JP2010194554A - Laser beam machining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser beam machining technique capable of efficiently forming a plurality of pieces of machining lines, which are nonuniform in pitch, dimension and position, on the surface of a workpiece. <P>SOLUTION: The laser beam machining apparatus 10 includes: a means of branching a laser beam into a plurality of beams; a means of adjusting pitches between the branched beams; a means of moving irradiation positions by which a shutter device of each branched beam and the irradiation position of each branched beam are moved in the XY directions; a controller 16; a means of determining the dimension, position and pitch of each target machining line by taking in CAD data; a means of setting groups to be simultaneously machined on the basis of the dimension, position, and pitch of each target machining line, the number of branched beams, and a pitch adjustable range between the branched beams; and a means which acquires, by the unit of the simultaneous machining group, positional information at the point of time of starting machining of a reference branched beam, positional information at the point of time of machining completion, pitch information between the branched beams, and specific information of shutter devices to be blocked during the machining, and which forms a control program including these pieces of information to transmit to the controller 16. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a laser processing technique, and more particularly to a laser processing apparatus that simultaneously forms a plurality of processing lines on a workpiece by branching a laser beam into a plurality of laser beams.

In order to increase the efficiency of laser processing, it has been practiced to divide a laser beam emitted from a laser oscillator into a plurality of parts by using an optical element and simultaneously irradiate a plurality of places on a workpiece at the same time. For example, FIG. 3 of Patent Document 1 discloses a technique of splitting laser beams emitted from two laser oscillators into eight laser beams by combining a total reflection mirror and a semi-transmission mirror. ing.
As a result, it is possible to irradiate the surface of the relatively long roller with a laser beam over a wide range at a time, and the film removal operation on the roller surface can be made efficient.
Table 96/20435 JP2007-190560

In the case of this prior art, the purpose of processing is to remove the organic film adhering to the surface on the roller. Therefore, if the laser beam is branched into a plurality of beams as described above, and condensed directly on the surface of the roller. That's enough.
On the other hand, there is a process in which a laser beam is irradiated onto the surface of a planar workpiece and a large number of processing lines are formed with high accuracy (for example, a conductive film is deposited on the entire surface of an insulating substrate). For example, the work piece is irradiated with a laser beam to remove the conductive film into a linear shape).
Even for such processing, it is expected that the processing efficiency can be improved by applying a technique in which one laser beam is branched into a plurality of beams and irradiated simultaneously.

However, in such processing, the pitch between processing target lines is often different, and the size and position of the processing target lines are often not uniform. Simply irradiating the work surface did not make it useful.
Of course, as disclosed in FIG. 6 of Patent Document 2, if a dedicated galvano scanner is prepared for each branch beam, each irradiation position can be controlled independently. Increased size and complexity are inevitable.

  The present invention has been devised to solve the above-described problems of the prior art, and is a multi-axis simultaneous machining technique in which a laser beam is branched into a plurality of beams and simultaneous machining is performed using each branched beam. An object of the present invention is to provide a laser processing technique that can efficiently form a plurality of processing lines with non-uniform pitches, dimensions, and positions on the surface of a workpiece by making improvements.

  In order to achieve the above object, a laser processing apparatus according to the present invention includes a beam branching unit for branching a laser beam emitted from a laser oscillator into a plurality of beams, and a pitch between the branched beams within a predetermined range. A pitch adjusting means for adjusting the position, a shutter device for switching the opening and closing of the optical path through which each branched beam passes, an irradiation position moving means for relatively moving the irradiation position of each branched beam on the workpiece in the XY direction, and the above A laser oscillator ON / OFF, a pitch adjustment between branched beams by the pitch adjusting means, an optical path opening / closing by the shutter device, a control means for controlling movement of an irradiation position by the irradiation position moving means, and a plurality of processing target lines. Means to import the described CAD data, calculate the size and position of each machining target line, the pitch between each machining target line, and each machining target Select the combination of machining target lines to be processed at the same time based on the dimensions of the in, the position, the pitch between each machining target line, the number of branch beams, and the pitch variable range between the branch beams. Means to be set, position information at the start of processing of at least one of the branched beams, position information at the end of processing, pitch information between each branched beam, and block during processing, in units of simultaneous processing groups Means for obtaining shutter specific information and generating a control program including the information, and means for transmitting the control program to the control means, the control means based on the control program, the laser oscillator ON / OFF, pitch adjustment between branched beams by the pitch adjusting means, opening / closing of the optical path by the shutter device, movement of irradiation position It is characterized by controlling the movement of the irradiation position by stage.

In the laser processing apparatus according to the present invention, combinations of processing target lines that can be simultaneously processed based on the dimensions and positions of the processing target lines, the pitch between the processing target lines, the number of branch beams, and the variable pitch range. Is required and certified as a simultaneous processing group. Further, for each group, position information at the start of processing, position information at the end of processing, pitch information at the time of processing, and specific information of the shutter device to be closed are obtained, and a control program reflecting these is generated. . A mechanism is provided in which actual laser processing is executed according to this control program.
In other words, as the device configuration, it is only necessary to provide a mechanism for adjusting the pitch between each branch beam to the existing device, and then the configuration of the processing target line is analyzed in advance based on the CAD data, and simultaneous processing is possible. Possible machining target lines are grouped as simultaneous machining groups, machining conditions are set for each group, and a control program that reflects these is generated, making it extremely efficient for workpieces with various machining target lines. Can be processed.

FIG. 1 is a schematic diagram showing a basic configuration of a laser processing apparatus 10 according to the present invention, which includes a laser head 12, a laser oscillator 14, a control unit 16, a PC 18, and a table 20.
On the table 20, a flat work 22 is placed. The workpiece 22 is made of, for example, a conductive thin film 26 deposited on the surface of an insulating substrate 24.

The laser head 12 is mounted on a linear servo motor 28 and is installed so as to be able to reciprocate in the Y direction along the linear guide.
Although not shown, the table 20 is also placed on a linear servo motor, and is installed so as to reciprocate in the X direction along the linear guide.
The linear servo motor 28 on the laser head 12 side and the linear servo motor on the table 20 side correspond to the “irradiation position moving means” in the claims.

As shown in FIG. 2, the laser head 12 includes a rectangular parallelepiped casing 30, a horizontally long fixed plate 31 disposed and fixed inside the casing 30, and four vertically long branches attached to the fixed plate 31. And plates 32 to 35.
An opening 36 for passing a laser beam is provided on the bottom side of the casing 30. An opening 37 for introducing a laser beam is provided on the side surface of the casing 30.

The first branching plate 32 disposed at the left end of each branching plate has a first total reflection mirror 38, a first shutter device 39, and a first processing lens 40 on the surface side thereof. The placement is fixed.
Further, a first beam splitter 41, a second shutter device 42, and a second processing lens 43 are arranged and fixed on the surface side of the second branching plate 33.
The third branching plate 34 has a second beam splitter 44, a first polarizing plate 45, a third beam splitter 46, a third shutter device 47, and a third processing on the surface side thereof. The lens 48 is arranged and fixed.
On the surface of the fourth branch plate 35, a second polarizing plate 49, a second total reflection mirror 50, a fourth shutter device 51, and a fourth processing lens 52 are arranged and fixed. Yes.
A third polarizing plate 53 is disposed and fixed between the second branching plate 33 and the third branching plate 34.

The first branch plate 32 has its back side fixed to the surface of the fixed plate 31, whereas the second branch plate 33, the third branch plate 34, and the fourth branch plate 35 are These are attached to the fixed plate 31 so as to be slidable in the lateral direction within a certain movable range by linear servo motors 54 provided on the back side.
The linear servo motor 54 corresponds to “pitch adjusting means” in the claims.

  The first shutter device 39, the second shutter device 42, the third shutter device 47, and the fourth shutter device 51 each have a function of opening and closing the light shielding plate by opening and closing the optical path of the laser beam by driving the solenoid. ing.

  The first beam splitter 41, the second beam splitter 44, and the third beam splitter 46 have a function of transmitting about 50% of the light beam and reflecting the remaining 50% of the light beam.

  The first polarizing plate 45, the second polarizing plate 49, and the third polarizing plate 53 are disposed immediately before the third beam splitter 46, the second beam splitter 44, and the first beam splitter 41, respectively, and rotate. It is attached as possible. These polarizing plates are composed of λ / 4 and λ / 2 plates, and the balance of the laser beam branched by the beam splitter can be adjusted by rotating each plate at an appropriate angle.

The laser beam LB emitted from the laser oscillator 14 is reflected by the third total reflection mirror 55 and enters the casing 30 through the opening 37 of the laser head 12.
Then, the laser beam LB that has passed through the second polarizing plate 49 is branched into two by the second beam splitter 44.

First, the branched beam that has passed through the second beam splitter 44 enters the first beam splitter 41, and is further split into two beams.
That is, when the first branched beam B1 transmitted through the first beam splitter 41 is reflected downward by the first total reflection mirror 38, and the first shutter device 39 is in the “open” state. The light passes through this and reaches the first processing lens 40, where it is condensed and irradiated onto the surface of the work 22.
Further, the second branched beam B2 reflected downward by the first beam splitter 41 is incident on the second shutter device 42, and when it is in the “open” state, the second processed lens as it is. 43 is reached, and the surface of the work 22 is irradiated.

On the other hand, the branched beam reflected downward by the second beam splitter 44 enters the third beam splitter 46 and is further branched into two beams.
That is, the third branched beam B3 that has passed through the third beam splitter 46 is incident on the third shutter device 47, and when it is in the “open” state, reaches the third processing lens 48 as it is. The surface of the work 22 is irradiated.
Further, the fourth branched beam B4 reflected in the horizontal direction by the third beam splitter 46 is reflected downward by the second total reflection mirror 50, and the fourth shutter device 51 is in the “open” state. In some cases, the light passes through this, reaches the fourth processing lens 52, and is irradiated onto the surface of the workpiece 22.

The control unit 16 includes an NC device (Numerical Control Unit), and has a function of generating a control signal according to a given control program and outputting the control signal to the laser oscillator 14, the laser head 12, and the table 20.
Below, the control content by the control part 16 is illustrated.
(1) ON / OFF of laser oscillator 14, output level, oscillation mode (PW / pulse) control
(2) Reciprocating movement of laser head 12 in Y direction (drive control of linear servo motor 28)
(3) Driving the linear servo motor 54 for adjusting the positions of the second branch plate 33, the third branch plate 34, and the fourth branch plate 35 (adjustment of the pitch between the branch beams)
(4) Opening / closing control of the first shutter device 39, the second shutter device 42, the third shutter device 47, and the fourth shutter device 51
(5) Reciprocating movement of table 20 in the X direction (linear servo motor drive control)

In the PC 18, there is a dedicated application program having a CAD data in which a processing target line to be formed on the workpiece 22 is drawn and a function for automatically generating the control program for the control unit 16 based on the CAD data. It is installed.
The processing procedure of the PC 18 that operates according to this dedicated application program will be described below with reference to the flowchart of FIG.

First, the PC 18 reads a CAD data file stored in the hard disk, and acquires the start point (XY coordinate) and end point (XY coordinate) of the processing target line described therein (S10).
Next, the PC 18 calculates the dimension (length) in the X direction of each processing target line, the position in the X direction, and the pitch between the processing target lines based on the start point and end point of the processing target line (S12).

Next, the PC 18 sets a group to be simultaneously processed for each processing target line (S14).
In this grouping, the following logic (rule) is applied.
(1) The same group is formed between processing target lines having the same dimension and position in the X direction.
(2) Whether or not grouping is possible is determined based on the number of each branch beam of the laser head 12 and whether or not it falls within the movable range (pitch adjustable range) between processing target lines having the same X-direction dimension and position. .
(3) When there are a plurality of combinations that can be grouped within the movable range of each branch beam, a combination having the same processing pitch is preferentially selected.

For example, as shown in FIG. 4, when a total of 14 machining target lines L01 to L14 are described in the CAD data, the PC 18 recognizes five simultaneous machining groups G1 to G5 as follows. .
First, since the processing target line L01 has a longer dimension in the X direction than other processing target lines, one processing line is recognized as an independent processing group, and a group ID G1 is given.
L13 and L14 have the same dimensions as L02 to L12, but the X-direction position (X coordinate of the start point and end point) is different, so two are recognized as independent processing groups, and the group ID G5 is given. Is done.

The remaining L02 to L12 are grouped in consideration of the movable range of the branched beams B1 to B4 emitted from the laser head 12, since the dimensions and positions in the X direction are common.
First, since the combination of L02, L05, L08, and L11 is a combination that falls within the movable range of the branched beams B1 to B4 and has the same processing pitch, the group ID of G2 is assigned by the PC 18.
Similarly, since the combination of L03, L06, L09, and L12 is a combination that falls within the movable range of the branched beams B1 to B4 and has the same processing pitch, the group ID of G3 is given by the PC 18.
Further, since the combination of L04, L07, and L10 is a combination that falls within the movable range of the branched beams B1 to B3 and has the same processing pitch, the group ID of G4 is assigned by the PC 18.

The above group ID represents the processing order as it is.
That is, since L01 exists at the upper left part of the drawing, which is the starting point of processing, G1 which is the youngest ID is assigned. Next, as the laser head 12 moves in the Y direction, a large number of IDs such as G2, G3, G4, and G5 are allocated.

After the above grouping or in parallel with the grouping, the processing conditions (parameters) of each group are calculated by the PC 18 (S16).
Specific examples of processing conditions are shown below.
(1) Position at the start of laser irradiation of the first branch beam B1 as a reference (processing start point)
(2) Position of the first branched beam B1 at the end of laser irradiation (processing end point)
(3) Pitch between each branched beam at the start of laser irradiation (machining pitch)
(4) Specific information of the shutter device to be shielded during laser irradiation

The PC 18 automatically generates a control program reflecting the above calculation results, that is, the configuration of each group, the processing order, and the processing conditions (S18), and then registers the control program file in a predetermined area of the hard disk. (S20).
Next, the PC 18 uploads the control program to the control unit 16 (S22).
The control unit 16 executes laser processing according to this control program.

Hereinafter, a processing method using the laser processing apparatus 10 will be described.
First, when performing processing on the processing group G1, the laser head 12 and the table 20 move by a required amount in the required direction, and the irradiation position of the first branch beam B1 serving as a reference is set as the processing start point of the processing target line L01. To match.
At this time, as shown in FIG. 5, only the first shutter device 39 is “open” and the other shutter devices are “closed”.
Here, when the laser beam BL is emitted from the laser oscillator 14, the first branch beam B1 divided into ¼ by the second beam splitter 44 and the first beam splitter 41 is used for the first branch. The light is condensed by the first processing lens 40 mounted on the plate 32 and enters the processing start point of the processing target line L01. In this state, the table 20 moves in the downward direction in FIG. 4 to execute processing on the processing target line L01.

  When the irradiation position of the first branch beam B1 reaches the processing end point of L01, the emission of the laser beam BL from the laser oscillator 14 is stopped, and at the same time, the laser head 12 and the table 20 are moved in the necessary direction by a necessary amount. The irradiation position of the first branch beam B1 is adjusted to the processing start point of the processing target line L02 belonging to the next processing group G2.

  At this time, as shown in FIG. 2, the shutter devices mounted on all the branching plates are “open”. Further, the second branch plate 33 to the fourth branch plate 35 slide in the required direction in the required direction, and the irradiation positions of the respective branch beams B2, B3, B4 are aligned with the processing start points of L05, L08, L11. It is done.

  Here, when the laser beam LB is emitted from the laser oscillator 14, the branched beams B1 to B4 divided into ¼ by the second beam splitter 44, the first beam splitter 41, and the third beam splitter 46 are formed. These are condensed by the first processing lens 40 to the fourth processing lens 52, respectively, and enter the processing start points of the processing target lines L02, L05, L08, and L11. In this state, the table 20 moves in the upward direction in FIG. 4 to execute processing on the processing target lines L02, L05, L08, and L11.

  When the irradiation position of the first branch beam B1 reaches the processing end point of L02, the emission of the laser beam LB from the laser oscillator 14 is stopped, and at the same time, the laser head 12 and the table 20 move by a necessary amount in the necessary direction. The irradiation position of the first branch beam B1 is adjusted to the processing start point of the processing target line L03 belonging to the next processing group G3.

  Also in this case, as shown in FIG. 2, the shutter devices mounted on all the branching plates are “open”. Further, since there is no change in the pitch between the lines to be processed, each irradiation position is L06, L09 without adjusting the pitch by moving the second branching plate 33 to the fourth branching plate 35. , It matches the processing start point of L12.

  Here, when the laser beam LB is emitted from the laser oscillator 14, the branched beams B1 to B4 divided into ¼ by the second beam splitter 44, the first beam splitter 41, and the third beam splitter 46 are formed. These are condensed by the first processing lens 40 to the fourth processing lens 52, respectively, and enter the processing start points of the processing target lines L03, L06, L09, and L12. In this state, the table 20 moves downward in the plane of FIG. 4 to execute processing on the processing target lines L03, L06, L09, and L12.

  When the irradiation position of the first branch beam B1 reaches the processing end point of L03, the emission of the laser beam LB from the laser oscillator 14 is stopped, and at the same time, the laser head 12 and the table 20 move by a necessary amount in the necessary direction. The irradiation position of the first branch beam B1 is adjusted to the processing start point of the processing target line L04 belonging to the next processing group G4.

  In this case, as shown in FIG. 6, only the fourth shutter device 51 is “closed”, and the other shutter devices are “open”. Further, since there is no change in the pitch between the processing target lines, each irradiation position can be obtained without adjusting the pitch between the branch beams by moving the second branch plate 33 and the third branch plate 34. Is consistent with the processing start points of L07 and L10.

  Here, when the laser beam LB is emitted from the laser oscillator 14, the branched beams B1 to B3 divided into ¼ by the second beam splitter 44, the first beam splitter 41, and the third beam splitter 46 are generated. Then, it enters the machining start point of the machining target lines L04, L07, L10. In this state, the table 20 moves in the upward direction in FIG. 4 to execute processing on the processing target lines L04, L07, and L10.

  When the irradiation position of the first branch beam B1 reaches the processing end point of L04, the emission of the laser beam LB from the laser oscillator 14 is stopped, and at the same time, the laser head 12 and the table 20 are moved in the necessary direction by a necessary amount. Then, the irradiation position of the first branch beam B1 is adjusted to the processing start point of the processing target line L13 belonging to the next processing group G5.

  In this case, as shown in FIG. 7, the first shutter device 39 and the second shutter device 42 are “open”, and the third shutter device 47 and the fourth shutter device 51 are “closed”. Yes. In addition, since there is no change in the pitch between the lines to be processed, the irradiation position of the second branch beam B2 is at the processing start point of L14 without adjusting the pitch by moving the second branch plate. It matches.

  Here, when the laser beam LB is emitted from the laser oscillator 14, the first branched beam B1 and the second branched beam B1 divided by the second beam splitter 44, the first beam splitter 41, and the third beam splitter 46 are output. The branched beam B2 is incident on the processing start points of the processing target lines L13 and L14. In this state, when the table 20 moves downward in the drawing, the processing for the processing target lines L13 and L14 is executed.

  As described above, in the laser processing apparatus 10, even if the CAD data includes processing target lines of various patterns having different dimensions, positions, and pitches, the dimensions and positions are common and simultaneous processing is possible. Possible machining target lines are narrowed down as grouping candidates, and then a specific simultaneous machining group is set based on the number of branch beams and the movable pitch range between the branch beams. Simultaneous processing is possible.

  In the above, an example in which the laser beam emitted from the laser oscillator 14 is divided into four using the first beam splitter 41, the second beam splitter 44, and the third beam splitter 46 has been shown. The present invention is not limited to this, and can be widely applied to a laser processing apparatus having a mechanism for generating two or more branched beams.

FIG. 4 shows an example in which one type of CAD data includes a plurality of types of machining target lines having different dimensions and positions in the X direction and different pitches in the Y direction. About the case where it is necessary to perform machining along the machining target line with different dimensions, position, and pitch depending on the workpiece, although only the machining target line with the same size and position in the X direction and the pitch in the Y direction is included. However, the present invention is applicable.
In such a case, a plurality of control programs may be generated in advance based on a plurality of CAD data, uploaded to the control unit 16, and the control programs may be switched when exchanging workpieces.

It is a schematic diagram which shows the basic composition of the laser processing apparatus which concerns on this invention. It is explanatory drawing which shows the internal structure of a laser head. It is a flowchart which shows the process sequence of PC which operate | moves according to a dedicated application program. It is a schematic diagram which shows an example of a process target line. It is explanatory drawing which shows the internal structure of the laser head in the case of irradiating only a 1st branch beam. It is explanatory drawing which shows the internal structure of the laser head in the case of irradiating a 1st branch beam, a 2nd branch beam, and a 3rd branch beam. It is explanatory drawing which shows the internal structure of the laser head in the case of irradiating a 1st branch beam and a 2nd branch beam.

10 Laser processing equipment
12 Laser head
14 Laser oscillator
16 Control unit
18 PC
20 tables
22 Workpiece
26 Thin film
28 Linear servo motor
30 casing
31 Fixing plate
32 First branch plate
33 Second branch plate
34 Third branch plate
35 Fourth branch plate
36 Opening area
37 opening
38 First total reflection mirror
39 First shutter device
40 First processing lens
41 First beam splitter
42 Second shutter device
43 Second processing lens
44 Second beam splitter
45 First polarizing plate
46 Third beam splitter
47 Third shutter device
48 Third processing lens
49 Second Polarizer
50 Second total reflection mirror
51 Fourth shutter device
52 Fourth processing lens
53 Third Polarizer
54 Linear servo motor
55 Third total reflection mirror
LB laser beam
B1 First branch beam
B2 Second branch beam
B3 Third branch beam
B4 Fourth branch beam
G1 processing group
G2 processing group
G3 processing group
G4 processing group
G5 processing group
L01 to L14 Processed line

Claims (1)

Beam branching means for branching the laser beam emitted from the laser oscillator into a plurality of beams;
Pitch adjusting means for adjusting the pitch between the branched beams within a predetermined range;
A shutter device that switches between opening and closing an optical path through which each branched beam passes;
An irradiation position moving means for relatively moving the irradiation position of each branch beam on the workpiece in the XY direction;
Control means for controlling ON / OFF of the laser oscillator, pitch adjustment between the branched beams by the pitch adjusting means, opening and closing of the optical path by the shutter device, movement of the irradiation position by the irradiation position moving means,
Means for taking in CAD data describing a plurality of machining target lines, calculating the dimensions and positions of each machining target line, and the pitch between each machining target line;
Based on the size and position of each processing target line, the pitch between each processing target line, the number of branch beams, and the adjustable range of pitch between branch beams, select the combination of processing target lines to be processed simultaneously. Means for setting as a simultaneous machining group;
Position information at the start of processing of at least one of the branched beams, position information at the end of processing, pitch information between the branched beams, and specific information of the shutter device to be closed during processing in units of simultaneous processing groups Means for generating a control program including these pieces of information,
Means for transmitting the control program to the control means,
Based on the control program, the control means turns on / off the laser oscillator, adjusts the pitch between the branched beams by the pitch adjusting means, opens and closes the optical path by the shutter device, and moves the irradiation position by the irradiation position moving means. A laser processing apparatus characterized by controlling.

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