CN104004458A - Bonding method - Google Patents
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- CN104004458A CN104004458A CN201410239825.9A CN201410239825A CN104004458A CN 104004458 A CN104004458 A CN 104004458A CN 201410239825 A CN201410239825 A CN 201410239825A CN 104004458 A CN104004458 A CN 104004458A
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Abstract
The invention discloses a bonding method comprising the following steps of firstly, enclosing on a to-be-glued surface of a first to-be-bonded part by using a high-temperature-resistant adhesive tape to form a closed bonding region; secondly, coating silicone gel to the bonding region to form an adhesive layer with uniform thickness in the bonding region, and enabling the thickness of the adhesive layer to be larger than the thickness of the high-temperature-resistant adhesive tape; thirdly, heating the adhesive layer to solidify a gel solution on the adhesive layer to obtain a solidified adhesive layer; and fourthly, tearing the high-temperature-resistant adhesive tape, and then, bonding a second to-be-bonded part with the first to-be-bonded part. According to the invention, the to-be-glued surface of the first to-be-bonded part is enclosed by using the high-temperature-resistant adhesive tape to form the closed bonding region, so that the adhesive coating range is limited, and furthermore, gel is accurately and rapidly coated.
Description
Technical field
The present invention relates to a kind of applying method; be particularly related to full attaching process between a kind of liquid crystal panel or liquid crystal module and cover sheet; or/and the full attaching process between cover sheet and touch sensor, or/and the full attaching process between liquid crystal panel or liquid crystal module and touch sensor.
Background technology
The use range of the product such as touch-screen mobile phone, panel computer is more and more extensive.In the structure of the product such as touch-screen mobile phone, panel computer, generally comprise cover sheet, liquid crystal panel (or liquid crystal module) and touch sensor, the general mode that adopts the tackiness agent of high-clarity to fit that interfixes between them.For example: publication No. is CN102622146, name is called the Chinese invention patent application of " a kind of capacitive touch screen and production method thereof ", announce a kind of capacitive touch screen structure, this capacitive touch screen has capacitive touch sensors, bonding layer, glass cover-plate and flexible printed circuit board, and it utilizes tackiness agent (bonding layer) by relative with glass cover-plate capacitive touch sensors fixing.Granted publication number is CN203232402, name is called the Chinese utility model patent of " a kind of OPS entirely fit capacitance plate ", a kind of OPS capacitance plate of entirely fitting is disclosed, comprise the touch-control module (touch sensor), tack coat and the liquid-crystal display module that are cascading, tack coat is glue or solid-state OCA optical cement.Touch-control module is seamless applying by tack coat and liquid-crystal display module.
When laminating, the solid-state glue laminating of the general OCA of employing or the liquid glue of LOCA are fitted.For example: publication No. is CN103660511, the Chinese invention patent application that name is called " applying method of capacitive touch screen " discloses a kind of applying method of capacitive touch screen, comprise between protection armourplate glass (cover plate) and touch pad (touch sensor), and/or applying method between touch pad and LCD MODULE, comprise the following steps: 1) according to the laminating size between protection armourplate glass and touch pad, formulate printing area; 2) determine web plate and the glue material of the printing of plastic emitting, require gel quantity even, glue mobility is even; 3) particularly at edge part, design the glue amount that remaining glue flows again, prevent that glue from overflowing at periphery; 4) binding face to protection armourplate glass, or the binding face of touch pad, or the binding face of LCD MODULE carries out brush coating; 5) control gel quantity, control rubber quality thickness; 6) laminating, vacuum pressed, UV light irradiation; 7) after sclerosis, complete printing attaching process.The shortcoming of the method is: production efficiency is general, and binding yield is poor, is generally 75%～90%, and cannot heavy industry, is only applicable to the laminating of small-medium size product, can not meet the demand of the full laminating of large size product.
Summary of the invention
The object of the invention is to provide the full applying method of a kind of liquid crystal module.
For achieving the above object, the technical solution used in the present invention is: 1, a kind of applying method, is characterized in that: comprise the following steps:
The first step: the high temperature resistant adhesive tape of glue-coated surface for the treatment of at the first parts to be fit encloses the closed stickup district of formation;
Second step: by glue-coating to described stickup district to form the adhesive-layer of an even thickness in described stickup district, and make the thickness of described adhesive-layer be greater than the thickness of described high temperature resistant adhesive tape; Described glue makes after being mixed according to the mass ratio of 1 ︰ 1 by A component and B component; Described A component is made up of the material of cutting stock weight part:
Base-material 60～95 weight parts;
Catalyzer 0.1～0.5 weight part;
Auxiliary material 5～40 weight parts;
Described catalyzer is platinum metal catalysts;
Described B component is made up of the material of cutting stock weight part:
Wherein, described base-material for meet general formula (1) compound, meet general formula (2) compound, meet the compound of general formula (3) and meet at least one in the compound of general formula (4);
In formula, R
1represent that carbonatoms is 1～6 alkyl; R
2, R
3, R
4represent that independently of one another carbonatoms is the alkylene that 1～6 alkyl or carbonatoms are 2～8; X=5～40, y=1～30;
In formula, a is more than or equal to 20, b and is more than or equal to 30;
In formula, c is more than or equal to 20, d and is more than or equal to 30, e and is more than or equal to 10;
In formula, f is more than or equal to 30, g and is more than or equal to 10, h and is more than or equal to 10, i and is more than or equal to 10;
Described linking agent is for meeting at least one in the compound of general formula (5);
In formula, R
8represent that carbonatoms is 1～6 alkyl; R
5, R
6, R
7represent that independently of one another carbonatoms is 1～6 alkyl or hydrogen base, and R
5, R
6and R
7in at least one be hydrogen base; J=10～30, k=1～10;
Described accessory package is containing meeting the MQ resin of general formula (6) or meeting the MQ resin of general formula (6) and the mixture of vinyl-terminated silicone fluid; Wherein, described MQ resin and vinyl-terminated silicone fluid mass ratio are between the two 0.3～0.4:0.6～0.7;
Described auxiliary material also comprises and meets the MT resin of general formula (7) or meet the MT resin of general formula (7) and the mixture of vinyl-terminated silicone fluid; Described MT resin and vinyl-terminated silicone fluid mass ratio are between the two 0.3～0.4:0.6～0.7;
(Me
3SiO
0.5)
l(R
9Me
2SiO
0.5)
m(SiO
2) (6)；
In formula, Me represent methylidene; R
9represent that carbonatoms is the alkylene that 1～6 alkyl, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl or carbonatoms are 2～7; L=0～1.5, m=0～1.5, and l+m=1.3～1.8;
Described auxiliary material also comprises adhesive accelerant, and this adhesive accelerant makes after being mixed by C component and D component, and described C component and D component mass ratio are between the two 10～90 ︰ 10～90; Described C component for meet general formula (7) compound, meet general formula (8) compound, meet the compound of general formula (9) and meet at least one in the compound of general formula (10); Described B component is for meeting at least one in the compound of general formula (11);
In formula, q=3～6, r=2～6, s=6～12, t=2～6, u=3～6, v=6～12, w=1～12.
Described inhibitor is alkynol compounds and contains at least one in alkylene annular siloxane oligopolymer.
The 3rd step: described adhesive-layer is heated so that the glue of described adhesive-layer solidifies and obtains solidifying adhesive-layer;
The 4th step: described high temperature resistant adhesive tape is removed, then by described the second parts to be fit and described the first parts laminating to be fit.
Preferred technical scheme is: in second step, after described adhesive-layer forms, described adhesive-layer is struck off, and unnecessary glue is scraped to described high temperature resistant adhesive tape.
Preferred technical scheme is: after described high temperature resistant adhesive tape is removed, and adhesive coating outside described curing adhesive-layer scope.
Preferred technical scheme is: described platinum metal catalysts is at least one in Platinic chloride, platinum-vinyl siloxane title complex, Platinic chloride and alkene complex and the platinum-olefin(e)complex of Platinic chloride, alcohol modification.
Preferred technical scheme is: described platinum metal catalysts is platinum-vinyl siloxane title complex.
Preferred technical scheme is: described inhibitor is selected from 3-methyl isophthalic acid-butine-3-alcohol, methylpentynol, 3,5-dimethyl-1-hexin-3-alcohol, 1-hexin base-1-hexalin, 3-Phenyl-1-butyn-3-ol, 2-methyl-3-butyne-2-alcohol and tetramethyl-tetrem thiazolinyl cyclotetrasiloxane, pyridine, unsaturated amides.
Preferred technical scheme is: described in the alkylene that meets in the compound of general formula (1) be vinyl, allyl group, butenyl, pentenyl, hexenyl or heptenyl.
Preferred technical scheme is: described in meet the R in the compound of general formula (1)
1and R
2represent methylidene, R
3and R
4represent vinyl, and contents of ethylene is 0.005～0.5wt%; The viscosity of the described compound that meets general formula (1) is 300～30000 centipoises;
Or, described in meet the R in the compound of general formula (1)
1represent methylidene, R
2, R
3and R
4represent vinyl, and contents of ethylene is 0.01～10%; The viscosity of the described compound that meets general formula (1) is 50～10000 centipoises;
Or, described in meet the R in the compound of general formula (1)
1, R
2and R
3represent methylidene, R
4represent vinyl, and contents of ethylene is 0.001～0.5%; The viscosity of the described compound that meets general formula (1) is 500～10000 centipoises.
Preferred technical scheme is: described in meet the R in the compound of general formula (5)
5and R
8represent methylidene, R
6and R
7represent hydrogen base, and described in meet the compound of general formula (5) hydrogen content be 0.005～1%; The viscosity of the described compound that meets general formula (5) is 5～200 centipoises;
Or, described in meet the R in the compound of general formula (5)
6, R
7and R
8represent methylidene, R
5represent hydrogen base, and described in meet the compound of general formula (5) hydrogen content be 0.005～2%; The viscosity of the described compound that meets general formula (5) is 10～100 centipoises;
Or, described in meet the R in the compound of general formula (5)
8represent methylidene, R
5, R
6and R
7represent hydrogen base, and described in meet the compound of general formula (5) hydrogen content be 0.001～10%; The viscosity of the described compound that meets general formula (5) is 10～300 centipoises.
Preferred technical scheme is: in described MQ resin, and R
9represent methylidene, the ratio of the M/Q of described MQ resin is 0.6～1.2;
Or, in described MQ resin, R
9represent vinyl, and the content of vinyl is less than or equal to 10w%.
Preferred technical scheme is: the ratio of the M/Q of described MQ resin is 0.8.
Preferred technical scheme is: the preparation method of described MT resin, comprises the following steps:
The first step: add dry toluene, dehydrated alcohol and organoalkoxysilane in reaction vessel, then under 50～70 DEG C of conditions, and under nitrogen protection, taking fluorine-containing methylsulfonic acid or fluorine-containing mesylate as catalyzer, to dripping acetic acid in described reaction vessel, described organoalkoxysilane is reacted with described acetic acid; Wherein, described organoalkoxysilane and acetic acid mol ratio is between the two 1 ︰ 0.95～1.2; Described organoalkoxysilane is selected from methyltrimethoxy silane, Union carbide A-162, methyl tripropoxy silane, dimethyldimethoxysil,ne, dimethyldiethoxysilane, ethyl trimethoxy silane, n-propyl Trimethoxy silane, isobutyl-Trimethoxy silane, isobutyl triethoxy silane, n-octyl triethoxyl silane, n-octyl Trimethoxy silane, trimethylammonium methoxy silane, trimethylethoxysilane, trimethylammonium methoxy silane.Described fluorine-containing methylsulfonic acid is trifluoromethanesulfonic acid.Described fluorine-containing mesylate is selected from that copper trifluoromethanesulfcomposite, silver trifluoromethanesulfonate, trifluoromethanesulfonic acid magnesium, trifluoromethanesulfonic acid zinc, trifluoromethanesulfonic acid are cuprous, trifluoromethanesulfonic acid cerium, trifluoromethanesulfonic acid samarium, trifluoromethanesulfonic acid europium, Ytterbiumtriflate, trifluoromethanesulfonic acid praseodymium, trifluoromethanesulfonic acid lanthanum, trifluoromethanesulfonic acid neodymium, trifluoromethanesulfonic acid erbium, trifluoromethanesulfonic acid dysprosium.
Second step: remove the solvent in described reaction vessel;
The 3rd step: under 80～100 DEG C of conditions, add tetramethyl-dihydro base sily oxide in described reaction vessel, and then drip acetic acid in described reaction vessel, fully obtain MT resin after reaction; Wherein, described tetramethyl-dihydro base sily oxide and organoalkoxysilane mol ratio are between the two 1 ︰ 0.45～0.55; Described acetic acid and organoalkoxysilane mol ratio is between the two 1 ︰ 0.9～1.2.The step that dewaters is: in described reaction vessel, add with the diacetyl oxide of the amounts such as tetramethyl-dihydro base sily oxide to absorb the water generating in the 3rd step.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1, the present invention encloses the closed stickup district of formation at the high temperature resistant adhesive tape of glue-coated surface for the treatment of of the first parts to be fit, to limit gluing scope, thereby makes gluing accurate, and speed is fast.
2, the thickness of adhesive-layer of the present invention is greater than the thickness of high temperature resistant adhesive tape, thereby can adjust easily the thickness of adhesive-layer.
3, the unnecessary glue of adhesive-layer of the present invention is scraped to high temperature resistant adhesive tape, thereby removes easily unnecessary glue.
4, the present invention's adhesive coating again outside curing adhesive-layer scope, thus make the first parts to be fit and the second parts to be fit bond strength between the two higher.
5, the present invention is the transparent AB silicon of dual composition addition type gel caking agent (hereinafter to be referred as silicon gel), glass, PC plate, PMMA are had to good cementability, and these materials is common used materials of touch-screen cover plate.Silicon gel has low cost and the characteristic such as technological operation is simple.Its specific refractory power, between 1.40～1.43, for colorless transparent gel body, light transmission rate are more than 92%, has certain elasticity and recovery, can resist external impact, and can keep lasting binding property.In room temperature or while heating, can be completely curing, there is good economy and reliability.
Brief description of the drawings
Accompanying drawing 1 is the first block diagram to be fit.
Accompanying drawing 2 is adhesive-layer formation schematic diagram.
Accompanying drawing 3 is fit-state schematic diagram.
In above accompanying drawing, 1, the first parts to be fit; 2, paste district; 3, high temperature resistant adhesive tape; 4, adhesive-layer; 5, the second parts to be fit.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described:
Embodiment: a kind of applying method
Shown in accompanying drawing 1～3, a kind of applying method, comprises the following steps:
The first step: the high temperature resistant adhesive tape 3 of glue-coated surface for the treatment of at the first parts 1 to be fit (glass cover-plate) encloses the closed stickup district 2 of formation;
Second step: by glue-coating to described stickup district 2 with in described stickup district 2, described glue is struck off, and unnecessary glue is scraped to described high temperature resistant adhesive tape, form like this adhesive-layer 4 of an even thickness, and make the thickness of described adhesive-layer 4 be greater than the thickness of described high temperature resistant adhesive tape 3; Described glue makes after being mixed according to the mass ratio of 1 ︰ 1 by A component and B component; Described A component is made up of the material of cutting stock weight part:
Base-material 60 weight parts;
Catalyzer 0.1 weight part;
Auxiliary material 5 weight parts;
Described catalyzer is Platinic chloride.
Described B component is made up of the material of cutting stock weight part:
Wherein, described base-material is for meeting the compound of general formula (1).
In formula, described in meet the R in the compound of general formula (1)
1and R
2represent methylidene, R
3and R
4represent vinyl, and contents of ethylene is 0.05wt%; The viscosity of the described compound that meets general formula (1) is 10000 centipoises.x＝10，y＝15。
Described linking agent meets the compound of general formula (5).
In formula, described in meet the R in the compound of general formula (5)
5and R
8represent methylidene, R
6and R
7represent hydrogen base, and described in meet the compound of general formula (5) hydrogen content be 0.05%; The viscosity of the described compound that meets general formula (5) is 90 centipoises; J=10, k=5.
Described accessory package is containing the MQ resin that meets general formula (6).
Described auxiliary material also comprises MT resin.
(Me
3SiO
0.5)
l(R
9Me
2SiO
0.5)
m(SiO
2) (6)；
In formula, Me represent methylidene; R
9represent methylidene; L=1, m=0.8, l+m=1.8; The ratio of the M/Q of described MQ resin is 0.8.
Described auxiliary material also comprises adhesive accelerant, and this adhesive accelerant makes after being mixed by C component and D component, and described C component and D component mass ratio are between the two 30 ︰ 70; Described C component is compound, the compound that meets general formula (8) that meets general formula (7), the mixture that the compound that meets general formula (9) and the compound that meets general formula (10) form; Described B component is for meeting the compound of general formula (11).
In formula, q=3, r=2, s=6, t=2, u=3, v=6, w=3.
Meet general formula (7) compound, meet general formula (8) compound, meet the compound of general formula (9) and the mass ratio that meets between the compound of general formula (10) is 1 ︰ 1 ︰ 1 ︰ 1.
The preparation method of adhesive accelerant: mix and get final product after C component and D component are weighed according to component.
The preparation method of MT resin, comprises the following steps:
The first step: add dry toluene, dehydrated alcohol and methyltrimethoxy silane in reaction vessel, then under 50～70 DEG C of conditions, and under nitrogen protection, specifically refer to that reaction vessel is placed under nitrogen atmosphere, temperature condition and nitrogen protection condition are indispensable, then in reaction vessel, first add trifluoromethanesulfonic acid as catalyzer, then make described methyltrimethoxy silane react and make intermediate product with described acetic acid to dripping acetic acid in described reaction vessel; Wherein, described methyltrimethoxy silane and acetic acid mol ratio is between the two 1 ︰ 1.
Second step: remove the solvent in described reaction vessel; Specifically heating evaporation of the method for desolvation.
The 3rd step: under 80～100 DEG C of conditions, in described reaction vessel, add tetramethyl-dihydro base sily oxide, and then drip acetic acid in described reaction vessel, the intermediate product reaction that acetic acid and the first step make generates silicon hydroxyl, and silicon hydroxyl is made MT resin by tetramethyl-dihydro base sily oxide end-blocking; After cooling, washing, distillation, obtain pure MT silicone resin again.Wherein, described tetramethyl-dihydro base sily oxide and methyltrimethoxy silane mol ratio are between the two 1 ︰ 0.5; Described acetic acid and methyltrimethoxy silane mol ratio is between the two 1 ︰ 1.
The simplification two dimensional structure formula of the MT resin making is as follows, does not draw part for repeating silica structure unit.
The simplification of the MT resin making is three-dimensional as follows:
In described auxiliary material, the mass ratio meeting between MQ resin, MT resin and the adhesive accelerant three of general formula (6) is 1 ︰ 1 ︰ 0.3.
The preparation method of transparent organic silicon gel caking agent is: take respectively the each raw material in above-mentioned weight range, add in stirrer, being evacuated to vacuum tightness is-0.1～-0.05MPa, adopt 50～500 revs/min of dispersators to stir 0.5～3 hour, after stirring, filling and sealing is preserved and is obtained described AB component silicon gel respectively.
Transparent organic silicon gel caking agent for the optics making: appearance colorless is transparent, within the scope of 400-700nm, transmittance reaches 97% (adopting ultraviolet spectrophotometer to record).Basic color parameter L is that 90.2, a is that-2.01, b is 0.62, after two 85 experiments (85 DEG C and 85% humidity condition) and cold shock testing variation very little, not xanthochromia.Mechanical property: tensile strength 0.3MPa; Having good bond strength, is 0.4KN/m for 180 ° of stripping strengths of glass, and lap shear strength reaches 1.0MPa, and flame retardant properties is good, reaches UL94-V0.Specific refractory power 1.42.
The 3rd step: described adhesive-layer 4 is heated so that the glue of described adhesive-layer 4 solidifies and obtains solidifying the 3rd step: described adhesive-layer 4 is heated so that the glue of described adhesive-layer 4 solidifies and obtains solidifying adhesive-layer; Specifically the first parts 1 to be fit (glass cover-plate) are moved to baking oven, then heat so that glue solidifies, because there is the existence of heating steps, therefore need adhesive tape to have high temperature resistant.Because the temperature that glue is heating and curing is very wide, the temperature resistant range of high temperature resistant adhesive tape is very wide, can the using of 50 DEG C～150 DEG C of temperature resistant ranges.Can use publication number to be: CN103589362, name is called disclosed adhesive tape in " a kind of high temperature resistant adhesive tape ".
The 4th step: described high temperature resistant adhesive tape 3 is removed, then described the second parts 5 to be fit (liquid crystal panel) and described the first parts 1 to be fit are fitted.
Be preferred embodiment: after described high temperature resistant adhesive tape is removed, adhesive coating outside described curing adhesive-layer scope.
In other embodiments, the first parts 1 to be fit are liquid crystal panel, and the second parts 5 to be fit are cover sheet, and mode of the present invention can be used for cover sheet and the touch sensor of fitting, and also can be used for liquid crystal module and the touch sensor of fitting.Or fit successively cover sheet, touch sensor and liquid crystal module, to realize the full laminating of product.
Embodiment bis-～eight: a kind of applying method
Laminating step is with embodiment mono-, and difference is glue: glue makes after being mixed according to the mass ratio of 1 ︰ 1 by A component and B component.
The A component allocation sheet of embodiment bis-～six is as follows:
| Base-material | Catalyzer | Auxiliary material | |
| Embodiment bis- | 85 weight parts | 0.2 weight part | 25 weight parts |
| Embodiment tri- | 95 weight parts | 0.3 weight part | 15 weight parts |
| Embodiment tetra- | 90 weight parts | 0.5 weight part | 20 weight parts |
| Embodiment five | 67 weight parts | 0.1 weight part | 5 weight parts |
| Embodiment six | 85 weight parts | 0.15 weight part | 30 weight parts |
The B component allocation sheet of embodiment bis-～six is as follows:
| Base-material | Linking agent | Inhibitor | Auxiliary material | |
| Embodiment bis- | 65 weight parts | 7 weight parts | 0.1 weight part | 2 weight parts |
| Embodiment tri- | 85 weight parts | 13 weight parts | 0.2 weight part | 5 weight parts |
| Embodiment tetra- | 70 weight parts | 9 weight parts | 0.1 weight part | 10 weight parts |
| Embodiment five | 69 weight parts | 5 weight parts | 0.25 weight part | 8 weight parts |
| Embodiment six | 90 weight parts | 18 weight parts | 0.5 weight part | 15 weight parts |
1, the base-material that the A component of embodiment bis-～six uses:
Embodiment bis-: meet the compound of general formula (1) and meet the compound of general formula (2) according to the mass ratio mixing of 1 ︰ 1.In general formula (1), R
1represent methylidene; R
2, R
3, R
4represent vinyl; X=20, y=20; The viscosity of the described compound that meets general formula (1) is 7000 centipoises; In general formula (2), a equals 20, b and equals 30.
Embodiment tri-: meet the compound of general formula (3), in general formula (3), c equals 20, d and equals 30, e and equal 10.
Embodiment tetra-: meet the compound of general formula (2) and meet the compound of general formula (4) according to the mass ratio mixing of 1 ︰ 1.5.In general formula (2), a equals 20, b and equals 35, and in general formula (4), in formula, f equals 30, g and equals 10, h and equal 10, i and equal 10.
Embodiment five: meet the compound of general formula (1), the compound that meets general formula (2), the compound that meets the compound of general formula (3) and meet general formula (4) according to the mixture of the mass ratio composition of 1 ︰ 0.5 ︰ 1.5 ︰ 1.In general formula (1), R
1, R
2and R
3represent methylidene, R
4represent vinyl, and contents of ethylene is 0.05%; The viscosity of the described compound that meets general formula (1) is 6500 centipoises.In general formula (2), a equals 25, b and equals 30.In general formula (3), c equals 22, d and equals 30, e and equal 15.In general formula (4), f equals 30, g and equals 15, h and equal 10, i and equal 20.
Embodiment six: meet the compound of general formula (2), the compound that meets the compound of general formula (3) and meet general formula (4) according to the mixture of the mass ratio composition of 0.8 ︰ 0.5 ︰ 1.In general formula (2), a equals 25, b and equals 30.In general formula (3), c equals 22, d and equals 30, e and equal 15.In general formula (4), f equals 30, g and equals 15, h and equal 10, i and equal 20.
2, the catalyzer that the A component of embodiment bis-～six uses:
Embodiment bis-: the Platinic chloride of alcohol modification.
Embodiment tri-: platinum-vinyl siloxane title complex.
Embodiment tetra-: Platinic chloride.
Embodiment five: the Platinic chloride of alcohol modification and platinum-vinyl siloxane title complex are according to the mixture of the mass ratio composition of 1 ︰ 1.
Embodiment six: Platinic chloride.
3, the auxiliary material that the A component of embodiment bis-～six uses:
Embodiment bis-: the mass ratio meeting between MQ resin, MT resin and the adhesive accelerant three of general formula (6) is 1 ︰ 1 ︰ 1.In described MQ resin, R
9represent vinyl, and the content 4w% of vinyl.a＝1、b＝0.6。M/Q ratio is 0.8.The preparation method of MT resin: the first step: add dry toluene, dehydrated alcohol and dimethyldiethoxysilane in reaction vessel, then under 50～70 DEG C of conditions, and under nitrogen protection, specifically refer to that reaction vessel is placed under nitrogen atmosphere, temperature condition and nitrogen protection condition are indispensable, then in reaction vessel, first add trifluoromethanesulfonic acid zinc as catalyzer, then make described dimethyldiethoxysilane react and make intermediate product with described acetic acid to dripping acetic acid in described reaction vessel; Wherein, described dimethyldiethoxysilane and acetic acid mol ratio is between the two 1 ︰ 1.1.
Second step: remove the solvent in described reaction vessel; Specifically heating evaporation of the method for desolvation.
The 3rd step: under 80～100 DEG C of conditions, in described reaction vessel, add tetramethyl-dihydro base sily oxide, and then drip acetic acid in described reaction vessel, the intermediate product reaction that acetic acid and the first step make generates silicon hydroxyl, and silicon hydroxyl is made MT resin by tetramethyl-dihydro base sily oxide end-blocking.In described reaction vessel, add with the diacetyl oxide of the amounts such as tetramethyl-dihydro base sily oxide to absorb the water generating in the 3rd step.After cooling, washing, distillation, obtain pure MT silicone resin again.Wherein, described tetramethyl-dihydro base sily oxide and dimethyldiethoxysilane mol ratio are between the two 1 ︰ 0.52; Described acetic acid and dimethyldiethoxysilane mol ratio is between the two 1 ︰ 1.05.
Embodiment tri-: the mass ratio meeting between MQ resin, MT resin and the adhesive accelerant three of general formula (6) is 1 ︰ 0.5 ︰ 1.In described MQ resin, R
9represent ethyl.a＝0.6、b＝0.8。M/Q ratio is 0.7.The preparation method of MT resin is with embodiment mono-.
Embodiment tetra-: the mass ratio meeting between MQ resin, MT resin and the adhesive accelerant three of general formula (6) is 0.5 ︰ 1 ︰ 1.In described MQ resin, R
9represent cyclopentyl.a＝0.3、b＝1。M/Q ratio is 0.9.The preparation method of MT resin: the first step: to the mixture that adds dry toluene, dehydrated alcohol, n-propyl Trimethoxy silane and methyl tripropoxy silane in reaction vessel, n-propyl Trimethoxy silane and methyl tripropoxy silane mass ratio are between the two 1 ︰ 1.Then under 50～70 DEG C of conditions, and under nitrogen protection, specifically refer to that reaction vessel is placed under nitrogen atmosphere, temperature condition and nitrogen protection condition are indispensable, then in reaction vessel, first add trifluoromethanesulfonic acid praseodymium as catalyzer, then make the mixture of described n-propyl Trimethoxy silane and methyl tripropoxy silane react and make intermediate product with described acetic acid to dripping acetic acid in described reaction vessel; Wherein, the mixture of described n-propyl Trimethoxy silane and methyl tripropoxy silane and acetic acid mol ratio are between the two 1 ︰ 1.1.
Second step: remove the solvent in described reaction vessel; Specifically heating evaporation of the method for desolvation.
The 3rd step: under 80～100 DEG C of conditions, in described reaction vessel, add tetramethyl-dihydro base sily oxide, and then drip acetic acid in described reaction vessel, the intermediate product reaction that acetic acid and the first step make generates silicon hydroxyl, and silicon hydroxyl is made MT resin by tetramethyl-dihydro base sily oxide end-blocking.In described reaction vessel, add with the diacetyl oxide of the amounts such as tetramethyl-dihydro base sily oxide to absorb the water generating in the 3rd step.After cooling, washing, distillation, obtain pure MT silicone resin again.Wherein, the mixture of described tetramethyl-dihydro base sily oxide and n-propyl Trimethoxy silane and methyl tripropoxy silane mol ratio is between the two 1 ︰ 0.5; The mixture of described acetic acid and n-propyl Trimethoxy silane and methyl tripropoxy silane mol ratio is between the two 1 ︰ 1.
Embodiment five: the mass ratio meeting between MQ resin, MT resin and the adhesive accelerant three of general formula (6) is 0.5 ︰ 0.8 ︰ 1.In described MQ resin, R
9represent propenyl.a＝0.2、b＝1.1。M/Q ratio is 1.2.The preparation method of MT resin: the first step: add dry toluene in reaction vessel, dehydrated alcohol and trimethylethoxysilane, then under 50～70 DEG C of conditions, and under nitrogen protection, specifically refer to that reaction vessel is placed under nitrogen atmosphere, temperature condition and nitrogen protection condition are indispensable, then in reaction vessel, first add Ytterbiumtriflate and copper trifluoromethanesulfcomposite as catalyzer (Ytterbiumtriflate and copper trifluoromethanesulfcomposite mass ratio is between the two 1 ︰ 1), then make described trimethylethoxysilane react and make intermediate product with described acetic acid to dripping acetic acid in described reaction vessel, wherein, described trimethylethoxysilane and acetic acid mol ratio is between the two 1 ︰ 1.1.
Second step: remove the solvent in described reaction vessel; Specifically heating evaporation of the method for desolvation.
The 3rd step: under 80～100 DEG C of conditions, in described reaction vessel, add tetramethyl-dihydro base sily oxide, and then drip acetic acid in described reaction vessel, the intermediate product reaction that acetic acid and the first step make generates silicon hydroxyl, and silicon hydroxyl is made MT resin by tetramethyl-dihydro base sily oxide end-blocking.In described reaction vessel, add with the diacetyl oxide of the amounts such as tetramethyl-dihydro base sily oxide to absorb the water generating in the 3rd step.After cooling, washing, distillation, obtain pure MT silicone resin again.Wherein, described tetramethyl-dihydro base sily oxide and trimethylethoxysilane mol ratio are between the two 1 ︰ 0.55; Described acetic acid and trimethylethoxysilane mol ratio is between the two 1 ︰ 1.
Embodiment six: the mass ratio meeting between MQ resin, MT resin and the adhesive accelerant three of general formula (6) is 0.7 ︰ 0.8 ︰ 1.In described MQ resin, R
9represent butyl.a＝1、b＝0.3。M/Q ratio is 0.9.MT resin adopts prior art to make, and being specially date of publication is on January 16th, 2013, and publication No. is CN102875810A, and name is called the disclosed technical scheme of Chinese invention patent of " a kind of containing phenyl MT type resin and preparation method thereof ".
Adhesive accelerant in the auxiliary material that the A component of embodiment bis-～six uses, its composition of raw materials sees the following form:
Note: embodiment bis-: C component and D component mass ratio are between the two 90 ︰ 10.
Embodiment tri-: C component and D component mass ratio are between the two 40 ︰ 60.Meeting the compound of general formula (2), the compound that meets general formula (3), the mass ratio meeting between the compound three of general formula (4) is 1 ︰ 2 ︰ 1.
Embodiment tetra-: C component and D component mass ratio are between the two 50 ︰ 50.The compound that meets the compound of general formula (2) and meet general formula (4) mass ratio is between the two 1 ︰ 2.
Embodiment five: it is 45 ︰ 55 that C component and D component are divided mass ratio between the two.The compound that meets the compound of general formula (1) and meet general formula (3) mass ratio is between the two 1 ︰ 1.
Embodiment six: C component and D component mass ratio are between the two 20 ︰ 80.The mass ratio meeting between the compound three that the compound of general formula (1), the compound that meets general formula (2) meet general formula (4) is 1 ︰ 1 ︰ 1.
4, the base-material that the B component of embodiment bis-～six uses:
Embodiment bis-: meet the compound of general formula (1) and meet the compound of general formula (2) according to the mass ratio mixing of 1 ︰ 1.In general formula (1), R
1represent methylidene; R
2, R
3, R
4represent vinyl; X=20, y=20; The viscosity of the described compound that meets general formula (1) is 7000 centipoises; In general formula (2), a equals 20, b and equals 30.
Embodiment tri-: meet the compound of general formula (2) and meet the compound of general formula (4) according to the mass ratio mixing of 1 ︰ 1.5.In general formula (2), a equals 20, b and equals 35, and in general formula (4), in formula, f equals 30, g and equals 10, h and equal 10, i and equal 10.
Embodiment tetra-: meet the compound of general formula (3), in general formula (3), c equals 20, d and equals 30, e and equal 10.
Embodiment five: meet the compound of general formula (1), the compound that meets general formula (2), the compound that meets the compound of general formula (3) and meet general formula (4) according to the mixture of the mass ratio composition of 1 ︰ 0.5 ︰ 1.5 ︰ 1.In general formula (1), R
1, R
2and R
3represent methylidene, R
4represent vinyl, and contents of ethylene is 0.05%; The viscosity of the described compound that meets general formula (1) is 6500 centipoises.In general formula (2), a equals 25, b and equals 30.In general formula (3), c equals 22, d and equals 30, e and equal 15.In general formula (4), f equals 30, g and equals 15, h and equal 10, i and equal 20.
Embodiment six: meet the compound of general formula (2), the compound that meets the compound of general formula (3) and meet general formula (4) according to the mixture of the mass ratio composition of 0.8 ︰ 0.5 ︰ 1.In general formula (2), a equals 25, b and equals 30.In general formula (3), c equals 22, d and equals 30, e and equal 15.In general formula (4), f equals 30, g and equals 15, h and equal 10, i and equal 20.
5, the linking agent that the B component of embodiment bis-～six uses:
Embodiment bis-: described in meet the R in the compound of general formula (5)
5and R
8represent methylidene, R
6and R
7represent hydrogen base, j=12, k=1.The viscosity of the described compound that meets general formula (5) is 100 centipoises.
Embodiment tri-: described in meet the R in the compound of general formula (5)
6, R
7and R
8represent methylidene, R
5represent hydrogen base, j=30, k=10.The viscosity of the described compound that meets general formula (5) is 80 centipoises;
Embodiment tetra-: described in meet the R in the compound of general formula (5)
8represent methylidene, R
5, R
6and R
7represent hydrogen base, j=15, k=10.And described in meet the compound of general formula (5) hydrogen content be 3%; The viscosity of the described compound that meets general formula (5) is 200 centipoises.
Embodiment five: with embodiment tetra-.
Embodiment six: with embodiment tri-.
6, the inhibitor that the B component of embodiment bis-～six uses:
Embodiment bis-: tetramethyl-tetrem thiazolinyl cyclotetrasiloxane.
Embodiment tri-: 3-Phenyl-1-butyn-3-ol.
Embodiment tetra-: 5-dimethyl-1-hexin-3-alcohol.
Embodiment five: 3-methyl isophthalic acid-butine-3-alcohol and 2-methyl-3-butyne-2-alcohol are according to the mixture of the mass ratio composition of 1 ︰ 1.
Embodiment six: methylpentynol.
Embodiment bis-: the mass ratio meeting between MQ resin, MT resin and the adhesive accelerant three of general formula (6) is 1 ︰ 1 ︰ 1.In described MQ resin, R
9represent vinyl, and the content 4w% of vinyl.a＝1、b＝0.6。M/Q ratio is 0.8.The preparation method of MT resin: the first step: add dry toluene, dehydrated alcohol and dimethyldiethoxysilane in reaction vessel, then under 50～70 DEG C of conditions, and under nitrogen protection, specifically refer to that reaction vessel is placed under nitrogen atmosphere, temperature condition and nitrogen protection condition are indispensable, then in reaction vessel, first add trifluoromethanesulfonic acid zinc as catalyzer, then make described dimethyldiethoxysilane react and make intermediate product with described acetic acid to dripping acetic acid in described reaction vessel; Wherein, described dimethyldiethoxysilane and acetic acid mol ratio is between the two 1 ︰ 1.1.
Second step: remove the solvent in described reaction vessel; Specifically heating evaporation of the method for desolvation.
The 3rd step: under 80～100 DEG C of conditions, in described reaction vessel, add tetramethyl-dihydro base sily oxide, and then drip acetic acid in described reaction vessel, the intermediate product reaction that acetic acid and the first step make generates silicon hydroxyl, and silicon hydroxyl is made MT resin by tetramethyl-dihydro base sily oxide end-blocking.In described reaction vessel, add with the diacetyl oxide of the amounts such as tetramethyl-dihydro base sily oxide to absorb the water generating in the 3rd step.After cooling, washing, distillation, obtain pure MT silicone resin again.Wherein, described tetramethyl-dihydro base sily oxide and dimethyldiethoxysilane mol ratio are between the two 1 ︰ 0.52; Described acetic acid and dimethyldiethoxysilane mol ratio is between the two 1 ︰ 1.05.
Embodiment tri-: the mass ratio meeting between MQ resin, MT resin and the adhesive accelerant three of general formula (6) is 0.7 ︰ 0.8 ︰ 1.In described MQ resin, R
9represent butyl.a＝1、b＝0.3。M/Q ratio is 0.9.MT resin adopts prior art to make, and being specially date of publication is on January 16th, 2013, and publication No. is CN102875810A, and name is called the disclosed technical scheme of Chinese invention patent of " a kind of containing phenyl MT type resin and preparation method thereof ".
Embodiment tetra-: the mass ratio meeting between MQ resin, MT resin and the adhesive accelerant three of general formula (6) is 0.5 ︰ 1 ︰ 1.In described MQ resin, R
9represent cyclopentyl.a＝0.3、b＝1。M/Q ratio is 0.9.The preparation method of MT resin: the first step: to the mixture that adds dry toluene, dehydrated alcohol, n-propyl Trimethoxy silane and methyl tripropoxy silane in reaction vessel, n-propyl Trimethoxy silane and methyl tripropoxy silane mass ratio are between the two 1 ︰ 1.Then under 50～70 DEG C of conditions, and under nitrogen protection, specifically refer to that reaction vessel is placed under nitrogen atmosphere, temperature condition and nitrogen protection condition are indispensable, then in reaction vessel, first add trifluoromethanesulfonic acid praseodymium as catalyzer, then make the mixture of described n-propyl Trimethoxy silane and methyl tripropoxy silane react and make intermediate product with described acetic acid to dripping acetic acid in described reaction vessel; Wherein, the mixture of described n-propyl Trimethoxy silane and methyl tripropoxy silane and acetic acid mol ratio are between the two 1 ︰ 1.1.
Second step: remove the solvent in described reaction vessel; Specifically heating evaporation of the method for desolvation.
The 3rd step: under 80～100 DEG C of conditions, in described reaction vessel, add tetramethyl-dihydro base sily oxide, and then drip acetic acid in described reaction vessel, the intermediate product reaction that acetic acid and the first step make generates silicon hydroxyl, and silicon hydroxyl is made MT resin by tetramethyl-dihydro base sily oxide end-blocking.In described reaction vessel, add with the diacetyl oxide of the amounts such as tetramethyl-dihydro base sily oxide to absorb the water generating in the 3rd step.After cooling, washing, distillation, obtain pure MT silicone resin again.Wherein, the mixture of described tetramethyl-dihydro base sily oxide and n-propyl Trimethoxy silane and methyl tripropoxy silane mol ratio is between the two 1 ︰ 0.5; The mixture of described acetic acid and n-propyl Trimethoxy silane and methyl tripropoxy silane mol ratio is between the two 1 ︰ 1.
Embodiment five: the mass ratio meeting between MQ resin, MT resin and the adhesive accelerant three of general formula (6) is 0.5 ︰ 0.8 ︰ 1.In described MQ resin, R
9represent propenyl.a＝0.2、b＝1.1。M/Q ratio is 1.2.The preparation method of MT resin: the first step: add dry toluene in reaction vessel, dehydrated alcohol and trimethylethoxysilane, then under 50～70 DEG C of conditions, and under nitrogen protection, specifically refer to that reaction vessel is placed under nitrogen atmosphere, temperature condition and nitrogen protection condition are indispensable, then in reaction vessel, first add Ytterbiumtriflate and copper trifluoromethanesulfcomposite as catalyzer (Ytterbiumtriflate and copper trifluoromethanesulfcomposite mass ratio is between the two 1 ︰ 1), then make described trimethylethoxysilane react and make intermediate product with described acetic acid to dripping acetic acid in described reaction vessel, wherein, described trimethylethoxysilane and acetic acid mol ratio is between the two 1 ︰ 1.1.
Second step: remove the solvent in described reaction vessel; Specifically heating evaporation of the method for desolvation.
The 3rd step: under 80～100 DEG C of conditions, in described reaction vessel, add tetramethyl-dihydro base sily oxide, and then drip acetic acid in described reaction vessel, the intermediate product reaction that acetic acid and the first step make generates silicon hydroxyl, and silicon hydroxyl is made MT resin by tetramethyl-dihydro base sily oxide end-blocking.In described reaction vessel, add with the diacetyl oxide of the amounts such as tetramethyl-dihydro base sily oxide to absorb the water generating in the 3rd step.After cooling, washing, distillation, obtain pure MT silicone resin again.Wherein, described tetramethyl-dihydro base sily oxide and trimethylethoxysilane mol ratio are between the two 1 ︰ 0.55; Described acetic acid and trimethylethoxysilane mol ratio is between the two 1 ︰ 1.
Embodiment six: the mass ratio meeting between MQ resin, MT resin and the adhesive accelerant three of general formula (6) is 1 ︰ 0.5 ︰ 1.In described MQ resin, R
9represent ethyl.a＝0.6、b＝0.8。M/Q ratio is 0.7.The preparation method of MT resin is with embodiment mono-.
Adhesive accelerant in the auxiliary material that the B component of embodiment bis-～six uses, its composition of raw materials sees the following form:
Note: embodiment bis-: C component and D component mass ratio are between the two 90 ︰ 10.
Embodiment tri-: C component and D component mass ratio are between the two 40 ︰ 60.Meeting the compound of general formula (2), the compound that meets general formula (3), the mass ratio meeting between the compound three of general formula (4) is 1 ︰ 2 ︰ 1.
Embodiment tetra-: C component and D component mass ratio are between the two 50 ︰ 50.The compound that meets the compound of general formula (2) and meet general formula (4) mass ratio is between the two 1 ︰ 2.
Embodiment five: C component and D component mass ratio are between the two 45 ︰ 55.The compound that meets the compound of general formula (1) and meet general formula (3) mass ratio is between the two 1 ︰ 1.
Embodiment six: C component and D component mass ratio are between the two 20 ︰ 80.The mass ratio meeting between the compound three that the compound of general formula (1), the compound that meets general formula (2) meet general formula (4) is 1 ︰ 1 ︰ 1.
General formula (1)～(11) in embodiment bis-～six are with embodiment mono-.
The preparation method of the transparent organic silicon gel caking agent of embodiment bis-～six is with embodiment mono-.
The character of transparent organic silicon gel caking agent for the optics that embodiment bis-makes: appearance colorless is transparent, within the scope of 400-700nm, transmittance reaches 98% (adopting ultraviolet spectrophotometer to record).Basic color parameter L is that 90.2, a is that-2.01, b is 0.62, after two 85 experiments (85 DEG C and 85% humidity condition) and cold shock testing variation very little, not xanthochromia.Mechanical property: tensile strength 0.25MPa; Having good bond strength, is 0.4KN/m for 180 ° of stripping strengths of glass, and lap shear strength reaches 1.0MPa, and flame retardant properties is good, reaches UL94-V0.Specific refractory power 1.43.
The character of transparent organic silicon gel caking agent for the optics that embodiment tri-makes: appearance colorless is transparent, within the scope of 400-700nm, transmittance reaches 95% (adopting ultraviolet spectrophotometer to record).Basic color parameter L is that 90.2, a is that-2.01, b is 0.62, after two 85 experiments (85 DEG C and 85% humidity condition) and cold shock testing variation very little, not xanthochromia.Mechanical property: tensile strength 0.20MPa; Having good bond strength, is 0.4KN/m for 180 ° of stripping strengths of glass, and lap shear strength reaches 1.0MPa, and flame retardant properties is good, reaches UL94-V0.Specific refractory power 1.40.
The character of transparent organic silicon gel caking agent for the optics that embodiment tetra-makes: appearance colorless is transparent, within the scope of 400-700nm, transmittance reaches 96.5% (adopting ultraviolet spectrophotometer to record).Basic color parameter L is that 90.2, a is that-2.01, b is 0.62, after two 85 experiments (85 DEG C and 85% humidity condition) and cold shock testing variation very little, not xanthochromia.Mechanical property: tensile strength 0.28MPa; Having good bond strength, is 0.4KN/m for 180 ° of stripping strengths of glass, and lap shear strength reaches 1.0MPa, and flame retardant properties is good, reaches UL94-V0.Specific refractory power 1.42.
The character of transparent organic silicon gel caking agent for the optics that embodiment five makes: appearance colorless is transparent, within the scope of 400-700nm, transmittance reaches 95% (adopting ultraviolet spectrophotometer to record).Basic color parameter L is that 90.2, a is that-2.01, b is 0.62, after two 85 experiments (85 DEG C and 85% humidity condition) and cold shock testing variation very little, not xanthochromia.Mechanical property: tensile strength 0.25MPa; Having good bond strength, is 0.41KN/m for 180 ° of stripping strengths of glass, and lap shear strength reaches 1.0MPa, and flame retardant properties is good, reaches UL94-V0.Specific refractory power 1.40.
The character of transparent organic silicon gel caking agent for the optics that embodiment six makes: appearance colorless is transparent, within the scope of 400-700nm, transmittance reaches 97% (adopting ultraviolet spectrophotometer to record).Basic color parameter L is that 90.2, a is that-2.01, b is 0.62, after two 85 experiments (85 DEG C and 85% humidity condition) and cold shock testing variation very little, not xanthochromia.Mechanical property: tensile strength 0.25MPa; Having good bond strength, is 0.4KN/m for 180 ° of stripping strengths of glass, and lap shear strength reaches 1.0MPa, and flame retardant properties is good, reaches UL94-V0.Specific refractory power 1.43.
Above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences that spirit is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.
Claims (10)
1. an applying method, is characterized in that: comprise the following steps:
The first step: the high temperature resistant adhesive tape of glue-coated surface for the treatment of at the first parts to be fit encloses the closed stickup district of formation;
Second step: by glue-coating to described stickup district to form the adhesive-layer of an even thickness in described stickup district, and make the thickness of described adhesive-layer be greater than the thickness of described high temperature resistant adhesive tape; Described glue makes after being mixed according to the mass ratio of 1 ︰ 1 by A component and B component; Described A component is made up of the material of cutting stock weight part:
Base-material 60～95 weight parts;
Catalyzer 0.1～0.5 weight part;
Auxiliary material 5～40 weight parts;
Described catalyzer is platinum metal catalysts;
Described B component is made up of the material of cutting stock weight part:
Base-material 60～95 weight parts;
Linking agent 5～20 weight parts
Inhibitor 0.1～0.5 weight part;
Auxiliary material 1～20 weight part;
Wherein, described base-material for meet general formula (1) compound, meet general formula (2) compound, meet the compound of general formula (3) and meet at least one in the compound of general formula (4);
（1）；
In formula, R
1represent that carbonatoms is 1～6 alkyl; R
2, R
3, R
4represent that independently of one another carbonatoms is the alkylene that 1～6 alkyl or carbonatoms are 2～8; X=5 ~ 40, y=1～30;
（2）；
In formula, a is more than or equal to 20, b and is more than or equal to 30;
（3）；
In formula, c is more than or equal to 20, d and is more than or equal to 30, e and is more than or equal to 10;
（4）；
In formula, f is more than or equal to 30, g and is more than or equal to 10, h and is more than or equal to 10, i and is more than or equal to 10;
Described linking agent is for meeting at least one in the compound of general formula (5);
（5）；
In formula, R
8represent that carbonatoms is 1～6 alkyl; R
5, R
6, R
7represent that independently of one another carbonatoms is 1～6 alkyl or hydrogen base, and R
5, R
6and R
7in at least one be hydrogen base; J=10 ~ 30, k=1～10;
Described accessory package is containing meeting the MQ resin of general formula (6) or meeting the MQ resin of general formula (6) and the mixture of vinyl-terminated silicone fluid; Wherein, described MQ resin and vinyl-terminated silicone fluid mass ratio are between the two 0.3～0.4:0.6～0.7;
Described auxiliary material also comprises and meets the MT resin of general formula (7) or meet the MT resin of general formula (7) and the mixture of vinyl-terminated silicone fluid; Described MT resin and vinyl-terminated silicone fluid mass ratio are between the two 0.3～0.4:0.6～0.7;
(Me
3SiO
0.5)
l(R
9Me
2SiO
0.5)
m(SiO
2) （6）；
In formula, Me represent methylidene; R
9represent that carbonatoms is the alkylene that 1～6 alkyl, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl or carbonatoms are 2～7; L=0～1.5, m=0～1.5, and l+m=1.3～1.8;
Described auxiliary material also comprises adhesive accelerant, and this adhesive accelerant makes after being mixed by C component and D component, and described C component and D component mass ratio are between the two 10～90 ︰ 10～90; Described C component for meet general formula (7) compound, meet general formula (8) compound, meet the compound of general formula (9) and meet at least one in the compound of general formula (10); Described B component is for meeting at least one in the compound of general formula (11);
（7）；
（8）；
（9）；
（10）；
（11）；
In formula, q=3～6, r=2～6, s=6～12, t=2～6, u=3～6, v=6～12, w=1 ~ 12;
Described inhibitor is alkynol compounds and contains at least one in alkylene annular siloxane oligopolymer;
The 3rd step: described adhesive-layer is heated so that the glue of described adhesive-layer solidifies and obtains solidifying adhesive-layer;
The 4th step: described high temperature resistant adhesive tape is removed, then by described the second parts to be fit and described the first parts laminating to be fit.
2. applying method according to claim 1, is characterized in that: in second step, after described adhesive-layer forms, described adhesive-layer is struck off, and unnecessary glue is scraped to described high temperature resistant adhesive tape.
3. applying method according to claim 1, is characterized in that: after described high temperature resistant adhesive tape is removed, and adhesive coating outside described curing adhesive-layer scope.
4. applying method according to claim 1, is characterized in that: described platinum metal catalysts is at least one in Platinic chloride, platinum-vinyl siloxane title complex, Platinic chloride and alkene complex and the platinum-olefin(e)complex of Platinic chloride, alcohol modification.
5. applying method according to claim 1, is characterized in that: described platinum metal catalysts is platinum-vinyl siloxane title complex.
6. applying method according to claim 1, it is characterized in that: described inhibitor is selected from 3-methyl isophthalic acid-butine-3-alcohol, methylpentynol, 3,5-dimethyl-1-hexin-3-alcohol, 1-hexin base-1-hexalin, 3-Phenyl-1-butyn-3-ol, 2-methyl-3-butyne-2-alcohol and tetramethyl-tetrem thiazolinyl cyclotetrasiloxane, pyridine, unsaturated amides.
7. applying method according to claim 1, is characterized in that: described in the alkylene that meets in the compound of general formula (1) be vinyl, allyl group, butenyl, pentenyl, hexenyl or heptenyl.
8. applying method according to claim 1, is characterized in that: described in meet the R in the compound of general formula (1)
1and R
2represent methylidene, R
3and R
4represent vinyl, and contents of ethylene is 0.005～0.5wt%; The viscosity of the described compound that meets general formula (1) is 300～30000 centipoises;
Or, described in meet the R in the compound of general formula (1)
1represent methylidene, R
2, R
3and R
4represent vinyl, and contents of ethylene is 0.01～10%; The viscosity of the described compound that meets general formula (1) is 50～10000 centipoises;
Or, described in meet the R in the compound of general formula (1)
1, R
2and R
3represent methylidene, R
4represent vinyl, and contents of ethylene is 0.001～0.5%; The viscosity of the described compound that meets general formula (1) is 500～10000 centipoises.
9. applying method according to claim 1, is characterized in that: described in meet the R in the compound of general formula (5)
5and R
8represent methylidene, R
6and R
7represent hydrogen base, and described in meet the compound of general formula (5) hydrogen content be 0.005～1%; The viscosity of the described compound that meets general formula (5) is 5～200 centipoises;
Or, described in meet the R in the compound of general formula (5)
6, R
7and R
8represent methylidene, R
5represent hydrogen base, and described in meet the compound of general formula (5) hydrogen content be 0.005～2%; The viscosity of the described compound that meets general formula (5) is 10～100 centipoises;
Or, described in meet the R in the compound of general formula (5)
8represent methylidene, R
5, R
6and R
7represent hydrogen base, and described in meet the compound of general formula (5) hydrogen content be 0.001～10%; The viscosity of the described compound that meets general formula (5) is 10～300 centipoises.
10. applying method according to claim 1, is characterized in that: in described MQ resin, and R
9represent methylidene, the ratio of the M/Q of described MQ resin is 0.6～1.2;
Or, in described MQ resin, R
9represent vinyl, and the content of vinyl is less than or equal to 10w%.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107179621A (en) * | 2017-07-13 | 2017-09-19 | 南京巨鲨显示科技有限公司 | A kind of processing method of the full laminating display based on liquid silicone glue |
| CN109825245A (en) * | 2018-12-30 | 2019-05-31 | 苏州桐力光电股份有限公司 | A kind of full fitting liquid crystal module sealing technology |
| CN109960435A (en) * | 2017-12-26 | 2019-07-02 | 苏州桐力光电股份有限公司 | The full attaching process and device of touch-control display module |
| CN113820875A (en) * | 2021-09-01 | 2021-12-21 | 滁州桐友显示科技有限公司 | Bonding method and display module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107179621A (en) * | 2017-07-13 | 2017-09-19 | 南京巨鲨显示科技有限公司 | A kind of processing method of the full laminating display based on liquid silicone glue |
| CN109960435A (en) * | 2017-12-26 | 2019-07-02 | 苏州桐力光电股份有限公司 | The full attaching process and device of touch-control display module |
| CN109825245A (en) * | 2018-12-30 | 2019-05-31 | 苏州桐力光电股份有限公司 | A kind of full fitting liquid crystal module sealing technology |
| CN109825245B (en) * | 2018-12-30 | 2022-04-01 | 苏州桐力光电股份有限公司 | Full-lamination liquid crystal module sealing process |
| CN113820875A (en) * | 2021-09-01 | 2021-12-21 | 滁州桐友显示科技有限公司 | Bonding method and display module |
| CN113820875B (en) * | 2021-09-01 | 2024-05-07 | 滁州桐友显示科技有限公司 | Bonding method and display module |
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|---|---|
| CN104004458B (en) | 2016-09-21 |
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