CN109994463A - Intelligent power module and preparation method thereof, air conditioner - Google Patents
Intelligent power module and preparation method thereof, air conditioner Download PDFInfo
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- CN109994463A CN109994463A CN201910357366.7A CN201910357366A CN109994463A CN 109994463 A CN109994463 A CN 109994463A CN 201910357366 A CN201910357366 A CN 201910357366A CN 109994463 A CN109994463 A CN 109994463A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/88—Electrical aspects, e.g. circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- Inverter Devices (AREA)
Abstract
The invention proposes intelligent power module and preparation method thereof, air conditioner, which includes: substrate；The upper surface of substrate is arranged in circuit-wiring layer；The upper surface of substrate is arranged in glass-fiber-plate, and orthographic projection of the glass-fiber-plate on substrate is not overlapped with orthographic projection of the circuit-wiring layer on substrate；The upper surface of circuit-wiring layer is arranged in device for power switching；The upper surface of glass-fiber-plate is arranged in control device；Metal wire is contacted with device for power switching and control device respectively.Intelligent power module proposed by the invention, device for power switching and control device can be made to be in approximately the same plane, so, shorten to efficiency the wire lengths connected between device for power switching and control device, to advantageously reduce the risk breasted the tape in encapsulation process, and then the technical problem of the easily short circuit of the intelligent power module route after encapsulation is avoided, keep the yield rate of intelligent power module higher.
Description
Technical field
The present invention relates to technical field of electronic encapsulation, specifically, the present invention relates to intelligent power module and preparation method thereof,
Air conditioner.
Background technique
Intelligent power module (abbreviation of IPM, Intelligent Power Module) is a kind of by power electronics sum aggregate
The power drive class product combined at circuit engineering.Device for power switching and high-voltage driving circuit are integrated in by intelligent power module
Together, and interior the fault detection circuits such as overvoltage, overcurrent and overheat are kept.On the one hand intelligent power module receives microcontroller list
The control signal of first (MCU), driving subsequent conditioning circuit work, on the other hand sends the state detection signal of system back to MCU.With tradition
Discrete scheme is compared, and intelligent power module wins increasing market with advantages such as its high integration, high reliability, especially suitable
Frequency converter and various inverters together in driving motor, are frequency control, metallurgical machinery, electric propulsion, servo-drive, frequency conversion
A kind of desired power level electronic device of household electrical appliances.
The device for power switching of IPM, can generate in the process of running heat to and high-voltage driving circuit generate interference, thus
It causes the function confusion of driving chip, burn to cause the failure of entire module.It is existing to avoid device for power switching to control
The method that chip generates interference is the method for using composite substrate, i.e. control chip is welded on the lesser glass-fiber-plate of thermal conductivity,
Switching device is welded on the biggish copper frame of thermal conductivity, and switching device and device for power switching are attached by metal wire,
Glass-fiber-plate is welded on copper frame.Its shortcoming is that control chip and switching device are not in one plane, make connection switch device
Too long be easy to appear in encapsulation process of the metal wire of part and device for power switching is breasted the tape, and is led to line short, is influenced module system
The yield rate of journey.
Summary of the invention
The present invention is the following discovery based on inventor and completes:
The present inventor has found in the course of the research, and circuit-wiring layer and glass-fiber-plate are all disposed on substrate, can
It is in the device for power switching being arranged on circuit-wiring layer in approximately the same plane with the control device being arranged on glass-fiber-plate,
In this way, the wire lengths connected between device for power switching and control device can effectively be shortened, to advantageously reduce envelope
The risk breasted the tape during dress, and then the technical problem of the easily short circuit of the intelligent power module route after encapsulation is avoided, make intelligent function
The yield rate of rate module is higher.
In view of this, an object of the present invention is to provide metal wires between a kind of device for power switching and control device
Length is shorter, encapsulates the higher intelligent power module of yield rate.
In the first aspect of the present invention, the invention proposes a kind of intelligent power module.
According to an embodiment of the invention, the intelligent power module includes: substrate；Circuit-wiring layer, the wiring
The upper surface of the substrate is arranged in layer；The upper surface of the substrate, and the glass-fiber-plate is arranged in glass-fiber-plate, the glass-fiber-plate
Orthographic projection on the substrate is not overlapped with the orthographic projection of the circuit-wiring layer on the substrate；Device for power switching,
The upper surface of the circuit-wiring layer is arranged in the device for power switching；Control device, the control device are arranged described
The upper surface of glass-fiber-plate；Metal wire, the metal wire are contacted with the device for power switching and the control device respectively.
Inventor has found that the intelligent power module of the embodiment of the present invention, circuit-wiring layer and glass-fiber-plate are all
It is set up directly on substrate, the controller that the device for power switching being arranged on circuit-wiring layer can be made and be arranged on glass-fiber-plate
Part is in approximately the same plane, in this way, the metal wire length connected between device for power switching and control device can be shortened effectively
Degree to advantageously reduce the risk breasted the tape in encapsulation process, and then avoids the intelligent power module route after encapsulation easily short-circuit
The technical issues of, keep the yield rate of intelligent power module higher.
In addition, intelligent power module according to the above embodiment of the present invention.It can also have the following additional technical features:
According to an embodiment of the invention, the substrate is formed by ceramics.
According to an embodiment of the invention, the substrate is formed by metal, and it is the substrate and the circuit-wiring layer, described
Insulating layer is provided between glass-fiber-plate.
According to an embodiment of the invention, the diameter of the metal wire is 40~400 microns.
According to an embodiment of the invention, the intelligent power module further comprises: pin, the pin are arranged described
The upper surface of glass-fiber-plate.
According to an embodiment of the invention, the intelligent power module further comprises: encapsulated layer, the substrate, the electricity
Road wiring layer, the glass-fiber-plate, the device for power switching, the control device and the metal wire are packaged in the encapsulated layer
In.
In the second aspect of the present invention, the invention proposes a kind of methods for making intelligent power module.
According to an embodiment of the invention, the described method includes: forming circuit-wiring layer in the upper surface of the substrate；Institute
The upper surface for stating substrate forms glass-fiber-plate, and the orthographic projection of the glass-fiber-plate on the substrate and the circuit-wiring layer are in institute
The orthographic projection stated on substrate is not overlapped；In the upper surface installation power switching device of the circuit-wiring layer；In the glass-fiber-plate
Upper surface install control device；Metal wire is connect with the device for power switching, the control device.
Inventor has found that using the production method of the embodiment of the present invention metal can be formed in upper surface of base plate
Wiring layer and glass-fiber-plate, and installation power switching device and control device on belonging to wiring layer and glass-fiber-plate respectively, in this way, can make
Metal wire is shorter between device for power switching and control device in the intelligent power module produced, to rush in encapsulation process
The probability that line occurs is lower, and then keeps the yield rate for the intelligent power module produced higher.
In addition, production method according to the above embodiment of the present invention, can also have the following additional technical features:
According to an embodiment of the invention, the method further includes: pin is welded on to the upper surface of the glass-fiber-plate.
According to an embodiment of the invention, the method further includes: by the substrate, circuit-wiring layer, described
Glass-fiber-plate, the device for power switching, the control device and the metal wire are encapsulated in encapsulated layer.
In the third aspect of the present invention, the invention proposes a kind of air conditioners.
According to an embodiment of the invention, the air conditioner includes above-mentioned intelligent power module.
Inventor has found that the air conditioner of the embodiment of the present invention, the yields of intelligent power module is higher, from
And air conditioner can be made the service life is longer, cost is lower.It will be appreciated to those of skill in the art that above for intelligent function
Feature and advantage described in rate module are still applied to the air conditioner, and details are not described herein.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned aspect combination following accompanying drawings of the invention explains the description of embodiment, in which:
Fig. 1 is the vertical section structure schematic diagram of the intelligent power module of one embodiment of the invention；
Fig. 2 is the vertical section structure schematic diagram of the intelligent power module of another embodiment of the present invention；
Fig. 3 is the vertical section structure schematic diagram of the intelligent power module of another embodiment of the present invention；
Fig. 4 is the method flow diagram of the production intelligent power module of one embodiment of the invention；
Fig. 5 is the method flow diagram of the production intelligent power module of another embodiment of the present invention.
Appended drawing reference
100 substrates
200 circuit-wiring layers
300 glass-fiber-plates
400 device for power switching
500 control devices
600 metal wires
700 pins
800 encapsulated layers
900 insulating layers
Specific embodiment
The embodiment of the present invention is described below in detail, those skilled in the art is it will be appreciated that following example is intended for solving
The present invention is released, and is not construed as limitation of the present invention.Unless stated otherwise, it is not expressly recited in embodiment below specific
Technology or conditions, those skilled in the art can be according to common technology or conditions in the art or according to product description
It carries out.
In one aspect of the invention, the invention proposes a kind of intelligent power module.
According to an embodiment of the invention, intelligent power module may include substrate 100, circuit-wiring layer 200, glass with reference to Fig. 1
Fine plate 300, device for power switching 400, control device 500 and metal wire 600；Wherein, circuit-wiring layer 200 is arranged in substrate
100 upper surface；Glass-fiber-plate 300 is also disposed at the upper surface of substrate 100, and the orthographic projection of glass-fiber-plate 300 on the substrate 100 with
The orthographic projection of circuit-wiring layer 200 on the substrate 100 is not overlapped；The upper of circuit-wiring layer 200 is arranged in device for power switching 400
Surface；The upper surface of glass-fiber-plate 300 is arranged in control device 500；And metal wire 600 respectively with device for power switching 400 and control
Device 500 processed contacts.
The present inventor has found in the course of the research, and chip is controlled in existing device for power switching and is mounted on thermal conductivity
On the lesser glass-fiber-plate of rate, glass-fiber-plate is to be arranged on copper frame, and switching device is to be directly installed on the biggish copper of thermal conductivity
On frame, so, after switching device and device for power switching are attached by metal wire, since spacing is at 1 centimetre or so
It controls chip and switching device not in one plane, it is too long and be easy to be thrust in encapsulation process to will lead to metal wire.Institute
With circuit-wiring layer 200 and glass-fiber-plate 300 are all set up directly on substrate 100 by inventor, can make to be arranged in circuit-wiring layer
Device for power switching 400 on 200 is in approximately the same plane with the control device 500 being arranged on glass-fiber-plate 300, in this way,
The length of the metal wire 600 connected between device for power switching 400 and control device 500 can be effectively shortened, to can reduce
The probability breasted the tape in encapsulation process, and then improve the yield rate of intelligent power module.
In some embodiments of the invention, substrate 100 can be formed by ceramics, specifically such as aluminium oxide or aluminium nitride
Ceramic material, in this way, the ceramic substrate 100 led and be electrically insulated using low-heat, can not only completely cut off circuit-wiring layer to fiberglass layer 300
Heat conduction, and electricity can be played to circuit-wiring layer and fiberglass layer 300 also without insulating layer without the upper surface of substrate 100
The effect of insulation.
In other embodiments of the invention, with reference to Fig. 2, substrate 100 can also be formed by metal, specifically the gold such as aluminium
Belong to, and may be provided with insulating layer 900 between substrate 100 and circuit-wiring layer 200, glass-fiber-plate 300, in this way, using high thermal conductivity
The substrate 100 that the metal materials such as aluminium are formed, the heat that device for power switching 400 generates when can accelerate to disperse intelligent power module work
Amount, and the substrate 100 of conductive metal can be isolated with metal wiring layer 200 again for the insulating layer 900 being electrically insulated, and can prevent gold
Heat is conducted to glass-fiber-plate 300 by the substrate 100 of category.
In some embodiments of the invention, the diameter of metal wire 600 can be 40~400 microns, and specifically such as 100 is micro-
Rice etc., in this way, using above-mentioned micron-sized aluminum metal lines, even if the spacing between device for power switching 400 and control device 500
Reach 1 centimetre or more, as long as device for power switching 400 and control device 500 are in approximately the same plane, can also shorten significantly
The length of metal wire 600 between device for power switching 400 and control device 500, to effectively reduce metal in encapsulation process
Line 600 is easy the probability breasted the tape.
In some fact Examples of the invention, circuit-wiring layer 200 and the respective thickness of glass-fiber-plate 300 can for 50~
100 microns, specifically such as 70 microns, in this way, using the circuit-wiring layer 200 and glass-fiber-plate 300 of above-mentioned micron order thickness, it can
Fully make device for power switching 400 and control device 500 is in approximately the same plane, and then significant shortens power switch device
The length of metal wire 600 between part 400 and control device 500.
According to an embodiment of the invention, the cross-sectional shape of circuit-wiring layer 200 is not particularly limited, art technology
Personnel can design according to the actual circuit of intelligent power module come the shape of planning circuit wiring layer 200, to realize the intelligence
The actual functional capability of power module.
According to an embodiment of the invention, the concrete type or practical structures of device for power switching 400, specific such as gallium nitride
Power component, silicon-based power element or silicon carbide power element etc., those skilled in the art can be according to the intelligent power module
Actual functional capability is correspondingly selected and is designed, by taking gallium nitride (GaN) power component as an example, it may include the source being generally aligned in the same plane
Pole, error of omission and grid.According to an embodiment of the invention, the concrete type or practical structures of control device 500, those skilled in the art
Member correspondingly can be selected and be designed according to the actual functional capability of the intelligent power module, and details are not described herein.
According to an embodiment of the invention, intelligent power module can further comprise pin 700 with reference to Fig. 3, pin 700 is set
It sets in the upper surface of glass-fiber-plate 300, in this way, pin 700 can pass through metal wire and device for power switching 400, control device 500
Electrical connection, thus by being electrically connected with each pin 700, it can be achieved that the frequency control of intelligent power module, metallurgical machinery, electricity
The functions such as power traction or servo-drive.
According to an embodiment of the invention, intelligent power module further comprises encapsulated layer 800, substrate 100, electricity with reference to Fig. 3
Road wiring layer 200, glass-fiber-plate 300, device for power switching 400, control device 500 and metal wire 600 are packaged in encapsulated layer 800
In, in this way, encapsulated layer 800 can to inside intelligent power module circuit and element protect.
In conclusion according to an embodiment of the invention, the invention proposes a kind of intelligent power module, circuit-wiring layer
All it is set up directly on substrate with glass-fiber-plate, the device for power switching being arranged on circuit-wiring layer can be made and is arranged in glass-fiber-plate
On control device be in approximately the same plane, connected between device for power switching and control device in this way, can effectively shorten
Wire lengths, to advantageously reduce the risk breasted the tape in encapsulation process, and then avoid the intelligent power module after encapsulation
The technical problem of route easily short circuit, keeps the yield rate of intelligent power module higher.
In another aspect of the invention, the invention proposes a kind of methods for making intelligent power module.According to this hair
Bright embodiment, with reference to Fig. 4, which includes:
S100: circuit-wiring layer is formed in the upper surface of substrate.
In this step, circuit-wiring layer 200 directly can be formed in the upper surface of substrate 100, it specifically can be in ceramics
Substrate 100 be first laid with copper foil and etch copper foil again and form the circuit-wiring layer 200 of preset shape.
It, can be in advance in the upper surface of substrate 100 for the substrate 100 of the metals such as aluminium in some fact Examples of the invention
The insulating layer 900 of flood is formed, so forms circuit-wiring layer 200 far from the upper surface of substrate 100 in insulating layer 900 again, such as
This, can make conductive metal substrate 100 be electrically insulated with circuit-wiring layer 200.
S200: glass-fiber-plate is formed in the upper surface of substrate.
In this step, glass-fiber-plate 300 directly can be attached in the upper surface of substrate, and glass-fiber-plate 300 is on the substrate 100
Orthographic projection be not overlapped with the orthographic projection of circuit-wiring layer 200 on the substrate 100, in this way, glass-fiber-plate 300 and wiring can be made
Layer 200 same layers setting.
It, can be in insulating layer 900 far from substrate 100 for the substrate 100 of the metals such as aluminium in some fact Examples of the invention
Upper surface form glass-fiber-plate 300, and the orthographic projection of glass-fiber-plate 300 on the substrate 100 and circuit-wiring layer 200 are in substrate 100
On orthographic projection be not overlapped, in this way, glass-fiber-plate 300 and 200 same layer of circuit-wiring layer can equally be arranged.
S300: in the upper surface installation power switching device of circuit-wiring layer.
In this step, can be in upper surface of the circuit-wiring layer 200 far from substrate 100 that step S100 is formed, installation
The weldering of device for power switching 400 specifically can be set to the corresponding peace of circuit-wiring layer 200 by chip mounter by device for power switching 400
It fills on position, or the weldering of device for power switching 400 is set on the corresponding installation position of circuit-wiring layer 200 using reverse installation process.
S400: control device is installed in the upper surface of glass-fiber-plate.
In this step, can be in upper surface of the glass-fiber-plate 300 far from substrate 100 that step S200 is formed, installation control
The weldering of control device 500 can be specifically set on the corresponding installation position of glass-fiber-plate 300 by chip mounter, or use by device 500
It fills technique the weldering of control device 500 is set on the corresponding installation position of glass-fiber-plate 300.
S500: metal wire is connect with device for power switching, control device.
In this step, the both ends of metal wire 600 are welded with device for power switching 400, control device 500 respectively, such as
This, the control signal that control device 500 can be made to export is transmitted to device for power switching 400, to realize device for power switching 400
On or off.
In some embodiments of the invention, with reference to Fig. 5, which can also further comprise:
S600: pin is welded on to the upper surface of glass-fiber-plate.
It in this step, can be in upper surface of the glass-fiber-plate 300 far from substrate 100 that step S200 is formed, by pin 700
It is welded in corresponding position, and is electrically connected by metal wire or circuit-wiring layer with device for power switching or control device, in this way,
By 700 transmission telecommunications number of pin, it can be achieved that the frequency control of intelligent power module, metallurgical machinery, electric propulsion or servo are driven
The functions such as dynamic.
S700: substrate, circuit-wiring layer, glass-fiber-plate, device for power switching, control device and metal wire are encapsulated in encapsulation
In layer.
It in this step, can be by the substrate 100 of step S500, circuit-wiring layer 200, glass-fiber-plate 300, power switch device
Part 400, control device 500 and metal wire 600 etc. need functional component to be protected to be all packaged in encapsulated layer 800, with asphalt mixtures modified by epoxy resin
For rouge material, specifically can preforming encapsulated layer 800 be packaged again, and the part of pin 700 exposes to encapsulated layer 800.
In conclusion according to an embodiment of the invention, the invention proposes a kind of production method, it can be in upper surface of base plate shape
At metal wiring layer and glass-fiber-plate, and installation power switching device and control device on belonging to wiring layer and glass-fiber-plate respectively, such as
This, can make in the intelligent power module produced that metal wire is shorter between device for power switching and control device, thus encapsulating
Breast the tape in the process generation probability it is lower, and then keep the yield rate for the intelligent power module produced higher.
In another aspect of the invention, the invention proposes a kind of air conditioners.According to an embodiment of the invention, air conditioner
Including above-mentioned intelligent power module.
It should be noted that the air conditioner further includes necessary composition and knot other than above-mentioned intelligent power module
Structure, specifically such as blower, compressor, heat exchanger, orifice union, wind guide component, chassis, panel, those skilled in the art can
It is correspondingly designed and is supplemented according to the function of the air conditioner, details are not described herein.
In conclusion according to an embodiment of the invention, the invention proposes a kind of air conditioner, intelligent power module it is good
Product rate is higher, and so as to make air conditioner, the service life is longer, cost is lower.It will be appreciated to those of skill in the art that preceding
Face is still applied to the air conditioner, details are not described herein for feature and advantage described in intelligent power module.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In the description of the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ",
Terms such as " fixations " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be with
It is mechanical connection, is also possible to be electrically connected；It can be directly connected, two can also be can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside a element.For the ordinary skill in the art, Ke Yigen
The concrete meaning of above-mentioned term in the present invention is understood according to concrete condition.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (10)
1. a kind of intelligent power module characterized by comprising
Substrate；
The upper surface of the substrate is arranged in circuit-wiring layer, the circuit-wiring layer；
The upper surface of the substrate, and the orthographic projection of the glass-fiber-plate on the substrate is arranged in glass-fiber-plate, the glass-fiber-plate
It is not overlapped with the orthographic projection of the circuit-wiring layer on the substrate；
The upper surface of the circuit-wiring layer is arranged in device for power switching, the device for power switching；
The upper surface of the glass-fiber-plate is arranged in control device, the control device；
Metal wire, the metal wire are contacted with the device for power switching and the control device respectively.
2. intelligent power module according to claim 1, which is characterized in that the substrate is formed by ceramics.
3. intelligent power module according to claim 1, which is characterized in that the substrate is formed by metal, and the base
Insulating layer is provided between plate and the circuit-wiring layer, the glass-fiber-plate.
4. intelligent power module according to claim 1, which is characterized in that the diameter of the metal wire is 40~400 micro-
Rice.
5. intelligent power module according to claim 1, which is characterized in that further comprise:
The upper surface of the glass-fiber-plate is arranged in pin, the pin.
6. intelligent power module according to claim 1, which is characterized in that further comprise:
Encapsulated layer, the substrate, the circuit-wiring layer, the glass-fiber-plate, the device for power switching, the control device and
The metal wire is packaged in the encapsulated layer.
7. a kind of method for making intelligent power module characterized by comprising
Circuit-wiring layer is formed in the upper surface of the substrate；
Glass-fiber-plate, and the orthographic projection of the glass-fiber-plate on the substrate and the circuit cloth are formed in the upper surface of the substrate
The orthographic projection of line layer on the substrate is not overlapped；
In the upper surface installation power switching device of the circuit-wiring layer；
Control device is installed in the upper surface of the glass-fiber-plate；
Metal wire is connect with the device for power switching, the control device.
8. the method according to the description of claim 7 is characterized in that further comprising:
Pin is welded on to the upper surface of the glass-fiber-plate.
9. the method according to the description of claim 7 is characterized in that further comprising:
By the substrate, the circuit-wiring layer, the glass-fiber-plate, the device for power switching, the control device and described
Metal wire is encapsulated in encapsulated layer.
10. a kind of air conditioner, which is characterized in that including intelligent power module according to any one of claims 1 to 6.
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| CN103236422A (en) * | 2013-03-29 | 2013-08-07 | 广东美的制冷设备有限公司 | Intelligent power module and manufacturing method thereof |
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| CN108054148A (en) * | 2017-12-08 | 2018-05-18 | 广东美的制冷设备有限公司 | Intelligent power module and its manufacturing method, air conditioner |
| CN208257678U (en) * | 2018-06-13 | 2018-12-18 | 重庆美的制冷设备有限公司 | Highly integrated intelligent power module and electrical equipment |
| CN209447796U (en) * | 2019-04-29 | 2019-09-27 | 广东美的制冷设备有限公司 | Intelligent power module, circuit board and air conditioner |
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| CN103236422A (en) * | 2013-03-29 | 2013-08-07 | 广东美的制冷设备有限公司 | Intelligent power module and manufacturing method thereof |
| CN104716128A (en) * | 2013-12-16 | 2015-06-17 | 台达电子企业管理（上海）有限公司 | Power module, power converter and method for manufacturing power module |
| CN108054148A (en) * | 2017-12-08 | 2018-05-18 | 广东美的制冷设备有限公司 | Intelligent power module and its manufacturing method, air conditioner |
| CN208257678U (en) * | 2018-06-13 | 2018-12-18 | 重庆美的制冷设备有限公司 | Highly integrated intelligent power module and electrical equipment |
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