CN110013976A - A kind of Surface Properties of GaAs Wafers cleaning device - Google Patents
A kind of Surface Properties of GaAs Wafers cleaning device Download PDFInfo
- Publication number
- CN110013976A CN110013976A CN201910226003.XA CN201910226003A CN110013976A CN 110013976 A CN110013976 A CN 110013976A CN 201910226003 A CN201910226003 A CN 201910226003A CN 110013976 A CN110013976 A CN 110013976A
- Authority
- CN
- China
- Prior art keywords
- cleaning head
- hemispherical
- handle
- cleaning
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 73
- 229910001218 Gallium arsenide Inorganic materials 0.000 title claims abstract description 31
- 235000012431 wafers Nutrition 0.000 title claims abstract description 26
- 238000003780 insertion Methods 0.000 claims abstract description 4
- 230000037431 insertion Effects 0.000 claims abstract description 4
- 235000014676 Phragmites communis Nutrition 0.000 claims 1
- 239000013618 particulate matter Substances 0.000 abstract description 5
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 25
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B5/00—Brush bodies; Handles integral with brushware
- A46B5/0095—Removable or interchangeable brush heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a kind of Surface Properties of GaAs Wafers cleaning devices, including handle, cleaning head has been removably installed in the front end of handle, the front end of cleaning head is provided with a cleaning brush, the connection structure of cleaning head and handle are as follows: be equipped with locating slot in the front end of handle, hemispherical limit hole is equipped in locating slot inner wall, the inner hollow of cleaning head, through-hole is equipped in cleaning head side wall, spring leaf is set in the inside of cleaning head, one end of spring leaf and the inner wall of cleaning head are mutually fixed, the other end, which is fixed with, protrudes into through-hole and hemispherical locating piece compatible with hemispherical limit hole, when cleaning head insertion handle locating slot and turn to hemispherical locating piece it is corresponding with hemispherical limit hole when, hemispherical locating piece can stretch out through-hole under the outside elastic force effect of spring leaf and be inserted into hemispherical limit hole, cleaning head and handle are connected to a fixed.The invention has the advantages that: it is easy to operate, it is easy to use, it can effectively clear the particulate matter for being attached to Surface Properties of GaAs Wafers.
Description
Technical field
The present invention relates to gallium arsenide wafer manufacture technology fields, and in particular to a kind of Surface Properties of GaAs Wafers cleaning device.
Background technique
GaAs is a kind of important semiconductor material, GaAs can be made high 3 orders of magnitude of resistivity ratio silicon, germanium with
On semi-insulating highly resistant material, for making IC substrate, infrared detector, γ photon detector etc.；With GaAs system
At semiconductor devices have many advantages, such as that high frequency, high temperature, low temperature performance well, noise are small, capability of resistance to radiation is strong, therefore GaAs exists
The fields such as microwave device, high-speed digital circuit, mobile phone, satellite communication, microwave point-to-point connection, radar system obtain important
Using.Due to GaAs surface-active with higher, cause the particle generated in gallium arsenide wafer cutting process easily attached
In Surface Properties of GaAs Wafers, being all at present is cleaned to Surface Properties of GaAs Wafers using the clean mode of water, still
Surface Properties of GaAs Wafers after water cleans still has many particles to adhere to, and influences product quality.
Summary of the invention
The object of the present invention is to provide a kind of easy to operate, dismounting and easy to use can effectively clear and be attached to GaAs
The Surface Properties of GaAs Wafers cleaning device of the particulate matter of wafer surface.
To achieve the above object, present invention employs following technical solutions: a kind of Surface Properties of GaAs Wafers cleaning device, packet
Handle is included, cleaning head is detachably installed in the front end of handle, the front end of cleaning head is provided with a cleaning brush, it is described
Specific connection structure between cleaning head and handle are as follows: the front end of handle is provided with the locating slot for cleaning head insertion, fixed
The inner wall of position slot is provided with hemispherical limit hole, and the inner hollow of the cleaning head has been arranged radially logical in the side wall of cleaning head
Hole, in the spring leaf that is internally provided with of cleaning head, one end of spring leaf is mutually fixed with the inner wall of cleaning head, the other end of spring leaf
It is fixed with and protrudes into through-hole and size hemispherical locating piece compatible with hemispherical limit hole, hemispherical locating piece is in spring leaf
Always with the trend of protruding through-hole under outside elastic force effect, when cleaning head is inserted into the locating slot of handle and turns to hemisphere
When shape locating piece is corresponding with hemispherical limit hole, hemispherical locating piece can stretch out through-hole under the outside elastic force effect of spring leaf
And it is inserted into hemispherical limit hole, cleaning head and handle are connected to a fixed.
Further, a kind of Surface Properties of GaAs Wafers cleaning device above-mentioned, in which: the length of cleaning brush be (0.5~
2) centimetre, the diameter of cleaning brush is (5~15) micron.
Further, a kind of Surface Properties of GaAs Wafers cleaning device above-mentioned, in which: the length of cleaning brush is 1 centimetre,
The diameter of cleaning brush is 10 microns.
Through the implementation of the above technical solution, the medicine have the advantages that it is easy to operate, it dismounts and easy to use, can have
Effect removes the particulate matter for being attached to Surface Properties of GaAs Wafers, to improve product quality.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of Surface Properties of GaAs Wafers cleaning device of the present invention.
Specific embodiment
The present invention will be further explained below with reference to the attached drawings and specific examples.
As shown in Figure 1, a kind of Surface Properties of GaAs Wafers cleaning device, including handle 1, it can in the front end of handle 1
Cleaning head 2 is installed to demolition, the front end of cleaning head 2 is provided with a cleaning brush 3, between the cleaning head 2 and handle 1
Specific connection structure are as follows: the front end of handle 1 be provided with for cleaning head 2 be inserted into locating slot, locating slot inner wall be arranged
There is hemispherical limit hole, the inner hollow of the cleaning head 2 has been arranged radially through-hole 4 in the side wall of cleaning head 2, in cleaning head 2
Be internally provided with spring leaf 5, one end of spring leaf 5 is mutually fixed with the inner wall of cleaning head 2, and the other end of spring leaf 5 is fixed with
Protrude into through-hole 4 and size hemispherical locating piece 6 compatible with hemispherical limit hole, hemispherical locating piece 6 spring leaf 5 to
Always with the trend of protruding through-hole 4 under outer elastic force effect, when cleaning head 2 is inserted into the locating slot of handle 1 and turns to half
When spherical locating piece 6 is corresponding with hemispherical limit hole, hemispherical locating piece 6 can be stretched under the outside elastic force effect of spring leaf 5
Through-hole 4 and it is inserted into hemispherical limit hole out, cleaning head 2 and handle 1 are connected to a fixed；In the present embodiment, cleaning brush 3
Length is (0.5~2) centimetre, and the diameter of cleaning brush 3 is (5~15) micron, it is preferable that the length of cleaning brush is 1 centimetre,
The diameter of cleaning brush is 10 microns；
In use, first gallium arsenide wafer is placed on station, then worker holds handle 1, will be adhered to by cleaning brush 3
Particulate matter on gallium arsenide wafer is chosen from gallium arsenide wafer, easy to operate, easy to use, ensure that the surface of gallium arsenide wafer
Cleannes improve product quality；When needing replacing cleaning brush 3, cleaning head 2 need to only be transferred to the locating slot of handle 1, then
Reinsert the new cleaning head 2 with cleaning brush 3.
The invention has the advantages that it is easy to operate, it dismounts and easy to use, can effectively clear and be attached to Surface Properties of GaAs Wafers
Particulate matter, to improve product quality.
Claims (3)
1. a kind of Surface Properties of GaAs Wafers cleaning device, it is characterised in that: including handle, detachably installed in the front end of handle
There is cleaning head, the front end of cleaning head is provided with a cleaning brush, the specific connection structure between the cleaning head and handle
Are as follows: the front end of handle is provided with the locating slot for cleaning head insertion, the inner wall of locating slot is provided with hemispherical limit hole, institute
The inner hollow for stating cleaning head has been arranged radially through-hole in the side wall of cleaning head, in the spring leaf that is internally provided with of cleaning head, bullet
One end of reed and the inner wall of cleaning head are mutually fixed, and the other end of spring leaf, which is fixed with, protrudes into through-hole and size and hemispherical limits
The compatible hemispherical locating piece in hole, hemispherical locating piece have protruding logical always under the outside elastic force effect of spring leaf
The trend in hole, when cleaning head insertion handle locating slot and turn to hemispherical locating piece it is corresponding with hemispherical limit hole when,
Hemispherical locating piece can stretch out through-hole under the outside elastic force effect of spring leaf and be inserted into hemispherical limit hole, by cleaning head and hand
Handle is connected to a fixed.
2. a kind of Surface Properties of GaAs Wafers cleaning device according to claim 1, it is characterised in that: the length of cleaning brush
For (0.5~2) centimetre, the diameter of cleaning brush is (5~15) micron.
3. a kind of Surface Properties of GaAs Wafers cleaning device according to claim 2, it is characterised in that: the length of cleaning brush
It is 1 centimetre, the diameter of cleaning brush is 10 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910226003.XA CN110013976A (en) | 2019-03-25 | 2019-03-25 | A kind of Surface Properties of GaAs Wafers cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910226003.XA CN110013976A (en) | 2019-03-25 | 2019-03-25 | A kind of Surface Properties of GaAs Wafers cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110013976A true CN110013976A (en) | 2019-07-16 |
Family
ID=67189940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910226003.XA Pending CN110013976A (en) | 2019-03-25 | 2019-03-25 | A kind of Surface Properties of GaAs Wafers cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110013976A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2405462Y (en) * | 2000-01-24 | 2000-11-15 | 何顺明 | Umbrella with stick not at center of said umbrella |
| CN201211168Y (en) * | 2008-06-27 | 2009-03-25 | 上海市松江二中 | Portable cleaning tool |
| CN201445210U (en) * | 2009-07-10 | 2010-05-05 | 廖建甜 | Adjustable mosquito curtain |
| CN201958842U (en) * | 2011-04-20 | 2011-09-07 | 巫梦丹 | Cup brush |
| CN103122898A (en) * | 2011-11-18 | 2013-05-29 | 海洋王照明科技股份有限公司 | Extensible pole component and lamp using extensible pole component |
| CN203114815U (en) * | 2013-03-05 | 2013-08-07 | 江门邦达金属电子制品有限公司 | Telescoping rod with positioning device |
| CN208434907U (en) * | 2018-05-30 | 2019-01-29 | 武汉博士德生物工程有限公司 | A kind of electric test tube brush |
| CN210159998U (en) * | 2019-03-25 | 2020-03-20 | 苏州芯海半导体科技有限公司 | Gallium arsenide wafer surface cleaning device |
-
2019
- 2019-03-25 CN CN201910226003.XA patent/CN110013976A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2405462Y (en) * | 2000-01-24 | 2000-11-15 | 何顺明 | Umbrella with stick not at center of said umbrella |
| CN201211168Y (en) * | 2008-06-27 | 2009-03-25 | 上海市松江二中 | Portable cleaning tool |
| CN201445210U (en) * | 2009-07-10 | 2010-05-05 | 廖建甜 | Adjustable mosquito curtain |
| CN201958842U (en) * | 2011-04-20 | 2011-09-07 | 巫梦丹 | Cup brush |
| CN103122898A (en) * | 2011-11-18 | 2013-05-29 | 海洋王照明科技股份有限公司 | Extensible pole component and lamp using extensible pole component |
| CN203114815U (en) * | 2013-03-05 | 2013-08-07 | 江门邦达金属电子制品有限公司 | Telescoping rod with positioning device |
| CN208434907U (en) * | 2018-05-30 | 2019-01-29 | 武汉博士德生物工程有限公司 | A kind of electric test tube brush |
| CN210159998U (en) * | 2019-03-25 | 2020-03-20 | 苏州芯海半导体科技有限公司 | Gallium arsenide wafer surface cleaning device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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