CN109994295A - The resistance trimming method and system of resistor body - Google Patents
The resistance trimming method and system of resistor body Download PDFInfo
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- CN109994295A CN109994295A CN201910312427.8A CN201910312427A CN109994295A CN 109994295 A CN109994295 A CN 109994295A CN 201910312427 A CN201910312427 A CN 201910312427A CN 109994295 A CN109994295 A CN 109994295A
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- fluting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
Abstract
The application provides a kind of resistance trimming method and system of resistor body, is applied to technical field of laser processing, which comprises obtain the cutting starting position of resistor body to be adjusted；Control laser is based on preset first power and slots along predetermined cut path to the resistance to be adjusted from the starting position；Control the laser based on preset second power from the end position of fluting along the predetermined cut path switchback up to the starting position, wherein second power be less than first power.The residue in fluting can be removed by this way, simultaneously as the second power is smaller, therefore, the resistance value of the resistor body in switchback process is more stable, will not be by the substrate damage of resistor body.
Description
Technical field
This application involves technical field of laser processing, in particular to a kind of resistance trimming method and system of resistor body.
Background technique
Existing laser resistance adjuster to the resistance of repairing of resistor body is beaten on resistor body using a branch of superfine laser beam, is passed through
Steam raising is carried out to resistance resistance body and realizes cutting, is surveyed in real time with the progress of laser cutting process, while by measurement system
The resistance value for measuring resistor body, after the actual resistance of resistor body reaches target resistance value, laser beam is closed, i.e. realization laser resistor trimming
Journey.Laser resistor trimming has the characteristics that resistance trimming precision is high, speed is fast, high reliablity, low in cost.However, being carried out to resistor body
When fluting repairs resistance, it is easy then to make resistor body there are residue and the incomplete abnormality that gasifies in the fluting of resistor body
Resistance stability it is poor, not high pressure resistant etc..
In view of the above-mentioned problems, existing laser repair resistance technique generally use increase repair resistance power mode come remove repair resistance carve
Ink residue in trace, and eliminate the incomplete abnormality of resistor body gasification.However, the method for increasing laser power is held
Easily the base part of resistor body is destroyed, meanwhile, increasing power can make the temperature on resistor body increase, and then cause repairing resistance
The resistance value of resistor body in the process is unstable.
Apply for content
In consideration of it, a kind of resistance trimming method and system for being designed to provide resistor body of the embodiment of the present application, are repaired with removing
The ink residue in indentation is hindered, and eliminates the incomplete abnormality of resistor body gasification.
In a first aspect, the embodiment of the present application provides a kind of resistance trimming method of resistor body, which comprises obtain electricity to be adjusted
The cutting starting position of resistance body；It controls laser and is based on preset first power from the starting position along default cutting
It slots to the resistance to be adjusted in path；Control stop bits of the laser based on preset second power from fluting
It sets place to start along the predetermined cut path switchback until the starting position, wherein second power is less than described first
Power.
During above-mentioned realization, do not have to as the prior art, resistance trimming power is tuned up when slotting resistance trimming, but is used
Ordinary power (the first power), so the substrate damage of resistor body will not will not be made resistance when slotting resistance trimming
Temperature drift occurs for body, then after treating tune resistor body and carrying out fluting resistance trimming, is based on by controlling the laser less than the first function
Second power of rate from the end position of fluting along the predetermined cut path switchback up to slot starting position, institute
Also can achieve the purpose for removing the residue in fluting, further, since the size of laser beam is related with laser power, swash
Optical power is smaller, and laser beam is thinner, is less than the first power, so that the laser beam in switchback process compares by the second power setting
Carefully, so will not will not make resistor body that temperature drift occur, and can make back the substrate damage of resistor body when switchback
The resistance value of resistor body after cutting is more stable.
Based in a first aspect, second power is 1/10th of first power in a kind of possible design.
During above-mentioned realization, by by the second power setting in switchback process be first power ten/
One, the effect for clearing up residue and the effect for reducing influence of the laser to the resistance value of resistor body in switchback process can be made all to compare
It is good.
Based in a first aspect, controlling the laser in a kind of possible design and being based on preset second power
Along the predetermined cut path switchback up to the starting position from the end position of fluting, comprising: control is described to swash
Light device based on preset second power and switchback speed from the end position of fluting along the predetermined cut path
Switchback is until the starting position, wherein the switchback speed is greater than the cutting speed when fluting.
During above-mentioned realization, since the size of laser beam is also related with the cutting speed of laser, in laser
In the identical situation of power, cutting speed is bigger, and laser beam is thinner, so also returning by the laser in setting switchback process
Cutting speed degree is greater than cutting speed when fluting so that the laser in switchback process is thinner, can take into account cleaning residue effect and
Reduce the effect of influence of the laser to the resistance value of resistor body in switchback process.
Based in a first aspect, controlling the laser in a kind of possible design and being based on preset second power
Along the predetermined cut path switchback up to the starting position from the end position of fluting, comprising: control is described to swash
Densities of points of light of the light device based on preset second power and laser from the end position of fluting default cut along described
Path switchback is cut until the starting position, wherein the densities of points of light is less than the densities of points of light when fluting.
During above-mentioned realization, since the size of laser beam is related with densities of points of light, in a single pulse energy (luminous point
Energy) in identical situation, densities of points of light is smaller, and laser beam is thinner, so also passing through the laser in setting switchback process
It is residual can to take into account cleaning so that the laser in switchback process is thinner for the densities of points of light of laser when densities of points of light is less than fluting
Slag effect and the effect for reducing influence of the laser to the resistance value of resistor body in switchback process.
Based in a first aspect, in a kind of possible design, the method also includes: there is also residuals in the fluting
When object, control the laser is again based on second power from the end position of fluting along the default cutting road
Diameter switchback is until the starting position.
During above-mentioned realization, in order to preferably remove fluting in residue, therefore, in the fluting there is also
When residue, controls and cut the laser is again based on second power from the end position of fluting along described preset
Path switchback is cut until the starting position, can further remove residue by this way.
Based in a first aspect, being based on preset second function controlling the laser in a kind of possible design
Rate from the end position of fluting along the predetermined cut path switchback before the starting position, the method is also
It include: the preset resistive value for obtaining resistor body to be adjusted；It controls the laser and is based on preset first power since described
At position along the predetermined cut path to described when adjusting resistor body to slot, obtain the resistance value of the resistor body to be adjusted；
Described when adjusting the resistance value of resistor body to reach the preset value, the end position of the fluting is obtained.
During above-mentioned realization, when slotting to resistor body, by the resistance value of real-time measurement resistor body to be adjusted,
It is described to obtain the end position of the fluting when adjusting resistor body resistance value to reach preset value, it enables to slot by this way
At the end of the resistance value of resistor body to be adjusted reach the preset value, and can accurately determine the initial position of switchback.
Second aspect, the embodiment of the present application provide a kind of resistance trimming system of resistor body, the system comprises: laser and control
Device processed, the control device are connect with the laser and resistor body to be adjusted respectively；The control device, it is described for obtaining
The cutting starting position of resistor body to be adjusted；The control device is also used to control the laser and is based on preset first
Power slots to the resistance to be adjusted along predetermined cut path from the starting position；The control device, is also used to
Control the laser based on preset second power from the end position of fluting along the predetermined cut path
Switchback is until the starting position, wherein second power is less than first power.
Based on second aspect, in a kind of possible design, the control device is also used to control the laser and is based on
Preset second power and switchback speed from the end position of fluting along the predetermined cut path switchback up to
The starting position, wherein the switchback speed is greater than the cutting speed when fluting.
Based on second aspect, in a kind of possible design, the control device is also used to control the laser and is based on
The densities of points of light of preset second power and laser from the end position of fluting along the predetermined cut path return
It cuts until the starting position, wherein the densities of points of light is less than the densities of points of light when fluting.
Based on second aspect, in a kind of possible design, the control device, be also used in the fluting there is also
When residue, controls and cut the laser is again based on second power from the end position of fluting along described preset
Path switchback is cut until the starting position.
Based on second aspect, in a kind of possible design, the control device is also used to obtain the pre- of resistor body to be adjusted
Handicapping value；And the control laser is based on preset first power from the starting position along the default cutting
Path when adjusting resistor body to slot, obtains the resistance value of the resistor body to be adjusted to described；And in the resistor body to be adjusted
Resistance value when reaching the preset value, obtain the end position of the fluting.
Other feature and advantage of the application will be illustrated in subsequent specification, also, partly be become from specification
It is clear that by implementing the embodiment of the present application understanding.The purpose of the application and other advantages can be by written theorys
Specifically noted structure is achieved and obtained in bright book, claims and attached drawing.
Detailed description of the invention
Technical solution in ord to more clearly illustrate embodiments of the present application, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only some embodiments of the application, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the flow diagram of the resistance trimming method of resistor body provided by the embodiments of the present application；
Fig. 2 is the structural schematic diagram of resistor body provided by the embodiments of the present application；
Fig. 3 is the structural schematic diagram of the resistance trimming system of resistor body provided by the embodiments of the present application；
Table 1 is experimental data provided by the embodiments of the present application.
Icon: the resistance trimming system of 100- resistor body；110- laser；120- control device.
Specific embodiment
Below in conjunction with attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application is described.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.Meanwhile the application's
In description, term " first ", " second " etc. are only used for distinguishing description, are not understood to indicate or imply relative importance.
Fig. 1 and Fig. 3 are please referred to, Fig. 1 is a kind of flow chart of the resistance trimming method of resistor body provided by the embodiments of the present application, figure
3 for resistor body provided by the embodiments of the present application resistance trimming system structural schematic diagram, which comprises S100, S200 and
S300。
For ease of illustration of the implementation process of the resistance trimming method in the embodiment of the present application, below first simply introduce laser tune
The principle of resistance: control laser 110 makes resistance slurry layer stimulated light heating and gasifying to the surface-emitting laser of resistor body, is formed
The indentation of certain depth is realized to change the conductive cross-sectional area and conductive lengths of resistor body and adjusts the resistance value of resistor body
To target resistance value.
S100: the cutting starting position of resistor body to be adjusted is obtained.
S200: control laser 110 is based on preset first power from the starting position along default cutting road
Diameter slots to the resistance to be adjusted.
S300: control the laser 110 based on preset second power from the end position of fluting edge
The predetermined cut path switchback is until the starting position, wherein second power is less than first power.
The process of the present processes is described in detail below.
In a kind of possible embodiment, S100 can be implemented as follows, need treat adjust resistor body into
When row resistance trimming, resistor body to be adjusted is placed in work stage, wherein the resistor body to be adjusted is located at the two-dimensional coordinate pre-established
In system, obtain user setting or it is calculated (content that the contents of the section is well known to the skilled person, thus
This is repeated no more) abscissa and ordinate of the cutting starting position of resistor body to be adjusted in the two-dimensional coordinate system.
Wherein, in the present embodiment, the resistor body to be adjusted is small size, light and thin type ceramics water type resistance, in other realities
It applies in example, the resistor body to be adjusted may be the other kinds of resistance such as large scale plate resistor.
In alternatively possible embodiment, S100 can be implemented as follows, need to treat tune resistor body
When carrying out resistance trimming, it is located at when adjusting the cutting starting position of resistor body in the laser that control laser 110 emits, is opened described in acquisition
Abscissa and ordinate of the beginning position in the two-dimensional coordinate system.
Wherein, the laser 110 used in the present embodiment is the optical-fiber laser resistance adjuster of model JPT MOPA, at it
In his embodiment, laser 110 can be other kinds of laser 110.
S200: control laser 110 is based on preset first power from the starting position along default cutting road
Diameter slots to the resistance to be adjusted.
In a kind of possible embodiment, S200 can be implemented as follows, get the starting position
Abscissa and ordinate when, control laser of the laser 110 based on preset first power emission is from the start bit
It slots along predetermined cut path to the resistance to be adjusted at the place of setting.
Wherein, the preset cutting path be in the track top view after adjusting the cutting on resistor body,
The cutting path can be L-type, and linear type etc., cutting path is not construed as limiting, in the present embodiment, referring to figure 2., described pre-
The linear type of the cutting path first set.It is described to preset cutting path be linear type when, due to two o'clock determine one it is straight
Line, it is therefore desirable to obtain the position of at least one point on the preset cutting path at the starting position in addition to
Set coordinate.When the preset cutting path is L-type, need to obtain on the preset cutting path except described
With 1 points outer of position coordinates at starting position, with the unique cutting path of determination.The coordinate value of each point on path
Setting and acquisition, be well known content described in those skilled in the art, so details are not described herein.
As alternatively possible embodiment, the cutting path further includes the depth of fluting and the width of fluting.
Control device 120 can determine the parameters such as power, speed and the densities of points of light of laser beam according to depth and width.
S300: control the laser 110 based on preset second power from the end position of fluting edge
The predetermined cut path switchback is until the starting position, wherein second power is less than first power.
In order to remove the residue in fluting, control the laser under conditions of guaranteeing not damaging resistor body substrate
110 based on preset second power from the end position of fluting along the predetermined cut path switchback up to described
Starting position, wherein second power is less than first power.Due to switchback cut direction and fluting when cutting side
To on the contrary, and switchback cutting path it is identical as cutting path when fluting, therefore, can by the removing residues in fluting,
Simultaneously as the second power, less than the first power, therefore, the temperature change of the resistor body in switchback process is little, then make
The resistance value of resistor body in switchback process can be more stable, will not be by the substrate damage of resistor body.
As an implementation, second power is 1/10th of first power.
For example, second power is 0.3W when first power is 3W.
Since the size of laser beam is related with laser power, laser power is smaller, and laser beam is thinner, by by switchback process
In the second power setting be 1/10th of first power, so that the laser beam in switchback process is thinner, Ke Yijian
Gu Qingli residue effect and the effect for reducing influence of the laser to the resistance value of resistor body in switchback process.
As an implementation, second power may be 1/9th of first power.
For example, second power is 0.27W when first power is 3W.
As an implementation, second power is the arbitrary value in 0.2W-0.8W.
For example, second power can be 0.2W, second power can be 0.5W, and second power can be
0.8W。
, can not only be by removing residues when second power is the arbitrary value in 0.2W-0.8W, and it can be most
Reduce influence of the laser to the resistance value of resistor body in switchback process to big degree.
Since the size of laser beam is related with the cutting speed of laser 110, cutting speed is bigger, and laser beam is thinner, together
When, the laser beam in switchback process is thinner, and laser influences the resistance value of resistor body smaller in switchback process, therefore, as one kind
Embodiment, S300 include:
The laser 110 is controlled to open from the end position of fluting based on preset second power and switchback speed
Begin along the predetermined cut path switchback until the starting position, wherein cutting when the switchback speed is greater than the fluting
Cut speed.
Wherein, three times of the cutting speed when switchback speed is the fluting.
For example, the switchback speed is 90mm/s when the cutting speed is 30mm/s.
As an implementation, four times of the cutting speed when switchback speed is the fluting.
For example, the switchback speed is 120mm/s when the cutting speed is 30mm/s.
As an implementation, the switchback speed is the arbitrary value in 80mm/s-150mm/s.
For example, the switchback speed can be 80mm/s, the switchback speed can be 90mm/s, and the switchback speed is also
It can be 150mm/s.
The switchback speed be 80mm/s-150mm/s in arbitrary value when, can not only by removing residues, and
Influence of the laser to the resistance value of resistor body in switchback process can farthest be reduced.
It is greater than cutting speed when fluting due to the switchback speed of the laser 110 in switchback process, so that switchback process
In laser it is thinner, then reduce switchback process in influence of the laser to the resistance value of resistor body.
Since the size of laser beam and the densities of points of light of laser are related, in the identical situation of single pulse energy, luminous point is close
Spend smaller, laser beam is thinner, and therefore, as an implementation, S300 includes:
Control stop bits of densities of points of light of the laser 110 based on preset second power and laser from fluting
It sets place to start along the predetermined cut path switchback until the starting position, wherein the densities of points of light is less than the fluting
When densities of points of light.
Since the densities of points of light of the laser in switchback process is less than the densities of points of light of laser when slotting, so that switchback process
In laser it is thinner, then reduce switchback process in influence of the laser to the resistance value of resistor body.
As an implementation, two of the densities of points of light when densities of points of light when switchback is the fluting/
One.
For example, when densities of points of light in the fluting is 400p/mm, the densities of points of light when switchback is 200p/mm.
For example, when densities of points of light in the fluting is 500p/mm, the densities of points of light when switchback is 250p/mm.
As an implementation, four of the densities of points of light when densities of points of light when switchback is the fluting/
One.
For example, when densities of points of light in the fluting is 400p/mm, the densities of points of light when switchback is 100p/mm.
As an implementation, the densities of points of light when switchback is 200p/mm.
, can not only be by removing residues when densities of points of light in the switchback is 200p/mm, and it being capable of maximum journey
Degree ground reduces influence of the laser to the resistance value of resistor body in switchback process.
As an implementation, S200 includes:
Control densities of points of light of the laser 110 based on preset second power, switchback speed and laser from
Start at the end position of fluting along the predetermined cut path switchback until the starting position, wherein the switchback speed
Cutting speed when greater than the fluting, and the densities of points of light be less than the fluting when densities of points of light.
As an implementation, before S200, the method also includes: A1, A2 and A3.
A1: the preset resistive value of resistor body to be adjusted is obtained.
When needing to carry out resistance trimming to resistor body, the preset resistive value of the resistor body to be adjusted of user setting is obtained, wherein described
Preset resistive value can be 2 times of the resistor body resistance value to be adjusted, and the preset resistive value can be the 3 of the resistor body resistance value to be adjusted
Times etc., the preset value can be 30 ohm, 40 ohm etc., and the preset value is set according to user demand, and the preset value is not
It limits.
For example, when the current resistance value wait adjust resistance is 10 ohm, if the preset resistive value is the resistance to be adjusted
2 times when, then, the preset resistive value is 20 ohm, if the preset resistive value is described when adjusting 3 times of resistance, then, institute
Stating preset resistive value is 30 ohm.
A2: it controls the laser 110 and is based on preset first power from the starting position along described default
Cutting path when adjusting resistor body to slot, obtains the resistance value of the resistor body to be adjusted to described.
When the resistance value for needing to treat tune resistor body measures, described a constant-current source is set wait adjust around resistor body,
So that the constant-current source and the resistor body to be adjusted form primary Ioops, preset the is based on controlling the laser 110
One power from the starting position along the predetermined cut path to described when adjusting resistor body to slot, by surveying in real time
The voltage at resistor body both ends to be adjusted is measured, and using the voltage value at resistor body both ends to be adjusted divided by the perseverance for flowing through the resistor body to be adjusted
The current value of constant current then obtains the resistance value of the resistor body to be adjusted.
A3: described when adjusting the resistance value of resistor body to reach the preset value, the end position of the fluting is obtained.
As an implementation, it is opened described in acquisition when adjusting the resistance value of resistor body equal with the preset value described
Abscissa and ordinate of the end position of slot in the two-dimensional coordinate system.
As another embodiment, small in the absolute value of the resistance value and the difference of the preset value of the resistor body to be adjusted
When preset error value, abscissa and ordinate of the end position of the fluting in the two-dimensional coordinate system are obtained.Wherein,
The value range of the preset error value is 0.1% and the product of the preset value -- 0.5% with the product of the preset value, in this reality
It applies in example, the preset error value is the product of 0.4% with the preset value, and in other embodiments, the preset error value can
Think that the product of 0.5% Yu the preset value, the preset error value may be the product of 0.1% Yu the preset value.
In order to thoroughly remove the residue in fluting, therefore, there is also when residue in the fluting, therefore, as
A kind of embodiment, the method also includes:
There is also when residue, control the laser 110 to be again based on second power from opening in the fluting
Start at the end position of slot along the predetermined cut path switchback until the starting position.
As an implementation, there is also when residue, control the laser 110 to be again based in the fluting
Second power, the switchback speed from the end position of fluting along the predetermined cut path switchback up to described
Starting position.
As an implementation, there is also when residue, control the laser 110 to be again based in the fluting
Second power, the laser densities of points of light from the end position of fluting it is straight along the predetermined cut path switchback
To the starting position.
Resistance effect is repaired using after switchback in order to verify, please refers to table 1, it is 0402 that the application, which utilizes package dimension, default
The ceramics water type resistance of 1 Ω of resistance value (range of initial resistance value is 0.65 Ω -0.9 Ω) is tested.Randomly choose 10 resistance into
Row test then, introduces firstly, the resistance error for carrying out repairing the resistor body that resistance obtains by the way of switchback is not added is denoted as " a "
The resistance error that resistance mode carries out repairing the resistor body that resistance obtains of repairing of switchback is " b ".Whether compare resistance error before and after switchback
(that is, if desired producing 1 Ω of preset resistive value, resistance error is less than or equal to 1% resistance, in the industry laser in controlled range
The resistance error of resistor body after repairing resistance should be at ± 0.6% in the range of the product of the preset resistive value).
Table 1
Referring to figure 3., Fig. 3 is a kind of structural block diagram of the resistance trimming system 100 of resistor body provided by the embodiments of the present application.Under
Face will be illustrated structural block diagram shown in Fig. 3, and shown system includes: laser 110 and control device 120, the control
Device 120 is connect with the laser 110 and resistor body to be adjusted respectively, wherein the control device 120 is for executing above-mentioned electricity
The resistance trimming method of resistance body.
The control device 120, for obtaining the cutting starting position of the resistor body to be adjusted.
The control device 120 is also used to control the laser 110 and is opened based on preset first power from described
It slots along predetermined cut path to the resistor body to be adjusted at beginning position.
The control device 120 is also used to control the laser 110 based on preset second power from fluting
Start at end position along the predetermined cut path switchback until the starting position, wherein second power is less than institute
State the first power.
As an implementation, the control device 120 is also used to control the laser 110 and is based on presetting
The second power and switchback speed from the end position of fluting along the predetermined cut path switchback up to described
Position, wherein the switchback speed is greater than the cutting speed when fluting.
As an implementation, the control device 120 is also used to control the laser 110 and is based on presetting
The second power and laser densities of points of light from the end position of fluting along the predetermined cut path switchback up to institute
State starting position, wherein the densities of points of light is less than the densities of points of light when fluting.
As an implementation, the control device 120 is also used in the fluting control there is also when residue
It makes and is returned the laser 110 is again based on second power from the end position of fluting along the predetermined cut path
It cuts until the starting position.
As an implementation, the control device 120, is also used to obtain the preset resistive value of resistor body to be adjusted；And
Control the laser 110 be based on preset first power from the starting position along the predetermined cut path to institute
It states when adjusting resistor body to be slotted, obtains the resistance value of the resistor body to be adjusted；And it is reached in the resistance value of the resistor body to be adjusted
When to the preset value, the end position of the fluting is obtained.
The specific implementation that the above-mentioned function of control device 120 is realized in the present embodiment refers to and implements shown in above-mentioned Fig. 1
Content described in example, details are not described herein again.
In conclusion the resistance trimming method and system for the resistor body that each embodiment of the application proposes, which comprises obtain
The cutting starting position of resistor body to be adjusted；It controls laser 110 and is based on preset first power from the starting position
It slots along predetermined cut path to the resistance to be adjusted；It controls the laser 110 and is based on preset second power
Along the predetermined cut path switchback up to the starting position from the end position of fluting, wherein second function
Rate is less than first power.The residue in fluting can be removed by this way, simultaneously as the second power is smaller,
Therefore, the resistance value of the resistor body in switchback process is more stable, will not be by the substrate damage of resistor body.
In embodiment provided herein, it should be understood that disclosed device and method, it can also be by other
Mode realize.The apparatus embodiments described above are merely exemplary, for example, the flow chart and block diagram in attached drawing are shown
According to device, the architectural framework in the cards of method and computer program product, function of multiple embodiments of the application
And operation.In this regard, each box in flowchart or block diagram can represent one of a module, section or code
Point, a part of the module, section or code includes one or more for implementing the specified logical function executable
Instruction.It should also be noted that function marked in the box can also be attached to be different from some implementations as replacement
The sequence marked in figure occurs.For example, two continuous boxes can actually be basically executed in parallel, they sometimes may be used
To execute in the opposite order, this depends on the function involved.It is also noted that each of block diagram and or flow chart
The combination of box in box and block diagram and or flow chart can be based on the defined function of execution or the dedicated of movement
The device of hardware is realized, or can be realized using a combination of dedicated hardware and computer instructions.
In addition, each functional module in each embodiment of the application can integrate one independent portion of formation together
Point, it is also possible to modules individualism, an independent part can also be integrated to form with two or more modules.
Claims (10)
1. a kind of resistance trimming method of resistor body, which is characterized in that the described method includes:
Obtain the cutting starting position of resistor body to be adjusted；
Control laser be based on preset first power from the starting position along predetermined cut path to described wait adjust
Resistor body is slotted；
Control the laser based on preset second power from the end position of fluting along the default cutting
Path switchback is until the starting position, wherein second power is less than first power.
2. the method according to claim 1, wherein second power be first power ten/
One.
3. the method according to claim 1, wherein controlling the laser is based on preset second power
Along the predetermined cut path switchback up to the starting position from the end position of fluting, comprising:
Control the laser based on preset second power and switchback speed from the end position of fluting along institute
Predetermined cut path switchback is stated until the starting position, wherein the switchback speed is greater than the cutting speed when fluting.
4. the method according to claim 1, wherein controlling the laser is based on preset second power
Along the predetermined cut path switchback up to the starting position from the end position of fluting, comprising:
The laser is controlled to open from the end position of fluting based on the densities of points of light of preset second power and laser
Begin along the predetermined cut path switchback until the starting position, wherein the densities of points of light is less than the light when fluting
Dot density.
5. the method according to claim 1, wherein the method also includes:
There is also when residue, control the laser to be again based on end of second power from fluting in the fluting
Start at position along the predetermined cut path switchback until the starting position.
6. the method according to claim 1, wherein being based on preset second function controlling the laser
Rate from the end position of fluting along the predetermined cut path switchback before the starting position, the method is also
Include:
Obtain the preset resistive value of resistor body to be adjusted；
It controls the laser and is based on preset first power from the starting position along the predetermined cut path pair
It is described when adjusting resistor body to be slotted, obtain the resistance value of the resistor body to be adjusted；
Described when adjusting the resistance value of resistor body to reach the preset value, the end position of the fluting is obtained.
7. a kind of resistance trimming system of resistor body, which is characterized in that the system comprises: laser and control device, the control
Device is connect with the laser respectively；
The control device, for obtaining the cutting starting position of resistor body to be adjusted；
The control device is also used to control the laser and is based on preset first power from edge from the starting position
Predetermined cut path slots to the resistor body to be adjusted；
The control device is also used to control the laser based on preset second power from the end position of fluting
Start along the predetermined cut path switchback until the starting position, wherein second power is less than first power.
8. system according to claim 1, which is characterized in that the control device is also used to control the laser base
It is straight along the predetermined cut path switchback in preset second power and switchback speed are from the end position of fluting
To the starting position, wherein the switchback speed is greater than the cutting speed when fluting.
9. system according to claim 1, which is characterized in that the control device is also used to control the laser base
Along the predetermined cut path in the densities of points of light of preset second power and laser is from the end position of fluting
Switchback is until the starting position, wherein the densities of points of light is less than the densities of points of light when fluting.
10. system according to claim 1, which is characterized in that the control device is also used to obtain resistor body to be adjusted
Preset resistive value；It controls the laser and is based on preset first power from the starting position along the default cutting road
Diameter when adjusting resistor body to slot, obtains the resistance value of the resistor body to be adjusted to described；And in the resistor body to be adjusted
When resistance value reaches the preset value, the end position of the fluting is obtained.
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| CN201910312427.8A CN109994295A (en) | 2019-04-18 | 2019-04-18 | The resistance trimming method and system of resistor body |
| PCT/CN2020/084724 WO2020211754A1 (en) | 2019-04-18 | 2020-04-14 | Resistance regulation method and system for resistor body |
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| CN110993229A (en) * | 2019-12-31 | 2020-04-10 | 深圳市杰普特光电股份有限公司 | Method for obtaining laser resistance-adjusting scheme, laser resistance-adjusting scheme and chip resistor |
| WO2020211754A1 (en) * | 2019-04-18 | 2020-10-22 | 深圳市杰普特光电股份有限公司 | Resistance regulation method and system for resistor body |
| CN112894162A (en) * | 2021-01-14 | 2021-06-04 | 大族激光科技产业集团股份有限公司 | Laser cutting method and laser cutting system for circuit board |
| CN114888454A (en) * | 2022-05-25 | 2022-08-12 | 深圳市杰普特光电股份有限公司 | Cutting method of battery pole piece |
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Application publication date: 20190709 |