CN110045583A - A kind of dual surface lithography work stage based on dual masks alignment - Google Patents

A kind of dual surface lithography work stage based on dual masks alignment Download PDF

Info

Publication number
CN110045583A
CN110045583A CN201910411096.3A CN201910411096A CN110045583A CN 110045583 A CN110045583 A CN 110045583A CN 201910411096 A CN201910411096 A CN 201910411096A CN 110045583 A CN110045583 A CN 110045583A
Authority
CN
China
Prior art keywords
mask
plate
mask plate
vacuum
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910411096.3A
Other languages
Chinese (zh)
Inventor
杜婧
冯金花
刘俊伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Optics and Electronics of CAS
Original Assignee
Institute of Optics and Electronics of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institute of Optics and Electronics of CAS filed Critical Institute of Optics and Electronics of CAS
Priority to CN201910411096.3A priority Critical patent/CN110045583A/en
Publication of CN110045583A publication Critical patent/CN110045583A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70425Imaging strategies, e.g. for increasing throughput, printing product fields larger than the image field, compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching, double patterning
    • G03F7/70466Multiple exposures, e.g. combination of fine and coarse exposures, double patterning, multiple exposures for printing a single feature, mix-and-match
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70775Position control

Abstract

The invention discloses a kind of dual surface lithography work stages based on dual masks alignment, including pedestal, lower mask levelling mechanism, upper mask elevating mechanism;Pedestal is the reference for installation of entire work stage, is made of bottom plate and guide rail mounting base;Lower mask levelling mechanism is connect with bottom plate, and hemisphere, ball bowl and spring mechanism realize upper leveling of mask during decline with lower mask, and cylinder locking and ball bowl vacuum adsorption mechanism realize the locking to levelling mechanism;Upper mask elevating mechanism is driven by a motor precision ball screw and realizes driving, and rolling guide is used as guiding, the descending motion in realization when ascending motion of the mask in film releasing and alignment exposure.The present invention arranges in pairs or groups video to Barebone, lighting system, can be used for two-sided single exposure and two-sided while alignment, has the advantages that high production efficiency, easy to operate, exposure resolution ratio is higher.

Description

A kind of dual surface lithography work stage based on dual masks alignment
Technical field
The present invention relates to microelectronics special equipment technical fields, and in particular to a kind of dual surface lithography based on dual masks alignment Work stage, the substrate that can have corresponding position to require to front and back sides realize two-sided single exposure and two-sided while alignment.
Background technique
Double face photoetching machine is to produce the equipment that corresponding position requires figure in substrate front and back sides.Existing dual surface lithography The design of work stage is mainly based upon bottom alignment principle, places aligming microscope or so object lens, acquisition in work stage bottom Label on mask plate images in display, places into substrate, and figure is face-down, adjustment substrate make the label of its lower figure with Mask label alignment, the dual surface lithography work stage of this type can realize vacuum contact, eliminate diffraction effect, have very high exposure Resolution ratio and alignment precision, but its alignment time is very long and production efficiency is very low.
Dual masks alignment principles are first to be directed at two mask plates, place into substrate, simultaneously to substrate front and back sides It is exposed.This principle high production efficiency is suitble to development and production line equipment.Dual light currently on the market based on dual masks alignment Quarter, two-sided single exposure only can be achieved in machine, i.e., in substrate front and back sides, single produces the figure that corresponding position requires, Wu Fajin The multi-time two-sided while alignment of row has certain limitation for producing.
Summary of the invention
The purpose of the present invention is to provide a kind of dual surface lithography work stages based on dual masks alignment, serve primarily in life It produces in the very high dual surface lithography equipment of efficiency requirements, the invention and double-exposure head, video image form dual surface lithography to Barebone Machine can carry out two-sided single exposure and two-sided while alignment to substrate, have high production efficiency, easy to operate, alignment precision and The higher advantage of exposure resolution ratio.
The technical solution adopted by the present invention is that: a kind of dual surface lithography work stage based on dual masks alignment, comprising: pedestal, Lower mask levelling mechanism and upper mask elevating mechanism, the pedestal are the benchmark of entire work stage installation;The lower mask leveling Arrangement of mechanism is above the bottom plate of pedestal, leveling of mask during decline with lower mask in realization;The upper mask lifting Decline fortune of the arrangement of mechanism in the guide rail mounting base of pedestal, when ascending motion of the mask in film releasing and alignment expose in realization It is dynamic.
Further, the pedestal is made of bottom plate and guide rail mounting base, and the bottom plate is the substrate of work stage, described to lead Rail mounting base is connect with bottom plate.
Further, the lower mask levelling mechanism is protected by locking cylinder seat, support cylinder, support cylindrical spring, steel ball Hold frame, steel ball, piston, sealing ring, gasket, cylinder block end cap, cylinder gas nozzle, ball bowl adapter, ball bowl, hemisphere, ball bowl gas Mouth, ball bowl anti-rotation nail, lower mask holder, lower mask plate, substrate vacuum gas nozzle, lower mask vacuum gas nozzle, leveling optoelectronic switch, leveling Optoelectronic switch baffle, lower mask plate positioning pin composition;The locking cylinder seat is fixed on bottom plate;Three support cylinders are put It sets in locking cylinder seat, between the two with support cylindrical spring connection, supports cylinder that can do fortune up and down in locking cylinder seat Dynamic, ball retainer and steel ball are as its motion guide;Three pistons are placed on three circular holes of locking cylinder seat side It is interior, snare is sealed in outside piston groove, packing connection is encrypted between cylinder block end cap and locking cylinder seat, to prevent leak-stopping Gas;The cylinder gas nozzle is mounted on cylinder block end cap, the connection for locking cylinder seat and positive pressure gas source;The ball bowl switching Part is fixed on three support cylinders, and ball bowl is arranged on ball bowl adapter, and hemisphere is placed in ball bowl, and ball bowl gas nozzle is arranged in Connection on ball bowl, for ball bowl and positive pressure gas source and vacuum source;Two ball bowl anti-rotation nails are arranged on ball bowl in 180 °, with Two circular hole wide arc gaps cooperation under hemisphere, prevents hemisphere bottom rotational angle under air bearing operating condition excessive;The lower mask holder It being fixed on hemisphere, lower mask vacuum gas nozzle is fixed on lower mask holder side, for the connection of lower mask holder and vacuum source, this Vacuum is used for the absorption of lower mask plate, and lower mask plate is placed on lower mask holder, and it is fixed that three lower mask plates are installed on lower mask holder Position pin, the positioning for lower mask plate outer profile;Substrate vacuum gas nozzle is mounted on lower mask holder, and the company with vacuum source It connects, this vacuum can achieve lower mask plate upper surface by two apertures on lower mask holder, lower mask plate, for exposing substrate Vacuum suction;The leveling optoelectronic switch is fixed on locking cylinder seat side, and leveling optoelectronic switch baffle is fixed on ball bowl and turns Fitting side, during mask levelling mechanism leveling instantly, leveling optoelectronic switch and leveling optoelectronic switch baffle play lower limit and make With.
Further, the upper mask elevating mechanism is collateral by motor, motor rack, shaft coupling, ball-screw, bearing fixation Support unit, bearing support side support unit, screw nut sleeve, Z driven rod, Z drive rod set, rolling guide, upper mask connecting plate, Upper mask holder, upper mask holder locking handwheel, upper mask holder gas nozzle, upper mask plate, optoelectronic switch, Z-direction optoelectronic switch gear in Z-direction Optoelectronic switch forms under piece, Z-direction.The motor is the power source of upper mask lifting, is fixed on motor rack, motor rack is fixed on In guide rail mounting base;Motor is connect with ball-screw by shaft coupling, and it is single that ball-screw one end is fixed on the support of bearing affixed side In member, the other end is fixed in the support unit of bearing support side;The bearing affixed side support unit and the collateral support of bearing support Unit is mounted in guide rail mounting base;The concentric fixed installation of nut on the screw nut sleeve and ball-screw;The Z band Lever threaded portion and feed screw nut, which cover, to be connected, and bulb part and Z drive (309) 2 to 3 microns of rod set interference fits;The Z Rod set is driven to be fixed on mask connecting plate, rolling guide is mounted in guide rail mounting base, and upper mask connecting plate is mounted on rolling It moves on guide rail, the guiding that rolling guide moves up and down as upper mask connecting plate;The upper mask holder is locked by upper mask holder Handwheel is fixed on mask connecting plate, and upper mask holder gas nozzle is mounted on the side end face of mask holder, for upper mask holder and very The connection of air-source;Optoelectronic switch is fixed in guide rail mounting base with optoelectronic switch under Z-direction in the Z-direction, is connected for upper mask The limit up and down of fishplate bar Z-direction movement, Z-direction optoelectronic switch baffle are fixed on the side of mask connecting plate.
Further, the work stage in use, lower mask plate vacuum suction on lower mask holder, upper mask plate vacuum suction In on upper mask holder, upper mask elevating mechanism drives upper mask plate decline up to contacting with lower mask plate, at this time upper mask lifting While mechanism drives upper mask plate to continue decline, barotropic gas is inputted in the ball bowl in lower mask levelling mechanism, hemisphere is in ball Air bearing is in bowl to realize the leveling of lower mask plate and upper mask plate, and cylinder is supported to move downward, and lower end supports cylinder Spring starts to compress, until leveling optoelectronic switch senses that leveling optoelectronic switch baffle, upper mask elevating mechanism stop decline fortune It is dynamic, negative-pressure gas is inputted in ball bowl at this time, hemisphere is in ball bowl internal locking, while the interior input barotropic gas of locking cylinder seat is pushed and lived Plug movement is to lock support cylinder;Upper mask elevating mechanism drives upper mask plate to move upwards a distance L, will be upper Mask plate is placed on lower mask plate after removing, and the position that mask plate descends mask plate relatively is manually adjusted, in video image pair The label of two mask plates is aligned in the visual field of Barebone, the vacuum in substrate vacuum gas nozzle is opened after alignment, this is true Sky can achieve lower mask plate upper surface by two apertures on lower mask holder, lower mask plate, by upper mask plate and lower mask Plate is attached together;Upper mask elevating mechanism drives upper mask holder to move downward distance L and contacts with upper mask plate, and it is true to close substrate Vacuum in air mouth, mask holder gas nozzle in opening, upper mask plate vacuum suction is on upper mask holder at this time, upper mask elevator Structure drives upper mask plate to move upwards a distance L.The above alignment for completing upper mask plate and lower mask plate label.
Further, which forms double face photoetching machine with double-exposure head, to Barebone, can carry out two-sided one to substrate Secondary exposure and two-sided while alignment.When two-sided single exposure, after completing mask plate alignment, substrate is placed on lower mask plate, Upper mask elevating mechanism drives upper mask plate to move downward up to contacting with substrate upper surface, subsequent to carry out the two-sided of substrate Exposing operation simultaneously;When two-sided while alignment, after completing mask plate alignment, substrate is placed on lower mask plate, is manually adjusted Label on substrate is aligned by the position of substrate with the label on lower mask plate, is opened in substrate vacuum gas nozzle after alignment Vacuum, this vacuum can achieve lower mask plate upper surface by two apertures on lower mask holder, lower mask plate, substrate inhaled It is attached to the upper surface of lower mask plate, upper mask elevating mechanism drives upper mask plate to move downward until connecing with substrate upper surface at this time Touching, the subsequent two-sided while exposing operation that can carry out substrate complete two-sided while alignment.
The advantages of the present invention over the prior art are that:
(1), the present invention is the dual surface lithography work stage based on dual masks alignment principles, right using dual masks alignment It is short between punctual;
(2), the substrate that the present invention can have corresponding position to require to front and back sides realizes two-sided single exposure and two-sided while covering It carves, high production efficiency;
(3), the present invention forms double face photoetching machine with double-exposure head, to Barebone, has easy to operate, alignment precision and exposure The higher advantage of light resolution ratio.
Detailed description of the invention
Fig. 1 is a kind of overall construction drawing of the dual surface lithography work stage based on dual masks alignment of the present invention, wherein 100- base Seat;101- bottom plate;102- guide rail mounting base;Mask levelling mechanism under 200-;The upper mask elevating mechanism of 300-;
Fig. 2 is lower mask levelling mechanism structure chart, wherein Fig. 2 (a) is the isometric side view of lower mask levelling mechanism, Fig. 2 It (b) is the cross-sectional view of lower mask levelling mechanism, Fig. 2 (c) is the front view of lower mask levelling mechanism.In figure, 201- locking cylinder Seat, 202- support cylinder, 203- support cylindrical spring, 204- ball retainer, 205- steel ball, 206- piston, 207- sealing ring, 208- gasket, 209- cylinder block end cap, 210- cylinder gas nozzle, 211- ball bowl adapter, 212- ball bowl, 213- hemisphere, 214- Mask under mask plate, 218- substrate vacuum gas nozzle, 219- under mask holder, 217- under ball bowl gas nozzle, 215- ball bowl anti-rotation nail, 216- Mask plate positioning pin under vacuum gas nozzle, 220- leveling optoelectronic switch, 221- leveling optoelectronic switch baffle, 222-.
Fig. 3 is upper mask elevating mechanism structure chart, wherein Fig. 3 (a) is the isometric side view of upper mask elevating mechanism, Fig. 3 (b) be upper mask elevating mechanism front view, Fig. 3 (c) is the cross-sectional view of upper mask elevating mechanism, in figure, 301- motor, 302- Motor rack, 303- shaft coupling, 304- ball-screw, 305- bearing affixed side support unit, 306- bearing support side support unit, 307- screw nut sleeve, 308-Z driven rod, 309-Z drive rod set, 310- rolling guide, the upper mask connecting plate of 311-, on 312- Mask holder, 313- upper mask holder locking handwheel, the upper mask holder gas nozzle of 314-, the upper mask plate of 315-, the upward optoelectronic switch of 316-Z, 317-Z is to optoelectronic switch baffle, the downward optoelectronic switch of 318-Z.
Specific embodiment
In order to keep the features and advantages of the invention more obvious and easy to understand, specific implementation of the invention is done specifically below It is bright.
As shown, a kind of dual surface lithography work stage of the present invention, including pedestal 100, lower mask levelling mechanism 200 and above cover Mould elevating mechanism 300, the pedestal 100 are the benchmark of entire work stage installation, are made of bottom plate 101 and guide rail mounting base 102, The bottom plate 101 is the substrate of work stage, and the guide rail mounting base 102 is connect with bottom plate 101;The lower mask levelling mechanism 200 are arranged in 101 top of bottom plate of pedestal 100, leveling of mask during decline with lower mask in realization;The upper mask Elevating mechanism 300 is arranged in the guide rail mounting base 102 of pedestal 100, ascending motion and alignment of the mask in film releasing in realization Descending motion when exposure.
As shown in Fig. 2 (a), Fig. 2 (b) and Fig. 2 (c), lower mask levelling mechanism 200 is by locking cylinder seat 201, support cylinder 202, cylindrical spring 203, ball retainer 204, steel ball 205, piston 206, sealing ring 207, gasket 208, cylinder block are supported End cap 209, cylinder gas nozzle 210, ball bowl adapter 211, ball bowl 212, hemisphere 213, ball bowl gas nozzle 214, ball bowl anti-rotation nail 215, Lower mask holder 216, substrate vacuum gas nozzle 218, lower mask vacuum gas nozzle 219, leveling optoelectronic switch 220, is adjusted lower mask plate 217 Zero diopter electric switch baffle 221, lower mask plate positioning pin 222 composition;The locking cylinder seat 201 is fixed on bottom plate 101;It is described Three support cylinders 202 are placed in locking cylinder seat 201, are connected between the two with support cylindrical spring 203, are supported cylinder 202 can move up and down in locking cylinder seat 201, and ball retainer 204 and steel ball 205 are used as its motion guide;Described three A piston 206 is placed in three circular holes of 201 side of locking cylinder seat, 207 sets of sealing ring in 206 outer circle groove of piston, It encrypts packing 208 between cylinder block end cap 209 and locking cylinder seat 201 to connect, to prevent gas leakage;The cylinder gas nozzle 210 is pacified Connection on cylinder block end cap 209, for locking cylinder seat 201 and positive pressure gas source;The ball bowl adapter 211 is fixed on On three support cylinders 202, ball bowl 212 is arranged on ball bowl adapter 211, and hemisphere 213 is placed in ball bowl 212, ball bowl gas Mouth 214 is arranged on ball bowl 212, the connection for ball bowl 212 and positive pressure gas source and vacuum source;Two ball bowl anti-rotation nails 215 It is arranged on ball bowl 212 in 180 °, cooperates with two circular hole wide arc gaps under hemisphere 213, prevent 213 bottom of hemisphere in air bearing work Rotational angle is excessive under condition;The lower mask holder 216 is fixed on hemisphere 213, and lower mask vacuum gas nozzle 219 is fixed on lower mask 216 side of frame, for the connection of lower mask holder 216 and vacuum source, this vacuum is used for the absorption of lower mask plate 217, lower mask Plate 217 is placed on lower mask holder 216, and three lower mask plate positioning pins 222 are installed on lower mask holder 216, is used for lower mask plate The positioning of 217 outer profiles;Substrate vacuum gas nozzle 218 is mounted on lower mask holder 216, and the connection with vacuum source, this vacuum It can achieve lower 217 upper surface of mask plate by two apertures on lower mask holder 216, lower mask plate 217, for exposing substrate Vacuum suction;The leveling optoelectronic switch 220 is fixed on 201 side of locking cylinder seat, and leveling optoelectronic switch baffle 221 is fixed In 211 side of ball bowl adapter, during mask levelling mechanism 200 levels instantly, leveling optoelectronic switch 220 is opened with leveling photoelectricity It closes baffle 221 and removes position-limiting action.
As shown in Fig. 3 (a), Fig. 3 (b) and Fig. 3 (c), upper mask elevating mechanism 300 is by motor 301, motor rack 302, shaft coupling Device 303, ball-screw 304, bearing affixed side support unit 305, bearing support side support unit 306, screw nut sleeve 307, Z Driven rod 308, Z drive rod set 309, rolling guide 310, upper mask connecting plate 311, upper mask holder 312, upper mask holder to lock hand Wheel 313, upper mask holder gas nozzle 314, upper mask plate 315, light under optoelectronic switch 316, Z-direction optoelectronic switch baffle 317, Z-direction in Z-direction Electric switch 318 forms.The motor 301 is the power source of upper mask lifting, is fixed on motor rack 302, motor rack 302 is fixed In guide rail mounting base 102;Motor 301 is connect with ball-screw 304 by shaft coupling 303, and 304 one end of ball-screw is fixed on In bearing affixed side support unit 305, the other end is fixed in bearing support side support unit 306;The bearing fixation is collateral Support unit 305 and bearing support side support unit 306 are mounted in guide rail mounting base 102;The screw nut sleeve 307 and ball The concentric fixed installation of nut on lead screw 304;308 threaded portion of Z driven rod is connect with feed screw nut's set 307, ball Head, which is divided to, drives 309 liang to three microns of rod set interference fits with Z;The Z drives rod set to be fixed on mask connecting plate 311, Rolling guide 310 is mounted in guide rail mounting base 102, and upper mask connecting plate 311 is mounted on rolling guide 310, rolling guide 310 guiding to move up and down as upper mask connecting plate 311;The upper mask holder 312 is locked handwheel 313 by upper mask holder and is consolidated It is scheduled on mask connecting plate 311, upper mask holder gas nozzle 314 is mounted on the side end face of mask holder 312, is used for upper mask holder 312 with the connection of vacuum source;Optoelectronic switch 316 is fixed on guide rail mounting base 102 with optoelectronic switch 318 under Z-direction in the Z-direction On, for upper mask connecting plate 311Z to the limit up and down of movement, Z-direction optoelectronic switch baffle 317 is fixed on mask connecting plate 311 side.
Non-elaborated part of the present invention belongs to techniques known.

Claims (4)

1. a kind of dual surface lithography work stage based on dual masks alignment, it is characterised in that: including pedestal (100), lower mask leveling Mechanism (200) and upper mask elevating mechanism (300), the pedestal (100) are the benchmark of entire work stage installation;The lower mask Levelling mechanism (200) is arranged in above the bottom plates (101) of pedestal (100), in realization mask during decline with lower mask Leveling;The upper mask elevating mechanism (300) is arranged in the guide rail mounting base (102) of pedestal (100), and mask is being put in realization Descending motion when ascending motion and alignment when piece expose;
The pedestal (100) is made of bottom plate (101) and guide rail mounting base (102), and the bottom plate (101) is the base of work stage Plate, the guide rail mounting base (102) connect with bottom plate (101);
The lower mask levelling mechanism (200) by locking cylinder seat (201), support cylinder (202), support cylindrical spring (203), Ball retainer (204), steel ball (205), piston (206), sealing ring (207), gasket (208), cylinder block end cap (209), Cylinder gas nozzle (210), ball bowl adapter (211), ball bowl (212), hemisphere (213), ball bowl gas nozzle (214), ball bowl anti-rotation nail (215), lower mask holder (216), lower mask plate (217), substrate vacuum gas nozzle (218), lower mask vacuum gas nozzle (219), leveling Optoelectronic switch (220), leveling optoelectronic switch baffle (221), lower mask plate positioning pin (222) composition;The locking cylinder seat (201) it is fixed on bottom plate (101);Three support cylinders (202) are placed in locking cylinder seat (201), between the two With support cylindrical spring (203) connection, support cylinder (202) can move up and down in locking cylinder seat (201), and steel ball is kept Frame (204) and steel ball (205) are used as its motion guide;Three pistons (206) are placed on locking cylinder seat (201) side In three circular holes, sealing ring (207) covers in piston (206) outer circle groove, cylinder block end cap (209) and locking cylinder seat (201) packing (208) connection is encrypted between, to prevent gas leakage;The cylinder gas nozzle (210) is mounted on cylinder block end cap (209) On, it is used for the connection of locking cylinder seat (201) and positive pressure gas source;The ball bowl adapter (211) is fixed on three support cylinders (202) on, ball bowl (212) is arranged on ball bowl adapter (211), and hemisphere (213) is placed in ball bowl (212), ball bowl gas nozzle (214) it is arranged on ball bowl (212), is used for the connection of ball bowl (212) and positive pressure gas source and vacuum source;Two ball bowl anti-rotation nails (215) it is arranged on ball bowl (212) in 180 °, cooperates with two circular hole wide arc gaps under hemisphere (213), prevent hemisphere (213) Bottom rotational angle under air bearing operating condition is excessive;The lower mask holder (216) is fixed on hemisphere (213), lower mask vacuum gas Mouth (219) is fixed on lower mask holder (216) side, is used for the connection of lower mask holder (216) and vacuum source, this vacuum is used for down The absorption of mask plate (217), lower mask plate (217) are placed on lower mask holder (216), and three are installed on lower mask holder (216) Lower mask plate positioning pin (222) is used for the positioning of lower mask plate (217) outer profile;Substrate vacuum gas nozzle (218), which is mounted on down, to be covered On mould bases (216), and the connection with vacuum source, this vacuum pass through two on lower mask holder (216), lower mask plate (217) Aperture can achieve lower mask plate (217) upper surface, for exposing the vacuum suction of substrate;The leveling optoelectronic switch (220) It is fixed on locking cylinder seat (201) side, leveling optoelectronic switch baffle (221) is fixed on ball bowl adapter (211) side, instantly During mask levelling mechanism (200) leveling, leveling optoelectronic switch (220) and leveling optoelectronic switch baffle (221) play lower limit Effect;
The upper mask elevating mechanism (300) by motor (301), motor rack (302), shaft coupling (303), ball-screw (304), Bearing affixed side support unit (305), bearing support side support unit (306), screw nut sleeve (307), Z driven rod (308), Z drives rod set (309), rolling guide (310), upper mask connecting plate (311), upper mask holder (312), upper mask holder to lock handwheel (313), upper mask holder gas nozzle (314), upper mask plate (315), optoelectronic switch (316), Z-direction optoelectronic switch baffle in Z-direction (317), optoelectronic switch (318) forms under Z-direction;The motor (301) is the power source of upper mask lifting, is fixed on motor rack (302) on, motor rack (302) is fixed on guide rail mounting base (102);Motor (301) and ball-screw (304) pass through shaft coupling (303) it connects, ball-screw (304) one end is fixed in bearing affixed side support unit (305), and the other end is fixed on bearing branch It supports in side support unit (306);The bearing affixed side support unit (305) and bearing support side support unit (306) installation On guide rail mounting base (102);The concentric fixed installation of nut on the screw nut sleeve (307) and ball-screw (304); Z driven rod (308) threaded portion covers (307) with feed screw nut and connect, and bulb part and Z drive rod set (309) 2 to 3 Micron interference fit;The Z drives rod set to be fixed on mask connecting plate (311), and rolling guide (310) is mounted on guide rail peace It fills on seat (102), upper mask connecting plate (311) is mounted on rolling guide (310), and mask connects in rolling guide (310) conduct The guiding that fishplate bar (311) moves up and down;The upper mask holder (312) is fixed on by upper mask holder locking handwheel (313) and is covered On mould connecting plate (311), upper mask holder gas nozzle (314) is mounted on the side end face of mask holder (312), is used for upper mask holder (312) with the connection of vacuum source;Optoelectronic switch (316) is fixed on guide rail peace with optoelectronic switch (318) under Z-direction in the Z-direction It fills on seat (102), for the limit up and down of upper mask connecting plate (311) Z-direction movement, Z-direction optoelectronic switch baffle (317) is fixed on The side of upper mask connecting plate (311).
2. a kind of dual surface lithography work stage based on dual masks alignment according to claim 1, it is characterised in that: the workpiece Platform is in use, lower mask plate (217) vacuum suction is on lower mask holder (216), and upper mask plate (315) vacuum suction is in upper mask On frame (312), mask plate (315) declines up to contacting with lower mask plate (217) in upper mask elevating mechanism (300) drive, this When on while mask plate (217) continues decline in mask elevating mechanism (300) drive, in lower mask levelling mechanism (200) Input barotropic gas in ball bowl (212), hemisphere (213) ball bowl (212) interior air bearing under realizing mask plate (217) with above cover The leveling of template (315), and cylinder (202) is supported to move downward, lower end support cylindrical spring (203) starts to compress, directly Leveling optoelectronic switch baffle (221) is sensed to leveling optoelectronic switch (220), and upper mask elevating mechanism (300) stops decline fortune It is dynamic, input negative-pressure gas in ball bowl (212) at this time, hemisphere (213) is in ball bowl (212) internal locking, while locking cylinder seat (201) Interior input barotropic gas pushes piston (206) movement to lock to support cylinder (202);Upper mask elevating mechanism (300) mask plate (315) moves upwards a distance L in drive, is placed on lower mask plate after upper mask plate (315) is removed (217) on, the position that mask plate (315) descends mask plate (217) relatively is manually adjusted, in video image to the visual field of Barebone The interior label by two mask plates is aligned, and the vacuum in substrate vacuum gas nozzle (218) is opened after alignment, under this vacuum passes through Two apertures on mask holder (216), lower mask plate (217) can achieve lower mask plate (217) upper surface, by upper mask plate (315) it is attached together with lower mask plate (217);In upper mask elevating mechanism (300) drive mask holder (312) move downward away from It is contacted from L with upper mask plate (315), the vacuum in closing substrate vacuum gas nozzle (218), mask holder gas nozzle (314) in opening, this When on mask plate (315) vacuum suction on upper mask holder (312), mask plate (315) in upper mask elevating mechanism (300) drive A distance L is moved upwards, the alignment of mask plate (315) and lower mask plate (217) label in the above completion.
3. a kind of dual surface lithography work stage based on dual masks alignment according to claim 1 or 2, it is characterised in that: should Work stage and double-exposure head form double face photoetching machine to Barebone, and two-sided single exposure can be carried out to substrate and two-sided is covered simultaneously It carves;When two-sided single exposure, after completing mask plate alignment, substrate, upper mask elevating mechanism are placed on lower mask plate (217) (300) mask plate (315) moves downward until contact with substrate upper surface in drive, it is subsequent can carry out substrate it is two-sided simultaneously Exposing operation;When two-sided while alignment, after completing mask plate alignment, substrate is placed on lower mask plate (217), is manually adjusted Label on substrate is aligned by the position of substrate with the label on lower mask plate (217), and substrate vacuum gas is opened after alignment Vacuum in mouth (218), this vacuum be can achieve down by two apertures on lower mask holder (216), lower mask plate (217) and covered Substrate, is adsorbed on the upper surface of lower mask plate (217) by template (217) upper surface, and upper mask elevating mechanism (300) drive at this time Upper mask plate (315) moves downward up to contacting with substrate upper surface, the subsequent two-sided while exposing operation that can carry out substrate, Complete two-sided while alignment.
4. a kind of dual surface lithography work stage based on dual masks alignment according to claim 1 or 2, it is characterised in that: should Work stage and double-exposure head form double face photoetching machine to Barebone, and two-sided single exposure can be carried out to substrate and two-sided is covered simultaneously It carves.
CN201910411096.3A 2019-05-17 2019-05-17 A kind of dual surface lithography work stage based on dual masks alignment Pending CN110045583A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910411096.3A CN110045583A (en) 2019-05-17 2019-05-17 A kind of dual surface lithography work stage based on dual masks alignment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910411096.3A CN110045583A (en) 2019-05-17 2019-05-17 A kind of dual surface lithography work stage based on dual masks alignment

Publications (1)

Publication Number Publication Date
CN110045583A true CN110045583A (en) 2019-07-23

Family

ID=67282387

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910411096.3A Pending CN110045583A (en) 2019-05-17 2019-05-17 A kind of dual surface lithography work stage based on dual masks alignment

Country Status (1)

Country Link
CN (1) CN110045583A (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1094827A (en) * 1993-05-05 1994-11-09 哈尔滨工业大学 Two-sided to the version exposure machine
US7425238B2 (en) * 2002-10-16 2008-09-16 Canon Kabushiki Kaisha Substrate holding device
CN204145893U (en) * 2014-09-15 2015-02-04 中国电子科技集团公司第二十九研究所 A kind of exposure positioning device for printed board
CN204178122U (en) * 2014-08-22 2015-02-25 深圳市大川光电设备有限公司 Be applicable to the film and the workpiece adherence device of image transfer exposure machine
CN106371292A (en) * 2016-09-18 2017-02-01 中国科学院光电技术研究所 Double-side photoetching workpiece table
CN107561748A (en) * 2017-11-01 2018-01-09 深圳宇顺电子股份有限公司 A kind of method for preventing transparent conductive glass fitting off normal
CN107761051A (en) * 2017-11-14 2018-03-06 合肥鑫晟光电科技有限公司 A kind of mask, mask evaporation component and evaporation coating device
CN108303857A (en) * 2018-01-25 2018-07-20 北京控制工程研究所 A kind of method, system and storage medium improving dual surface lithography consistency

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1094827A (en) * 1993-05-05 1994-11-09 哈尔滨工业大学 Two-sided to the version exposure machine
US7425238B2 (en) * 2002-10-16 2008-09-16 Canon Kabushiki Kaisha Substrate holding device
CN204178122U (en) * 2014-08-22 2015-02-25 深圳市大川光电设备有限公司 Be applicable to the film and the workpiece adherence device of image transfer exposure machine
CN204145893U (en) * 2014-09-15 2015-02-04 中国电子科技集团公司第二十九研究所 A kind of exposure positioning device for printed board
CN106371292A (en) * 2016-09-18 2017-02-01 中国科学院光电技术研究所 Double-side photoetching workpiece table
CN107561748A (en) * 2017-11-01 2018-01-09 深圳宇顺电子股份有限公司 A kind of method for preventing transparent conductive glass fitting off normal
CN107761051A (en) * 2017-11-14 2018-03-06 合肥鑫晟光电科技有限公司 A kind of mask, mask evaporation component and evaporation coating device
CN108303857A (en) * 2018-01-25 2018-07-20 北京控制工程研究所 A kind of method, system and storage medium improving dual surface lithography consistency

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
高仰月: ""几种双面对准原理的分析与比较"", 《电子工业专用设备》 *

Similar Documents

Publication Publication Date Title
CN1800975B (en) Stepped and repeated illuminating and nano-imprinting device
CN103904011A (en) Sucking device for warped silicon wafer and sucking method thereof
CN106371292B (en) A kind of dual surface lithography work stage
TW201323186A (en) Roller-based imprinting system
CN110045583A (en) A kind of dual surface lithography work stage based on dual masks alignment
CN103529373A (en) Defect detection device for OLED
CN107817654A (en) Vacuum surface plasma light engraving device
CN105033630A (en) Automobile lamp shell mounting screw driving-in device
CN109556088A (en) A kind of LED illumination device convenient for safeguarding
CN207206250U (en) Multi-sucker formula workpiece fixed mechanism
JP2006098296A (en) Lighting inspection device of display panel
CN106338890B (en) A kind of passive base connecting mechanism and method
CN204844054U (en) A device for dismouting valve spring
CN210257585U (en) Vacuum printing-down machine
CN108161829A (en) A kind of piston and dust cover press-loading apparatus
CN209310828U (en) A kind of one-touch flash tester
CN207778126U (en) A kind of surgical operation lighting device
CN211350608U (en) Auxiliary device for reducing wafer adsorption warping degree and projection photoetching machine
TWI726740B (en) A wafer test head
JPH09107198A (en) Electronic component fitter
CN209282175U (en) A kind of COG binding machine
CN109668584A (en) A kind of one-touch flash tester
CN213874192U (en) Water drop angle tester
CN210605357U (en) Lower light source exposure device
CN214980580U (en) Device for replacing yaw brake sealing ring based on wind generating set

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination