CN115609019A - Electron beam calibration device, calibration device and method for metal powder processing - Google Patents
Electron beam calibration device, calibration device and method for metal powder processing Download PDFInfo
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- CN115609019A CN115609019A CN202211610609.1A CN202211610609A CN115609019A CN 115609019 A CN115609019 A CN 115609019A CN 202211610609 A CN202211610609 A CN 202211610609A CN 115609019 A CN115609019 A CN 115609019A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/90—Means for process control, e.g. cameras or sensors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/31—Calibration of process steps or apparatus settings, e.g. before or during manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/36—Process control of energy beam parameters
- B22F10/366—Scanning parameters, e.g. hatch distance or scanning strategy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The invention relates to an electron beam calibration device, a calibration device and a method for metal powder processing, and relates to the technical field of equipment for metal powder processing. The calibration device comprises: the plate body is provided with a plurality of calibration holes; the current collecting device is arranged below the calibration hole and used for collecting current signals generated by the electron beams passing through the calibration hole, the beam spots scan the calibration hole according to a preset track, penetrate through the calibration hole and irradiate on the current collecting device, and the current signals are generated at the current collecting device. The calibration device has simple structure, easy processing and no need of precise manufacturing, and the current acquisition device is used for acquiring current signals passing through the calibration hole and providing accurate data for the calibration of the electron beam. The electron beam calibration method provided by the invention has the advantages that the calibration device which is easy to prepare is adopted to collect the beam spot current signals, the cost is lower, the beam spot can be calibrated by simply analyzing the current change condition, the method is simple and easy to implement, and the precision is higher.
Description
Technical Field
The invention relates to the technical field of equipment for metal powder processing, in particular to an electron beam calibration device, a calibration device and a method for metal powder processing.
Background
The selective electron beam melting is a processing technology which takes a high-energy electron beam as an energy source and forms a three-dimensional metal part by scanning metal powder point by point, lapping line by line and melting, solidifying and accumulating layer by layer in a vacuum environment. In the processing process, a cathode filament of an electron gun is heated by high pressure to enable a large number of electrons to be separated, the electrons which are diffused to the periphery are converged into electron current with small diameter through a focusing coil, then deflection is carried out under the action of a deflection coil magnetic field, and the electron beam is controlled by a deflection signal to complete selective scanning melting under a preset path.
The selective melting of the electron beams has the advantages of high energy utilization rate, no reflection, high power density, high scanning speed, no pollution in a vacuum environment, low residual stress and the like, is particularly suitable for direct forming of active, refractory and brittle metal materials, and has wide application prospects in the fields of aerospace, biomedical treatment, automobiles, molds and the like. The precision of the selective melting and forming of the electron beam is always an important factor for limiting the development of the selective melting and forming electron beam.
The forming precision is the quality of the electron beam, namely the shape, the size and the position accuracy of the lower beam. The beam scan requires a large deflection angle for shaping the edge of the web, which is theoretically unlimited. In practice, the deflection angle of the electron beam is limited by the fact that the additional astigmatism caused by the nonuniformity of the scanning magnetic field is too large, which exceeds the correction capability of the focusing device, and causes the beam spot to become large in size and distorted in shape. The large size of the beam spot can cause processing defects caused by non-concentrated energy, and the shape distortion and the position deviation of the beam spot can cause the reduction of processing precision. Therefore, the beam spot needs to be calibrated and calibrated before processing. According to the shape, size and position of the electron beam at the set position, the deflection and focusing of the electron beam generating device are adjusted to reach a preset state, namely the beam spot is as small and round as possible, and the position deviation meets the requirement.
In the related art, the calibration method for the beam spot mainly includes manual calibration based on visual observation, automatic calibration based on shooting imaging, calibration using secondary electrons generated by a calibration point, and the like.
The calibration method based on the visual observation has insufficient reliability, wastes time and labor; the calibration method based on shooting imaging has the problems that the beam spot information is inaccurate to extract and even difficult to extract due to the fact that a shot image is easy to distort; the calibration method adopting the secondary electrons needs expensive materials such as tungsten wires and the like and calibration points with higher precision, and has high cost, large processing difficulty and complex operation.
Accordingly, there is a need to ameliorate one or more of the problems with the above-mentioned related art solutions.
It is noted that this section is intended to provide a background or context to the embodiments of the disclosure that are recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.
Disclosure of Invention
An object of the present invention is to provide an electron beam calibration apparatus, a calibration apparatus and a method for metal powder processing, which overcome one or more of the problems due to the limitations and disadvantages of the related art, at least to some extent.
A first aspect of the present invention provides an electron beam calibration apparatus for metal powder processing, the calibration apparatus comprising:
the plate comprises a plate body, wherein a plurality of calibration holes are formed in the plate body, and the calibration holes are through holes;
the current acquisition device is arranged below the calibration hole and used for acquiring current signals generated by the electron beams passing through the calibration hole, and the sources of the current signals are as follows: and scanning the calibration hole by the beam spot of the electron beam according to a preset track, penetrating through the calibration hole to irradiate the current acquisition device, and generating the current signal at the current acquisition device.
The calibration device provided by the invention has a simple structure, is easy to process, does not need precise manufacturing, and is used for collecting the current value passing through the calibration hole by using the current collection device, so as to provide accurate data for the calibration of the beam spot of the electron beam and provide a reliable data source for calibration work.
Preferably, the current collecting device is an annular hall current sensor.
Preferably, the plate body is a metal plate.
Preferably, the diameter of the calibration hole is smaller than the diameter of the beam spot.
A second aspect of the present invention provides an electron beam calibration apparatus for metal powder processing, the electron beam calibration apparatus comprising:
the calibration device adopts any one of the calibration devices;
the vacuum chamber is internally provided with a beam spot generated by an electron beam generator and the calibration device;
the signal collector is connected with the current collecting device and is used for collecting the position information of the beam spot of the electron beam on the calibration device and receiving the current signal collected by the current collecting device;
the controller is used for controlling the electron beam generator to scan the calibration hole according to a preset track, and the controller is used for receiving the data sent by the signal collector and carrying out data processing so as to calibrate the electron beam.
The electron beam calibration device adopts the calibration device which is easy to prepare to collect the position information and the current signal of the beam spot, has lower calibration cost, and places the calibration device and the beam spot in the vacuum chamber, thereby being beneficial to maintaining the vacuum degree of equipment and improving the calibration precision.
A third aspect of the present invention provides an electron beam calibration method for metal powder processing, which calibrates an electron beam using the above electron beam calibration apparatus, the electron beam calibration method comprising the steps of:
calibrating the position of the beam spot of the electron beam:
controlling the electron beam to scan the calibration hole of the calibration device along the X-axis direction, recording the position information of the beam spot and the current change condition in the scanning process, and setting the X-axis coordinate corresponding to the position where the current starts to increase as X a The X-axis coordinate corresponding to the position where the current is maximum is defined as X 0 The X-axis coordinate corresponding to the position where the current is reduced to the minimum value is set as X b ；
X is passing through 0 Making a vertical line on the X axis as a Y axis by a corresponding point, controlling the electron beam to scan the calibration hole along the Y axis, recording the position information of the beam spot and the current change condition in the scanning process, and setting the Y axis coordinate corresponding to the position where the current starts to increase as Y a The Y-axis coordinate corresponding to the position where the current is maximum is defined as Y 0 The Y-axis coordinate corresponding to the position where the current is reduced to the minimum value is set as Y b ；
Obtaining the coordinate (x) of the beam spot of the electron beam at the center of the calibration hole 0 ，y 0 ）。
Preferably, the electron beam calibration method further comprises the steps of:
calibrating the roundness of the beam spot of the electron beam:
calibrating the position of the beam spot of the electron beam to obtain the dimension D of the beam spot of the electron beam in the X-axis direction x =|x a -x b I, dimension D in Y-axis direction y =|y a -y b I, the roundness e = D of the beam spot of the electron beam x /D y And comparing the roundness with a preset roundness, and adjusting the parameters of the electron beam generator to enable the roundness to reach the preset roundness.
Preferably, the electron beam calibration method further comprises the steps of:
calibrating the size of the beam spot of the electron beam:
placing a beam spot of the electron beam at (x) 0 ，y 0 ) And at the position, comparing the beam current passing rate with a preset beam current passing rate, and adjusting the parameters of the electron beam generator to enable the beam current passing rate to reach the preset beam current passing rate.
Preferably, the parameters of the electron beam generator are focusing parameters.
Preferably, when the beam spot of the electron beam is calibrated, a hole-by-hole calibration method or a method of calibrating a plurality of calibration holes simultaneously is adopted.
According to the electron beam calibration method, the calibration device which is easy to prepare is adopted to collect the current data of the beam spot, the calibration cost is low, the position of the beam spot can be calibrated by simply analyzing the current change condition, the calibration process is simple and easy to implement, and the precision is high.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It should be apparent that the drawings in the following description are merely examples of the disclosure and that other drawings may be derived by those of ordinary skill in the art without inventive effort.
FIG. 1 is a schematic structural diagram of an electron beam calibration device for metal powder processing according to an embodiment of the present invention;
FIG. 2 illustrates a schematic diagram of the operation of a current collection device in an embodiment of the present invention;
FIG. 3 is a schematic diagram showing the scanning route of the X-axis direction beam spot scanning calibration hole in the embodiment of the invention;
FIG. 4 is a schematic diagram illustrating the current change in the X-axis direction in an embodiment of the present invention;
FIG. 5 is a schematic diagram showing a scanning route of a Y-axis direction beam spot scanning calibration hole in the embodiment of the invention;
fig. 6 is a schematic diagram showing a change in current in the Y-axis direction in the embodiment of the present invention.
Reference numerals:
100. a calibration device; 101. a plate body; 1011. calibrating the hole; 102. and a current collection device.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
An embodiment of the present invention first provides an electron beam calibration apparatus 100 for metal powder processing, as shown in fig. 1, where the calibration apparatus 100 includes: plate body 101 and current collection device 102.
Specifically, a plurality of calibration holes 1011 are formed in the plate body 101, and the calibration holes 1011 are through holes.
The current collecting device 102 is disposed below the calibration hole 1011 and is configured to collect a current signal generated by the electron beam passing through the calibration hole 1011. The sources of the current signals are: the beam spot of the electron beam scans the calibration hole 1011 according to a preset track, and passes through the calibration hole 1011 to irradiate on the current collection device 102, so as to generate the current signal at the current collection device 102.
In this embodiment, the calibration device 100 has a simple structure, is easy to process, does not need precise manufacturing, and acquires the current signal passing through the calibration hole 1011 by using the current acquisition device 102, so as to provide accurate data for the calibration of the beam spot of the electron beam and provide a reliable data source for the calibration work.
Optionally, in some embodiments, as shown in fig. 2, the current collecting device 102 is an annular hall current sensor. The annular Hall current sensor comprises a single-turn coil and a multi-turn coil, and the single-turn coil is electrified with a fixed external current I 0 For sensing a standard current and a multi-turn coil for sensing the induced current through the calibration aperture 1011. The current detection and calibration method comprises the following steps: when the electron beam is not down (i.e. before calibration), the single-turn coil is energized with an external fixed current I 0 The ring-shaped Hall current sensor can obtain a detection current I 0 '; during calibration (i.e. during beaming), the electron beam is beamed with a fixed small current I to the multi-turn coil, and a fixed external current I is simultaneously applied to the single-turn coil 0 At the moment, the annular Hall current sensor can obtain the detection current
Then, then
Where n is the number of turns of the multi-turn coil,
is the true current through the calibration hole 1011, then
The beam passing rate through the calibration hole 1011
。
Optionally, in some embodiments, the plate body 101 is a metal plate, such as an aluminum plate, a steel plate, and the like, and is low in cost.
Optionally, in some embodiments, the diameter of the calibration hole 1011 is smaller than the diameter of the beam spot of the electron beam. The number of the calibration holes 1011 may be one or more through holes arranged in an array.
An embodiment of the present invention secondly provides an electron beam calibration apparatus for metal powder processing, the electron beam calibration apparatus including: calibration device 100, vacuum chamber, signal collector and controller.
Specifically, the calibration device 100 adopts the calibration device 100 according to any one of the embodiments described above. The beam spot generated by the electron beam generator and the calibration device 100 are both located within the vacuum chamber. The signal collector is connected to the current collecting device, and is configured to collect position information of a beam spot of the electron beam on the calibration device 100, and receive the current signal collected by the calibration device 100. The electron beam generator and the signal collector are respectively connected with the controller, the controller is used for controlling the electron beam generator to scan the calibration hole 1011 according to a preset track, and the controller is used for receiving data sent by the signal collector and carrying out data processing so as to calibrate the electron beam.
In the embodiment, the calibration device 100 which is easy to prepare is adopted to collect the position information and the current signal of the beam spot, the calibration cost is low, the calibration device 100 and the beam spot are arranged in the vacuum chamber, the vacuum degree of the equipment is kept favorably, and the calibration precision is improved.
The embodiment of the invention also provides an electron beam calibration method for metal powder processing, which is used for calibrating the electron beam by adopting the electron beam calibration device in the embodiment, and comprises the following steps:
step S100, calibrating the position of the beam spot of the electron beam:
step S101, as shown in fig. 3, controlling the electron beam to scan the calibration hole 1011 of the calibration apparatus 100 along the X-axis direction, and recording the position information of the beam spot and the current variation during the scanning process. As shown in FIG. 4, the X-axis coordinate corresponding to the position where the current starts to increase is represented by X a The X-axis coordinate corresponding to the position where the current is maximum is defined as X 0 The X-axis coordinate corresponding to the position where the current is reduced to the minimum value is set as X b . Wherein, the X-axis direction may be from left to right or from right to left.
Step S102, as shown in FIG. 5, passing through said x 0 Making a perpendicular line on the X axis as a Y axis at a corresponding point, controlling the electron beam to scan the calibration hole 1011 along the Y axis, recording the position information of the beam spot and the current change condition in the scanning process, and setting the Y axis coordinate corresponding to the position where the current starts to increase as Y as shown in FIG. 6 a The Y-axis coordinate corresponding to the position where the current is maximum is defined as Y 0 The Y-axis coordinate corresponding to the position where the current is reduced to the minimum value is set as Y b . Wherein, the Y-axis direction is from top to bottom or from bottom to top.
Step S103, obtaining the coordinate (x) of the beam spot of the electron beam at the center of the calibration hole 1011 0 ，y 0 ) And the coordinate is the position of the beam spot after calibration.
In the embodiment, the calibration device 100 which is easy to prepare is adopted to collect the position information and the current signal of the beam spot, the calibration cost is low, the position of the beam spot can be calibrated by simply analyzing the current change condition, the calibration process is simple and easy to implement, and the precision is high.
In addition, the calibration method may further include step S200:
specifically, in step S200, the circularity of the beam spot is calibrated: calibrating the position of the beam spot of the electron beam to obtain the dimension D of the beam spot of the electron beam in the X-axis direction x =|x a -x b I, dimension D in Y-axis direction y =|y a -y b I, then the circularity e = D of the beam spot of the electron beam x /D y And comparing the roundness with a preset roundness, and adjusting the parameters of the electron beam generator to enable the roundness to reach the preset roundness.
The calibration method may further include step S300:
step S300, calibrating the size of the beam spot of the electron beam: placing a beam spot of the electron beam at (x) 0 ，y 0 ) And at the position, comparing the beam current passing rate with a preset beam current passing rate, and adjusting the parameters of the electron beam generator to enable the beam current passing rate to reach the preset beam current passing rate. According to the positionSetting the calibration and roundness calibration basis, and adjusting the beam spot to (x) 0 ，y 0 ) And detecting and calculating the beam passing rate of the calibration hole 1011 when the beam spot is at the position, and comparing the beam passing rate with a preset value, so as to judge whether the beam spot is positioned at the center of the calibration hole 1011. The beam current passing rate calculation method comprises the following steps: lower bundle P 0 The current is (0.8-10mA), and the current which is received by the signal collector and passes through the calibration hole 1011 is P 1 Calculating the beam passing rate eta = P of the calibration hole 1011 1 /P 0 And (5) comparing with the preset value, and controlling the electron beam generator to automatically adjust until eta meets the preset value through the computer.
The beam spot detection and calibration may be performed one by one for each calibration hole 1011, or may be performed simultaneously for a plurality of calibration holes 1011.
It is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like in the foregoing description are used for indicating or indicating the orientation or positional relationship illustrated in the drawings, and are used merely for convenience in describing embodiments of the present invention and for simplifying the description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the embodiments of the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixed or detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present disclosure can be understood by those of ordinary skill in the art as appropriate.
In embodiments of the invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise the first and second features being in direct contact, or the first and second features being in contact, not directly, but via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
Claims (10)
1. An electron beam calibration apparatus for metal powder processing, the calibration apparatus comprising:
the plate comprises a plate body, wherein a plurality of calibration holes are formed in the plate body, and the calibration holes are through holes;
the current acquisition device is arranged below the calibration hole and used for acquiring current signals generated by the electron beams passing through the calibration hole, and the sources of the current signals are as follows: and scanning the calibration hole by the beam spot of the electron beam according to a preset track, penetrating through the calibration hole to irradiate the current acquisition device, and generating the current signal at the current acquisition device.
2. The calibration device according to claim 1, wherein the current collecting device is an annular hall current sensor.
3. The calibration device according to claim 1, wherein the plate body is a metal plate.
4. The calibration device according to claim 1, wherein the diameter of the calibration hole is smaller than the diameter of the beam spot.
5. An electron beam calibration device for use in metal powder processing, said electron beam calibration device comprising:
calibration means using the calibration means of any one of claims 1 to 4;
the vacuum chamber is internally provided with a beam spot generated by an electron beam generator and the calibration device;
the signal collector is connected with the current collecting device and is used for collecting the position information of the beam spot of the electron beam on the calibration device and receiving the current signal collected by the current collecting device;
the controller is used for controlling the electron beam generator to scan the calibration holes according to a preset track, and the controller is used for receiving the data sent by the signal collector and carrying out data processing so as to calibrate the electron beams.
6. An electron beam calibration method for metal powder processing, characterized in that an electron beam is calibrated using the electron beam calibration apparatus of claim 5, the electron beam calibration method comprising the steps of:
calibrating the spot position of the electron beam:
controlling the electron beam to scan the calibration hole of the calibration device along the X-axis direction, recording the position information of the beam spot and the current change condition in the scanning process, and setting the X-axis coordinate corresponding to the position where the current starts to increase as X a The X-axis coordinate corresponding to the position where the current is maximum is defined as X 0 The X-axis coordinate corresponding to the position where the current is reduced to the minimum value is set as X b ；
X is passing through 0 Making a vertical line on the X axis as a Y axis by a corresponding point, controlling the electron beam to scan the calibration hole along the Y axis, recording the position information of the beam spot and the current change condition in the scanning process, and setting the Y axis coordinate corresponding to the position where the current starts to increase as Y a The Y-axis coordinate corresponding to the position where the current is maximum is defined as Y 0 The Y-axis coordinate corresponding to the position where the current is reduced to the minimum value is set as Y b ；
Obtaining the coordinate (x) of the beam spot of the electron beam at the center of the calibration hole 0 ，y 0 ）。
7. The electron beam calibration method according to claim 6, wherein the electron beam calibration method further comprises the steps of:
calibrating the roundness of the beam spot of the electron beam:
obtaining the size D of the beam spot of the electron beam in the X-axis direction through the beam spot position calibration of the electron beam x =|x a -x b I, dimension D in Y-axis direction y =|y a -y b I, then the circularity e = D of the beam spot of the electron beam x /D y And comparing the roundness with a preset roundness, and adjusting the parameters of the electron beam generator to enable the roundness to reach the preset roundness.
8. The electron beam calibration method according to claim 7, wherein the electron beam calibration method further comprises the steps of:
calibrating a size of a beam spot of the electron beam:
placing a beam spot of the electron beam at (x) 0 ，y 0 ) And at the position, comparing the beam passing rate with a preset beam passing rate, and adjusting the parameters of the electron beam generator to enable the beam passing rate to reach the preset beam passing rate.
9. The method of claim 8, wherein the parameter of the electron beam generator is a focusing parameter.
10. The method according to any one of claims 6 to 9, wherein the calibration of the beam spot of the electron beam is performed by a hole-by-hole calibration method or a simultaneous calibration of a plurality of calibration holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211610609.1A CN115609019A (en) | 2022-12-15 | 2022-12-15 | Electron beam calibration device, calibration device and method for metal powder processing |
Applications Claiming Priority (1)
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Cited By (1)
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| CN116441562A (en) * | 2023-06-16 | 2023-07-18 | 西安赛隆增材技术股份有限公司 | Device and method for calibrating beam spot of electron beam |
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