CN109378147B - Adjustment method for trimming resistance value of thin film resistor and thin film resistor - Google Patents
Adjustment method for trimming resistance value of thin film resistor and thin film resistor Download PDFInfo
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- CN109378147B CN109378147B CN201811444793.0A CN201811444793A CN109378147B CN 109378147 B CN109378147 B CN 109378147B CN 201811444793 A CN201811444793 A CN 201811444793A CN 109378147 B CN109378147 B CN 109378147B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/20—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material the resistive layer or coating being tapered
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/235—Initial adjustment of potentiometer parts for calibration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The invention discloses a method for adjusting the resistance of a fine-tuning thin film resistor and the thin film resistor, which are characterized in that the method comprises the steps of arranging a plurality of resistance adjusting holes or spots in the thin film resistor according to the resistance value to be adjusted, wherein the thin film resistor with the resistance adjusting holes or spots is the resistor with the adjusted resistance value. The mode of arranging a plurality of holes or spots in the resistor avoids the problem that the difference between the adjusted resistance and the actual demand is large due to the adjustment of the L-shaped laser cutting.
Description
Technical Field
The invention belongs to the technical field of thin film resistor manufacturing, and particularly relates to a method for adjusting the resistance of a fine-tuning thin film resistor and the thin film resistor.
Background
The thin film resistor is a higher-end product in the printed circuit board, and a series of complex processes such as photoimaging, liquid medicine etching and the like are adopted to manufacture a circuit, meanwhile, the resistor film area with a certain size is manufactured, the same function of a resistor element is achieved, SMT of a mounting device is omitted, and the space of the printed circuit board is not occupied. As shown in FIG. 1, a schematic diagram of a formed thin film resistor 1 is shown, and a calculation formula of the resistance value of the thin film resistor 1 is as follows
R＝R Square ＊L/W
Wherein R is the resistance value, R is the sheet resistance process sheet resistance, L is the sheet resistance length, and W is the sheet resistance width.
The traditional thin film resistor process is to control the resistance value only by controlling the length and the width of the resistor, so that the precision of the formed resistance value is limited by the stability of the thin film resistor material, the precision of the photoimaging equipment and the etching equipment, the resistance precision capability is difficult to be improved, and the increasingly severe requirements of the current electronic equipment industry can not be met.
There is a laser trimming resistor process in the current industry, and the design scheme is as follows:
the L-shaped path is laser ablated from the edge of the resistor on the shaped resistor to form a thin film resistor containing an L-shaped channel 2, as shown in FIG. 2, making the resistor equivalent to a series connection of two resistor ladder 12 and a rectangular resistor 11, as shown in FIG. 3. Calculation of r=r by resistance Square ＊[L 1 /W 1 +(L－L 2 )/(W－W 1 )＊ln(W/W 1 )]Setting parameters L1, L2 and W1 to obtain the final required resistance value.
However, this process has the following disadvantages:
1. in key parameters of the resistor, L1 and W1 are limited by the etching precision of the resistor size and the precision of laser equipment, and in practical application, the deviation between the L1 and W1 and a design value is caused due to the problems of pattern deviation and laser alignment deviation, and finally, the problem that the resistance value of the resistor after adjustment is inconsistent with an expected value is caused;
2. the laser resistor adjusting process is low in reaction speed, files are temporarily manufactured according to the actual resistor value after forming, and cannot be designed in advance, so that production is stagnant;
3. by adopting the process, the same laser file can only adjust the resistance with one resistance value, and when the laser file is adjusted in batches, a large number of laser files are manufactured according to the actual resistance value of the formed resistance, so that the workload of file design and production operation conversion files is increased.
The above-mentioned conventional adjustment techniques mainly have the following disadvantages, which are correspondingly caused by the following reasons:
1. the L-shaped laser cutting adjustment is adopted, the resistance value after the actual use adjustment is greatly different from the actual demand, and the adjustment is limited by graphic deviation and laser deviation;
2. the L-shaped laser cutting adjustment is adopted, the reaction speed is low, the actual resistance value of the formed resistor is required to be measured, then a file is manufactured, and the laser file cannot be manufactured in advance;
3. the L-shaped laser cutting adjustment is not suitable for batch production, and each resistor size and resistor resistance value need to be used as a single file, so that the workload is large and the efficiency is low.
Disclosure of Invention
The invention provides an adjustment method for trimming the resistance value of a thin film resistor and the thin film resistor, in order to avoid the problems of production stagnation caused by adjustment of a file temporarily according to an actual measured resistor after resistor forming and low efficiency caused by complicated laser file design and production operation conversion file caused by batch adjustment of resistors.
The technical scheme of the invention is as follows:
the method is characterized in that a plurality of resistance adjusting holes, light spots or etching spots are formed in the thin film resistor according to the resistance value to be adjusted, and the thin film resistor with the resistance adjusting holes or the resistance spots is the resistance with the adjusted resistance value.
Further, the manner in which the plurality of resistance adjustment holes or spots are provided includes a single or double resistance adjustment hole or spot, or a matrix resistance adjustment hole or spot.
Further, the number and diameter of the resistance adjustment holes, spots or plaques are obtained by the amount of resistance adjustment required, and the formula of the amount of resistance adjustment is:
△R＝R square *x*y*D 2 /[W*(W-yD)]
Wherein R is Square The method is characterized in that the method is a sheet resistor process sheet resistor, x is the number of holes and spots in the length direction of the resistor, y is the number of holes and spots in the width direction of the resistor, D is the diameter of the holes or spots, and W is the width of the sheet resistor.
Further, the resistance adjustment light spot is manufactured by means of laser ablation.
Further, the method for manufacturing the resistance adjustment light spot comprises the following steps:
s1, on the basis of an original design file of a thin film resistor, a laser matrix file is manufactured, and a laser adjustment resistor file is output;
s2, manufacturing a formed film resistor according to the original design file of the film resistor;
s3, measuring the resistance of the formed film resistor, and calculating the deviation between the resistance of the manufactured film resistor and the resistance of the designed resistor;
s4, selecting a corresponding laser matrix file on the laser adjustment resistance file according to the resistance value deviation of the resistor to perform laser.
Further, the manufacturing method of the laser matrix file in S1 adopts layered design and manufacturing, so that the resistance value adjustment quantity of each layer is a fixed value, and the corresponding resistance value adjustment quantity is realized according to different numbers of the selected layers.
Further, the method for designing and manufacturing the layered image comprises the steps of designing a laser output file on the basis of an original design file of the laser film resistor, wherein the laser output file comprises x image layers, y light spots are designed on each image layer, the y light spots on the x image layers are output by the laser output file to form matrix light spots after laser ablation, and the light spot diameter of each laser output file is adjustable.
A thin film resistor, characterized by: the thin film resistor is provided with a plurality of holes or spots.
Further, the number of the holes or spots is single or double, or matrix, wherein the central connecting line of the two holes or spots is parallel to the length or width of the thin film resistor, and the connecting line of each two adjacent holes or spots in the matrix is parallel to the length or width of the thin film resistor.
Further, the spot is a light spot or a plaque.
Further, the diameter of the holes or spots on the sheet resistance is the same.
The beneficial effects of the invention are as follows:
the problem that the difference between the adjusted resistance value and the actual demand is large due to the fact that a plurality of holes or spots are formed in the resistor is avoided;
in addition, the laser light spots are adopted, the effects of pattern deviation and laser deviation are not limited, and meanwhile, the problems of deviation of adjustment values caused by light spot ablation outside a resistance range due to the influence of resistance size precision and equipment precision are avoided;
meanwhile, the laser files of the matrixes divided into a plurality of layers and composed of the light spots are used by simply designing the light spots with different diameters in the length and width directions of the thin film resistor, so that the same file is used, the resistance values of the thin film resistors in batches can be accurately and computationally adjusted, the efficiency is improved, and the light spot matrix file can be used in a certain range and can be prefabricated before the production of the product is finished, so that the smoothness of actual production is ensured.
Drawings
FIG. 1 is a schematic diagram of an as-molded sheet resistance;
FIG. 2 is a schematic diagram of a prior art thin film resistor L-type cut;
FIG. 3 is a schematic diagram of equivalent resistance of the L-shaped cut according to FIG. 2 in the prior art;
FIG. 4 is a schematic diagram of a resistor structure for processing a spot with a diameter D on a molded resistor according to the present invention;
FIG. 5 is a schematic diagram of a thin film resistor structure containing laser matrix spots according to the present invention.
Detailed Description
The invention will be described in detail below with reference to the drawings in conjunction with embodiments. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict.
A method for adjusting the resistance of a fine-tuning thin film resistor comprises the steps of arranging a plurality of resistor adjusting holes, light spots or plaques in the thin film resistor according to the resistance value to be adjusted, wherein the thin film resistor with the resistor adjusting holes or plaques is the resistor with the adjusted resistance value. The mode of arranging a plurality of resistance adjustment holes or spots comprises single or double resistance adjustment holes, spots and plaques, or matrix resistance adjustment holes, spots and plaques.
The number and the diameter of the resistance adjusting holes, the light spots or the etching spots are obtained by the resistance adjusting quantity, and the formula of the resistance adjusting quantity is as follows:
△R＝R square *x*y*D 2 /[W*(W-yD)]
Wherein R is Square Is a sheet resistance process sheet resistance, x is the number of holes and spots in the long direction of the resistance, y is the number of holes and spots in the wide direction of the resistance, and D is the diameter of the holes or spotsW is the film resistance width.
The resistance adjustment light spot of the embodiment is manufactured by a laser ablation mode.
The following equation principle for the resistance adjustment according to the laser ablation method is explained as follows:
as shown in FIG. 4, when a spot with a diameter D is processed on the forming resistor, the spot can be regarded as ablating an equal-sized parallel resistor, and the resistor can be regarded as a resistor formed by connecting R2 and R3 in parallel and then connecting R1 and R4 in series. I.e. the effective length of the resistor (line-to-line distance) is unchanged, the effective width of a certain section of the resistor is reduced, and the resistance value is correspondingly increased.
The adjusted resistance value R'
R＇＝R 1 +R 2 *R 3 /(R 2 +R 3 )+R 4
Substituting the following formula into the above formula
R 1 ＝R Square *L 1 /W
R 2 ＝R Square *D/W 1
R 3 ＝R Square *D/(W-W 1 )
R 4 ＝R Square *(L-L1)/W
Obtaining the product
R＇＝R Square *L/W+R Square *D 2 /[W*(W-D)]
Namely, the resistance change amount is
△R＝R＇-R＝R Square *D 2 /[W*(W-D)]
It can be seen that the spot ablates any region within the resistor, the amount of change in resistance being related only to the sheet resistance of the material itself, the spot diameter, and the width of the resistor.
When the ablation is a matrix, the same is true
△R＝R Square *x*y*D 2 /[W*(W-yD)]。
According to the principle, the manufacturing method of the resistance adjustment light spot comprises the following steps:
s1, on the basis of an original design file of a thin film resistor, a laser matrix file is manufactured, and a laser adjustment resistor file is output;
s2, manufacturing a formed film resistor according to the original design file of the film resistor;
s3, measuring the resistance of the formed film resistor, and calculating the deviation between the resistance of the manufactured film resistor and the resistance of the designed resistor;
s4, selecting a corresponding laser matrix file on the laser adjustment resistance file according to the resistance value deviation of the resistor to perform laser.
The manufacturing method of the laser matrix file in S1 adopts layered design and manufacturing, so that the resistance adjustment quantity of each layer is a fixed value, and the corresponding resistance adjustment quantity is realized according to different numbers of the selected layers.
The method for designing and manufacturing the split-layer comprises the steps of designing a laser output file on the basis of an original design file of a laser film resistor, wherein the laser output file comprises x layers, y light spots are designed on each layer, the y light spots on the x layers are output by the laser output file to form matrix light spots after laser ablation, and the light spot diameter of each laser output file is adjustable. As in fig. 5, the file is divided into x layers in the long direction, i.e., each layer has y spots.
According to the method, laser is completely applied to the inside of the resistor, adjustment value deviation caused by the fact that light spots are ablated outside the resistor range due to the size precision of the resistor and the precision of laser equipment is avoided, meanwhile, a laser file can be used for adjusting batch products in a larger range through designing a light spot matrix and carrying out layered design, and efficiency is improved.
Because the facula matrix file can be used in a certain range, the facula matrix file can be prefabricated before the production of the product is finished, and the smoothness of actual production is ensured.
A thin film resistor, characterized by: the thin film resistor 1 is provided with a plurality of holes or spots 3.
The number of holes or spots 3 is single or double, or matrix, wherein the central connecting line of the double holes or spots is parallel to the length or width of the thin film resistor, and the connecting line of each two adjacent holes or spots in the matrix is parallel to the length or width of the thin film resistor.
The spots are light spots or plaques.
The diameter D of the holes or spots on the sheet resistance is the same.
The above examples merely represent concentrated embodiments of the invention, which are described in more detail and are not to be construed as limiting the scope of the invention, it being understood that variations and modifications can be made by those skilled in the art without departing from the spirit of the invention. The scope of the invention is therefore intended to be covered by the appended claims.
Claims (2)
1. The method is characterized in that the method comprises the steps of setting a plurality of resistance adjustment spots in the thin film resistor according to the resistance value to be adjusted, wherein the thin film resistor with the resistance adjustment spots is the resistance with the adjusted resistance value;
the resistance adjustment spots are manufactured by a laser ablation mode;
the method of laser ablation comprises the steps of:
s1, on the basis of an original design file of a thin film resistor, a laser matrix file is manufactured, and a laser adjustment resistor file is output;
the manufacturing method of the laser matrix file adopts layered design and manufacturing, so that the resistance adjustment quantity of each layer is a fixed value, and the corresponding resistance adjustment quantity is realized according to different numbers of the selected layers;
designing a laser matrix file on the basis of an original design file of a thin film resistor, wherein the laser matrix file comprises x layers, y light spots are designed on each layer, and y light spots on the x layers are output by the laser matrix file to form matrix light spots after laser ablation, and the light spot diameter of each laser matrix file is adjustable;
s2, manufacturing a formed film resistor according to the original design file of the film resistor;
s3, measuring the resistance of the formed film resistor, and calculating the deviation between the resistance of the manufactured film resistor and the resistance of the designed resistor;
s4, selecting a corresponding laser matrix file on the laser adjustment resistance file according to the resistance value deviation of the resistor to perform laser.
2. The method of trimming the resistance of a thin film resistor according to claim 1, wherein the number and diameter of the resistance trimming spots are obtained from a required resistance trimming amount, and the formula of the resistance trimming amount is:
△R= R square xyD 2 /[W(W-yD)]
Wherein R is Square The resistor is a sheet resistor process sheet resistor, x is the number of spots in the resistor length direction, y is the number of spots in the resistor width direction, D is the diameter of the spots, and W is the film resistor width.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811444793.0A CN109378147B (en) | 2018-11-29 | 2018-11-29 | Adjustment method for trimming resistance value of thin film resistor and thin film resistor |
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| CN201811444793.0A CN109378147B (en) | 2018-11-29 | 2018-11-29 | Adjustment method for trimming resistance value of thin film resistor and thin film resistor |
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| CN109378147A CN109378147A (en) | 2019-02-22 |
| CN109378147B true CN109378147B (en) | 2023-09-05 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1337196A (en) * | 1971-03-25 | 1973-11-14 | Ici Ltd | Multiple beam optical projector |
| JPH01318167A (en) * | 1988-06-20 | 1989-12-22 | Fuji Xerox Co Ltd | Document forming device |
| CN106782951A (en) * | 2017-01-23 | 2017-05-31 | 广东风华高新科技股份有限公司 | The resistance trimming method of thin-film thermistor and the manufacture method of diaphragm type thermistor |
-
2018
- 2018-11-29 CN CN201811444793.0A patent/CN109378147B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1337196A (en) * | 1971-03-25 | 1973-11-14 | Ici Ltd | Multiple beam optical projector |
| JPH01318167A (en) * | 1988-06-20 | 1989-12-22 | Fuji Xerox Co Ltd | Document forming device |
| CN106782951A (en) * | 2017-01-23 | 2017-05-31 | 广东风华高新科技股份有限公司 | The resistance trimming method of thin-film thermistor and the manufacture method of diaphragm type thermistor |
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| CN109378147A (en) | 2019-02-22 |
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