CN110016230A - A kind of solderability conductive rubber and preparation method thereof - Google Patents

A kind of solderability conductive rubber and preparation method thereof Download PDF

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Publication number
CN110016230A
CN110016230A CN201910239170.8A CN201910239170A CN110016230A CN 110016230 A CN110016230 A CN 110016230A CN 201910239170 A CN201910239170 A CN 201910239170A CN 110016230 A CN110016230 A CN 110016230A
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conductive rubber
solderability
conductive
parts
rubber
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吴刚
林军
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Zhuomeicheng Electronic Technology (wuhan) Co Ltd
Shenzhen Tengshun Electronic Materials Co Ltd
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Zhuomeicheng Electronic Technology (wuhan) Co Ltd
Shenzhen Tengshun Electronic Materials Co Ltd
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Priority to CN201910239170.8A priority Critical patent/CN110016230A/en
Publication of CN110016230A publication Critical patent/CN110016230A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B05D7/16—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies using synthetic lacquers or varnishes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/548—Silicon-containing compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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Abstract

The invention discloses a kind of solderability conductive rubbers and preparation method thereof.The solderability conductive rubber includes that metal-based layer and the conductive rubber layer that the metal-based layer upper surface is arranged in, the conductive rubber layer material include: 100 parts of rubber matrix by weight, 5-500 parts of conductive filler, 0-20 parts of coupling agent, 1-10 parts of crosslinking agent, 1-10 parts of catalyst.By the way that above-mentioned specific conductive rubber composition growth to be made on metal base, which overcome conductive rubbers in the prior art not to have solderability, the problem of conductive rubber cohesive force difference in conjunction with metal material.Meanwhile the solderability conductive rubber prepared also has excellent electric property and mechanical performance.

Description

A kind of solderability conductive rubber and preparation method thereof
Technical field
The present invention relates to flexible conducting material technical field more particularly to a kind of solderability conductive rubber and its preparation sides Method.
Background technique
Conductive rubber is as a kind of flexible conducting material for having favorable elasticity ability, the elastomeric pad being made into or close Sealing plays more and more effects in fields such as electromagnetic shielding, conducting ground connection and electrostatic protections.
The mounting means of conductive rubber washer, gasket or sealing joint strip etc. is usually directly filled in groove, or passes through patch Attached double-sided adhesive, which is fixed on, needs position, or cooperates the structures such as special buckle to realize fixation.
Due to the characteristic of conductive rubber low-surface-energy, it is greater than 90 degree with the angle of wetting of metal scolding tin, almost without solderable Property.Therefore, washer, gasket made of conductive rubber material or sealing are fixed/installed the soldering of the modes such as SMT on PCB Adhesive tape etc. cannot achieve, and limit conductive rubber in the application in the field.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of solderability conductive rubber and its preparations Method, it is intended to solve the problems, such as that existing conductive rubber does not have solderability.
The technical proposal for solving the technical problem of the invention is as follows:
A kind of solderability conductive rubber, wherein including metal-based layer and the conductive rubber of the metal-based layer upper surface is set Glue-line, the conductive rubber layer material include: 100 parts of rubber matrix by weight, and 5-500 parts of conductive filler, coupling agent 0-20 parts, 1-10 parts of crosslinking agent, 1-10 parts of catalyst.
The solderability conductive rubber, wherein the conductive rubber layer material includes: rubber matrix by weight 100 parts, 50-150 parts of conductive filler, 5-15 parts of coupling agent, 5-8 parts of crosslinking agent, 5-8 parts of catalyst.
In the present invention, the rubber matrix can be selected from methyl vinyl silicone rubber, dimethyl silicone rubber, aminomethyl phenyl second At least one of alkenyl silicon rubber, eyeball silicon rubber and fluorine silicone rubber, such as methyl vinyl silicone rubber.Normal temperature cure technique , mainly sealed end of hydroxyl gathers two organo-siloxane, such as 107 glue.
In the present invention, conductive filler can be silver-colored glass, silver-colored aluminium, silver-bearing copper, silver-colored nickel and fine silver powder, nickel aluminium, nickel carbon, conductive carbon powder And the conductive materials such as carbon nanotube.
In the present invention, coupling agent be mainly used for increasing conductive filler and the metal materials such as rubber matrix and copper foil, aluminium foil it Between compatibility to making it combine closely.Its common molecular formula is RSiX, and wherein R is the nonhydrolyzable organic official of reactivity Energy base, such as epoxy group, vinyl, methacrylate etc., X is hydrolyzable groups, such as halogen, alkoxy, acyloxy Deng.
Specifically, the silane coupling agent can be selected from vinyltriethoxysilane (A151), vinyltrimethoxysilane (A171), vinyl three (beta-methoxy ethyoxyl) silane (A172) and γ mercaptopropyitrimethoxy silane (A189), γ-ammonia At least one of propyl-triethoxysilicane (KH-550) and n-octytriethoxysilane (A137).
In the present invention, the crosslinking agent (vulcanizing agent) can be selected from di-t-butyl peroxide (vulcanizing agent DTBP), peroxidating Diisopropylbenzene (DIPB) (vulcanizing agent DCP), 2,5- dimethyl -2,5- bis(t-butylperoxy) hexane (vulcanizing agent DBPMH).It can also select From MeSi (OAc) 3, methyl tri acetylacetonate oximino silane, methyl tricyclohexyltin amine base silane, methyl three (N- methyl vinyl amido) silicon Alkane, methyl three (isopropyl alkenyloxy group) silane, at least one of 3 and containing hydrogen silicone oil MeSi (ONEt2).
The solderability conductive rubber, wherein the catalyst is selected from metal organic acid, titanium complex, guanidine radicals silane At least one of with Pt catalyst.
The preparation method of any solderability conductive rubber, wherein comprising steps of
The rubber matrix, conductive filler, coupling agent, crosslinking agent and catalyst are mixed according to parts by weight, mixed Glue；
The epoxy glue is carried out squeezing on metal base to form conductive rubber layer, the conductive rubber layer is carried out at vulcanization Reason, is made the solderability conductive rubber.
The preparation method of any solderability conductive rubber, wherein comprising steps of
The rubber matrix, conductive filler, coupling agent, crosslinking agent and catalyst are mixed according to parts by weight, mixed Glue；
Organic solvent is added into the epoxy glue and mixes, obtains rubber compound slurry；
Rubber compound slurry coating is generated into conductive rubber layer on metal base, the conductive rubber layer is carried out at vulcanization Reason, is made the solderability conductive rubber.
The preparation method of the solderability conductive rubber, wherein give birth to rubber compound slurry coating on metal base It is specific to wrap the step of carrying out vulcanizing treatment to the conductive rubber layer, the solderability conductive rubber is made at conductive rubber layer It includes:
The rubber compound slurry is coated using dispenser, printing machine, calender or coating machine and generates conduction on metal base Rubber layer carries out vulcanizing treatment to the conductive rubber layer, the solderability conductive rubber is made, wherein curing time For 12-72h.
The preparation method of the solderability conductive rubber, wherein give birth to rubber compound slurry coating on metal base It is specific to wrap the step of carrying out vulcanizing treatment to the conductive rubber layer, the solderability conductive rubber is made at conductive rubber layer It includes:
The rubber compound slurry even application is generated by conductive rubber layer using spraying equipment on metal base, to the conduction Rubber layer carries out vulcanizing treatment, and the solderability conductive rubber is made.
The preparation method of the solderability conductive rubber, wherein the organic solvent is selected from toluene, dimethylbenzene, acetic acid second Ester, carbon tetrachloride, dimethyl carbonate and petroleum ether kind it is one or more.
The utility model has the advantages that solderability conductive rubber provided by the present invention, by by above-mentioned specific conductive rubber composition Growth is made on metal base, and which overcome conductive rubbers in the prior art not to have solderability, conductive rubber and metal material The problem of matter combination cohesive force difference.Meanwhile the solderability conductive rubber prepared also has excellent electric property and mechanicalness Energy.Mixture paste solderability conductive rubber composition as made from coating, available softer or compression performance are better Conductive rubber, the places such as frivolous structural member not high especially suitable for flatness precision.Hardness is minimum to accomplish Shore A 40, Compression ratio is up to 50%.
Detailed description of the invention
Fig. 1 is the flow chart of solderability conductive rubber preparation method in embodiment 1 provided by the present invention.
Fig. 2 is the flow chart of solderability conductive rubber preparation method in embodiment 2 provided by the present invention.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer and more explicit, right as follows in conjunction with drawings and embodiments The present invention is further described.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and do not have to It is of the invention in limiting.
Embodiment 1
1, conductive rubber layer, conductive rubber layer is grouped as by the group of following parts by weight in the present embodiment:
100 parts of methyl vinyl silicone rubber
300 parts of silver-colored glass
10 parts of γ mercaptopropyitrimethoxy silane (A189)
2 parts of 2,4- dichloro benzoyl peroxide (vulcanizing agent DCBP)
2, solderability conductive rubber, the solderability conductive rubber in the present embodiment includes metal-based layer, conductive rubber layer, conductive Rubber layer is made of said components.It is tin plating that material used in the metal-based layer can be metal copper foil, aluminium foil, tinfoil paper and copper Foil etc..
As shown in Figure 1, the preparation method of solderability conductive rubber includes the following steps:
S10, the rubber matrix, conductive filler, coupling agent, crosslinking agent and catalyst are mixed according to parts by weight, is obtained Epoxy glue；
S20, the epoxy glue is carried out squeezing on metal base to form conductive rubber layer, sulphur is carried out to the conductive rubber layer Change processing, is made the solderability conductive rubber.
Specifically, according to 100 parts of deal precise methyl vinyl silicone rubber, silver-colored 300 parts of glass, γ-mercaptopropyi 10 parts of trimethoxy silane (A189), 2 parts of 2,4- dichloro benzoyl peroxide (vulcanizing agent DCBP), are placed in kneading machine and are mixed Refining, control melting temperature are < 40 DEG C (30 DEG C), mixing time 60min, are uniformly mixed each component, place, obtain after slice Rubber compound.
It carries out molding on copper foil to the rubber compound using vulcanizing press and forms conductive rubber layer, then to conductive rubber Glue-line carries out post vulcanization processing, and can control molding temperature is 160 DEG C, and molding pressure is 25MPa or so, clamp time 10 The solderability conductive rubber is made in min.
The conductive rubber adhesive force of hyperplasia on metal base is tested using pull and push dynamometer, adhesive force is 160 N/ cm2.Have product binding force strong using mould pressing process production solderability conductive rubber, dimensionally stable, simple and effective feature.
Embodiment 2
1, conductive rubber layer, conductive rubber layer is grouped as by the group of following parts by weight in the present embodiment:
107 100 parts of glue
300 parts of nickel aluminium
10 parts of Methyl Hydrogen Polysiloxane Fluid
0.5 part of 2% chloroplatinic acid-aqueous isopropanol
2, solderability conductive rubber, the solderability conductive rubber in the present embodiment includes metal-based layer, conductive rubber layer, conductive Rubber layer is made of said components.It is tin plating that material used in the metal-based layer can be metal copper foil, aluminium foil, tinfoil paper and copper Foil etc..
As shown in Fig. 2, the preparation method of solderability conductive rubber includes the following steps:
S10, the rubber matrix, conductive filler, coupling agent, crosslinking agent and catalyst are mixed according to parts by weight, is obtained Epoxy glue；
Organic solvent is added in S20, Xiang Suoshu epoxy glue and mixes, obtains rubber compound slurry；
S30, rubber compound slurry coating is generated into conductive rubber layer on metal base, sulphur is carried out to the conductive rubber layer Change processing, is made the solderability conductive rubber.
Specifically, according to 100 parts of 107 glue of deal precise, 300 parts of nickel aluminium, 10 parts of Methyl Hydrogen Polysiloxane Fluid, 2% It 0.5 part of chloroplatinic acid-aqueous isopropanol, is placed in blender, controls mixing speed 300r/min, mixing time 60min makes Each component is uniformly mixed, and obtains rubber compound slurry.
The rubber compound slurry is coated on aluminium foil using dispenser, printing machine or coating machine, room temperature vulcanization molding, Continuous length solderability conductive rubber is made, wherein surface drying time 60min toasts 60min under the conditions of 160 DEG C.
The conductive rubber adhesive force of hyperplasia on metal base is tested using pull and push dynamometer, 145 N/ of adhesive force cm2.Have the characteristics that can to continuously generate using cladding process preparation solderability conductive rubber, is high-efficient.
Embodiment 3
1, conductive rubber layer, conductive rubber layer is grouped as by the group of following parts by weight in the present embodiment:
100 parts of ethenyl blocking fluorinated polysiloxane
15 parts of carbon nanotube (CNT)
5 parts of titanate coupling agent of n-octytriethoxysilane (A137)
3 parts of containing hydrogen silicone oil
0.1 part of chloroplatinic acid catalyst
2, solderability conductive rubber, the solderability conductive rubber in the present embodiment includes metal-based layer, conductive rubber layer, conductive Rubber layer is made of said components.Material used in the metal-based layer is tinfoil paper.
The preparation method of solderability conductive rubber includes the following steps:
According to parts by weight by the ethenyl blocking fluorinated polysiloxane, carbon nanotube (CNT), n-octytriethoxysilane (A137) titanate coupling agent, containing hydrogen silicone oil and chloroplatinic acid catalyst, which are placed in mixing apparatus, is mixed, and epoxy glue is obtained；
Epoxy glue spraying is formed into conductive rubber layer on metal base, vulcanizing treatment is carried out to the conductive rubber layer, The solderability conductive rubber is made.
Specifically, it according to deal precise each component, is placed in blender, controls mixing speed 600r/min, mix The refining time is 70min, is uniformly mixed each component, obtains rubber compound slurry.
Using high pressure painting equipment to the rubber compound slurry even application on tinfoil paper material, room temperature vulcanization molding, be made Thickness is less than the ultra-thin solderability conductive rubber of 0.5mm, wherein surface drying time 50min toasts 60min in 160C baking oven.
The conductive rubber adhesive force of hyperplasia on metal base is tested using pull and push dynamometer, 110 N/ of adhesive force cm2.Ultra-thin (thickness is less than 0.5mm) solderability conductive rubber can be prepared using spray coating method.
Embodiment 4
1, conductive rubber layer, the present embodiment conductive rubber layer are grouped as by the group of following parts by weight:
100 parts of methyl vinyl silicone rubber
500 parts of silver-colored glass
20 parts of γ mercaptopropyitrimethoxy silane (A189)
10 parts of 2,4- dichloro benzoyl peroxide (vulcanizing agent DCBP)
2, solderability conductive rubber, the solderability conductive rubber in the present embodiment includes metal-based layer, conductive rubber layer, conductive Rubber layer is made by above-mentioned conductive rubber composition.Material used in the metal-based layer can be metal copper foil, aluminium foil, tinfoil paper And copper plating tinfoil paper etc..
The preparation method of solderability conductive rubber includes the following steps:
According to parts by weight by the methyl vinyl silicone rubber, Yin Bo, γ mercaptopropyitrimethoxy silane (A189), 2,4- Dichloro benzoyl peroxide (vulcanizing agent DCBP), which is placed in mixing apparatus, to be mixed, and epoxy glue is obtained；
The epoxy glue is used into die pressing, conductive rubber layer is formed in the metal base, the conductive rubber layer is carried out The solderability conductive rubber is made in vulcanizing treatment.
Specifically, it according to deal precise each component, is placed in kneading machine and is kneaded, control melting temperature is 35 DEG C, mixing time 80min is uniformly mixed each component, places after slice, obtain rubber compound.
The rubber compound is pressed and molded on copper foil using vulcanizing press, then carries out post vulcanization, it can be with Controlling molding temperature is 180 DEG C, and molding pressure is 25MPa or so, and clamp time is 20 min, and the solderability conduction rubber is made Glue.
The conductive rubber adhesive force of hyperplasia on metal base is tested using pull and push dynamometer, adhesive force is 150 N/ cm2。
In conclusion the present invention provides a kind of solderability conductive rubbers and preparation method thereof.The present invention passes through will be above-mentioned Specific conductive rubber composition growth is made on metal base, and which overcome conductive rubbers in the prior art without solderable Property, the problem of conductive rubber cohesive force difference in conjunction with metal material.Meanwhile the solderability conductive rubber prepared also have it is excellent Electric property and mechanical performance, expanded conductive rubber part in the application range in the field PCB.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention Protect range.

Claims (9)

1. a kind of solderability conductive rubber, which is characterized in that including metal-based layer and be arranged in the metal-based layer upper surface Conductive rubber layer, the conductive rubber layer material includes: 100 parts of rubber matrix by weight, conductive filler 5-500 Part, 0-20 parts of coupling agent, 1-10 parts of crosslinking agent, 1-10 parts of catalyst.
2. solderability conductive rubber according to claim 1, which is characterized in that the conductive rubber layer material is by weight Meter includes: 100 parts of rubber matrix, and 50-150 parts of conductive filler, 5-15 parts of coupling agent, 5-8 parts of crosslinking agent, catalyst 5-8 Part.
3. solderability conductive rubber according to claim 1 to 2, which is characterized in that the coupling agent is selected from vinyl Triethoxysilane, vinyltrimethoxysilane, vinyl three (beta-methoxy ethyoxyl) silane, γ-mercaptopropyi trimethoxy At least one of base silane, gamma-aminopropyl-triethoxy-silane and n-octytriethoxysilane.
4. solderability conductive rubber according to claim 1 to 2, which is characterized in that the catalyst has selected from metal At least one of machine acid, titanium complex, guanidine radicals silane and Pt catalyst.
5. a kind of preparation method of the solderability conductive rubber as described in claim 1-4 is any, which is characterized in that comprising steps of
The rubber matrix, conductive filler, coupling agent, crosslinking agent and catalyst are mixed according to parts by weight, mixed Glue；
The epoxy glue is carried out squeezing on metal base to form conductive rubber layer, the conductive rubber layer is carried out at vulcanization Reason, is made the solderability conductive rubber.
6. a kind of preparation method of the solderability conductive rubber as described in claim 1-4 is any, which is characterized in that comprising steps of
The rubber matrix, conductive filler, coupling agent, crosslinking agent and catalyst are mixed according to parts by weight, mixed Glue；
Organic solvent is added into the epoxy glue and mixes, obtains rubber compound slurry；
Rubber compound slurry coating is generated into conductive rubber layer on metal base, the conductive rubber layer is carried out at vulcanization Reason, is made the solderability conductive rubber.
7. the preparation method of solderability conductive rubber according to claim 6, which is characterized in that the step is by the mixing The coating of rubber cement material generates conductive rubber layer on metal base, carries out vulcanizing treatment to the conductive rubber layer, be made it is described can Weldering property conductive rubber, specifically includes:
The rubber compound slurry is coated using dispenser, printing machine, calender or coating machine and generates conduction on metal base Rubber layer carries out vulcanizing treatment to the conductive rubber layer, the solderability conductive rubber is made, wherein curing time For 12-72h.
8. the preparation method of solderability conductive rubber according to claim 6, which is characterized in that the step is by the mixing The coating of rubber cement material generates conductive rubber layer on metal base, carries out vulcanizing treatment to the conductive rubber layer, be made it is described can Weldering property conductive rubber, specifically includes:
The rubber compound slurry even application is generated by conductive rubber layer using spraying equipment on metal base, to the conduction Rubber layer carries out vulcanizing treatment, and the solderability conductive rubber is made.
9. the preparation method of solderability conductive rubber according to claim 6, which is characterized in that the organic solvent is selected from first Benzene, dimethylbenzene, ethyl acetate, carbon tetrachloride, dimethyl carbonate and petroleum ether kind it is one or more.
CN201910239170.8A 2019-03-27 2019-03-27 A kind of solderability conductive rubber and preparation method thereof Pending CN110016230A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105131612A (en) * 2015-09-25 2015-12-09 深圳市博恩实业有限公司 Self-adhesive conductive silicone rubber electromagnetic shielding material
CN105400204A (en) * 2015-12-24 2016-03-16 平湖阿莱德实业有限公司 Electromagnetic shield and preparation method thereof
CN108424653A (en) * 2018-02-08 2018-08-21 东莞市雷兹盾电子材料有限公司 A kind of SMD conductive rubber compositions can be used for alternative metals shrapnel

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105131612A (en) * 2015-09-25 2015-12-09 深圳市博恩实业有限公司 Self-adhesive conductive silicone rubber electromagnetic shielding material
CN105400204A (en) * 2015-12-24 2016-03-16 平湖阿莱德实业有限公司 Electromagnetic shield and preparation method thereof
CN108424653A (en) * 2018-02-08 2018-08-21 东莞市雷兹盾电子材料有限公司 A kind of SMD conductive rubber compositions can be used for alternative metals shrapnel

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Application publication date: 20190716