CN110016647B - Evaporation source cleaning equipment and evaporation system - Google Patents
Evaporation source cleaning equipment and evaporation system Download PDFInfo
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- CN110016647B CN110016647B CN201910459263.1A CN201910459263A CN110016647B CN 110016647 B CN110016647 B CN 110016647B CN 201910459263 A CN201910459263 A CN 201910459263A CN 110016647 B CN110016647 B CN 110016647B
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- evaporation source
- evaporation
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- heating unit
- heat sink
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
Abstract
The invention discloses an evaporation source cleaning device and an evaporation system. The evaporation source cleaning equipment comprises a vacuum chamber, a first evaporation source heating unit and a second evaporation source heating unit, wherein the first evaporation source heating unit and the second evaporation source heating unit are arranged in the vacuum chamber; the second evaporation source heating unit and the first evaporation source heating unit are distributed at intervals, the second evaporation source heating unit comprises at least one accommodating groove used for accommodating a line evaporation source or a surface evaporation source, and the accommodating groove can generate thermal radiation to clean the line evaporation source or the surface evaporation source. The evaporation source cleaning equipment disclosed by the invention can remove impurities of the point evaporation source, the line evaporation source and the surface evaporation source, cannot influence the process of the evaporation chamber, and further can improve the evaporation efficiency and the utilization rate of an evaporation system.
Description
Technical Field
The invention belongs to the technical field of display, and particularly relates to evaporation source cleaning equipment and an evaporation system.
Background
Organic Light Emitting Diode (OLED) display has the advantages of low cost, wide viewing angle, low driving voltage, fast response speed, rich Light Emitting colors, simple preparation process, capability of realizing large-area flexible display and the like, and is considered to be one of the display technologies with the greatest development prospects.
The evaporation process of the array substrate of the OLED is generally performed in an evaporation chamber of an evaporation apparatus, and during the evaporation process, evaporation materials may remain on a heater and a crucible, and it is necessary to bake (baking) the evaporation chamber periodically to remove impurities remaining on the inner wall of the heater and the crucible used in the evaporation. The baking process consumes a long time and directly influences the utilization rate of the evaporation system.
Disclosure of Invention
The embodiment of the invention provides an evaporation source cleaning device and an evaporation system, and aims to improve the utilization rate of the evaporation system.
In a first aspect, the present invention provides an evaporation source cleaning apparatus, including: a vacuum chamber; the first evaporation source heating unit is arranged in the vacuum chamber and comprises a supporting part, the supporting part is used for placing at least one point evaporation source, and the first evaporation source heating unit can generate heat radiation to clean the point evaporation source; the second evaporation source heating unit is arranged in the vacuum chamber and distributed at intervals with the first evaporation source heating unit, the second evaporation source heating unit comprises at least one accommodating groove used for accommodating a line evaporation source or a surface evaporation source, and the accommodating groove can generate thermal radiation to clean the line evaporation source or the surface evaporation source arranged in the accommodating groove.
According to one aspect of the present invention, the vacuum chamber includes a first chamber and a second chamber which are isolated from each other, the first evaporation source heating unit is disposed in the first chamber, and the second evaporation source heating unit is disposed in the second chamber.
According to one aspect of the invention, the supporting part comprises a plurality of supporting discs distributed in an array, each supporting disc can be correspondingly provided with a point evaporation source, and the supporting discs can generate heat radiation to clean the point evaporation sources; or a plurality of electrifying devices are arranged on the supporting plate and can be electrically connected with the heater of the point evaporation source so as to enable the heater of the point evaporation source to generate heat radiation for cleaning.
According to one aspect of the invention, each support plate can be correspondingly provided with point evaporation sources of different models.
According to one aspect of the invention, a first cylindrical heat sink is further disposed in the first chamber, the first heat sink is disposed on the support and surrounds the support plate, and the point evaporation source can be located in the first heat sink and spaced from an inner surface of the first heat sink by a first predetermined distance.
According to one aspect of the invention, a second heat dissipation device is further arranged in the first chamber, is connected to the inner surface of the first chamber, and is covered on the top of the first evaporation source heating unit.
According to an aspect of the present invention, a third heat dissipation device is further disposed in the second chamber, and the third heat dissipation device can be disposed around the accommodating groove and is spaced from the outer surface of the accommodating groove by a second preset distance.
According to one aspect of the invention, the number of the accommodating grooves is more than two, at least one of the more than two accommodating grooves can be used for accommodating different types of line evaporation sources or different types of surface evaporation sources for cleaning, and at least one of the more than two accommodating grooves is matched with the pre-melting crucible with a preset size so as to be used for accommodating the pre-melting crucible for pre-melting treatment.
According to a first aspect of the invention, the first and second chambers each have an open end; the evaporation source cleaning equipment further comprises an air extractor which is correspondingly connected to the open end of the first cavity and the open end of the second cavity.
In a second aspect, the present invention provides an evaporation system, including: the coating solution device comprises a coating solution chamber and the coating solution source cleaning device of any one of the embodiments, wherein the coating solution source cleaning device is arranged outside the coating solution chamber.
In the embodiment of the invention, the evaporation source cleaning equipment comprises a first evaporation source heating unit and a second evaporation source heating unit which are arranged in a vacuum chamber, wherein the first evaporation source heating unit comprises a supporting part for placing at least one point evaporation source, and the first evaporation source heating unit can generate heat radiation to bake the point evaporation source placed on the supporting part so as to remove impurities of the point evaporation source and realize the cleaning of the point evaporation source; the second evaporation source heating unit comprises a containing groove used for containing a line evaporation source and a surface evaporation source, the containing groove can generate heat radiation to bake the line evaporation source or the surface evaporation source placed in the containing groove so as to remove impurities of the line evaporation source or the surface evaporation source, and the cleaning of the line evaporation source or the surface evaporation source is realized. Utilize the evaporation coating source cleaning equipment of this embodiment can get rid of the impurity in some evaporation coating source, line evaporation coating source and face evaporation coating source, can not cause the influence to the technology of evaporation coating cavity, and then can promote evaporation coating efficiency, promote the evaporation coating system and use the rate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an evaporation source cleaning apparatus according to an embodiment of the present invention;
fig. 2 is a structural view of an opening door of an evaporation source cleaning device according to an embodiment of the invention;
fig. 3 is a schematic structural view of a first evaporation source heating unit and a first heat dissipation device according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a second evaporation source heating unit and a third heat sink according to an embodiment of the present invention.
In the figure: 10-a first chamber; 11-a first evaporation source heating unit; 110-a support; 111-a support disk; 12-a first heat sink; 13-a second heat sink; 14-a first door; 20-a second chamber; 21-a second evaporation source heating unit; 211-a receiving groove; 22-a third heat sink; 23-a second door; 30-a heat insulation plate; 40-air extraction device.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order to avoid unnecessarily obscuring the present invention; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
The directional terms appearing in the following description are intended to be illustrative in all directions, and are not intended to limit the specific construction of embodiments of the present invention. In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as either a fixed connection, a removable connection, or an integral connection; can be directly connected or indirectly connected. The specific meaning of the above terms in the present invention can be understood as appropriate to those of ordinary skill in the art.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The embodiments will be described in detail below with reference to the accompanying drawings.
The vapor deposition source cleaning device and the vapor deposition system according to the embodiment of the present invention will be described in detail with reference to fig. 1 to 4.
Referring to fig. 1 to 4, fig. 1 is a schematic structural diagram of an evaporation source cleaning apparatus according to an embodiment of the present invention; FIG. 2 is a schematic structural diagram of an opening door of an evaporation source cleaning device according to an embodiment of the invention; fig. 3 is a schematic structural view of a first evaporation source heating unit and a first heat dissipation device according to an embodiment of the present invention; fig. 4 is a schematic structural view of a second evaporation source heating unit and a third heat sink according to an embodiment of the present invention. The evaporation source cleaning equipment at least comprises a vacuum chamber, a first evaporation source heating unit 11 and a second evaporation source heating unit 21 which are positioned in the vacuum chamber, wherein the first evaporation source heating unit 11 and the second evaporation source heating unit 21 are distributed at intervals so as to prevent the first evaporation source heating unit 11 and the second evaporation source heating unit 21 from influencing each other under the simultaneous working state.
The first evaporation source heating unit 11 includes a support portion 110, the support portion 110 is used for placing at least one dot evaporation source, and the first evaporation source heating unit 11 can generate heat radiation to bake and clean the dot evaporation source. It is to be understood that the dot evaporation source may include a heater of the dot evaporation source and a crucible of the dot evaporation source, and the first evaporation source heating unit 11 according to the embodiment of the present invention may clean the heater of the dot evaporation source or the crucible of the dot evaporation source.
The second evaporation source heating unit 21 includes at least one receiving groove 211 for receiving a line evaporation source or a surface evaporation source, and can generate heat radiation in the receiving groove 211 to bake the line evaporation source or the surface evaporation source received in the receiving groove 211 for cleaning. It is understood that the wire evaporation source may include a crucible of the wire evaporation source, which may be placed in the receiving groove 211 to be cleaned; the surface evaporation source may include a crucible of the surface evaporation source, and the crucible of the surface evaporation source may be placed in the receiving groove 211 to be cleaned.
In the embodiment of the invention, the chamber of the evaporation source cleaning equipment is in a vacuum state, the chamber can be pumped by the air pumping device to keep the chamber in the vacuum state, and impurities baked by the first evaporation source heating unit and the second evaporation source heating unit can be pumped out of the chamber in the air pumping process.
In the embodiment of the present invention, the evaporation source cleaning device includes a first evaporation source heating unit 11 and a second evaporation source heating unit 21 which are arranged in a vacuum chamber, wherein the first evaporation source heating unit 11 includes a support portion 110 for placing at least one point evaporation source, and the point evaporation source placed on the support portion 110 can be baked by generating heat radiation in the first evaporation source heating unit 11 to remove impurities of the point evaporation source, so as to clean the point evaporation source; the second evaporation source heating unit 21 includes a containing groove 211 for containing the line evaporation source or the surface evaporation source, and the containing groove 211 can generate heat radiation to bake the line evaporation source or the surface evaporation source contained therein to remove impurities of the line evaporation source or the surface evaporation source, thereby cleaning the line evaporation source or the surface evaporation source. Utilize the evaporation coating source cleaning equipment of this embodiment can get rid of the impurity in some evaporation coating source, line evaporation coating source and face evaporation coating source, can not cause the influence to the technology of evaporation coating cavity, and then can promote evaporation coating efficiency, promote the evaporation coating system and use the rate. And after the impurities of the point evaporation source, the line evaporation source and the surface evaporation source are removed through the evaporation source, the performance of an evaporation product can be improved during evaporation production, and the yield and the product performance of the product are further improved.
In some alternative embodiments, the vacuum chamber may include a first chamber 10 and a second chamber 20 which are isolated from each other, wherein the first evaporation source heating unit 11 is disposed in the first chamber 10, and the second evaporation source heating unit 21 is disposed in the second chamber 20, so as to further prevent heat generated when the two are operated simultaneously from affecting each other. Optionally, the first chamber 10 and the second chamber 20 may be isolated by an insulation board 30.
Referring to fig. 3, the supporting portion 110 of the first evaporation source heating unit 11 of the present embodiment includes a plurality of supporting plates 111 distributed in an array, and each supporting plate 111 can be provided with a point evaporation source. For example, the number of the supporting plates 111 may be four, and the four supporting plates 111 may be distributed in a rectangular shape, so as to save occupied space. Each support plate 111 of the present embodiment may be correspondingly provided with dot evaporation sources of different models, so as to ensure compatibility of the support plate 111.
In some alternative embodiments, the support plate 111 itself can generate heat radiation to clean the dot evaporation source disposed thereon, for example, a resistance wire may be disposed in the support plate 111, and the resistance wire is energized to generate heat radiation to bake the dot evaporation source for cleaning.
In other alternative embodiments, a plurality of current-carrying devices (not shown) may be disposed on the support plate 111, and the current-carrying devices may be electrically connected to the heaters of the dot evaporation sources, so that the heaters of the dot evaporation sources can generate heat radiation for cleaning, and the heaters of the dot evaporation sources may be powered to generate high temperature to remove impurities, and may also remove impurities from the crucibles of the dot evaporation sources placed in the heaters of the dot evaporation sources. In this embodiment, the cleaning of the spot deposition source itself is realized by using the heater of the existing spot deposition source, and the structure of the apparatus can be simplified. In this embodiment, in order to ensure that the heater of the point evaporation source can be quickly abutted to the heating device, a connecting structure matched with each other may be provided on the heating device and the heater of the point evaporation source, for example, a first positioning structure is provided on the power-on device, the first positioning structure may be one of a groove or a protrusion, a second positioning structure matched with the first positioning structure is provided on the heater of the point evaporation source, and the second positioning structure may be the other of the groove or the protrusion.
It will be appreciated that a controller is also provided in the first chamber 10 to control the current or voltage of the resistance wire provided on the support plate 111 and the energising means, and thus the heat radiating capacity thereof, so that the heat radiating capacity is within a desired range.
In some optional embodiments, a cylindrical first heat sink 12 is further disposed in the first chamber 10, the first heat sink 12 may be disposed on the supporting portion 110 and can surround the supporting plates 111, and one first heat sink 12 is disposed on each supporting plate 111. The point evaporation source is disposed on the corresponding support plate 111 and can be located in the first heat dissipation device 12, and is away from the inner surface of the first heat dissipation device 12 by a first preset distance.
The first heat sink 12 may be a double-layered tubular body having an interlayer, and a circulating cooling water pipeline arranged according to a predetermined rule is provided in the interlayer. The first preset distance can be set according to actual needs.
In this embodiment, the first cylindrical heat sink 12 can protect the structures inside the first chamber, and can prevent the vacuum environment inside the first chamber 10 from being damaged by high temperature generated by the support plate 111 inside the first heat sink or the heater located inside the first heat sink, and prevent other structures inside the first chamber 10 from being damaged by high temperature heat radiation. Furthermore, the heating uniformity of the crucible of the point evaporation source can be kept. In this embodiment, the first heat dissipation device 12 is spaced from the point evaporation source by a certain distance, so as to prevent the heating effect from being affected.
In some alternative embodiments, referring to fig. 2, a second heat dissipation device 13 is further disposed in the first chamber 10, and the second heat dissipation device 13 is connected to the inner surface of the first chamber 10 and covers the top of the first evaporation source heating unit 11. Alternatively, the second heat sink 13 may be covered on the top of the cylindrical first heat sink 12. The second heat dissipation device 13 covers the top of the tubular first heat dissipation device 12, and can dissipate heat from the top of the tubular first heat dissipation device 12 in the baking and cleaning process of the absorption point evaporation source, so that the heat dissipation function of the whole first chamber 10 can be improved, and the over-high temperature of the side wall of the first chamber 10 can be avoided.
Alternatively, the second heat sink 13 may be a plate-shaped structure provided with a circulating cooling water line.
In the above embodiment, the supporting portion 110 of the first evaporation source heating unit 11 may be fixed to the bottom of the first chamber 10 by a flange or the like, for example, to be isolated from the bottom of the first chamber 10, so as to prevent the point evaporation unit from being too close to the bottom of the first chamber 10, which may result in too high temperature at the bottom of the first chamber 10. The second heat sink 13 may be fixed to the inner surface of the first chamber 10 by a bolt or the like. However, the above-mentioned fixing structure is not limited to this, and other fixing structures may be adopted, and the present invention is not limited to this.
In some alternative embodiments, referring to fig. 2 and 4, a third heat dissipation device 22 is further disposed in the second chamber 20, and the third heat dissipation device 22 can be disposed around the receiving groove 211 and is spaced apart from the outer surface of the receiving groove 211 by a second predetermined distance.
In this embodiment, the second heat dissipation device 13 can protect the structures in the second chamber, and can prevent the vacuum environment inside the second chamber 20 from being damaged by the high temperature generated by the accommodating groove 211 inside the second chamber, so as to prevent other structures inside the second chamber 20 from being damaged by the high-temperature heat radiation. Furthermore, the uniformity of heating of the crucible of the wire evaporation source or the crucible of the surface evaporation source can be maintained. In this embodiment, the second heat dissipation device 13 is spaced from the line evaporation source or the surface evaporation source by a certain distance, so as to prevent the heating effect from being affected.
The third heat sink 22 may be a rectangular parallelepiped structure having an interlayer matching the shapes of the crucible of the line evaporation source and the crucible of the surface evaporation source, the rectangular parallelepiped structure having an open top, and the interlayer being provided with a circulating cooling water pipeline arranged according to a predetermined rule. The second preset distance can be set according to actual needs.
The receiving groove 211 may be formed by surrounding resistance wires in a regular arrangement, and the receiving groove 211 may be fixed to the inner surface of the third heat sink 22 by a connector and spaced from the inner surface of the third heat sink 22 by a second preset distance. The invention is not limited to the specific structure of the connecting member, and for example, the resistance wire may be fixed on the inner surface of the third heat sink 22 by a fixing block provided with a clamping groove.
It should be noted that the arrangement rule of the resistance wires can be set according to the shape of the crucible of the wire evaporation source or the shape of the crucible of the surface evaporation source, so that the crucible of the wire evaporation source and the crucible of the surface evaporation source can be better fixed.
In some optional embodiments, the number of the receiving grooves 211 may be two or more, and at least one of the two or more receiving grooves 211 may be set according to a maximum-sized crucible of the crucibles of the line evaporation sources and the crucibles of the surface evaporation sources used in the actual production process, so that the receiving grooves 211 may receive crucibles of different types of line evaporation sources and crucibles of different types of surface evaporation sources, so as to clean the crucibles of different types of line evaporation sources and the crucibles of different types of surface evaporation sources, and improve the versatility of the second evaporation source heating unit 21.
Further, at least one of the two or more receiving grooves 211 may be matched according to the size of the pre-melting crucible with a predetermined size used in the actual production process, so that the receiving groove 211 may just receive the pre-melting crucible with the predetermined size for the pre-melting treatment. In this embodiment, the pre-melting crucible with a predetermined size is just disposed in the corresponding receiving groove 211, so as to ensure the melting effect of the organic evaporation material in the pre-melting crucible. The organic evaporation materials are subjected to pre-melting treatment in the second chamber 20, and then the melted organic materials are sent into the evaporation chamber for evaporation process, so that the evaporation volume production requirement can be met, and the evaporation production time is prolonged. It should be noted that the arrangement of the resistance wires of the receiving groove 211 for placing the pre-melting crucible may be different from the arrangement of the resistance wires of the receiving groove 211 for performing the baking cleaning process, and the arrangement may be set according to the actual shape of the pre-melting crucible.
Alternatively, as shown in fig. 2 and 4, three receiving grooves 211 may be disposed in the second chamber 20, wherein one receiving groove 211 is used for thermally baking a crucible of a wire evaporation source or a crucible of a surface evaporation source, and the other two receiving grooves are used for placing a pre-melting crucible for pre-melting treatment.
In other alternative embodiments, two accommodating grooves 211 for thermal radiation cleaning may be disposed in the second chamber 20, and the two accommodating grooves 211 may respectively accommodate different types of line evaporation sources and different types of surface evaporation sources, so that the line evaporation sources and the surface evaporation sources may be cleaned simultaneously in the second chamber 20.
It is understood that a controller may be disposed in the second chamber 20 to control the current or voltage of the resistance wire of the receiving groove 211, so as to control the heat radiation capability thereof, so that the heat radiation capability is within a desired range.
In the above embodiment, a heat sink may be further disposed on the sidewall of the vacuum chamber to prevent the temperature of the sidewall of the vacuum chamber from being too high. The first chamber 10 is provided with a first openable and closable door 14 at a corresponding position, and the second chamber 20 is provided with a second openable and closable door 23 at a corresponding position.
In the above embodiment, the first chamber 10 and the second chamber 20 each have an open end, and the air-extracting device 40 is connected to each of the open end of the first chamber 10 and the open end of the second chamber 20, so as to maintain the vacuum environment inside the first chamber 10 and the second chamber 20, and to extract the impurities in the two chambers out of the chambers.
The evacuation device 40 of the embodiment of the present invention may include a cryopump, a dry pump and a compressor, wherein the cryopump is connected to the open ends of the two chambers, and the dry pump and the compressor are connected to the cryopump, and the vacuum environment in the chambers is maintained by the cooperation of the cryopump, the dry pump and the compressor.
The invention also provides an embodiment of an evaporation system, and the evaporation system comprises an evaporation chamber and the evaporation source cleaning equipment of the embodiment. Wherein, evaporation plating source cleaning equipment is located the evaporation chamber outside, can not exert an influence to the evaporation plating process of evaporation plating chamber, and evaporation plating source cleaning equipment toasts the cleanness as independent equipment to point evaporation plating source, line evaporation plating source and the evaporation plating source that evaporation plating process used in the evaporation plating chamber, can not influence the evaporation plating process, and the impurity that produces in toasting the process also can not exert an influence to the evaporation plating chamber.
Furthermore, the organic material can be pre-melted in the evaporation source cleaning equipment, and the organic material in a molten state is sent into the evaporation chamber for evaporation process, so that the evaporation efficiency can be improved.
Since the evaporation system of the embodiment of the present invention includes the evaporation source cleaning apparatus of the embodiment, the evaporation system further has the beneficial effects of the evaporation source cleaning apparatus of the embodiment, and details are not described herein.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. An evaporation source cleaning apparatus, comprising:
a vacuum chamber;
the first evaporation source heating unit (11) is arranged in the vacuum chamber, the first evaporation source heating unit (11) comprises a supporting part (110), the supporting part (110) is used for placing at least one point evaporation source, and the first evaporation source heating unit (11) can generate heat radiation to clean the point evaporation source;
the second evaporation source heating unit (21) is arranged in the vacuum chamber and is distributed at intervals with the first evaporation source heating unit (11), the second evaporation source heating unit (21) comprises at least one accommodating groove (211) for accommodating a line evaporation source or a surface evaporation source, the accommodating groove (211) can generate heat radiation to clean the line evaporation source or the surface evaporation source arranged in the accommodating groove (211), and the first evaporation source heating unit (11) and the second evaporation source heating unit (21) work simultaneously or alternately.
2. The evaporation source cleaning apparatus according to claim 1, wherein the vacuum chamber comprises a first chamber (10) and a second chamber (20) isolated from each other, the first evaporation source heating unit (11) is provided in the first chamber (10), and the second evaporation source heating unit (21) is provided in the second chamber (20).
3. The evaporation source cleaning apparatus according to claim 2, wherein the support (110) comprises a plurality of support plates (111) distributed in an array, each support plate (111) can be provided with one spot evaporation source, and the support plates (111) can generate heat radiation to clean the spot evaporation sources; or
The supporting plate (111) is provided with a plurality of electrifying devices which can be electrically connected with the heaters of the point evaporation sources so as to enable the heaters of the point evaporation sources to generate heat radiation for cleaning.
4. The evaporation source cleaning apparatus according to claim 3, wherein each support plate (111) can be provided with different types of point evaporation sources.
5. The evaporation source cleaning apparatus according to claim 3, wherein a first cylindrical heat sink (12) is further disposed in the first chamber (10), the first heat sink (12) is disposed on the support (110) and surrounds the support plate (111), and the point evaporation source can be located in the first heat sink (12) and is spaced from an inner surface of the first heat sink (12) by a first predetermined distance.
6. The evaporation source cleaning apparatus according to claim 2, wherein a second heat sink (13) is further provided in the first chamber (10), and the second heat sink (13) is attached to an inner surface of the first chamber (10) and covers a top of the first evaporation source heating unit (11).
7. The evaporation source cleaning apparatus according to claim 2, wherein a third heat sink (22) is further disposed in the second chamber (20), and the third heat sink (22) can be disposed around the accommodating groove (211) and is spaced from the outer surface of the accommodating groove (211) by a second predetermined distance.
8. The evaporation source cleaning apparatus according to claim 2, wherein the number of the receiving grooves (211) is two or more, at least one of the two or more receiving grooves (211) is capable of receiving different types of line evaporation sources or different types of surface evaporation sources for cleaning, and at least one of the two or more receiving grooves (211) is adapted to a pre-melting crucible having a predetermined size so as to receive the pre-melting crucible for pre-melting.
9. An evaporation source cleaning apparatus according to claim 2, wherein the first chamber (10) and the second chamber (20) each have an open end;
the evaporation source cleaning equipment further comprises a gas suction device (40), wherein the gas suction device (40) is correspondingly connected to the open end of the first chamber (10) and the open end of the second chamber (20).
10. An evaporation system, comprising:
an evaporation chamber;
the evaporation source cleaning apparatus according to any one of claims 1 to 9, which is disposed outside the evaporation chamber.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910459263.1A CN110016647B (en) | 2019-05-29 | 2019-05-29 | Evaporation source cleaning equipment and evaporation system |
| PCT/CN2019/119959 WO2020238080A1 (en) | 2019-05-29 | 2019-11-21 | Vapor deposition source cleaning device and vapor deposition system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910459263.1A CN110016647B (en) | 2019-05-29 | 2019-05-29 | Evaporation source cleaning equipment and evaporation system |
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| CN110016647A CN110016647A (en) | 2019-07-16 |
| CN110016647B true CN110016647B (en) | 2020-09-08 |
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| WO (1) | WO2020238080A1 (en) |
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| CN110016647B (en) * | 2019-05-29 | 2020-09-08 | 昆山国显光电有限公司 | Evaporation source cleaning equipment and evaporation system |
| CN114892139A (en) * | 2022-03-31 | 2022-08-12 | 宣城开盛新能源科技有限公司 | Method and device for controlling moisture and impurities of evaporation source material |
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| CN109072412A (en) * | 2017-03-17 | 2018-12-21 | 应用材料公司 | The equipment of vacuum processing for substrate, the system for manufacturing the device with organic material, the method for sealing against each other processing vacuum chamber and maintenance vacuum chamber |
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| CN110016647A (en) | 2019-07-16 |
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