CN101896052A - Heat radiating module - Google Patents
Heat radiating module Download PDFInfo
- Publication number
- CN101896052A CN101896052A CN2009103024026A CN200910302402A CN101896052A CN 101896052 A CN101896052 A CN 101896052A CN 2009103024026 A CN2009103024026 A CN 2009103024026A CN 200910302402 A CN200910302402 A CN 200910302402A CN 101896052 A CN101896052 A CN 101896052A
- Authority
- CN
- China
- Prior art keywords
- base
- radiators
- heat radiation
- radiator
- radiation module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A heat radiating module comprises a base and a plurality of radiators, wherein the radiators are separately and selectively installed on the base; and raised lines which separate the base into a plurality of installation areas protrude from the base to locate the radiators. The heat radiating module achieves the aim of meeting the heat radiation requirements of different chips by separately installing the radiators on the base and changing the quantity and shapes of the radiators, and the raised lines separate the base into a plurality of installation areas, thus being convenient for locating when installing the radiators.
Description
Technical field
The present invention relates to a kind of heat radiation module.
Background technology
The radiator of north and south bridge chip is different from the radiator of CPU (Central Processing Unit, central processing unit), and prolonging with property of cpu heat is very strong, the radiator that a lot of mainboards can general same model and do not influence the heat radiation function of CPU; And the radiator of north and south bridge chip is just different, the position of its ornaments, space, radiating requirements all have very big uncertainty, thereby the exploitation kind that causes the radiator of north and south bridge chip also is maximum, so both increase the development cost of the radiator of north and south bridge chip, also increased the time of exploitation simultaneously.
Summary of the invention
In view of above content, be necessary to provide a kind of heat radiation module of radiating requirements of the chip applicable to multiple power.
A kind of heat radiation module comprises a base and some radiators, and described radiator is separable and optionally be installed on the described base, is equipped with the raised line that this base is separated into some installing zones on the described base, to locate these radiators.
Above-mentioned heat radiation module is by the described radiator of the installing that separates on described base, and can change the quantity and the shape of described radiator, reach the purpose that satisfies different chip cooling demands, raised line is divided into some installing zones with base simultaneously, is convenient to the location when radiator is installed.
Description of drawings
Fig. 1 is the dispel the heat exploded view of better embodiment of module of the present invention.
Fig. 2 is installed on the assembly drawing of this base for the radiator among Fig. 1.
Fig. 3 is the assembly drawing of Fig. 1.
Embodiment
Please refer to Fig. 1, the dispel the heat better embodiment of module of the present invention comprises that one is fastener 40 and 4 screws 50 that foursquare base 10, four radiators 20, can be fixed in this base 10 circuit board.
Each radiator 20 comprises the fin 23 of a base plate 21 and some vertical these base plates 21.This base plate 21 is provided with a fixing hole 212.In the present embodiment, the base plate 21 of described four radiators 20 is identical, and the fin 23 of four radiators 20 is highly different.In other real-time mode, the base plate 21 of described four radiators 20 and the height of fin 23 all can be different.
Orthogonal two raised lines 12 are equipped with on the surface of described base 10, and described raised line 12 is separated into four installing zones 14 that size is identical with this base 10, in order to locate described four radiators 20.Each installing zone 14 is provided with a screwed hole 142 in the middle part.Wherein keep at a certain distance away on the raised line 12 and be equipped with two fastening parts 122 that can be used to this fastener 40 of holding.Each fastening part 122 comprises two tabs 144 that are provided with relatively at interval.In other real-time modes, described two raised lines 12 also can be divided into three installation regions with described base 10.
This fastener 40 is made by elastomeric material, but comprises a limiting section 42, is located at the pressure section 44 of limiting section 42 these bases 10 of two ends butt and is arranged on the end of pressure section 44 and two holding parts 46 that bearing of trend can be held in described circuit board on the contrary.Two pressure sections 44 can be placed in the fastening part 122 of this base 10 and can compress this base 10, and this limiting section 42 can be limited between two fastening parts 122 of this base 10.
During use, can be according to the radiating requirements of the electronic component on the circuit board (as south/north bridge chips), at the dispel the heat base of module of the present invention the radiator of respective numbers can be installed.See also Fig. 2, the power of the electronic component on circuit board hour can be installed the radiator 20 of lesser amt on base 10, can lock a screwed hole 142 of base 10 by the fixing hole 212 that a screw 50 passes a radiator 20.See also Fig. 3, when the power of the electronic component on the circuit board is big, the radiator 20 (as four) of a greater number can be installed on base 10, can lock four screwed holes 142 of base 10 by the fixing hole 212 that four screws 50 pass four radiators 20.Be placed in described base 10 fastener 40 two holding parts 46 can be held on the described circuit board.
The installing described radiator 20 of above-mentioned heat radiation module by on described base 10, separating, and can change the quantity and the shape of described radiator 20, reach the purpose that satisfies different chip cooling demands, raised line 12 is divided into some installing zones with base 10 simultaneously, is convenient to the location when radiator 20 is installed.
Claims (7)
1. a heat radiation module comprises a base and some radiators, and described radiator is separable and optionally be installed on the described base, is equipped with the raised line that this base is separated into some installing zones on the described base, to locate these radiators.
2. heat radiation module as claimed in claim 1 is characterized in that: each radiator comprises the fin of a base plate and some vertical these base plates.
3. heat radiation module as claimed in claim 2 is characterized in that: a fixing hole is arranged on the base plate of each radiator, and each installing zone correspondence is provided with a screw hole, passes this fixing hole by a screw and is locked in this screw hole and radiator is installed on this base.
4. heat radiation module as claimed in claim 1 is characterized in that: described base is provided with two mutual vertically disposed raised lines, and this two raised line is separated into four installing zones with base, so that four radiators to be installed.
5. heat radiation module as claimed in claim 4 is characterized in that: the base plate shape of described four radiators is identical with described four installing zones respectively.
6. heat radiation module as claimed in claim 4 is characterized in that: described four radiators the height difference.
7. heat radiation module as claimed in claim 4 is characterized in that: wherein a raised line is provided with a pair of fastening part, and this is used for holding one to fastening part can be fixed in this heat radiation module the fastener of one circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103024026A CN101896052A (en) | 2009-05-18 | 2009-05-18 | Heat radiating module |
| US12/489,455 US20100288470A1 (en) | 2009-05-18 | 2009-06-23 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103024026A CN101896052A (en) | 2009-05-18 | 2009-05-18 | Heat radiating module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101896052A true CN101896052A (en) | 2010-11-24 |
Family
ID=43067571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009103024026A Pending CN101896052A (en) | 2009-05-18 | 2009-05-18 | Heat radiating module |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20100288470A1 (en) |
| CN (1) | CN101896052A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103957682A (en) * | 2014-05-08 | 2014-07-30 | 华为技术有限公司 | Heat dissipater and electronic device with same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10477728B2 (en) * | 2017-12-27 | 2019-11-12 | Juniper Networks, Inc | Apparatus, system, and method for cooling devices containing multiple components |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4103737A (en) * | 1976-12-16 | 1978-08-01 | Marantz Company, Inc. | Heat exchanger structure for electronic apparatus |
| US5706169A (en) * | 1996-05-15 | 1998-01-06 | Yeh; Robin | Cooling apparatus for a computer central processing unit |
| US5964285A (en) * | 1999-02-12 | 1999-10-12 | Yung-Tsai Chu | Heat sink |
| US6659168B1 (en) * | 2002-07-09 | 2003-12-09 | Hewlett-Packard Development Company, L.P. | Heatsink with multiple fin types |
| CN100561721C (en) * | 2006-12-26 | 2009-11-18 | 鸿富锦精密工业（深圳）有限公司 | Data memory heat radiating device |
-
2009
- 2009-05-18 CN CN2009103024026A patent/CN101896052A/en active Pending
- 2009-06-23 US US12/489,455 patent/US20100288470A1/en not_active Abandoned
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103957682A (en) * | 2014-05-08 | 2014-07-30 | 华为技术有限公司 | Heat dissipater and electronic device with same |
| CN103957682B (en) * | 2014-05-08 | 2016-11-23 | 华为技术有限公司 | Heat abstractor and there is the electronic equipment of this heat abstractor |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100288470A1 (en) | 2010-11-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20101124 |