CN110005626A - 散热风扇和包含散热风扇的散热模块 - Google Patents

散热风扇和包含散热风扇的散热模块 Download PDF

Info

Publication number
CN110005626A
CN110005626A CN201910451591.7A CN201910451591A CN110005626A CN 110005626 A CN110005626 A CN 110005626A CN 201910451591 A CN201910451591 A CN 201910451591A CN 110005626 A CN110005626 A CN 110005626A
Authority
CN
China
Prior art keywords
substrate
radiator fan
top plate
sunk structure
sunk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910451591.7A
Other languages
English (en)
Inventor
杨智凯
郑懿伦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inventec Pudong Technology Corp
Inventec Corp
Original Assignee
Inventec Pudong Technology Corp
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Pudong Technology Corp, Inventec Corp filed Critical Inventec Pudong Technology Corp
Priority to CN201910451591.7A priority Critical patent/CN110005626A/zh
Priority to US16/436,725 priority patent/US10921062B2/en
Publication of CN110005626A publication Critical patent/CN110005626A/zh
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/26Rotors specially for elastic fluids
    • F04D29/28Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps
    • F04D29/281Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps for fans or blowers
    • F04D29/282Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps for fans or blowers the leading edge of each vane being substantially parallel to the rotation axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D1/00Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D1/04Helico-centrifugal pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D15/00Control, e.g. regulation, of pumps, pumping installations or systems
    • F04D15/0066Control, e.g. regulation, of pumps, pumping installations or systems by changing the speed, e.g. of the driving engine
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00Pumping installations or systems
    • F04D25/02Units comprising pumps and their driving means
    • F04D25/08Units comprising pumps and their driving means the working fluid being air, e.g. for ventilation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/002Details, component parts, or accessories especially adapted for elastic fluid pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/04Shafts or bearings, or assemblies thereof
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/26Rotors specially for elastic fluids
    • F04D29/28Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps
    • F04D29/281Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps for fans or blowers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/26Rotors specially for elastic fluids
    • F04D29/28Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps
    • F04D29/30Vanes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/26Rotors specially for elastic fluids
    • F04D29/32Rotors specially for elastic fluids for axial flow pumps
    • F04D29/325Rotors specially for elastic fluids for axial flow pumps for axial flow fans
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/26Rotors specially for elastic fluids
    • F04D29/32Rotors specially for elastic fluids for axial flow pumps
    • F04D29/38Blades
    • F04D29/388Blades characterised by construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/40Casings; Connections of working fluid
    • F04D29/42Casings; Connections of working fluid for radial or helico-centrifugal pumps
    • F04D29/4206Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
    • F04D29/4226Fan casings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/40Casings; Connections of working fluid
    • F04D29/42Casings; Connections of working fluid for radial or helico-centrifugal pumps
    • F04D29/44Fluid-guiding means, e.g. diffusers
    • F04D29/441Fluid-guiding means, e.g. diffusers especially adapted for elastic fluid pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/58Cooling; Heating; Diminishing heat transfer
    • F04D29/582Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/58Cooling; Heating; Diminishing heat transfer
    • F04D29/582Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • F04D29/584Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps cooling or heating the machine
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air

Abstract

本发明公开一种散热风扇及包含该散热风扇的散热模块。散热风扇包含基板、轴管、轴承、定子、转子以及多个扇叶。基板具有基板凸起结构。扇叶各具有第一凹陷结构。当扇叶转动时,基板凸起结构穿过各扇叶的第一凹陷结构。通过基板的凸起结构和风扇的凹陷结构,除了可以增加基板的热交换面积,在风扇运转时所产生的扰动气流还可以反复破坏基板表面热边界层,借以提升散热效果。

Description

散热风扇和包含散热风扇的散热模块
技术领域
本发明涉及一种散热风扇以及包含散热风扇的散热模块。
背景技术
随着科技进步,发展出了许多电子产品。在这些电子产品工作的过程中,会产生或累积大量的热。若无法及时散热,可能会影响电子产品的正常工作,降低其寿命甚至造成损坏。因此,为了维持电子产品的正常工作,需要安装散热组件。常见的散热组件例如热导管、散热片及风扇等。
一般的散热模式为通过热导管将热传递到风扇的上盖或底座,再搭配风扇进行散热。然而,将热源或热管搭接于风扇的上盖或底座,这种散热方式受限于该处的表面积,而热交换效果并不明显。因此,如何改善散热风扇的散热效果是目前所欲解决的问题之一。
发明内容
本发明提供一种散热风扇与包含散热风扇的散热模块。此散热风扇通过基板上的凸起结构来增加热交换面积,以改善散热风扇的散热效果。
本发明实施例提供一种散热风扇,包含基板、轴管、轴承、定子、转子以及多个扇叶。基板具有基板凸起结构。轴管固定于基板,基板凸起结构围绕轴管。轴承位于轴管中。定子固定于基板。转子枢设于轴承。多个扇叶与转子连接,该些扇叶各具有第一凹陷结构,当转子转动时,基板凸起结构穿过各扇叶的第一凹陷结构。
本发明提供一种散热模块,包含如上述的散热风扇以及热管。热管与散热风扇的基板接触。
本发明实施例的散热风扇,通过基板的凸起结构和扇叶的凹陷结构,除了可以增加基板的热交换面积,在扇叶旋转时所产生的扰动气流还可以反复破坏基板表面的热边界层,借以提升散热效果。
以上关于本发明内容的说明及以下的实施方式的说明用以示范与解释本发明的精神与原理,并且提供本发明的权利要求书更进一步的解释。
附图说明
图1为本发明第一实施例的散热风扇的分解图。
图2为本发明第一实施例的散热风扇的剖面图。
图3为包含本发明第一实施例的散热风扇的散热模块的立体图。
图4为本发明第二实施例的散热风扇的分解图。
图5为本发明第三实施例的散热风扇的扇叶部分的剖面图。
图6为本发明第四实施例的散热风扇的扇叶部分的剖面图。
图7为本发明第五实施例的散热风扇的分解图。
图8为本发明第五实施例的散热风扇的扇叶部分的剖面图。
图9为本发明第六实施例的散热风扇的扇叶部分的剖面图。
其中,附图标记:
1 散热模块
100、200、300、400、500、600 散热风扇
110 基板
111 承载面
112 基板凸起结构
113 基板通道
120 轴管
130 轴承
140 定子
150 转子
160 扇叶
161 第一凹陷结构
162 缺口
163 第二凹陷结构
170 顶板
171 顶板凸起结构
172 顶板通道
180 侧壁
200 散热模块
P 热管
IN 入风口
OUT 出风口
L1 第一宽度
L2 第二宽度
具体实施方式
以下在实施方式中详细叙述本发明的详细特征以及优点,其内容足以使本领域的技术人员了解本发明的技术内容并据以实施,且根据本说明书所公开的内容、权利要求书及附图,本领域的技术人员可轻易地理解本发明相关的目的及优点。以下的实施例是进一步详细说明本发明的观点,但非以任何观点限制本发明的范畴。
首先说明本发明第一实施例的散热风扇100。请参考图1和图2,图1为本发明第一实施例的散热风扇的分解图,图2为本发明第一实施例的散热风扇的剖面图。散热风扇100包含基板110、轴管120、轴承130、定子140、转子150、多个扇叶160、顶板170以及侧壁180,且散热风扇100具有入风口IN以及出风口OUT。
基板110具有承载面111和基板凸起结构112。基板凸起结构112位于承载面111。轴管120固定于承载面111,且基板凸起结构112围绕着轴管120。基板凸起结构112具有基板通道113。轴管120暴露于基板通道113中。在本实施例中,基板通道113的数量为四个,但不以此为限。基板110的材质可由散热性良好的材料制成,例如金属。基板110的承载面111作为热交换面时,基板凸起结构112可增加热交换面积,以改善热交换效率。
轴承130位于轴管120中。定子140通过轴管120固定于基板110的承载面111且围绕着轴管120。转子150枢设于轴承130。多个扇叶160与转子150连接。定子140与转子150用来驱动扇叶160旋转。在其他实施例中,定子可直接固定于基板的承载面。
扇叶160具有第一凹陷结构161。第一凹陷结构161位于扇叶160朝向基板110的一侧。当转子150转动时,基板凸起结构112会穿过各扇叶160的第一凹陷结构161。同理,扇叶160的第一凹陷结构161之间的部分可以通过各基板凸起结构112之间的空间。基板凸起结构112具有第一宽度L1,第一凹陷结构161具有第二宽度L2,且第一宽度L1小于第二宽度L2。因此,当扇叶160转动时,基板凸起结构112可以顺利地穿过第一凹陷结构161而不会与第一凹陷结构161相干涉。在本实施例中,基板凸起结构112和第一凹陷结构161的形状为矩形,但不以此为限。在其他实施例中,基板凸起结构和第一凹陷结构可以为矩形、三角形或弧形,只要基板凸起结构可以顺利地穿过第一凹陷结构,两者可为不同的形状。通过扇叶160的第一凹陷结构161和基板110的基板凸起结构112,扇叶转动时可以产生扰动气流,例如涡流或紊流,来破坏形成于基板110上的热边界层,借此提升热的传导并改善散热效率。此外,基板凸起结构112所具有的基板通道113作为出口,可让累积在基板凸起结构112之间较高温的气流经基板通道113排出。
顶板170与基板110相对,侧壁180位于顶板170和基板110之间并与顶板170和基板110连接。顶板170、侧壁180和基板110形成壳体,且定子140、转子150和扇叶160位于壳体中。入风口IN位于顶板170,用以引入来自外界的气流。在其他实施例中,入风口IN可以位于基板。在另一实施例中,入风口IN可同时位于顶板和基板。出风口OUT位于侧壁180,用以排出带有热量的气流。至少一个基板凸起结构112的基板通道113位于轴管120和出风口OUT之间,也就是靠近出风口OUT的位置。此配置可以帮助扇叶160将累积于基板凸起结构112的热量尽快排出至散热风扇100外。在本实施例中,定子140、转子150和扇叶160位于顶板170、侧壁180和基板110之间,但不以此为限。在其他实施例中,出风口和入风口可以分别位于顶板和基板,如轴流扇。
接下来说明包含本发明第一实施例的散热风扇100的散热模块1。请参考图3,图3为包含本发明第一实施例的散热风扇的散热模块的立体图。散热模块1包含前述第一实施例的散热风扇100以及热管P。热管P与基板110接触,并将热量传导至散热风扇100进行散热。此散热模块1可用于笔记本电脑、桌面计算机等任何需要散热器的电子产品。在本实施例中,散热模块1使用第一实施例的散热风扇100来进行散热,但不以此为限。散热模块也可以使用本发明其他实施例的散热风扇来进行散热。
接下来说明使用本发明第一实施例的散热风扇100的散热模块1散热时热量的传递途径。热管P与发热源或其他导热件接触,并将热量传递到基板110。基板110、顶板170和侧壁180可由导热性良好的材料制成,因此相连接的基板110、顶板170和侧壁180可传递热量,同时作为热交换件以进行热交换。基板凸起结构112可增加基板110的热交换面积。在散热风扇100运转时,气流从入风口IN被引入,经过基板110进行热交换之后,带着热量的气流再由出风口OUT被排出。此外,散热风扇100运转时,基板凸起结构112穿过第一凹陷结构161。同理,扇叶160的第一凹陷结构161之间的部分通过各基板凸起结构112之间的空间。借此,转动的扇叶160产生的扰动气流反复破坏形成于基板110表面的热边界层,以改善散热效果。
接下来说明本发明第二实施例的散热风扇200。请参考图4,图4为本发明第二实施例的散热风扇的分解图。散热风扇200包含基板110、轴管120、轴承130、定子140、转子150、多个扇叶160、顶板170、侧壁180、入风口IN以及出风口OUT。第二实施例大致上与第一实施例相同,以下仅对差异处做说明。相同的部分请参考上文描述,于此不再赘述。
在第一实施例中,基板凸起结构112具有四个基板通道113,但不以此为限。在第二实施例的散热风扇200中,基板凸起结构112不具有基板通道113,换句话说,基板凸起结构112为连续不中断的结构。不具有基板通道113的散热风扇200也可通过扇叶160的第一凹陷结构161和基板110的基板凸起结构112,在扇叶转动时产生扰动气流,例如涡流或紊流,来破坏形成于基板110上的热边界层,借此提升热的传导并改善散热效率。
在第一实施例中,一个基板凸起结构112穿过各扇叶160上的一个第一凹陷结构161,但不以此为限。请参考图5,图5为本发明第三实施例的散热风扇的扇叶部分的剖面图。第三实施例大致上与第一实施例相同,以下仅对差异处做说明。相同的部分请参考上文描述,于此不再赘述。在第三实施例的散热风扇300中,扇叶160还具有缺口162。缺口162与第一凹陷结构161设置于扇叶160的同侧。当转子150转动时,基板凸起结构112穿过第一凹陷结构161,但不穿过缺口162。缺口162在不影响扇叶功能与结构强度的情况下可为任意数量和任意位置。缺口162可在扇叶160转动时,进一步产生扰动气流,例如涡流或紊流,来帮助破坏基板110表面的热边界层。
在第一实施例中,一个基板凸起结构112穿过各扇叶160上的一个第一凹陷结构161,但不以此为限。请参考图6,图6为本发明第四实施例的散热风扇的扇叶部分的剖面图。第四实施例大致上与第一实施例相同,以下仅对差异处做说明。相同的部分请参考上文描述,于此不再赘述。在第四实施例的散热风扇400中,当转子150转动时,多个基板凸起结构112同时穿过各扇叶160上的一个第一凹陷结构161,也就是说一个第一凹陷结构161可容纳多个基板凸起结构112。多个基板凸起结构112可在扇叶160转动时,进一步产生扰动气流,例如涡流或紊流,来帮助破坏基板110表面的热边界层。
接下来说明本发明第五实施例的散热风扇500。请参考图7和图8,图7为本发明第五实施例的散热风扇的分解图,图8为本发明第五实施例的散热风扇的扇叶部分的剖面图。散热风扇500包含基板110、轴管120、轴承130、定子140、转子150、多个扇叶160、顶板170、侧壁180、入风口IN以及出风口OUT。第五实施例大致上与第一实施例相同,以下仅对差异处做说明。相同的部分请参考上文描述,于此不再赘述。
在第五实施例中,顶板170具有顶板凸起结构171,顶板凸起结构171围绕着入风口IN。顶板凸起结构171具有顶板通道172。在本实施例中,顶板通道172的数量为四个,但不以此为限。于本发明其他实施例中,可不具有顶板通道。顶板凸起结构171可增加热交换面积,借此提升热的传导并改善散热效率。
扇叶160具有第一凹陷结构161和第二凹陷结构163。第一凹陷结构161与第二凹陷结构163位于扇叶160的相对两侧,且互相对齐。当转子150转动时,基板凸起结构112会穿过各扇叶160的第一凹陷结构161,而顶板凸起结构171会穿过各扇叶160的第二凹陷结构163。同理,扇叶160的第一凹陷结构161之间的部分可以通过各基板凸起结构112之间的空间,第二凹陷结构163之间的部分可以通过各顶板凸起结构171之间的空间。通过第一凹陷结构161、第二凹陷结构163、基板凸起结构112和顶板凸起结构171,扇叶转动时可以产生扰动气流,例如涡流或紊流,来破坏形成于基板110和顶板170的热边界层,借此提升热的传导并改善散热效率。此外,基板通道113和顶板通道172作为出口,可让累积在基板凸起结构112之间与顶板凸起结构171之间较高温的气流经基板通道113和顶板通道172排出。
在第五实施例中,第一凹陷结构161与第二凹陷结构163位于扇叶160的相对两侧,且互相对齐,但不以此为限。请参考图9,图9为本发明第六实施例的散热风扇的扇叶部分的剖面图。第六实施例大致上与第五实施例相同,以下仅对差异处做说明。相同的部分请参考上文描述,于此不再赘述。在第六实施例的散热风扇600中,第一凹陷结构161与第二凹陷结构163位于扇叶160的相对两侧,且相错位。第二凹陷结构163的位置可配合顶板170的顶板凸起结构171,使顶板170在结构设计上更有弹性。在其他实施例中,在不影响扇叶功能的情况下,第一凹陷结构161与第二凹陷结构163可为任意的数量和位置关系。
本发明实施例的散热风扇,通过基板的凸起结构和扇叶的凹陷结构,除了可以增加基板的热交换面积,在扇叶旋转时所产生的扰动气流还可以反复破坏基板表面的热边界层,借以提升散热效果。
虽然本发明已以实施方式公开如上,然其并非用以限定本发明,任何熟悉此技艺的技术人员,在不脱离本发明的精神和范围内,当可作各种的更动与润饰,因此本发明的保护范围当视所附的权利要求书所界定的范围为准。

Claims (10)

1.一种散热风扇,其特征在于,包含:
一基板,具有一基板凸起结构;
一轴管,固定于该基板,该基板凸起结构围绕该轴管;
一轴承,位于该轴管中;
一定子,固定于该基板;
一转子,枢设于该轴承;以及
多个扇叶,与该转子连接,该些扇叶各具有一第一凹陷结构,当该转子转动时,该基板凸起结构穿过各该些扇叶的该第一凹陷结构。
2.根据权利要求1所述的散热风扇,其特征在于,该基板凸起结构具有一第一宽度,该第一凹陷结构具有一第二宽度,该第一宽度小于该第二宽度。
3.根据权利要求1所述的散热风扇,其特征在于,该基板凸起结构或该第一凹陷结构的形状为矩形、三角形或弧形。
4.根据权利要求1所述的散热风扇,其特征在于,该些扇叶还具有一缺口,该缺口与该第一凹陷结构设置于该些扇叶的同侧。
5.根据权利要求1所述的散热风扇,其特征在于,该基板凸起结构的数量为多个,该些基板凸起结构同时穿过各该些扇叶的该第一凹陷结构。
6.根据权利要求1所述的散热风扇,其特征在于,还包含一顶板、一侧壁、一出风口和一入风口,其中该顶板与该基板相对,而该侧壁位于该顶板与该基板之间并与该顶板和该基板连接,且该些扇叶、该定子和该转子位于该基板、该顶板和该侧壁之间,该出风口位于该侧壁,该入风口位于该顶板或该基板。
7.根据权利要求6所述的散热风扇,其特征在于,该基板凸起结构具有一基板通道,该基板通道位于该轴管和该出风口之间。
8.根据权利要求6所述的散热风扇,其特征在于,该顶板具有一顶板凸起结构,该顶板凸起结构具有一顶板通道,该些扇叶具有一第二凹陷结构,当该转子转动时,该顶板凸起结构穿过该第二凹陷结构,该第一凹陷结构与该第二凹陷结构位于该些扇叶的相对两侧。
9.根据权利要求8所述的散热风扇,其特征在于,该第一凹陷结构与该第二凹陷结构相错位。
10.一种散热模块,其特征在于,包含根据权利要求1至9中任一权利要求所述的散热风扇以及一热管,该热管与该基板接触。
CN201910451591.7A 2019-05-28 2019-05-28 散热风扇和包含散热风扇的散热模块 Pending CN110005626A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201910451591.7A CN110005626A (zh) 2019-05-28 2019-05-28 散热风扇和包含散热风扇的散热模块
US16/436,725 US10921062B2 (en) 2019-05-28 2019-06-10 Cooling fan and heat dissipating module including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910451591.7A CN110005626A (zh) 2019-05-28 2019-05-28 散热风扇和包含散热风扇的散热模块

Publications (1)

Publication Number Publication Date
CN110005626A true CN110005626A (zh) 2019-07-12

Family

ID=67177951

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910451591.7A Pending CN110005626A (zh) 2019-05-28 2019-05-28 散热风扇和包含散热风扇的散热模块

Country Status (2)

Country Link
US (1) US10921062B2 (zh)
CN (1) CN110005626A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113760066A (zh) * 2020-06-01 2021-12-07 王士荣 微型散热系统

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2249586A (en) * 1990-09-28 1992-05-13 Mitsubishi Electric Corp Vehicular a.c. generator.
US20060021735A1 (en) * 2004-07-27 2006-02-02 Industrial Design Laboratories Inc. Integrated cooler for electronic devices
CN2874080Y (zh) * 2006-01-25 2007-02-28 元山科技工业股份有限公司 外极式散热风扇
CN101672299A (zh) * 2008-09-12 2010-03-17 富准精密工业(深圳)有限公司 离心风扇
CN201884303U (zh) * 2010-12-16 2011-06-29 元山科技工业股份有限公司 外极式散热风扇
US20140290918A1 (en) * 2013-04-02 2014-10-02 Quanta Computer, Inc Heat dissipation module and centrifugal fan thereof
US20160186778A1 (en) * 2014-12-26 2016-06-30 Nidec Corporation Fan
CN105927561A (zh) * 2016-04-21 2016-09-07 深圳市风酷电子科技有限公司 直流无刷风扇及防转子飞出结构
CN207935122U (zh) * 2017-01-19 2018-10-02 日本电产株式会社 送风装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5928096A (ja) * 1982-08-06 1984-02-14 Matsushita Electric Ind Co Ltd 送風機
US5000254A (en) * 1989-06-20 1991-03-19 Digital Equipment Corporation Dynamic heat sink
US5445215A (en) * 1992-12-22 1995-08-29 Herbert; Edward Fan assembly with heat sink
JP2004353496A (ja) * 2003-05-28 2004-12-16 Sony Corp 薄型ファンモータ
JP5005181B2 (ja) * 2005-04-01 2012-08-22 日本電産サーボ株式会社 遠心ファン
TWM292888U (en) * 2005-12-30 2006-06-21 Sheng-An Yang Heat-dissipating fan
US20100247344A1 (en) * 2006-12-18 2010-09-30 Sheng-An Yang Heat dissipating fan

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2249586A (en) * 1990-09-28 1992-05-13 Mitsubishi Electric Corp Vehicular a.c. generator.
US20060021735A1 (en) * 2004-07-27 2006-02-02 Industrial Design Laboratories Inc. Integrated cooler for electronic devices
CN2874080Y (zh) * 2006-01-25 2007-02-28 元山科技工业股份有限公司 外极式散热风扇
CN101672299A (zh) * 2008-09-12 2010-03-17 富准精密工业(深圳)有限公司 离心风扇
CN201884303U (zh) * 2010-12-16 2011-06-29 元山科技工业股份有限公司 外极式散热风扇
US20140290918A1 (en) * 2013-04-02 2014-10-02 Quanta Computer, Inc Heat dissipation module and centrifugal fan thereof
US20160186778A1 (en) * 2014-12-26 2016-06-30 Nidec Corporation Fan
CN105927561A (zh) * 2016-04-21 2016-09-07 深圳市风酷电子科技有限公司 直流无刷风扇及防转子飞出结构
CN207935122U (zh) * 2017-01-19 2018-10-02 日本电产株式会社 送风装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113760066A (zh) * 2020-06-01 2021-12-07 王士荣 微型散热系统

Also Published As

Publication number Publication date
US10921062B2 (en) 2021-02-16
US20200378688A1 (en) 2020-12-03

Similar Documents

Publication Publication Date Title
US10739084B2 (en) Liquid cooling heat sink structure and cooling circulation system thereof
US11320874B2 (en) Cooling apparatus
CN101730451B (zh) 散热装置
US8023265B2 (en) Heat dissipation device and centrifugal fan thereof
US6892800B2 (en) Omnidirectional fan-heatsinks
RU2348963C1 (ru) Устройство для охлаждения деталей компьютера и способ его изготовления
US7779894B2 (en) Heat dissipation device
US20040201958A1 (en) System and method for cooling an electronic device
JP4682859B2 (ja) 電子機器用の冷却システム
CN110005626A (zh) 散热风扇和包含散热风扇的散热模块
TWI649024B (zh) Electronic device
TWI382300B (zh) 液態冷卻單元及用於此單元之熱交換器(二)
TWI334529B (en) Heat dissipation device
JP4682858B2 (ja) 電子機器用の冷却装置
CN210839705U (zh) 散热装置及手持终端设备
US20110094713A1 (en) Heat dissipation assembly
US20220291727A1 (en) Cooling apparatus
WO2003067949A1 (en) Cooling mechanism and information processing device using the cooling mechanism
KR100513010B1 (ko) 노트북 컴퓨터의 냉각 장치 및 냉각 장치의 형성 방법
TW201317537A (zh) 散熱裝置及其組裝方法
TWI698169B (zh) 散熱風扇和包含其的散熱模組
US11877381B2 (en) Heat dissipating system
TWI711367B (zh) 散熱系統
JP2009238948A (ja) ファン付ヒートシンク
KR100945052B1 (ko) 히트싱크

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190712

WD01 Invention patent application deemed withdrawn after publication