CN109948595A - Fingerprint mould group, Fingerprint Lock and electronic equipment - Google Patents
Fingerprint mould group, Fingerprint Lock and electronic equipment Download PDFInfo
- Publication number
- CN109948595A CN109948595A CN201910304157.6A CN201910304157A CN109948595A CN 109948595 A CN109948595 A CN 109948595A CN 201910304157 A CN201910304157 A CN 201910304157A CN 109948595 A CN109948595 A CN 109948595A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- line plate
- fingerprint
- circuit
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The present invention relates to fingerprint mould groups, Fingerprint Lock and electronic equipment, including first line plate, second wiring board, finger print acquisition module and fingerprint identification module, the first circuit and multiple first pins are provided on first line plate, second circuit and multiple second pins are provided on second wiring board, first line plate wherein with the second wiring board wherein while connect, each first pin connects one to one with each second pin, fingerprint identification module is set on first line plate, fingerprint identification module is electrically connected with the first circuit, finger print acquisition module is set to the one side that the second wiring board deviates from first line plate, and finger print acquisition module is electrically connected with second circuit.Conductor wire is omitted between first circuit of first line plate and the second wiring board second circuit, so that the structure of fingerprint mould group is more compact, above-mentioned fingerprint mould group is installed and does not need to carry out winding displacement to conductor wire, so that installation space needed for fingerprint mould group is smaller.
Description
Technical field
The present invention relates to fingerprint mould technical group fields, more particularly to fingerprint mould group, Fingerprint Lock and electronic equipment.
Background technique
Current fingerprint mould group includes that the part such as acquisition module, wiring board and identification module forms, and acquisition module is for adopting
Collect the fingerprint of user, acquisition module is set on wiring board by conductor wire and circuit board electrical connection, identification module, and for knowing
The other collected fingerprint of acquisition module.The structure of this fingerprint mould group is complex, it is difficult to winding displacement is carried out to conductor wire, so that
Conductor wire occupies biggish volume during installation, so that the installation space that fingerprint mould group needs is larger.
Summary of the invention
Based on this, it is necessary to provide a kind of fingerprint mould group, Fingerprint Lock and electronic equipment.
A kind of fingerprint mould group, including first line plate, the second wiring board, finger print acquisition module and fingerprint identification module, institute
It states and is provided with the first circuit and multiple first pins on first line plate, first pin is electrically connected with first circuit,
Second circuit and multiple second pins are provided on second wiring board, second pin is electrically connected with the second circuit
It connects, the area of section of the first line plate is greater than the area of section of second wiring board, and the first line plate is wherein
With second wiring board wherein while connect, each first pin is aligned one by one with each second pin, and
Each first pin connects one to one with each second pin, and the fingerprint identification module is set to the first line
On plate, the fingerprint identification module is electrically connected with first circuit, and the finger print acquisition module is set to second route
One side of the backboard from the first line plate, and the finger print acquisition module is electrically connected with the second circuit.
Above-mentioned fingerprint mould group, by setting first line plate and the second wiring board, first line plate is for installing fingerprint
Identification module, fingerprint identification module are electrically connected with the first circuit of first line plate, and the second wiring board is for installing fingerprint collecting
Module, finger print acquisition module are electrically connected with the second circuit of the second wiring board, and the first circuit of first line plate passes through the first pipe
Foot is electrically connected with the second pin, since the second pin is electrically connected with second circuit, it is thus achieved that the first circuit and second circuit
Electrical connection, to realize that fingerprint identification module is electrically connected with the finger print acquisition module.First circuit of first line plate in this way
And second be omitted conductor wire between wiring board second circuit, so that the structure of fingerprint mould group is more compact, installs above-mentioned fingerprint
Mould group does not need to carry out winding displacement to conductor wire, so that installation space needed for fingerprint mould group is smaller.
The fingerprint identification module is set to the first line plate towards second line in one of the embodiments,
The one side of road plate.
The finger print acquisition module is away from the one side of the first line plate to described first in one of the embodiments,
The distance of wiring board is greater than or equal to the height that the fingerprint identification module is raised in the first line plate.
The height that second wiring board is raised in the first line plate in one of the embodiments, is greater than or equal to
The fingerprint identification module is raised in the height of the first line plate.
Projection of second wiring board on the face where the first line plate is whole in one of the embodiments,
It falls on the first line plate.
The thickness of second wiring board is greater than the thickness of the first line plate in one of the embodiments,.
It in one of the embodiments, further include power supply interface, the power supply interface is set on the first line plate,
And the power supply interface is electrically connected with first circuit.
The power supply interface is set to the first line backboard from second wiring board in one of the embodiments,
One side.
A kind of Fingerprint Lock, including the fingerprint mould group as described in above-mentioned any embodiment.
A kind of electronic equipment, including first line plate, the second wiring board, input/output module and processing module, described
The first circuit and multiple first pins are provided on one wiring board, first pin is electrically connected with first circuit, described
Second circuit and multiple second pins are provided on second wiring board, second pin is electrically connected with the second circuit, institute
State first line plate area of section be greater than second wiring board area of section, the first line plate wherein one side with
The wherein one side of second wiring board connects, and each first pin is aligned one by one with each second pin, and each described
First pin connects one to one with each second pin, and the processing module is set on the first line plate, described
Processing module is electrically connected with first circuit, and the input/output module is set to second wiring board away from described the
The one side of one wiring board, and the input/output module is electrically connected with the second circuit.
Detailed description of the invention
Fig. 1 is the schematic perspective view of the fingerprint mould group of one embodiment；
Fig. 2 is the schematic diagram of the section structure of the fingerprint mould group of another embodiment；
Fig. 3 is the partial enlargement diagram in Fig. 2 at A；
Fig. 4 is the schematic perspective view of the Fingerprint Lock of one embodiment；
Fig. 5 is the three-dimensional separate structure schematic diagram of the Fingerprint Lock of one embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give better embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant listed item.
In one of the embodiments, as shown in Figure 1, Figure 2 and Figure 3, a kind of fingerprint mould group 10, including first line plate
100, the second wiring board 200, finger print acquisition module 300 and fingerprint identification module 500 are provided on the first line plate 100
First circuit (not shown) and multiple first pins 110, first pin are electrically connected with first circuit, second line
Second circuit (not shown) and multiple second pins 120, second pin and second circuit electricity are provided on road plate 200
Connection, the area of section of the first line plate 100 are greater than the area of section of second wiring board 200, the first line
Plate 100 wherein with second wiring board 200 wherein while connect, each first pin 110 and each described the
Two pins 120 are aligned one by one, and each first pin 110 connects one to one with each second pin 120, the fingerprint
Identification module is set on the first line plate 100, and the fingerprint identification module is electrically connected with first circuit, the finger
Line acquisition module 300 is set to the one side that second wiring board 200 deviates from the first line plate 100, and the fingerprint is adopted
Collection module 300 is electrically connected with the second circuit.
In the present embodiment, first pin is referred to as the first pad, and second pin is referred to as second
Pad.In the present embodiment, the fingerprint identification module is provided with third pin, and the first line plate is provided with the 4th pin,
4th pin is electrically connected with first circuit, and the fingerprint identification module passes through the third pin and the 4th pipe
Foot electrical connection.The finger print acquisition module is provided with the 5th pin, and second wiring board is provided with the 6th pin, and the described 6th
Pin is electrically connected with the second circuit, and the finger print acquisition module is electrically connected by the 5th pin with the 6th pin
It connects.
Specifically, finger print acquisition module is for acquiring fingerprint, and fingerprint identification module is for obtaining finger print acquisition module acquisition
Fingerprint and identified.Finger print acquisition module has a collection surface, which is arranged backwards to second wiring board, this refers to
Line identification module is fingerprint recognition chip.
First line plate and the second wiring board are PCB (Printed Circuit Board, printed circuit board) plate, should
The first circuit is provided on first line plate, which includes multiple electrical components interconnected, such as capacitor, resistance
Or electrical component needed for inductance etc., and composition circuit, these electrical components connect the circuit to be formed on first line plate, i.e.,
First circuit, belong to skilled artisans appreciate that and realize, not burdensome description in the present embodiment.Second line
Second circuit is set on the plate of road, and second circuit is for being electrically connected finger print acquisition module and the first pin, so that fingerprint collecting
Module can be electrically connected with the first circuit.
Referring to Fig. 1, above-mentioned fingerprint mould group 10, by setting first line plate 100 and the second wiring board 200, first
Wiring board 100 is for installing fingerprint identification module, and fingerprint identification module is electrically connected with the first circuit of first line plate, the second line
Road plate is for installing finger print acquisition module, and finger print acquisition module is electrically connected with the second circuit of the second wiring board, first line plate
The first circuit be electrically connected with the second pin by the first pin, since the second pin is electrically connected with second circuit, be achieved in
First circuit is electrically connected with second circuit, to realize that fingerprint identification module is electrically connected with the finger print acquisition module.In this way
Conductor wire is omitted between first circuit of first line plate and the second wiring board second circuit, so that the structure of fingerprint mould group is more
Step up to gather, above-mentioned fingerprint mould group is installed and does not need to carry out winding displacement to conductor wire, so that installation space needed for fingerprint mould group is smaller.
In addition, the second wiring board 200 is also used to carry finger print acquisition module 300, and finger print acquisition module 300 is protruded
Bigger in the height of first line plate 100, the height of the second wiring board 200 can increase the height of finger print acquisition module 300, so that
Finger print acquisition module 300 can protrude from first line plate 100, and then when installing fingerprint mould group 10, can make fingerprint collecting
Module 300 can more be raised in the outside or exposed of equipment, and user is facilitated to contact finger print acquisition module 300.
It should be understood that there was only finger print acquisition module 300 due to fingerprint mould group 10 is the outside that equipment is arranged in,
Finger print acquisition module 300 must be raised in wiring board setting, just can guarantee acquisition module closer to outside position, and it is current
300 thinner thickness of standard fingerprint acquisition module, it is thinner than some other electronic component, therefore in only one wiring board, nothing
Acquisition module and other electronic components are arranged on the same face of assist side method, and individually improve finger print acquisition module 300, make
The thickness for obtaining finger print acquisition module 300 itself increases, and will increase more production cost, this is because finger print acquisition module
300 belong to integrated circuit, it is difficult to be adjusted to its structure.In the application, the area of section of the first line plate 100 is greater than
The area of section of second wiring board 200, first line plate 100 are in that electricity can be also arranged in the one side of the second wiring board 200 of direction
Subcomponent, makes full use of the installation space of first line plate 100, thus enable the structure of entire fingerprint mould group 10 more compact, the
Two wiring boards 200 can enable fingerprint module bigger away from the distance of one side to the first line plate 100 of the first line plate 100,
The thickness cost for adjusting the second wiring board 200 is low compared to the cost for adjusting finger print acquisition module 300.
In addition, deviating from the one side of the first line plate 100 if necessary to adjust finger print acquisition module 300 in the application
To the distance of first line plate 100, can be realized by adjusting the thickness of the second wiring board 200, due to the second wiring board 200
For carrying finger print acquisition module 300, area of section is smaller than first line plate 100, to adjust the thickness of the second wiring board 200
Cost is relatively low.It should be understood that carrying finger print acquisition module 300 and finger print acquisition module in only one wiring board
In the case where 300, since the area of section of wiring board can be greater than the area of section of finger print acquisition module 300, wiring board
Area of section is also larger, and the biggish wiring board of area of section, more cost will be consumed by being further added by thickness.
The fingerprint identification module is set to realize, as shown in Fig. 2, the fingerprint recognition in one of the embodiments,
Module 500 is set to the first line plate 100 towards the one side of second wiring board 200, to realize the setting finger
Line identification module.
Specifically, the fingerprint identification module is single-chip microcontroller, and the first line plate is additionally provided with multiple circuit elements, institute
It states single-chip microcontroller and is electrically connected respectively with first circuit with the circuit element, the single-chip microcontroller is set to the first line plate
Towards the one side of second wiring board, multiple circuit elements are distributed in the first line plate towards second route
Plate and backwards to second wiring board while.
In another embodiment, the fingerprint identification module is set to the first line backboard to second route
The one side of plate, to realize the setting fingerprint identification module.
As shown in Figure 4 and Figure 5, in one embodiment, a kind of Fingerprint Lock 11, including lock body 810 and panel 820 are provided,
Installation space 811 is offered in the lock body 810, the installation space 811 has opening 812, the panel 820 and the lock
Body 810 connects, and the panel 820 closes the opening 812, and the panel 820 offers port 821, the port 821 with
The installation space 811 is connected to, and the fingerprint mould group 10 is set in the installation space 811, the finger print acquisition module 300
It is arranged in the port 821, and finger print acquisition module 300 exposes to installation space 811 by port 821.
Preferably to install the finger print acquisition module 300, as depicted in figs. 1 and 2, institute in one of the embodiments,
The distance that finger print acquisition module 300 is stated away from one side to the first line plate 100 of the first line plate 100 is greater than or waits
The height of the first line plate 100 is raised in the fingerprint identification module.The fingerprint is adopted in one of the embodiments,
The distance for collecting module 300 away from one side to the first line plate 100 of the first line plate 100 is greater than the fingerprint recognition
Module 500 is raised in the height of the first line plate 100, in the present embodiment, when the fingerprint mould group 10 is arranged in a lock body
When in 810, so that finger print acquisition module 300 is convenient for user closer to the outside of Fingerprint Lock 11 better close to port 821
Finger print acquisition module 300 is pressed, convenient for acquisition user fingerprints.
The finger print acquisition module is away from the one side of the first line plate to described first in one of the embodiments,
The distance of wiring board is equal to the height that the fingerprint identification module is raised in the first line plate, when the fingerprint mould group is arranged
When in a lock body, so that finger print acquisition module is better close to port, so that, in the present embodiment, when the fingerprint
When mould group is arranged in a lock body, enable finger print acquisition module close to port.That is, fingerprint identification module is avoided to be against
On the panel, and the case where make fingerprint collecting mould group can not be close to port.
For the finger print acquisition module 300 is arranged close to port 821, as depicted in figs. 1 and 2, wherein
In one embodiment, the height that second wiring board 200 is raised in the first line plate 100 is greater than or equal to the fingerprint
Identification module is raised in the height of the first line plate 100.In this way, using the finger print acquisition module 300 of any thickness
So that finger print acquisition module 300 is arranged better close to port 821, the case where being interfered by fingerprint identification module is avoided.
To realize that first pin is electrically connected with second pin, described first manage in one of the embodiments,
Foot and second pin weld, and in the present embodiment, first pin is connect with the second pin soldering, to realize institute
It states the first pin to be electrically connected with second pin, specifically, first pin and second pin pass through a tin paste layer
101 connections.Specifically, the tin paste layer 101 is made of tin cream.
To carry the first line plate 100 preferably to the second wiring board 200, as depicted in figs. 1 and 2,
Projection of second wiring board 200 on the face where the first line plate 100 in one of the embodiments, is all fallen
On the first line plate 100, specifically, first line plate 100 has a mounting surface, and second wiring board 200 is arranged
In on the mounting surface of the first line plate 100, projection of the first line plate on the mounting surface is entirely located in installation
In face.The one side of second wiring board 200 is Chong Die with the first line plate 100, so that the first line plate 100
Preferably the second wiring board 200 is carried.
In one embodiment, second wiring board 200 is set to the middle part of the first line plate 100, i.e., described
Second wiring board 200 is set to the middle part of the one side of the first line plate 100.In the present embodiment, second wiring board 200
It is set to the mounting surface of the first line plate 100, in this way, being conducive to uniform point of 100 electrical component on first line plate
Cloth is conducive to radiate, heat is avoided to concentrate, additionally it is possible to first line plate 100 is made to be easily installed and fix, so that the
One wiring board 100 to the support effect of the second wiring board 200 more preferably.
In order to enable the connection of the second wiring board 200 and first line plate 100 is more firm, in one embodiment, the
The attaching of two wiring boards 200 is set to first line plate 100, and in one embodiment, the second wiring board 200 passes through viscose glue and first
Wiring board 100 connects, i.e. the second wiring board 200 is connect by viscose glue with the mounting surface of first line plate.In the present embodiment, in addition to
The interconnection of first pin and the second pin, the bonding between first line plate 100 and the second wiring board 200 enable to two
Connection between person is more firm.
In one embodiment, the viscose glue is set to the edge of second wiring board 200, i.e., the described viscose glue is around described
The edge of second wiring board 200 is arranged, in the present embodiment, the second wiring board 200 towards first line plate 100 one side edge
It is connect by viscose glue with the mounting surface of first line plate 100, in this way, viscose glue can not only be by first line plate 100 and the second line
Road plate 200 connect, additionally it is possible to between the second wiring board and first line plate the first pin and the second pin be sealed,
It effectively avoids dust or moisture from entering, avoids the short circuit between the first pin and the second pin, additionally it is possible to make the
One pin and the second pin and exterior insulation.
For the function of realizing the viscose glue, in one embodiment, viscose glue is resin.One embodiment is the viscose glue
For epoxy resin.One embodiment is that the viscose glue is silicon rubber, and one embodiment is the model QIS- of the viscose glue
3003。
In order to enable finger print acquisition module 300 is closer to port 821, and avoids cost excessively high simultaneously, such as Fig. 1 and Fig. 2
Shown, the thickness of second wiring board 200 is greater than the thickness of the first line plate 100 in one of the embodiments,.Such as
Fruit needs to adjust finger print acquisition module 300 and deviates from distance of the one side of the first line plate 100 to first line plate 100, energy
It is realized by adjusting the thickness of the second wiring board 200, the application is served only for carrying fingerprint collecting mould due to the second wiring board 200
Block 300, area of section are smaller than first line plate 100, so that cost is relatively low for the thickness of the second wiring board 200 of adjusting.This implementation
In example, the thickness for adjusting the second wiring board 200 is thicker, so as to which finger print acquisition module 300 is arranged closer to port 821,
And the area of first line plate 100 is bigger, and it is relatively thin that plate thickness is made, to avoid cost excessively high.
To be powered to fingerprint module, as depicted in figs. 1 and 2, the fingerprint module is also in one of the embodiments,
Including power supply interface 400, the power supply interface 400 is set on the first line plate 100, and the power supply interface 400 with
The first circuit electrical connection, power supply interface 400 with power supply for being electrically connected, to be powered to fingerprint module.
To avoid the thickness of the second wiring board 200 excessively high, the power supply interface 400 is arranged in one of the embodiments,
Deviate from the one side of second wiring board 200 in the first line plate 100.It should be understood that current power supply interface 400
Thickness including Mini USB, Micro USB, type-C etc., these power supply interfaces 400 is larger, if by power supply interface 400
First line plate 100 is set towards the side of the second wiring board 200, it is required that the finger print acquisition module 300 deviates from institute
The distance for stating one side to the first line plate 100 of first line plate 100 is equal to power supply interface 400 and is raised in first line plate
100 height could make finger print acquisition module 300 be arranged close to port 821, still, if using this set side in this way
Formula, the second wiring board 200 require biggish thickness, to can excessively increase the cost of manufacture of the second wiring board 200.This reality
It applies in example, the biggish power supply interface 400 of thickness is set to the first line plate 100 away from second wiring board 200
On one side, the second wiring board 200 does not need then to be made into biggish thickness, and finger print acquisition module 300 is set close to port 821
It sets, thus reduces the cost of fingerprint mould group 10.
A kind of Fingerprint Lock 11 is provided in one of the embodiments, including such as weighs any of the above-described finger as described in the examples
Line mould group 10.
It should be understood that the above-mentioned structure using Fingerprint Lock illustrates as embodiment, but the fingerprint mould group not only limits
In Fingerprint Lock, but it can be applied to other technologies field, fingerprint mould group can be installed in other devices, and for acquiring
A kind of fingerprint device, including pedestal and panel are provided, opened in the pedestal in one embodiment with the fingerprint of identification user
Equipped with installation space, the installation space has opening, and the panel is connect with the lock body, and opens described in panel closing
Mouthful, the panel offers port, and the port is connected to the installation space, and it is empty that the fingerprint mould group is set to the installation
In, the finger print acquisition module is arranged in the port.
A kind of electronic equipment, including first line plate, the second wiring board, input/defeated are provided in one of the embodiments,
Module and processing module out, are provided with the first circuit and multiple first pins on the first line plate, first pin with
First circuit is electrically connected, and is provided with second circuit and multiple second pins, second pin on second wiring board
It is electrically connected with the second circuit, the area of section of the first line plate is greater than the area of section of second wiring board, institute
State first line plate wherein with second wiring board wherein while connect, each first pin and each described the
Two pins are aligned one by one, and each first pin connects one to one with each second pin, the processing module setting
In on the first line plate, the processing module is electrically connected with first circuit, and the input/output module is set to institute
The one side that the second wiring board deviates from the first line plate is stated, and the input/output module is electrically connected with the second circuit.
It should be understood that the input/output module can be input module, or output module, Huo Zhewei
Input and output module, the input/output module are referred to as I/O module (I/O, input/output, input/defeated
Out).
One embodiment is, the input/output module includes input module, and in the present embodiment, the processing module is used
In the signal for receiving the input/output module.One embodiment is that the input/output module includes mechanical key.One
Embodiment is that the input/output module includes touch key-press.One embodiment is that the input/output module includes Mike
Wind.One embodiment is that the input/output module includes finger print acquisition module, and the processing module includes fingerprint recognition mould
Block.
One embodiment is, the input/output module includes output module, and in the present embodiment, the processing module is used
In to the input/output module send signal.One embodiment is that the input/output module includes display screen.One reality
Applying example is, the input/output module includes loudspeaker.
One embodiment is, the input/output module includes input module and output module, described in the present embodiment
Processing module is used to send signal, and the signal for receiving the input/output module to the input/output module.This
In embodiment, the input/output module is referred to as input/output module, or is I/O module, or is interactive module.
One embodiment is that the input/output module includes touch screen.In one embodiment, input/output module is adopted for fingerprint
Collect module, one embodiment is that the processing module module is fingerprint identification module, which is alternatively referred to as at fingerprint recognition
Manage module.
Electronic equipment in above-described embodiment, compared to tradition by the connection method of conductor wire, the electronic equipment is saved
Conductor wire has been omited, so that the overall structure of electronic equipment is more compact, in addition, conductor wire is easy to damage, has omitted the electronics of conductor wire
Equipment is more durable, meanwhile, input/output module can be increased by the second wiring board away from the one side of first line plate to first
The distance of wiring board can carry input/output mould by the second wiring board when the electronic equipment is arranged in a shell
Block, so that input/output module is closer to the outside of shell.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of fingerprint mould group, which is characterized in that know including first line plate, the second wiring board, finger print acquisition module and fingerprint
Other module is provided with the first circuit and multiple first pins, first pin and first electricity on the first line plate
Road is electrically connected, and is provided with second circuit and multiple second pins, second pin and described second on second wiring board
Circuit electrical connection, the area of section of the first line plate are greater than the area of section of second wiring board, the first line
Plate wherein with second wiring board wherein while connect, each first pin and each second pin are one by one
Alignment, and each first pin connects one to one with each second pin, the fingerprint identification module is set to described
On first line plate, the fingerprint identification module is electrically connected with first circuit, and the finger print acquisition module is set to described
Second wiring board deviates from the one side of the first line plate, and the finger print acquisition module is electrically connected with the second circuit.
2. fingerprint mould group according to claim 1, which is characterized in that the fingerprint identification module is set to the First Line
One side of the road plate towards second wiring board.
3. fingerprint mould group according to claim 2, which is characterized in that the finger print acquisition module deviates from the first line
The distance of the one side of plate to the first line plate is greater than or equal to the fingerprint identification module and is raised in the first line plate
Height.
4. fingerprint mould group according to claim 2, which is characterized in that second wiring board is raised in the first line
The height of plate is greater than or equal to the height that the fingerprint identification module is raised in the first line plate.
5. fingerprint mould group according to claim 1, which is characterized in that second wiring board is in the first line plate institute
Face on projection fully fall on the first line plate.
6. fingerprint mould group according to any one of claims 1-5, which is characterized in that the thickness of second wiring board is big
In the thickness of the first line plate.
7. fingerprint mould group according to any one of claims 1-5, which is characterized in that it further include power supply interface, the confession
Electrical interface is set on the first line plate, and the power supply interface is electrically connected with first circuit.
8. fingerprint mould group according to claim 7, which is characterized in that the power supply interface is set to the first line plate
Away from the one side of second wiring board.
9. a kind of Fingerprint Lock, which is characterized in that including fingerprint mould group such as of any of claims 1-8.
10. a kind of electronic equipment, which is characterized in that including first line plate, the second wiring board, input/output module and processing
Module is provided with the first circuit and multiple first pins, first pin and first circuit on the first line plate
It is electrically connected, second circuit and multiple second pins, second pin and second electricity is provided on second wiring board
Road electrical connection, the area of section of the first line plate are greater than the area of section of second wiring board, the first line plate
Wherein with second wiring board wherein while connect, each first pin and each second pin one are a pair of
Together, and each first pin connects one to one with each second pin, and the processing module is set to the First Line
On the plate of road, the processing module is electrically connected with first circuit, and the input/output module is set to second wiring board
Away from the one side of the first line plate, and the input/output module is electrically connected with the second circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910304157.6A CN109948595B (en) | 2019-04-16 | 2019-04-16 | Fingerprint module, fingerprint lock and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910304157.6A CN109948595B (en) | 2019-04-16 | 2019-04-16 | Fingerprint module, fingerprint lock and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109948595A true CN109948595A (en) | 2019-06-28 |
| CN109948595B CN109948595B (en) | 2023-09-12 |
Family
ID=67015386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910304157.6A Active CN109948595B (en) | 2019-04-16 | 2019-04-16 | Fingerprint module, fingerprint lock and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109948595B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206557803U (en) * | 2017-03-21 | 2017-10-13 | 上海图正信息科技股份有限公司 | A kind of fingerprint recognition module and terminal |
| EP3309667A1 (en) * | 2016-10-11 | 2018-04-18 | Samsung Electronics Co., Ltd. | Electronic device having plurality of fingerprint sensing modes and method for controlling the same |
-
2019
- 2019-04-16 CN CN201910304157.6A patent/CN109948595B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3309667A1 (en) * | 2016-10-11 | 2018-04-18 | Samsung Electronics Co., Ltd. | Electronic device having plurality of fingerprint sensing modes and method for controlling the same |
| CN206557803U (en) * | 2017-03-21 | 2017-10-13 | 上海图正信息科技股份有限公司 | A kind of fingerprint recognition module and terminal |
Non-Patent Citations (2)
| Title |
|---|
| QIJUN ZHAO: "Latent Fingerprint Matching: Utility of Level 3 Features", 《RESEARCHGATE》, pages 1 - 30 * |
| 邱在良: "指纹模组制作工艺改进及效率提升研究", 《中国优秀硕士论文全文数据库信息科技辑》, pages 138 - 1013 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109948595B (en) | 2023-09-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008193097A5 (en) | ||
| TWM351407U (en) | Structure for resistance type touch panel | |
| CN206133601U (en) | Fingerprint sensor module | |
| CN207099321U (en) | Loudspeaker enclosure and electric terminal equipment | |
| CN209710612U (en) | A kind of Multi-layer circuit board structure and terminal device | |
| CN108966486A (en) | Rigid Flex and mobile terminal | |
| CN107545230A (en) | Ultrasonic type fingerprint identification module and its manufacture method | |
| CN210379235U (en) | Battery and wearable electronic equipment | |
| CN109117696A (en) | Fingerprint mould group and electronic equipment equipped with the fingerprint mould group | |
| CN209607002U (en) | Fingerprint mould group, Fingerprint Lock and electronic equipment | |
| WO2021249142A1 (en) | Wireless charging coil assembly and charging device | |
| CN102404930A (en) | Improved structure of multilayered flexible printed circuit board (PCB) | |
| CN109948595A (en) | Fingerprint mould group, Fingerprint Lock and electronic equipment | |
| WO2022005368A1 (en) | Biometric imaging module and method for manufacturing a biometric imaging module | |
| CN208888836U (en) | Fingerprint recognition component and electronic equipment | |
| CN202353916U (en) | Improved structure of multilayer flexible printed circuit board | |
| CN205616568U (en) | Packaging structure of integrated sensor | |
| CN111405756A (en) | Circuit board structure, display panel, display device and preparation method | |
| CN207799700U (en) | Fingerprint module and electronic equipment equipped with fingerprint module | |
| CN106611752B (en) | Electric connection structure and its manufacturing method between the positive back side of chip | |
| CN209748899U (en) | Circuit board | |
| CN210609704U (en) | MEMS microphone packaging structure | |
| US20080311792A1 (en) | Usb connector device, connector module and method for fabricating usb connector device | |
| CN113970389A (en) | Film type pressure sensor and electronic equipment | |
| CN206788883U (en) | A kind of fingerprint recognition module and terminal device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |