CN110993229A - Method for obtaining laser resistance-adjusting scheme, laser resistance-adjusting scheme and chip resistor - Google Patents
Method for obtaining laser resistance-adjusting scheme, laser resistance-adjusting scheme and chip resistor Download PDFInfo
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- CN110993229A CN110993229A CN201911404599.4A CN201911404599A CN110993229A CN 110993229 A CN110993229 A CN 110993229A CN 201911404599 A CN201911404599 A CN 201911404599A CN 110993229 A CN110993229 A CN 110993229A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
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Abstract
The invention relates to the technical field of laser resistance trimming, in particular to a method for acquiring a laser resistance trimming scheme, the laser resistance trimming scheme and a chip resistor. The method for acquiring the laser resistance trimming scheme comprises the following steps: cutting the resistor to be adjusted once by a snake-shaped knife edge so as to enable the resistance value precision of the resistor to be adjusted to reach the preset precision, wherein the value range of the preset precision is 0.1% -1%; carrying out secondary cutting on the cut edge of the resistor to be adjusted; judging whether the resistance value precision of the resistor to be regulated reaches the target precision or not; and if the resistance value precision of the resistor to be adjusted reaches the target precision, determining that the laser resistance adjustment scheme is to cut the blank resistor by using the snake-shaped knife edge and the bisection knife edge in sequence. The laser resistance trimming scheme is obtained by the method for obtaining the laser resistance trimming scheme. The chip resistor is produced by the laser resistance adjusting scheme. The laser resistance trimming scheme, the acquisition method thereof and the chip resistor can improve the precision and yield of finished resistors.
Description
Technical Field
The invention relates to the technical field of laser resistance trimming, in particular to a method for acquiring a laser resistance trimming scheme, the laser resistance trimming scheme and a chip resistor.
Background
The principle of laser resistance adjustment is that a beam of superfine laser beam is used for being applied to a thick film resistor and a thin film resistor, the resistor body is gasified and evaporated to cut a thick film circuit and a thin film circuit, and the resistance precision is improved by changing the conductive sectional area of the resistor.
In order to improve the resistance accuracy from 1% to 0.1%, a secondary resistance trimming method is generally adopted for laser resistance trimming. After the first resistance trimming operation, the cutting is generally performed to the precision range of 1% to 1.5% of the target value, and then after the second resistance trimming operation, the cutting is performed to the precision range of 0.1% of the target value.
However, the conventional secondary resistance trimming method generally has the problems of low resistance precision and low yield after secondary resistance trimming.
Disclosure of Invention
The first objective of the present invention is to provide a method for obtaining a laser trimming scheme, so as to obtain a laser trimming scheme that can solve the technical problems of low resistance precision and low yield after secondary trimming, which are common in the existing secondary trimming methods, to a certain extent.
The second objective of the present invention is to provide a laser trimming scheme, so as to solve the technical problems of low resistance precision and low yield after secondary trimming commonly existing in the current secondary trimming method to a certain extent.
The third objective of the present invention is to provide a chip resistor, so as to solve the technical problems of low precision and low yield of the resistor after the secondary trimming commonly existing in the current secondary trimming method to a certain extent.
In order to achieve the purpose, the invention provides the following technical scheme;
based on the first objective, the method for obtaining the laser resistance trimming scheme provided by the invention comprises the following steps:
taking one of the blank resistors as a resistor to be adjusted, and cutting the resistor to be adjusted for the first time by using a snake-shaped knife edge so as to enable the resistance value precision of the resistor to be adjusted to reach a preset precision, wherein the value range of the preset precision is 0.1% -1%;
carrying out secondary cutting on the resistor to be adjusted by a cutting edge;
judging whether the resistance value precision of the resistor to be regulated reaches the target precision or not;
and if the resistance value precision of the resistor to be adjusted reaches the target precision, determining that the laser resistance adjustment scheme is to cut the blank resistor by the snake-shaped knife edge and the bisection knife edge in sequence.
In any of the above technical solutions, optionally, after the step of determining whether the resistance accuracy of the resistor to be adjusted reaches the target accuracy, the method further includes the following steps:
if the resistance value precision of the resistor to be adjusted does not reach the target precision, replacing the resistor to be adjusted;
and circulating the steps of the replaced resistor to be adjusted until the resistance value precision of the resistor to be adjusted reaches the target precision.
In any of the above technical solutions, optionally, the step of performing the second cutting on the resistor to be adjusted by the incision point specifically includes:
cutting the resistor to be adjusted by a first knife edge to obtain a difference value between an actual resistance value and a target resistance value of the resistor to be adjusted;
and determining the length of a second knife edge according to the difference, and cutting the resistor to be adjusted by the second knife edge.
In any of the above technical solutions, optionally, the length of the first knife edge is less than half of the width of the resistor to be adjusted;
and/or the greater the difference, the greater the length of the second edge; the smaller the difference, the smaller the length of the second edge.
In any of the above technical solutions, optionally, the following steps are further included between the step of determining that the resistance accuracy of the resistor to be tuned reaches the target accuracy and the step of determining that the laser resistance tuning scheme is the step of tuning the resistance of the snake-shaped blade and the pair of blades in sequence:
judging whether the first knife edge and the second knife edge are crossed in the width direction of the resistor to be adjusted;
if the first knife edge and the second knife edge are crossed in the width direction of the resistor to be adjusted, replacing the resistor to be adjusted;
and circulating the replaced resistor to be adjusted until the first knife edge and the second knife edge do not intersect in the width direction of the resistor to be adjusted.
In any of the above technical solutions, optionally, the predetermined precision is in a range of 0.3% to 0.7%;
and/or, the target accuracy is 0.1%.
In any of the above technical solutions, optionally, the step of determining that the laser resistance adjustment scheme is the step of sequentially adjusting the resistance of the snake-shaped knife edge and the bisector knife edge specifically includes:
resistance adjustment is carried out on a preset number of sample resistors one by one according to the snake-shaped knife edge and the bisection knife edge;
taking the resistance values of all sample resistors, and judging whether the resistance value precision of the sample resistors reaches the target precision;
if the resistance value precision of all the sample resistors reaches the target precision, determining that the laser resistance adjustment scheme is to cut the blank resistor by the snake-shaped knife edge and the bisection knife edge in sequence;
if at least one of the resistance value accuracies of the sample resistors does not reach the target accuracy, the steps are circulated until the resistance value accuracies of all the sample resistors reach the target accuracy.
In any of the above technical solutions, optionally, the step of determining the laser resistance trimming scheme as cutting the blank resistance with the serpentine blade and the bisection blade in sequence specifically includes:
taking the standard deviation of the resistance values of all sample resistors after resistance adjustment, and judging whether the standard deviation is smaller than a preset standard deviation or not;
if the standard deviation is smaller than the preset standard deviation, determining that the laser resistance adjusting scheme is to cut the blank resistor by the snake-shaped knife edge and the bisection knife edge in sequence;
if the standard deviation is larger than the preset standard deviation, the above steps are repeated until the standard deviation is smaller than the preset standard deviation.
Based on the second object, the laser resistance trimming scheme provided by the invention is obtained by the method for obtaining the laser resistance trimming scheme provided by any one of the above technical schemes.
Based on the third objective, the laser resistance trimming scheme provided by the invention is obtained by performing resistance trimming according to the laser resistance trimming scheme provided by any one of the above technical schemes.
By adopting the technical scheme, the invention has the beneficial effects that:
according to the method for obtaining the laser resistance trimming scheme, the resistance precision of the obtained laser resistance trimming scheme after the first cutting is controlled within 0.1% -1%, and compared with the resistance precision of the laser resistance trimming scheme after the first cutting in the prior art, the resistance precision is obviously reduced. That is to say, the cutting amount of the second cutting can be obviously reduced, so that the current channel of the blank resistor subjected to the second cutting can be widened, the resistance value change rate of the blank resistor in unit length is reduced, the controllability of the resistance value precision of the blank resistor in the secondary resistance trimming process is improved, and further the precision and the yield of the finished product resistor can be improved compared with the existing secondary resistance trimming method by using the laser resistance trimming scheme.
The laser resistance trimming scheme provided by the invention is obtained by the method for obtaining the laser resistance trimming scheme, so that all the beneficial effects which can be realized by the method for obtaining the laser resistance trimming scheme can be realized.
The chip resistor provided by the invention is produced by the laser resistance trimming scheme, so that all the beneficial effects which can be realized by the laser resistance trimming scheme can be realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic first flowchart of a method for obtaining a laser trimming scheme according to an embodiment of the present invention;
fig. 2 is a second flowchart of a method for obtaining a laser trimming scheme according to an embodiment of the present invention;
fig. 3 is a schematic third flow chart of an obtaining method of a laser trimming scheme according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a fourth flowchart of a method for obtaining a laser trimming scheme according to an embodiment of the present invention;
fig. 5 is a schematic flow chart of a fifth method for obtaining a laser trimming scheme according to an embodiment of the present invention;
fig. 6 is a sixth flowchart illustrating an obtaining method of a laser trimming scheme according to an embodiment of the present invention;
FIG. 7 is a prior art chip resistor;
fig. 8 is a chip resistor according to a third embodiment of the present invention.
The icons of fig. 7: 80' -a serpentine edge; 81' -setting a knife edge; 810' -a first edge; 811' -second edge.
FIG. 8 is a drawing, 80-serpentine edge; 81-tool setting of a knife edge; 810-a first knife edge; 811-second edge.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example one
The method for acquiring the laser resistance trimming scheme provided by the embodiment is used for acquiring the laser resistance trimming method.
Referring to fig. 1, the method for obtaining the laser trimming scheme provided by this embodiment includes the following steps:
s100, cutting the resistor to be adjusted for the first time by a snake-shaped knife edge so that the resistance value precision of the resistor to be adjusted reaches a preset precision, wherein the value range of the preset precision is 0.1% -1%;
s101, cutting the resistor to be adjusted for the second time;
s102, judging whether the resistance value precision of the resistor to be regulated reaches the target precision;
s103, if the resistance value precision of the resistor to be adjusted reaches the target precision, determining that the laser resistance adjustment scheme is to cut the blank resistor by the snake-shaped knife edge and the bisection knife edge in sequence.
Optionally, the predetermined precision is in a range of 0.1% -0.3% or 0.7% -1%. For example, the predetermined precision is 0.1%, 0.2%, 0.8%, 0.9%, or 1%.
Specifically, the existing laser resistor trimming machine can cut the resistor to be trimmed through laser and detect the real-time resistance of the resistor to be trimmed, so that the resistor to be trimmed can be cut with a snake-shaped knife edge and the resistance accuracy of the resistor to be trimmed can be detected in the first cutting process until the resistance accuracy of the resistor to be trimmed reaches the preset accuracy. Then, optionally, a re-melting process can be performed between the first cutting and the second cutting according to specific requirements.
And further, cutting the resistor to be adjusted after the first cutting for the second time until the resistance value precision of the resistor to be adjusted reaches the target precision. The shape and size of the snake-shaped knife edge and the shape and size of the secondary cutting obtained through the acquisition scheme of the laser resistance trimming scheme can be used as a laser resistance trimming scheme and applied to actual production so as to trim the resistance of the blank resistor according to the laser resistance trimming scheme and obtain a cost resistor, such as a chip resistor.
It is worth explaining that the resistor to be adjusted can be a sheet resistor produced by the same batch of blank resistors, so that the scheme of adjusting the resistor to be adjusted can be determined as a laser resistance adjusting scheme and applied to the blank resistors.
In the conventional secondary resistance trimming method, as shown in fig. 7, the length direction of the blank resistor is demarcated by a dotted line a ', a snake-shaped knife edge 80 ' for the first resistance trimming is shown on the right side, and a knife edge 81 ' for the second resistance trimming is shown on the left side. After the first resistance trimming, the resistance precision of the blank resistor reaches 1% -1.5%, that is, the resistance trimming range reserved for the second resistance trimming is large, so that the cutting amount of the tool setting knife edge 81' for the second resistance trimming is large, the current channel of the blank resistor after the second resistance trimming is narrowed, the resistance change rate of the blank resistor in unit length is accelerated, the resistance precision is not easy to control in the second resistance trimming process, and the technical problems of low precision and low yield of the conventional secondary resistance trimming method are further caused.
According to the method for obtaining the laser resistance trimming scheme in the embodiment, the obtained laser resistance trimming scheme is capable of remarkably reducing the resistance accuracy after the first cutting compared with the resistance accuracy after the first resistance trimming in the prior art by controlling the resistance accuracy after the first cutting within 0.1% -1%. That is to say, the cutting amount of the second cutting can be obviously reduced, so that the current channel of the blank resistor subjected to the second cutting can be widened, the resistance value change rate of the blank resistor in unit length is reduced, the controllability of the resistance value precision of the blank resistor in the secondary resistance trimming process is improved, and further the precision and the yield of the finished product resistor can be improved compared with the existing secondary resistance trimming method by using the laser resistance trimming scheme.
In an alternative to this embodiment, the target accuracy is 0.1%. In the existing laser resistance trimming scheme, the target precision is usually set to be 0.1%, so that the method is beneficial to improving the application range of the laser resistance trimming method and the acquisition method of the laser resistance trimming method.
In an alternative of this embodiment, the predetermined accuracy is in the range of 0.3% to 0.7%. For example, the predetermined accuracies are 0.3%, 0.4%, 0.5%, 0.6%, and 0.7%. By limiting the value range of the preset precision to be not less than 0.3%, the over-high precision of the first cutting can be avoided, and the cost is reduced; the value range of the preset precision is limited not to be larger than 0.7%, the phenomenon that the cutting amount of the second cutting is increased due to the fact that the precision of the first cutting is too low is avoided, and therefore the resistance value precision after the second cutting is finished is improved.
Referring to fig. 2, in an alternative of this embodiment, the method for obtaining a laser resistance trimming scheme provided by this embodiment includes the following steps:
s200, cutting the resistor to be adjusted for the first time by a snake-shaped knife edge so that the resistance value precision of the resistor to be adjusted reaches a preset precision, wherein the value range of the preset precision is 0.1% -1%;
s201, performing second cutting on a cutting edge on the resistor to be adjusted;
s202, judging whether the resistance value precision of the resistor to be regulated reaches the target precision;
s203, if the resistance value precision of the resistor to be adjusted does not reach the target precision, replacing the resistor to be adjusted, and returning to the step S200;
and S204, if the resistance value precision of the resistor to be adjusted reaches the target precision, determining that the laser resistance adjustment scheme is to cut the blank resistor by a snake-shaped knife edge and a bisection knife edge in sequence.
The second cutting adopts a mode of a bisection knife edge, namely, two staggered knife edges are formed to enable the resistance value precision of the resistor to be adjusted to reach the target precision, on one hand, the number of knives is small, the controllability of the second cutting is improved, and on the other hand, the yield is improved by means of two mutual matching.
Referring to fig. 3, in an alternative of this embodiment, the method for obtaining a laser resistance trimming scheme provided by this embodiment includes the following steps:
s300, cutting the resistor to be adjusted for the first time by a snake-shaped knife edge so that the resistance value precision of the resistor to be adjusted reaches a preset precision, wherein the value range of the preset precision is 0.1% -1%;
s301, cutting the resistor to be adjusted by a first knife edge to obtain a difference value between an actual resistance value and a target resistance value of the resistor to be adjusted;
s302, determining the length of a second knife edge according to the difference value, and cutting the resistor to be adjusted by the second knife edge;
s303, judging whether the resistance value precision of the resistor to be regulated reaches the target precision;
s304, if the resistance value precision of the resistor to be adjusted does not reach the target precision, replacing the resistor to be adjusted, and returning to the step S300;
s305, if the resistance value precision of the resistor to be adjusted reaches the target precision, determining that the laser resistance adjustment scheme is to cut the blank resistor by a snake-shaped knife edge, a first knife edge and a second knife edge in sequence.
As shown in fig. 8, the knife edge 81 includes a first knife edge 810 and a second knife edge 811 on the left side of a dashed dividing line a in the length direction of the resistor to be adjusted, and the length of the second knife edge 811 is determined according to the actual resistance value and the target resistance value of the resistor to be adjusted after the resistor to be adjusted is cut by the first knife edge 810, so that the length of the second knife edge 811 can be macroscopically grasped, the second knife edge 811 is cut to be close to the predicted second knife edge length, and then fine adjustment is performed, which is beneficial to improving the cutting efficiency of the second knife edge 811.
Specifically, the larger the difference, the larger the length of the second blade; the smaller the difference is, the smaller the length of the second knife edge is, so that the accuracy of the length of the second knife edge of the obtained laser resistance trimming scheme can be ensured.
In an alternative of this embodiment, as shown in fig. 8, the length of the first knife edge 810 is less than half of the width of the resistor to be adjusted, that is, the end of the first knife edge 810 does not exceed the center line b in the width direction of the resistor to be adjusted. Compared with the technical scheme that the length of the first knife edge 810 'is greater than half of the width of the resistor to be adjusted as shown in fig. 7, the length of the first knife edge 810' is less than half of the width of the resistor to be adjusted, in the scheme in the embodiment, the cutting amount of the first knife edge 810 is significantly reduced in the second cutting process, so that the width of a current channel in the second cutting area shown on the left side of the dotted line a after the cutting with the first knife edge 810 is finished is widened, the controllability of resistance accuracy in the cutting process with the second knife edge 811 is favorably improved, and the yield and the accuracy of the blank resistor produced by the obtained laser resistance adjusting scheme are further improved.
Referring to fig. 4, in an alternative of this embodiment, the method for obtaining a laser resistance trimming scheme provided by this embodiment includes the following steps:
s400, cutting the resistor to be adjusted for the first time by a snake-shaped knife edge so that the resistance value precision of the resistor to be adjusted reaches a preset precision, wherein the value range of the preset precision is 0.1% -1%;
s401, cutting a resistor to be adjusted by a first knife edge to obtain a difference value between an actual resistance value and a target resistance value of the resistor to be adjusted;
s402, determining the length of a second knife edge according to the difference, and cutting the resistor to be adjusted by the second knife edge;
s403, judging whether the first knife edge and the second knife edge are crossed in the width direction of the resistor to be adjusted;
s404, if the first knife edge and the second knife edge are crossed in the width direction of the resistor to be adjusted, replacing the resistor to be adjusted, and returning to the step S400;
s405, if the first knife edge and the second knife edge do not intersect in the width direction of the resistor to be adjusted, judging whether the resistance value precision of the resistor to be adjusted reaches the target precision, if the resistance value precision of the resistor to be adjusted does not reach the target precision, replacing the resistor to be adjusted, and returning to the step S400;
s406, if the resistance value precision of the resistor to be adjusted reaches the target precision, determining that the laser resistance adjustment scheme is to cut the blank resistor by a snake-shaped knife edge, a first knife edge and a second knife edge in sequence.
As shown in fig. 8, the ends of the first knife edge 810 and the second knife edge 811 in the obtained laser resistance trimming scheme are ensured not to have a cross overlapping region in the width direction of the blank resistor, so that the width of a current channel between the end of the first knife edge 810 and the end of the second knife edge 811 is increased, and the controllability of resistance accuracy when the first knife edge 810 and the second knife edge 811 are used for cutting is improved. In the actual production, the result that the yield and the precision are reduced because the precision of the resistance of the blank is uncontrollable due to the fact that the first knife edge 810 and the second knife edge 811 are crossed is avoided.
As shown in fig. 7, in the conventional laser resistance trimming method, the ends of the first blade 810 ' and the second blade 811 ' of the knife blade 81 ' are intersected, which may aggravate the narrowing of the width of the current path. And the ends of the first cutting edge 810 'and the second cutting edge 811 both exceed the widthwise centerline b' of the blank resistor.
Referring to fig. 5, in an alternative of this embodiment, the method for obtaining a laser trimming scheme provided by this embodiment includes the following steps:
s500, cutting the resistor to be adjusted for the first time by a snake-shaped knife edge so that the resistance value precision of the resistor to be adjusted reaches a preset precision, wherein the value range of the preset precision is 0.1% -1%;
s501, cutting the resistor to be adjusted by a first knife edge to obtain a difference value between an actual resistance value and a target resistance value of the resistor to be adjusted;
s502, determining the length of a second knife edge according to the difference value, and cutting the resistor to be adjusted by the second knife edge;
s503, judging whether the first knife edge and the second knife edge are crossed in the width direction of the resistor to be adjusted;
s504, if the first knife edge and the second knife edge are crossed in the width direction of the resistor to be adjusted, replacing the resistor to be adjusted, and returning to the step S500;
s505, if the first knife edge and the second knife edge do not intersect in the width direction of the resistor to be adjusted, judging whether the resistance value precision of the resistor to be adjusted reaches the target precision, if the resistance value precision of the resistor to be adjusted does not reach the target precision, replacing the resistor to be adjusted, and returning to the step S500;
s506, if the resistance value precision of the resistors to be adjusted reaches the target precision, adjusting the resistance of the sample resistors with the preset number one by one according to the snake-shaped knife edge, the first knife edge and the second knife edge;
s507, taking the resistance values of all the sample resistors, judging whether the resistance value precision of the sample resistors reaches the target precision, and if at least one of the resistance value precision of the sample resistors does not reach the target precision, returning to the step S500;
and S508, if the resistance value precision of all the sample resistors reaches the target precision, determining that the laser resistance trimming scheme is to cut the blank resistor by a snake-shaped knife edge, a first knife edge and a second knife edge in sequence.
After the snake-shaped knife edge, the first knife edge and the second knife edge are preliminarily determined, the preliminarily determined laser resistance trimming scheme is subjected to batch test to verify the practical feasibility of the preliminarily determined laser resistance trimming scheme, if the resistance value accuracy of all the sample resistors reaches the target accuracy, the laser resistance trimming scheme can be selected, and the laser resistance trimming scheme is applied to the qualification rate capable of ensuring 100% of the resistance value accuracy in practical production.
It is worth explaining that the sample resistor can be a sheet resistor produced in the same batch as the blank resistor, so that the feasibility of the laser resistance trimming scheme for the blank resistor is tested by testing the resistance trimming scheme acting on the sample resistor.
On the contrary, if at least one of the resistance value accuracies of the sample resistor does not reach the target accuracy, the snake-shaped knife edge, the first knife edge and the second knife edge need to be reselected until the obtained laser resistance trimming scheme can meet the requirement of the qualification rate of reaching 100% of the resistance value accuracy in the actual production.
Referring to fig. 6, in an alternative of this embodiment, the method for obtaining a laser trimming scheme provided by this embodiment includes the following steps:
s600, cutting the resistor to be adjusted for the first time by a snake-shaped knife edge so that the resistance value precision of the resistor to be adjusted reaches a preset precision, wherein the value range of the preset precision is 0.1% -1%;
s601, cutting the resistor to be adjusted by a first knife edge to obtain a difference value between an actual resistance value and a target resistance value of the resistor to be adjusted;
s602, determining the length of a second knife edge according to the difference, and cutting the resistor to be adjusted by the second knife edge;
s603, judging whether the first knife edge and the second knife edge are crossed in the width direction of the resistor to be adjusted;
s604, if the first knife edge and the second knife edge are crossed in the width direction of the resistor to be adjusted, replacing the resistor to be adjusted, and returning to the step S600;
s605, if the first knife edge and the second knife edge are not crossed in the width direction of the resistor to be adjusted, judging whether the resistance value precision of the resistor to be adjusted reaches the target precision, if the resistance value precision of the resistor to be adjusted does not reach the target precision, replacing the resistor to be adjusted, and returning to the step S600;
s606, if the resistance value precision of the resistors to be regulated reaches the target precision, conducting resistance regulation on a preset number of sample resistors one by one according to the snake-shaped knife edge and the bisection knife edge;
s607, taking the resistance values of all the sample resistors, judging whether the resistance value accuracies of the sample resistors all reach the target accuracy, and if at least one of the resistance value accuracies of the sample resistors does not reach the target accuracy, returning to the step S600;
s608, if the resistance value accuracy of all the sample resistors reaches the target accuracy, taking the standard deviation of the resistance values of all the sample resistors after resistance trimming, judging whether the standard deviation is smaller than a preset standard deviation, and if the standard deviation is larger than the preset standard deviation, returning to the step S600;
and S609, if the standard deviation is smaller than the preset standard deviation, determining that the laser resistance trimming scheme is to cut the blank resistor by a snake-shaped knife edge, a first knife edge and a second knife edge in sequence.
After the qualification rate of the resistance value precision is verified, a batch test is carried out on the temporarily determined laser resistance trimming scheme to further verify the practical feasibility of the temporarily determined laser resistance trimming scheme, if the standard deviation of all the sample resistors is smaller than the preset standard deviation, the laser resistance trimming scheme can be selected, and the laser resistance trimming scheme is applied to practical production to ensure that the resistance value fluctuation among finished product resistors obtained by the blank resistors is small enough to ensure the yield of 100%.
And if the standard deviation is larger than the preset standard deviation, reselecting the snake-shaped knife edge, the first knife edge and the second knife edge until the obtained laser resistance trimming scheme can meet the requirement of reaching 100 percent of yield in actual production.
Example two
The second embodiment provides a laser resistance trimming scheme, the second embodiment includes the method for acquiring the laser resistance trimming scheme in the first embodiment, technical features of the method for acquiring the laser resistance trimming scheme disclosed in the first embodiment are also applicable to the second embodiment, and technical features of the method for acquiring the laser resistance trimming scheme disclosed in the first embodiment are not described repeatedly.
The laser resistance trimming scheme provided by the embodiment is obtained by the method for obtaining the laser resistance trimming scheme provided by the first embodiment.
Specifically, the laser resistance adjusting scheme comprises the following steps:
s700, performing primary cutting on the blank resistor by a snake-shaped knife edge so as to enable the resistance value precision of the resistor to be adjusted to reach preset precision;
and S701, cutting the blank resistor for the second time by using a cutting edge.
The laser resistance trimming scheme in this embodiment has the advantages of the method for obtaining the laser resistance trimming scheme in the first embodiment, and the advantages of the method for obtaining the laser resistance trimming scheme disclosed in the first embodiment are not described repeatedly herein.
EXAMPLE III
The third embodiment provides a chip resistor, the third embodiment includes the laser resistance trimming scheme in the second embodiment, technical features of the laser resistance trimming scheme disclosed in the second embodiment are also applicable to the third embodiment, and technical features of the laser resistance trimming scheme disclosed in the second embodiment are not described repeatedly.
Referring to fig. 1 to 6 in combination with fig. 8, the chip resistor provided in this embodiment is produced by the laser trimming scheme provided in the second embodiment.
The chip resistor in this embodiment has the advantages of the laser resistance trimming scheme in the second embodiment, and the advantages of the laser resistance trimming scheme disclosed in the second embodiment are not described again here.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention. Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Claims (10)
1. The method for acquiring the laser resistance trimming scheme is characterized by comprising the following steps of:
taking one of the blank resistors as a resistor to be adjusted, and cutting the resistor to be adjusted for the first time by using a snake-shaped knife edge so as to enable the resistance value precision of the resistor to be adjusted to reach a preset precision, wherein the value range of the preset precision is 0.1% -1%;
carrying out secondary cutting on the resistor to be adjusted by a cutting edge;
judging whether the resistance value precision of the resistor to be regulated reaches the target precision or not;
and if the resistance value precision of the resistor to be adjusted reaches the target precision, determining that the laser resistance adjustment scheme is to cut the blank resistor by the snake-shaped knife edge and the bisection knife edge in sequence.
2. The method for obtaining the laser resistance trimming scheme according to claim 1, wherein the step of judging whether the resistance accuracy of the resistor to be trimmed reaches the target accuracy further comprises the following steps of:
if the resistance value precision of the resistor to be adjusted does not reach the target precision, replacing the resistor to be adjusted;
and circulating the steps of the replaced resistor to be adjusted until the resistance value precision of the resistor to be adjusted reaches the target precision.
3. The method for obtaining the laser resistance trimming scheme according to claim 2, wherein the step of cutting the resistor to be trimmed for the second time by the cutting edge specifically comprises:
cutting the resistor to be adjusted by a first knife edge to obtain a difference value between an actual resistance value and a target resistance value of the resistor to be adjusted;
and determining the length of a second knife edge according to the difference, and cutting the resistor to be adjusted by the second knife edge.
4. The method of claim 3, wherein the step of obtaining the laser trimming scheme,
the length of the first knife edge is less than half of the width of the resistor to be adjusted;
and/or the greater the difference, the greater the length of the second edge; the smaller the difference, the smaller the length of the second edge.
5. The method for obtaining the laser resistance trimming scheme according to claim 3, wherein the following steps are further included between the step of determining that the resistance precision of the resistor to be trimmed reaches the target precision and the step of determining that the laser resistance trimming scheme is to perform resistance trimming by the snake-shaped blade and the pair of blade cuts in sequence:
judging whether the first knife edge and the second knife edge are crossed in the width direction of the resistor to be adjusted;
if the first knife edge and the second knife edge are crossed in the width direction of the resistor to be adjusted, replacing the resistor to be adjusted;
and circulating the replaced resistor to be adjusted until the first knife edge and the second knife edge do not intersect in the width direction of the resistor to be adjusted.
6. The method of obtaining a laser trimming scheme according to claim 1,
the value range of the preset precision is 0.3% -0.7%;
and/or, the target accuracy is 0.1%.
7. The method for obtaining the laser resistance trimming scheme according to claim 1, wherein the step of determining that the laser resistance trimming scheme is to sequentially trim the snake-shaped knife edge and the knife edge specifically comprises:
resistance adjustment is carried out on a preset number of sample resistors one by one according to the snake-shaped knife edge and the bisection knife edge;
taking the resistance values of all sample resistors, and judging whether the resistance value precision of the sample resistors reaches the target precision;
if the resistance value precision of all the sample resistors reaches the target precision, determining that the laser resistance adjustment scheme is to cut the blank resistor by the snake-shaped knife edge and the bisection knife edge in sequence;
if at least one of the resistance value accuracies of the sample resistors does not reach the target accuracy, the steps are circulated until the resistance value accuracies of all the sample resistors reach the target accuracy.
8. The method for obtaining the laser resistance trimming scheme according to claim 7, wherein the step of determining the laser resistance trimming scheme as cutting the blank resistor by the snake-shaped knife edge and the bisection knife edge in sequence specifically comprises:
taking the standard deviation of the resistance values of all sample resistors after resistance adjustment, and judging whether the standard deviation is smaller than a preset standard deviation or not;
if the standard deviation is smaller than the preset standard deviation, determining that the laser resistance adjusting scheme is to cut the blank resistor by the snake-shaped knife edge and the bisection knife edge in sequence;
if the standard deviation is larger than the preset standard deviation, the above steps are repeated until the standard deviation is smaller than the preset standard deviation.
9. A laser trimming scheme, characterized by being obtained by the method of obtaining a laser trimming scheme according to any one of claims 1 to 8.
10. A chip resistor obtained by trimming the laser trimming scheme according to claim 9.
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