CN101605446B - Radiating device - Google Patents

Radiating device Download PDF

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Publication number
CN101605446B
CN101605446B CN200810302094A CN200810302094A CN101605446B CN 101605446 B CN101605446 B CN 101605446B CN 200810302094 A CN200810302094 A CN 200810302094A CN 200810302094 A CN200810302094 A CN 200810302094A CN 101605446 B CN101605446 B CN 101605446B
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Prior art keywords
installation
radiator
installation portion
fastener
heat abstractor
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Expired - Fee Related
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CN200810302094A
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CN101605446A (en
Inventor
孙虎
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200810302094A priority Critical patent/CN101605446B/en
Priority to US12/261,047 priority patent/US20090308573A1/en
Publication of CN101605446A publication Critical patent/CN101605446A/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置，用于对电路板上的电子元件进行散热，其包括一散热器和将散热器固定在一电路板上的扣具，所述扣具包括分别结合至散热器两侧的二安装片和二扣件，所述安装片可沿第一方向相对散热器来回滑动，所述扣件可在安装片上沿着第二方向移动，与现有技术相比，上述散热装置的扣具可以根据电路板上电子元件周围的固定孔位置对扣具进行调节，使散热装置适于安装在不同规格的电路板上。

Figure 200810302094

A heat dissipation device is used to dissipate heat from electronic components on a circuit board. It includes a radiator and a fastener for fixing the radiator on a circuit board. The mounting piece and two fasteners, the mounting piece can slide back and forth relative to the heat sink along the first direction, and the fastener can move along the second direction on the mounting piece. Compared with the prior art, the fastener of the above-mentioned heat dissipation device The buckle can be adjusted according to the positions of the fixing holes around the electronic components on the circuit board, so that the heat dissipation device is suitable for being installed on circuit boards of different specifications.

Figure 200810302094

Description

散热装置heat sink

技术领域 technical field

本发明涉及一种散热装置，特别是指用于冷却电子元件的散热装置。The invention relates to a heat dissipation device, in particular to a heat dissipation device for cooling electronic components.

背景技术 Background technique

随着计算机技术的迅速发展，电脑的电子元件如中央处理器、北桥芯片的运行频率及速度在不断提升。然而，电子元件产生的热量随之增多，温度也不断升高，严重威胁着电子元件运行时的性能，为确保电子元件正常运作，通常将一散热装置安装在电子元件所在的电路板上而将电子元件产生的热量及时排出。With the rapid development of computer technology, the operating frequency and speed of computer electronic components such as central processing unit and north bridge chip are constantly increasing. However, the heat generated by electronic components increases, and the temperature continues to rise, which seriously threatens the performance of electronic components during operation. To ensure the normal operation of electronic components, a heat sink is usually installed on the circuit board where the electronic components are located. The heat generated by the electronic components is discharged in time.

为使散热装置与电路板上的电子元件表面紧密接触，业界通常在散热装置的底部安装一固定架，固定架周缘向外延伸有若干开设有通孔的凸缘。安装散热装置时，将若干螺钉插入固定架凸缘的通孔，使螺钉对准电路板或电路板背面背板的固定孔，用相应工具旋拧螺钉将散热器锁固在电路板上。但该散热装置的固定架的通孔通常只与电路板上电子元件周围特定的固定孔位置对齐配合，不同规格电路板上电子元件周围的固定孔位置不尽相同，只与孔位对应一致的散热装置匹配。于是针对不同规格的电路板必须设计与之匹配的散热装置，增加了设计成本。In order to make the cooling device closely contact with the surface of the electronic components on the circuit board, the industry usually installs a fixing frame on the bottom of the cooling device, and a plurality of flanges with through holes extend outward from the periphery of the fixing frame. When installing the heat sink, insert a number of screws into the through holes of the flange of the fixing frame, align the screws with the fixing holes on the circuit board or the back panel on the back of the circuit board, and use corresponding tools to screw the screws to lock the heat sink on the circuit board. However, the through holes of the fixing frame of the heat dissipation device are usually only aligned with the specific fixing holes around the electronic components on the circuit board. Heatsinks match. Therefore, matching heat dissipation devices must be designed for circuit boards of different specifications, which increases the design cost.

发明内容 Contents of the invention

有鉴于此，有必要提供一种散热装置，该散热装置具有一扣具可使该散热装置调适用于不同规格的电路板。In view of this, it is necessary to provide a heat dissipation device, the heat dissipation device has a buckle to make the heat dissipation device adaptable to circuit boards of different specifications.

一种散热装置，用于对电路板上的电子元件进行散热，其包括一散热器和将散热器固定在一电路板上的扣具，所述扣具包括分别结合至散热器两侧的二安装片和二扣件，所述安装片可沿第一方向相对散热器来回滑动，所述扣件可在安装片上沿着第二方向移动。A heat dissipation device is used to dissipate heat from electronic components on a circuit board. It includes a radiator and a fastener for fixing the radiator on a circuit board. An installation piece and two fasteners, the installation piece can slide back and forth relative to the radiator along the first direction, and the fastener can move on the installation piece along the second direction.

与现有技术相比，上述散热装置的扣具可以根据电路板上电子元件周围的固定孔位置对扣具进行调节，使散热装置适于安装在不同规格的电路板上。Compared with the prior art, the fasteners of the heat dissipation device can be adjusted according to the positions of the fixing holes around the electronic components on the circuit board, so that the heat dissipation device is suitable for installation on circuit boards of different specifications.

附图说明 Description of drawings

图1是本发明一实施例散热装置的立体组装图。FIG. 1 is a three-dimensional assembly view of a heat sink according to an embodiment of the present invention.

图2是图1的立体分解图。FIG. 2 is an exploded perspective view of FIG. 1 .

图3是图2中散热装置中散热器和扣具的立体分解图。FIG. 3 is a three-dimensional exploded view of the radiator and the buckle in the heat dissipation device in FIG. 2 .

具体实施方式 Detailed ways

请参照图1，本发明一实施例中的散热装置用于对电路板(图未示)上的芯片(图未示)进行散热，该散热装置包括一与芯片接触的散热器10、一安装在散热器10上而将散热装置固定在电路板上的扣具20、一风扇30及一将风扇30固定在散热器10上的固定架40。Please refer to Fig. 1, the heat dissipation device in one embodiment of the present invention is used for dissipating heat to the chip (not shown) on the circuit board (figure not shown), and this heat dissipation device comprises a radiator 10 that contacts with chip, a mounting On the heat sink 10 , a buckle 20 for fixing the cooling device on the circuit board, a fan 30 and a fixing frame 40 for fixing the fan 30 on the heat sink 10 .

请参照图2，所述散热器10由导热性良好的金属材料制成，其整体结构大致呈立方体形，其包括若干鳍片12及一穿设鳍片12的热管14。所述鳍片12具有相同尺寸并相互平行。所述热管14被弯成U形，其具有一吸热部及一放热部(未标号)，其吸热部嵌入鳍片12底部的中间位置并与鳍片12垂直，且该吸热部的底面与鳍片12的底面齐平，从而将芯片产生的热量传递至鳍片12上，其放热部垂直穿过鳍片12且靠近鳍片12顶端。该散热器10在其二相对的最外侧鳍片12顶部各向外凸设一凸柱(未标号)，每一凸柱内开设一用于安装固定架40的螺孔120。所述鳍片12于靠近其底部位置处开设有一矩形槽道122，该槽道122垂直鳍片12贯通散热器10相对两侧且位于热管14吸热部的正上方位置，用以插设扣具20的相应组件。Referring to FIG. 2 , the heat sink 10 is made of a metal material with good thermal conductivity, and its overall structure is roughly cube-shaped, which includes a plurality of fins 12 and a heat pipe 14 passing through the fins 12 . The fins 12 have the same size and are parallel to each other. The heat pipe 14 is bent into a U shape and has a heat absorbing portion and a heat releasing portion (not labeled). The bottom surface of the chip is flush with the bottom surface of the fin 12 , so that the heat generated by the chip is transferred to the fin 12 , and the heat release part vertically passes through the fin 12 and is close to the top of the fin 12 . The heat sink 10 has a protruding post (not labeled) protruding outward from the top of the two opposite outermost fins 12 , and a screw hole 120 for installing the fixing frame 40 is defined in each protruding post. The fin 12 is provided with a rectangular slot 122 near its bottom. The slot 122 is vertical to the fin 12 and runs through the opposite sides of the heat sink 10 and is located directly above the heat-absorbing part of the heat pipe 14 for inserting buckles. The corresponding components of tool 20.

请参照图2及图3，所述扣具20用于将散热装置安装在电路板上，其包括一矩形条状支撑板22、分别位于支撑板22两端的二安装片24、二用于将安装片24固定于支撑板22两端的螺钉26及分别插设于二安装片24一端并与安装片24配合的二扣件28。该支撑板22可沿散热器20的矩形槽道122进入且贯通散热器20，仅保留支撑板22两端在散热器20相对两侧，支撑板22的两端各开设一螺孔220，用以与穿设于安装片24一端的螺钉26配合。每一安装片24由一金属片一体形成，其包括第一安装部242、垂直于第一安装部242的一第二安装部244和从第一安装部242一端倾斜向下延伸并连接第二安装部244一侧的一连接部246。所述二安装片24的二第一安装部242分别通过螺钉26平行地固接在支撑板22两端，每一第一安装部242的中央形成一长椭圆形纵向滑孔2420，用以供螺钉26穿过与支撑板22两端的螺孔220配合而将安装片24连接到支撑板22上，且在螺钉26未处于最紧螺合状态时，安装片24可沿纵向滑孔2420在平行鳍片12的方向来回移动。所述第二安装部244通过扣件28结合至电路板上，其具有长椭圆环状结构且靠近椭圆圆弧端的边缘与连接部246相连接，其中央形成一长椭圆形横向滑孔2440，用以供扣件28穿设。第一安装部242与第二安装部244沿长度方向相互垂直。所述扣件28穿设于安装片24第二安装部244用于将散热装置固定在电路板上，每一扣件28包括一扣件本体(图未标)及套置在该扣件本体上的一弹簧288。所述扣件本体由塑胶材料一体形成，其包括一扣帽282、一自扣帽282中央向下延伸形成的一杆部284及于杆部284末端形成的一倒刺状的卡块286，其中扣帽282的直径大于弹簧288的直径，弹簧288的直径大于第二安装部244的长椭圆形横向滑孔2440宽度，以使弹簧288两端分别抵靠在扣帽282和第二安装部244表面，防止其脱离扣件本体。所述卡块286下压变形后穿过第二安装部244的横向滑孔2440并卡置在第二安装部244下面，弹簧288套设在杆部284上并夹置在扣帽282与第二安装部244之间，该扣件28可沿横向滑孔2440在垂直鳍片12的方向上来回移动。所述螺钉26包括一螺帽262、自螺帽262中央向下延伸形成的一圆形台阶部264和自该台阶部264中央向下延伸形成的一螺杆266。螺帽262顶面形成一十字形沟槽260，用以供一螺丝刀(图未示)进入旋拧该螺钉26。螺杆266表面具有螺纹(图未标)用以与支撑板22上的螺孔220匹配。螺杆266的直径小于第一安装部242的长椭圆形纵向滑孔2420的宽度，台阶部264的直径大于第一安装部242的长椭圆形纵向滑孔2420的宽度，使螺钉26的螺杆266穿过第一安装部242的长椭圆形纵向滑孔2420而使台阶部264抵靠住第一安装部242表面。Please refer to Fig. 2 and Fig. 3, described buckle 20 is used for installing heat dissipation device on circuit board, and it comprises a rectangular support board 22, two mounting pieces 24 that are respectively positioned at the two ends of support board 22, two are used for The mounting pieces 24 are fixed to the screws 26 at both ends of the support plate 22 and the two fasteners 28 are respectively inserted into one ends of the two mounting pieces 24 and cooperate with the mounting pieces 24 . The support plate 22 can enter and pass through the radiator 20 along the rectangular channel 122 of the radiator 20, only the two ends of the support plate 22 are kept on the opposite sides of the radiator 20, and a screw hole 220 is respectively provided at the two ends of the support plate 22 for use. To cooperate with the screw 26 passing through one end of the mounting piece 24 . Each mounting piece 24 is integrally formed by a metal sheet, which includes a first mounting portion 242, a second mounting portion 244 perpendicular to the first mounting portion 242, and extends obliquely downward from one end of the first mounting portion 242 and connects the second mounting portion 242. A connecting portion 246 on one side of the mounting portion 244 . The two first mounting parts 242 of the two mounting pieces 24 are fixed on both ends of the support plate 22 in parallel by screws 26 respectively, and an oblong longitudinal sliding hole 2420 is formed in the center of each first mounting part 242 for The screw 26 passes through the screw holes 220 at both ends of the support plate 22 to connect the mounting piece 24 to the support plate 22, and when the screw 26 is not in the most tightly screwed state, the mounting piece 24 can be parallel to the longitudinal sliding hole 2420. The direction of the fins 12 moves back and forth. The second mounting part 244 is combined to the circuit board through a fastener 28, which has a long oval ring structure and is connected to the connecting part 246 at the edge close to the end of the ellipse arc, and an oblong horizontal sliding hole 2440 is formed in the center thereof, Used for the fastener 28 to be worn. The first mounting portion 242 and the second mounting portion 244 are perpendicular to each other along the length direction. The fasteners 28 pass through the second mounting portion 244 of the mounting piece 24 to fix the heat sink on the circuit board. Each fastener 28 includes a fastener body (not shown) and is sleeved on the fastener body. A spring 288 on the top. The fastener body is integrally formed of plastic material, which includes a buckle cap 282, a rod portion 284 extending downward from the center of the buckle cap 282, and a barb-shaped block 286 formed at the end of the rod portion 284, Wherein the diameter of the buckle cap 282 is greater than the diameter of the spring 288, and the diameter of the spring 288 is greater than the width of the oblong transverse sliding hole 2440 of the second mounting part 244, so that the two ends of the spring 288 are respectively against the buckle cap 282 and the second mounting part 244 surface to prevent it from detaching from the fastener body. The block 286 is pressed and deformed, passes through the transverse sliding hole 2440 of the second mounting part 244 and is locked under the second mounting part 244, and the spring 288 is sleeved on the rod part 284 and sandwiched between the buckle cap 282 and the second mounting part 244. Between the two installation parts 244 , the fastener 28 can move back and forth along the horizontal sliding hole 2440 in the direction perpendicular to the fin 12 . The screw 26 includes a nut 262 , a circular step 264 extending downward from the center of the nut 262 , and a screw 266 extending downward from the center of the step 264 . A cross-shaped groove 260 is formed on the top surface of the nut 262 for a screwdriver (not shown) to enter and screw the screw 26 . The surface of the screw 266 has threads (not shown) for matching with the screw holes 220 on the support plate 22 . The diameter of the screw rod 266 is less than the width of the oblong longitudinal sliding hole 2420 of the first mounting part 242, and the diameter of the step part 264 is greater than the width of the oblong longitudinal sliding hole 2420 of the first mounting part 242, so that the screw rod 266 of the screw 26 passes through The step portion 264 abuts against the surface of the first installation portion 242 through the oblong longitudinal sliding hole 2420 of the first installation portion 242 .

所述风扇30为轴流风扇，其结合至固定架40的上表面。该风扇30具有分别自其顶端和底端延伸而出的上凸缘32、下凸缘34及用以固定风扇30的若干螺钉36。上凸缘32和下凸缘34相互平行，于下凸缘34的四角处开设四通孔300，用以供螺钉36穿设。The fan 30 is an axial fan, which is coupled to the upper surface of the fixing frame 40 . The fan 30 has an upper flange 32 , a lower flange 34 respectively extending from the top and bottom of the fan 30 , and a plurality of screws 36 for fixing the fan 30 . The upper flange 32 and the lower flange 34 are parallel to each other, and four through holes 300 are defined at the four corners of the lower flange 34 for passing the screws 36 .

所述固定架40用于将风扇30固定在散热器10上，其包括一本体部42、自本体部42相对两侧垂直向下延伸形成的二安装板44。该本体部42中央开设一圆形入风口400，用以供风扇30产生的气流通过。该本体部42四角处开设四环绕入风口400的螺孔420，用以与穿过风扇30通孔300的螺钉36相配合。该二安装板44两端各开设一通孔440，用以供螺钉46穿过与散热器10上的螺孔120配合而将固定架40固定到散热器10上。The fixing bracket 40 is used to fix the fan 30 on the heat sink 10 , and includes a body portion 42 and two mounting plates 44 vertically extending downward from opposite sides of the body portion 42 . A circular air inlet 400 is defined in the center of the body portion 42 for the airflow generated by the fan 30 to pass through. Four corners of the main body 42 define screw holes 420 surrounding the air inlet 400 for matching with the screws 36 passing through the through holes 300 of the fan 30 . Two through holes 440 are defined at both ends of the two mounting plates 44 for the screws 46 to pass through and cooperate with the screw holes 120 on the heat sink 10 to fix the bracket 40 to the heat sink 10 .

组装该散热装置时，所述风扇30通过四螺钉36穿过其下凸缘34的通孔300与固定架40本体部42的螺孔420配合，而将风扇30锁固在固定架40上；固定架40通过四螺钉46穿过其安装板44的通孔440与散热器10顶部的螺孔120，而将载有风扇30的固定架40锁固在散热器10上；将扣具20的支撑板22插设在散热器20的矩形槽道122内，仅保留支撑板22两端在散热器20二相对外侧；将二螺钉26的螺杆266沿第一安装部242的纵向滑孔2420插入第一安装部242，继而借助一螺丝刀旋拧螺钉26，使螺杆266沿支撑板22的螺孔220进入而与支撑板22螺接，在固紧第一安装部242前，第一安装部242可沿纵向滑孔2420相对螺钉26左右滑动来调节安装片24在支撑板22上的位置，使第二安装部244的横向滑孔2440正对对应的电路板固定孔(图未示)上，再继续旋拧螺钉26使螺钉26的台阶部264顶靠在第一安装部242表面，而将第一安装部242锁紧固定；将扣件28沿第二安装部244的横向滑孔2440插入第二安装部244，并沿第二安装部244左右滑动扣件28而使扣件28的卡块286与电路板的固定孔对齐，向下按压扣件28的扣帽282使弹簧288被压缩而两端分别抵靠在扣帽282和第二安装部244表面，同时卡块286穿过电路板固定孔，直至卡块286卡置在电路板下面的背板上，从而将散热装置牢固地固定在电路板上。When assembling the heat sink, the fan 30 passes through the through hole 300 of the lower flange 34 of the fan 30 to cooperate with the screw hole 420 of the main body 42 of the fixing frame 40 to lock the fan 30 on the fixing frame 40; The fixed frame 40 passes through the through hole 440 of its mounting plate 44 and the screw hole 120 on the top of the radiator 10 through four screws 46, and the fixed frame 40 carrying the fan 30 is locked on the radiator 10; The support plate 22 is inserted in the rectangular channel 122 of the radiator 20, and only the two ends of the support plate 22 are kept on the two opposite outer sides of the radiator 20; the screw rods 266 of the two screws 26 are inserted along the longitudinal sliding holes 2420 of the first mounting part 242 The first installation part 242, then screw the screw 26 by means of a screwdriver, so that the screw rod 266 enters along the screw hole 220 of the support plate 22 and is screwed with the support plate 22. Before the first installation part 242 is fastened, the first installation part 242 The position of the mounting piece 24 on the support plate 22 can be adjusted by sliding left and right along the longitudinal sliding hole 2420 relative to the screw 26, so that the horizontal sliding hole 2440 of the second mounting part 244 is facing the corresponding circuit board fixing hole (not shown). Then continue to screw the screw 26 so that the stepped portion 264 of the screw 26 is against the surface of the first mounting portion 242, and the first mounting portion 242 is locked and fixed; the fastener 28 is inserted along the transverse slide hole 2440 of the second mounting portion 244 The second mounting part 244, and slide the fastener 28 left and right along the second mounting part 244 so that the block 286 of the fastener 28 is aligned with the fixing hole of the circuit board, and press the buckle cap 282 of the fastener 28 downward to compress the spring 288 The two ends respectively lean against the buckle cap 282 and the surface of the second mounting part 244, while the block 286 passes through the fixing hole of the circuit board until the block 286 is stuck on the back plate below the circuit board, so that the heat sink is firmly fixed. fixed on the circuit board.

与现有技术相比，上述散热装置的扣具可以根据电路板上电子元件周围的固定孔位置对扣具进行调节，使散热装置适于安装在不同规格的电路板上。Compared with the prior art, the fasteners of the heat dissipation device can be adjusted according to the positions of the fixing holes around the electronic components on the circuit board, so that the heat dissipation device is suitable for installation on circuit boards of different specifications.

Claims (13)

1. heat abstractor; Be used for the electronic component on the circuit board is dispelled the heat; It comprises a radiator and radiator is fixed on the fastener on the circuit board, it is characterized in that: said fastener comprises two installation sheets and two fasteners that are bonded to the radiator both sides respectively, and each installation sheet comprises one first installation portion and one second installation portion; Said the first installation part is not slidably mounted in the relative both sides of radiator; This two fastener is slidably mounted in respectively on second installation portion, and said installation sheet can slidably reciprocate to regulate two second distances between the installation portion along the relative radiator of first direction, and said fastener can move along second direction on installation sheet.
2. heat abstractor as claimed in claim 1 is characterized in that: said first direction is perpendicular to second direction.
3. heat abstractor as claimed in claim 2 is characterized in that: said fastener comprises that also one is set in the supporting bracket on the radiator, and its two ends are stretched out the relative both sides of radiator and are connected with installation sheet.
4. heat abstractor as claimed in claim 3 is characterized in that: first installation portion is movably attached to supporting bracket one end through screw, and fastener wears second installation portion.
5. heat abstractor as claimed in claim 4; It is characterized in that: on said first installation portion and second installation portion respectively correspondence offer orthogonal one a vertical slide opening and a horizontal slide opening; Said installation sheet about screw longitudinally slide opening slidably reciprocate, the direction that said fastener can slide along vertical installation sheet in horizontal slide opening move around.
6. heat abstractor as claimed in claim 5 is characterized in that: said supporting bracket two ends respectively offer a screw, itself and the screw fit that is located in the vertical slide opening of first installation portion.
7. heat abstractor as claimed in claim 4 is characterized in that: said first installation portion is vertical each other with second installation portion, and said installation sheet also comprises a junction that extends and connect second installation portion, one side from first installation portion, one end.
8. heat abstractor as claimed in claim 7 is characterized in that: said first installation portion and second installation portion are positioned at the adjacent both sides of radiator respectively.
9. heat abstractor as claimed in claim 8 is characterized in that: said connecting portion is tilted to extend below from first installation portion, one end and connects second installation portion.
10. like claim 4 or 5 described heat abstractors; It is characterized in that: said fastener comprises a bar portion that button cap, a self-clinching cap extend to form downwards, is sheathed on the spring of bar portion in the fixture block and of the terminal reversed acanthoid that forms of bar portion; Said spring is resisted against on said second connecting portion, and the spring and second connecting portion pass in said bar portion.
11. like claim 3 or 4 described heat abstractors, it is characterized in that: said radiator comprises some fins at interval that are parallel to each other, and said installation sheet is parallel with fin along the direction that slidably reciprocates.
12. heat abstractor as claimed in claim 11 is characterized in that: said fin offer one vertically run through its both sides a conduit, said supporting bracket is inserted in the conduit.
13. heat abstractor as claimed in claim 11; It is characterized in that: said radiator also comprises a heat pipe; Said heat pipe have one vertically pass fin endothermic section and embed centre position, fin bottom surface and the heat release portion vertical with fin, bottom surface, said endothermic section flushes with the fin bottom surface.
CN200810302094A 2008-06-11 2008-06-11 Radiating device Expired - Fee Related CN101605446B (en)

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