CN110017318A - The device and method of elasticity binding target - Google Patents
The device and method of elasticity binding target Download PDFInfo
- Publication number
- CN110017318A CN110017318A CN201910239647.2A CN201910239647A CN110017318A CN 110017318 A CN110017318 A CN 110017318A CN 201910239647 A CN201910239647 A CN 201910239647A CN 110017318 A CN110017318 A CN 110017318A
- Authority
- CN
- China
- Prior art keywords
- target
- backboard
- chuck body
- stabilizer blade
- elasticity binding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000003381 stabilizer Substances 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 35
- 229910052802 copper Inorganic materials 0.000 claims description 35
- 125000006850 spacer group Chemical group 0.000 claims description 34
- 239000000084 colloidal system Substances 0.000 claims description 23
- 229910052738 indium Inorganic materials 0.000 claims description 16
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 238000007711 solidification Methods 0.000 claims description 9
- 230000008023 solidification Effects 0.000 claims description 9
- 239000008119 colloidal silica Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical group OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 claims description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052980 cadmium sulfide Inorganic materials 0.000 claims description 6
- 229910052733 gallium Inorganic materials 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000013077 target material Substances 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 4
- 238000010792 warming Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 239000011347 resin Substances 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- -1 at high price Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
Abstract
The present invention relates to a kind of devices of elasticity binding target, it includes a portal frame and a gap plate clamp, the portal frame includes the first parallel stabilizer blade, the first stabilizer blade of second stabilizer blade and connection, one horizon bar of the second stabilizer blade, first stabilizer blade, second stabilizer blade is provided with conduit, the gap plate clamp includes chuck body and an adjustment portion, the adjustment portion includes the leader extended from up to down, one adjusting rod, one crawl section, the chuck body is parallel with horizon bar, and the both ends of chuck body are sheathed in conduit, the crawl section is fixed in chuck body, the adjusting rod runs through horizon bar up and down, the moving up and down of the handle is able to drive chuck body and moves up and down along conduit.A kind of method that the present invention proposes elasticity binding target simultaneously.The gap simplicity gel resin that the gap between target is precisely controlled between target may be implemented in the device and method of elasticity binding target of the invention.
Description
Technical field
The present invention relates to the preparation field of target more particularly to a kind of device and methods of elasticity binding target.
Background technique
The target of high quality is the basis of film application, and the target binding being accompanied with target also affects the matter of film
Amount.Target binding, is a kind of target deep process technology, i.e., keeps target and backboard viscous using wellability and the good material of ductility
Knot together, and is formed by adhesive layer with certain electric conductivity, thermal conductivity and adhesive strength.
The common material of backboard is copper (Cu) and molybdenum (Mo), is typically provided with special water channel knot inside larger area backboard
Structure is conducive to water flowing and radiates.And binding technology solves part target because brittleness is larger, thermal conductivity is poor, directly sputtering Shi Yikai
It splits, is scrapped so as to cause target.
The binding of planar targets is bound using indium mostly at present, and indium belongs to dissipated metal, at high price, and indium binding is simultaneously
It is not suitable for all targets, binds and be not suitable for, typically now use with frangible brittleness target, indium for example, not infiltrated to indium
The method of elasticity binding solves.
Chinese patent application CN104928633A discloses a kind of method of target elasticity binding, by target and backboard
Welding surface and nonmagnetic metal net two sides be coated with it is a certain amount of doping silver powder or active carbon particle epoxide-resin glue, according to
It is secondary to stack the binding for solidifying and completing target after each layer under normal temperature and pressure, pass through the mesh number and net of control nonmagnetic metal net
Linear diameter come realize elimination or segmentation welding layer present in air pocket, improve the binding rate of target, avoiding target makes
With hidden danger of missing the target caused by being combined in the air pocket of welding layer because of hot polymerization in the process.
The case where needing continuous binding for muti-piece planar targets, the above method can not be applicable in completely, and reason is:
The gap being usually faced between target when muti-piece planar targets are continuously bound is small, the problem of glue difficulty is removed after adhesive curing, above-mentioned
Method is not designed in view of these situations.
Therefore, in order to solve muti-piece planar targets need it is continuous bind existing above-mentioned technical problem, need a kind of new
The device and method of elasticity binding target.
Summary of the invention
Between between the target faced when it is an object of the invention to propose that a kind of solution muti-piece planar targets are continuously bound
Gap is small, after adhesive curing except the device and method of the difficult elasticity binding target of glue.
To realize foregoing purpose, the present invention adopts the following technical scheme: a kind of device of elasticity binding target comprising one
Portal frame and a gap plate clamp, the portal frame include the first parallel stabilizer blade, the second stabilizer blade and connection the first stabilizer blade,
One horizon bar of the second stabilizer blade, first stabilizer blade, the second stabilizer blade are provided with conduit, and the gap plate clamp includes chuck body
And an adjustment portion, the adjustment portion includes the leader extended from up to down, an adjusting rod, a crawl section, the fixture sheet
Body is parallel with horizon bar, and the both ends of chuck body are sheathed in conduit, and the crawl section is fixed in chuck body, the tune
Pole runs through horizon bar up and down, and the moving up and down of the handle is able to drive chuck body and moves up and down along conduit.
A kind of method for proposing elasticity binding target simultaneously uses the device of above-mentioned elasticity binding target, this method
The following steps are included:
S1, the binding face that target, backboard are cleaned with isopropanol, then the binding face with washes of absolute alcohol target, backboard；
S2, target and backboard are placed in below portal frame, spacer shims is held in chuck body, handle alignment jig sheet is passed through
The upper and lower position of body；
Spacer shims are coated with the two sides point of organic colloidal silica by S3, the two sides that a kind of organosilicon colloid is uniformly coated on to spacer shims
It is not adhered to two adjacent targets, and spacer shims are concordant with the bottom surface of two targets；
S4, above-mentioned two adjacent targets are overlayed on the welding surface of backboard and is positioned, tied up copper mesh by organosilicon colloid
Due between target and backboard；
S5, S3, S4 are repeated, until multi-disc target is relatively fixed；
S6, the briquetting that constant weight is placed on each target, briquetting forms certain pressure on target, then by target and
Backboard is warming up to 80 ~ 120 DEG C with certain heating rate and stands 1 ~ 8h of solidification；
S7, spacer shims are removed by the upper and lower position of handle alignment jig ontology, clear up organosilicon colloid, be cooled to room temperature, obtain
To the target bound.
As a further improvement of the present invention, the pressure that briquetting is formed on target is 100 ~ 200g ∕ cm2。
As a further improvement of the present invention, the heating rate in S6 is 1 ~ 5 DEG C ∕ min.
As a further improvement of the present invention, the mesh number of copper mesh is 60 ~ 100 mesh, and copper mesh is with a thickness of 0.15 ~ 0.25mm.
As a further improvement of the present invention, the preparation material of spacer shims is copper.
As a further improvement of the present invention, target is cadmium sulfide target, ITO target, copper and indium gallium target or AZO target
Material.
The present invention realizes the elasticity binding of target by organosilicon colloid, binds compared to traditional indium, application range
It is wider, the brittleness target that cannot be bound using indium can be bound, while extending the use temperature of target, this method is 250
Normal use at DEG C may be implemented the gap between target using the device of elasticity binding target and be precisely controlled between target
Gap simplicity gel resin.
Detailed description of the invention
Fig. 1 is the structural schematic diagram under the first visual angle of the device of present invention elasticity binding target.
Fig. 2 is the structural schematic diagram under the second visual angle of the device of present invention elasticity binding target.
Fig. 3 is the structural schematic diagram under the third visual angle of the device of present invention elasticity binding target.
Specific embodiment
Technical solution is clearly and completely described below in conjunction with the embodiment of the present invention, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
For the existing elasticity binding technical deficiency of target, the present invention proposes a kind of device 100 of elasticity binding target,
Please refer to Fig. 1,2,3 comprising a portal frame 110 and a gap plate clamp 120, the portal frame 110 include parallel the
One horizon bar 113 of the first stabilizer blade 111 of one stabilizer blade 111, the second stabilizer blade 112 and connection, the second stabilizer blade 112, the first stabilizer blade
111, the second stabilizer blade 112 is provided with conduit 130, and gap plate clamp 120 includes chuck body 121 and an adjustment portion 122, adjusts
Portion 122 includes leader 122a, an adjusting rod 122b, the crawl section 122c extended from up to down, chuck body 121 and level
Bar 113 is parallel, and the both ends of chuck body 121 are sheathed in conduit 130, and crawl section 122c is fixed in chuck body 121, adjusts
Pole 122b or more runs through horizon bar 113, and moving up and down for handle 122a is able to drive chuck body 121 along on conduit 130
Lower movement.
The operational process of the device 100 are as follows: spacer shims 200 are held in chuck body 121, by regulation handle 122a come
Two sides of spacer shims 200 are coated with organic colloidal silica by the lifting for realizing chuck body 121 and spacer shims 200, and by between
Two sides that feeler 200 is coated with organic colloidal silica are adhered to two adjacent targets 300 respectively, while guaranteeing spacer shims 200
Bottom it is concordant with the bottom of two targets 300, two targets 300 are placed on a big backboard 400, organic silica gel is passed through
Copper mesh is bound between target 300 and backboard 400 by body.
In certain embodiments of the present invention, after the completion of binding, spacer shims 200 and organosilicon colloid are heated to certain temperature
Degree, removes spacer shims 200, repeats the above steps, and successively carries out the elasticity binding of adjacent target.
In certain embodiments of the present invention, whenever necessary, apply external force from two targets 300 to spacer shims 200, squeeze
Extra organosilicon colloid out.
Meanwhile a kind of method that the present invention proposes elasticity binding target should using the device of above-mentioned elasticity binding target
Method the following steps are included:
S1, the binding face that target, backboard are cleaned with isopropanol, then the binding face with washes of absolute alcohol target, backboard；
S2, target and backboard are placed in below portal frame, spacer shims is held in chuck body, handle alignment jig sheet is passed through
The upper and lower position of body；
Spacer shims are coated with the two sides point of organic colloidal silica by S3, the two sides that a kind of organosilicon colloid is uniformly coated on to spacer shims
It is not adhered to two adjacent targets, and spacer shims are concordant with the bottom surface of two targets；
S4, above-mentioned two adjacent targets are overlayed on the welding surface of backboard and is positioned, tied up copper mesh by organosilicon colloid
Due between target and backboard；
S5, S3, S4 are repeated, until multi-disc target is relatively fixed；
S6, the briquetting that constant weight is placed on each target, briquetting forms certain pressure on target, then by target and
Backboard is warming up to 80 ~ 120 DEG C with certain heating rate and stands 1 ~ 8h of solidification；
S7, spacer shims are removed by the upper and lower position of handle alignment jig ontology, clear up organosilicon colloid, be cooled to room temperature, obtain
To the target bound.
In certain embodiments of the present invention, the pressure that briquetting is formed on target is 100 ~ 200g ∕ cm2。
In certain embodiments of the present invention, the heating rate in S6 is 1 ~ 5 DEG C ∕ min.
In certain embodiments of the present invention, the mesh number of copper mesh is 60 ~ 100 mesh, and copper mesh is with a thickness of 0.15 ~ 0.25mm.
In certain embodiments of the present invention, the preparation material of spacer shims is copper.
In certain embodiments of the present invention, target is cadmium sulfide target, ITO target, copper and indium gallium target or AZO target
Material.
This method realizes the binding of target by organosilicon colloid, can satisfy thermally conductive demand, can also play raising
Sputtering target material using temperature, extend target binding range (target frangible when connecting by indium can be bound), reach
Protect the effect that target material body is not damaged.
Embodiment 1.
A kind of method of elasticity binding target, using a kind of device 100 of elasticity binding target comprising following steps:
The binding face of cadmium sulfide target, backboard is cleaned with isopropanol first, then again with washes of absolute alcohol cadmium sulfide target, backboard
Binding face, and the one circle high temperature gummed tape of winding around target, wherein the size of cadmium sulfide target is 150 × 150mm, copper backboard
Having a size of 150 × 1510mm；Special gap control fixture is installed on backboard position location, and (gap between adjacent target is
0.2mm)；A kind of organosilicon colloid is uniformly coated on to the two sides of spacer shims, spacer shims are coated with to the two sides point of organic colloidal silica
It is not adhered to two adjacent targets, and spacer shims are concordant with the bottom surface of two targets；Copper mesh and target are successively overlayed into back
It on the binding face of plate and positions, copper mesh is bound between target and backboard by organosilicon colloid, wherein the sieve pore ruler of copper mesh
Very little is 80 mesh, and copper mesh is with a thickness of 0.2mm；A bronze medal briquetting is placed on each target, and solidification 1h is stood at 120 DEG C；Solidification
Extra organosilicon colloid is removed after the completion, remove the device of elasticity binding target and clears up high temperature gummed tape, is cooled to room temperature, is obtained
To the target bound；The target bound is measured its thermal coefficient and detected its binding using ultrasonic scanning with flat band method and is tied
Conjunction rate, thermal coefficient are 38W ∕ mK, and binding rate is up to 97%.
Embodiment 2.
A kind of method of elasticity binding target, using a kind of device 100 of elasticity binding target comprising following steps:
The binding face of ITO target, backboard is cleaned with isopropanol first, then uses the binding of washes of absolute alcohol ITO target, backboard again
Face, and the one circle high temperature gummed tape of winding around target, wherein the size of ITO target is 150 × 150mm, the size of copper backboard is
365×880mm；Special gap control fixture is installed on backboard position location (gap between adjacent target is 0.1mm)；
A kind of organosilicon colloid is uniformly coated on to the two sides of spacer shims, by spacer shims be coated with the two sides of organic colloidal silica respectively with it is adjacent
The adherency of two targets, and spacer shims are concordant with the bottom surface of two targets；Copper mesh and target are successively overlayed to the binding of backboard
It on face and positions, copper mesh is bound between target and backboard by organosilicon colloid, wherein the screen size of copper mesh is 80
Mesh, copper mesh is with a thickness of 0.2mm；A bronze medal briquetting is placed on each target, and solidification 4h is stood at 100 DEG C；After the completion of solidification
Extra organosilicon colloid is removed, the device of elasticity binding target is removed and clears up high temperature gummed tape, room temperature is cooled to, is bound
Good target；The target bound is measured its thermal coefficient and is detected it using ultrasonic scanning with flat band method and binds Percentage bound,
Its thermal coefficient is 42W ∕ mK, and binding rate is up to 98%.
Embodiment 3.
A kind of method of elasticity binding target, using a kind of device 100 of elasticity binding target comprising following steps:
The binding face of copper and indium gallium target, backboard is cleaned with isopropanol first, then again with washes of absolute alcohol copper and indium gallium target, backboard
Binding face, and the one circle high temperature gummed tape of winding around target, wherein the size of copper and indium gallium target is 200 × 100mm, copper backboard
Having a size of 108 × 410mm；Special gap control fixture is installed on backboard position location, and (gap between adjacent target is
0.1mm)；A kind of organosilicon colloid is uniformly coated on to the two sides of spacer shims, spacer shims are coated with to the two sides point of organic colloidal silica
It is not adhered to two adjacent targets, and spacer shims are concordant with the bottom surface of two targets；Copper mesh and target are successively overlayed into back
It on the binding face of plate and positions, copper mesh is bound between target and backboard by organosilicon colloid, wherein the sieve pore ruler of copper mesh
Very little is 100 mesh, and copper mesh is with a thickness of 0.25mm；A bronze medal briquetting is placed on each target, and solidification 8h is stood at 80 DEG C；Solidification
Extra organosilicon colloid is removed after the completion, remove the device of elasticity binding target and clears up high temperature gummed tape, is cooled to room temperature, is obtained
To the target bound；The target bound is measured its thermal coefficient and detected its binding using ultrasonic scanning with flat band method and is tied
Conjunction rate, thermal coefficient are 45W ∕ mK, and binding rate is up to 96%.
Testing result through the foregoing embodiment is it is found that the present apparatus and method have practical, applied widely, technique
Flexibly, process is easy to control, and suitable for using when the binding of muti-piece planar targets continuous elastic, solves target elasticity binding procedure
Middle positioning and subsequent the problem of removing glue, and its heating conduction is good, for muti-piece planar targets elasticity bind provide it is a kind of high
Imitate processing unit and method.
The present invention realizes the elasticity binding of target by organosilicon colloid, binds compared to traditional indium, application range
It is wider, the brittleness target that cannot be bound using indium can be bound, while extending the use temperature of target, this method is 250
Normal use at DEG C, using elasticity binding target device 100 may be implemented the gap between target be precisely controlled with target it
Between gap simplicity gel resin.
Although for illustrative purposes, the preferred embodiment of the present invention is had been disclosed, but the ordinary skill people of this field
Member will realize without departing from the scope and spirit of the invention as disclosed by the appended claims, various to change
Into, increase and replace be possible.
Claims (7)
1. a kind of device of elasticity binding target, it is characterised in that: it includes a portal frame and a gap plate clamp, the dragon
Door frame include the first parallel stabilizer blade, the second stabilizer blade and connection the first stabilizer blade, the second stabilizer blade a horizon bar, described first
Foot, the second stabilizer blade are provided with conduit, and the gap plate clamp includes chuck body and an adjustment portion, and the adjustment portion includes certainly
On extend downwardly leader, an adjusting rod, a crawl section, the chuck body is parallel with horizon bar, and the two of chuck body
End cap is set in conduit, and the crawl section is fixed in chuck body, and the adjusting rod runs through horizon bar up and down, the handle
It moves up and down and is able to drive chuck body and is moved up and down along conduit.
2. a kind of method of elasticity binding target, uses the device of elasticity binding target described in claim 1, feature exists
In: method includes the following steps:
S1, the binding face that target, backboard are cleaned with isopropanol, then the binding face with washes of absolute alcohol target, backboard；
S2, target and backboard are placed in below portal frame, spacer shims is held in chuck body, handle alignment jig sheet is passed through
The upper and lower position of body；
Spacer shims are coated with the two sides point of organic colloidal silica by S3, the two sides that a kind of organosilicon colloid is uniformly coated on to spacer shims
It is not adhered to two adjacent targets, and spacer shims are concordant with the bottom surface of two targets；
S4, above-mentioned two adjacent targets are overlayed on the welding surface of backboard and is positioned, tied up copper mesh by organosilicon colloid
Due between target and backboard；
S5, S3, S4 are repeated, until multi-disc target is relatively fixed；
S6, the briquetting that constant weight is placed on each target, briquetting forms certain pressure on target, then by target and
Backboard is warming up to 80 ~ 120 DEG C with certain heating rate and stands 1 ~ 8h of solidification；
S7, spacer shims are removed by the upper and lower position of handle alignment jig ontology, clear up organosilicon colloid, be cooled to room temperature, obtain
To the target bound.
3. the method for elasticity binding target according to claim 2, it is characterised in that: the pressure that briquetting is formed on target
For 100 ~ 200g ∕ cm2。
4. the method for elasticity binding target according to claim 2, it is characterised in that: the heating rate in S6 is 1 ~ 5 DEG C ∕
min。
5. the method for elasticity binding target according to claim 2, it is characterised in that: the mesh number of copper mesh is 60 ~ 100 mesh,
Copper mesh is with a thickness of 0.15 ~ 0.25mm.
6. the method for elasticity binding target according to claim 2, it is characterised in that: the preparation material of spacer shims is copper.
7. the method for elasticity binding target according to claim 2, it is characterised in that: target is cadmium sulfide target, ITO target
Material, copper and indium gallium target or AZO target.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910239647.2A CN110017318B (en) | 2019-03-27 | 2019-03-27 | Device and method for elastically binding target material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910239647.2A CN110017318B (en) | 2019-03-27 | 2019-03-27 | Device and method for elastically binding target material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110017318A true CN110017318A (en) | 2019-07-16 |
| CN110017318B CN110017318B (en) | 2021-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910239647.2A Active CN110017318B (en) | 2019-03-27 | 2019-03-27 | Device and method for elastically binding target material |
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| CN (1) | CN110017318B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110629171A (en) * | 2019-09-25 | 2019-12-31 | 福建阿石创新材料股份有限公司 | Binding method of planar small-specification sputtering target used in testing machine |
| CN112171164A (en) * | 2020-10-20 | 2021-01-05 | 江苏城乡建设职业学院 | Friction stir welding clamp |
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| JP2005105389A (en) * | 2003-10-01 | 2005-04-21 | Asahi Techno Glass Corp | Split type sputtering target |
| CN1873049A (en) * | 2005-05-31 | 2006-12-06 | 应用材料股份有限公司 | Method of elastomer bonding of large area target |
| EP2145976A1 (en) * | 2008-07-15 | 2010-01-20 | Praxair Technology, Inc. | Sputter target assembly having a low-temperature high-strength bond |
| CN202576549U (en) * | 2012-04-05 | 2012-12-05 | 江西沃格光电科技有限公司 | Film coating target table |
| CN104928633A (en) * | 2014-03-18 | 2015-09-23 | 汉能新材料科技有限公司 | Target material binding method |
| CN109112490A (en) * | 2017-06-23 | 2019-01-01 | 宁波江丰电子材料股份有限公司 | Spliced target welding method |
| CN207656045U (en) * | 2017-11-22 | 2018-07-27 | 湘潭大学兴湘学院 | A kind of energy-saving lamp pcb board wicking clamping device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110629171A (en) * | 2019-09-25 | 2019-12-31 | 福建阿石创新材料股份有限公司 | Binding method of planar small-specification sputtering target used in testing machine |
| CN112171164A (en) * | 2020-10-20 | 2021-01-05 | 江苏城乡建设职业学院 | Friction stir welding clamp |
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|---|---|
| CN110017318B (en) | 2021-05-28 |
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Application publication date: 20190716 Assignee: Pilot film materials Co.,Ltd. Assignor: Leading film materials (Guangdong) Co.,Ltd. Contract record no.: X2021440000141 Denomination of invention: Device and method for elastically binding target Granted publication date: 20210528 License type: Common License Record date: 20210730 |
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