CN109979895A - Devices, systems, and methods for the cooling device comprising multiple components - Google Patents
Devices, systems, and methods for the cooling device comprising multiple components Download PDFInfo
- Publication number
- CN109979895A CN109979895A CN201811525720.4A CN201811525720A CN109979895A CN 109979895 A CN109979895 A CN 109979895A CN 201811525720 A CN201811525720 A CN 201811525720A CN 109979895 A CN109979895 A CN 109979895A
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- China
- Prior art keywords
- radiator
- pedestal
- component
- temperature
- threshold temperature
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/10—Fastening; Joining by force joining
Abstract
Disclose the devices, systems, and methods for the cooling device comprising multiple components.Disclosed device may include (1) pedestal, the pedestal (A) supports multiple radiators and (B) is coupled to device, the device includes (i) first assembly, first assembly is designed to operate in the temperature lower than first threshold temperature, (ii) second component, second component is designed to operate in the temperature lower than second threshold temperature, first threshold temperature is different from second threshold temperature, (2) first radiators, first radiator (A) is fixed to pedestal and (B) passes heat from first assembly so that first assembly is operated in the temperature lower than first threshold temperature, and (3) second radiator, second radiator (A) is fixed to pedestal, (B) at least a certain amount of space is physically separated with the first radiator, and (C) passes heat so that second from the second component Component is operated in the temperature lower than second threshold temperature.
Description
Technical field
This disclosure relates to which device is cooling, and in particular, to for the device of the cooling device comprising multiple components, system and
Method.
Background technique
Radiator is usually the key component of electronics and mechanical devices.For example, the power as consumed by device there may be
Heat increases so as to cause the operation temperature of device.If operation temperature is increased to certain level or more, the component of device can
It can overheat, break down or even damage.Therefore, many devices can be dissipated equipped be designed to conduct heat and/or radiate
Hot device.In general, radiator may include and/or represent Heat Conduction Material, which passes heat from operated device,
To cooling device and/or enable the device to realize optimum performance.
The operation temperature of device usually can be related to the quantity of power that it is consumed.Since technological progress increases certain devices
The quantity of power that (such as microprocessor and integrated circuit) can consume, therefore these devices may be needed and/or be required more efficient
And/or effective radiator.In the device comprising multiple components, this problem may aggravate or complicate.For example, comprising
The multi-chip module of two different integrated circuits may generate bigger heat than the more simple Devices comprising single integrated circuit.
In addition, the different components of multi-chip module may have different cooling requirements.For example, including dedicated integrated electricity
In the device of road (ASIC) and high bandwidth memory (HBM) chip, HBM chip be can be designed as in temperature more lower than ASIC
Operation.Traditional radiator system may attempt temperature needed for the operation temperature of two components is reduced to HBM chip.No
Good fortune, completed using traditional heat sink technology this task may be difficult, it is expensive even not possible with.Example
Such as, can be cooled to apparatus assembly allows the radiator of the temperature of operation temperature that may need excessive space far below it
And/or excessively high cost.
Therefore, the present disclosure recognize that and solving to the additional and improved dress for the cooling device comprising multiple components
It sets, the demand of system and method.
Summary of the invention
As will be described in more detail, the disclosure broadly relates to the dress for the cooling device comprising multiple components
It sets, system and method.In one example, the device for completing such task may include (1) pedestal, the pedestal (A)
Multiple radiators can be supported, and (B) is coupled to device, which includes (i) first assembly, which is designed
It is operated in the temperature lower than first threshold temperature, and (ii) second component, which is designed to lower than the second threshold
It is worth the temperature operation of temperature, first threshold temperature is different from second threshold temperature, (2) first radiators, first radiator (A)
It is fixed to pedestal, and (B) passes heat from first assembly so that first assembly is lower than first threshold temperature
Temperature operation, and (3) second radiators, second radiator (A) are fixed to pedestal, and (B) and the first radiator are physically
At least a certain amount of space is separated, and (C) passes heat from the second component so that the second component is lower than the second threshold
It is worth the temperature operation of temperature.
It similarly, may include (1) multi-chip module in conjunction with the system of above-mentioned apparatus, which includes (A) the
One module, which is designed to operate in the temperature lower than first threshold temperature, and (B) second module, second mould
Block is designed to operate in the temperature lower than second threshold temperature, and first threshold temperature is different from second threshold temperature, (2) base
Seat, the pedestal can support multiple radiators and be coupled to multi-chip module, (3) first radiators, first radiator (A)
It is fixed to pedestal, and (B) passes heat from the first module so that the first module is lower than first threshold temperature
Temperature operation, and (4) second radiators, second radiator (A) are fixed to pedestal, and (B) and the first radiator are physically
At least a certain amount of space (separate) is separated, and (C) passes heat from the second module so that the second module exists
Temperature lower than second threshold temperature operates.
Corresponding method may include that the first radiator is fixed to the pedestal that can support multiple radiators by (1), this
One radiator is designed to pass heat from the first assembly of device, which is designed to lower than the first threshold
It is worth the temperature operation of temperature, the second radiator is fixed to pedestal, second radiator (A) and the first radiator physics by (2)
Ground separates at least a certain amount of space, and (B) is designed to pass heat from the second component of device, the second component
It is designed to operate in the temperature lower than second threshold temperature, second threshold temperature is different from first threshold temperature, and (3) will
Pedestal couples are to device, so that (A) first assembly is operated in the temperature lower than first threshold temperature, and (B) second component is low
It is operated in the temperature of second threshold temperature.
It, can the feature in combination with one another from any of above embodiment according to generic principles described herein.Pass through
It is described in detail below in conjunction with drawings and claims reading, these and other embodiments, feature and advantage will be more fully understood.
Detailed description of the invention
Drawing illustration has gone out multiple exemplary embodiments and has been part of specification.These attached drawings and it is described below one
It rises and demonstrates and explain the various principles of the disclosure.
Fig. 1 is the diagram of example multiple chip module.
Fig. 2 is the diagram for the exemplary means of the cooling device comprising multiple components.
Fig. 3 is the diagram for the exemplary system of the cooling device comprising multiple components.
Fig. 4 is the diagram for the other exemplary system of the cooling device comprising multiple components.
Fig. 5 is the flow chart for the illustrative methods of the cooling device comprising multiple components.
Throughout the drawings, identical appended drawing reference is similar with description instruction but the element that is not necessarily identical.Although
Exemplary embodiment described herein is easy to carry out various modifications and alternative forms, but shows by way of example in the accompanying drawings
Specific embodiment is gone out, and will be described in detail herein.However, exemplary embodiment described herein not purport
It is being limited to the particular forms disclosed.But the disclosure cover all modifications fallen within the scope of the appended claims, etc.
Jljl and substitute.
Specific embodiment
The present disclosure describes the various devices, systems, and methods for the cooling device comprising multiple components.Such as below will
It is explained in more detail, embodiment of the disclosure can enable each component of device (such as multi-chip module) grasp in its threshold value
Make temperature or is operated lower than its threshold operation temperature.For example, disclosed heat sink arrangement can be independently and/or individually cold
But the separation assembly of device, so that component is operated in different temperatures.In order to complete the task, the disclosed embodiments can will be more
A radiator is integrated in single cooling mechanism.The mechanism can indicate " bilayer " radiator system, and it includes two or more
The radiator of a distinguishing (distinct), each radiator are coupled to the separation assembly of device and are designed to cooling device
Separation assembly.
In some embodiments, the radiator in disclosed heat sink arrangement can be separated from each other certain distance (that is,
Gap), to prevent or minimize the hot crosstalk between radiator, so that the different components of device can be grasped in different temperature
Make.Furthermore, it is possible to the independently installed radiator via isolated spring system.These spring systems can be designed to ensure that device
Each component of part and it is exclusively used in cooling down the physical contact appropriate between the radiator of the component.With traditional radiator system
(for example, being related to the system of single radiator) is compared, and embodiment of the disclosure can make the device with multiple heat generating components
It can securely and effectively be operated in ideal temperature.
With reference to Fig. 1, the detailed description of multi-chip module provided below.Discussion corresponding to Fig. 2 will be provided for cooling down
The detailed description of the device of device comprising multiple components.In addition, the discussion corresponding to Fig. 3 and Fig. 4 will be provided for cooling packet
The detailed description of the system of device containing multiple components.Finally, the discussion corresponding to Fig. 5 will be provided for cooling including multiple groups
The detailed description of the illustrative methods of the device of part.
Fig. 1 shows exemplary means 100.Device 100 usually indicates any type comprising one or more components
Or the machinery and/or electric device of form.These components can be with independent operation or the operation that is bonded to each other.In one embodiment,
Device 100 can indicate multi-chip module.Terms used herein " multi-chip module " typically refer to contain at least two area
Other chip, integrated circuit, any type of semiconductor bare chip and/or other types component or form electronic device or portion
Part.
In the example of fig. 1, device 100 can indicate include component 102 and component 104 multi-chip module.These groups
Part can be fixed on platform 106.In one example, component 102 can indicate a type of semiconductor bare chip (example
Such as, ASIC), and component 104 can indicate different types of semiconductor bare chip (for example, HBM chip).In general, device 100 can
To include any quantity and/or any kind of heat generating component.
In some instances, the component of device 100 can be designed as in certain operation temperatures or lower than certain operation temperature
Degree operation.For example, as the operation temperature of component is increased beyond certain threshold temperature, the one or more components in device 100
Performance and/or reliability may be damaged.Because component 102 and component 104 may include different materials and/or execute difference
Function, so the threshold operation temperature of component 102 can be different from the threshold operation temperature of component 104.As an example, component
102 can have 115 DEG C of threshold operation temperature, and component 104 has 95 DEG C of threshold operation temperature.In this example, it is
Ensure the correct operation of device 100, the temperature of each of component 102 and component 104 preferably must be held in their own
Threshold temperature is lower than their own threshold temperature.
Fig. 2, which is shown, enables each component of device 100 in its respective threshold temperature or lower than its respective threshold
The exemplary means 200 of temperature operation.Device 200 usually indicates to combine any structure or the portion of one or more radiators
Part, the radiator are designed to pass heat from component 102 and component 104.As used herein, term " radiator " is logical
Refer to system, device, structure and/or the mechanism of conduction, transmitting, any type for absorbing and/or sucking heat or form.It dissipates
Hot device may include and/or comprising a variety of materials.The example of this radiator material include but is not limited to copper, aluminium, diamond, with
On one or more alloys, above one or more identical combinations or variant, and/or any other suitable material
Material.
In some instances, radiator may include and/or include a series of spines extended from pedestal or ripple.This is matched
The surface area that can increase the conductive material in radiator is set, to increase the heat to be dissipated by radiator.Radiator can be with
Including any additional or alternative structure for being designed to promote heat dissipation, such as core and/or soaking plate.
As shown in Figure 2, device 200 may include radiator 202 and radiator 204.In one embodiment, device
Each radiator in 200 can be exclusively used in the specific components of cooling device 100.For example, when the device 200 in Fig. 2 is applied
When device 100 in Fig. 1, radiator 202 can be passed heat from component 102, and radiator 204 by heat from group
Part 104 passes.Alternatively, radiator 202 and/or radiator 204 can pass heat from both components 102 and 104
It passs away.
In some instances, radiator 202 can be essentially identical or similar with radiator 204.For example, 202 He of radiator
Radiator 204 may include identical material and/or each includes identical component (such as evaporation cavity (vapor
chamber)).In other examples, radiator 202 and radiator 204 can be different in terms of one or more characteristics.For example,
The size of radiator 202 and/or configuration can be designed as ensuring that component 102 keeps specific operation temperature, and radiator
204 size and/or configuration can independently be designed to ensure that component 104 keeps different operation temperatures.
In the figure 2 example, radiator 202 and radiator 204 are all installed on pedestal 208 and/or are fixed to base
Seat 208.In one embodiment, pedestal 208 can indicate a part of radiator 202.For example, radiator 202 may include
The spine of pedestal 208 and the promotion heat dissipation extended from pedestal 208.In this example, radiator 204 may be coupled to pedestal 208
(that is, in the region of spine for not including radiator 202).In one embodiment, radiator 204 can be fixed and/or
It is inserted into the opening in pedestal 208.In this way, at least part of radiator 204 can expose below pedestal 208
It and/or is come-at-able.In some instances, the opening of pedestal 208 can be determined based on the dimension of component 104 dimension and/
Or size.For example, the opening can correspond to the size of component 104, so that when device 200 is coupled to device 100, radiator
204 are physically contacted with component 104 (rather than component 102).
In some embodiments, radiator 204 may be coupled directly to pedestal 208.Alternatively, radiator 204 can be with
It is indirectly couple to pedestal 208 (for example, via one or more extra plays or component).For example, device 200 may include insulation
Layer (for example, vacuum or filler rod).The insulating layer can be a part of radiator 204 and/or be coupled to radiator 204.Insulation
Layer can be prevented or be minimized between device 200 and certain components of device 100 (between such as radiator 204 and element 102)
It is undesirable heat transmitting.
In the figure 2 example, radiator 204 is surrounded and/or is surrounded by radiator 202.In general, radiator 202 and heat dissipation
Device 204 can be arranged in a manner of any suitable or substitution (for example, based on the component 102 on device 100 relative to each other
With 104 arrangement).For example, radiator 202 can be adjacent with radiator 204.Alternatively, radiator 202 can be in radiator
Above or below 204.In another example, the only only a part (opposite with entire radiator 202) of radiator 202 can be with
It is surrounded by radiator 204.In addition, device 200 may include one or more attached heat sinks (not shown) in Fig. 2.
In some embodiments, radiator 202 and radiator 204 can separate a certain amount of space.For example, can will dissipate
Hot device 202 and radiator 204 are located so that any side of radiator 204 not in the certain distance away from radiator 202.
In the figure 2 example, every side of radiator 204 can be with 202 physical separation of radiator at least gap 206.Gap 206 can be with
With any suitable size (for example, 0.025 inch or 0.5 centimetre).Indicate the space in gap 206 can be it is empty (for example,
Air) or filled with any suitable insulating materials.In some instances, gap 206 can prevent from being stored in radiator 202
And/or it is transmitted at least part of the heat of radiator 202 and is transmitted to radiator 204 (vice versa).For example, can choose
The size in gap 206 is to stop or minimize the hot crosstalk between radiator 202 and radiator 204.In this way, radiator
202 and radiator 204 component 102 and component 104 can be enabled to operate in different operation temperatures.
Device 200 can be coupled to device 100 in various ways.Fig. 3 shows system 300, shows device 100
With the exemplary configuration of the radiator of device 200.In this example, radiator 202 is described in a transparent way to illustrate heat dissipation
The component of the system 300 of 202 lower section of device.
As shown in Figure 3, each of radiator 202 and radiator 204 can be via one or more spring mechanisms
It is coupled to device 100 and/or device 200.Specifically, radiator 202 can be coupled to platform via spring mechanism 302 (A-D)
106, and radiator 204 can be coupled to pedestal 208 via spring mechanism 304 (A) and 304 (B).These spring mechanisms can be with
Including various assemblies or device, such as spring (for example, spring of helical spring, extension spring or any other type), screw
Or bolt, O-ring, washer and/or any other type support or fastener (fastener).
In the example of fig. 3, the hole that each spring mechanism 302 (A-D) can be inserted into radiator 202 or opening with
And in corresponding aperture in platform 106 or opening.When spring mechanism 302 (A-D) is fixed in this some holes, spring mechanism 302
(A-D) it may insure that radiator 202 is physically contacted with component 102.For example, spring mechanism 302 (A-D) can be with enough
Power press radiator 202 against or component 102 all or part of, it is enough between component 102 and radiator 202 to realize
And/or maximum heat transfer.In one embodiment, the spring in spring mechanism 302 (A-D) can at least partly be selected
Rigidity (for example, spring constant value) is so that spring mechanism 302 (A-D) is capable of providing the power.
Similarly, at least part of radiator 204 can be seated against the complete of component 104 by spring mechanism 304 (A-B)
Portion or a part.In the example of fig. 3, spring mechanism 304 (A-B) may be coupled to the platform of support radiator 204.Coiling machine
The platform can be fixed to the pedestal 208 of device 200 by structure 304 (A-B).In this way, spring mechanism 304 (A-B) can be with
Promote the physical contact between at least part and component 104 of radiator 204.For example, it is as explained above, it can be via base
The bottom surface of opening exposure radiator 204 in seat 208.Radiator 204 is fixed in the opening (for example, via coiling machine
Structure 304 (A-B)) may be implemented between component 104 and radiator 204 heat transmitting.
In some embodiments, the spring constant of the spring in spring mechanism 304 (A-B) can at least partly be selected
Value, to realize enough physical contacts and/or heat transmitting between component 104 and radiator 204.In some instances, coiling machine
The spring constant value of spring in structure 304 (A-B) can be different from the spring constant value of the spring in spring mechanism 302 (A-D).
For example, component 102 and component 104 can have different height (for example, component 102 can extend than component 104 further from
Platform 106).The deviation of this coplanarity may be the manufacturing tolerance of component 102 and component 104 and/or the result of dimension.In order to
Ensure that both component 102 and component 104 are all firmly pressed respectively to be resisted against on radiator 202 and radiator 204, it can be only
The spring constant of habitat location spring mechanism 302 (A-D) and the spring constant of spring mechanism 304 (A-B).
In some instances, radiator 204 can be coupled to via tolerance ring or the similar fixed mechanism based on friction
Pedestal 208.Radiator 204 can be maintained in the opening of pedestal 208 by the tolerance ring, thus prevent radiator 204 relative to
The movement of radiator 202.In this way, tolerance ring can keep the gap 206 between radiator 202 and radiator 204.?
In one embodiment, tolerance ring can indicate and/or including radial spring, which is cooperated to pedestal 208 securely
In opening.
As shown in Figure 3, system 300 may include one or more guidance pins (guide pin), such as guidance pin 306
(A) and 306 (B).Guiding pin 306 (A-B) usually indicates any retention mechanism that device 200 is fixed to device 100.In this way,
Guidance pin 306 (A-B) can prevent the movement of radiator 202 and radiator 204 relative to component 102 and component 104.In general,
The component and device 100 of device 200 can be via spring mechanism, guidance pin, tolerance ring and/or other kinds of retention mechanisms
Any combination of (fastening mechanism) and be coupled and/or be fixed.
In some instances, system 300 may include one or more add ons, be designed to promote device 100
Heat transmitting between device 200.For example, component 102 and/or component 104 may be coupled to or equipped with hot interfaces
(thermal interface) material (for example, heat-conducting layer or covering).These thermal interfacial materials can promote 102 He of component
Physical contact and/or heat transfer between component 104 and radiator 202 and radiator 204.
In some embodiments, the thermal interfacial material for being coupled to component 102 can be with the hot interface material that is coupled to component 104
Material is different.For example, the thermal interfacial material for being coupled to each component can be selected based on the hot attribute of various components, and therefore
Thermal interfacial material may be not necessarily identical for each component.In some instances, covering group can also be based at least partially on
The thermal interfacial material of part selects to be coupled to the spring constant of the spring mechanism of each component.For example, can at least partly ground
The spring constant of the spring in spring mechanism 302 (A-D) is selected in the thickness for the thermal interfacial material for being coupled to component 102.
Fig. 4 shows expansion and/or the decomposition view of system 300.Particularly, Fig. 4 shows the component of system 300 such as
What is arranged and/or fixes relative to each other.Other than component illustrated in Fig. 3, Fig. 4 also shows backing plate
(backer plate)402.Backing plate 402 usually indicates any platform, piece that system 300 is coupled to load or other structures
And/or fastener.
Fig. 5 is the flow chart for the illustrative methods 500 of the cooling device comprising multiple components.Method 500 can wrap
The step of the first radiator is fixed to the pedestal that can support multiple radiators is included, which is designed to heat
It is passed from the first assembly of device, which is designed in the temperature operation (510) lower than first threshold temperature.
In one example, first assembly can indicate the chip (for example, asic chip) in multi-chip module.
Step 510 can be executed in various ways.For example, multi-chip module manufacturer can process and/or assemble including
The component of radiator 202 including pedestal 208 and/or spring mechanism 302 (A-D).In one embodiment, multi-chip module system
Radiator 202 can be designed and then manufacture by making quotient, can physically contact with the component 102 of device 100 and from device 100
Component 102 transmits heat.
Method 500 can also include the steps that by the second radiator, fixed to pedestal, which dissipates with first
Hot device is physically separated at least a certain amount of space, and (2) are designed to pass heat from the second component of device,
Second component is designed to operate in the temperature lower than second threshold temperature, which is different from first threshold temperature
It spends (520).In one example, the second component can indicate the different chips (for example, HBM chip) in multi-chip module.
Step 520 can be executed in various ways.For example, radiator 204 can be fixed on by multi-chip module manufacturer
In radiator 202 and/or 202 side of radiator.Particularly, radiator 204 can be fixed on the opening of pedestal 208 by manufacturer
It is interior.In addition, manufacturer may insure radiator 204.Whole sides of radiator 204 or surface and radiator 202 are at least
It is spaced apart.In this way, manufacturer may insure that radiator 204 can pass heat from the component 104 of device 100
It passs away, while also preventing heat from transmitting between radiator 202 and radiator 204.In some embodiments, manufacturer can be with
Radiator 204 is coupled to pedestal 208 via spring mechanism 304 (A-B), spring mechanism 304 (A-B) is independently of spring mechanism
302(A-D)。
Fig. 5 is returned to, method 500 can also be included the steps that pedestal couples to device, so that (1) first assembly is being lower than
The temperature of first threshold temperature operates, and (2) second components operate (530) in the temperature lower than second threshold temperature.
Step 530 can be executed in various ways.For example, multi-chip module manufacturer can be by radiator 202 and heat dissipation
Device 204 (for example, via spring mechanism 302 (A-D)) is fixed to device 100.Particularly, manufacturer can position device 200
On device 100 so that all or part of of component 102 physically contacts with radiator 202, and the whole of component 104 or
A part physically contacts with radiator 204.In this way, radiator 202 and radiator 204 can be individually and/or independent
Ground cooling component 102 and component 104 enable each component to operate in the ideal operating temperatures of their own.
Although aforementioned disclosure elaborates various embodiments using specific block diagram, flow chart and example, using various hard
Part, software or firmware (or any combination thereof) configuration individually and/or can realize collectively and be described herein and/or illustrate
Each block components, flow chart step, operation and/or component.In addition, identical to realize because many other frameworks may be implemented
Functionality, include any disclosure in other assemblies by component substantially should be considered illustrative.
The procedure parameter and sequence for the step of being described herein and/or illustrating are merely given as examples, and can basis
It needs and changes.Although for example, can show or discuss the step of illustrating and/or describe herein with particular order, this
A little steps are not necessarily required to execute with sequence that is illustrated or discussing.The various illustrative methods for being described herein and/or illustrating
The one or more steps for being described herein or illustrating can also be omitted, or can also include other than those of disclosed
Additional step.
The description for providing front is in order to enable others skilled in the art can be best using disclosed herein
The various aspects of exemplary embodiment.The exemplary description is not intended to exhaustion or is limited to disclosed any accurate shape
Formula.Without departing from the spirit and scope of the disclosure, many modifications and variations can be carried out.Embodiment disclosed herein
It should be considered to be illustrative and be not restrictive in all respects.It, should be with reference to appended when determining the scope of the present disclosure
Claim and its equivalent.
Unless otherwise stated, the term " being connected to " used in the specification and in the claims and " being coupled to "
(and its derivative) should be interpreted to allow directly or indirectly (that is, via other elements or component) to connect.In addition, in specification
It is interpreted as "at least one" with term "a" or "an" used in claim.Finally, for the ease of using, such as explanation
Term " includes " used in book and claims and " having " (and its derivative) can exchange and have with one word of "comprising"
There is identical meaning.
Claims (15)
1. a kind of device, comprising:
The pedestal of multiple radiators can be supported, the pedestal:
It is coupled to device, the device includes:
First assembly, the first assembly are designed to operate in the temperature lower than first threshold temperature；With
Second component, second component are designed to operate in the temperature lower than second threshold temperature, the first threshold temperature
Degree is different from the second threshold temperature；
First radiator, first radiator:
It is fixed to the pedestal；With
Heat is passed from the first assembly, so that the first assembly is in the temperature for being lower than the first threshold temperature
Operation；With
Second radiator, second radiator:
It is fixed to the pedestal；
At least a certain amount of space is physically separated with first radiator；With
Heat is passed from second component, so that second component is in the temperature for being lower than the second threshold temperature
Operation.
2. the apparatus according to claim 1, in which:
The first assembly transfers heat to first radiator via conduction by the pedestal；With
Second component transfers heat to second radiator via the opening in the pedestal, and the opening is so that institute
The second component is stated to physically contact with second radiator.
3. the apparatus according to claim 1, wherein separating described the one of first radiator and second radiator
Quantitative space prevents at least part for the heat for being passed to first radiator to be passed to second radiator.
4. the apparatus according to claim 1, in which:
First radiator is fixed to the pedestal via at least one spring；With
Second radiator is fixed to the pedestal via at least one additional springs.
5. device according to claim 4, in which:
The spring constant value of the spring is selected, is enough to be realized when the device is coupled to the pedestal described the
The physical contact of hot transmitting is carried out between one component and first radiator；With
The spring constant value of the additional springs is selected, is enough to be realized when the device is coupled to the pedestal in institute
State the physical contact that hot transmitting is carried out between the second component and second radiator.
6. the apparatus according to claim 1 further includes tolerance ring, the tolerance ring:
Second radiator is fixed to the pedestal；With
Physical separation is kept between first radiator and second radiator.
7. device according to claim 6, wherein the tolerance ring includes radial spring, the radial spring:
It is coupled to second radiator；With
It is inserted into the opening in the pedestal.
8. the apparatus according to claim 1, further includes:
Thermal interfacial material, the thermal interfacial material are coupled to the first assembly and promote the first assembly and described
Heat transmitting between one radiator；With
Additional thermal interfacial material, the additional thermal interfacial material are coupled to second component and are different from being coupled to institute
State the thermal interfacial material of first assembly.
9. the apparatus according to claim 1, in which:
At least two sides of second radiator are adjacent with first radiator；With
The every side adjacent with first radiator of second radiator and first radiator be physically separated to
Few a certain amount of space.
10. the apparatus according to claim 1, in which:
The first assembly includes microprocessor；With
Second component includes data storage device.
11. a kind of system, comprising:
Multi-chip module, comprising:
First module, first module are designed to operate in the temperature lower than first threshold temperature；With
Second module, second module are designed to operate in the temperature lower than second threshold temperature, the first threshold temperature
Degree is different from the second threshold temperature；
Pedestal, the pedestal can support multiple radiators and be coupled to the multi-chip module；
First radiator, first radiator:
It is fixed to the pedestal；With
Heat is passed from first module, so that first module is in the temperature for being lower than the first threshold temperature
Operation；With
Second radiator, second radiator:
It is fixed to the pedestal；
At least a certain amount of space is physically separated with first radiator；With
Heat is passed from second module, so that second module is in the temperature for being lower than the second threshold temperature
Operation.
12. system according to claim 11, in which:
First module transfers heat to first radiator via conduction by the pedestal；With
Second module transfers heat to second radiator via the opening in the pedestal, and the opening is so that institute
The second module is stated to physically contact with second radiator.
13. system according to claim 11, wherein separating the described of first radiator and second radiator
A certain amount of space prevents at least part for the heat for being passed to first radiator to be passed to second heat dissipation
Device.
14. system according to claim 11, in which:
First radiator is fixed to the pedestal via at least one spring；With
Second radiator is fixed to the pedestal via at least one additional springs.
15. a kind of method, comprising:
First radiator, which is fixed to, can support the pedestals of multiple radiators, first radiator be designed to by heat from
The first assembly of device passes, and the first assembly is designed to operate in the temperature lower than first threshold temperature；
Second radiator is fixed to the pedestal, second radiator:
At least a certain amount of space is physically separated with first radiator；With
It is designed to pass heat from the second component of the device, second component is designed to lower than second
The temperature of threshold temperature operates, and the second threshold temperature is different from the first threshold temperature；With
By the pedestal couples to the device, so that:
The first assembly is operated in the temperature lower than the first threshold temperature；With
Second component is operated in the temperature lower than the second threshold temperature.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/854,840 US10477728B2 (en) | 2017-12-27 | 2017-12-27 | Apparatus, system, and method for cooling devices containing multiple components |
| US15/854,840 | 2017-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109979895A true CN109979895A (en) | 2019-07-05 |
| CN109979895B CN109979895B (en) | 2023-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811525720.4A Active CN109979895B (en) | 2017-12-27 | 2018-12-13 | Apparatus, system, and method for cooling a device comprising a plurality of components |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10477728B2 (en) |
| CN (1) | CN109979895B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10882147B2 (en) * | 2018-10-01 | 2021-01-05 | Hewlett Packard Enterprise Development Lp | Heatsink with retention mechanisms |
| US10622279B1 (en) * | 2019-01-14 | 2020-04-14 | Cisco Technology, Inc. | Heatsink mounting system with overhang damping |
| CN112531371B (en) * | 2019-09-17 | 2022-06-03 | 美国莫列斯有限公司 | Connector assembly |
| US11343945B2 (en) * | 2019-10-10 | 2022-05-24 | Cisco Technology, Inc. | Combined liquid and air cooling system for fail-safe operation of high power density ASIC devices |
| US11937403B2 (en) * | 2019-10-23 | 2024-03-19 | Lumentum Operations Llc | Progressive heatsink |
| US10978372B1 (en) * | 2019-11-11 | 2021-04-13 | Google Llc | Heat sink load balancing apparatus |
| DE102019135060A1 (en) * | 2019-12-19 | 2021-06-24 | Dspace Digital Signal Processing And Control Engineering Gmbh | Multi-zone heat sinks for circuit boards |
| US11810832B2 (en) | 2020-06-29 | 2023-11-07 | Marvell Asia Pte Ltd | Heat sink configuration for multi-chip module |
| US20230262937A1 (en) * | 2022-02-11 | 2023-08-17 | Quanta Computer Inc. | Combination heat sink |
| US20230301029A1 (en) * | 2022-03-16 | 2023-09-21 | Google Llc | Load Vectoring Heat Sink |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6212074B1 (en) * | 2000-01-31 | 2001-04-03 | Sun Microsystems, Inc. | Apparatus for dissipating heat from a circuit board having a multilevel surface |
| US7224582B1 (en) * | 2004-09-20 | 2007-05-29 | Nortel Networks Limited | Floating heatsink for removable components |
| CN101026132A (en) * | 2006-02-22 | 2007-08-29 | 特奕展科技股份有限公司 | Multi-mode radiator comprising cooling chip and its radiating method |
| US7405937B1 (en) * | 2007-02-16 | 2008-07-29 | Inventec Corporation | Heat sink module for dual heat sources |
| US20090223647A1 (en) * | 2008-03-05 | 2009-09-10 | Sinan Alousi | Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members |
| US20160118315A1 (en) * | 2014-10-23 | 2016-04-28 | Intel Corporation | Heat Sink Coupling Using Flexible Heat Pipes for Multi-Surface Components |
| CN106150573A (en) * | 2014-11-20 | 2016-11-23 | 范戴尼超级涡轮有限公司 | Turbocharger roller support system |
| CN106884957A (en) * | 2015-12-10 | 2017-06-23 | 丰田自动车株式会社 | For the power-transmission system of vehicle |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6625025B1 (en) * | 2000-07-10 | 2003-09-23 | Nortel Networks Limited | Component cooling in electronic devices |
| US20030193777A1 (en) * | 2002-04-16 | 2003-10-16 | Friedrich Richard J. | Data center energy management system |
| CN101896052A (en) * | 2009-05-18 | 2010-11-24 | 鸿富锦精密工业（深圳）有限公司 | Heat radiating module |
| US9198328B1 (en) * | 2012-04-26 | 2015-11-24 | Hamilton Sundstrand Corporation | Thermal separation of electronic control chassis heatsink fins |
-
2017
- 2017-12-27 US US15/854,840 patent/US10477728B2/en active Active
-
2018
- 2018-12-13 CN CN201811525720.4A patent/CN109979895B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6212074B1 (en) * | 2000-01-31 | 2001-04-03 | Sun Microsystems, Inc. | Apparatus for dissipating heat from a circuit board having a multilevel surface |
| US7224582B1 (en) * | 2004-09-20 | 2007-05-29 | Nortel Networks Limited | Floating heatsink for removable components |
| CN101026132A (en) * | 2006-02-22 | 2007-08-29 | 特奕展科技股份有限公司 | Multi-mode radiator comprising cooling chip and its radiating method |
| US7405937B1 (en) * | 2007-02-16 | 2008-07-29 | Inventec Corporation | Heat sink module for dual heat sources |
| US20090223647A1 (en) * | 2008-03-05 | 2009-09-10 | Sinan Alousi | Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members |
| US20160118315A1 (en) * | 2014-10-23 | 2016-04-28 | Intel Corporation | Heat Sink Coupling Using Flexible Heat Pipes for Multi-Surface Components |
| CN106150573A (en) * | 2014-11-20 | 2016-11-23 | 范戴尼超级涡轮有限公司 | Turbocharger roller support system |
| CN106884957A (en) * | 2015-12-10 | 2017-06-23 | 丰田自动车株式会社 | For the power-transmission system of vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109979895B (en) | 2023-05-02 |
| US10477728B2 (en) | 2019-11-12 |
| US20190200479A1 (en) | 2019-06-27 |
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