CN109991788A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN109991788A CN109991788A CN201910215623.3A CN201910215623A CN109991788A CN 109991788 A CN109991788 A CN 109991788A CN 201910215623 A CN201910215623 A CN 201910215623A CN 109991788 A CN109991788 A CN 109991788A
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- area
- substrate
- underlay substrate
- display panel
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
- G02F1/133711—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by organic films, e.g. polymeric films
- G02F1/133723—Polyimide, polyamide-imide
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136204—Arrangements to prevent high voltage or static electricity failures
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/22—Antistatic materials or arrangements
Abstract
The invention discloses a kind of display panel and display devices, are related to field of display technology, and the first substrate including being oppositely arranged and the second substrate, first substrate includes: underlay substrate；Underlay substrate is set and is fanned out to cabling towards the second substrate side, is fanned out to cabling and is located at non-display area；Electrostatic conductive pads of the underlay substrate towards the second substrate side are set, electrostatic conductive pads are located at non-display area, and along the direction perpendicular to plane where underlay substrate, electrostatic conductive pads are recessed towards underlay substrate, recessed portion is formed, the electrostatic conductive pads include at least one conductive via；Recessed portion includes the firstth area and the secondth area around the firstth area, and conductive via is only distributed in the firstth area；The orthographic projection of plane where underlay substrate of secondth area is overlapped with cabling is at least partly fanned out to；Alignment film on underlay substrate is set, the side positioned at electrostatic conductive pads far from underlay substrate.Such scheme is conducive to the antistatic ability for promoting product.
Description
Technical field
The present invention relates to field of display technology, more particularly, to a kind of display panel and display device.
Background technique
From CRT (Cathode Ray Tube, cathode-ray tube), the epoch are to the liquid crystal epoch, then the OLED to arrive till now
(Organic Light-Emitting Diode, Organic Light Emitting Diode) epoch, display industry experienced the development of decades
Become with rapid changepl. never-ending changes and improvements.Display industry is closely bound up with our life, from traditional mobile phone, plate, TV and PC, then arrives
Present intelligent wearable device and VR etc. all be unable to do without display technology.
Electrostatic would generally be generated in display device, if electrostatic is present in display device and when exporting not in time, electrostatic
In the presence of display panel surrounding line broken circuit may be made, cause display abnormal, such as: it is rubescent, turn blue, abnormal show is even without Faxian
Show.
Therefore, how reliably to conduct the electrostatic generated inside display device to outside becomes urgently to be resolved at this stage
One of technical problem.
Summary of the invention
In view of this, the technical problem to be solved by the application is to provide a kind of display panel and display device, it is therein
Electrostatic conductive pads are recessed to form recessed portion towards underlay substrate, and the plane where underlay substrate of the secondth area in recessed portion
Orthographic projection is overlapped with cabling is at least partly fanned out to, even if the frame of display panel is narrowed, is equally beneficial for increase recessed portion and is existed
The area of the orthographic projection of plane where underlay substrate, thus during forming alignment film, be conducive to reduction alignment film with it is quiet
The contact area of electrical conduction liner, to be conducive to reduce alignment film shadow caused by the electrostatic conductive performance of electrostatic conductive pads
It rings, is conducive to the ability for promoting the antistatic influence of product.
The application has following technical solution:
In a first aspect, the application provides a kind of display panel, it is provided with viewing area and around the non-display of the viewing area
Area, the display panel include the first substrate being oppositely arranged and the second substrate, and the first substrate includes:
Underlay substrate；
Be fanned out to cabling of the underlay substrate towards the second substrate side is set, and the cabling that is fanned out to is positioned at described
Non-display area；
Electrostatic conductive pads of the underlay substrate towards the second substrate side, the electrostatic conductive pads are set
Positioned at the non-display area, along the direction perpendicular to plane where the underlay substrate, the electrostatic conductive pads are towards institute
Underlay substrate recess is stated, forms recessed portion, the electrostatic conductive pads include at least one conductive via；The recessed portion includes
Firstth area and around secondth area in firstth area, the conductive via only divides in the orthographic projection of plane where the underlay substrate
It is distributed in firstth area；Secondth area is fanned out to cabling at least partly described in the orthographic projection of plane where the underlay substrate
It is overlapping；
Alignment film on the underlay substrate is set, positioned at the electrostatic conductive pads far from the underlay substrate one
Side, the alignment film are located at least in the viewing area.
Second aspect, the application also provide a kind of display device, including display panel, which is mentioned by the application
Any display panel supplied.
Compared with prior art, display panel provided by the invention and display device at least realize following beneficial effect
Fruit:
In display panel and display device provided herein, including the first substrate being oppositely arranged and the second substrate,
The side of first substrate towards the second substrate is provided with electrostatic conductive pads, which is recessed towards underlay substrate
Recessed portion is formed, electrostatic conductive pads include the conductive via positioned at the firstth area of recessed portion, and the secondth area is where underlay substrate
The orthographic projection of plane is overlapped with cabling is fanned out to, and is equivalent to and is increased the face of recessed portion orthographic projection of plane where underlay substrate
Product；Since electrostatic conductive pads are recessed towards underlay substrate, during forming alignment film, into the PI in recessed portion
The amount of (Polyimide, polyimide) liquid will be less than the amount of the corresponding PI liquid of identical with recessed portion area non-sunk area, have
Conducive to the contact area of reduction PI liquid and electrostatic conductive pads, while being conducive to reduce the contact area of PI liquid and conductive via,
Even if therefore that the frame side of display panel and display device is narrow, it is equally beneficial for reducing PI liquid to the electrostatic of electrostatic conductive pads
It is influenced caused by conductive performance, and then is conducive to be promoted the ability of the antistatic influence of display panel and display device.It needs
Bright, above-mentioned PI liquid is the chemical liquid for forming alignment film, after PI liquid is printed on substrate after overbaking
Form alignment film.
Certainly, implementing any of the products of the present invention specific needs while must not reach all the above technical effect.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its
Advantage will become apparent.
Detailed description of the invention
It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even
With its explanation together principle for explaining the present invention.
Fig. 1 show a kind of top view of display panel provided by the prior art；
Fig. 2 show another top view of display panel provided by the technology of showing；
Fig. 3 show a kind of top view of display panel provided by the embodiment of the present application；
Fig. 4 show a kind of along AA ' sectional view of display panel provided in Fig. 3 embodiment；
Fig. 5 show a kind of along BB ' sectional view of first substrate in embodiment illustrated in fig. 3；
Fig. 6 show electrostatic conductive pads and a kind of phase for being fanned out to cabling in display panel provided by the embodiment of the present application
To location diagram；
It is opposite that Fig. 7 show electrostatic conductive pads and one kind of alignment film in display panel provided by the embodiment of the present application
Location diagram；
Fig. 8 show a kind of along CC ' sectional view of first substrate in display panel provided by Fig. 3 embodiment；
Fig. 9 show a kind of along DD ' sectional view of conductive via position in display panel provided by Fig. 6 embodiment；
Figure 10 show the another kind of conductive via position in display panel provided by Fig. 6 embodiment along DD ' sectional view；
Figure 11 show the another kind of conductive via position in display panel provided by Fig. 6 embodiment along DD ' sectional view；
Figure 12 show one of embodiment illustrated in fig. 6 along EE ' sectional view；
Figure 13 show one of embodiment illustrated in fig. 6 along FF ' sectional view；
Figure 14 show a kind of top view of display device provided by the embodiment of the present application.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should also be noted that unless in addition having
Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The range of invention.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention
And its application or any restrictions used.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
Fig. 1 show a kind of top view of display panel 300 provided by the prior art, and Fig. 2 show the technology of showing
Another top view of provided display panel 300, referring to Figure 1, the lower frame position of display panel 300 are provided with electrostatic
Conductive pads 301, for conducting electrostatic present in display panel 300 to display panel 300.COF(Chip On
Film) the appearance of technology is largely fulfilled the narrow lower frame design of display panel 300, and COF is to bind driving chip
In flexible circuit board 303, then the side by 303 reflexed of flexible circuit board to display panel 300 far from light-emitting surface again, such
Control chip in structure is not take up the lower frame space of display panel 300, thus can compress to lower frame, to realize
The narrow lower frame of display panel 300 designs.Under the visual angle shown in Fig. 1 and Fig. 2, when lower frame is compressed, electrostatic conduction
301 length in a second direction of liner also reduces therewith, is decreased to H2 from H1, at the same electrostatic conductive pads 301 and viewing area it
Between distance also reduce therewith；During forming alignment film on display panel 300, alignment film easily diffuses to electrostatic conduction
301 positions are padded, causes the ability of 301 conducting static electricity of electrostatic conductive pads to decline, influences the antistatic of display panel 300
Interference performance, and then influence properties of product.
In view of this, the technical problem to be solved by the application is to provide a kind of display panel and display device, it is therein
Electrostatic conductive pads are recessed to form recessed portion towards underlay substrate, and the plane where underlay substrate of the secondth area in recessed portion
Orthographic projection is overlapped with cabling is at least partly fanned out to, and is conducive to the face for increasing recessed portion orthographic projection of plane where underlay substrate
Product during forming alignment film, is equally beneficial for reducing PI liquid and electrostatic conducts even if the frame side by display panel is narrow
The contact area of liner, to be conducive to reduce the influence caused by the electrostatic conductive performance of electrostatic conductive pads of PI liquid, favorably
In the ability for the antistatic influence for promoting product.
The application provides a kind of display panel, is provided with viewing area and the non-display area around viewing area, display panel packet
The first substrate being oppositely arranged and the second substrate are included, first substrate includes:
Underlay substrate；
Underlay substrate is set and is fanned out to cabling towards the second substrate side, is fanned out to cabling and is located at non-display area；
Electrostatic conductive pads of the underlay substrate towards the second substrate side are set, and electrostatic conductive pads are located at non-display
Area, along the direction perpendicular to plane where underlay substrate, electrostatic conductive pads are recessed towards underlay substrate, form recessed portion,
Electrostatic conductive pads include at least one conductive via；Recessed portion includes the firstth area and the secondth area around the firstth area, conductive mistake
The orthographic projection of hole plane where underlay substrate is only distributed in the firstth area；Secondth area where underlay substrate the orthographic projection of plane with
It is overlapping to be at least partly fanned out to cabling；
Alignment film on underlay substrate is set, and the side positioned at electrostatic conductive pads far from underlay substrate, alignment film is extremely
It is located at viewing area less.
It is described in detail below with reference to drawings and examples.
Fig. 3 show a kind of top view of display panel 100 provided by the embodiment of the present application, and Fig. 4 show Fig. 3 implementation
Display panel 100 provided in example refers to Fig. 3 and Fig. 4 along a kind of sectional view of AA ', provided by the embodiment of the present application
Display panel 100 is provided with viewing area 102 and the non-display area 103 around viewing area 102, which includes opposite
The first substrate 10 and the second substrate 20 of setting, underlay substrate 101 is arranged towards the side of the second substrate 20 in first substrate 10
Be fanned out to cabling 50, this be fanned out to cabling 50 to by first substrate 10 signal wire (such as data line and power supply line etc.) and drive
Dynamic chip electrical connection optionally for the narrow frame design for realizing display panel, can be used COF technology, driving chip is bundled in
In flexible circuit board 107, then the side by 107 reflexed of flexible circuit board to display panel 100 far from light-emitting surface.In underlay substrate
101 are additionally provided with electrostatic conductive pads 30 towards the side of the second substrate 20, which is used for display panel
Electrostatic in 100 is conducted to outside, and electrostatic is avoided to impact display panel 100.In particular, 30 court of electrostatic conductive pads
It is recessed to underlay substrate 101, forms recessed portion 38, refer to Fig. 5 and Fig. 6, Fig. 5 show the first base in embodiment illustrated in fig. 3
Plate 10 it is a kind of along BB ' sectional view, Fig. 6 show electrostatic conductive pads in display panel 100 provided by the embodiment of the present application
30 be fanned out to a kind of relative position relation figure of cabling 50, electrostatic conductive pads 30 include at least one conductive via 33, electrostatic
The recessed portion 38 that conductive pads 30 are formed includes that the first area 31 and the second area 32 around the first area 31, conductive via 33 are only distributed
In the first area 31, the second area 32 is overlapped in the orthographic projection of 101 place plane of underlay substrate with cabling 50 is at least partly fanned out to.It please tie
Fig. 4 is closed, during forming alignment film 108 on first substrate 10, to ensure that alignment film 108 completely covers viewing area 102,
Would generally also form alignment film 108 at least partly non-display area 103, alignment film 108 be usually by PI (Polyimide,
Polyimide) liquid production, PI liquid is the chemical liquid for making alignment film 108, and PI liquid is printed on first substrate 10
By formation alignment film 108 after overbaking.During printing PI liquid in non-display area 103, due to electrostatic conductive pads 30
Recessed portion 38 is formd towards the recess of underlay substrate 101, and the second area 32 in recessed portion 38 is in 101 place plane of underlay substrate
Orthographic projection and be at least partly fanned out to that cabling 50 is overlapping, even if the frame side by display panel 100 is narrow, which still is able to increase
Big recessed portion 38 the orthographic projection of 101 place plane of underlay substrate area, thus during forming alignment film 108, i.e.,
Make there is part PI liquid to extend to non-display area 103, due to the presence of the biggish recessed portion 38 of area, so that in same units area
Interior, the area that alignment film 108 covers electrostatic conductive pads 30 is less than it to the area covered in other non-sunk areas,
The contact area for being thus conducive to reduce conductive via 33 in alignment film 108 and electrostatic conductive pads 30, to be conducive to reduce
Alignment film 108 is influenced caused by the electrostatic conductive performance of electrostatic conductive pads 30, is also helped while realizing narrow frame
Promote the antistatic ability of product.
It should be noted that Fig. 3 schematically shows only first substrate, the second substrate, electrostatic conductive pads, is fanned out to away
A kind of relative positional relationship of line, does not represent actual size and number.
Optionally, electrostatic biography in display panel 100 provided by the embodiment of the present application is shown continuing with referring to Fig. 7, Fig. 7
A kind of relative position relation figure of guide bush pad 30 and alignment film 108, in display panel 100 provided by the embodiment of the present application, until
Small part alignment film 108 extends to non-display area 103 from viewing area 102；
In same units area, area coverage of the alignment film 108 in the first area 31 is less than it in the covering in the second area 32
Area.
Specifically, to ensure that alignment film 108 can all cover viewing area 102, during making alignment film 108,
Part PI liquid will be printed to the position of non-display area, form recess since electrostatic conductive pads 30 are recessed towards underlay substrate 101
Portion 38, the amount of PI liquid please further tie the amount of PI liquid in the non-sunk area for being less than same units area in recessed portion 38
Fig. 3, Fig. 5 and Fig. 7 are closed, in the recessed portion 38 formed by electrostatic conductive pads 30, the area overlapping with cabling 50 is fanned out to, the second area 32
For the first area 31 is compared in domain, closer to viewing area 102, during printing PI liquid, in same units area, second
The amount of the corresponding PI liquid in the region overlapping with cabling 50 is fanned out to of area 32 will be greater than the amount of PI liquid in the first area 31, that is to say, that match
Area coverage to film 108 in the first area 31 is less than it in the area coverage in the second area 32, leads due to being provided in the first area 31
Electric via hole 33, even if having PI liquid to enter in the recessed portion 38 formed by electrostatic conductive pads 30, PI liquid will be more covered on
In second area 32,33 corresponding region of the conductive via i.e. area coverage in the first area 31 will also be reduced, thus such design has
Conducive to the contact area of conductive via 33 in alignment film 108 and electrostatic conductive pads 30 is reduced, to be conducive to reduce alignment film
108 influence caused by the electrostatic conductive performance of electrostatic conductive pads 30, and then are conducive to promote the antistatic of product
Ability.
Optionally, Fig. 4 is referred to, in display panel 100 provided by the embodiment of the present application, the second substrate 20 includes electrostatic
Shielded layer 21, display panel 100 further include conductive silver glue 40, and electrostatic screen layer 21 passes through 30 electricity of conductive silver and electrostatic conductive pads
Connection, and conductive silver glue 40 at least partly covers the first area 31 in the orthographic projection of 101 place plane of underlay substrate.
Specifically, incorporated by reference to Fig. 3 and Fig. 4, in the recessed portion 38 formed due to electrostatic conductive pads 30, conductive via 33
It can be realized conductive silver glue 40 and conductive via 33 when conductive silver glue 40 at least partly covers the firstth area 31 in the first area 31
Electrical connection；Since conductive silver glue 40 is electrically connected with the electrostatic screen layer 21 in the second substrate 20, in this way, in the second substrate 20
Electrostatic will be enabled through the electrostatic conductive pads 30 of the conduction of conductive silver glue 40 to first substrate 10, and then be passed by electrostatic conductive pads 30
It is directed at outside display panel 100, thus is conducive to reduce electrostatic to influence caused by the second substrate 20, be equally beneficial for being promoted aobvious
Show the antistatic ability of panel 100.
Optionally, map interlinking 5 and Fig. 8 are asked, Fig. 8 show first substrate 10 in display panel 100 provided by Fig. 3 embodiment
It is a kind of along CC ' sectional view, incorporated by reference to Fig. 5 and Fig. 8, first substrate 10 further include along perpendicular to underlay substrate 101 direction according to
The secondary the first metal layer 11 being arranged on underlay substrate 101, interlayer insulating film 14, second metal layer 12, planarization layer 16, passivation
Layer 17 and electrode layer 18, electrode layer 18 include electrostatic conductive pads 30, and the first metal layer 11 is located at interlayer insulating film 14 close to lining
The side of substrate 101；
Planarization layer 16 is not overlapped in the orthographic projection of 101 place plane of underlay substrate with recessed portion 38.
Specifically, incorporated by reference to Fig. 5 and Fig. 8, array layer is usually provided on first substrate 10, the driving in array layer is thin
Film transistor 105 is used to drive the pixel electrode 182 on display panel 100, in general, the grid position of driving thin film transistor (TFT) 105
In the first metal layer 11, source electrode and drain electrode is located at second metal layer 12, and drain electrode is electrically connected with pixel electrode, the usual position of pixel electrode
In above-mentioned electrode layer 18.When display panel 100 is liquid crystal display panel 100, the gate turn-on of thin film transistor (TFT) 105 is driven
When, the signal of source electrode will be transmitted to drain electrode, and then be transferred to pixel electrode 182, the voltage and public affairs generated on pixel electrode 182
The voltage collective effect generated in common electrode 181, formed driving liquid crystal deflection deflection voltage, thus realize to sub-pixel whether
Light transmission or the control of light transit dose.In general, a plurality of signal wire is distributed in second metal layer 12, such as data line etc., complete
After production at second metal layer 12, it will usually larger in surface formation thickness of the second metal layer 12 far from underlay substrate 101
Planarization layer 16, to provide the surface of planarization for the formation of subsequent film.Display panel provided by the embodiment of the present application
In 100, incorporated by reference to Fig. 5 and Fig. 8, orthographic projection and electrostatic conductive pads 30 of the planarization layer 16 in 101 place plane of underlay substrate
The recessed portion 38 of formation does not overlap, and forms planarization far from the surface of underlay substrate 101 in second metal layer 12 in this way, being equivalent to
After layer 16, the planarization layer 16 in region corresponding to electrostatic conductive pads 30 is etched away, so that after electrostatic conductive pads 30
Continuous film layer shows the state of recess, to reduce the amount that the PI liquid in 108 forming process of alignment film enters recessed portion 38, thus
Be conducive to be promoted the antistatic interference performance of display panel 100.It should be noted that during forming recessed portion 38, it can
All to etch away the planarization layer 16 of 30 corresponding region of electrostatic conductive pads, a part can also be only etched away, as long as can
So that electrostatic conductive pads 30 are correspondingly formed recessed portion 38, the application is to this without specifically limiting.
Optionally, continuing with referring to Fig. 5, along the direction perpendicular to 101 place plane of underlay substrate, the depth of recessed portion 38
Spend the maximum gauge D2 that D1 is less than or equal to planarization layer 16.
Specifically, flat when being etched away the part planarization layer 16 of 30 corresponding region of electrostatic conductive pads, retaining a part
When smoothization layer, D1 is less than the maximum gauge of planarization layer 16 by the depth of recessed portion 38, and such mode recessed portion 38 has certain
The recess of degree can reduce the amount that PI liquid enters recessed portion 38 during forming alignment film 108 to a certain extent,
To be conducive to reduce influence of the PI liquid to the electrostatic conducting power of electrostatic conductive pads 30.When electrostatic conductive pads 30 are corresponding
When the planarization layer 16 in region all etches away, to the extent permitted by the error, the depth D1 of recessed portion 38 will be equal to planarization
The maximum gauge D2 of layer 16, the sinking degree of such mode recessed portion 38 is larger, during forming alignment film, utmostly
On reduce the amount that PI liquid enters recessed portion 38, to largely reduce PI liquid to the electrostatic of electrostatic conductive pads 30
The influence of conducting power.
Optionally, Fig. 5 is referred to, conductive via 33 includes the first via hole 331；In the first area 31, second metal layer 12 is connect
Ground, electrostatic conductive pads 30 are electrically connected by the first via hole 331 with second metal layer 12, and the first via hole 331 is perpendicular to substrate
The side of 101 place plane of substrate extends upward through passivation layer 17.
Specifically, continuing with referring to Fig. 5, in the corresponding position of electrostatic conductive pads 30, second metal layer 12 is grounded, electrostatic
Conductive pads 30 are electrically connected with second metal layer 12, when there is electrostatic generation, electrostatic conductive pads 30 electrostatic can be conducted to
The second metal layer 12 of ground connection, and then electrostatic is exported to display panel 100, to reduce electrostatic to display panel 100
Caused by influence.Since the film layer between second metal layer 12 and electrostatic conductive pads 30 is less, in the embodiment shown in fig. 5 only
Including a passivation layer 17, therefore, when forming the first via hole 331, need to only be punched on the first passivation layer 17, thus it is advantageous
In simplified production process.It should be noted that during forming recessed portion 38, it can be by the corresponding area of electrostatic conductive pads 30
The planarization layer 16 in domain all etches away, and can also only etch away a part；It is passed when only etch away sections planarization layer and in electrostatic
When guide bush pads 30 corresponding regions reservation part planarization layer, it is also required to etch in the planarization layer of 331 corresponding position of the first via hole
Fall, that is to say, that in the direction perpendicular to 101 place plane of underlay substrate, the first via hole 331 is in addition to through passivation layer 17, also
Planarization layer need to be run through, to realize being electrically connected between electrostatic conductive pads 30 and second metal layer 12.
Optionally, Fig. 9 show a kind of edge of 33 position of conductive via in display panel 100 provided by Fig. 6 embodiment
DD ' sectional view, refers to Fig. 9, and conductive via 33 includes the second via hole 332；In the first area 31, the first metal layer 11 is grounded, quiet
Electrical conduction liner 30 is electrically connected by the second via hole 332 with the first metal layer 11, and the second via hole 332 is perpendicular to underlay substrate
The side of 101 place planes extends upward through passivation layer 17 and interlayer insulating film 14.
Specifically, continuing with referring to Fig. 9, in the corresponding position of electrostatic conductive pads 30, the first metal layer 11 is grounded, electrostatic
Conductive pads 30 are electrically connected with the first metal layer 11, when there is electrostatic generation, electrostatic conductive pads 30 electrostatic can be conducted to
The first metal layer 11 of ground connection, and then electrostatic conduction is removed outside display panel 100, to reduce electrostatic to display panel 100
Caused by influence.
Certainly, in some other embodiments of the application, 0, Figure 10 show Fig. 6 embodiment and is provided referring to Figure 1
Display panel 100 in 33 position of conductive via it is another along DD ' sectional view, in the corresponding position of electrostatic conductive pads 30,
Second metal layer 12 is electrically connected with the first metal layer 11 by via hole, and the first metal layer 11 is grounded, and second metal layer 12 passes through the
One metal layer 11 ground connection；Electrostatic conductive pads 30 are electrically connected with second metal layer 12, and then are grounded.In such structure, beat
In the technique in hole, each Kong Jun only runs through a layer insulating, is easier to realize in technique, and electrostatic conductive pads 30 can equally lead to
It crosses second metal layer 12 and the first metal layer 11 conducts electrostatic to display panel 100, to be conducive to reduce electrostatic pair
It is influenced caused by display panel 100.
Optionally, Figure 11 show the another kind of 33 position of conductive via in display panel 100 provided by Fig. 6 embodiment
Along DD ' sectional view, referring to Figure 11, first substrate 10 further includes third metal layer 13, and third metal layer 13 is located at planarization layer
Between 16 and passivation layer 17；
Conductive via 33 includes third via hole 333；In the first area 31, third metal layer 13 is grounded, electrostatic conductive pads 30
It is electrically connected by third via hole 333 with third metal layer 13, third via hole 333 is on the direction of 101 place plane of underlay substrate
Through passivation layer 17.
Specifically, continuing with referring to Figure 11, in the embodiment, part is remained in the corresponding position of electrostatic conductive pads 30
Planarization layer 16 further includes third metal layer 13, the third metal layer 13 ground connection between planarization layer 16 and passivation layer 17；It is quiet
Electrical conduction liner 30 is electrically connected by the third via hole 333 through passivation layer 17 with third metal layer 13, and then realizes ground connection,
In this way, electrostatic conductive pads 30 can conduct electrostatic to the third metal layer 13 of ground connection, and then will be quiet when there is electrostatic generation
Electrical conduction is removed outside display panel 100, to reduce electrostatic to influence caused by display panel 100.
Optionally, Figure 12 show one of embodiment illustrated in fig. 6 along EE ' sectional view, and referring to Figure 12, it is fanned out to cabling
50 include the first line segment 51, and the first line segment 51 is overlapping in the orthographic projection of 101 place plane of underlay substrate and the second area 32, and first
Line segment 51 is located at the first metal layer 11.
Specifically, incorporated by reference to Figure 12 and Fig. 6, due in 30 corresponding position of electrostatic conductive pads, by removing at least partly
Planarization layer 16 realizes the recess of electrostatic conductive pads 30, and corresponding passivation layer 17 can also be located at originally to lower recess at this time
After the biggish planarization layer 16 of the thickness of passivation layer 17 towards 101 side of underlay substrate is removed, corresponding passivation layer 17 occurs
A possibility that being broken (peeling) will become larger, and after passivation layer 17 is broken, will lead to positioned at passivation layer 17 far from substrate base
The electrode layer 18 of 101 side of plate be located at passivation layer close to 101 side of underlay substrate third metal layer or second metal layer it
Between occur short circuit；And the application is arranged the first line segment 51 overlapped in cabling 50 with the second area 32 is fanned out in the first metal layer 11
When, between first line segment 51 and passivation layer 17 between be separated with interlayer insulating film 14, such set-up mode advantageously reduces passivation layer
17 risks being broken, thus such setting of the first line segment 51, in the electrostatic conducting power for promoting electrostatic conductive pads 30
While, additionally it is possible to the risk that passivation layer 17 is broken is reduced, thus is conducive to be promoted the overall performance of display panel 100.
Optionally, Figure 13 show one of embodiment illustrated in fig. 6 along FF ' sectional view, incorporated by reference to figure and Figure 13, this Shen
Please be in display panel 100 provided by embodiment, first substrate 10 further includes third metal layer 13, and third metal layer 13 is located at flat
Between smoothization layer 16 and passivation layer 17；
Being fanned out to cabling 50 further includes the second line segment 52 in addition to the first line segment 51, and second line segment 52 is located at the first metal layer
11, at least one layer in second metal layer 12 and third metal layer 13, and second line segment 52 is in 101 place plane of underlay substrate
Orthographic projection is not overlapped with the second area 32.
Specifically, referring to Figure 13, the second line segment 52 being fanned out in cabling 50, due to not with electrostatic conductive pads 30
Two areas 32 are overlapping, therefore will not make to its normal arrangement electrostatic conductive pads 30 are recessed towards underlay substrate 101
At influence, therefore, the second line segment 52 being fanned out in cabling 50 can be distributed in the first metal layer 11, second metal layer 12 and third gold
Belong at least one layer in layer 13.Optionally, the second line segment 52 being fanned out in cabling 50 is distributed in the first metal layer 11, the second gold medal
Belong at least two layers in layer 12 and third metal layer 13, is conducive to the number for reducing the cabling arranged on same metal layer in this way
Amount avoids due to the crosstalk that distance is smaller and generates between adjacent traces, while the second line segment 52 being fanned out in cabling 50 being divided
When being distributed in different metal layers, the narrow frame design for realizing display panel 100 is also helped.
It should be noted that Fig. 6 is referred to, when the first line segment 51 and second line segment 52 being fanned out in cabling 50 are positioned at identical
When film layer, can directly it be electrically connected therebetween；When the first line segment 51 and second line segment 52 are located at different film layers, the two it
Between electrical connection can be realized by way of punching.
It additionally it should be noted that, refers to Fig. 8, in display panel 100 provided by the embodiment of the present application, is located at first
Electrode layer 18 on substrate 10 generally includes public electrode 181 and pixel electrode 182, electrostatic provided in the embodiment of the present application
Conductive pads 30 can be arranged with above-mentioned 181 same layer of public electrode, can also be arranged with 182 same layer of pixel electrodes, the application couple
This is without specifically limiting.When electrostatic conductive pads 30 and public electrode 181 or 182 same layer of pixel electrode are arranged, without being quiet
Special film layer is separately provided in electrical conduction liner 30, is conducive to save generation process, improves production efficiency；Meanwhile with common electrical
When pole 181 or 182 same layer of pixel electrode are arranged, additionally it is possible to play the role of covering and protection to the metal being connected electrically, have
Effect prevents extraneous moisture and oxygen from causing to corrode to metal layer when contacting with metal layer.
Based on the same inventive concept, the application also provides a kind of display device, and Figure 14 show the embodiment of the present application and mentioned
A kind of top view of the display device 200 of confession, the display device 200 include display panel 100, which is this Shen
It please any display panel provided by embodiment.The embodiment of display device provided by the embodiment of the present application can be found in above-mentioned aobvious
Show the embodiment of panel 100, overlaps will not be repeated.Display device provided herein can be with are as follows: mobile phone, plate electricity
Any products or components having a display function such as brain, television set, display, laptop, Digital Frame, navigator.
Through the foregoing embodiment it is found that display panel provided by the invention and display device, at least realizing following has
Beneficial effect:
In display panel and display device provided herein, including the first substrate being oppositely arranged and the second substrate,
The side of first substrate towards the second substrate is provided with electrostatic conductive pads, which is recessed towards underlay substrate
Recessed portion is formed, electrostatic conductive pads include the conductive via positioned at the firstth area of recessed portion, and the secondth area is where underlay substrate
The orthographic projection of plane is overlapped with cabling is fanned out to, and is equivalent to and is increased the face of recessed portion orthographic projection of plane where underlay substrate
Product；Since electrostatic conductive pads are recessed towards underlay substrate, during forming alignment film, into the PI liquid in recessed portion
Amount will be less than the amount of the corresponding PI liquid of identical with recessed portion area non-sunk area, is conducive to reduce PI liquid and electrostatic conduction serves as a contrast
The contact area of pad, while being conducive to reduce the contact area of PI liquid and conductive via, therefore even if by display panel and display
The frame side of device is narrow, is equally beneficial for reducing the influence caused by the electrostatic conductive performance of electrostatic conductive pads of PI liquid, in turn
Be conducive to be promoted the ability of the antistatic influence of display panel and display device.
Although some specific embodiments of the invention are described in detail by example, the skill of this field
Art personnel it should be understood that example above merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field
Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair
Bright range is defined by the following claims.
Claims (11)
1. a kind of display panel, which is characterized in that be provided with viewing area and the non-display area around the viewing area, the display
Panel includes the first substrate being oppositely arranged and the second substrate, and the first substrate includes:
Underlay substrate；
Be fanned out to cabling of the underlay substrate towards the second substrate side is set, and the cabling that is fanned out to is positioned at described non-aobvious
Show area；
Electrostatic conductive pads of the underlay substrate towards the second substrate side are set, and the electrostatic conductive pads are located at
The non-display area, along the direction perpendicular to plane where the underlay substrate, the electrostatic conductive pads are towards the lining
Substrate recess, forms recessed portion, the electrostatic conductive pads include at least one conductive via；The recessed portion includes first
Area and around secondth area in firstth area, the conductive via is only distributed in the orthographic projection of plane where the underlay substrate
Firstth area；It is handed in the orthographic projection of plane where the underlay substrate and at least partly described cabling that is fanned out in secondth area
It is folded；
Alignment film on the underlay substrate is set, positioned at the side of the electrostatic conductive pads far from the underlay substrate,
The alignment film is located at least in the viewing area.
2. display panel according to claim 1, which is characterized in that at least partly described alignment film prolongs from the viewing area
Extend to the non-display area；
In same units area, area coverage of the alignment film in firstth area is less than it in the covering in secondth area
Area.
3. display panel according to claim 2, which is characterized in that the second substrate includes electrostatic screen layer, described
Display panel further includes conductive silver glue, and the electrostatic screen layer is electrically connected by the conductive silver glue and the electrostatic conductive pads
It connects, and the conductive silver glue at least partly covers firstth area in the orthographic projection of plane where the underlay substrate.
4. display panel according to claim 1, which is characterized in that the first substrate further includes along perpendicular to the lining
The direction of substrate is successively set on the first metal layer, interlayer insulating film, second metal layer, planarization on the underlay substrate
Layer, passivation layer and electrode layer, the electrode layer include the electrostatic conductive pads, and it is exhausted that the first metal layer is located at the interlayer
Edge layer is close to the side of the underlay substrate；
The planarization layer is not overlapped in the orthographic projection of plane where the underlay substrate with the recessed portion.
5. display panel according to claim 4, which is characterized in that along perpendicular to plane where the underlay substrate
Direction, the depth of the recessed portion are less than or equal to the maximum gauge of the planarization layer.
6. display panel according to claim 4, which is characterized in that the conductive via includes the first via hole；Described
Firstth area, the second metal layer ground connection, the electrostatic conductive pads pass through first via hole and second metal layer electricity
Connection, first via hole side of plane where perpendicular to the underlay substrate extends upward through the passivation layer.
7. display panel according to claim 4, which is characterized in that the conductive via includes the second via hole；Described
Firstth area, the first metal layer ground connection, the electrostatic conductive pads pass through second via hole and the first metal layer electricity
Connection, second via hole side of plane where perpendicular to the underlay substrate extends upward through the passivation layer and the interlayer
Insulating layer.
8. display panel according to claim 4, which is characterized in that the first substrate further includes third metal layer, institute
Third metal layer is stated between the planarization layer and the passivation layer；
The conductive via includes third via hole；In firstth area, the third metal layer ground connection, the electrostatic conductive pads
It is electrically connected by the third via hole with the third metal layer, the third via hole is in the side of plane where the underlay substrate
Extend upward through the passivation layer.
9. display panel according to claim 4, which is characterized in that the cabling that is fanned out to includes the first line segment, and described the
One line segment is overlapping in the orthographic projection of plane where the underlay substrate and secondth area, and the First Line section is located at described the
One metal layer.
10. display panel according to claim 9, which is characterized in that the first substrate further includes third metal layer, institute
Third metal layer is stated between the planarization layer and the passivation layer；
The cabling that is fanned out to further includes the second line segment in addition to first line segment, and the second line segment is located at first gold medal
Belong at least one layer in layer, the second metal layer and the third metal layer, and the second line segment is in the underlay substrate
The orthographic projection of place plane is not overlapped with secondth area.
11. a kind of display device, which is characterized in that described in any item display panels including claim 1-10.
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| CN201910215623.3A CN109991788B (en) | 2019-03-21 | 2019-03-21 | Display panel and display device |
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|---|---|---|---|
| CN201910215623.3A CN109991788B (en) | 2019-03-21 | 2019-03-21 | Display panel and display device |
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| CN109991788B CN109991788B (en) | 2021-08-06 |
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| CN110910758A (en) * | 2019-12-17 | 2020-03-24 | 厦门天马微电子有限公司 | Display substrate, display module and control method thereof |
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| CN112666768A (en) * | 2020-12-29 | 2021-04-16 | 厦门天马微电子有限公司 | Display panel and display device |
| CN112908168A (en) * | 2021-01-28 | 2021-06-04 | 厦门天马微电子有限公司 | Display panel and display device |
| CN113658991A (en) * | 2021-08-19 | 2021-11-16 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| WO2022257216A1 (en) * | 2021-06-09 | 2022-12-15 | 武汉华星光电技术有限公司 | Display module |
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| CN109991788B (en) | 2021-08-06 |
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