CN110031887A - Beam spot caliberating device and method - Google Patents

Beam spot caliberating device and method Download PDF

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Publication number
CN110031887A
CN110031887A CN201910359073.2A CN201910359073A CN110031887A CN 110031887 A CN110031887 A CN 110031887A CN 201910359073 A CN201910359073 A CN 201910359073A CN 110031887 A CN110031887 A CN 110031887A
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China
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signal
state matrix
beam spot
electron beam
scaling board
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CN201910359073.2A
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CN110031887B (en
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林峰
赵德陈
张磊
郭超
马旭龙
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Tianjin Qingyan Zhishu Technology Co Ltd
Tsinghua University
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Tianjin Qingyan Zhishu Technology Co Ltd
Tsinghua University
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/29Measurement performed on radiation beams, e.g. position or section of the beam; Measurement of spatial distribution of radiation

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
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  • Spectroscopy & Molecular Physics (AREA)
  • Electron Sources, Ion Sources (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

The application proposes that a kind of beam spot caliberating device and method, device include: electron beam generating apparatus, signal pickup assembly, scaling board, vacuum chamber and computer equipment.Structure of the device based on computer equipment and signal pickup assembly, controlling electron beam generating apparatus by computer equipment generates and drives electron beam to scan scaling board generation process signal according to desired guiding trajectory, utilize the real-time collection process signal of signal pickup assembly, process signal is handled using computer equipment, determine electron-beam position deviation, beam spot circularity and beam spot size, according to position deviation, beam spot circularity and beam spot size, adjust the location status matrix of electron beam generating apparatus, astigmatism state matrix and focus state matrix, with it is traditional based on visually observe and calibration mode based on imaging compared with, the influence of pattern distortion caused by avoiding because of visual angle inclination, high reliablity and precision with higher, calibration efficiency greatly improved simultaneously.

Description

Beam spot caliberating device and method
Technical field
This application involves electron beam process field more particularly to a kind of beam spot caliberating device and methods.
Background technique
Using electron beam as the electron beam increases material manufacturing technology of high energy heat source, is greatly paid close attention to and developed in recent years, but It is forming accuracy is an important factor for limiting its development always.The precision and quality of electron beam qualitative effects forming, for electronics Beam increasing material manufacturing technique it is significant.
Currently, mainly having the calibration mode based on macroscopic mode and based on imaging to the scaling method of electron beam. But both scaling methods are easy to be influenced by visual angle, so that calibrated error is larger, additionally, there may be reliability deficiency, mark The problem of determining low efficiency.
Summary of the invention
The application proposes a kind of beam spot caliberating device and method, can for solving that scaling method in the related technology exists By the problem of property is insufficient, stated accuracy is low, calibration low efficiency.
The application one side embodiment proposes a kind of beam spot caliberating device, comprising: electron beam generating apparatus, signal Acquisition device, scaling board, vacuum chamber and computer equipment;
The electron beam generating apparatus, for generating electron beam and controlling astigmatism, focusing and the deflection of the electron beam;
The computer, for controlling the electron beam generating apparatus generation and driving the electron beam according to desired guiding trajectory It scans the scaling board and generates process signal, the process signal is generated during scaling board described in the electronics beam scanning Signal;
The signal pickup assembly, for acquiring the process signal, including signal transducer, the sensing in real time Device acquires the process signal;Signal amplifier, the signal amplifier connect the signal transducer, are used for amplified signal; AD capture card, the AD capture card connection signal amplifier collection process signal.
The computer is also used to calculate position deviation, the beam spot circle of electron beam at calibration point according to the process signal Degree and beam spot size, and according to the position deviation, beam spot circularity and beam spot size, adjust the position of the electron beam generating apparatus Set state matrix, astigmatism state matrix and focus state matrix.
The beam spot caliberating device of the embodiment of the present application, the structure based on computer equipment and signal pickup assembly are led to Computer equipment control electron beam generating apparatus is crossed to generate and electron beam is driven to generate process according to desired guiding trajectory scanning scaling board Signal, and the real-time collection process signal of signal pickup assembly is utilized, process signal is handled using computer equipment, is determined Electron-beam position deviation, beam spot circularity and beam spot size adjust position shape according to position deviation, beam spot circularity and beam spot size State matrix, astigmatism state matrix and focus state matrix, with traditional calibration mode phase based on visually observing and based on imaging Than avoiding the influence of pattern distortion caused by tilting because of visual angle, high reliablity and precision with higher greatly improved simultaneously Beam spot demarcates speed.
In a kind of possible implementation of the application one side embodiment, the process signal be secondary electron signal, Backscattered electron signal or x-ray signal.Accordingly, the signal transducer is secondary electron sensor, backscattered electron biography Sensor or x-ray sensor.
In a kind of possible implementation of the application one side embodiment, the signal transducer is secondary electron sensing Device, and the material of the secondary electron detector is conductive material.
In a kind of possible implementation of the embodiment of the present application, the scaling board is one flat plate, has at least one Calibration point, and the feature of the calibration point is made of geometry or materials variances.
In a kind of possible implementation of the application one side embodiment, there is M × M array mark on the scaling board Pinpoint feature, wherein M is positive integer.
In a kind of possible implementation of the application one side embodiment, the scaling board is special with array cross recess The metal plate of sign, and the width of four conduits is equal, adjacent cross groove center is equidistant.
The application another aspect embodiment proposes a kind of beam spot scaling method, is applied to beam spot calibration dress It sets, described device includes: electron beam generating apparatus, signal pickup assembly, scaling board, vacuum chamber and computer equipment, comprising:
The computer equipment generates electron beam generating apparatus and controls number according to current calibration state matrix and desired guiding trajectory According to, and control electron beam generating apparatus and electron beam is driven to scan the scaling board, the current calibration state according to desired guiding trajectory Matrix refers to the location status matrix at current time, astigmatism state matrix and focus state matrix;
The signal pickup assembly is during electronics beam scanning scaling board, real-time collection process signal, the process Signal is the signal generated during scaling board described in the electronics beam scanning;
The computer equipment calculates position deviation, the beam spot circularity of electron beam at calibration point according to the process signal And beam spot size, and according to the position deviation, beam spot circularity and beam spot size, adjust location status matrix, astigmatism state square Battle array and focus state matrix.
The beam spot scaling method of the embodiment of the present application controls electron beam generating apparatus by computer equipment and drives electricity Beamlet generates process signal according to desired guiding trajectory scanning scaling board, and utilizes the real-time collection process signal of signal pickup assembly, benefit Process signal is handled with computer equipment, the position deviation, beam spot circularity and beam spot size of electron beam are determined, according to position Deviation, beam spot circularity and beam spot size are set, adjustment location status matrix, astigmatism state matrix and focus state matrix realize To the Accurate Calibration of beam spot, with it is traditional based on visually observe and calibration mode based on imaging compared with, avoid because of visual angle The influence of pattern distortion caused by tilting, high reliablity and precision with higher, while beam spot calibration greatly improved Speed.
In a kind of possible implementation of the application another aspect embodiment, the adjustment location status matrix, astigmatism State matrix and focus state matrix, comprising:
After single pass-collection process, position state matrix, astigmatism state matrix and focus state matrix are all carried out Adjustment;
Until position deviation, beam spot circularity and beam spot size are all satisfied condition at calibration point, without adjusting the position shape When state matrix, the astigmatism state matrix and the focus state matrix, stop scanning-acquisition.
In a kind of possible implementation of the application another aspect embodiment, the adjustment location status matrix, astigmatism State matrix and focus state matrix, comprising:
After single pass-collection process, to the location status matrix, the astigmatism state matrix and the focus state A state matrix is adjusted in matrix;
After the state matrix that first adjusts meets condition, calibration point is scanned again-is acquired, and from remaining two One is arbitrarily selected to be adjusted in a unadjusted state matrix, after the state matrix that second adjusts meets condition, after It is continuous that a remaining state matrix is adjusted.
In a kind of possible implementation of the application another aspect embodiment, one by one to the calibration point on the scaling board Calibration, or to the scaling board single pass after, to all calibration points simultaneously demarcate.
The additional aspect of the application and advantage will be set forth in part in the description, and will partially become from the following description It obtains obviously, or recognized by the practice of the application.
Detailed description of the invention
The application is above-mentioned and/or additional aspect and advantage will become from the following description of the accompanying drawings of embodiments Obviously and it is readily appreciated that, in which:
Fig. 1 is a kind of structural schematic diagram of beam spot caliberating device provided by the embodiments of the present application;
The schematic diagram for the array cross recess scaling board that Fig. 2 is provided by the embodiments of the present application a kind of 7 × 7;
Fig. 3 is a kind of flow diagram of beam spot scaling method provided by the embodiments of the present application;
Fig. 4 is a kind of schematic diagram of desired guiding trajectory for scanning cross recess calibration point provided by the embodiments of the present application;
Secondary current signal when Fig. 5 is a kind of scanning cross recess calibration point four edges line provided by the embodiments of the present application shows It is intended to;
Fig. 6 is a kind of flow diagram of the scaling method based on parallel way provided by the embodiments of the present application;
Fig. 7 is a kind of flow diagram of the scaling method based on series system provided by the embodiments of the present application.
Specific embodiment
Embodiments herein is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached The embodiment of figure description is exemplary, it is intended to for explaining the application, and should not be understood as the limitation to the application.
Below with reference to the accompanying drawings the beam spot caliberating device and method of the embodiment of the present application are described.
Fig. 1 is a kind of schematic diagram of beam spot caliberating device provided by the embodiments of the present application.
As shown in Figure 1, the beam spot caliberating device includes: electron beam generating apparatus 1, signal pickup assembly 2, scaling board 3, vacuum chamber 5 and computer equipment 6.
Wherein, electron beam generating apparatus 1 is used to generate electron beam 4 and control astigmatism, focusing and the deflection of electron beam 4, In, the acceleration voltage of electron beam generating apparatus 1 can be 60kV, power 0-10kW.
Electron beam generating apparatus 1 includes astigmatism coil 11, focus coil 12 and deflection coil 13, controls electron beam 4 respectively Astigmatism, focusing and deflection.Also, electron beam 4 is used in the vacuum chamber 5 formed under the action of pump, valve.
Computer equipment 6 controls electron beam generating apparatus 1 and generates electron beam 4, and controls electron beam generating apparatus 1 and drive electricity Beamlet 4 generates process signal according to desired guiding trajectory scanning scaling board 3.Wherein, process signal is that electron beam 4 scans scaling board 3 The signal generated in the process, such as secondary electron signal, backscattered electron signal and x-ray signal.
Scaling board 3 is located in vacuum chamber, has and can result in structure or material characteristics that process signal generates variation.
The real-time collection process signal of signal pickup assembly 2, and the process signal of acquisition is sent to computer equipment 6.This In embodiment, signal pickup assembly 2 includes signal transducer 21, signal amplifier 22 and AD capture card 23.Wherein, sensing Device 21 is placed in vacuum chamber, the process signal of acquisition electron beam 4 and the effect generation of scaling board 3, such as secondary electron signal, back dissipate Radio or x-ray signal etc.;Signal amplifier 22 is connect with signal transducer 21, is used for amplification process signal;AD capture card 23 connect with signal amplifier 22, further for computer equipment 6 for amplified process signal to be converted to digital signal Processing.
Signal transducer 21 can be secondary electron sensor or backscattered electron sensor or x-ray sensor.That , for different process signals, different types of sensor can be selected, such as acquires secondary electricity using secondary electron sensor Subsignal;Backscattered electron signal is acquired using backscattered electron sensor;X-ray signal is acquired using x-ray sensor.
Computer equipment 6 handles process signal, calculate the position deviation of electron beam at calibration point, beam spot circularity and Beam spot size.Meanwhile computer equipment 6 is by adjusting the parameter of electron beam generating apparatus 1, with adjust beam spot size, Circularity and the position on scaling board 3, and then position state matrix, focus state matrix, astigmatism state matrix are marked It is fixed.
Wherein, location status matrix is made of the corresponding location parameter of calibration point each on scaling board, focus state matrix It is made of the corresponding focusing parameter of calibration point each on scaling board, astigmatism state matrix is corresponding by calibration point each on scaling board Astigmatism parameter composition.
In one embodiment of the application, signal transducer 21 is secondary electron sensor, and secondary electron sensor Material be conductive material, such as brass, the face of secondary electron sensor can be smooth, be also possible to out-of-flatness, this Application is not construed as limiting this.
In one embodiment of the application, scaling board 3 is one flat plate, has at least one calibration point, and calibration point With specific structure or material characteristics, these features cause the process signal in electron beam scanning process to generate apparent become Change.Generally, the feature of calibration point is made of geometry or material property difference etc..When electron beam 4 is swept along desired guiding trajectory Apparent signal difference can be generated when retouching calibration point, computer equipment 6 handles process signal, determines beam spot Size and focus state.
Specifically, the purpose of scaling board 3 is to generate the difference of transducing signal, and then pass through 6 operation of computer equipment Obtain the state value of electron beam, such as size, circularity, focus state.Therefore, should have on scaling board 3 due to geometry Or the obvious spy of the compositions such as material property difference.Such as cross recess, field word slot, circle hole groove geometry;Or by dissimilar material Cross characteristics, field word feature, circle hole groove, heterogeneous circular feature of construction etc..That is, calibration point is considered as by geometry spy Sign is constituted, and is also considered as the feature being made up of material property difference, increases coating/coating such as on metal plate.
In order to which accurate calibration shapes coordinate origin, in one embodiment of the application, the calibration point on scaling board 3 is M* M array, wherein M is positive integer.For example, calibration lattice array is the square matrix with odd-numbered line and odd column, then on scaling board The center point coordinate (0,0) of heart calibration point can be used as forming coordinate origin.If demarcating lattice array is with even number line and even column Square matrix, then the center of all calibration points of scaling board can be used as forming coordinate origin.
In one embodiment of the application, scaling board 3 is a metal plate, has array cross cavity feature, and four The width of a conduit keeps equal, and adjacent cross groove center is equidistant, the corresponding calibration point of each cross groove center.Its In, the width of four conduits can be denoted as w, and the distance of adjacent cross groove center is denoted as L.
If the line number and columns of cross recess character array be odd number be denoted as M, M=2k+1 respectively, k is natural number, will in Crux of heart slot is denoted as (0,0), and array cross recess can be denoted as (i, j), i, j=0, ± 1, ± 2 ..., ± k.
The schematic diagram for the array cross recess scaling board that Fig. 2 is provided by the embodiments of the present application a kind of 7 × 7.Assuming that centre ten The centre coordinate of word slot is (0,0), and the distance between adjacent cross groove center is L, then can the centre coordinate of intermediate cross recess be Origin establishes rectangular coordinate system, and array cross recess can be denoted as (i, j), i, j=0, and ± 1, ± 2, ± 3, according to cross on scaling board The absolute coordinate that each cross groove center is calculated in separation is (iL, jL).
In order to realize above-described embodiment, the embodiment of the present application also proposes a kind of beam spot scaling method.Fig. 3 is the application A kind of flow diagram for beam spot scaling method that embodiment provides.
The beam spot scaling method of the embodiment of the present application can be applied to above-mentioned beam spot caliberating device, the device packet Electron beam generating apparatus, signal pickup assembly, scaling board, vacuum chamber and computer equipment are included, beam spot is carried out with realizing Calibration.
As shown in figure 3, the beam spot scaling method includes:
Step 301, computer equipment generates electron beam generating apparatus control according to current calibration state matrix and desired guiding trajectory Data processed, and control electron beam generating apparatus and electron beam is driven to scan scaling board according to desired guiding trajectory.
In the present embodiment, scaling board is located in vacuum chamber, has and can result in structure or material that process signal generates variation Expect feature.Computer equipment generates electron beam generating apparatus and controls data according to current calibration state matrix and desired guiding trajectory, and Data control electron beam generating apparatus, which is controlled, according to electron beam generating apparatus generates electron beam, and control electron beam generating apparatus Electron beam is driven to scan scaling board according to desired guiding trajectory.
In the desired guiding trajectory for determining calibration point, it can generate according to the true coordinate of current calibration point and surround the central point The track of rectangular scanning, the track are closed square sideline, and square side length is l, and four scan lines are sat with forming respectively The x-axis for marking system is parallel with y-axis direction.
For example, scaling board is the metal plate with array cross cavity feature, and the width of four conduits is equal, adjacent ten Word groove center is equidistant, and the corresponding calibration point of each cross groove center, desired guiding trajectory is as shown in figure 4, around current mark It pinpoints cross groove center and is respectively perpendicular to four conduits, and the four edges line length of the desired guiding trajectory is equal.
In the present embodiment, the current location status matrix demarcated state matrix and refer to current time, astigmatism state matrix and poly- Burnt state matrix.If it is first scan, then currently calibration state matrix can be the calibration state matrix of default.
It-acquires-and adjusts, computer equipment is demarcated according on scaling board if being scanned one by one to the calibration point on scaling board The geometric dimension of point, determines the centre coordinate of current calibration point, calculates scanning element coordinate according to centre coordinate and the length of scanning line, There can be multiple scanning elements in every scan line, by scanning point set coordinate by currently demarcating state matrix, be converted into electron beam The control data of generating device, wherein calibration state matrix includes: location status matrix, focus state matrix and astigmatism state Matrix.
With scaling board for the metal plate with array cross cavity feature, and the width of four conduits is equal, adjacent cross Groove center is equidistant, and for the corresponding calibration point of each cross groove center, is illustrated.
Specifically, the centre coordinate of calibration point cross recess can be determined according to the geometric dimension of array cross recess on scaling board, Scanning element coordinate is calculated according to centre coordinate and the length of scanning line, scanning point set coordinate is passed through into currently calibration state matrix conversion Data are controlled for electron beam generating apparatus.
Step 302, signal pickup assembly is during electronics beam scanning scaling board, real-time collection process signal.
In the embodiment of the present application, during electron beam is according to calibration point on desired guiding trajectory scanning scaling board, signal is adopted Acquisition means can collection process signal in real time, and send the process signal of acquisition to computer equipment.
Signal pickup assembly may include signal transducer, signal amplifier and AD capture card, specific collection process signal Process, reference can be made to above-described embodiment, details are not described herein.
Signal transducer can be secondary electron sensor or backscattered electron sensor or x-ray sensor.So, For different process signals, different types of sensor can be selected, such as acquires secondary electron using secondary electron sensor Signal;Backscattered electron signal is acquired using backscattered electron sensor;X-ray signal is acquired using x-ray sensor.
For example, signal transducer is secondary electron sensor, and the material of secondary electron sensor is conductive material, such as yellow Copper etc., the face of secondary electron sensor can be smooth, be also possible to out-of-flatness.
It is understood that one-off scanning is carried out if it is to scaling board, then signal pickup assembly can be acquired to every The process signal that a calibration point generates when being scanned, computer equipment store the corresponding process signal of each calibration point.
Step 303, computer equipment calculates position deviation, the beam spot circularity of electron beam at calibration point according to process signal And beam spot size, and according to position deviation, beam spot circularity and beam spot size, adjust location status matrix, astigmatism state matrix and Focus state matrix.
Wherein, beam spot circularity is used to characterize beam spot shape, and circularity can pass through length-width ratio, or oval eccentricity etc. To indicate;Beam spot size refers to beam spot size, can be indicated by equivalent diameter or ellipse area.
For indicating that beam spot circularity, equivalent diameter indicate beam spot size with length-width ratio, illustrate to calculate current calibration position Set place electron-beam position deviation, the method for beam spot circularity and beam spot size.
Firstly, extracting secondary current signal when scanning current calibration point four edges line.Specifically, according to electron beam The defection signal of electron beam is converted coordinate data by the corresponding relationship of defection signal and true coordinate.For current calibration point, Secondary current signal segment when four edges line shown in scanning figure 4 is extracted respectively.As shown in figure 5, the secondary current signal packet Containing four end to end scan-line datas, a trough is separately included in each scan line, corresponding to narrow in scan line Slot.
It should be noted that if one-off scanning is carried out to the calibration point on scaling board, then having to scaling board more The scanning of a calibration point is that sequence is completed, it is therefore desirable to extract the corresponding process signal of each calibration point, count respectively Calculate the beam spot state of different calibration points.That is, if one-off scanning is carried out to the calibration point on scaling board, then needing Accurately to divide the corresponding secondary current signal segment of different calibration points.
After extracting secondary current signal when scanning current calibration point four edges line, actual scan line center and reason are calculated Think the deviation δ of center in the x and y directionx、δy, i.e. the central point of calculating square center point and current calibration point is in the direction x and y On deviation, and calculating position deviation
Specifically, counting secondary current signal starting point and the scan line trough center in each scan line respectively Point sequence difference, such as scan line P1P2Upper corresponding sequence difference ni3-ni1, calculate actual scan line center and desired center x and y Deviation on direction.With first scan-line data P1P2For, in the present embodiment by the way of spot scan, adjacent scanning element The distance between be denoted as d, groove width w then has P1The distance between point and y-axis x1=(ni3-ni1) d, then by P1P2Scan data When can obtain along the forward scan of the direction xBy P3P4When scan data can be obtained along the reverse scan of the direction xThe deviation that synthesis can obtain on the direction x isThe deviation on the direction y can similarly be obtained δy, and calculating position deviation
Calculate diameter D when electron beam is scanned along the direction x forward and reversex+、Dx-And along the direction y forward and reverse Diameter D when scanningy+、Dy-, and be averaged to obtain the diameter in the direction xWith the diameter along the direction y
Specifically, calculating separately the width of trough on four scanning-line signals first.When actually calculating, secondary current The simultaneously out-of-flatness of the upper reference line of signal, the confidence interval line and trough for generalling use 5% ask friendship, using the abscissa of intersection point as n12 And n14Value.Theoretically the trough width in secondary current signal is equal to the sum of groove width w and beam diameter D.According to practical groove width W obtains the diameter D that electron beam is scanned along the direction x forward and reverse respectivelyx+、Dx-And along the direction y forward and reverse Diameter Dy+、Dy-, such as along x forward scan when diameter be Dx+=(n14-n12)d-w.To when being scanned back and forth on the direction x Diameter is averaged to obtain the diameter in the direction xThe similarly available diameter D along the direction yy
Thus, it is possible to calculate beam spot circularityWith the equivalent diameter of electron beam
It is possible to calculate the position deviation of electron beam at each calibration point, beam spot circularity and beam spot size.According to mark The position deviation of electron beam, beam spot circularity and beam spot size at fixed point, adjustment location status matrix, astigmatism state matrix and focusing The corresponding parameter of calibration point in state matrix.During the calibration process, location parameter can be first adjusted, then is sequentially adjusted in focusing parameter With astigmatism parameter.
Specifically, judging whether the position deviation of electron beam is less than preset value.If the position deviation of electron beam is less than Preset value does not need the corresponding location parameter of the calibration point in adjustment location status matrix then;Otherwise, it is updated according to position deviation The corresponding location parameter of the calibration point in location status matrix.
Judge whether within a preset range beam spot circularity at current calibration point, if beam spot circularity is in preset range It is interior, then the corresponding astigmatism parameter of the calibration point in astigmatism state matrix is not adjusted;Otherwise, astigmatism state is adjusted according to circularity state The corresponding astigmatism parameter of the calibration point in matrix.
If indicating beam spot size with equivalent diameter, judge whether the equivalent diameter of beam spot is less than preset value, or with Whether the absolute value that preceding single pass-collection process calculates the difference of gained equivalent diameter is less than preset value.If it is, uncomfortable The corresponding focusing parameter of the calibration point in whole focus state matrix;Otherwise, gained is calculated according to preceding single pass-collection process The corresponding focusing parameter of the calibration point in the difference adjustment focus state matrix of equivalent diameter.
In the embodiment of the present application, the process signal acquired by information collecting device can calculate electron beam at calibration Position deviation, beam spot circularity and beam spot size;It is to observe by the naked eye beam spot position, base based on macroscopic mode It is that beam spot position is shot by camera in the scaling method of imaging, both modes are easy to be influenced by visual angle, such as by In there are visual angle inclinations will lead to pattern distortion, so that it is slow to will affect stated accuracy, calibration speed.And the calibration side of the present embodiment Method is based on information collecting device collection process signal, and there is no visual angle tilt problems, because without by pattern distortion Influence, and spatial resolution by the point of electron beam away from determining, can achieve very high stated accuracy, furthermore have quickly, conveniently, can By the advantages of.
In one embodiment of the application, during the calibration process, the calibration point on scaling board can be demarcated one by one, Scan data can be generated after disposable completion is to the scanning of whole calibration points for whole calibration points to click through all calibration Rower is fixed.
It in practical applications, can be simultaneously to position state matrix, astigmatism state matrix after single pass-collection process Parameter corresponding with calibration point in focus state matrix is adjusted, can also only to position state matrix, astigmatism state matrix and In focus state matrix, the corresponding parameter of calibration point is adjusted in one of state matrix, to completed one by one to three The adjustment of state matrix.In other words, we can both use the scaling method based on parallel way, can also be used based on tandem Scaling method.
Below for disposably demarcating all calibration points, the scaling method based on parallel way is described in conjunction with Fig. 6.Fig. 6 For a kind of flow diagram of the scaling method based on parallel way provided by the embodiments of the present application.
As shown in fig. 6, the scaling method based on parallel way includes:
Step 601, computer equipment generates electron beam generating apparatus according to current calibration state matrix and desired guiding trajectory Data are controlled, and controls electron beam generating apparatus and electron beam is driven to be scanned according to desired guiding trajectory to scaling board.
The method of the specific control data for generating electron beam generating apparatus can be found in the method recorded in above-mentioned steps 301, Details are not described herein.
Step 602, during electronics beam scanning scaling board, the real-time collection process signal of signal pickup assembly.
Step 603, computer equipment calculates the position deviation, beam spot of electron beam at each calibration point according to process signal Circularity and beam spot size, and according to position deviation, beam spot circularity and beam spot size, adjust location status matrix, astigmatism state square Battle array parameter corresponding with calibration point corresponding in focus state matrix.
In the present embodiment, after to current calibration point single pass-acquisition, the position of electron beam at each calibration point is calculated Then deviation, beam spot circularity and beam spot size judge whether to need according to position deviation, beam spot circularity and beam spot size respectively Parameter corresponding to calibration point each in position state matrix, astigmatism state matrix and focus state matrix these three state matrixes It is adjusted.
Specifically, judging whether the position deviation of electron beam at each calibration point is less than preset value.If each calibration The position deviation of point place electron beam is respectively less than preset value, then does not need to adjust the corresponding position of each calibration point in location status matrix Set parameter;It is greater than or equal to preset value if there is the position deviation of electron beam at calibration point, then according to electronics at the calibration point Beam position deviation updates the corresponding location parameter of the calibration point in location status matrix.
Judge whether within a preset range beam spot circularity at each calibration point, if beam spot circularity exists at each calibration point In preset range, then the corresponding astigmatism parameter of each calibration point in astigmatism state matrix is not adjusted;If there is its position of calibration point Set the beam spot circularity at place not within a preset range, then according to calibration in circularity state adjustment astigmatism state matrix at the calibration point The corresponding astigmatism parameter of point.
If indicating beam spot size with equivalent diameter, judge whether the equivalent diameter of beam spot at each calibration point is less than Whether preset value, or the absolute value for calculating the difference of gained equivalent diameter with preceding single pass-collection process are less than preset value.Such as The equivalent diameter of beam spot is respectively less than preset threshold at each calibration point of fruit, or calculates with preceding single pass-collection process The absolute value of the difference of gained equivalent diameter is respectively less than preset value, then it is corresponding not adjust each calibration point in focus state matrix Focusing parameter;If there is the beam spot at its position of calibration point equivalent diameter be greater than or equal to preset threshold, or with it is preceding The absolute value that single pass-collection process calculates the difference of gained equivalent diameter is all larger than or is equal to preset value, then according to it is preceding Single pass-collection process calculates the corresponding focusing ginseng of the calibration point in the difference adjustment focus state matrix of gained equivalent diameter Number.
Step 604, it repeats the above steps, until position deviation, beam spot circularity and beam spot size meet condition without adjustment Location status matrix, astigmatism state matrix and focus state matrix.
In the present embodiment, after carrying out single pass-acquisition-adjustment to whole calibration points, if at any calibration point It is any in the position deviation of electron beam, beam spot circularity and beam spot size to be unsatisfactory for condition, then continue scanning-acquisition, continues State matrix is adjusted, until the position deviation of the electron beam at whole calibration points, beam spot circularity and beam spot size are full When sufficient condition, stop scanning-collection process.
That is, position deviation, beam spot circularity and the beam spot size of electron beam are all satisfied requirement at whole calibration points, Then terminate the adjustment to position state matrix, astigmatism state matrix and focus state matrix.
It is worth noting that the parameter of the different location in the corresponding calibration state matrix of different calibration points, each other It is independent, therefore calibration can be executed to each calibration point respectively according to above-mentioned steps 601- step 604, it is demarcated to a calibration point After the completion, next calibration point is demarcated.It-acquires-and adjusts that is, by being scanned one by one to calibration point, complete to entire The calibration for the control data that beam spot scans at all calibration points on scaling board.
Scaling method based on parallel way, with based on visually observe and calibration mode based on imaging compared with, be not present Visual angle tilt phenomenon, because without being influenced by pattern distortion, and spatial resolution by the point of electron beam away from determining, Ke Yida To very high precision, furthermore have the advantages that quickly, conveniently, reliably.
In one embodiment of the application, after single pass-collection process, to position state matrix, the astigmatism shape The corresponding parameter of calibration point is adjusted in a state matrix in state matrix and focus state matrix.In the shape that first adjusts After state matrix meets condition, calibration point is scanned again-is acquired, and is any from remaining two unadjusted state matrixes Selection one be adjusted, when second adjust state matrix meet condition after, continue to a remaining state matrix into Row adjustment.
Below for demarcate one by one to the calibration point on scaling board, in conjunction with Fig. 7 to the calibration based on series system Method is described.Fig. 7 is a kind of flow diagram of the scaling method based on series system provided by the embodiments of the present application.
As shown in fig. 7, the scaling method based on series system includes:
Step 701, location parameter is demarcated.
Step 702, focusing parameter is demarcated.
Step 703, astigmatism parameter is demarcated.
Wherein, location parameter refers to the corresponding parameter of current calibration point in location status matrix;Focusing parameter refers to focusing The corresponding parameter of current calibration point in state matrix;Astigmatism parameter refers to the corresponding ginseng of current calibration point in astigmatism state matrix Number.
It-acquires-and adjusts if being scanned one by one to the calibration point on scaling board, according to current calibration state matrix and preset Track generates the scan data of electron beam generating apparatus and scans current calibration point, is carrying out single pass-to current calibration point After acquisition, the position deviation of electron beam is calculated according to process signal, if position deviation is greater than or equal to preset threshold, is aligned The corresponding location parameter of current calibration point in state matrix is set to be adjusted.Further according to location status matrix adjusted to current Calibration point is scanned again-acquires, and then according to the process signal of acquisition, judges whether position deviation value meets condition, if Satisfaction then stops adjusting location parameter, continues to be scanned current calibration point-acquisition-adjusting if being unsatisfactory for, until electronics The position deviation of beam meets condition.
After position deviation meets condition, that is, after completing to the calibration of location parameter, further according to current calibration state matrix Electron beam generating apparatus is generated with desired guiding trajectory and controls data, and scans current calibration point.Computer equipment is according to scanning process The process signal of acquisition, calculate electronics equivalent diameter, and judge the equivalent diameter of beam spot whether be less than preset value or with it is preceding Whether the absolute value of the difference of equivalent diameter is less than preset value during single pass-acquisition-adjustment, if it is not, then according to With current calibration point in the difference adjustment focus state matrix of equivalent diameter obtained in preceding single pass-acquisition-adjustment process Corresponding focusing parameter.Then, then to current calibration point it is scanned-acquires, electron beam is calculated according to the process signal of acquisition Spot equivalent diameter, judges whether beam spot equivalent diameter meets condition, stops adjusting focusing parameter if meeting, if being unsatisfactory for Then continue to be scanned current calibration point-acquisition-and adjust, until the beam spot circularity of electron beam meets condition, completes to focusing The calibration of parameter.
After completing the focusing parameter calibration of current calibration point, continue to demarcate the astigmatism parameter of current calibration point, Detailed process is similar to the above, repeats no more.
It is set it is worth noting that the laggard line position of single pass-acquisition can also be executed to all calibration points on scaling board The calibration of parameter, focusing parameter or astigmatism parameter.Specifically, scan data is generated for whole calibration points, it is disposable to complete Scanning to whole calibration points carries out position to each calibration point, focuses then according to the corresponding process signal of each calibration point Or the adjustment of astigmatism parameter.It based on foregoing description, is whether scanned-acquisition-one by one to calibration point and adjusts, or to all Calibration point carries out whole calibration after carrying out one-off scanning, can be by being realized based on concatenated mode.
It should be noted that in the scaling method based on series system, location parameter, astigmatism parameter and focusing parameter mark Fixed sequencing, can be set as needed, and the embodiment of the present application is not construed as limiting this.
The scaling method based on series system of the embodiment of the present application, with the calibration side based on visually observing and based on imaging Formula is compared, the influence of pattern distortion, high reliablity and precision with higher caused by avoiding because of visual angle inclination.
In one embodiment of the application, above-mentioned scaling board is one flat plate, has at least one calibration point, and demarcate Point has specific structure or material characteristics.
Specifically, the purpose of scaling board is to generate the difference of transducing signal, and then obtained by computer equipment operation To the state value of electron beam, such as size, circularity, focus state.Therefore, should have on scaling board due to geometry or material The obvious characteristic of the compositions such as material sex differernce, such as cross recess, field word slot, circle hole groove geometry, or by dissimilar material structure Cross characteristics, field word feature, circle hole groove, heterogeneous circular feature for making etc..That is, calibration point is considered as by geometrical characteristic It constitutes, is also considered as increasing coating/coating such as on metal plate by material property difference constitutive characteristic.
In order to which accurate calibration shapes coordinate origin, in one embodiment of the application, the calibration point on scaling board is M*M Array, wherein M is positive integer.For example, calibration lattice array is the square matrix with odd-numbered line and odd column, then on scaling board The center point coordinate (0,0) of heart calibration point can be used as forming coordinate origin.If demarcating lattice array is with even number line and even column Square matrix, then the center of all calibration points of scaling board can be used as forming coordinate origin.
In one embodiment of the application, above-mentioned scaling board can be a metal plate, have array cross recess special Sign, and the width of four conduits keeps equal, adjacent cross groove center is equidistant, the corresponding mark of each cross groove center Fixed point.Wherein, the width of four conduits can be denoted as w, and the distance of adjacent cross groove center is denoted as L.
If the line number and columns of cross recess character array be odd number be denoted as M, M=2k+1 respectively, k is natural number, will in Crux of heart slot is denoted as (0,0), and array cross recess can be denoted as (i, j), i, j=0, ± 1, ± 2 ..., ± k.

Claims (10)

1. a kind of beam spot caliberating device characterized by comprising electron beam generating apparatus, signal pickup assembly, calibration Plate, vacuum chamber and computer equipment;
The electron beam generating apparatus, for generating electron beam and controlling astigmatism, focusing and the deflection of the electron beam;
The computer equipment, for controlling the electron beam generating apparatus generation and driving the electron beam according to desired guiding trajectory It scans the scaling board and generates process signal, the process signal is generated during scaling board described in the electronics beam scanning Signal;
The scaling board is located in vacuum chamber, has and can result in structure or material characteristics that process signal generates variation;
The signal pickup assembly, for acquiring the process signal, including signal transducer in real time, the signal transducer is adopted Collect the process signal;Signal amplifier, the signal amplifier connect the signal transducer, for amplifying the process letter Number;AD capture card, the AD capture card connect the signal amplifier and acquire amplified process signal;
The computer equipment is also used to calculate position deviation, the beam spot circle of electron beam at calibration point according to the process signal Degree and beam spot size, and according to the position deviation, beam spot circularity and beam spot size, adjust the position of the electron beam generating apparatus Set state matrix, astigmatism state matrix and focus state matrix.
2. device as described in claim 1, which is characterized in that the process signal is secondary electron signal, backscattered electron Signal or x-ray signal.Accordingly, the signal transducer is secondary electron sensor, backscattered electron sensor or x-ray Sensor.
3. device as claimed in claim 2, the signal transducer is secondary electron sensor, and the secondary electron senses The material of device is conductive material.
4. device as described in claim 1, which is characterized in that the scaling board is one flat plate, has at least one calibration Point, and the feature of the calibration point is made of geometry or materials variances.
5. the device as described in claim 1-4, which is characterized in that have M × M array calibration point special on the scaling board Sign, wherein M is positive integer.
6. device as claimed in claim 5, which is characterized in that the scaling board is flat for the metal with array cross cavity feature Plate, and the width of four conduits is equal, adjacent cross groove center is equidistant.
7. a kind of beam spot scaling method, which is characterized in that be applied to beam spot caliberating device, described device includes: electricity Beamlet generating device, signal pickup assembly, scaling board, vacuum chamber and computer equipment, which comprises
The computer equipment generates the electron beam generating apparatus control number according to current calibration state matrix and desired guiding trajectory According to, and control the electron beam generating apparatus and electron beam is driven to scan the scaling board, the current calibration according to desired guiding trajectory State matrix refers to the location status matrix, astigmatism state matrix and focus state matrix at current time;
During signal pickup assembly scaling board described in electronics beam scanning, real-time collection process signal, the process Signal is the signal generated during scaling board described in the electronics beam scanning;
The computer equipment calculates position deviation, beam spot circularity and the beam of electron beam at calibration point according to the process signal Spot size, and according to the position deviation, beam spot circularity and beam spot size, adjust location status matrix, astigmatism state matrix and Focus state matrix.
8. the method for claim 7, which is characterized in that the adjustment location status matrix, astigmatism state matrix and gather Burnt state matrix, comprising:
After single pass-collection process, position state matrix, astigmatism state matrix and focus state matrix are all adjusted It is whole;
Until position deviation, beam spot circularity and beam spot size are all satisfied condition at calibration point, without adjusting the location status square When battle array, the astigmatism state matrix and the focus state matrix, stop scanning-acquisition.
9. method according to claim 8, which is characterized in that the adjustment location status matrix, astigmatism state matrix and poly- Burnt state matrix, comprising:
After single pass-collection process, to the location status matrix, the astigmatism state matrix and the focus state matrix In a state matrix be adjusted;
After the state matrix that first adjusts meets condition, calibration point is scanned again-is acquired, and not from remaining two One is arbitrarily selected in the state matrix of adjustment to be adjusted, and after the state matrix that second adjusts meets condition, is continued pair A remaining state matrix is adjusted.
10. the method as described in claim 7-9 is any, which is characterized in that the calibration point on the scaling board is demarcated one by one, Or to the scaling board single pass after, to all calibration points simultaneously demarcate.
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