CN109990900B - Temperature measuring device and temperature measuring method for temperature measuring target body on electromagnetic stove - Google Patents
Temperature measuring device and temperature measuring method for temperature measuring target body on electromagnetic stove Download PDFInfo
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- CN109990900B CN109990900B CN201711487693.1A CN201711487693A CN109990900B CN 109990900 B CN109990900 B CN 109990900B CN 201711487693 A CN201711487693 A CN 201711487693A CN 109990900 B CN109990900 B CN 109990900B
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000000523 sample Substances 0.000 claims abstract description 153
- 238000009529 body temperature measurement Methods 0.000 claims description 37
- 230000006698 induction Effects 0.000 claims description 32
- 238000001514 detection method Methods 0.000 claims description 25
- 238000002310 reflectometry Methods 0.000 claims description 18
- 238000002834 transmittance Methods 0.000 claims description 6
- 230000005457 Black-body radiation Effects 0.000 claims description 4
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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Abstract
The invention relates to a temperature measuring device for a temperature measuring target body on an electromagnetic oven, which comprises an infrared probe and an infrared light source, wherein the infrared probe and the infrared light source are positioned below an electromagnetic oven panel, a temperature detecting element is arranged on the electromagnetic oven panel and positioned beside an infrared detecting area on the electromagnetic oven panel, a controller is electrically connected with the infrared probe, the infrared light source and the temperature detecting element, the infrared light source is positioned beside the infrared probe and matched with the detecting area of the infrared probe on the electromagnetic oven panel, and a temperature sensor is arranged in the infrared probe. The invention also relates to a temperature measuring method of the temperature measuring target body on the electromagnetic oven, which is used for calculating the infrared parameters of the temperature measuring target body in real time, simultaneously acquiring the temperature of the panel of the electromagnetic oven and the temperature of the circuit board in real time and realizing the calculation of the temperature measuring target body on the basis of the energy acquired by the infrared probe acquired in real time. The temperature measuring device is simple in structure, the measuring method is convenient and easy to operate, and the acquired temperature data are more accurate.
Description
Technical Field
The invention relates to the technical field of temperature detection, in particular to a temperature measuring device of a temperature measuring target body on an electromagnetic oven, and also relates to a temperature measuring method of the temperature measuring target body on the electromagnetic oven.
Background
In the prior temperature measurement technology, two main types of contact temperature measurement and non-contact temperature measurement exist. The contact temperature measurement generally uses a thermistor or a thermo-sensitive device such as a thermocouple. The contact temperature measurement itself has a delay because the object to be measured is transferred to the heat sensitive device before the measurement can be performed. The temperature tolerance of the thermosensitive device is limited, the aging speed is high when the thermosensitive device is applied to the temperature measuring environment of the high-temperature device, and the thermosensitive device cannot be directly contacted with a temperature measuring target object in some application environments, so that the application range is limited.
The non-contact temperature measurement is mainly infrared temperature measurement, and an infrared probe is generally adopted for temperature measurement. The infrared probe mainly utilizes the radiation heat effect, so that the temperature rise is caused after the detection device receives radiation energy, and further, a certain performance in the infrared probe is changed along with the change of the temperature, and further, a temperature signal is obtained.
According to the optical principle, α+ρ+τ=1, where α represents the absorption, ρ represents the reflectance, τ represents the transmittance. As is known from kirchhoff's law, α=ε, where ε represents the emissivity, and τ=0 for an opaque object, then ε+ρ=1, i.e., the higher the reflectivity of the opaque object surface is inversely proportional to the emissivity. In infrared thermometry, emissivity measurement is a necessary task. And the infrared probe can use a blackbody with emissivity close to 1 to perform temperature calibration during production. The reflectivities of black bodies selected by different manufacturers are different, but the emissivity in the infrared probe is set to be a fixed value. Objects with the same temperature have different emissivity due to different materials, and temperature measurement errors are caused. Leading to a large error in the temperature results obtained by the detection.
When the cookware and the like placed on the electromagnetic oven are used for measuring the temperature, the infrared temperature measurement of the articles placed on the electromagnetic oven is correspondingly complicated due to the blocking factors of the panel of the electromagnetic oven. When an infrared probe in an electromagnetic oven is used for measuring the temperature of an article placed on the electromagnetic oven, the following problems exist: the surface emissivity of the article to be measured placed on the electromagnetic oven is unknown; the infrared transmittance of the panel is unknown; the panel also has a higher temperature and emits infrared radiation. In order to solve the difficult problems of temperature measurement, holes are formed in the panel corresponding to the positions of the infrared probes or the infrared probes are arranged externally. The trompil can reduce the intensity of electromagnetic oven panel, has the potential safety hazard to influence electromagnetic oven pleasing to the eye clean, the practicality is poor. The infrared probe is arranged externally, so that the temperature of the bottom of an article on the electromagnetic oven is difficult to measure, and only the temperature of the side surface of the article can be measured. Therefore, the temperature measurement accuracy of the infrared probe can be directly affected by the external factors such as greasy dirt and environmental corrosion sputtered on the infrared probe in the temperature measurement process, and the problems of multiple temperature measurement interference factors, poor appearance, unfavorable cleaning and the like exist, so that the practicability is also poor.
Disclosure of Invention
The invention aims to solve the technical problem of providing a temperature measuring device and a temperature measuring method for a temperature measuring target body on an electromagnetic oven, which can detect the reflectivity of the temperature measuring target body in the use process so as to realize temperature calculation of the temperature measuring target body and further improve the temperature detection accuracy.
The invention solves the problems by adopting the following technical scheme: the utility model provides a temperature measuring device of temperature measurement target body on electromagnetic oven which characterized in that: comprising
The infrared probe is internally provided with a temperature sensor capable of acquiring temperature signals and is arranged in the electromagnetic oven and positioned below a panel of the electromagnetic oven;
The infrared light source is arranged in the electromagnetic oven and positioned below the panel of the electromagnetic oven, and the infrared light source is positioned beside the infrared probe;
The temperature detection element is arranged on the electromagnetic oven panel and is positioned beside a detection area of the infrared probe on the electromagnetic oven panel and is used for detecting the temperature of the electromagnetic oven panel;
And the controller is respectively and electrically connected with the infrared probe, the infrared light source and the temperature detection element.
In order to obtain the infrared parameters of the electromagnetic oven panel and the circuit board, the infrared sensor further comprises a standby infrared probe which can be electrically connected with the controller, and the standby infrared probe is used for being placed above the electromagnetic oven panel and used at a position which is in mirror symmetry with the infrared probe.
Preferably, the infrared probe and the infrared light source are integrally arranged on a circuit board.
Preferably, the controller is also integrally provided on the circuit board.
The setting position of the infrared light source is matched with the detection area of the infrared probe on the panel of the electromagnetic stove, so that the infrared probe can detect the infrared light reflected by the infrared light source.
A temperature measurement method of a temperature measurement target body on an electromagnetic oven is characterized in that: the method comprises the following steps:
S1, acquiring the transmissivity tau 0 of a panel of the electromagnetic oven stored in a controller, the reflectivity rho 0 of the panel of the electromagnetic oven and the emissivity epsilon 0 of the panel of the electromagnetic oven, acquiring the emissivity epsilon 2 of a circuit board stored in the controller, acquiring the sum Es of receivable energy of an infrared light source stored in the controller, and acquiring the functional relation E=f (T) between the energy E of a part of infrared energy of standard blackbody radiation stored in the controller, which can be received by an infrared probe, and the standard blackbody temperature T;
s2, on the premise that a temperature measuring target body is not placed on the panel of the electromagnetic oven, the controller controls the on and off of the infrared light source;
the infrared probe detects infrared energy data E1 obtained when the infrared light source is turned on and transmits the infrared energy data E1 to the controller, and the infrared probe detects infrared energy data E2 obtained when the infrared light source is turned off and transmits the infrared energy data E2 to the controller;
s3, placing a temperature measuring target body on the panel of the electromagnetic oven, placing the temperature measuring target body in a detection area of the infrared probe, and controlling the opening and closing of the infrared light source by the controller;
the infrared probe detects infrared energy data E5 acquired when the infrared light source is turned on and transmits the infrared energy data E5 to the controller, and the infrared probe detects infrared energy data E6 acquired when the infrared light source is turned off and transmits the infrared energy data E6 to the controller;
s4, the controller calculates infrared energy emitted by the infrared light source, after being transmitted through the electromagnetic oven panel, reflected by the bottom surface of the object to be detected, transmitted through the electromagnetic oven panel and finally received by the infrared probe;
er= (E5-E6) - (E1-E2) =es τ 0*ρ1*τ0; (equation 1)
Wherein ρ 1 is the reflectivity of the temperature measurement target;
As can be obtained according to the formula 1,
Since the transmittance τ 1 =0 of the temperature measurement target body, the emissivity ε 1 of the temperature measurement target body is calculated according to formula 2;
s5, the controller receives infrared energy data e acquired by the infrared probe in real time;
e=e a+Eb+Ec+Ed; (equation 4)
Wherein E a represents infrared energy radiated by the lower surface of the induction cooker panel received by the infrared probe;
E a＝ε0*f(T0); (equation 5)
T 0 represents the temperature of the panel of the induction cooker, and T 0 is detected by a temperature detection element and transmitted to a controller;
E b represents infrared energy radiated by the upper surface of the electromagnetic oven panel, reflected by the bottom of a temperature measuring target body placed on the electromagnetic oven, transmitted by the electromagnetic oven panel and received by the infrared probe;
E b＝ε0*f(T0)*ρ1*τ0; (equation 6)
E c represents infrared energy radiated by the bottom of a temperature measurement target body placed on the electromagnetic oven, and the infrared energy is transmitted by the panel of the electromagnetic oven and received by the infrared probe;
e c＝ε1f(T1)*τ0; (equation 7)
Wherein T 1 represents the temperature of a temperature measurement target body placed on the induction cooker;
E d represents the sum of the energy part of the infrared energy radiated by the circuit board near the infrared probe, which is received by the infrared probe after being reflected by the lower surface of the electromagnetic oven panel, and the energy part of the infrared energy radiated by the circuit board, which is received by the infrared probe after being reflected by the bottom of the temperature measuring object body and transmitted by the electromagnetic oven panel after being transmitted by the electromagnetic oven panel;
E d＝ε2*f(T2)*(ρ0+τ0*ρ1*τ0; (equation 8)
Wherein T 2 represents the temperature of the circuit board, and T 2 is detected by a temperature-sensitive device in the infrared probe and transmitted to the controller;
from equations 4 through 8, it is possible to obtain:
e＝ε0*f(T0)+ε0*f(T0)*ρ1*τ0+ε1f(T1)*τ0+ε2*f(T2)*(ρ0+τ0*ρ1*τ0); ( Formula 9)
S6, the controller calculates and acquires the temperature T 1 of the temperature measuring target body placed on the electromagnetic stove according to the formula 9.
As an improvement, the method for obtaining the sum Es of the infrared light source energy which can be received by the infrared probe under the condition that the electromagnetic oven panel is not placed is as follows:
S-A, placing se:Sup>A standby infrared probe above the panel installation position of the electromagnetic oven and at se:Sup>A position which is mirror symmetry with the infrared probe;
S-B, controlling the infrared light source to keep a closed state, and detecting the acquired infrared energy data E of the infrared light source by the standby infrared probe and transmitting the infrared energy data E to the controller when the panel of the electromagnetic oven is not installed;
S-C, opening an infrared light source, detecting the acquired infrared energy data E0 of the infrared light source by using a standby infrared probe, and transmitting the infrared energy data E0 to a controller;
S-D, the controller calculates the sum Et=E0-E of the energy of the infrared light source which can be received by the standby infrared probe under the condition that the electromagnetic oven panel is not placed;
Es＝Et＝E0－E。
As an improvement, the infrared parameters of the basic target body which is the panel of the electromagnetic oven and the circuit board are obtained by the following steps:
S100, placing a basic target body so that the infrared probes and the standby infrared probes are distributed on two sides of a detection surface of the basic target body in a mirror symmetry mode;
S200, the controller controls the on and off of the infrared light source;
the infrared probe detects infrared energy data E11 acquired when the infrared light source is turned on and transmits the infrared energy data E11 to the controller, and the infrared probe detects infrared energy data E22 acquired when the infrared light source is turned off and transmits the infrared energy data E22 to the controller;
The standby infrared probe detects infrared energy data E3 acquired when the infrared light source is turned on and transmits the infrared energy data E3 to the controller, and the standby infrared probe detects infrared energy data E4 acquired when the infrared light source is turned off and transmits the infrared energy data E4 to the controller;
S300, the controller calculates the transmissivity of the basic target body as follows The reflectivity of the basic target body is calculated as the transmissivity of the basic target body by the controller as/>The reflectivity of the basic target body is/>Emissivity of the basic target body is/>
Compared with the prior art, the invention has the advantages that: in the invention, in the process of acquiring the temperature of the temperature measuring target body placed on the electromagnetic oven, the infrared parameters of the panel, the infrared parameters of the circuit board and the infrared parameters of the temperature measuring target body are required to be acquired in real time, so that the calculation and the acquisition of the temperature are realized on the basis. The temperature measuring device fully considers the influence of the infrared parameter property of the panel material, the infrared parameter property of the circuit board material and the infrared parameter property of the temperature measuring target body on the infrared temperature detection result in the temperature measuring process, and further calculates according to the infrared parameter of the actual area, so that the temperature result obtained by calculation is more accurate. The temperature measuring device of the temperature measuring target body on the electromagnetic oven is very simple in structure, and the corresponding temperature measuring method is very simple in operation in a laboratory stage and an actual application stage, so that the practicability is high.
Drawings
Fig. 1 is a schematic structural diagram of a temperature measuring device for measuring a temperature of a target body on an induction cooker according to an embodiment of the invention.
FIG. 2 is a schematic diagram of the basic target infrared parameter measurement structure in an embodiment of the present invention.
Fig. 3 is a block diagram of a temperature measuring device for measuring a temperature of a target body on an induction cooker according to an embodiment of the invention.
Detailed Description
The invention is described in further detail below with reference to the embodiments of the drawings.
As shown in fig. 1 to 3, the temperature measuring device for the temperature measuring object on the induction cooker in the present embodiment includes an infrared probe 1, an infrared light source 2, a temperature detecting element 3, a controller 4 and a circuit board 7, and for installation convenience, the infrared probe 1, the infrared light source 2 and the controller 4 are integrally disposed on the circuit board 7, and the circuit board 7 is disposed in the induction cooker and below a panel of the induction cooker. In addition, during the production of the induction cooker, in order to accurately obtain the accurate infrared parameters of each induction cooker panel 6 and the energy sum receivable by the infrared light source 2, the temperature measuring device for measuring the temperature of the object on the induction cooker further comprises a standby infrared probe 5. The controller 4 is electrically connected with the infrared probe 1, the standby infrared probe 5, the infrared light source 2 and the temperature detecting element 3, respectively.
The infrared probe 1 is located below the hob panel 6 at a distance from the hob panel 6 such that the infrared probe 1 has a detection area on the hob panel 6 where infrared light can be detected. The infrared probe 1 in the embodiment can directly adopt the infrared probe 1 body in the temperature sensor in the electromagnetic oven. The infrared probe 1 is internally provided with a temperature sensor capable of acquiring a temperature signal, and the temperature of the circuit board 7 can be detected in real time through the temperature sensor and transmitted to the controller 4.
The temperature detecting element 3 is attached to the lower surface of the electromagnetic oven panel 6 and is located beside the detection area of the infrared light source 2, and the temperature detecting element 3 can detect the temperature of the electromagnetic oven panel 6 in real time and then transmit the temperature to the controller 4.
The standby infrared probe 5 is placed above the electromagnetic oven panel 6 and is used at a position which is mirror symmetrical with the infrared probe 1 when in use.
The infrared light source 2 is located below the induction cooker panel 6 and beside the infrared probe 1, and the setting position of the infrared light source 2 is matched with the detection area of the infrared probe 1 on the induction cooker panel 6, so that the infrared probe 1 can detect the infrared light reflected by the infrared light source 2.
The controller 4 may be the master controller 4 in the induction cooker directly or may be an independent controller 4. In order to facilitate operation, a key electrically connected with the controller 4 can be arranged, and a command for starting the measurement of the infrared parameters of the temperature measuring target body 8 on the electromagnetic oven can be sent to the controller 4 through the operation key, so that the controller 4 controls the infrared probe 1 and the infrared light source 2 to work, and further the measurement of the infrared parameters of the temperature measuring target body 8 on the electromagnetic oven is realized. In the measuring process, a user places a temperature measuring target body 8 to be measured such as a pot on the electromagnetic oven according to the prompt.
The temperature measurement method of the temperature measurement target body on the electromagnetic oven comprises the following steps:
S1, acquiring the transmissivity tau 0 of the electromagnetic oven panel 6 stored in the controller 4, the reflectivity rho 0 of the electromagnetic oven panel 6 and the emissivity epsilon 0 of the electromagnetic oven panel 6, acquiring the emissivity epsilon 2 of the circuit board 7 stored in the controller 4, acquiring the sum Es of receivable energy of the infrared light source 2 stored in the controller 4, and acquiring the functional relation E=f (T) between the energy E of the part of infrared energy of standard blackbody radiation stored in the controller 4 and the standard blackbody temperature T, wherein the energy E can be received by the infrared probe 1;
The transmissivity tau 0 of the electromagnetic oven panel 6 and the total quantity Es of the receivable energy of the infrared light source 2 can be additionally increased and used for measuring by using the standby infrared probe 5 when the electromagnetic oven is produced, and further, the measuring result is stored in the controller 4, so that a user can conveniently call and use the infrared-transmitting target bodies such as cookers on the electromagnetic oven in the process of measuring the reflectivity in the use process;
In the production process of the electromagnetic oven, the method for acquiring the sum Es of the receivable energy of the infrared light source 2 is specifically as follows:
The following steps are performed before the induction cooker panel 6 is installed:
S-A, placing se:Sup>A standby infrared probe 5 above the installation position of the electromagnetic oven panel 6 and at se:Sup>A position which is mirror symmetry with the infrared probe 1;
S-B, controlling the infrared light source 2 to keep a closed state, and when the electromagnetic oven panel 6 is not installed and placed, detecting the acquired infrared energy data E of the infrared light source 2 by the standby infrared probe 5 and transmitting the infrared energy data E to the controller 4;
S-C, turning on the infrared light source 2, detecting the acquired infrared energy data E0 of the infrared light source 2 by the standby infrared probe 5, and transmitting the infrared energy data E0 to the controller 4;
S-D, the controller 4 calculates the sum et=e0-E of the energy of the infrared light source 2 that the standby infrared probe 5 can receive without placing the induction cooker panel 6;
Es＝Et＝E0－E；
the electromagnetic oven panel 6 and the circuit board 7 are taken as basic target bodies, and the method for acquiring the infrared parameters of the basic target bodies comprises the following steps:
s100, placing a basic target body, so that the infrared probe 1 and the standby infrared probe 5 are distributed on two sides of a detection surface of the basic target body in a mirror symmetry manner;
s200, the controller 4 controls the on and off of the infrared light source 2;
the infrared probe 1 detects infrared energy data E11 acquired when the infrared light source 2 is turned on and transmits the infrared energy data E11 to the controller 4, and the infrared probe 1 detects infrared energy data E22 acquired when the infrared light source 2 is turned off and transmits the infrared energy data E22 to the controller 4;
the standby infrared probe 5 detects infrared energy data E3 acquired when the infrared light source 2 is turned on and transmits the infrared energy data E3 to the controller 4, and the standby infrared probe 5 detects infrared energy data E4 acquired when the infrared light source 2 is turned off and transmits the infrared energy data E4 to the controller 4;
s300, the controller 4 calculates the transmissivity of the basic target body as follows The reflectivity of the basic target body isEmissivity of the target body is/>
In the test process, the transmissivity tau 0, the reflectivity rho 0 and the emissivity epsilon 0 of the electromagnetic oven panel 6 are specifically calculated according to the data correspondingly acquired by the electromagnetic oven panel 6; the transmissivity tau 2 of the circuit board 7 is specifically calculated according to the data correspondingly acquired by the circuit board 7;
the functional relation E=f (T) between the energy E of the part of the infrared energy radiated by the standard blackbody and the temperature T of the standard blackbody, which can be received by the infrared probe 1, is obtained in a laboratory environment through multiple data measurement fitting;
s2, on the premise that a temperature measuring target body 8 is not placed on the electromagnetic oven panel 6, the controller 4 controls the infrared light source 2 to be turned on and off;
The infrared probe 1 detects infrared energy data E1 acquired when the infrared light source 2 is turned on and transmits the infrared energy data E1 to the controller 4, and the infrared probe 1 detects infrared energy data E2 acquired when the infrared light source 2 is turned off and transmits the infrared energy data E2 to the controller 4;
S3, placing a temperature measuring target body 8 on the electromagnetic oven panel 6, placing the temperature measuring target body 8 in a detection area of the infrared probe 1, and controlling the on and off of the infrared light source 2 by the controller 4;
The infrared probe 1 detects infrared energy data E5 acquired when the infrared light source 2 is turned on and transmits the infrared energy data E5 to the controller 4, and the infrared probe 1 detects infrared energy data E6 acquired when the infrared light source 2 is turned off and transmits the infrared energy data E6 to the controller 4;
S4, the controller 4 calculates infrared energy emitted by the infrared light source 2, after being transmitted through the electromagnetic oven panel 6, reflected by the bottom surface of the object to be detected, transmitted through the electromagnetic oven panel 6 and finally received by the infrared probe 1;
er= (E5-E6) - (E1-E2) =es τ 0*ρ1*τ0; (equation 1)
Wherein ρ 1 is the reflectivity of the thermometry target 8;
As can be obtained according to the formula 1,
Since the transmittance τ 1 =0 of the temperature measurement target body 8, the emissivity ε 1 of the temperature measurement target body 8 is calculated according to equation 2;
s5, the controller 4 receives infrared energy data e acquired by the infrared probe 1 in real time;
e=e a+Eb+Ec+Ed; (equation 4)
Wherein E a represents the infrared energy radiated from the lower surface of the induction cooker panel 6 received by the infrared probe 1;
E a＝ε0*f(T0); (equation 5)
T 0 represents the temperature of the induction cooker panel 6, and T 0 is detected by the temperature detecting element 3 and transmitted to the controller 4;
E b represents infrared energy radiated by the upper surface of the electromagnetic oven panel 6, reflected by the bottom of a temperature measuring target body 8 placed on the electromagnetic oven, transmitted by the electromagnetic oven panel 6 and received by the infrared probe 1;
E b＝ε0*f(T0)*ρ1*τ0; (equation 6)
E c represents infrared energy radiated from the bottom of the temperature measurement target body 8 placed on the electromagnetic oven, and the infrared energy is transmitted by the panel 6 of the electromagnetic oven and received by the infrared probe 1;
e c＝ε1f(T1)*τ0; (equation 7)
Wherein T 1 represents the temperature of the temperature measurement target body 8 placed on the induction cooker;
E d represents the sum of the energy part of the infrared energy radiated by the circuit board 7 near the infrared probe 1, which is received by the infrared probe 1 after being reflected by the lower surface of the electromagnetic oven panel 6, and the energy part of the infrared energy radiated by the circuit board 7, which is received by the infrared probe 1 after being reflected by the bottom of the temperature measuring object 8 after passing through the electromagnetic oven panel 6, and then passing through the electromagnetic oven panel 6;
E d＝ε2*f(T2)*(ρ0+τ0*ρ1*τ0; (equation 8)
Wherein T 2 represents the temperature of the circuit board 7, and T 2 is detected by a temperature-sensitive device in the infrared probe 1 and transmitted to the controller 4;
from equations 4 through 8, it is possible to obtain:
e＝ε0*f(T0)+ε0*f(T0)*ρ1*τ0+ε1f(T1)*τ0+ε2*f(T2)*(ρ0+τ0*ρ1*τ0); ( Formula 9)
S6, the controller 4 calculates and acquires the temperature T 1 of the temperature measuring target body 8 placed on the electromagnetic stove according to the formula 9.
Therefore, when a user buys the electromagnetic oven back for use, the infrared parameters of the cookers placed on the electromagnetic oven can be measured in real time according to different cookers placed on the electromagnetic oven, and further when the working temperature of the cookers is detected, the detection result is more accurate, and the use performance of the electromagnetic oven is improved.
Claims (8)
1. The utility model provides a temperature measuring device of temperature measurement target body on electromagnetic oven which characterized in that: comprising
An infrared probe (1) is internally provided with a temperature sensor capable of acquiring temperature signals, and the infrared probe (1) is arranged in the electromagnetic oven and is positioned below a panel (6) of the electromagnetic oven;
The infrared light source (2) is arranged in the electromagnetic oven and is positioned below the panel (6) of the electromagnetic oven, and the infrared light source (2) is positioned beside the infrared probe (1);
A temperature detection element (3) which is arranged on the electromagnetic oven panel (6) and is positioned beside a detection area of the infrared probe (1) on the electromagnetic oven panel (6) and is used for detecting the temperature of the electromagnetic oven panel (6);
The controller (4) is respectively and electrically connected with the infrared probe (1), the infrared light source (2) and the temperature detection element (3);
The temperature measuring method corresponding to the temperature measuring device of the temperature measuring target body on the electromagnetic oven comprises the following steps:
s1, acquiring the transmissivity tau 0 of the electromagnetic oven panel (6), the reflectivity rho 0 of the electromagnetic oven panel (6) and the emissivity epsilon 0 of the electromagnetic oven panel (6) stored in the controller (4), acquiring the emissivity epsilon 2 of the circuit board (7) stored in the controller (4), acquiring the sum Es of receivable energy of the infrared light source (2) stored in the controller (4), and acquiring the functional relation E=f (T) between the energy E of the part of infrared energy of standard blackbody radiation stored in the controller (4) and the standard blackbody temperature T, wherein the energy E can be received by the infrared probe (1);
S2, on the premise that a temperature measuring target body (8) is not placed on the electromagnetic oven panel (6), the controller (4) controls the opening and closing of the infrared light source (2);
The infrared probe (1) detects infrared energy data E1 acquired when the infrared light source (2) is turned on and transmits the infrared energy data E1 to the controller (4), and the infrared probe (1) detects infrared energy data E2 acquired when the infrared light source (2) is turned off and transmits the infrared energy data E2 to the controller (4);
s3, placing a temperature measuring target body (8) on the electromagnetic oven panel (6), placing the temperature measuring target body (8) in a detection area of the infrared probe (1), and controlling the infrared light source (2) to be turned on and off by the controller (4);
The infrared probe (1) detects infrared energy data E5 acquired when the infrared light source (2) is turned on and transmits the infrared energy data E5 to the controller (4), and the infrared probe (1) detects infrared energy data E6 acquired when the infrared light source (2) is turned off and transmits the infrared energy data E6 to the controller (4);
S4, the controller (4) calculates infrared energy Er which is transmitted by the infrared light source (2) through the electromagnetic oven panel (6), reflected by the bottom surface of the object to be detected, transmitted through the electromagnetic oven panel (6) and finally received by the infrared probe (1);
er= (E5-E6) - (E1-E2) =es τ 0*ρ1*τ0; (equation 1)
Wherein ρ 1 is the reflectivity of the temperature measurement target body (8);
As can be obtained according to the formula 1,
Since the transmittance τ 1 =0 of the temperature measurement target body (8), the emissivity ε 1 of the temperature measurement target body (8) is calculated according to formula 2;
s5, the controller (4) receives infrared energy data e acquired by the infrared probe (1) in real time;
e=e a+Eb+Ec+Ed; (equation 4)
Wherein E a represents the infrared energy radiated by the lower surface of the induction cooker panel (6) received by the infrared probe (1);
E a＝ε0*f(T0); (equation 5)
T 0 represents the temperature of the induction cooker panel (6), and T 0 is detected by a temperature detecting element (3) and transmitted to a controller (4);
E b represents infrared energy radiated by the upper surface of the electromagnetic oven panel (6), reflected by the bottom of a temperature measuring target body (8) placed on the electromagnetic oven, transmitted by the electromagnetic oven panel (6) and received by the infrared probe (1);
E b＝ε0*f(T0)*ρ1*τ0; (equation 6)
E c represents infrared energy radiated by the bottom of a temperature measuring target body (8) placed on the electromagnetic oven, and the infrared energy is transmitted by an electromagnetic oven panel (6) and received by an infrared probe (1);
e c＝ε1f(T1)*τ0; (equation 7)
Wherein T 1 represents the temperature of a temperature measuring target body (8) placed on the induction cooker;
E d represents the sum of the energy part of infrared energy radiated by a circuit board (7) near the infrared probe (1) and received by the infrared probe (1) after being reflected by the lower surface of the electromagnetic oven panel (6), and the energy part of infrared energy radiated by the circuit board (7) and received by the infrared probe (1) after being reflected by the bottom of a temperature measuring target body (8) and transmitted by the electromagnetic oven panel (6) after being transmitted by the electromagnetic oven panel (6);
e d＝ε2*f(T2)*(ρ0+τ0*ρ1*τ0); (equation 8)
Wherein T 2 represents the temperature of the circuit board (7), and T 2 is detected by a temperature-sensitive device in the infrared probe (1) and transmitted to the controller (4);
from equations 4 through 8, it is possible to obtain:
e＝ε0*f(T0)+ε0*f(T0)*ρ1*τ0+ε1f(T1)*τ0+ε2*f(T2)*(ρ0+τ0*ρ1*τ0);( Formula 9)
S6, the controller (4) calculates and acquires the temperature T 1 of the temperature measuring target body (8) placed on the electromagnetic stove according to the formula 9.
2. The temperature measuring device for measuring temperature of a target body on an induction cooker according to claim 1, wherein: the infrared probe is characterized by further comprising a standby infrared probe (5) which can be electrically connected with the controller (4), wherein the standby infrared probe (5) is used for being placed above the electromagnetic oven panel (6) and used at a position which is in mirror symmetry with the infrared probe (1).
3. The temperature measuring device for measuring temperature of a target body on an induction cooker according to claim 1 or 2, characterized in that: the infrared probe (1) and the infrared light source (2) are integrally arranged on a circuit board (7).
4. A temperature measuring device for measuring a temperature of a target body on an induction cooker according to claim 3, characterized in that: the controller (4) is also integrated on the circuit board (7).
5. The temperature measuring device for measuring temperature of a target body on an induction cooker according to any one of claims 1 to 4, characterized in that: the arrangement position of the infrared light source (2) is matched with the detection area of the infrared probe (1) on the electromagnetic oven panel (6), so that the infrared probe (1) can detect the infrared light reflected by the infrared light source (2).
6. A temperature measurement method of a temperature measurement target body on an electromagnetic oven is characterized in that: a temperature measuring device for measuring temperature of a target body on an induction cooker according to any one of claims 1 to 5, comprising the steps of:
s1, acquiring the transmissivity tau 0 of the electromagnetic oven panel (6), the reflectivity rho 0 of the electromagnetic oven panel (6) and the emissivity epsilon 0 of the electromagnetic oven panel (6) stored in the controller (4), acquiring the emissivity epsilon 2 of the circuit board (7) stored in the controller (4), acquiring the sum Es of receivable energy of the infrared light source (2) stored in the controller (4), and acquiring the functional relation E=f (T) between the energy E of the part of infrared energy of standard blackbody radiation stored in the controller (4) and the standard blackbody temperature T, wherein the energy E can be received by the infrared probe (1);
S2, on the premise that a temperature measuring target body (8) is not placed on the electromagnetic oven panel (6), the controller (4) controls the opening and closing of the infrared light source (2);
The infrared probe (1) detects infrared energy data E1 acquired when the infrared light source (2) is turned on and transmits the infrared energy data E1 to the controller (4), and the infrared probe (1) detects infrared energy data E2 acquired when the infrared light source (2) is turned off and transmits the infrared energy data E2 to the controller (4);
s3, placing a temperature measuring target body (8) on the electromagnetic oven panel (6), placing the temperature measuring target body (8) in a detection area of the infrared probe (1), and controlling the infrared light source (2) to be turned on and off by the controller (4);
The infrared probe (1) detects infrared energy data E5 acquired when the infrared light source (2) is turned on and transmits the infrared energy data E5 to the controller (4), and the infrared probe (1) detects infrared energy data E6 acquired when the infrared light source (2) is turned off and transmits the infrared energy data E6 to the controller (4);
S4, the controller (4) calculates infrared energy Er which is transmitted by the infrared light source (2) through the electromagnetic oven panel (6), reflected by the bottom surface of the object to be detected, transmitted through the electromagnetic oven panel (6) and finally received by the infrared probe (1);
er= (E5-E6) - (E1-E2) =es τ 0*ρ1*τ0; (equation 1)
Wherein ρ 1 is the reflectivity of the temperature measurement target body (8);
As can be obtained according to the formula 1,
Since the transmittance τ 1 =0 of the temperature measurement target body (8), the emissivity ε 1 of the temperature measurement target body (8) is calculated according to formula 2;
s5, the controller (4) receives infrared energy data e acquired by the infrared probe (1) in real time;
e=e a+Eb+Ec+Ed; (equation 4)
Wherein E a represents the infrared energy radiated by the lower surface of the induction cooker panel (6) received by the infrared probe (1);
E a＝ε0*f(T0); (equation 5)
T 0 represents the temperature of the induction cooker panel (6), and T 0 is detected by a temperature detecting element (3) and transmitted to a controller (4);
E b represents infrared energy radiated by the upper surface of the electromagnetic oven panel (6), reflected by the bottom of a temperature measuring target body (8) placed on the electromagnetic oven, transmitted by the electromagnetic oven panel (6) and received by the infrared probe (1);
E b＝ε0*f(T0)*ρ1*τ0; (equation 6)
E c represents infrared energy radiated by the bottom of a temperature measuring target body (8) placed on the electromagnetic oven, and the infrared energy is transmitted by an electromagnetic oven panel (6) and received by an infrared probe (1);
e c＝ε1f(T1)*τ0; (equation 7)
Wherein T 1 represents the temperature of a temperature measuring target body (8) placed on the induction cooker;
E d represents the sum of the energy part of infrared energy radiated by a circuit board (7) near the infrared probe (1) and received by the infrared probe (1) after being reflected by the lower surface of the electromagnetic oven panel (6), and the energy part of infrared energy radiated by the circuit board (7) and received by the infrared probe (1) after being reflected by the bottom of a temperature measuring target body (8) and transmitted by the electromagnetic oven panel (6) after being transmitted by the electromagnetic oven panel (6);
e d＝ε2*f(T2)*(ρ0+τ0*ρ1*τ0); (equation 8)
Wherein T 2 represents the temperature of the circuit board (7), and T 2 is detected by a temperature-sensitive device in the infrared probe (1) and transmitted to the controller (4);
from equations 4 through 8, it is possible to obtain:
e＝ε0*f(T0)+ε0*f(T0)*ρ1*τ0+ε1f(T1)*τ0+ε2*f(T2)*(ρ0+τ0*ρ1*τ0);( Formula 9)
S6, the controller (4) calculates and acquires the temperature T 1 of the temperature measuring target body (8) placed on the electromagnetic stove according to the formula 9.
7. The method for measuring temperature of a temperature measuring object on an induction cooker according to claim 6, wherein: the method for acquiring the sum Es of the energy of the infrared light source (2) which can be received by the infrared probe (1) under the condition that the electromagnetic oven panel (6) is not placed is as follows:
S-A, placing se:Sup>A standby infrared probe (5) above the installation position of the electromagnetic oven panel (6) and at se:Sup>A position which is in mirror symmetry with the infrared probe (1);
S-B, controlling the infrared light source (2) to keep a closed state, and when the electromagnetic oven panel (6) is not installed, detecting the acquired infrared energy data E of the infrared light source (2) by the standby infrared probe (5) and transmitting the infrared energy data E to the controller (4);
S-C, opening the infrared light source (2), detecting the acquired infrared energy data E0 of the infrared light source (2) by the standby infrared probe (5), and transmitting the infrared energy data E0 to the controller (4);
S-D, the controller (4) calculates the sum Et=E0-E of the energy of the infrared light source (2) which can be received by the standby infrared probe (5) under the condition that the electromagnetic oven panel (6) is not placed;
Es＝Et＝E0－E。
8. the method for measuring the temperature of a temperature measuring target body on an induction cooker according to claim 7, wherein: the method for acquiring the infrared parameters of the basic target body by taking the electromagnetic oven panel (6) and the circuit board (7) as the basic target body comprises the following steps:
S100, placing a basic target body, so that the infrared probe (1) and the standby infrared probe (5) are distributed on two sides of a detection surface of the basic target body in a mirror symmetry mode;
S200, a controller (4) controls the on and off of the infrared light source (2);
The infrared probe (1) detects infrared energy data E11 acquired when the infrared light source (2) is turned on and transmits the infrared energy data E11 to the controller (4), and the infrared probe (1) detects infrared energy data E22 acquired when the infrared light source (2) is turned off and transmits the infrared energy data E22 to the controller (4);
The standby infrared probe (5) detects infrared energy data E3 acquired when the infrared light source (2) is turned on and transmits the infrared energy data E3 to the controller (4), and the standby infrared probe (5) detects infrared energy data E4 acquired when the infrared light source (2) is turned off and transmits the infrared energy data E4 to the controller (4);
s300, the controller (4) calculates the transmissivity of the basic target body as follows The reflectivity of the basic target body is calculated as/>, by the controller (4)The reflectivity of the basic target body is/>Emissivity of the basic target body is/>
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| JP2006221950A (en) * | 2005-02-10 | 2006-08-24 | Matsushita Electric Ind Co Ltd | Cooker |
| JP2009295456A (en) * | 2008-06-06 | 2009-12-17 | Hitachi Appliances Inc | Induction cooker |
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