CN110010554A - A kind of physics self-destruction device encapsulation structure based on water-absorbing resin - Google Patents
A kind of physics self-destruction device encapsulation structure based on water-absorbing resin Download PDFInfo
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- CN110010554A CN110010554A CN201910230535.0A CN201910230535A CN110010554A CN 110010554 A CN110010554 A CN 110010554A CN 201910230535 A CN201910230535 A CN 201910230535A CN 110010554 A CN110010554 A CN 110010554A
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- water
- absorbing resin
- structure based
- encapsulation structure
- destruction device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Abstract
The invention discloses a kind of physics self-destruction device encapsulation structure based on water-absorbing resin, which includes: ceramic package shell, terylene grenadine, water-absorbing resin, hard metal thin layer, aluminium oxide ceramic substrate and chip with wedge angle.The hardness of the hard metal thin layer with wedge angle is bigger than the hardness of aluminium oxide ceramic substrate, while flexible, being unlikely to deform, and can move in vertical direction with the variation of water-absorbing resin layer volume.
Description
Technical field
The invention belongs to information security fields, and in particular to a kind of method and encapsulating structure of physics self-destruction device.
Background technique
With the rapid development of semiconductor industry and microelectric technique, electronic device and electronic equipment have become mankind's life
Essential a part in work, and information security, defence and military, telecommunication, Life Education, in terms of
Play increasingly important role.To the protection of information in chip not exclusively to defense military safety, also relate to pair
The protection of individual privacy, Intellectual Property Right of Enterprises etc..
Currently, mainly making core using chemical attack, the chip containing energy and introducing stress in terms of realizing chip self-destroying both at home and abroad
The broken mode of piece.The principle of chemical attack is usually to be with acid or caustic corrosion metal electrode, silica and silicon materials, method
It is dripped in the devices with polymer wrapped acid drop or alkali, during long-term storage, with the variation acid drop or alkali of external environment
The chemical property of drop is easy to happen variation, and acid or alkali are in addition added in device can also have security risk, environmental pollution；The core containing energy
The method of piece is filling thermite or prepares porous silicon, and principle is CuO or Bi2O3Nanometer powder and aluminium occur under certain condition
Thermit reaction releases a large amount of heat or explosion makes chip self-destroying, triggering temperature requirement be it is relatively high, also have one after triggering
Fixed risk；The mode for introducing stress is usually breaking strength or fracture toughness according to silicon in silicon chip back side one depthkeeping of etching
The groove of wide ratio fills expandable material, and material expansion, which generates stress, keeps chip broken.This mode does not have security risk,
It does not pollute the environment.The self-destruction device of three of the above mode is largely by the way of heat triggering, and common chip is for a long time
70~80 DEG C can be reached in the course of work, the chip local operating temperature of some special applications can reach 100 DEG C or more, heat triggering
The low self-destruction device of temperature may be triggered and self-destruction in the normal course of work, and heat triggers the high self-destruction device of temperature very
Difficulty reaches desired triggering temperature spot.Therefore, it is necessary to a kind of physics self-destruction electronic devices of the introducing stress of non-thermal triggering.
Water-absorbing resin be it is a kind of containing the strongly hydrophilics such as hydroxyl, carboxyl group and with certain degree of cross linking have three dimensional network
Network structure function high molecular material, in irregular shape, hydrophilic radical and water are reacted to hydrogel after water absorbing resin particle chance water,
Volume can be expanded to several hundred or even thousands of times of own vol, and pressurize and be also difficult to extrude in water.Its raw material sources is
Starch or cellulose etc., starch and cellulose can be decomposed under microorganism it is degradable fall, therefore it is nontoxic do not pollute the environment,
It there will not be security risk.
Monocrystalline silicon is fragile material, elasticity modulus 130Gpa, fracture toughness 0.7Mpam at normal temperature1/2Left and right,
As temperature T > TmWhen (fusing point of silicon), monocrystalline silicon is converted to plasticity by brittleness, while fracture toughness sharply increases.The reason of monocrystalline silicon
Judgement resistance to spalling is 5Gpa or so, and due to the presence of the various defects such as micro-crack, the breaking strength of monocrystalline silicon only has 200 in practice
~700Mpa.
Aluminium oxide ceramic substrate is fragile material, and elasticity modulus 400Gpa is monocrystalline silicon elasticity modulus more than twice,
Its fracture toughness is 3Mpam1/2, it is 4~5 times of monocrystalline silicon fracture toughness.
Summary of the invention
The present invention is directed to the above problems of the prior art, devises one based on current device manufacture packaging technology
Physics self-destruction device encapsulation structure of the kind based on water-absorbing resin.On the basis of ceramic package device, in existing encapsulating package
Inner laser cutting processing groove and water suction hole array fill water-absorbing resin layer in groove, and water-absorbing resin is quick after water triggering
Expansion, which generates stress, strains ceramic substrate and chip, when the stress that water-absorbing resin expansion generates is greater than ceramic substrate and core
Ceramic substrate and chip are broken to make device self-destruction when the breaking strength of piece.
The technical scheme is that a kind of device encapsulation structure for making chip self-destroying, which includes ceramic package pipe
Shell, terylene grenadine, water-absorbing resin, hard metal thin layer, aluminium oxide ceramic substrate and chip.The hardness ratio of the hard metal thin layer
The hardness of aluminium oxide ceramic substrate is big, while flexible, being unlikely to deform, and the central area on metal hard layer has protrusion
Wedge angle.
Further, one layer of terylene grenadine first is padded on water suction hole array in groove, is subsequently filled water-absorbing resin layer.
Further, the hard metal thin layer of one layer with groove same area size is placed above in water-absorbing resin layer, this is hard
Thin metal layer is not fixed, and can be moved in vertical direction with the variation of water-absorbing resin layer volume.
The invention has the benefit that
1, relative to the mode that acid or alkali chemical attack are added in the devices, the design is answered using filling expanding material introducing
The mode of power avoids the pollution of acid or alkali, no security risk.
2, the non-biodegradable relative to other expanding materials, the raw material sources of water-absorbing resin are starch or cellulose,
It can be decomposed completely under microorganism, be belonged to environmentally friendly.
3, the self-destruction device that the present invention designs is triggered based on water, is solved and is triggered the low device of temperature spot in hot triggering mode
Part self-destruction and the problem of triggering temperature spot high-leveled and difficult triggering easily in course of normal operation.
4, of the invention that wedge angle is manufactured on metal hard layer, stress can occur in sharp corner after water triggering and concentrate, head at this
First cracked, the position by controlling wedge angle can control silicon wafer regional area broken first.
Detailed description of the invention
Fig. 1 is the sectional view of the ceramic package device structure of current standard.
Fig. 2 is the sectional view for the physics self-destruction device encapsulation structure based on water-absorbing resin that the present invention designs.
Fig. 3 is the manufacturing process flow for the ceramic package device that the present invention designs.
Fig. 4 is the simulation model that metal answers wedge angle and aluminium oxide ceramic substrate on thin layer.
Fig. 5 is the stress envelope in Fig. 4 in 4mm*4mm square groove after steel ball displacement 0.02mm between ab two o'clock.
Fig. 6 is the stress envelope in Fig. 4 in 4mm*4mm square groove after steel ball displacement 0.02mm between cd two o'clock.
Specific embodiment
As optional technical solution, the only processing groove on encapsulating package, with the polymer wrapped water droplet that can be pyrolyzed with
Water-absorbing resin mixing, the polymer decomposition that can be pyrolyzed after certain temperature triggering release water droplet, and water-absorbing resin water swelling generates
Stress keeps chip broken and self-destruction.
Embodiment one.
The sectional view of the embodiment of the present invention one as shown in Fig. 2, element manufacturing process as shown in figure 3, Fig. 1 Plays envelope
Tubulature shell inner laser cutting processing groove and the hole array that absorbs water, are sequentially filled terylene grenadine, water-absorbing resin layer and band in groove
The hard layer of wedge angle, then bonded ceramics substrate and chip, finally seal up shell cap.In 96% alumina ceramic-base in this example
The square groove of 4mm*4mm area is processed on encapsulating package below plate, the size of ceramic substrate is 8mm*8mm*0.125mm.
It is more than 200 times of own vol that the hydrogel formed after sufficiently being absorbed water due to water-absorbing resin, which may expand, using Fig. 4 as simulation model,
It is assumed that the stress distribution on ceramic substrate can be obtained in the case where the hard thin slice displacement 0.02mm with wedge angle, as it can be seen in figures 5 and 6, pottery
Stress is concentrated at porcelain substrate center point, has reached the breaking strength 400Mpa of alumina ceramic material, while in transverse direction
Groove boundary there are the second region of stress concentration, crackle occurred first from center to the second region of stress concentration expand
Exhibition.
Embodiment two
Embodiment is opened according to the shell structure of sectional view 2, then produces the encapsulation with groove and water suction hole array
Shell, next device making technics are the same as example 1.
Embodiment three
The embodiment of the present invention be that by solid-state under room temperature and can be quickly dissolved into the polymer of water on the basis of example 1
Liquefaction and the mixing cured molding of water-absorbing resin, are subsequently filled in the groove of Fig. 2.Specific implementing measure is gathered with soluble easily in water
For ethylene glycol, solid polyethylene glycol, which is placed higher than at a temperature of its fusing point, makes its liquefaction, is mixed into water-absorbing resin, then
Make its solidification under room temperature, the shape that cured sample is cut into groove size is filled into groove.
Example IV
The embodiment of the present invention is on the basis of example 1 by capillarities such as paper fiber, cotton fiber or polyester fibers
By force, hygroscopic material and water-absorbing resin mixing are filled into the groove of Fig. 2.
Embodiment five
Pocket Machining is on the basis of example 1 circular groove by the present embodiment, what is different from the first embodiment is that inhaling
Only in center there are region of stress concentration on ceramic substrate after water-resin water swelling, stress distribution is circle with center
The heart is distributed at circular ring shape, and crackle occurs by center, but direction of crack propagation is uncontrollable.
Claims (4)
1. a kind of physics self-destruction device encapsulation structure based on water-absorbing resin, the structure is thin comprising chip, the metallic hard with wedge angle
Piece, water-absorbing resin, terylene grenadine, aluminium oxide ceramic substrate, ceramic package shell, it is characterised in that water-absorbing resin is introduced into pottery
In porcelain packaging.
2. a kind of physics self-destruction device encapsulation structure based on water-absorbing resin according to claim 1, it is characterised in that:
Processing groove and water suction hole array inside encapsulating package.
3. according to claim 1 with a kind of physics self-destruction device encapsulation structure based on water-absorbing resin as claimed in claim 2,
It is characterized in that: water-absorbing resin layer and the metallic hard lamella with wedge angle is filled into the groove of encapsulating package.
4. a kind of physics self-destruction device encapsulation structure based on water-absorbing resin according to claim 3, it is characterised in that: band
The metallic hard lamella of wedge angle is located above water-absorbing resin layer, can move with the volume change of water-absorbing resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910230535.0A CN110010554B (en) | 2019-03-26 | 2019-03-26 | Physical self-destruction device packaging structure based on water-absorbent resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910230535.0A CN110010554B (en) | 2019-03-26 | 2019-03-26 | Physical self-destruction device packaging structure based on water-absorbent resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110010554A true CN110010554A (en) | 2019-07-12 |
| CN110010554B CN110010554B (en) | 2020-10-20 |
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|---|---|---|---|
| CN201910230535.0A Expired - Fee Related CN110010554B (en) | 2019-03-26 | 2019-03-26 | Physical self-destruction device packaging structure based on water-absorbent resin |
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Citations (11)
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| US3882324A (en) * | 1973-12-17 | 1975-05-06 | Us Navy | Method and apparatus for combustibly destroying microelectronic circuit board interconnections |
| CN2245989Y (en) * | 1995-11-02 | 1997-01-29 | 丁永华 | Expansion self-destroying disposable syringe |
| CN2397060Y (en) * | 1999-10-15 | 2000-09-20 | 羊性滋 | Down-press type anti-false bottle cap capable of realizing IC chip self-destroying |
| CN103378056A (en) * | 2012-04-12 | 2013-10-30 | 北京理工大学 | Integrated circuit chip-level self-destructive method based on MEMS metal bridge transducer element structure and structure thereof |
| CN105536092A (en) * | 2016-02-19 | 2016-05-04 | 汕头大学医学院第一附属医院 | Infusion tube easy to destroy |
| CN105552036A (en) * | 2015-12-16 | 2016-05-04 | 鸿秦（北京）科技有限公司 | Shape memory alloy based chip destroying device and method |
| CN106098673A (en) * | 2016-06-14 | 2016-11-09 | 电子科技大学 | A kind of for IC chip self-distruction structure |
| US20170092598A1 (en) * | 2015-09-29 | 2017-03-30 | Honeywell International Inc. | Self-destructing electronic device |
| CN206236092U (en) * | 2016-12-08 | 2017-06-09 | 江苏展邦智能科技有限公司 | A kind of type self-destroyed chip |
| JP2017195257A (en) * | 2016-04-19 | 2017-10-26 | 富士通株式会社 | Self destruction element, semiconductor device, electronic apparatus, information protection system, and information protection method |
| WO2018045179A1 (en) * | 2016-09-02 | 2018-03-08 | Frederick Flitsch | Customized smart devices and touchscreen devices and cleanspace manufacturing methods to make them |
-
2019
- 2019-03-26 CN CN201910230535.0A patent/CN110010554B/en not_active Expired - Fee Related
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3882324A (en) * | 1973-12-17 | 1975-05-06 | Us Navy | Method and apparatus for combustibly destroying microelectronic circuit board interconnections |
| CN2245989Y (en) * | 1995-11-02 | 1997-01-29 | 丁永华 | Expansion self-destroying disposable syringe |
| CN2397060Y (en) * | 1999-10-15 | 2000-09-20 | 羊性滋 | Down-press type anti-false bottle cap capable of realizing IC chip self-destroying |
| CN103378056A (en) * | 2012-04-12 | 2013-10-30 | 北京理工大学 | Integrated circuit chip-level self-destructive method based on MEMS metal bridge transducer element structure and structure thereof |
| US20170092598A1 (en) * | 2015-09-29 | 2017-03-30 | Honeywell International Inc. | Self-destructing electronic device |
| CN105552036A (en) * | 2015-12-16 | 2016-05-04 | 鸿秦（北京）科技有限公司 | Shape memory alloy based chip destroying device and method |
| CN105536092A (en) * | 2016-02-19 | 2016-05-04 | 汕头大学医学院第一附属医院 | Infusion tube easy to destroy |
| JP2017195257A (en) * | 2016-04-19 | 2017-10-26 | 富士通株式会社 | Self destruction element, semiconductor device, electronic apparatus, information protection system, and information protection method |
| CN106098673A (en) * | 2016-06-14 | 2016-11-09 | 电子科技大学 | A kind of for IC chip self-distruction structure |
| WO2018045179A1 (en) * | 2016-09-02 | 2018-03-08 | Frederick Flitsch | Customized smart devices and touchscreen devices and cleanspace manufacturing methods to make them |
| CN206236092U (en) * | 2016-12-08 | 2017-06-09 | 江苏展邦智能科技有限公司 | A kind of type self-destroyed chip |
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| CN110010554B (en) | 2020-10-20 |
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Granted publication date: 20201020 Termination date: 20210326 |