CN109948595B - Fingerprint module, fingerprint lock and electronic equipment - Google Patents
Fingerprint module, fingerprint lock and electronic equipment Download PDFInfo
- Publication number
- CN109948595B CN109948595B CN201910304157.6A CN201910304157A CN109948595B CN 109948595 B CN109948595 B CN 109948595B CN 201910304157 A CN201910304157 A CN 201910304157A CN 109948595 B CN109948595 B CN 109948595B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- fingerprint
- module
- circuit
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The application relates to a fingerprint module, a fingerprint lock and electronic equipment, which comprises a first circuit board, a second circuit board, a fingerprint acquisition module and a fingerprint identification module, wherein a first circuit and a plurality of first pins are arranged on the first circuit board, a second circuit and a plurality of second pins are arranged on the second circuit board, one surface of the first circuit board is connected with one surface of the second circuit board, each first pin is connected with each second pin in a one-to-one correspondence manner, the fingerprint identification module is arranged on the first circuit board, the fingerprint acquisition module is electrically connected with the first circuit, the fingerprint acquisition module is arranged on one surface of the second circuit board, which is away from the first circuit board, and the fingerprint acquisition module is electrically connected with the second circuit. The conducting wire is omitted between the first circuit of the first circuit board and the second circuit of the second circuit board, so that the structure of the fingerprint module is more compact, the conducting wire is not required to be arranged in the installation of the fingerprint module, and the installation space required by the fingerprint module is smaller.
Description
Technical Field
The application relates to the technical field of fingerprint modules, in particular to a fingerprint module, a fingerprint lock and electronic equipment.
Background
The current fingerprint module comprises a collection module, a circuit board, a recognition module and the like, wherein the collection module is used for collecting fingerprints of users, the collection module is electrically connected with the circuit board through a conductive wire, and the recognition module is arranged on the circuit board and is used for recognizing the fingerprints collected by the collection module. The fingerprint module is complex in structure, and the conducting wires are difficult to arrange, so that the conducting wires occupy a large volume during installation, and the installation space required by the fingerprint module is large.
Disclosure of Invention
Based on this, it is necessary to provide a fingerprint module, a fingerprint lock and an electronic device.
The utility model provides a fingerprint module, includes first circuit board, second circuit board, fingerprint collection module and fingerprint identification module, be provided with first circuit and a plurality of first pin on the first circuit board, first pin with first circuit electricity is connected, be provided with second circuit and a plurality of second pin on the second circuit board, the second pin with second circuit electricity is connected, the cross-sectional area of first circuit board is greater than the cross-sectional area of second circuit board, one of them face of first circuit board with one of them face of second circuit board is connected, each first pin with each second pin one-to-one, and each first pin with each second pin one-to-one is connected, fingerprint identification module set up in on the first circuit board, fingerprint identification module with first circuit electricity is connected, fingerprint collection module set up in the second circuit board deviate from the one face of first circuit board, just fingerprint collection module with second circuit electricity is connected.
Foretell fingerprint module, through setting up first circuit board and second circuit board, first circuit board is used for installing fingerprint identification module, fingerprint identification module is connected with the first circuit electricity of first circuit board, the second circuit board is used for installing fingerprint acquisition module, fingerprint acquisition module is connected with the second circuit electricity of second circuit board, the first circuit of first circuit board is connected with the second pin electricity through first pin, because the second pin is connected with the second circuit electricity, first circuit and second circuit electricity connection has been realized from this, thereby realize fingerprint identification module with fingerprint acquisition module electricity is connected. The conducting wire is omitted between the first circuit of the first circuit board and the second circuit of the second circuit board, so that the structure of the fingerprint module is more compact, the conducting wire is not required to be arranged in the installation of the fingerprint module, and the installation space required by the fingerprint module is smaller.
In one embodiment, the fingerprint identification module is disposed on a surface of the first circuit board facing the second circuit board.
In one embodiment, a distance from a surface of the fingerprint acquisition module facing away from the first circuit board to the first circuit board is greater than or equal to a height of the fingerprint identification module protruding from the first circuit board.
In one embodiment, the height of the second circuit board protruding from the first circuit board is greater than or equal to the height of the fingerprint identification module protruding from the first circuit board.
In one embodiment, the projection of the second circuit board on the surface of the first circuit board is all on the first circuit board.
In one embodiment, the thickness of the second circuit board is greater than the thickness of the first circuit board.
In one embodiment, the circuit further comprises a power supply interface, wherein the power supply interface is arranged on the first circuit board and is electrically connected with the first circuit.
In one embodiment, the power supply interface is disposed on a surface of the first circuit board facing away from the second circuit board.
A fingerprint lock comprising a fingerprint module as described in any one of the above embodiments.
The electronic equipment comprises a first circuit board, a second circuit board, an input/output module and a processing module, wherein a first circuit and a plurality of first pins are arranged on the first circuit board, the first pins are electrically connected with the first circuit, a second circuit and a plurality of second pins are arranged on the second circuit board, the second pins are electrically connected with the second circuit, the cross-sectional area of the first circuit board is larger than that of the second circuit board, one face of the first circuit board is connected with one face of the second circuit board, the first pins are aligned with the second pins one by one, the first pins are connected with the second pins one by one, the processing module is arranged on the first circuit board, the processing module is electrically connected with the first circuit, the input/output module is arranged on the face, deviating from the first circuit board, of the second circuit board, and the input/output module is electrically connected with the second circuit.
Drawings
FIG. 1 is a schematic perspective view of a fingerprint module according to an embodiment;
FIG. 2 is a schematic cross-sectional view of a fingerprint module according to another embodiment;
FIG. 3 is an enlarged partial schematic view of FIG. 2A;
FIG. 4 is a schematic perspective view of a fingerprint lock according to an embodiment;
fig. 5 is a schematic view of a three-dimensional split structure of a fingerprint lock according to an embodiment.
Detailed Description
In order that the application may be readily understood, a more complete description of the application will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the application. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
In one embodiment, as shown in fig. 1, 2 and 3, a fingerprint module 10 includes a first circuit board 100, a second circuit board 200, a fingerprint acquisition module 300 and a fingerprint identification module 500, where a first circuit (not shown) and a plurality of first pins 110 are disposed on the first circuit board 100, the first pins are electrically connected with the first circuit, a second circuit (not shown) and a plurality of second pins 120 are disposed on the second circuit board 200, the second pins are electrically connected with the second circuit, a cross-sectional area of the first circuit board 100 is larger than a cross-sectional area of the second circuit board 200, one surface of the first circuit board 100 is connected with one surface of the second circuit board 200, each first pin 110 is aligned with each second pin 120, each first pin 110 is correspondingly connected with each second pin 120, the fingerprint identification module is disposed on the first circuit board 100, the fingerprint identification module is connected with the first circuit board 300 and the fingerprint module 300 is connected with the second circuit board 200.
In this embodiment, the first pin may also be referred to as a first pad, and the second pin may also be referred to as a second pad. In this embodiment, the fingerprint identification module is provided with a third pin, the first circuit board is provided with a fourth pin, the fourth pin is electrically connected with the first circuit, and the fingerprint identification module is electrically connected with the fourth pin through the third pin. The fingerprint acquisition module is provided with a fifth pin, the second circuit board is provided with a sixth pin, the sixth pin is electrically connected with the second circuit, and the fingerprint acquisition module is electrically connected with the sixth pin through the fifth pin.
Specifically, fingerprint collection module is used for gathering the fingerprint, and fingerprint identification module is used for acquireing the fingerprint that fingerprint collection module gathered and discerns. The fingerprint acquisition module is provided with an acquisition surface, the acquisition surface is arranged back to the second circuit board, and the fingerprint identification module is a fingerprint identification chip.
The first circuit board and the second circuit board are both PCB (Printed Circuit Board ) boards, and a first circuit is provided on the first circuit board, and the first circuit includes a plurality of electrical elements, such as capacitors, resistors, inductors, etc., that are connected to each other, and electrical elements that are required to form a circuit, that is, a first circuit, on the first circuit board, which belongs to those skilled in the art can understand and implement the present embodiment, and is not described in detail in this embodiment. The second circuit is arranged on the second circuit board and is used for electrically connecting the fingerprint acquisition module and the first pin, so that the fingerprint acquisition module can be electrically connected with the first circuit.
Referring to fig. 1, in the fingerprint module 10, by setting the first circuit board 100 and the second circuit board 200, the first circuit board 100 is used for installing a fingerprint identification module, the fingerprint identification module is electrically connected with a first circuit of the first circuit board, the second circuit board is used for installing a fingerprint acquisition module, the fingerprint acquisition module is electrically connected with a second circuit of the second circuit board, the first circuit of the first circuit board is electrically connected with the second pin through the first pin, and the second pin is electrically connected with the second circuit, so that the first circuit is electrically connected with the second circuit, thereby realizing the electrical connection of the fingerprint identification module and the fingerprint acquisition module. The conducting wire is omitted between the first circuit of the first circuit board and the second circuit of the second circuit board, so that the structure of the fingerprint module is more compact, the conducting wire is not required to be arranged in the installation of the fingerprint module, and the installation space required by the fingerprint module is smaller.
In addition, the second circuit board 200 is further used for bearing the fingerprint acquisition module 300, and the height of the fingerprint acquisition module 300 protruding from the first circuit board 100 is larger, the height of the second circuit board 200 can be increased to the height of the fingerprint acquisition module 300, so that the fingerprint acquisition module 300 can protrude from the first circuit board 100, and when the fingerprint module 10 is installed, the fingerprint acquisition module 300 can be more protruding from the outside of the device or exposed, and a user can conveniently contact the fingerprint acquisition module 300.
It should be understood that, since the fingerprint module 10 is only disposed on the outer side of the device, the fingerprint module 300 must be protruded from the circuit board to ensure that the fingerprint module is located closer to the outer side, while the current standard fingerprint module 300 is thinner than other electronic components, so that when there is only one circuit board, the fingerprint module 300 cannot be separately improved, and the thickness of the fingerprint module 300 itself is increased, which increases more production cost, because the fingerprint module 300 belongs to an integrated circuit, and the structure thereof is difficult to adjust. In the present application, the cross-sectional area of the first circuit board 100 is larger than that of the second circuit board 200, and the electronic components can be disposed on the side of the first circuit board 100 facing the second circuit board 200, so that the installation space of the first circuit board 100 is fully utilized, the whole fingerprint module 10 is more compact, the distance from the side of the fingerprint module facing away from the first circuit board 100 to the first circuit board 100 is larger by the second circuit board 200, and the cost for adjusting the thickness of the second circuit board 200 is lower than that for adjusting the fingerprint acquisition module 300.
In addition, in the present application, if the distance from the side of the fingerprint acquisition module 300 facing away from the first circuit board 100 to the first circuit board 100 needs to be adjusted, the adjustment can be achieved by adjusting the thickness of the second circuit board 200, and since the second circuit board 200 is only used for carrying the fingerprint acquisition module 300, the cross-sectional area is smaller than that of the first circuit board 100, so that the cost for adjusting the thickness of the second circuit board 200 is lower. It should be appreciated that in the case where only one circuit board is used to carry the fingerprint acquisition module 300 and the fingerprint acquisition module 300, the circuit board has a larger cross-sectional area than the fingerprint acquisition module 300, and thus, a larger cross-sectional area of the circuit board and a larger thickness of the circuit board consumes more cost.
In order to implement the fingerprint recognition module, as shown in fig. 2, in one embodiment, the fingerprint recognition module 500 is disposed on a surface of the first circuit board 100 facing the second circuit board 200, so as to implement the fingerprint recognition module.
Specifically, the fingerprint identification module is a singlechip, the first circuit board is further provided with a plurality of circuit elements, the singlechip with circuit elements respectively with first circuit electricity is connected, the singlechip set up in first circuit board orientation the one side of second circuit board, a plurality of circuit elements distribute in first circuit board orientation the one side of second circuit board and back to the one side of second circuit board.
In another embodiment, the fingerprint recognition module is disposed on a surface of the first circuit board opposite to the second circuit board, so as to implement the fingerprint recognition module.
As shown in fig. 4 and 5, in one embodiment, a fingerprint lock 11 is provided, which includes a lock body 810 and a panel 820, wherein an installation space 811 is formed in the lock body 810, the installation space 811 has an opening 812, the panel 820 is connected with the lock body 810, the panel 820 seals the opening 812, the panel 820 has a through opening 821, the through opening 821 is communicated with the installation space 811, the fingerprint module 10 is disposed in the installation space 811, the fingerprint acquisition module 300 is disposed in the through opening 821 in a penetrating manner, and the fingerprint acquisition module 300 is exposed in the installation space 811 through the through opening 821.
To better mount the fingerprint acquisition module 300, as shown in fig. 1 and 2, in one embodiment, a distance from a side of the fingerprint acquisition module 300 facing away from the first circuit board 100 to the first circuit board 100 is greater than or equal to a height of the fingerprint identification module protruding from the first circuit board 100. In one embodiment, the distance from the side of the fingerprint collection module 300 facing away from the first circuit board 100 to the first circuit board 100 is greater than the height of the fingerprint identification module 500 protruding from the first circuit board 100, and in this embodiment, when the fingerprint module 10 is disposed in a lock body 810, the fingerprint collection module 300 is better close to the through hole 821, and is closer to the outside of the fingerprint lock 11, so that the user can press the fingerprint collection module 300 conveniently, and the fingerprint of the user can be collected conveniently.
In one embodiment, the distance from the side of the fingerprint collection module away from the first circuit board to the first circuit board is equal to the height of the fingerprint identification module protruding from the first circuit board, and when the fingerprint module is arranged in a lock body, the fingerprint collection module is enabled to be closer to the through hole, so that in the embodiment, when the fingerprint module is arranged in the lock body, the fingerprint collection module can be enabled to be closer to the through hole. That is, the condition that the fingerprint identification module is propped against the panel and the fingerprint collection module cannot be close to the through hole is avoided.
To better enable the fingerprint acquisition module 300 to be disposed near the through hole 821, as shown in fig. 1 and 2, in one embodiment, the height of the second circuit board 200 protruding from the first circuit board 100 is greater than or equal to the height of the fingerprint identification module protruding from the first circuit board 100. Thus, the fingerprint collection module 300 with any thickness can be better close to the through hole 821 to avoid being blocked by the fingerprint identification module.
In order to realize the electrical connection between the first pin and the second pin, in one embodiment, the first pin is soldered to the second pin, in this embodiment, the first pin is soldered to the second pin, so as to realize the electrical connection between the first pin and the second pin, and in particular, the first pin and the second pin are connected through a solder paste layer 101. Specifically, the solder paste layer 101 is made of solder paste.
In order to make the first circuit board 100 better carry the second circuit board 200, as shown in fig. 1 and 2, in one embodiment, the projection of the second circuit board 200 on the surface where the first circuit board 100 is located falls on the first circuit board 100, specifically, the first circuit board 100 has a mounting surface, the second circuit board 200 is disposed on the mounting surface of the first circuit board 100, and the projection of the first circuit board on the mounting surface is all located in the mounting surface. One side of the second circuit board 200 overlaps the first circuit board 100, so that the first circuit board 100 better carries the second circuit board 200.
In one embodiment, the second circuit board 200 is disposed in the middle of the first circuit board 100, that is, the second circuit board 200 is disposed in the middle of one surface of the first circuit board 100. In this embodiment, the second circuit board 200 is disposed on the mounting surface of the first circuit board 100, which is favorable to the uniform distribution of the electrical components on the first circuit board 100, is favorable to heat dissipation, and avoids heat concentration.
In order to make the connection between the second circuit board 200 and the first circuit board 100 more stable, in one embodiment, the second circuit board 200 is attached to the first circuit board 100, and in one embodiment, the second circuit board 200 is connected to the first circuit board 100 through an adhesive, that is, the second circuit board 200 is connected to the mounting surface of the first circuit board through an adhesive. In this embodiment, in addition to the interconnection of the first pin and the second pin, the adhesion between the first circuit board 100 and the second circuit board 200 can make the connection between the two more stable.
In one embodiment, the adhesive is disposed at the edge of the second circuit board 200, that is, the adhesive is disposed around the edge of the second circuit board 200, in this embodiment, the edge of the side of the second circuit board 200 facing the first circuit board 100 is connected to the mounting surface of the first circuit board 100 through the adhesive, so that the adhesive not only can connect the first circuit board 100 and the second circuit board 200, but also can seal the first pin and the second pin between the second circuit board and the first circuit board, so as to effectively avoid dust or moisture from entering, and avoid a short circuit between the first pin and the second pin, and in addition, can insulate the first pin and the second pin from the outside.
To perform the function of the glue, in one embodiment the glue is a resin. In one embodiment, the adhesive is an epoxy. One embodiment is that the adhesive is silicon rubber, and one embodiment is that the adhesive is QIS-3003.
In order to bring the fingerprint acquisition module 300 closer to the through opening 821 while avoiding excessive costs, as shown in fig. 1 and 2, in one embodiment, the thickness of the second circuit board 200 is greater than the thickness of the first circuit board 100. If the distance from the side of the fingerprint acquisition module 300 facing away from the first circuit board 100 to the first circuit board 100 needs to be adjusted, the adjustment can be achieved by adjusting the thickness of the second circuit board 200, and the second circuit board 200 is only used for bearing the fingerprint acquisition module 300, so that the cross-sectional area is smaller than that of the first circuit board 100, and the cost for adjusting the thickness of the second circuit board 200 is lower. In this embodiment, the thickness of the second circuit board 200 is adjusted to be thicker, so that the fingerprint acquisition module 300 is disposed closer to the through hole 821, while the area of the first circuit board 100 is larger, and the thickness of the first circuit board is made thinner, thereby avoiding excessive cost.
In order to supply power to the fingerprint module, as shown in fig. 1 and 2, in one embodiment, the fingerprint module further includes a power supply interface 400, where the power supply interface 400 is disposed on the first circuit board 100, and the power supply interface 400 is electrically connected to the first circuit, and the power supply interface 400 is electrically connected to a power supply, so as to supply power to the fingerprint module.
In order to avoid the second circuit board 200 having an excessively high thickness, in one embodiment, the power supply interface 400 is disposed on a side of the first circuit board 100 facing away from the second circuit board 200. It should be understood that, the current power supply interfaces 400 include Mini USB, micro USB, type-C, etc., and the thicknesses of these power supply interfaces 400 are all larger, if the power supply interfaces 400 are disposed on the side of the first circuit board 100 facing the second circuit board 200, the distance from the side of the fingerprint acquisition module 300 facing away from the first circuit board 100 to the first circuit board 100 needs to be equal to the height of the power supply interfaces 400 protruding from the first circuit board 100, so that the fingerprint acquisition module 300 can be disposed close to the through hole 821, however, if such an arrangement is adopted, the second circuit board 200 needs to have a larger thickness, so that the manufacturing cost of the second circuit board 200 will be excessively increased. In this embodiment, the power supply interface 400 with a larger thickness is disposed on the side of the first circuit board 100 facing away from the second circuit board 200, and the second circuit board 200 does not need to be made with a larger thickness, so that the fingerprint acquisition module 300 can be disposed close to the through hole 821, thereby reducing the cost of the fingerprint module 10.
In one embodiment, a fingerprint lock 11 is provided, comprising a fingerprint module 10 as described in any of the embodiments above.
It should be understood that the foregoing description is made with reference to the structure of the fingerprint lock as an embodiment, but the fingerprint module is not limited to the fingerprint lock, but may be applied to other technical fields, and the fingerprint module may be installed in other devices and used for collecting and identifying fingerprints of a user.
In one embodiment, an electronic device is provided, including a first circuit board, a second circuit board, an input/output module and a processing module, a first circuit and a plurality of first pins are disposed on the first circuit board, the first pins are electrically connected with the first circuit, a second circuit and a plurality of second pins are disposed on the second circuit board, the second pins are electrically connected with the second circuit, a cross-sectional area of the first circuit board is larger than a cross-sectional area of the second circuit board, one of the first circuit board is connected with one of the second circuit board, each first pin is aligned with each second pin one by one, each first pin is connected with each second pin one by one, the processing module is disposed on the first circuit board, the processing module is electrically connected with the first circuit, the input/output module is disposed on one side of the second circuit board facing away from the first circuit board, and the input/output module is electrically connected with the second circuit.
It should be understood that the input/output module may be an input module, an output module, or both an input and output module, and the input/output module may also be referred to as an I/O module (I/O).
In one embodiment, the input/output module includes an input module, and in this embodiment, the processing module is configured to receive a signal of the input/output module. In one embodiment, the input/output module includes a mechanical key. In one embodiment, the input/output module includes a touch key. In one embodiment, the input/output module includes a microphone. In one embodiment, the input/output module includes a fingerprint acquisition module, and the processing module includes a fingerprint identification module.
In one embodiment, the input/output module includes an output module, and in this embodiment, the processing module is configured to send a signal to the input/output module. In one embodiment, the input/output module includes a display screen. In one embodiment, the input/output module includes a speaker.
In one embodiment, the input/output module includes an input module and an output module, and in this embodiment, the processing module is configured to send a signal to the input/output module and is configured to receive the signal from the input/output module. In this embodiment, the input/output module may also be referred to as an input/output module, or as an IO module, or as an interaction module. In one embodiment, the input/output module includes a touch screen. In one embodiment, the input/output module is a fingerprint acquisition module, and in one embodiment, the processing module is a fingerprint identification module, which may also be referred to as a fingerprint identification processing module.
Compared with the traditional connection method through the conductive wire, the electronic device in the embodiment omits the conductive wire, so that the overall structure of the electronic device is more compact, in addition, the conductive wire is easy to damage, the electronic device omitting the conductive wire is more durable, meanwhile, the distance from one surface of the input/output module, which is away from the first circuit board, to the first circuit board can be increased through the second circuit board, and when the electronic device is arranged in a shell, the input/output module can be borne through the second circuit board, so that the input/output module is closer to the outside of the shell.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (10)
1. The fingerprint module is characterized by comprising a first circuit board, a second circuit board, a fingerprint acquisition module and a fingerprint identification module, wherein a first circuit and a plurality of first pins are arranged on the first circuit board, the first pins are electrically connected with the first circuit, a second circuit and a plurality of second pins are arranged on the second circuit board, the second pins are electrically connected with the second circuit, the cross-sectional area of the first circuit board is larger than that of the second circuit board, one surface of the first circuit board is connected with one surface of the second circuit board, the first pins are aligned with the second pins one by one, the first pins are connected with the second pins one by one, the fingerprint identification module is arranged on the first circuit board, the fingerprint identification module is electrically connected with the first circuit, the fingerprint acquisition module is arranged on one surface of the second circuit board, which is far away from the first circuit board, and the fingerprint acquisition module is connected with the second circuit. The fingerprint identification module is provided with a third pin, the first circuit board is provided with a fourth pin, the fourth pin is electrically connected with the first circuit, and the fingerprint identification module is electrically connected with the fourth pin through the third pin; the fingerprint acquisition module is provided with a fifth pin, the second circuit board is provided with a sixth pin, the sixth pin is electrically connected with the second circuit, and the fingerprint acquisition module is electrically connected with the sixth pin through the fifth pin.
2. The fingerprint module of claim 1, wherein the fingerprint recognition module is disposed on a surface of the first circuit board facing the second circuit board.
3. The fingerprint module of claim 2, wherein a distance from a side of the fingerprint acquisition module facing away from the first circuit board to the first circuit board is greater than or equal to a height of the fingerprint identification module protruding from the first circuit board.
4. The fingerprint module of claim 2, wherein the height of the second circuit board protruding from the first circuit board is greater than or equal to the height of the fingerprint identification module protruding from the first circuit board.
5. The fingerprint module of claim 1, wherein the projection of the second circuit board onto the face of the first circuit board is entirely on the first circuit board.
6. The fingerprint module of any one of claims 1-5, wherein the second circuit board has a thickness greater than a thickness of the first circuit board.
7. The fingerprint module of any one of claims 1-5, further comprising a power interface disposed on the first circuit board, the power interface electrically connected to the first circuit.
8. The fingerprint module of claim 7, wherein the power interface is disposed on a side of the first circuit board facing away from the second circuit board.
9. A fingerprint lock comprising a fingerprint module as claimed in any one of claims 1 to 8.
10. The electronic equipment is characterized by comprising a first circuit board, a second circuit board, an input/output module and a processing module, wherein a first circuit and a plurality of first pins are arranged on the first circuit board, the first pins are electrically connected with the first circuit, a second circuit and a plurality of second pins are arranged on the second circuit board, the second pins are electrically connected with the second circuit, the cross-sectional area of the first circuit board is larger than that of the second circuit board, one surface of the first circuit board is connected with one surface of the second circuit board, the first pins are aligned with the second pins one by one, the first pins are connected with the second pins one by one, the processing module is arranged on the first circuit board, the processing module is electrically connected with the first circuit, the input/output module is arranged on one surface of the second circuit board, which is away from the first circuit board, and the input/output module is connected with the second circuit; the fingerprint identification module is provided with a third pin, the first circuit board is provided with a fourth pin, the fourth pin is electrically connected with the first circuit, and the fingerprint identification module is electrically connected with the fourth pin through the third pin; the fingerprint acquisition module is provided with a fifth pin, the second circuit board is provided with a sixth pin, the sixth pin is electrically connected with the second circuit, and the fingerprint acquisition module is electrically connected with the sixth pin through the fifth pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910304157.6A CN109948595B (en) | 2019-04-16 | 2019-04-16 | Fingerprint module, fingerprint lock and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910304157.6A CN109948595B (en) | 2019-04-16 | 2019-04-16 | Fingerprint module, fingerprint lock and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109948595A CN109948595A (en) | 2019-06-28 |
| CN109948595B true CN109948595B (en) | 2023-09-12 |
Family
ID=67015386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910304157.6A Active CN109948595B (en) | 2019-04-16 | 2019-04-16 | Fingerprint module, fingerprint lock and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109948595B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206557803U (en) * | 2017-03-21 | 2017-10-13 | 上海图正信息科技股份有限公司 | A kind of fingerprint recognition module and terminal |
| EP3309667A1 (en) * | 2016-10-11 | 2018-04-18 | Samsung Electronics Co., Ltd. | Electronic device having plurality of fingerprint sensing modes and method for controlling the same |
-
2019
- 2019-04-16 CN CN201910304157.6A patent/CN109948595B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3309667A1 (en) * | 2016-10-11 | 2018-04-18 | Samsung Electronics Co., Ltd. | Electronic device having plurality of fingerprint sensing modes and method for controlling the same |
| CN206557803U (en) * | 2017-03-21 | 2017-10-13 | 上海图正信息科技股份有限公司 | A kind of fingerprint recognition module and terminal |
Non-Patent Citations (1)
| Title |
|---|
| 指纹模组制作工艺改进及效率提升研究;邱在良;《中国优秀硕士论文全文数据库信息科技辑》;I138-1013 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109948595A (en) | 2019-06-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112514546B (en) | Electronic device comprising shielding member | |
| CN103715493B (en) | Composite module and include the electronic equipment of this composite module | |
| US6392899B1 (en) | Processor power delivery system | |
| US8254145B2 (en) | Electronic device with expansion card modules | |
| CN1135798A (en) | Liquid crystal display, its mounting structure and electronic device | |
| US8559189B2 (en) | Riser card for power supply | |
| TWI405366B (en) | Wireless communciating devide and portable electronic apparatus using the same | |
| CN102377949B (en) | Image sensing module and camera module | |
| CN109948595B (en) | Fingerprint module, fingerprint lock and electronic equipment | |
| EP3933697A1 (en) | Biometric imaging module and method for manufacturing a biometric imaging module | |
| US9439286B2 (en) | Connecting device for electronic component of electronic device | |
| CN208888836U (en) | Fingerprint recognition component and electronic equipment | |
| CN209731710U (en) | A kind of terminal device | |
| US6888064B2 (en) | Modular packaging arrangements and methods | |
| CN110461086A (en) | A kind of circuit board, circuit board manufacturing method and terminal | |
| CN209607002U (en) | Fingerprint mould group, Fingerprint Lock and electronic equipment | |
| CN108848437A (en) | Loudspeaker mould group | |
| CN109409486A (en) | A kind of smart card and its processing method | |
| CN202565603U (en) | Mobile Terminal and enclosure thereof | |
| CN109117695A (en) | Fingerprint mould group and electronic equipment equipped with the fingerprint mould group | |
| CN209748899U (en) | Circuit board | |
| CN208434105U (en) | Loudspeaker mould group | |
| US20080311792A1 (en) | Usb connector device, connector module and method for fabricating usb connector device | |
| CN213818111U (en) | Assembly structure and electronic device comprising same | |
| CN219801246U (en) | Electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |