CN110026824A - IC chip test sorting machine marking device and control method - Google Patents
IC chip test sorting machine marking device and control method Download PDFInfo
- Publication number
- CN110026824A CN110026824A CN201910417556.3A CN201910417556A CN110026824A CN 110026824 A CN110026824 A CN 110026824A CN 201910417556 A CN201910417556 A CN 201910417556A CN 110026824 A CN110026824 A CN 110026824A
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- CN
- China
- Prior art keywords
- circular disc
- rotating circular
- semiconductor devices
- control method
- chip test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000004065 semiconductor Substances 0.000 claims abstract description 40
- 238000001514 detection method Methods 0.000 claims abstract description 27
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 21
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 238000009423 ventilation Methods 0.000 claims description 10
- 238000011065 in-situ storage Methods 0.000 claims description 3
- 238000010330 laser marking Methods 0.000 claims description 2
- 238000007664 blowing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q41/00—Combinations or associations of metal-working machines not directed to a particular result according to classes B21, B23, or B24
- B23Q41/02—Features relating to transfer of work between machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to semiconductor devices rotary type towers to test braid all-in-one machine marking mechanism, it is characterized by comprising have a pedestal, the base upper surface is installed with a square mounting, the square mounting upper surface offers a circular groove being embedded for rotating circular disc from top to bottom, the rotating circular disc is connected from bottom to top with rotating circular disc with machine shaft after square mounting through pedestal vertically by a servo motor and drives rotation, it is uniformly distributed in the rotating circular disc that there are four the placement positions of semiconductor devices, the mark work in the different marking mechanisms for placing position and the detection work of vision detection system are realized by the rotation of rotating circular disc, the IC chip test sorting machine marking device and control method are structurally reasonable, stability and high efficiency.
Description
Technical field
The present invention relates to a kind of IC chip test sorting machine marking device and control methods.
Background technique
Traditional marking mechanism is generally merely able to carry out mark, detection, placement to a semiconductor devices, completes this process
Next semiconductor devices is put into the mechanism again afterwards and carries out the flow operations, the time that mark, detection expend one by one in this way is long,
Inefficiency.
Summary of the invention
In view of the deficiencies in the prior art, technical problem to be solved by the invention is to provide IC chip test sortings
Machine marking device and control method, it is not only structurally reasonable, but also stability and high efficiency.
In order to solve the above-mentioned technical problem, the technical scheme is that a kind of IC chip test sorting machine is beaten
Device for mark and control method include a pedestal, which is installed with a square mounting, table on the square mounting
Face is equipped with a rotating circular disc, after the rotating circular disc runs through pedestal and square mounting vertically from bottom to top by a servo motor
Machine shaft is connected with rotating circular disc and drives rotation, and the placement position there are four semiconductor devices is evenly distributed in the rotating circular disc,
The mark work in the different marking mechanisms for placing position and the detection work of vision detection system are realized by the rotation of rotating circular disc
Make.
Further, the placement position of semiconductor devices is evenly arranged on nearly rotating circular disc edge, and two are placed adjacent position and turn
The angle that dynamic disk line is formed is 90 degree, and the placement position center is provided with through-hole through rotating circular disc vertically up and down,
The square mounting also runs through vertically up and down the second through-hole corresponding with lead to the hole site in rotating circular disc.
Further, the rotating circular disc is rotation counterclockwise, and with direction of rotation, the placement position in rotating circular disc is distinguished
Position, the second placement position, third placement position, the 4th placement position are placed for first；First placement is provided with placement half above position
The rotating arm of conductor device, the marking mechanism are correspondingly arranged in third and place above position, which is correspondingly arranged
It is placed above position in the 4th.
Further, the square mounting upper surface recessed a kind of annular groove downward, except being located at first, to place position right
Outside the second through-hole for answering lower section, the second through-hole that excess-three places below position is respectively positioned in class annular groove, by rotating circular disc
The space that three the second through-holes communicate is formed by such annular groove after in placement.
Further, pedestal side setting is there are four aperture, the aperture by four ventilation pipes of chassis outer side with
Second through-hole and through-hole are connected, be provided with controllable air-breathing on the first ventilation pipe for communicating of placement position and blow the
One air pump, excess-three place the second air pump that the corresponding ventilation pipe in position is provided with controllable air-breathing.
Further, a connecting column is provided between the rotating circular disc and machine shaft, the connecting column and rotating circular disc are logical
It crosses screw and runs through in rotating circular disc to connecting column from top to bottom and connect, it is cylindrical which offers one upward vertically
Slot, the connecting column offer T shape seam from its side edge surface towards center, and T shape seam is connected with slot, and the connecting column is separate
Center side passes through T shape seam vertical section by a bolt and connects connecting column and machine shaft locking.
Further, it is provided with a support frame below the pedestal, the axis and axis hole on the support frame by being vertically arranged
Pedestal is connected by interference fit with support frame, is arranged with spring outside the axis between the support frame and pedestal, the spring upper end and
Base lower surface apical grafting, in lower spring end apical grafting to support frame.
A kind of IC chip test sorting machine marking device and control method, sequentially include the following steps: and pass through first
Rotating arm bring semiconductor devices is placed on the first placement position through rotating arm, and the first air pump air-breathing adsorbs semiconductor devices,
Then servo motor drives rotating circular disc, the uniform rotation that rotation amplitude is 90 degree every time, when the first placement position by connecting column
Rotation places position to second, with the 4th places position by the semiconductor devices after detection and rotates to first and places position, and at this time the
One air pump carries out blown work, semiconductor devices is blown afloat, and the rotation by being placed on the first placement position semiconductor devices before
Arm, which has adsorbed rotation, to be taken away, and places position when the first placement position is rotated to third, semiconductor devices carries out laser by marking mechanism and beats
Mark operation places position when the first placement position is rotated to the 4th, and semiconductor devices carries out detection by vision detection system and operates, when same
Semiconductor device rotate a circle return to it is in situ complete mark detection after, that is, complete the mark detection work of four semiconductor devices
Make.
Compared with prior art, the invention has the following advantages: the IC chip test sorting machine mark fills
It sets and control method, by the design of rotating circular disc, different work can be carried out in different positions of placing in rotating circular disc, significantly
Increase working efficiency；By the design of class annular groove, three the second through-holes are connected, even if so having second gas
Pump damage stops working, but its corresponding second through-hole still is able to play suction-operated, improves the serious forgiveness of equipment.
The present invention will be further described in detail with reference to the accompanying drawings and detailed description.
Detailed description of the invention
Fig. 1 is organigram of the embodiment of the present invention；
Fig. 2 is the enlarged diagram of A in Fig. 1；
Fig. 3 is the attachment structure schematic diagram of pedestal and support frame in the embodiment of the present invention；
Fig. 4 is the attachment structure schematic diagram of servo motor and connecting column in the embodiment of the present invention；
Fig. 5 is the part drawing of square mounting in Fig. 1；
Fig. 6 is the part drawing of rotating circular disc in Fig. 1.
In figure: 1- pedestal, 2- square mounting, 3- rotating circular disc, 4- bolt, 5- servo motor, 6- machine shaft, 7- half
Conductor device, 8- place position, 9- marking mechanism, 10- vision detection system, 11- through-hole, the second through-hole of 12-, the placement of 13- first
Position, the placement of 14- second position, 15- third placement position, the placement of 16- the 4th position, 17- rotating arm, 18- class annular groove, 19- aperture,
20- ventilation pipe, the first air pump of 21-, the second air pump of 22-, 23- connecting column, 24- screw, 25- slot, 26-T shape seam, 27- branch
Support, 28- axis, 29- axis hole, 30- spring.
Specific embodiment
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and cooperate attached drawing, make detailed
Carefully it is described as follows.
As shown in Fig. 1 ~ 6, IC chip test sorting machine marking device and control method include a pedestal 1, should
Base upper surface is installed with a square mounting 2, which is equipped with a rotating circular disc 3, the rotating circular disc
It is connected simultaneously with machine shaft 6 after square mounting with rotating circular disc through pedestal vertically from bottom to top by a servo motor 5
Rotation is driven, the placement position 8 there are four semiconductor devices 7 is evenly distributed in the rotating circular disc, is realized and is existed by the rotation of rotating circular disc
Difference places the mark work of the marking mechanism 9 of position and the detection work of vision detection system 10.
In embodiments of the present invention, the placement position of semiconductor devices is evenly arranged on nearly rotating circular disc edge, and two adjacent put
The angle that set and rotating circular disc line are formed is 90 degree, and the placement position center is arranged through rotating circular disc vertically up and down
There is through-hole 11, which also runs through vertically up and down the second through-hole 12 corresponding with lead to the hole site in rotating circular disc.
In embodiments of the present invention, the rotating circular disc is rotation counterclockwise, with direction of rotation, putting in rotating circular disc
Set is respectively that position 14 is placed in the first placement position 13, second, third places position the 15, the 4th and places position 16；Described first places position
Top is provided with the rotating arm 17 for placing semiconductor devices, and the marking mechanism is correspondingly arranged in third and places above position, the view
Feel that detection system is correspondingly arranged in above the 4th placement position.
In embodiments of the present invention, the square mounting upper surface recessed a kind of annular groove 18 downward, except being located at the
One places outside the second through-hole of the corresponding lower section in position, and the second through-hole that excess-three places below position is respectively positioned in class annular groove,
Passing through such annular groove after rotating circular disc is placed above is the space for forming three the second through-holes and communicating.
In embodiments of the present invention, there are four apertures 19 for the pedestal side setting, and the aperture is by four of chassis outer side
Ventilation pipe is connected with the second through-hole and through-hole, is provided with controllable suction on the ventilation pipe 20 communicated with the first placement position
Gas and the first air pump 21 blown, excess-three place the second air pump that the corresponding ventilation pipe in position is provided with controllable air-breathing
22, by the getter action of the second air pump, negative pressure is formed in such annular groove, adsorbs the semiconductor devices of top whereby.
In embodiments of the present invention, be provided with a connecting column 23 between the rotating circular disc and machine shaft, the connecting column with
Rotating circular disc is connected in rotating circular disc to connecting column from top to bottom by screw 24, which opens up upward vertically
There is a cylindrical slot 25, which offers T shape seam 26, T shape seam and slot phase from its side edge surface towards center
Connection, the connecting column pass through T shape seam vertical section by a bolt 4 far from center side and connect connecting column and machine shaft locking
It connects, the design of T shape seam can effectively adapt to the servo motor of different size, the applicability of increased equipment, and the present embodiment is adopted
Servo motor model number is Panasonic MHMF (100W) servo motor.
In embodiments of the present invention, it is provided with a support frame 27 below the pedestal, passes through on the support frame and is vertically arranged
Axis 28 and axis hole 29 be interference fitted pedestal be connected with support frame, the axis between the support frame and pedestal is arranged with spring outside
30, the spring upper end and base lower surface apical grafting, in lower spring end apical grafting to support frame, above-mentioned connecting column lower end also extends to branch
In support, in servo motor work, which can reduce equipment vibration, conducive to the stability of equipment.
IC chip test sorting machine marking device and control method, and sequentially include the following steps: and pass through rotation first
Pivoted arm bring semiconductor devices is placed on the first placement position through rotating arm, and the first air pump air-breathing adsorbs semiconductor devices, is connect
Servo motor rotating circular disc is driven by connecting column, rotation amplitude is 90 degree of uniform rotation every time, places position and revolves when first
The second placement position is gone to, position with the 4th is placed by the semiconductor devices after detection rotates to first and place position, at this time first
Air pump carries out blown work, semiconductor devices is blown afloat, and the rotating arm by being placed on the first placement position semiconductor devices before
It has adsorbed rotation to take away, has placed position when the first placement position is rotated to third, semiconductor devices carries out laser marking by marking mechanism
Operation places position when the first placement position is rotated to the 4th, and semiconductor devices carries out detection by vision detection system and operates, when same
Semiconductor devices rotate a circle return to it is in situ complete mark detection after, that is, complete the mark detection work of four semiconductor devices
Make.
The present invention is not limited to above-mentioned preferred forms, anyone can show that other are each under the inspiration of the present invention
The IC chip test sorting machine marking device and control method of kind form.It is all to be done according to scope of the present invention patent
Equivalent changes and modifications are all covered by the present invention.
Claims (8)
1. a kind of IC chip test sorting machine marking device and control method, it is characterised in that: it include a pedestal, it should
Base upper surface is installed with a square mounting, which is equipped with a rotating circular disc, and the rotating circular disc is logical
A servo motor is crossed to be connected and drive with machine shaft after square mounting with rotating circular disc through pedestal vertically from bottom to top
It rotates, uniformly distributed in the rotating circular disc there are four the placement positions of semiconductor devices, are realized by the rotation of rotating circular disc and are put in difference
The mark work of the marking mechanism of set and the detection work of vision detection system.
2. IC chip test sorting machine marking device according to claim 1 and control method, it is characterised in that:
The placement position of semiconductor devices is evenly arranged on nearly rotating circular disc edge, and two are placed adjacent the angle that position is formed with rotating circular disc line
Degree is 90 degree, and the placement position center is provided with through-hole through rotating circular disc vertically up and down, and the square mounting is also upper and lower
Running through vertically has the second through-hole corresponding with lead to the hole site in rotating circular disc.
3. IC chip test sorting machine marking device according to claim 1 and control method, it is characterised in that:
The rotating circular disc is rotation counterclockwise, and with direction of rotation, the placement position in rotating circular disc is respectively the first placement position, second
Place position, third places position, the 4th places position；First placement is provided with the rotating arm for placing semiconductor devices above position,
The marking mechanism is correspondingly arranged in third and places above position, which is correspondingly arranged in above the 4th placement position.
4. IC chip test sorting machine marking device according to claim 1 and control method, it is characterised in that:
The square mounting upper surface recessed a kind of annular groove downward, except being located at the first the second through-hole for placing the corresponding lower section in position
Outside, the second through-hole that excess-three places below position is respectively positioned in class annular groove, passes through such after rotating circular disc is placed above
Annular groove forms the space that three the second through-holes communicate.
5. IC chip test sorting machine marking device according to claim 1 and control method, it is characterised in that:
Pedestal side setting is there are four aperture, and the aperture is by four ventilation pipes of chassis outer side and the second through-hole and through-hole phase
Connection places the first air pump for being provided with controllable air-breathing on the ventilation pipe that position communicates and blowing with first, and excess-three is put
The corresponding ventilation pipe of set is provided with the second air pump of controllable air-breathing.
6. IC chip test sorting machine marking device according to claim 1 and control method, it is characterised in that:
A connecting column is provided between the rotating circular disc and machine shaft, which is run through with rotating circular disc by screw from top to bottom
Connected in rotating circular disc to connecting column, which offers a cylindrical slot upward vertically, the connecting column from its
Side edge surface offers T shape seam towards center, and T shape seam is connected with slot, which passes through a spiral shell far from center side
Bolt passes through T shape seam vertical section and connects connecting column and machine shaft locking.
7. IC chip test sorting machine marking device according to claim 1 and control method, it is characterised in that:
It is provided with a support frame below the pedestal, is interference fitted by the axis and axis hole that are vertically arranged by pedestal and branch on the support frame
Support is connected, and is arranged with spring outside the axis between the support frame and pedestal, the spring upper end and base lower surface apical grafting, spring
In the apical grafting to support frame of lower end.
8. the working method of IC chip test sorting machine marking device, which is characterized in that using such as claim 1-7 institute
That states appoints semiconductor devices rotary type tower test braid all-in-one machine marking mechanism, and sequentially includes the following steps: and pass through rotating arm first
Bring semiconductor devices is placed on the first placement position through rotating arm, and the first air pump air-breathing adsorbs semiconductor devices, is then watched
Take motor and rotating circular disc driven by connecting column, rotation amplitude is 90 degree of uniform rotation every time, when first place position rotate to
Second places position, and placing position with the 4th by the semiconductor devices after detection is to rotate to first to place position, at this time the first air pump
Blown work is carried out, semiconductor devices is blown afloat, and the rotating arm by being placed on the first placement position semiconductor devices before adsorbs
It playing rotation to take away, places position when the first placement position is rotated to third, semiconductor devices carries out laser marking by marking mechanism and operates,
Position is placed when the first placement position is rotated to the 4th, semiconductor devices carries out detection by vision detection system and operates, when same half is led
Body device rotate a circle return to it is in situ complete mark detection after, that is, complete the mark detection work of four semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910417556.3A CN110026824A (en) | 2019-05-20 | 2019-05-20 | IC chip test sorting machine marking device and control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910417556.3A CN110026824A (en) | 2019-05-20 | 2019-05-20 | IC chip test sorting machine marking device and control method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110026824A true CN110026824A (en) | 2019-07-19 |
Family
ID=67242621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910417556.3A Pending CN110026824A (en) | 2019-05-20 | 2019-05-20 | IC chip test sorting machine marking device and control method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110026824A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113003215A (en) * | 2021-03-02 | 2021-06-22 | 马丁科瑞半导体技术(南京)有限公司 | Satellite wheel station of integrated machine and operation method thereof |
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|---|---|---|---|---|
| CN101493495A (en) * | 2009-03-06 | 2009-07-29 | 江都市东元机电设备有限公司 | Semiconductor device testing and sorting machine |
| CN202048286U (en) * | 2011-04-08 | 2011-11-23 | 童撮洪 | Insertion quick connector |
| CN102921644A (en) * | 2012-11-17 | 2013-02-13 | 吴华 | Turret test selector |
| CN204526433U (en) * | 2015-03-13 | 2015-08-05 | 宁波卡速视自动化科技有限公司 | A kind of general automation laser marking machine |
| CN205191045U (en) * | 2015-11-24 | 2016-04-27 | 艾克斯气动元件有限公司 | Meet diversion straight joint soon |
| CN107336529A (en) * | 2017-07-31 | 2017-11-10 | 深圳市深科达半导体科技有限公司 | Marking device |
| CN209919472U (en) * | 2019-05-20 | 2020-01-10 | 福州派利德电子科技有限公司 | Marking suction disc device for chip testing braider |
-
2019
- 2019-05-20 CN CN201910417556.3A patent/CN110026824A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101493495A (en) * | 2009-03-06 | 2009-07-29 | 江都市东元机电设备有限公司 | Semiconductor device testing and sorting machine |
| CN202048286U (en) * | 2011-04-08 | 2011-11-23 | 童撮洪 | Insertion quick connector |
| CN102921644A (en) * | 2012-11-17 | 2013-02-13 | 吴华 | Turret test selector |
| CN204526433U (en) * | 2015-03-13 | 2015-08-05 | 宁波卡速视自动化科技有限公司 | A kind of general automation laser marking machine |
| CN205191045U (en) * | 2015-11-24 | 2016-04-27 | 艾克斯气动元件有限公司 | Meet diversion straight joint soon |
| CN107336529A (en) * | 2017-07-31 | 2017-11-10 | 深圳市深科达半导体科技有限公司 | Marking device |
| CN209919472U (en) * | 2019-05-20 | 2020-01-10 | 福州派利德电子科技有限公司 | Marking suction disc device for chip testing braider |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113003215A (en) * | 2021-03-02 | 2021-06-22 | 马丁科瑞半导体技术(南京)有限公司 | Satellite wheel station of integrated machine and operation method thereof |
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