CN109951953A - A kind of preparation method and application of ceramic substrate and polymer composite-base plate - Google Patents
A kind of preparation method and application of ceramic substrate and polymer composite-base plate Download PDFInfo
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- CN109951953A CN109951953A CN201910323543.XA CN201910323543A CN109951953A CN 109951953 A CN109951953 A CN 109951953A CN 201910323543 A CN201910323543 A CN 201910323543A CN 109951953 A CN109951953 A CN 109951953A
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- ceramic substrate
- copper
- base plate
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Abstract
The present invention provides the preparation methods and application of a kind of ceramic substrate and polymer composite-base plate, including ceramic substrate and polymer composite-base plate.Circuit is modified on ceramic substrate upper layer, and layers of copper is modified by lower layer, and processes HDI micropore copper post and be connected with upper and lower surface circuit heat transfer, and with wiring board interconnection progress signal transmission.Polymer composite-base plate upper and lower surface covers copper, and through-hole fills out copper and is connected with the ceramic substrate lower layer of embedment thermally conductive.Ceramic substrate is embedded to polymer composite-base plate by the present invention, installs IC chip on the ceramic substrate circuit layer being exposed, and module improves heating conduction and unfailing performance as a whole, can be used for 5G communication module group, reduces signal distortion, improves signal transmission rate.
Description
Technical field
The invention belongs to PCB printed wiring board and electrical communications components field, it is related to a kind of ceramic substrate and macromolecule is multiple
Close the preparation method of substrate, especially application of the composite substrate in telecommunications field.
Background technique
PCB (Printed Circuit Board) printed circuit board, also known as printed wiring board, is the branch of electronic component
Support body is also the carrier of electronic component electric appliance connection.PCB is widely used in various electronic equipments, and design will with quality
Total quality and cost are directly affected, it is also different for the material and performance requirement of PCB in different application field.
Requirement with socio-economic development and people to wireless communication technique, cellular radio communications technology via
Forth generation cellular communication (4G) marches toward the 5th generation cellular communication (5G) epoch.
To enter the 5G epoch on the basis of existing 4G technology, not only need 5G network, with greater need for 5G corollary equipment and
The support of terminal technology.Therefore in telecommunications field, as the carrier of various components and the PCB of circuit signal hub transmission
It is also required to realize the leap of technical aspect, to meet high speed, the high frequency requirement of 5G epoch data communication, quality and reliable
Property will directly affect the quality and reliability of communication apparatus.
The high-speed high frequency characteristic of PCB baseplate material is determined by factors such as its substrate, copper foil, process conditions, logical
It interrogates in industrial application, PCB substrate should meet following characteristic:
(1) dielectric constant (Dk) must be small and stablizes, and substrate dielectric constant is smaller, and signal transmission rate and transmission quantity are got over
Greatly, performance number is bigger, and signal is also less susceptible to be distorted.High dielectric constant be easy to cause data transfer delay.
(2) thermal expansion coefficient of substrate and copper foil needs consistent as far as possible, can be cold if both sides' coefficient of expansion mismatches
It causes copper foil to separate in thermal change, influences reliability, cause to fail.
(3) substrate need to have enough heat resistances, chemical resistance, and impact strength and chemical strength need well, and can be in high temperature height
Normal use under wet environment.
At this stage, the high frequency circuit board substrate relatively mostly used has FR-4, PTFE, PPE, and BT etc., wherein FR-4 is because of price
It is cheaply widely applied, but in terms of dielectric constant and heating conduction, FR-4 is not so good as the materials such as PTFE.At the same time, PTFE
It is expensive with the material prices such as BT, and rigidity is poor, thermal expansion coefficient is larger.Such as use PTFE substrate, need to using silica or
The faying face of itself and copper foil need to be done special surface processing as enhancing packing material by glass cloth, and technology difficulty is larger, step
Cumbersome and higher cost is unfavorable for the popularization and application of 5G high frequency circuit board.
In addition, there are a large amount of Problem of Failure in the application in the high frequency circuit board used at this stage, mainly in high temperature height
There is Problem of Failure under wet environment, it is contemplated that high power caused by the high RST transmission quantity of 5G communication need, the heating conduction of PCB
Also it to meet the requirements, just can guarantee device reliability.
In conclusion this field need it is a kind of meet high-speed high frequency characteristic, and can in stable operation under hot and humid environment,
It can carry out the PCB substrate of large-scale production and application at lower cost simultaneously.
Summary of the invention
Meet high-speed high frequency characteristic the object of the present invention is to provide a kind of, and can in stable operation under hot and humid environment,
It can carry out the PCB substrate of large-scale production and application at lower cost simultaneously.
Guarantee the high-speed high frequency characteristic of PCB substrate, it is necessary to guarantee that baseplate material has low relative dielectric constant
(εr, referred to as " dielectric constant "), low dielectric loss tangent (tan δ).Low transmission loss, the few transmission of high-speed high frequency PCB is prolonged
Slow characteristic and baseplate material characteristic relation are as follows:
Transmission loss (α)=conductor losses (αc)+dielectric loss (αd)+radiation loss (αr)
Wherein: conductor losses (αc) related with conductor type (resistance), insulating layer and conductor physical size.
Radiation loss (αr) related with substrate dielectric characteristic, with εrIt is directly proportional with tan δ.
Propagation delay time (Tpd)=L × (εeff)1/2×C
Wherein: C is the light velocity, εeffFor practical relative dielectric constant, L is signal transmission length.
It can be seen that, as signal is decayed, signal delay is also increasing during signal high-speed transfer, work as substrate
When the dielectric constant of material is larger, signal integrity is deteriorated, and signal transfer rate is slack-off.
Following table lists this patent and is related to the dielectric constant statistical form of baseplate material:
Likewise, as working transmission becomes larger, device power value also becomes larger therewith during signal high-speed transfer,
Thus higher heat is generated, if PCB material heating conduction is not high, will cause heat can not export in time, and device is caused to overheat
Failure.
Following table lists this patent and is related to the thermal coefficient statistical form of baseplate material:
Ceramic material heating conduction is outstanding, has moderate dielectric constant and dielectric loss, and preferable insulation performance possesses
With thermal expansion coefficient similar in silicon, room temperature and mechanical behavior under high temperature are good.In view of the IC chip used at this stage is usually silicon
Base chip, this patent is by the way that IC chip to be mounted on ceramic substrate with heat-conducting glue, then ceramic substrate is embedded to polymeric substrate
Mode, it is possible to prevente effectively from silicon base chip and polymeric substrate material heat expansion rate mismatch caused by Problem of Failure.
Meanwhile the ceramic substrate and polymer composite-base plate of this patent design all process via hole with laser boring, simultaneously
Copper post is filled for thermally conductive, copper post be embedded in layers of copper be interconnected it is thermally conductive, it is more preferable than existing PCB copper-clad plate heat-conducting effect.
It is machined with HDI micropore copper post on the ceramic substrate of this patent design, Dan Keyu upper and lower surface circuit is not connected and is used as
Radiator structure and overall structure are consolidated, and can also interconnect with wiring board and carry out signal transmission, guarantee module by signal transmission integrity.
The ceramic substrate and polymer composite-base plate of this patent design use IC method for packaging semiconductor, can be obtained whole logical
News mould group simplifies procedure of processing, and the reliability of integral device can be greatly improved, and large-scale application is set in the base station 5G or communication
It is standby.
Another object of the present invention is to provide the preparation methods of a kind of ceramic substrate and polymer composite-base plate.
The preparation method of ceramic substrate of the invention includes the following steps:
(1) laser boring on ceramic substrate；
(2) copper is filled out in the through hole of ceramic substrate；
(3) in lower layer's copper electroplating layer of ceramic substrate, circuit is modified on upper layer；
(4) IC chip is installed on the upper layer of ceramic substrate.
Aluminium nitride can be used in ceramic substrate in the present invention, and aluminium oxide, beryllium oxide, silicon carbide is as substrate.
Filling perforation copper facing in step (2) of the present invention uses plating, chemical plating mode.
Circuit is modified in ceramic base plate surface in step (3) of the present invention, using DPC ceramic membrane circuit technology, first will
Ceramic substrate does pretreatment cleaning, is incorporated into the way of film specialized fabrication technology-vacuum coating in sputter on ceramic substrate
Copper metal composite layer is then coated with the photoresist of yellow light lithographic and exposes, develops, etching, membrane process is gone to complete route production, finally
The thickness for increasing route in a manner of plating/electroless deposition again completes metal line production after photoresist removal.
IC chip is directly welded at by ceramic base plate surface using SMT welding technique in step (4) of the present invention, or uses table
Face mounting technology can avoid poor contact, it is ensured that equipment dependability.
The preparation method of polymer composite-base plate of the invention includes the following steps:
(1) in polymeric substrate electroplating surface layers of copper, macromolecule copper-clad plate is made；
(2) it digs a hole in macromolecule copper-clad plate；
(3) by the hole of the ceramic substrate module prepared embedment macromolecule copper-clad plate；
(4) the macromolecule copper-clad plate for being embedded to ceramic substrate is subjected to through-hole copper facing, obtains Whole PC B mould after encapsulation process
Block.
FR-4 can be used in polymer composite-base plate in the present invention, and BT, PTFE, MG or conductive metal are as substrate.
It in step (2) of the present invention, digs a hole in macromolecule copper-clad plate, is divided into ceramic substrate embedment hole and conduction copper post holes
Hole, the two interpenetrate, and are respectively used to embedment ceramic substrate and through-hole copper facing.
In step (3) of the present invention, the one side that ceramic substrate module installs IC chip is external, covers the one side embedment macromolecule of copper
Copper-clad plate.
In step (4) of the present invention, using IC package technology, ceramic substrate and polymer composite-base plate, IC chip are encapsulated
For communication module group.
The beneficial effects of the present invention are:
(1) chip is mounted on ceramic substrate, ceramics are matched with chip expansion rate, while can be under hot and humid environment
It uses, global reliability improves.
(2) PCB substrate and IC chip are packaged into integral module, embed high heat-conducting ceramic substrate, and high heat-conducting copper is electroplated
Column improves overall thermal conductivity energy and reliability.
(3) signal reception, the conversion ratio for improving 5G communication base station, effectively prevent distorted signals.
(4) by high heat-conducting ceramic substrate and macromolecule copper-clad plate composite package, the material for polymeric substrate is reduced
With technique requirement, processing cost is significantly reduced.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure does simple introduction, it should be understood that the following drawings illustrates only the section Example scheme of this patent, therefore is not construed as
Restriction to range for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other relevant drawings.
Fig. 1 is the pcb board that conventional communications electronics industry uses；
Fig. 2 is to cover layers of copper in polymer-based plate surface, obtains macromolecule copper-clad plate；
Fig. 3 is dug a hole in macromolecule copper-clad plate, is ready for following process；
Fig. 4 is punched on ceramic substrate；
Fig. 5 is that copper is filled out in the hole of ceramic substrate, and the lower layer of ceramic substrate covers layers of copper, and circuit is modified on upper layer, upper
Layer circuit surface installs IC chip；
Fig. 6 is the ceramic substrate embedment macromolecule copper-clad plate after processing；
Fig. 7 is the macromolecule copper-clad plate progress through-hole copper facing that will be embedded to ceramic substrate；
Fig. 8 is the front plan view of whole composite substrate；
Fig. 9 is the overall schematic of this patent embodiment.
Specific embodiment
For a better understanding of the present invention, below with reference to the embodiment content that the present invention is furture elucidated, but it is of the invention
Content is not limited solely to the following examples.The present invention can have various embodiments, and can adjust and change wherein
Become.It should be understood, however, that: there is no the intentions that the various embodiments by this patent are limited to specific embodiment disclosed herein, but
This patent should be interpreted as covering all adjustment in the spirit and scope for the various embodiments for falling into this patent, equivalent and/
Or optinal plan.
A kind of preparation method of ceramic substrate and polymer composite-base plate, includes the following steps:
Ceramic substrate preparation step:
(1) it is punched on ceramic substrate；
(2) copper is filled out in the hole of ceramic substrate；
(3) in lower layer's copper electroplating layer of ceramic substrate, circuit is modified on upper layer；
(4) IC chip is installed on the upper layer of ceramic substrate.
Further, step (1) is to run through the hole of type in ceramic base plate surface laser processing.
Preferably, in step (1), ceramic substrate material selection used in the punching: aluminium nitride, aluminium oxide, silicon carbide,
Beryllium oxide etc..
Further, in step (2), the filling perforation copper facing mainly uses electro-plating method.
Preferably, in step (2), the plating metal material selection includes: the electric conductivity such as copper, silver, gold, platinum, thermal conductivity
Preferable metal.
Further, described mainly to use SMT method for brazing to be welded in ceramic base plate surface installation IC chip in step (4)
Connect assembling.
Polymer composite-base plate preparation step:
(1) in polymeric substrate electroplating surface layers of copper, macromolecule copper-clad plate is made；
(2) it digs a hole in macromolecule copper-clad plate；
(3) by the hole of the ceramic substrate module prepared embedment macromolecule copper-clad plate；
(4) the macromolecule copper-clad plate for being embedded to ceramic substrate is subjected to through-hole copper facing, obtains Whole PC B mould after encapsulation process
Block.
Further, in step (1), the polymeric substrate material selection: FR-4, BT, PTFE, MG etc. or conductive metal.
Further, described to dig a hole in macromolecule copper-clad plate in step (2), it is divided into ceramic substrate embedment hole and thermally conductive
Copper post hole, the two interpenetrate, and are respectively used to embedment ceramic substrate and through-hole copper facing.
Further, in step (3), the one side of the ceramic substrate module installation IC chip is external, covers the one side embedment of copper
Macromolecule copper-clad plate.
Preferably, in step (1) and (4), the plating metal material selection includes: the electric conductivity such as copper, silver, gold, platinum, leads
The preferable metal of heating rate.
The contents of the present invention are described in further detail below by way of specific embodiment.
Embodiment 1
The preparation and application of 5G communication module:
As shown in Fig. 4~Fig. 5, aluminum nitride ceramic substrate preparation step:
(1) it is punched on aluminum nitride ceramic substrate；
(2) copper is filled out in the hole of aluminum nitride ceramic substrate；
(3) in lower layer's copper electroplating layer of aluminum nitride ceramic substrate, circuit is modified on upper layer；
(4) IC chip is installed in the another side of aluminum nitride ceramic substrate.
Such as Fig. 2~Fig. 3, shown in Fig. 6~Fig. 7, FR-4 polymer composite-base plate preparation step:
(1) in FR-4 polymeric substrate electroplating surface layers of copper, the copper-clad plate of FR-4 macromolecule is made；
(2) it digs a hole in FR-4 macromolecule copper-clad plate；
(3) by the hole of the aluminum nitride ceramic substrate module prepared embedment FR-4 macromolecule copper-clad plate；
(4) the FR-4 macromolecule copper-clad plate for being embedded to aluminum nitride ceramic substrate is subjected to through-hole copper facing, is obtained after encapsulation process
5G communication module.
5G communication module thermal conductivity is tested, according to ASTME1461-11 standard method, measures thermal coefficient in 120W/mK
More than.
Embodiment 2
The preparation and application of artificial intelligence cpu chip:
As shown in Fig. 4~Fig. 5, aluminium oxide ceramic substrate preparation step:
(1) it is punched on aluminium oxide ceramic substrate；
(2) copper is filled out in the hole of aluminium oxide ceramic substrate；
(3) in lower layer's copper electroplating layer of aluminium oxide ceramic substrate, circuit is modified on upper layer；
(4) IC chip is installed in the another side of aluminium oxide ceramic substrate.
Such as Fig. 2~Fig. 3, shown in Fig. 6~Fig. 7, BT polymer composite-base plate preparation step:
(1) in BT polymeric substrate electroplating surface layers of copper, the copper-clad plate of FR-4 macromolecule is made；
(2) it digs a hole in BT macromolecule copper-clad plate；
(3) by the hole of the aluminium oxide ceramic substrate module prepared embedment BT macromolecule copper-clad plate；
(4) the BT macromolecule copper-clad plate for being embedded to aluminium oxide ceramic substrate is subjected to through-hole copper facing, obtains people after encapsulation process
Work intelligence cpu chip.
Artificial intelligence cpu chip thermal conductivity is tested, according to ASTME1461-11 standard method, thermal coefficient is measured and exists
100W/mK or more.
Embodiment 3
The preparation and application of laser radar sensor optical communication module:
As shown in Fig. 4~Fig. 5, aluminum nitride ceramic substrate preparation step:
(1) it is punched on aluminum nitride ceramic substrate；
(2) copper is filled out in the hole of aluminum nitride ceramic substrate；
(3) in lower layer's copper electroplating layer of aluminum nitride ceramic substrate, circuit is modified on upper layer；
(4) IC chip is installed in the another side of aluminum nitride ceramic substrate.
Such as Fig. 2~Fig. 3, shown in Fig. 6~Fig. 7, silver-colored composite substrate preparation step:
(1) in silver-based plate surface copper electroplating layer, silver copper-clad plate is made；
(2) it digs a hole in silver-colored copper-clad plate；
(3) the aluminum nitride ceramic substrate module prepared is embedded to the hole of silver-colored copper-clad plate；
(4) the silver-colored copper-clad plate for being embedded to aluminum nitride ceramic substrate is subjected to through-hole copper facing, obtains laser radar after encapsulation process
Sensor light communication module.
Testing laser radar sensor optical communication module thermal conductivity measures thermally conductive according to ASTME1461-11 standard method
Coefficient is in 150W/mK or more.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the embodiments can also be by appropriately combined, formation those skilled in the art
The other embodiments that member is understood that.The technical detail being not described in detail in the present invention can pass through appointing in this field
One prior art is realized.Particularly, all technical characterstics being not described in detail can pass through any prior art reality in the present invention
It is existing.
Claims (9)
1. a kind of ceramic substrate and polymer composite-base plate, which is characterized in that it is compound that the ceramic substrate is embedded to the macromolecule
Substrate installs IC chip on the ceramic substrate circuit layer being exposed.
2. a kind of ceramic substrate according to claim 1, which is characterized in that the ceramics are aluminium nitride, aluminium oxide, oxidation
Beryllium or silicon carbide.
3. a kind of ceramic substrate according to claim 1, which is characterized in that circuit, peace are modified in the ceramic substrate upper layer
IC chip is filled, layers of copper is modified by lower layer.
4. a kind of ceramic substrate according to claim 1, which is characterized in that the ceramic substrate is equipped with through hole, in hole
Copper is filled out in middle plating, is connected with upper layer circuit and lower layer's layers of copper, and heat can be conducted, and transmits signal.
5. a kind of polymer composite-base plate according to claim 1, which is characterized in that above and below the polymer composite-base plate
The equal copper electroplating layer of layer is macromolecule copper-clad plate.
6. a kind of polymer composite-base plate according to claim 1, which is characterized in that the polymeric substrate be FR-4,
MG, BT, PTFE or metal class substrate.
7. a kind of polymer composite-base plate according to claim 1, which is characterized in that the polymer composite-base plate punching
Thermally conductive copper post is filled in plating afterwards, is connected with the ceramic substrate lower layer layers of copper of insertion, can be conducted heat.
8. the preparation method of a kind of ceramic substrate according to claims 1 to 7 and polymer composite-base plate, feature exist
In including the following steps:
Ceramic substrate preparation step:
(1) it is punched on ceramic substrate；
(2) copper is filled out in the hole of ceramic substrate；
(3) in lower layer's copper electroplating layer of ceramic substrate, circuit is modified on upper layer；
(4) IC chip is installed on the upper layer of ceramic substrate.
Polymer composite-base plate preparation step:
(1) in polymeric substrate electroplating surface layers of copper, macromolecule copper-clad plate is made；
(2) it digs a hole in macromolecule copper-clad plate；
(3) by the hole of the ceramic substrate module prepared embedment macromolecule copper-clad plate；
(4) the macromolecule copper-clad plate for being embedded to ceramic substrate is subjected to through-hole copper facing, obtains Whole PC B module after encapsulation process.
9. a kind of ceramic substrate according to claims 1 to 8 and polymer composite-base plate, which is characterized in that the ceramics
Substrate and polymer composite-base plate overall structure are processed for telecommunications field component encapsulation, and the telecommunications field is preferred
5G communication field.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910323543.XA CN109951953A (en) | 2019-04-22 | 2019-04-22 | A kind of preparation method and application of ceramic substrate and polymer composite-base plate |
Applications Claiming Priority (1)
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| CN201910323543.XA CN109951953A (en) | 2019-04-22 | 2019-04-22 | A kind of preparation method and application of ceramic substrate and polymer composite-base plate |
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| JP2008227310A (en) * | 2007-03-14 | 2008-09-25 | Fujitsu Ltd | Hybrid substrate, electronic device having the same, and manufacturing method of hybrid substrate |
| US20080281008A1 (en) * | 2007-05-10 | 2008-11-13 | L'oreal | Composition in the foam form containing a polymeric structuring agent |
| CN102280569A (en) * | 2011-08-22 | 2011-12-14 | 佛山市国星光电股份有限公司 | High heat conducting substrate, light-emitting diode (LED) device and LED component |
| CN108566727A (en) * | 2018-06-29 | 2018-09-21 | 北京梦之墨科技有限公司 | A kind of electronic device and preparation method thereof based on BGA |
-
2019
- 2019-04-22 CN CN201910323543.XA patent/CN109951953A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008227310A (en) * | 2007-03-14 | 2008-09-25 | Fujitsu Ltd | Hybrid substrate, electronic device having the same, and manufacturing method of hybrid substrate |
| US20080281008A1 (en) * | 2007-05-10 | 2008-11-13 | L'oreal | Composition in the foam form containing a polymeric structuring agent |
| CN102280569A (en) * | 2011-08-22 | 2011-12-14 | 佛山市国星光电股份有限公司 | High heat conducting substrate, light-emitting diode (LED) device and LED component |
| CN108566727A (en) * | 2018-06-29 | 2018-09-21 | 北京梦之墨科技有限公司 | A kind of electronic device and preparation method thereof based on BGA |
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Application publication date: 20190628 |