CN110045583A - A kind of dual surface lithography work stage based on dual masks alignment - Google Patents
A kind of dual surface lithography work stage based on dual masks alignment Download PDFInfo
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- CN110045583A CN110045583A CN201910411096.3A CN201910411096A CN110045583A CN 110045583 A CN110045583 A CN 110045583A CN 201910411096 A CN201910411096 A CN 201910411096A CN 110045583 A CN110045583 A CN 110045583A
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- 238000001459 lithography Methods 0.000 title claims abstract description 17
- 230000003028 elevating Effects 0.000 claims abstract description 29
- 238000005096 rolling process Methods 0.000 claims abstract description 14
- 238000009434 installation Methods 0.000 claims abstract description 8
- 230000001174 ascending Effects 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 48
- 230000005693 optoelectronics Effects 0.000 claims description 42
- 229910000831 Steel Inorganic materials 0.000 claims description 9
- 239000010959 steel Substances 0.000 claims description 9
- 210000000282 Nails Anatomy 0.000 claims description 7
- 230000001808 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 6
- 238000001259 photo etching Methods 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 230000000007 visual effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000000875 corresponding Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 210000003128 Head Anatomy 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Exposure apparatus for microlithography
- G03F7/70425—Imaging strategies, e.g. for increasing throughput, printing product fields larger than the image field, compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching, double patterning
- G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning, multiple exposures for printing a single feature, mix-and-match
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Exposure apparatus for microlithography
- G03F7/70691—Handling of masks or wafers
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Exposure apparatus for microlithography
- G03F7/70691—Handling of masks or wafers
- G03F7/70775—Position control
Abstract
The invention discloses a kind of dual surface lithography work stages based on dual masks alignment, including pedestal, lower mask levelling mechanism, upper mask elevating mechanism；Pedestal is the reference for installation of entire work stage, is made of bottom plate and guide rail mounting base；Lower mask levelling mechanism is connect with bottom plate, and hemisphere, ball bowl and spring mechanism realize upper leveling of mask during decline with lower mask, and cylinder locking and ball bowl vacuum adsorption mechanism realize the locking to levelling mechanism；Upper mask elevating mechanism is driven by a motor precision ball screw and realizes driving, and rolling guide is used as guiding, the descending motion in realization when ascending motion of the mask in film releasing and alignment exposure.The present invention arranges in pairs or groups video to Barebone, lighting system, can be used for two-sided single exposure and two-sided while alignment, has the advantages that high production efficiency, easy to operate, exposure resolution ratio is higher.
Description
Technical field
The present invention relates to microelectronics special equipment technical fields, and in particular to a kind of dual surface lithography based on dual masks alignment
Work stage, the substrate that can have corresponding position to require to front and back sides realize two-sided single exposure and two-sided while alignment.
Background technique
Double face photoetching machine is to produce the equipment that corresponding position requires figure in substrate front and back sides.Existing dual surface lithography
The design of work stage is mainly based upon bottom alignment principle, places aligming microscope or so object lens, acquisition in work stage bottom
Label on mask plate images in display, places into substrate, and figure is face-down, adjustment substrate make the label of its lower figure with
Mask label alignment, the dual surface lithography work stage of this type can realize vacuum contact, eliminate diffraction effect, have very high exposure
Resolution ratio and alignment precision, but its alignment time is very long and production efficiency is very low.
Dual masks alignment principles are first to be directed at two mask plates, place into substrate, simultaneously to substrate front and back sides
It is exposed.This principle high production efficiency is suitble to development and production line equipment.Dual light currently on the market based on dual masks alignment
Quarter, two-sided single exposure only can be achieved in machine, i.e., in substrate front and back sides, single produces the figure that corresponding position requires, Wu Fajin
The multi-time two-sided while alignment of row has certain limitation for producing.
Summary of the invention
The purpose of the present invention is to provide a kind of dual surface lithography work stages based on dual masks alignment, serve primarily in life
It produces in the very high dual surface lithography equipment of efficiency requirements, the invention and double-exposure head, video image form dual surface lithography to Barebone
Machine can carry out two-sided single exposure and two-sided while alignment to substrate, have high production efficiency, easy to operate, alignment precision and
The higher advantage of exposure resolution ratio.
The technical solution adopted by the present invention is that: a kind of dual surface lithography work stage based on dual masks alignment, comprising: pedestal,
Lower mask levelling mechanism and upper mask elevating mechanism, the pedestal are the benchmark of entire work stage installation；The lower mask leveling
Arrangement of mechanism is above the bottom plate of pedestal, leveling of mask during decline with lower mask in realization；The upper mask lifting
Decline fortune of the arrangement of mechanism in the guide rail mounting base of pedestal, when ascending motion of the mask in film releasing and alignment expose in realization
It is dynamic.
Further, the pedestal is made of bottom plate and guide rail mounting base, and the bottom plate is the substrate of work stage, described to lead
Rail mounting base is connect with bottom plate.
Further, the lower mask levelling mechanism is protected by locking cylinder seat, support cylinder, support cylindrical spring, steel ball
Hold frame, steel ball, piston, sealing ring, gasket, cylinder block end cap, cylinder gas nozzle, ball bowl adapter, ball bowl, hemisphere, ball bowl gas
Mouth, ball bowl anti-rotation nail, lower mask holder, lower mask plate, substrate vacuum gas nozzle, lower mask vacuum gas nozzle, leveling optoelectronic switch, leveling
Optoelectronic switch baffle, lower mask plate positioning pin composition；The locking cylinder seat is fixed on bottom plate；Three support cylinders are put
It sets in locking cylinder seat, between the two with support cylindrical spring connection, supports cylinder that can do fortune up and down in locking cylinder seat
Dynamic, ball retainer and steel ball are as its motion guide；Three pistons are placed on three circular holes of locking cylinder seat side
It is interior, snare is sealed in outside piston groove, packing connection is encrypted between cylinder block end cap and locking cylinder seat, to prevent leak-stopping
Gas；The cylinder gas nozzle is mounted on cylinder block end cap, the connection for locking cylinder seat and positive pressure gas source；The ball bowl switching
Part is fixed on three support cylinders, and ball bowl is arranged on ball bowl adapter, and hemisphere is placed in ball bowl, and ball bowl gas nozzle is arranged in
Connection on ball bowl, for ball bowl and positive pressure gas source and vacuum source；Two ball bowl anti-rotation nails are arranged on ball bowl in 180 °, with
Two circular hole wide arc gaps cooperation under hemisphere, prevents hemisphere bottom rotational angle under air bearing operating condition excessive；The lower mask holder
It being fixed on hemisphere, lower mask vacuum gas nozzle is fixed on lower mask holder side, for the connection of lower mask holder and vacuum source, this
Vacuum is used for the absorption of lower mask plate, and lower mask plate is placed on lower mask holder, and it is fixed that three lower mask plates are installed on lower mask holder
Position pin, the positioning for lower mask plate outer profile；Substrate vacuum gas nozzle is mounted on lower mask holder, and the company with vacuum source
It connects, this vacuum can achieve lower mask plate upper surface by two apertures on lower mask holder, lower mask plate, for exposing substrate
Vacuum suction；The leveling optoelectronic switch is fixed on locking cylinder seat side, and leveling optoelectronic switch baffle is fixed on ball bowl and turns
Fitting side, during mask levelling mechanism leveling instantly, leveling optoelectronic switch and leveling optoelectronic switch baffle play lower limit and make
With.
Further, the upper mask elevating mechanism is collateral by motor, motor rack, shaft coupling, ball-screw, bearing fixation
Support unit, bearing support side support unit, screw nut sleeve, Z driven rod, Z drive rod set, rolling guide, upper mask connecting plate,
Upper mask holder, upper mask holder locking handwheel, upper mask holder gas nozzle, upper mask plate, optoelectronic switch, Z-direction optoelectronic switch gear in Z-direction
Optoelectronic switch forms under piece, Z-direction.The motor is the power source of upper mask lifting, is fixed on motor rack, motor rack is fixed on
In guide rail mounting base；Motor is connect with ball-screw by shaft coupling, and it is single that ball-screw one end is fixed on the support of bearing affixed side
In member, the other end is fixed in the support unit of bearing support side；The bearing affixed side support unit and the collateral support of bearing support
Unit is mounted in guide rail mounting base；The concentric fixed installation of nut on the screw nut sleeve and ball-screw；The Z band
Lever threaded portion and feed screw nut, which cover, to be connected, and bulb part and Z drive (309) 2 to 3 microns of rod set interference fits；The Z
Rod set is driven to be fixed on mask connecting plate, rolling guide is mounted in guide rail mounting base, and upper mask connecting plate is mounted on rolling
It moves on guide rail, the guiding that rolling guide moves up and down as upper mask connecting plate；The upper mask holder is locked by upper mask holder
Handwheel is fixed on mask connecting plate, and upper mask holder gas nozzle is mounted on the side end face of mask holder, for upper mask holder and very
The connection of air-source；Optoelectronic switch is fixed in guide rail mounting base with optoelectronic switch under Z-direction in the Z-direction, is connected for upper mask
The limit up and down of fishplate bar Z-direction movement, Z-direction optoelectronic switch baffle are fixed on the side of mask connecting plate.
Further, the work stage in use, lower mask plate vacuum suction on lower mask holder, upper mask plate vacuum suction
In on upper mask holder, upper mask elevating mechanism drives upper mask plate decline up to contacting with lower mask plate, at this time upper mask lifting
While mechanism drives upper mask plate to continue decline, barotropic gas is inputted in the ball bowl in lower mask levelling mechanism, hemisphere is in ball
Air bearing is in bowl to realize the leveling of lower mask plate and upper mask plate, and cylinder is supported to move downward, and lower end supports cylinder
Spring starts to compress, until leveling optoelectronic switch senses that leveling optoelectronic switch baffle, upper mask elevating mechanism stop decline fortune
It is dynamic, negative-pressure gas is inputted in ball bowl at this time, hemisphere is in ball bowl internal locking, while the interior input barotropic gas of locking cylinder seat is pushed and lived
Plug movement is to lock support cylinder；Upper mask elevating mechanism drives upper mask plate to move upwards a distance L, will be upper
Mask plate is placed on lower mask plate after removing, and the position that mask plate descends mask plate relatively is manually adjusted, in video image pair
The label of two mask plates is aligned in the visual field of Barebone, the vacuum in substrate vacuum gas nozzle is opened after alignment, this is true
Sky can achieve lower mask plate upper surface by two apertures on lower mask holder, lower mask plate, by upper mask plate and lower mask
Plate is attached together；Upper mask elevating mechanism drives upper mask holder to move downward distance L and contacts with upper mask plate, and it is true to close substrate
Vacuum in air mouth, mask holder gas nozzle in opening, upper mask plate vacuum suction is on upper mask holder at this time, upper mask elevator
Structure drives upper mask plate to move upwards a distance L.The above alignment for completing upper mask plate and lower mask plate label.
Further, which forms double face photoetching machine with double-exposure head, to Barebone, can carry out two-sided one to substrate
Secondary exposure and two-sided while alignment.When two-sided single exposure, after completing mask plate alignment, substrate is placed on lower mask plate,
Upper mask elevating mechanism drives upper mask plate to move downward up to contacting with substrate upper surface, subsequent to carry out the two-sided of substrate
Exposing operation simultaneously；When two-sided while alignment, after completing mask plate alignment, substrate is placed on lower mask plate, is manually adjusted
Label on substrate is aligned by the position of substrate with the label on lower mask plate, is opened in substrate vacuum gas nozzle after alignment
Vacuum, this vacuum can achieve lower mask plate upper surface by two apertures on lower mask holder, lower mask plate, substrate inhaled
It is attached to the upper surface of lower mask plate, upper mask elevating mechanism drives upper mask plate to move downward until connecing with substrate upper surface at this time
Touching, the subsequent two-sided while exposing operation that can carry out substrate complete two-sided while alignment.
The advantages of the present invention over the prior art are that:
(1), the present invention is the dual surface lithography work stage based on dual masks alignment principles, right using dual masks alignment
It is short between punctual；
(2), the substrate that the present invention can have corresponding position to require to front and back sides realizes two-sided single exposure and two-sided while covering
It carves, high production efficiency；
(3), the present invention forms double face photoetching machine with double-exposure head, to Barebone, has easy to operate, alignment precision and exposure
The higher advantage of light resolution ratio.
Detailed description of the invention
Fig. 1 is a kind of overall construction drawing of the dual surface lithography work stage based on dual masks alignment of the present invention, wherein 100- base
Seat；101- bottom plate；102- guide rail mounting base；Mask levelling mechanism under 200-；The upper mask elevating mechanism of 300-；
Fig. 2 is lower mask levelling mechanism structure chart, wherein Fig. 2 (a) is the isometric side view of lower mask levelling mechanism, Fig. 2
It (b) is the cross-sectional view of lower mask levelling mechanism, Fig. 2 (c) is the front view of lower mask levelling mechanism.In figure, 201- locking cylinder
Seat, 202- support cylinder, 203- support cylindrical spring, 204- ball retainer, 205- steel ball, 206- piston, 207- sealing ring,
208- gasket, 209- cylinder block end cap, 210- cylinder gas nozzle, 211- ball bowl adapter, 212- ball bowl, 213- hemisphere, 214-
Mask under mask plate, 218- substrate vacuum gas nozzle, 219- under mask holder, 217- under ball bowl gas nozzle, 215- ball bowl anti-rotation nail, 216-
Mask plate positioning pin under vacuum gas nozzle, 220- leveling optoelectronic switch, 221- leveling optoelectronic switch baffle, 222-.
Fig. 3 is upper mask elevating mechanism structure chart, wherein Fig. 3 (a) is the isometric side view of upper mask elevating mechanism, Fig. 3
(b) be upper mask elevating mechanism front view, Fig. 3 (c) is the cross-sectional view of upper mask elevating mechanism, in figure, 301- motor, 302-
Motor rack, 303- shaft coupling, 304- ball-screw, 305- bearing affixed side support unit, 306- bearing support side support unit,
307- screw nut sleeve, 308-Z driven rod, 309-Z drive rod set, 310- rolling guide, the upper mask connecting plate of 311-, on 312-
Mask holder, 313- upper mask holder locking handwheel, the upper mask holder gas nozzle of 314-, the upper mask plate of 315-, the upward optoelectronic switch of 316-Z,
317-Z is to optoelectronic switch baffle, the downward optoelectronic switch of 318-Z.
Specific embodiment
In order to keep the features and advantages of the invention more obvious and easy to understand, specific implementation of the invention is done specifically below
It is bright.
As shown, a kind of dual surface lithography work stage of the present invention, including pedestal 100, lower mask levelling mechanism 200 and above cover
Mould elevating mechanism 300, the pedestal 100 are the benchmark of entire work stage installation, are made of bottom plate 101 and guide rail mounting base 102,
The bottom plate 101 is the substrate of work stage, and the guide rail mounting base 102 is connect with bottom plate 101；The lower mask levelling mechanism
200 are arranged in 101 top of bottom plate of pedestal 100, leveling of mask during decline with lower mask in realization；The upper mask
Elevating mechanism 300 is arranged in the guide rail mounting base 102 of pedestal 100, ascending motion and alignment of the mask in film releasing in realization
Descending motion when exposure.
As shown in Fig. 2 (a), Fig. 2 (b) and Fig. 2 (c), lower mask levelling mechanism 200 is by locking cylinder seat 201, support cylinder
202, cylindrical spring 203, ball retainer 204, steel ball 205, piston 206, sealing ring 207, gasket 208, cylinder block are supported
End cap 209, cylinder gas nozzle 210, ball bowl adapter 211, ball bowl 212, hemisphere 213, ball bowl gas nozzle 214, ball bowl anti-rotation nail 215,
Lower mask holder 216, substrate vacuum gas nozzle 218, lower mask vacuum gas nozzle 219, leveling optoelectronic switch 220, is adjusted lower mask plate 217
Zero diopter electric switch baffle 221, lower mask plate positioning pin 222 composition；The locking cylinder seat 201 is fixed on bottom plate 101；It is described
Three support cylinders 202 are placed in locking cylinder seat 201, are connected between the two with support cylindrical spring 203, are supported cylinder
202 can move up and down in locking cylinder seat 201, and ball retainer 204 and steel ball 205 are used as its motion guide；Described three
A piston 206 is placed in three circular holes of 201 side of locking cylinder seat, 207 sets of sealing ring in 206 outer circle groove of piston,
It encrypts packing 208 between cylinder block end cap 209 and locking cylinder seat 201 to connect, to prevent gas leakage；The cylinder gas nozzle 210 is pacified
Connection on cylinder block end cap 209, for locking cylinder seat 201 and positive pressure gas source；The ball bowl adapter 211 is fixed on
On three support cylinders 202, ball bowl 212 is arranged on ball bowl adapter 211, and hemisphere 213 is placed in ball bowl 212, ball bowl gas
Mouth 214 is arranged on ball bowl 212, the connection for ball bowl 212 and positive pressure gas source and vacuum source；Two ball bowl anti-rotation nails 215
It is arranged on ball bowl 212 in 180 °, cooperates with two circular hole wide arc gaps under hemisphere 213, prevent 213 bottom of hemisphere in air bearing work
Rotational angle is excessive under condition；The lower mask holder 216 is fixed on hemisphere 213, and lower mask vacuum gas nozzle 219 is fixed on lower mask
216 side of frame, for the connection of lower mask holder 216 and vacuum source, this vacuum is used for the absorption of lower mask plate 217, lower mask
Plate 217 is placed on lower mask holder 216, and three lower mask plate positioning pins 222 are installed on lower mask holder 216, is used for lower mask plate
The positioning of 217 outer profiles；Substrate vacuum gas nozzle 218 is mounted on lower mask holder 216, and the connection with vacuum source, this vacuum
It can achieve lower 217 upper surface of mask plate by two apertures on lower mask holder 216, lower mask plate 217, for exposing substrate
Vacuum suction；The leveling optoelectronic switch 220 is fixed on 201 side of locking cylinder seat, and leveling optoelectronic switch baffle 221 is fixed
In 211 side of ball bowl adapter, during mask levelling mechanism 200 levels instantly, leveling optoelectronic switch 220 is opened with leveling photoelectricity
It closes baffle 221 and removes position-limiting action.
As shown in Fig. 3 (a), Fig. 3 (b) and Fig. 3 (c), upper mask elevating mechanism 300 is by motor 301, motor rack 302, shaft coupling
Device 303, ball-screw 304, bearing affixed side support unit 305, bearing support side support unit 306, screw nut sleeve 307, Z
Driven rod 308, Z drive rod set 309, rolling guide 310, upper mask connecting plate 311, upper mask holder 312, upper mask holder to lock hand
Wheel 313, upper mask holder gas nozzle 314, upper mask plate 315, light under optoelectronic switch 316, Z-direction optoelectronic switch baffle 317, Z-direction in Z-direction
Electric switch 318 forms.The motor 301 is the power source of upper mask lifting, is fixed on motor rack 302, motor rack 302 is fixed
In guide rail mounting base 102；Motor 301 is connect with ball-screw 304 by shaft coupling 303, and 304 one end of ball-screw is fixed on
In bearing affixed side support unit 305, the other end is fixed in bearing support side support unit 306；The bearing fixation is collateral
Support unit 305 and bearing support side support unit 306 are mounted in guide rail mounting base 102；The screw nut sleeve 307 and ball
The concentric fixed installation of nut on lead screw 304；308 threaded portion of Z driven rod is connect with feed screw nut's set 307, ball
Head, which is divided to, drives 309 liang to three microns of rod set interference fits with Z；The Z drives rod set to be fixed on mask connecting plate 311,
Rolling guide 310 is mounted in guide rail mounting base 102, and upper mask connecting plate 311 is mounted on rolling guide 310, rolling guide
310 guiding to move up and down as upper mask connecting plate 311；The upper mask holder 312 is locked handwheel 313 by upper mask holder and is consolidated
It is scheduled on mask connecting plate 311, upper mask holder gas nozzle 314 is mounted on the side end face of mask holder 312, is used for upper mask holder
312 with the connection of vacuum source；Optoelectronic switch 316 is fixed on guide rail mounting base 102 with optoelectronic switch 318 under Z-direction in the Z-direction
On, for upper mask connecting plate 311Z to the limit up and down of movement, Z-direction optoelectronic switch baffle 317 is fixed on mask connecting plate
311 side.
Non-elaborated part of the present invention belongs to techniques known.
Claims (4)
1. a kind of dual surface lithography work stage based on dual masks alignment, it is characterised in that: including pedestal (100), lower mask leveling
Mechanism (200) and upper mask elevating mechanism (300), the pedestal (100) are the benchmark of entire work stage installation；The lower mask
Levelling mechanism (200) is arranged in above the bottom plates (101) of pedestal (100), in realization mask during decline with lower mask
Leveling；The upper mask elevating mechanism (300) is arranged in the guide rail mounting base (102) of pedestal (100), and mask is being put in realization
Descending motion when ascending motion and alignment when piece expose；
The pedestal (100) is made of bottom plate (101) and guide rail mounting base (102), and the bottom plate (101) is the base of work stage
Plate, the guide rail mounting base (102) connect with bottom plate (101)；
The lower mask levelling mechanism (200) by locking cylinder seat (201), support cylinder (202), support cylindrical spring (203),
Ball retainer (204), steel ball (205), piston (206), sealing ring (207), gasket (208), cylinder block end cap (209),
Cylinder gas nozzle (210), ball bowl adapter (211), ball bowl (212), hemisphere (213), ball bowl gas nozzle (214), ball bowl anti-rotation nail
(215), lower mask holder (216), lower mask plate (217), substrate vacuum gas nozzle (218), lower mask vacuum gas nozzle (219), leveling
Optoelectronic switch (220), leveling optoelectronic switch baffle (221), lower mask plate positioning pin (222) composition；The locking cylinder seat
(201) it is fixed on bottom plate (101)；Three support cylinders (202) are placed in locking cylinder seat (201), between the two
With support cylindrical spring (203) connection, support cylinder (202) can move up and down in locking cylinder seat (201), and steel ball is kept
Frame (204) and steel ball (205) are used as its motion guide；Three pistons (206) are placed on locking cylinder seat (201) side
In three circular holes, sealing ring (207) covers in piston (206) outer circle groove, cylinder block end cap (209) and locking cylinder seat
(201) packing (208) connection is encrypted between, to prevent gas leakage；The cylinder gas nozzle (210) is mounted on cylinder block end cap (209)
On, it is used for the connection of locking cylinder seat (201) and positive pressure gas source；The ball bowl adapter (211) is fixed on three support cylinders
(202) on, ball bowl (212) is arranged on ball bowl adapter (211), and hemisphere (213) is placed in ball bowl (212), ball bowl gas nozzle
(214) it is arranged on ball bowl (212), is used for the connection of ball bowl (212) and positive pressure gas source and vacuum source；Two ball bowl anti-rotation nails
(215) it is arranged on ball bowl (212) in 180 °, cooperates with two circular hole wide arc gaps under hemisphere (213), prevent hemisphere (213)
Bottom rotational angle under air bearing operating condition is excessive；The lower mask holder (216) is fixed on hemisphere (213), lower mask vacuum gas
Mouth (219) is fixed on lower mask holder (216) side, is used for the connection of lower mask holder (216) and vacuum source, this vacuum is used for down
The absorption of mask plate (217), lower mask plate (217) are placed on lower mask holder (216), and three are installed on lower mask holder (216)
Lower mask plate positioning pin (222) is used for the positioning of lower mask plate (217) outer profile；Substrate vacuum gas nozzle (218), which is mounted on down, to be covered
On mould bases (216), and the connection with vacuum source, this vacuum pass through two on lower mask holder (216), lower mask plate (217)
Aperture can achieve lower mask plate (217) upper surface, for exposing the vacuum suction of substrate；The leveling optoelectronic switch (220)
It is fixed on locking cylinder seat (201) side, leveling optoelectronic switch baffle (221) is fixed on ball bowl adapter (211) side, instantly
During mask levelling mechanism (200) leveling, leveling optoelectronic switch (220) and leveling optoelectronic switch baffle (221) play lower limit
Effect；
The upper mask elevating mechanism (300) by motor (301), motor rack (302), shaft coupling (303), ball-screw (304),
Bearing affixed side support unit (305), bearing support side support unit (306), screw nut sleeve (307), Z driven rod (308),
Z drives rod set (309), rolling guide (310), upper mask connecting plate (311), upper mask holder (312), upper mask holder to lock handwheel
(313), upper mask holder gas nozzle (314), upper mask plate (315), optoelectronic switch (316), Z-direction optoelectronic switch baffle in Z-direction
(317), optoelectronic switch (318) forms under Z-direction；The motor (301) is the power source of upper mask lifting, is fixed on motor rack
(302) on, motor rack (302) is fixed on guide rail mounting base (102)；Motor (301) and ball-screw (304) pass through shaft coupling
(303) it connects, ball-screw (304) one end is fixed in bearing affixed side support unit (305), and the other end is fixed on bearing branch
It supports in side support unit (306)；The bearing affixed side support unit (305) and bearing support side support unit (306) installation
On guide rail mounting base (102)；The concentric fixed installation of nut on the screw nut sleeve (307) and ball-screw (304)；
Z driven rod (308) threaded portion covers (307) with feed screw nut and connect, and bulb part and Z drive rod set (309) 2 to 3
Micron interference fit；The Z drives rod set to be fixed on mask connecting plate (311), and rolling guide (310) is mounted on guide rail peace
It fills on seat (102), upper mask connecting plate (311) is mounted on rolling guide (310), and mask connects in rolling guide (310) conduct
The guiding that fishplate bar (311) moves up and down；The upper mask holder (312) is fixed on by upper mask holder locking handwheel (313) and is covered
On mould connecting plate (311), upper mask holder gas nozzle (314) is mounted on the side end face of mask holder (312), is used for upper mask holder
(312) with the connection of vacuum source；Optoelectronic switch (316) is fixed on guide rail peace with optoelectronic switch (318) under Z-direction in the Z-direction
It fills on seat (102), for the limit up and down of upper mask connecting plate (311) Z-direction movement, Z-direction optoelectronic switch baffle (317) is fixed on
The side of upper mask connecting plate (311).
2. a kind of dual surface lithography work stage based on dual masks alignment according to claim 1, it is characterised in that: the workpiece
Platform is in use, lower mask plate (217) vacuum suction is on lower mask holder (216), and upper mask plate (315) vacuum suction is in upper mask
On frame (312), mask plate (315) declines up to contacting with lower mask plate (217) in upper mask elevating mechanism (300) drive, this
When on while mask plate (217) continues decline in mask elevating mechanism (300) drive, in lower mask levelling mechanism (200)
Input barotropic gas in ball bowl (212), hemisphere (213) ball bowl (212) interior air bearing under realizing mask plate (217) with above cover
The leveling of template (315), and cylinder (202) is supported to move downward, lower end support cylindrical spring (203) starts to compress, directly
Leveling optoelectronic switch baffle (221) is sensed to leveling optoelectronic switch (220), and upper mask elevating mechanism (300) stops decline fortune
It is dynamic, input negative-pressure gas in ball bowl (212) at this time, hemisphere (213) is in ball bowl (212) internal locking, while locking cylinder seat (201)
Interior input barotropic gas pushes piston (206) movement to lock to support cylinder (202)；Upper mask elevating mechanism
(300) mask plate (315) moves upwards a distance L in drive, is placed on lower mask plate after upper mask plate (315) is removed
(217) on, the position that mask plate (315) descends mask plate (217) relatively is manually adjusted, in video image to the visual field of Barebone
The interior label by two mask plates is aligned, and the vacuum in substrate vacuum gas nozzle (218) is opened after alignment, under this vacuum passes through
Two apertures on mask holder (216), lower mask plate (217) can achieve lower mask plate (217) upper surface, by upper mask plate
(315) it is attached together with lower mask plate (217)；In upper mask elevating mechanism (300) drive mask holder (312) move downward away from
It is contacted from L with upper mask plate (315), the vacuum in closing substrate vacuum gas nozzle (218), mask holder gas nozzle (314) in opening, this
When on mask plate (315) vacuum suction on upper mask holder (312), mask plate (315) in upper mask elevating mechanism (300) drive
A distance L is moved upwards, the alignment of mask plate (315) and lower mask plate (217) label in the above completion.
3. a kind of dual surface lithography work stage based on dual masks alignment according to claim 1 or 2, it is characterised in that: should
Work stage and double-exposure head form double face photoetching machine to Barebone, and two-sided single exposure can be carried out to substrate and two-sided is covered simultaneously
It carves；When two-sided single exposure, after completing mask plate alignment, substrate, upper mask elevating mechanism are placed on lower mask plate (217)
(300) mask plate (315) moves downward until contact with substrate upper surface in drive, it is subsequent can carry out substrate it is two-sided simultaneously
Exposing operation；When two-sided while alignment, after completing mask plate alignment, substrate is placed on lower mask plate (217), is manually adjusted
Label on substrate is aligned by the position of substrate with the label on lower mask plate (217), and substrate vacuum gas is opened after alignment
Vacuum in mouth (218), this vacuum be can achieve down by two apertures on lower mask holder (216), lower mask plate (217) and covered
Substrate, is adsorbed on the upper surface of lower mask plate (217) by template (217) upper surface, and upper mask elevating mechanism (300) drive at this time
Upper mask plate (315) moves downward up to contacting with substrate upper surface, the subsequent two-sided while exposing operation that can carry out substrate,
Complete two-sided while alignment.
4. a kind of dual surface lithography work stage based on dual masks alignment according to claim 1 or 2, it is characterised in that: should
Work stage and double-exposure head form double face photoetching machine to Barebone, and two-sided single exposure can be carried out to substrate and two-sided is covered simultaneously
It carves.
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1094827A (en) * | 1993-05-05 | 1994-11-09 | 哈尔滨工业大学 | Two-sided to the version exposure machine |
| US7425238B2 (en) * | 2002-10-16 | 2008-09-16 | Canon Kabushiki Kaisha | Substrate holding device |
| CN204145893U (en) * | 2014-09-15 | 2015-02-04 | 中国电子科技集团公司第二十九研究所 | A kind of exposure positioning device for printed board |
| CN204178122U (en) * | 2014-08-22 | 2015-02-25 | 深圳市大川光电设备有限公司 | Be applicable to the film and the workpiece adherence device of image transfer exposure machine |
| CN106371292A (en) * | 2016-09-18 | 2017-02-01 | 中国科学院光电技术研究所 | Double-side photoetching workpiece table |
| CN107561748A (en) * | 2017-11-01 | 2018-01-09 | 深圳宇顺电子股份有限公司 | A kind of method for preventing transparent conductive glass fitting off normal |
| CN107761051A (en) * | 2017-11-14 | 2018-03-06 | 合肥鑫晟光电科技有限公司 | A kind of mask, mask evaporation component and evaporation coating device |
| CN108303857A (en) * | 2018-01-25 | 2018-07-20 | 北京控制工程研究所 | A kind of method, system and storage medium improving dual surface lithography consistency |
-
2019
- 2019-05-17 CN CN201910411096.3A patent/CN110045583A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1094827A (en) * | 1993-05-05 | 1994-11-09 | 哈尔滨工业大学 | Two-sided to the version exposure machine |
| US7425238B2 (en) * | 2002-10-16 | 2008-09-16 | Canon Kabushiki Kaisha | Substrate holding device |
| CN204178122U (en) * | 2014-08-22 | 2015-02-25 | 深圳市大川光电设备有限公司 | Be applicable to the film and the workpiece adherence device of image transfer exposure machine |
| CN204145893U (en) * | 2014-09-15 | 2015-02-04 | 中国电子科技集团公司第二十九研究所 | A kind of exposure positioning device for printed board |
| CN106371292A (en) * | 2016-09-18 | 2017-02-01 | 中国科学院光电技术研究所 | Double-side photoetching workpiece table |
| CN107561748A (en) * | 2017-11-01 | 2018-01-09 | 深圳宇顺电子股份有限公司 | A kind of method for preventing transparent conductive glass fitting off normal |
| CN107761051A (en) * | 2017-11-14 | 2018-03-06 | 合肥鑫晟光电科技有限公司 | A kind of mask, mask evaporation component and evaporation coating device |
| CN108303857A (en) * | 2018-01-25 | 2018-07-20 | 北京控制工程研究所 | A kind of method, system and storage medium improving dual surface lithography consistency |
Non-Patent Citations (1)
| Title |
|---|
| 高仰月: ""几种双面对准原理的分析与比较"", 《电子工业专用设备》 * |
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