CN115985609B - Laser resistance adjusting method and device - Google Patents
Laser resistance adjusting method and device Download PDFInfo
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- CN115985609B CN115985609B CN202211565851.1A CN202211565851A CN115985609B CN 115985609 B CN115985609 B CN 115985609B CN 202211565851 A CN202211565851 A CN 202211565851A CN 115985609 B CN115985609 B CN 115985609B
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- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000005520 cutting process Methods 0.000 claims abstract description 427
- 239000000758 substrate Substances 0.000 claims abstract description 160
- 238000004519 manufacturing process Methods 0.000 claims abstract description 49
- 238000012360 testing method Methods 0.000 claims description 44
- 230000001105 regulatory effect Effects 0.000 claims description 33
- 230000008569 process Effects 0.000 claims description 21
- 238000001816 cooling Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- 238000009966 trimming Methods 0.000 abstract description 7
- 238000010923 batch production Methods 0.000 abstract description 3
- 230000004044 response Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
The application provides a laser resistance adjustment method and device. According to the resistor trimming method and device, under the condition of no manual intervention, the resistor trimming can be carried out on the resistor to be trimmed in one substrate to be machined by utilizing a repeated cutting process, and the running water type resistor trimming can be carried out on the resistors to be trimmed in all substrates to be machined in the same batch production, so that the running water operation is realized. Solves the problem of low production yield when the single cutting process adjusts the resistance of some special resistors to be adjusted.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a laser resistance adjusting method and device.
Background
The resistance adjustment is to adjust the chip resistor, the passive circuit, the active circuit and the alloy resistor on the substrate by using laser. That is, when measuring the resistance in real time, the resistance smaller than the target resistance is made to reach the target resistance by changing the sectional area of the resistance to increase the resistance by laser etching.
Currently, a single cutting process is adopted for the resistors to be regulated, which are arranged in an array manner on the substrate, so that batch resistance regulation is performed. On the basis of preset technological parameters, each resistor to be adjusted is etched line by laser once to reach a target resistance value.
However, when a single cutting process cuts some special resistors to be adjusted, the longer the cutting time is, the longer the cutting length is, the higher the temperature of the resistors to be adjusted is, and when the critical temperature is exceeded, the resistance value of the resistors to be adjusted is uncontrollable, which often results in lower production yield. For example, resistors to be tuned for a number of different processes, such as resistors of high resistance, resistors of low resistance, resistors of small size, thermistors, resistors sensitive to laser (heat), resistors sensitive to cutting patterns, and resistors sensitive to cutting length.
Therefore, the present application provides a laser resistance adjusting method to solve one of the above technical problems.
Disclosure of Invention
The present application aims to provide a laser resistance adjusting method and device, which can solve at least one technical problem mentioned above. The specific scheme is as follows:
according to a specific embodiment of the present application, in a first aspect, the present application provides a laser resistance adjustment method, including:
respectively adjusting resistance of each to-be-adjusted resistor in at least one test-adjusted substrate by utilizing a single cutting process, and obtaining the production yield of the at least one test-adjusted substrate based on the resistance value of each to-be-adjusted resistor in the at least one test-adjusted substrate after resistance adjustment;
When the production yield of the at least one test-adjustment substrate is lower than a preset yield threshold, respectively adjusting resistance of each to-be-adjusted resistor in the to-be-processed substrate by utilizing a multiple-cutting process, so that the production yield of the to-be-processed substrate is greater than or equal to the preset yield threshold, wherein each to-be-adjusted resistor in the to-be-processed substrate and each to-be-adjusted resistor in the at least one test-adjustment substrate have the same characteristic.
Optionally, the adjusting resistors in the substrate to be processed by using the multiple cutting process includes:
determining cutting parameter values of each cutting process in the multiple cutting processes based on preset characteristic information common to all resistors to be adjusted in the substrate to be processed;
and respectively adjusting resistance of each resistor to be adjusted in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes.
Optionally, the determining the cutting parameter value of each cutting process in the multiple cutting processes based on the preset characteristic information common to all the resistors to be adjusted in the substrate to be processed includes:
and determining the balance coefficient value of each cutting process in the multiple cutting processes based on the preset characteristic information of the resistance to be adjusted in the substrate to be processed, wherein the sum of the balance coefficient values of all the cutting processes in the multiple cutting processes is equal to 1.
Optionally, the multiple cutting process includes a two-time cutting process, and the two-time cutting process includes a first cutting process and a second cutting process;
correspondingly, the resistance adjustment of each resistance to be adjusted in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes respectively comprises the following steps:
distributing a preset target resistance value based on the balance coefficient value of the first cutting process to obtain a first target resistance value of the first cutting process;
in the process of executing the first cutting process on any resistor to be processed in the substrate to be processed, testing a first resistance value of any resistor to be processed in real time;
when the first resistance value of any resistor to be adjusted is equal to the first target resistance value, terminating executing the first cutting process;
when the temperature value of any one of the resistors to be adjusted is measured to be lower than a preset cooling temperature threshold value, executing the second cutting process on the any one of the resistors to be adjusted, and testing the second resistance value of the any one of the resistors to be adjusted in real time;
and when the second resistance value of any one of the resistors to be adjusted is equal to a preset target resistance value, terminating executing the second cutting process.
Optionally, the cutting parameter values of the first cutting process further include a starting cutting position and a cutting angle in a preset coordinate system;
the cutting parameter values of the second cutting process further comprise a spacing value; the interval value is larger than or equal to a preset process interval threshold value;
accordingly, the performing the second cutting process on the any one of the resistors to be adjusted includes:
in a preset coordinate system, obtaining a first cutting straight line required by executing the first cutting process on any one of the resistors to be adjusted based on the initial cutting position and the cutting angle;
obtaining a second cutting line parallel to the first cutting line based on the first cutting line and the distance value;
and executing the second cutting process on any resistor to be regulated based on the second cutting straight line.
Optionally, the balance coefficient value of the first cutting process is 0.95-0.98.
Optionally, the substrate to be processed includes resistors to be modulated arranged in an array;
correspondingly, the resistance adjustment of each resistance to be adjusted in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes respectively comprises the following steps:
Respectively performing resistance adjustment test on any row of resistors to be adjusted in the substrate to be processed based on cutting parameter values of each cutting process in the multiple cutting processes to obtain the production yield of the resistors to be adjusted in any row;
and when the production yield of any row of resistors to be regulated is greater than or equal to a preset yield threshold, regulating the resistances of other resistors to be regulated in the substrate to be processed except any row of resistors to be regulated respectively based on the cutting parameter values of each cutting process in the multiple cutting processes.
According to a second aspect of the specific embodiment of the present application, the present application provides a laser resistance adjusting device, including:
the test adjustment unit is used for respectively adjusting resistance of each to-be-adjusted resistor in at least one test adjustment substrate by utilizing a single cutting process, and obtaining the production yield of the at least one test adjustment substrate based on the resistance value of each to-be-adjusted resistor in the at least one test adjustment substrate after resistance adjustment;
and the multiple cutting unit is used for respectively adjusting resistance of each resistor to be processed in the substrate to be processed by utilizing multiple cutting processes when the production yield of the at least one test-adjustment substrate is lower than a preset yield threshold value, so that the production yield of the substrate to be processed is greater than or equal to the preset yield threshold value, wherein each resistor to be processed in the substrate to be processed and each resistor to be adjusted in the at least one test-adjustment substrate have the same characteristic.
Optionally, the multiple cutting unit includes:
a first determining subunit, configured to determine a cutting parameter value of each cutting process in the multiple cutting processes based on preset characteristic information that is common to all the resistors to be adjusted in the substrate to be processed;
and the first resistance adjusting subunit is used for respectively adjusting the resistance of each resistance to be adjusted in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes.
Optionally, the first determining subunit includes:
and a second determining subunit, configured to determine a balance coefficient value of each of the multiple cutting processes based on preset characteristic information of the resistance to be adjusted in the substrate to be processed, where a sum of balance coefficient values of all the multiple cutting processes is equal to 1.
Optionally, the multiple cutting process includes a two-time cutting process, and the two-time cutting process includes a first cutting process and a second cutting process;
accordingly, the first resistance-adjusting subunit includes:
the first obtaining subunit is used for distributing a preset target resistance value based on the balance coefficient value of the first cutting process to obtain a first target resistance value of the first cutting process;
The first execution subunit is used for testing the first resistance value of any resistor to be processed in real time in the process of executing the first cutting process on any resistor to be processed in the substrate to be processed;
a first terminator unit, configured to terminate execution of the first cutting process when a first resistance value of the any one of the resistors to be adjusted is equal to the first target resistance value;
the second execution subunit is used for executing the second cutting process on any one of the resistors to be adjusted when the measured temperature value of the any one of the resistors to be adjusted is lower than a preset cooling temperature threshold value, and testing the second resistance value of the any one of the resistors to be adjusted in real time;
and the second terminator unit is used for terminating the execution of the second cutting process when the second resistance value of any resistor to be adjusted is equal to a preset target resistance value.
Optionally, the cutting parameter values of the first cutting process further include a starting cutting position and a cutting angle in a preset coordinate system;
the cutting parameter values of the second cutting process further comprise a spacing value; the interval value is larger than or equal to a preset process interval threshold value;
accordingly, the second execution subunit includes:
A second obtaining subunit, configured to obtain, in a preset coordinate system, a first cutting line required for performing the first cutting process on the any one of the resistors to be adjusted based on the start cutting position and the cutting angle;
a third obtaining subunit configured to obtain a second cutting line parallel to the first cutting line based on the first cutting line and the pitch value;
and the third execution subunit is used for executing the second cutting process on any one of the resistors to be adjusted based on the second cutting straight line when the measured temperature value of the any one of the resistors to be adjusted is lower than a preset cooling temperature threshold value, and testing the second resistance value of the any one of the resistors to be adjusted in real time.
Optionally, the balance coefficient value of the first cutting process is 0.95-0.98.
Optionally, the substrate to be processed includes resistors to be modulated arranged in an array;
correspondingly, the first resistance-adjusting subunit further includes:
a fourth obtaining subunit, configured to perform resistance adjustment test on any row of resistors to be adjusted in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes, so as to obtain a production yield of the any row of resistors to be adjusted;
And the second resistance adjusting subunit is used for respectively adjusting the resistance of other resistors to be adjusted except for the resistors to be adjusted in any row in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes when the production yield of the resistors to be adjusted in any row is greater than or equal to a preset yield threshold.
Compared with the prior art, the scheme provided by the embodiment of the application has at least the following beneficial effects:
the application provides a laser resistance adjustment method and device. The method comprises the following steps: respectively adjusting resistance of each to-be-adjusted resistor in at least one test-adjusted substrate by utilizing a single cutting process, and obtaining the production yield of the at least one test-adjusted substrate based on the resistance value of each to-be-adjusted resistor in the at least one test-adjusted substrate after resistance adjustment; when the production yield of the at least one test-adjustment substrate is lower than a preset yield threshold, respectively adjusting resistance of each to-be-adjusted resistor in the to-be-processed substrate by utilizing a multiple-cutting process, so that the production yield of the to-be-processed substrate is greater than or equal to the preset yield threshold, wherein each to-be-adjusted resistor in the to-be-processed substrate and each to-be-adjusted resistor in the at least one test-adjustment substrate have the same characteristic. According to the resistor trimming method and device, under the condition of no manual intervention, the resistor trimming can be carried out on the resistor to be trimmed in one substrate to be machined by utilizing a repeated cutting process, and the running water type resistor trimming can be carried out on the resistors to be trimmed in all substrates to be machined in the same batch production, so that the running water operation is realized. Solves the problem of low production yield when the single cutting process adjusts the resistance of some special resistors to be adjusted.
Drawings
FIG. 1 shows a flow chart of a laser resistance adjustment method according to an embodiment of the present application;
FIG. 2 shows a schematic diagram of a resistor to be tuned according to an embodiment of the present application;
FIG. 3 shows a block diagram of a laser resistor trimming device according to an embodiment of the present application;
description of the reference numerals
10-resistance to be adjusted, 11-initial cutting position, 12-first cutting straight line, 13-second cutting straight line, d-distance value.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail below with reference to the accompanying drawings, wherein it is apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" generally includes at least two.
It should be understood that the term "and/or" as used herein is merely one relationship describing the association of the associated objects, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
It should be understood that although the terms first, second, third, etc. may be used in embodiments of the present application to describe, these descriptions should not be limited to these terms. These terms are only used to distinguish one from another. For example, a first may also be referred to as a second, and similarly, a second may also be referred to as a first, without departing from the scope of embodiments of the present application.
The words "if", as used herein, may be interpreted as "at … …" or "at … …" or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrase "if determined" or "if detected (stated condition or event)" may be interpreted as "when determined" or "in response to determination" or "when detected (stated condition or event)" or "in response to detection (stated condition or event), depending on the context.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a product or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such product or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a commodity or device comprising such element.
In particular, the symbols and/or numerals present in the description, if not marked in the description of the figures, are not numbered.
Alternative embodiments of the present application are described in detail below with reference to the accompanying drawings.
Example 1
The embodiment provided by the application is an embodiment of a laser resistance adjustment method.
An embodiment of the present application is described in detail below with reference to fig. 1.
Step S101, performing resistance adjustment on each to-be-adjusted resistor 10 in at least one test adjustment substrate by using a single cutting process, and obtaining a production yield of the at least one test adjustment substrate based on the resistance value of each to-be-adjusted resistor 10 in the at least one test adjustment substrate after resistance adjustment.
The substrate is the basic material for producing the resistor. For the resistor 10 to be adjusted on the substrate, the manufacturing process comprises the following steps: and (3) preparing the paste for producing the resistor, stirring the paste, printing the resistor on the substrate by using the paste, and sintering the resistor printed on the substrate to produce the resistor to be regulated 10. After the resistance of the resistor to be regulated 10 is regulated, the resistor reaching the preset target resistance value can be shipped.
The single cutting process is a process of performing resistance adjustment by etching each resistor 10 to be adjusted on the substrate once by laser, and a preset target resistance value is expected to be reached once.
The production yield, also called "percent of pass", is one of the product quality indicators, which refers to the percentage of the total processed product that is the amount of the acceptable product. In the resistance adjustment process, the production yield represents the success probability of adjusting the resistance of a preset number of resistors to be adjusted 10, namely the probability of reaching a preset target resistance value after adjusting the resistance of the preset number of resistors to be adjusted 10.
The resistor 10 to be adjusted is sensitive to cutting length, patterns, heat and the like when adjusting resistance due to the reasons of resistor density, material distribution, resistor thickness and the like in the manufacturing process. For example, the sensitive resistor to be tuned 10 includes: a resistor with a high resistance value of more than 500k omega, a resistor with a low resistance value of less than 10 omega, a small-size resistor of 0201 and 01005 patches, and a thermistor with a large resistance value change after heating.
However, when the sensitive resistor 10 to be regulated is regulated by a single cutting process, the production yield is low. Therefore, in the embodiment of the application, one or several substrates are selected from the substrates with the resistors 10 to be tuned, which are produced in the same batch, as the test tuning substrates, and the resistors 10 to be tuned in the test tuning substrates are tested by using a single cutting process, so as to determine the effectiveness of the single cutting process in tuning the resistors 10 to be tuned on the batch of test tuning substrates, wherein the effectiveness is represented by the production yield of the batch of test tuning substrates. Of course, if the substrate to be processed includes the resistors 10 to be modulated arranged in an array, it is also possible to test one or more rows of the resistors 10 to be modulated in one substrate, and obtain the production yield based on the resistors 10 to be modulated to be tested, and the test of the present application is not limited thereto. The larger the number of the resistors 10 to be adjusted which participate in the test, the more the production yield accords with the actual situation, and the higher the reference value of the effectiveness.
Step S102, when the production yield of the at least one test-tuned substrate is lower than the preset yield threshold, tuning the resistors 10 in the substrate to be processed respectively by using multiple cutting processes, so that the production yield of the substrate to be processed is greater than or equal to the preset yield threshold.
Wherein, each to-be-tuned resistor 10 in the to-be-processed substrate and the test-tuned substrate has the same characteristics. It is understood that the substrate to be processed and the trial-adjustment substrate are produced in the same batch.
The multiple cutting process refers to multiple cutting of the resistor 10 to be adjusted, each cutting makes the temperature value of the resistor 10 to be adjusted within a preset safety temperature threshold value, and finally makes the resistance value of the resistor 10 to be adjusted reach a preset target resistance value.
According to the embodiment of the application, the resistance of the resistor 10 to be regulated in one substrate to be processed can be regulated by utilizing a multiple-time cutting process, and the resistance of the resistor 10 to be regulated in all substrates to be processed in the same batch can be regulated in a running water mode, so that the running operation is realized.
In some embodiments, the resistance adjustment is performed on each resistance to be adjusted 10 in the substrate to be processed by using the multiple cutting process, and the method includes the following steps:
step S102-1, determining the cutting parameter value of each cutting process in the multiple cutting processes based on the preset characteristic information shared by all the resistors 10 to be adjusted in the substrate to be processed.
The preset characteristic information includes: preset resistor density, preset material distribution information, and/or preset resistor thickness information.
The cutting parameter value of each cutting process in the multiple cutting processes can be an empirical value, or a corresponding relation can be established between the historical characteristic information and the cutting parameter value of each cutting process in the multiple cutting processes which are successful in the history, and the corresponding relation is stored in a relation data set. The cutting parameter values of each of the plurality of cutting processes corresponding to the characteristic information can be obtained from the relationship data set by the characteristic information of the resistance to be adjusted 10 whenever the plurality of cutting processes are required.
In some embodiments, the cutting parameter values comprise balance coefficient values.
The balance coefficient value is used for distributing the stage target resistance value reached by each cutting process.
Accordingly, the determining the cutting parameter value of each cutting process in the multiple cutting processes based on the preset characteristic information common to all the resistors 10 to be adjusted in the substrate to be processed includes the following steps:
step S102-1a, determining the balance coefficient value of each cutting process in the multiple cutting processes based on the preset characteristic information of the resistor to be adjusted 10 in the substrate to be processed.
Wherein the sum of the balance coefficient values of all the cutting processes in the multiple cutting processes is equal to 1. For example, the multiple cutting process includes a two-time cutting process including a first cutting process having a balance coefficient value of 0.95 and a second cutting process having a balance coefficient value of 0.05; the sum of the balance coefficient value of the first cutting process and the balance coefficient value of the second cutting process is 0.95+0.05=1.
And step S102-2, respectively adjusting resistance of each resistor 10 to be adjusted in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes.
In some embodiments, the multiple cutting process includes a two-pass cutting process including a first cutting process and a second cutting process.
In some embodiments, the balance coefficient value of the first cutting process is 0.95-0.98. Because the surface area of the resistor to be adjusted 10 is limited, the first cutting process can be as close to the maximum effective cutting length and/or the longest effective cutting time as possible, so that the second cutting process saves the effective cutting length, and the multiple cutting processes save space on the resistor to be adjusted 10.
The maximum effective cutting length refers to the cutting length when approaching the critical temperature;
and the longest effective cutting duration refers to the duration of cutting near the critical temperature.
Of course, embodiments of the present application are not limited to a two-shot process.
Correspondingly, the resistance adjustment of each resistor 10 to be adjusted in the substrate to be processed is performed based on the cutting parameter values of each cutting process in the multiple cutting processes, and the method comprises the following steps:
And step S102-2a-1, distributing a preset target resistance value based on the balance coefficient value of the first cutting process to obtain a first target resistance value of the first cutting process.
For example, if the balance coefficient value of the first cutting process is 0.95 and the preset target resistance value is 100deg.OMEGA, the first target resistance value=100deg.OMEGA 0.95=95OMEGA.
Step S102-2a-2, testing the first resistance value of any one of the resistors 10 to be processed in real time during the first cutting process of the first resistor 10 to be processed.
It will be appreciated that the first resistance value of any of the resistors 10 to be tuned is tested in-line during the execution of the first cutting process.
Because each resistor 10 to be adjusted has fine specificity, and the target resistance value of the cutting process cannot be achieved for the resistor 10 to be adjusted with specificity by controlling the cutting process once through the cutting length and the cutting time, the method accurately controls each cutting process to achieve the corresponding target resistance value in a real-time test mode.
Step S102-2a-3, when the first resistance value of any one of the resistors 10 to be adjusted is equal to the first target resistance value, terminating the first cutting process.
For example, continuing the above example, the first target resistance value is 95Ω, and when the first resistance value tested in real time is equal to 95Ω, the first dicing process is stopped. At this time, the temperature value of any one of the resistors 10 should be the highest temperature value during the first cutting process.
Step S102-2a-4, when the measured temperature value of any one of the resistors to be adjusted 10 is lower than the preset cooling temperature threshold, the second cutting process is performed on any one of the resistors to be adjusted 10, and the second resistance value of any one of the resistors to be adjusted 10 is tested in real time.
The preset cooling temperature threshold is used as a condition for limiting the start of the second cutting process, and the second cutting process can be performed on any one of the resistors 10 only when the temperature value of the any one of the resistors 10 is lower than the preset cooling temperature threshold. Otherwise, if the second cutting process is performed when the temperature of any resistor 10 to be adjusted is too high, the thermal effect of the resistor is likely to cause failure of resistor adjustment, and the production yield is reduced.
After the first cutting process is terminated on any one of the resistors 10, the second cutting process may be performed after waiting until the temperature value of any one of the resistors 10 is lower than the preset cooling temperature threshold.
The time point from the time point when the first cutting process is performed to the time point when the second cutting process is performed is referred to as a net resistance adjustment time for the same resistor to be adjusted 10.
The same standby resistor 10 is referred to as a net standby time from the point of time when the first cutting process is terminated to the point of time when the second cutting process is started.
For each resistor to be tuned 10 in the same batch of substrates to be processed, the first cutting process may be performed in batch for each resistor to be tuned 10 in the substrates to be processed. After the last resistor 10 to be adjusted in the substrate to be processed terminates the first cutting process, the temperature value of the resistor 10 to be adjusted in the first cutting process in the substrate to be processed is or is lower than a preset cooling temperature threshold value. At this time, the second cutting process is performed in batch from the first resistor 10 to be tuned for performing the first cutting process. Compared with the resistance adjustment process that the resistance adjustment process is performed on one to-be-adjusted resistor 10 for a plurality of times after the cutting process is performed on the next to-be-adjusted resistor 10 for a plurality of times, the resistance adjustment process is performed on the other to-be-adjusted resistor 10 for the first time or the second time within the net waiting time of each to-be-adjusted resistor 10 in the to-be-processed substrate, so that the total resistance adjustment time of the to-be-processed substrate for performing the cutting process for a plurality of times in batches is shortened, the average net resistance adjustment time of each to-be-adjusted resistor 10 is reduced, and the average resistance adjustment efficiency of each to-be-adjusted resistor 10 is improved.
In some embodiments, each substrate to be processed for resistance adjustment is placed in a predetermined coordinate system for position control and resistance adjustment.
The resistor 10 to be tuned (for example, a chip resistor) has a fixed size, and when the resistor 10 to be tuned is processed, the resistor is printed by a screen printing plate with the fixed size, and because of the relation between the tension of the adhesive slurry and the positioning precision of the sintering process and the printer, the resistor has integral deviation within a certain tolerance range. And in a preset coordinate system, automatically correcting each substrate to be processed for resistance adjustment according to the positions of the three points of the lower left, the lower right and the upper right of the substrate to be processed. After correction, the fixed position of each resistor 10 to be adjusted can be obtained from the substrate to be processed, so that the starting cutting position 11 and the cutting angle of the laser of each resistor 10 to be adjusted are relatively uniform.
The cutting parameter values of the first cutting process further comprise a starting cutting position 11 and a cutting angle in a preset coordinate system; the cutting parameter values of the second cutting process further comprise a spacing value d; the distance value d is larger than or equal to a preset process distance threshold value.
The distance value d refers to a distance value for keeping the cutting line segment of the second cutting process in parallel relation with the cutting line segment of the first cutting process. As the chip resistors are very small resistors, the resistance adjustment of the multiple cutting process can be achieved only when the distance value d is larger than or equal to the preset process distance threshold value.
Accordingly, as shown in fig. 2, the second cutting process is performed on any of the resistors to be adjusted 10, including the following steps:
step S102-2a-4-1, in a preset coordinate system, obtaining a first cutting straight line 12 required for executing the first cutting process on any one of the resistors to be adjusted 10 based on the starting cutting position 11 and the cutting angle.
Each substrate to be processed for adjusting resistance is placed in a preset coordinate system for position control and resistance adjustment. For example, as shown in fig. 2, the initial cutting position 11 (6, 17) of the first cutting process of the resistor to be adjusted 10, that is, a position on the left edge of the resistor to be adjusted 10, the cutting angle of the first cutting process of the resistor to be adjusted 10 is zero, that is, the first cutting line 12 passes through the initial cutting position 11 (6, 17), and the angle between the first cutting line 12 and the X axis in the preset coordinate system is zero, that is, the first cutting process starts from the initial cutting position 11 (6, 17) on the left edge of the resistor to be adjusted 10, and cuts to the right parallel to the X axis.
Step S102-2a-4-2, obtaining a second cutting line 13 parallel to the first cutting line 12 based on the first cutting line 12 and the distance value d.
For example, continuing the above example, the second cutting process of the resistor 10 to be adjusted has a distance d of 7, the second cutting line 13 passes through the start cutting position 11 (6, 10), and the angle between the second cutting line 13 and the X axis in the preset coordinate system is also zero, that is, the second cutting line 13 is parallel to the X axis and the first cutting line 12, that is, the second cutting process starts from the start cutting position 11 (6, 10) of the left edge of the resistor 10 to be adjusted, and cuts to the right parallel to the X axis.
Step S102-2a-4-3, the second cutting process is performed on any one of the resistors 10 based on the second cutting line 13.
And step S102-2a-5, terminating the execution of the second cutting process when the second resistance value of any one of the resistors to be adjusted 10 is equal to a preset target resistance value.
The second resistance value of any one of the resistors 10 to be adjusted is equal to the preset target resistance value, which indicates that the on-line resistance adjustment is successful. However, the resistance value at which the test is performed in the on-line resistance adjustment may be affected by the resistance adjustment process. Therefore, after the adjustment of the resistance of a batch of substrates to be processed is completed, the resistance value of the batch of substrates to be processed needs to be tested again on line, so that the actual production yield of the batch of substrates to be processed can be obtained.
Optionally, the values of the cutting parameters of each of the multiple cutting processes further include: the power of the etching laser, the blade type used for cutting, the cutting speed, and/or the frequency of the etching laser.
In other embodiments, the substrate to be processed includes the resistors 10 to be tuned arranged in an array.
Correspondingly, the resistance adjustment of each resistor 10 to be adjusted in the substrate to be processed is performed based on the cutting parameter values of each cutting process in the multiple cutting processes, and the method comprises the following steps:
and step S102-2b-1, respectively performing resistance adjustment test on any row of resistors 10 to be adjusted in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes, and obtaining the production yield of any row of resistors 10 to be adjusted.
And step S102-2b-2, when the production yield of any row of resistors 10 to be regulated is greater than or equal to a preset yield threshold, regulating the resistances of other resistors 10 to be regulated in the substrate to be processed except for any row of resistors 10 to be regulated based on the cutting parameter values of each cutting process in the multiple cutting processes.
In this embodiment, after determining the cutting parameter values of each cutting process in the multiple cutting processes, the small-scale resistance adjustment test is performed on any row of resistors 10 to be adjusted in the substrate to be processed by using the cutting parameter values of each cutting process in the multiple cutting processes, and the production yield after the resistance adjustment of any row of resistors 10 to be adjusted is tested. When the production yield after the small-scale resistance adjustment test meets the requirement, the resistance adjustment is performed on other resistors 10 to be adjusted in the substrate to be processed and other resistors 10 to be adjusted in the substrate to be processed produced in the same batch by utilizing the cutting parameter values of each cutting process in the multiple cutting processes. Distortion or error of preset characteristic information is avoided, distortion or error of cutting parameter values of each cutting process in the multiple cutting processes is caused, the resistance adjustment quality after batch resistance adjustment is ensured, and high-quality production yield is ensured.
According to the embodiment of the application, under the condition of no manual intervention, the resistance of the resistors 10 to be regulated in one substrate to be processed can be regulated by utilizing a repeated cutting process, and the resistances of the resistors 10 to be regulated in all substrates to be processed in the same batch can be regulated in a running water mode, so that the running operation is realized. The problem of low production yield when a single cutting process is used for adjusting the resistances of some special resistors 10 to be adjusted is solved.
Example 2
The application further provides an embodiment of the device adapted to the above embodiment, which is used for implementing the method steps described in the above embodiment, and the explanation based on the meaning of the same name is the same as that of the above embodiment, and has the same technical effects as those of the above embodiment, and is not repeated herein.
As shown in fig. 3, the present application provides a laser resistance adjustment device 300, including:
the test adjustment unit 301 is configured to adjust resistance of each to-be-adjusted resistor in at least one test adjustment substrate by using a single cutting process, and obtain a production yield of the at least one test adjustment substrate based on a resistance value of each to-be-adjusted resistor in the at least one test adjustment substrate after resistance adjustment;
and the multiple cutting unit 302 is configured to, when the production yield of the at least one test-adjustment substrate is lower than a preset yield threshold, respectively adjust the resistance of each to-be-adjusted resistor in the to-be-processed substrate by using multiple cutting processes, so that the production yield of the to-be-processed substrate is greater than or equal to the preset yield threshold, where each to-be-adjusted resistor in the to-be-processed substrate has the same characteristic as each to-be-adjusted resistor in the at least one test-adjustment substrate.
Optionally, the multiple cutting unit 302 includes:
a first determining subunit, configured to determine a cutting parameter value of each cutting process in the multiple cutting processes based on preset characteristic information that is common to all the resistors to be adjusted in the substrate to be processed;
and the first resistance adjusting subunit is used for respectively adjusting the resistance of each resistance to be adjusted in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes.
Optionally, the first determining subunit includes:
and a second determining subunit, configured to determine a balance coefficient value of each of the multiple cutting processes based on preset characteristic information of the resistance to be adjusted in the substrate to be processed, where a sum of balance coefficient values of all the multiple cutting processes is equal to 1.
Optionally, the multiple cutting process includes a two-time cutting process, and the two-time cutting process includes a first cutting process and a second cutting process;
accordingly, the first resistance-adjusting subunit includes:
the first obtaining subunit is used for distributing a preset target resistance value based on the balance coefficient value of the first cutting process to obtain a first target resistance value of the first cutting process;
The first execution subunit is used for testing the first resistance value of any resistor to be processed in real time in the process of executing the first cutting process on any resistor to be processed in the substrate to be processed;
a first terminator unit, configured to terminate execution of the first cutting process when a first resistance value of the any one of the resistors to be adjusted is equal to the first target resistance value;
the second execution subunit is used for executing the second cutting process on any one of the resistors to be adjusted when the measured temperature value of the any one of the resistors to be adjusted is lower than a preset cooling temperature threshold value, and testing the second resistance value of the any one of the resistors to be adjusted in real time;
and the second terminator unit is used for terminating the execution of the second cutting process when the second resistance value of any resistor to be adjusted is equal to a preset target resistance value.
Optionally, the cutting parameter values of the first cutting process further include a starting cutting position and a cutting angle in a preset coordinate system;
the cutting parameter values of the second cutting process further comprise a spacing value; the interval value is larger than or equal to a preset process interval threshold value;
accordingly, the second execution subunit includes:
A second obtaining subunit, configured to obtain, in a preset coordinate system, a first cutting line required for performing the first cutting process on the any one of the resistors to be adjusted based on the start cutting position and the cutting angle;
a third obtaining subunit configured to obtain a second cutting line parallel to the first cutting line based on the first cutting line and the pitch value;
and the third execution subunit is used for executing the second cutting process on any one of the resistors to be adjusted based on the second cutting straight line when the measured temperature value of the any one of the resistors to be adjusted is lower than a preset cooling temperature threshold value, and testing the second resistance value of the any one of the resistors to be adjusted in real time.
Optionally, the balance coefficient value of the first cutting process is 0.95-0.98.
Optionally, the substrate to be processed includes resistors to be modulated arranged in an array;
correspondingly, the first resistance-adjusting subunit further includes:
a fourth obtaining subunit, configured to perform resistance adjustment test on any row of resistors to be adjusted in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes, so as to obtain a production yield of the any row of resistors to be adjusted;
And the second resistance adjusting subunit is used for respectively adjusting the resistance of other resistors to be adjusted except for the resistors to be adjusted in any row in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes when the production yield of the resistors to be adjusted in any row is greater than or equal to a preset yield threshold.
According to the embodiment of the application, under the condition of no manual intervention, the resistance adjustment can be performed on the resistance to be adjusted in one substrate to be processed by utilizing a repeated cutting process, and the resistance adjustment in a running water mode can be performed on the resistance to be adjusted in all substrates to be processed in the same batch production, so that the running water operation is realized. Solves the problem of low production yield when the single cutting process adjusts the resistance of some special resistors to be adjusted.
Finally, it should be noted that: in the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. The system or the device disclosed in the embodiments are relatively simple in description, and the relevant points refer to the description of the method section because the system or the device corresponds to the method disclosed in the embodiments.
The above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.
Claims (4)
1. A method of laser resistance adjustment, comprising:
respectively adjusting resistance of each to-be-adjusted resistor in at least one test-adjusted substrate by utilizing a single cutting process, and obtaining the production yield of the at least one test-adjusted substrate based on the resistance value of each to-be-adjusted resistor in the at least one test-adjusted substrate after resistance adjustment;
when the production yield of the at least one test-adjustment substrate is lower than a preset yield threshold, respectively adjusting resistance of each to-be-adjusted resistor in the to-be-processed substrate by utilizing a multiple-cutting process, so that the production yield of the to-be-processed substrate is greater than or equal to the preset yield threshold, wherein each to-be-adjusted resistor in the to-be-processed substrate has the same characteristic as each to-be-adjusted resistor in the at least one test-adjustment substrate, and the to-be-processed substrate comprises to-be-adjusted resistors arranged in an array manner;
Each resistor to be regulated in the substrate to be processed is respectively regulated by utilizing a multiple cutting process, and the method comprises the following steps:
determining cutting parameter values of each cutting process in the multiple cutting processes based on preset characteristic information common to all resistors to be adjusted in the substrate to be processed; the preset characteristic information includes: presetting resistor density, preset material distribution information and/or preset resistor thickness information;
resistance adjustment is respectively carried out on each resistance to be adjusted in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes;
the determining the cutting parameter value of each cutting process in the multiple cutting processes based on the preset characteristic information common to all the resistors to be adjusted in the substrate to be processed comprises the following steps:
determining the balance coefficient value of each cutting process in the multiple cutting processes based on the preset characteristic information of the resistance to be adjusted in the substrate to be processed, wherein the sum of the balance coefficient values of all the cutting processes in the multiple cutting processes is equal to 1; the multiple cutting processes comprise a twice cutting process, wherein the twice cutting process comprises a first cutting process and a second cutting process; the balance coefficient value of the first cutting process is 0.95-0.98;
The cutting parameter values of each of the multiple cutting processes are determined as follows: establishing a corresponding relation between the historical characteristic information and the cutting parameter values of each of the multiple cutting processes which are successful in the history, and storing the corresponding relation into a relation data set; when the multiple cutting processes are carried out, obtaining cutting parameter values of each cutting process in the multiple cutting processes corresponding to the characteristic information from the relation data set through the characteristic information of the resistor to be adjusted;
correspondingly, the resistance adjustment of each resistance to be adjusted in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes respectively comprises the following steps:
distributing a preset target resistance value based on the balance coefficient value of the first cutting process to obtain a first target resistance value of the first cutting process;
performing a first cutting process on each resistor to be processed in batches for each resistor to be processed in the same batch of produced substrates to be processed;
testing the first resistance value of each resistor to be adjusted in real time in the process of executing the first cutting process on each resistor to be adjusted in the substrate to be processed;
Terminating execution of the first cutting process when the first resistance value of each resistor to be adjusted is equal to the first target resistance value;
after the last resistor to be adjusted in the substrate to be processed is stopped executing the first cutting process, the temperature value of the resistor to be adjusted in the first substrate to be processed for executing the first cutting process is lower than a preset cooling temperature threshold value; then, the second cutting process is carried out in batches from the first resistor to be regulated for carrying out the first cutting process;
testing the second resistance value of each resistor to be regulated in real time;
and when the second resistance value of each resistor to be adjusted is equal to a preset target resistance value, terminating executing the second cutting process.
2. The method of claim 1, wherein the step of determining the position of the substrate comprises,
the cutting parameter values of the first cutting process further comprise an initial cutting position and a cutting angle in a preset coordinate system;
in a preset coordinate system, obtaining a first cutting straight line required by executing the first cutting process on each resistor to be adjusted based on the initial cutting position and the cutting angle;
the cutting parameter values of the second cutting process further comprise a spacing value; the interval value is larger than or equal to a preset process interval threshold value;
Accordingly, the second cutting process is performed on each resistor to be adjusted, including:
obtaining a second cutting line parallel to the first cutting line based on the first cutting line and the distance value;
and executing the second cutting process on each resistor to be adjusted based on the second cutting straight line.
3. The method of claim 1, wherein the step of determining the position of the substrate comprises,
correspondingly, the resistance adjustment of each resistance to be adjusted in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes respectively comprises the following steps:
respectively performing resistance adjustment test on any row of resistors to be adjusted in the substrate to be processed based on cutting parameter values of each cutting process in the multiple cutting processes to obtain the production yield of the resistors to be adjusted in any row;
and when the production yield of any row of resistors to be regulated is greater than or equal to a preset yield threshold, regulating the resistances of other resistors to be regulated in the substrate to be processed except any row of resistors to be regulated respectively based on the cutting parameter values of each cutting process in the multiple cutting processes.
4. A laser resistance adjusting device, comprising:
the test adjustment unit is used for respectively adjusting resistance of each to-be-adjusted resistor in at least one test adjustment substrate by utilizing a single cutting process, and obtaining the production yield of the at least one test adjustment substrate based on the resistance value of each to-be-adjusted resistor in the at least one test adjustment substrate after resistance adjustment;
The multi-time cutting unit is used for respectively adjusting resistance of each to-be-processed resistor in the to-be-processed substrate by utilizing a multi-time cutting process when the production yield of the at least one test-adjustment substrate is lower than a preset yield threshold value, so that the production yield of the to-be-processed substrate is greater than or equal to the preset yield threshold value, wherein each to-be-processed resistor in the to-be-processed substrate has the same characteristic as each to-be-adjusted resistor in the at least one test-adjustment substrate, and the to-be-processed substrate comprises to-be-adjusted resistors arranged in an array manner;
the multiple cutting unit includes:
a first determining subunit, configured to determine a cutting parameter value of each cutting process in the multiple cutting processes based on preset characteristic information that is common to all the resistors to be adjusted in the substrate to be processed; the preset characteristic information includes: presetting resistor density, preset material distribution information and/or preset resistor thickness information;
the first resistance adjusting subunit is used for respectively adjusting resistance of each resistance to be adjusted in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes;
the first determining subunit includes:
a second determining subunit, configured to determine a balance coefficient value of each of the multiple cutting processes based on preset characteristic information of a resistance to be adjusted in the substrate to be processed, where a sum of balance coefficient values of all the multiple cutting processes is equal to 1; the multiple cutting processes comprise a twice cutting process, wherein the twice cutting process comprises a first cutting process and a second cutting process; the balance coefficient value of the first cutting process is 0.95-0.98;
The cutting parameter values of each of the multiple cutting processes are determined as follows: establishing a corresponding relation between the historical characteristic information and the cutting parameter values of each of the multiple cutting processes which are successful in the history, and storing the corresponding relation into a relation data set; when the multiple cutting processes are carried out, obtaining cutting parameter values of each cutting process in the multiple cutting processes corresponding to the characteristic information from the relation data set through the characteristic information of the resistor to be adjusted;
correspondingly, the resistance adjustment of each resistance to be adjusted in the substrate to be processed based on the cutting parameter values of each cutting process in the multiple cutting processes respectively comprises the following steps:
distributing a preset target resistance value based on the balance coefficient value of the first cutting process to obtain a first target resistance value of the first cutting process;
performing a first cutting process on each resistor to be processed in batches for each resistor to be processed in the same batch of produced substrates to be processed;
testing the first resistance value of each resistor to be adjusted in real time in the process of executing the first cutting process on each resistor to be adjusted in the substrate to be processed;
Terminating execution of the first cutting process when the first resistance value of each resistor to be adjusted is equal to the first target resistance value;
after the last resistor to be adjusted in the substrate to be processed is stopped executing the first cutting process, the temperature value of the resistor to be adjusted in the first substrate to be processed for executing the first cutting process is lower than a preset cooling temperature threshold value; then, the second cutting process is carried out in batches from the first resistor to be regulated for carrying out the first cutting process;
testing the second resistance value of each resistor to be regulated in real time;
and when the second resistance value of each resistor to be adjusted is equal to a preset target resistance value, terminating executing the second cutting process.
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