411096.3A 2019-05-17 2019-05-17 A kind of dual surface lithography work stage based on dual masks alignment Pending CN110045583A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910411096.3A CN110045583A (en) 2019-05-17 2019-05-17 A kind of dual surface lithography work stage based on dual masks alignment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910411096.3A CN110045583A (en) 2019-05-17 2019-05-17 A kind of dual surface lithography work stage based on dual masks alignment

Publications (1)

Publication Number Publication Date
CN110045583A true CN110045583A (en) 2019-07-23

Family

ID=67282387

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910411096.3A Pending CN110045583A (en) 2019-05-17 2019-05-17 A kind of dual surface lithography work stage based on dual masks alignment

Country Status (1)

Country Link
CN (1) CN110045583A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112180694A (en) * 2020-10-30 2021-01-05 四川上特科技有限公司 A cold light source exposure machine
CN114967367A (en) * 2022-05-31 2022-08-30 中国科学院光电技术研究所 A double-sided lithography method for transparent substrates
CN117369223A (en) * 2023-12-08 2024-01-09 上海隐冠半导体技术有限公司 Leveling device and photoetching machine
CN117406560A (en) * 2023-11-03 2024-01-16 苏州天准科技股份有限公司 Multi-degree-of-freedom adjusting table and exposure equipment

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1094827A (en) * 1993-05-05 1994-11-09 哈尔滨工业大学 Double-sided Plate Exposure Machine
US7425238B2 (en) * 2002-10-16 2008-09-16 Canon Kabushiki Kaisha Substrate holding device
CN204145893U (en) * 2014-09-15 2015-02-04 中国电子科技集团公司第二十九研究所 A kind of exposure positioning device for printed board
CN204178122U (en) * 2014-08-22 2015-02-25 深圳市大川光电设备有限公司 Be applicable to the film and the workpiece adherence device of image transfer exposure machine
CN106371292A (en) * 2016-09-18 2017-02-01 中国科学院光电技术研究所 Double-sided photoetching workpiece table
CN107561748A (en) * 2017-11-01 2018-01-09 深圳宇顺电子股份有限公司 A kind of method for preventing transparent conductive glass fitting off normal
CN107761051A (en) * 2017-11-14 2018-03-06 合肥鑫晟光电科技有限公司 A kind of mask, mask evaporation component and evaporation coating device
CN108303857A (en) * 2018-01-25 2018-07-20 北京控制工程研究所 A kind of method, system and storage medium improving dual surface lithography consistency

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1094827A (en) * 1993-05-05 1994-11-09 哈尔滨工业大学 Double-sided Plate Exposure Machine
US7425238B2 (en) * 2002-10-16 2008-09-16 Canon Kabushiki Kaisha Substrate holding device
CN204178122U (en) * 2014-08-22 2015-02-25 深圳市大川光电设备有限公司 Be applicable to the film and the workpiece adherence device of image transfer exposure machine
CN204145893U (en) * 2014-09-15 2015-02-04 中国电子科技集团公司第二十九研究所 A kind of exposure positioning device for printed board
CN106371292A (en) * 2016-09-18 2017-02-01 中国科学院光电技术研究所 Double-sided photoetching workpiece table
CN107561748A (en) * 2017-11-01 2018-01-09 深圳宇顺电子股份有限公司 A kind of method for preventing transparent conductive glass fitting off normal
CN107761051A (en) * 2017-11-14 2018-03-06 合肥鑫晟光电科技有限公司 A kind of mask, mask evaporation component and evaporation coating device
CN108303857A (en) * 2018-01-25 2018-07-20 北京控制工程研究所 A kind of method, system and storage medium improving dual surface lithography consistency

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
高仰月: ""几种双面对准原理的分析与比较"", 《电子工业专用设备》 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112180694A (en) * 2020-10-30 2021-01-05 四川上特科技有限公司 A cold light source exposure machine
CN114967367A (en) * 2022-05-31 2022-08-30 中国科学院光电技术研究所 A double-sided lithography method for transparent substrates
CN117406560A (en) * 2023-11-03 2024-01-16 苏州天准科技股份有限公司 Multi-degree-of-freedom adjusting table and exposure equipment
CN117369223A (en) * 2023-12-08 2024-01-09 上海隐冠半导体技术有限公司 Leveling device and photoetching machine
CN117369223B (en) * 2023-12-08 2024-02-27 上海隐冠半导体技术有限公司 Leveling device and photoetching machine

Similar Documents

Publication Publication Date Title
CN110045583A (en) A kind of dual surface lithography work stage based on dual masks alignment
TWI581356B (en) Wafer processing apparatus and method
CN106371292B (en) Double-sided photoetching workpiece table
WO2014101795A1 (en) Warped silicon-chip adsorption device and adsorption method thereof
CN101063810A (en) Ultraviolet illumination micro-nano graph air pressure imprinting and photoetching dual-purpose copying device
TWI501861B (en) Roller-based imprinting system
TW202004953A (en) Worktable and back alignment device
CN114975207B (en) Turntable with lifting vacuum claw and handover method
US3220331A (en) Contact printing mask alignment apparatus for semiconductor wafer geometry
CN116931385B (en) Mask table of photoetching machine
CN1800975B (en) Step-by-step and repeated illumination nano-imprinting device
CN102955373B (en) Approaching exposure apparatus and approaching type exposure method
CN112965344A (en) Photoetching system and exposure compensation method thereof
CN106154745B (en) A micro-nano cross-scale high-resolution UV imprint lithography machine
CN101201555A (en) A double-swapping system for silicon wafer tables of a lithography machine using a conveyor belt structure
CN114859666B (en) Full-field exposure apparatus and full-field exposure method
CN216622960U (en) Workpiece table of double-sided photoetching machine
TWI427426B (en) Drawing device
CN114624964A (en) Exposure method and device
TWI704637B (en) Pre-alignment device and method for warped sheet
JP2005129791A (en) Microcontact printing method and apparatus
CN114779596A (en) High-precision double-sided exposure machine
JP6142214B2 (en) Proximity exposure apparatus and proximity exposure method
CN201181388Y (en) Double-swapping device for silicon wafer stage of lithography machine with conveyor belt structure
CN113820925A (en) A double-sided lithography machine workpiece table

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20190723