CN109935533A - The conversion zone removal device and minimizing technology of packaging body - Google Patents
The conversion zone removal device and minimizing technology of packaging body Download PDFInfo
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- CN109935533A CN109935533A CN201711368627.2A CN201711368627A CN109935533A CN 109935533 A CN109935533 A CN 109935533A CN 201711368627 A CN201711368627 A CN 201711368627A CN 109935533 A CN109935533 A CN 109935533A
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Abstract
The present invention provides the conversion zone removal device and minimizing technology of a kind of packaging body, which includes: rotating member, and the rotating member has cavity and rotation axis, and the rotating member can be rotated around the rotation axis；Multiple second metal particles are provided in the cavity, and for accommodating multiple packaging bodies of doing over again, the pin surface of the packaging body of doing over again has the first metal reaction layer；Conducting solution is accommodated in the cavity, second metal particle occurs displacement with the first metal reaction layer in the conducting solution of the cavity and reacts, to remove the first metal reaction layer.The device can effectively remove the first metal reaction layer of the pin surface of each packaging body, carry out batch processing to greater number of packaging body.
Description
Technical field
The present invention relates to encapsulation technology field more particularly to the conversion zone removal devices and minimizing technology of a kind of packaging body.
Background technique
Currently, having one kind in QFN (Quad Flat No-lead Package, quad flat non-pin package) packaging body
Using the packing forms of silver-colored salient point substitution traditional copper frame, but silver-colored salient point is easy to happen vulcanization, therefore reduces encapsulating products
Yield, influence properties of product.
The method for removing desilver salient point sulfuric horizon at present is not suitable for the batch processing of encapsulating products, and therefore, it is necessary to one kind to have
The method of effect removal encapsulating products sulfuric horizon, and be suitable for carrying out batch processing to encapsulating products.
Summary of the invention
The present invention provides the conversion zone removal device and minimizing technology of a kind of packaging body, to solve in the related technology not
Foot.
According to the first aspect of the invention, a kind of conversion zone removal device of packaging body is provided, comprising:
Rotating member, the rotating member have cavity and rotation axis, and the rotating member can be rotated around the rotation axis；
Multiple second metal particles are provided in the cavity, and for accommodating multiple packaging bodies of doing over again, the envelope of doing over again
The pin surface for filling body has the first metal reaction layer；
Accommodate conducting solution in the cavity, second metal particle in the conducting solution of the cavity with it is described
Displacement reaction occurs for the first metal reaction layer, to remove the first metal reaction layer.
Optionally, further includes:
Container is provided with the conducting solution in the container；
It is also set up on the rotating member from rotating member surface and is through to the intracorporal multiple holes of the chamber, the rotating member is extremely
Small part is located in the conducting solution, and in rotating member rotation, the conducting solution can flow into described by the hole
In the cavity of rotating member.
It optionally, further include power source, the power source and the rotation axis connection, the power source are used to control described
Rotating member is rotated around the rotation axis.
Optionally, the shape of the rotating member and the cavity is cylinder.
Optionally, each hole is uniformly distributed on the rotating member.
Optionally, the diameter of second metal particle is 0.5mm to 1.5mm.
Optionally, the first metal reaction layer is vulcanization silver layer, and second metal particle is aluminum material particle.
Optionally, the conducting solution is alkaline solution.
Optionally, the conducting solution is the mixed solution of sodium carbonate and the sodium chloride.
Optionally, the mass ratio of the sodium carbonate and the sodium chloride is 400:1-100:1.
Optionally, the solvent of the conducting solution is deionized water.
According to the second aspect of the invention, a kind of conversion zone minimizing technology of packaging body is provided, comprising:
Packaging body is done over again and the second metal particle is placed in the cavity of a rotating member, the packaging body to be done over again for multiple
Pin surface have the first metal reaction layer；
It is anti-that with the first metal reaction layer displacement occurs for second metal particle in the conducting solution of the cavity
It answers, to remove the first metal reaction layer.
Based on the above-mentioned technical proposal, the conversion zone removal device of the packaging body, can simultaneously by multiple packaging bodies in set rotation
In the cavity of part, occurred in conducting solution by the first metal reaction layer of the second metal particle and the pin surface of packaging body
Displacement reaction, can gradually remove the first metal reaction layer of the pin surface of each packaging body, carry out to greater number of packaging body
Batch processing, since rotating member can be rotated constantly around rotation axis, the first metal of the packaging body pin surface that can make respectively to do over again
Conversion zone comes into full contact with the second metal particle, effectively removes the first metal reaction layer, also, since each packaging body is placed in conduction
It in solution, with the rotation of rotating member, will not be in contact between each packaging body, packaging body will not be caused to damage, not shadow
Ring the quality and yield of packaging body product.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the conversion zone removal device for the packaging body that an implementation exemplifies according to the present invention；
Fig. 2 is the flow chart of the conversion zone minimizing technology for the packaging body that an implementation exemplifies according to the present invention.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the application.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects be described in detail in claims, the application.
It is only to be not intended to be limiting the application merely for for the purpose of describing particular embodiments in term used in this application.
It is also intended in the application and the "an" of singular used in the attached claims, " described " and "the" including majority
Form, unless the context clearly indicates other meaning.Below with reference to the accompanying drawings each embodiment of detailed description of the present invention.
At present for using the QFN packaging body of packing forms of silver-colored salient point substitution traditional copper frame, silver-colored salient point can be made
It is connect for pin with other outer members, therefore, silver-colored salient point needs to be exposed to the outside of packaging body, since silver-colored salient point is easy to happen
Vulcanization, reduces the yield of encapsulating products, influences properties of product, accordingly, the embodiment of the invention provides a kind of the anti-of packaging body
Answer a layer removal device, comprising:
Rotating member, rotating member have cavity and rotation axis, and rotating member can be rotated around rotation axis；
Multiple second metal particles are provided in cavity, and for accommodating multiple packaging bodies of doing over again, packaging body of doing over again draws
Foot surface has the first metal reaction layer；
Conducting solution is accommodated in cavity, the second metal particle is sent out in the conducting solution of cavity with the first metal reaction layer
Raw displacement reaction, to remove the first metal reaction layer.
Packaging body refers to the structure for being packaged with chip, by chip package in plastic packaging material, the pin of exposed chip, will pass through
Pin is connect with outer member, since the pin of packaging body is exposed to outside plastic packaging material, it is easy to happen oxidation or vulcanization,
In the conversion zones such as the Surface Creation layer of oxide layer of pin or sulfuric horizon, for example, pin of the pin if it is copper product, in sky
One layer of copper oxide oxide layer can be generated after being oxidized in gas, if it is the pin of ag material, can be generated after curing in air
One layer of silver sulfide sulfuric horizon.
Packaging body of doing over again refer to the metal material of its pin in conjunction with the elements such as the oxygen in air or sulphur after in pin surface
Forming oxide layer, perhaps sulfuric horizon etc. do over again and to repair the encapsulation of the removal conversion zones such as the oxide layer or sulfuric horizon and produce
Product, hereinafter referred to as packaging body.
Rotating member has cavity, is provided with the second metal particle in cavity, packaging body can be put into cavity, due to rotation
Conducting solution is accommodated in part cavity, it is anti-that with the first metal reaction layer displacement can occur for the second metal particle in conducting solution
It answers, forms the element (such as oxygen or sulphur) and the second metal knot of conversion zone in the first metal reaction layer with the first metal bonding
It closes, forms substance (such as second metal oxide or second metal sulfide) of second metal in conjunction with the element, the object
Matter enters in conducting solution, is either dissolved in conducting solution or precipitating, and the first metal reaction layer loses the change of the element in conversion zone
At simple substance, therefore, the first metal reaction layer of pin surface can be removed.
It is to utilize electrification that the principle that displacement is reacted occurs in conducting solution with the second metal particle for the first metal layer
Reaction principle is learned, the metallic element of the second metal particle and the affinity for the element that conversion zone is formed with the first metal bonding are greater than
Therefore the affinity of first metal and the element is placed in conducting solution when by the second metal particle and the first metal reaction
When, the surface of the second metal particle has a weak current, and the second metal loses electronics, the second metal lose after electronics with formed it is anti-
Answer the element (such as oxygen or sulphur etc.) of layer that the substance formed is combined to enter in conducting solution, since conducting solution has conduction
Property, the electronics that the second metal loses enter conducting solution, can move in conducting solution, the first gold medal in the first metal reaction layer
Category can obtain the electronics that the second metal loses from conducting solution, and the first metal becomes the first metal simple-substance after obtaining electronics, on
The process for stating displacement reaction can carry out always, and therefore, the first metal reaction layer of pin surface is gradually removed.
In the present embodiment, multiple packaging bodies can be placed in the cavity of rotating member simultaneously, pass through the second metal particle and envelope
Displacement reaction occurs in conducting solution for the first metal reaction layer for filling the pin surface of body, can gradually remove drawing for each packaging body
The first metal reaction layer on foot surface carries out batch processing to greater number of packaging body, since rotating member can constantly rotate
Moving axis rotation, the first metal reaction layer of the packaging body pin surface that can make respectively to do over again come into full contact with the second metal particle, can
The first metal reaction layer is effectively removed, also, since each packaging body is placed in conducting solution, it is each to seal with the rotation of rotating member
It will not be in contact between dress body, packaging body will not be caused to damage, do not influence the quality and yield of packaging body product.
Fig. 1 show the structural schematic diagram of the conversion zone removal device of packaging body provided in an embodiment of the present invention, ties below
Fig. 1 is closed the device is introduced.
As shown in Figure 1, the device outside including above-mentioned rotating member can also including container, the device specifically include with
Flowering structure:
Rotating member 10, rotating member 10 have cavity and rotation axis 11, and rotating member 10 can be rotated around rotation axis 11；
Multiple second metal particles 20 are provided in cavity, and for accommodating multiple packaging body (not shown)s of doing over again,
Do over again packaging body pin surface have the first metal reaction layer；
Container 30 is provided with conducting solution 40 in container 30；
It is also set up on rotating member 10 from 10 surface of rotating member and is through to the intracorporal multiple hole (not shown)s of chamber, rotating member
10 are at least partially disposed in conducting solution 40, and conducting solution 40 can be flowed into through via hole in the cavity of rotating member 10.
In the device of the present embodiment, it is provided with container, conducting solution is filled in container, rotating member, which is at least partially disposed at, leads
In electric solution, rotating member, which has, is through to the intracorporal multiple holes of chamber, and when rotating member is rotated around rotation axis, the hole on rotating member can
It is placed in conducting solution, conducting solution can flow into the cavity of rotating member through via hole, the pin of the second metal particle and packaging body
Displacement reaction can occur in the intracorporal conducting solution of chamber for flowing into rotating member for the first metal reaction layer on surface, and gradually removal is each
First metal reaction layer of the pin surface of packaging body.
It is reacted as the second metal particle constantly carries out displacement with the first metal reaction layer, the second metal and the first metal are anti-
It answers the element in layer to combine the substance (such as the second metal oxide or second metal sulfide) formed that can constantly enter to turn
In the conducting solution of the cavity of moving part, therefore, it is possible to influence the electric conductivity of conducting solution, conducting solution is filled with by setting
Container, the intracorporal conducting solution of chamber for flowing into rotating member mutually flowed by other solution in the Kong Keyu container on rotating member
Logical, the conducting solution in container can carry out supplement update to the intracorporal conducting solution of chamber, make the conduction of the intracorporal conducting solution of chamber
Property etc. variations it is smaller, be conducive to accelerate removal packaging body pin surface the first metal reaction layer.
In some instances, as shown in Figure 1, the device further includes power source 50, power source 50 is connect with rotation axis 11, is moved
Power source 50 is rotated for controlling rotating member 10 around rotation axis 11.
By be arranged power source, can automatically control rotating member around rotation axis rotate, power source for example motor or
Other can control the element of rotation axis rotation, and power source can according to need the revolving speed of adjustment rotating member.
It certainly, may be manual type for the mode of control rotating member rotation, for example, the rotation axis of rotating member can have
There is a rocking handle, rotating member also can control by manual operation rocking handle and rotated around rotation axis.
As shown in Figure 1, rotating member is completely disposed in conducting solution, rotating member can also be partially disposed in conducting solution, only
Will be when rotating member rotate, the hole of rotating member can be placed in solution, and conducting solution can be made to be flowed into the cavity of rotating member through via hole
?.
For rotating member is placed in the mode in solution, the rotation axis of rotating member can be set on wall of a container face,
Rotation axis is rotatably connected with wall of a container face, or in addition one support frame of setting, by the rotation axis and support frame of rotating member
It is rotatably connected, and is at least partially disposed at rotating member in conducting solution, the present embodiment does not limit this.
Needing specification is, packaging body and the second metal particle being placed in the cavity of rotating member for convenience, and
Facilitate taking-up packaging part, opening can be set on rotating member, packaging body and the second metal particle can be placed in by the opening
In cavity, also, the upper settable lid that is open, lid are located at opening for covering, which can be sealed, and avoid turning
In moving part rotation process, do over again packaging body and the second metal particle are leaked out from opening.It is of course also possible to it is not provided with lid, it will
Do over again packaging body and the second metal particle be placed in the cavity of rotating member after using sealing material sealed opening, when needing to take out
When packaging body, sealing material is opened.
In some instances, as shown in Figure 1, the shape of rotating member 10 and cavity is cylinder, i.e., rotating member 10 is one
Cylinder, and open up a cylindrical cavity on rotating member 10 and form cylindrical cavity.
Certainly, rotating member may be other shapes, for example, rectangular-shape or cube-shaped or other shapes, cavity
Shape may be other shapes, cavity is for being arranged the second metal particle and packaging body, as long as being formed on rotating member
Cavity, the present invention do not limit the shape of rotating member and cavity.
Setting also can according to need for the volume size of rotating member and cavity, the size of usual packaging body is smaller, is
The efficiency of pin surface the first metal reaction layer of removal packaging body is improved, and considers to remove the effect of the first metal reaction layer
The size of fruit, cavity can be receiving a packaging bodies up to a hundred to thousands of.
The number and size in the hole being set on rotating member also can according to need setting, preferably, the diameter in hole is less than
The diameter of second metal particle can avoid the second metal particle and leak out from hole, in order to keep the conducting solution in container more equal
In the cavity of even inflow rotating member, multiple holes on rotating member can be distributed on rotating member.
For the diameter of the second metal particle can also there are many, in order to improve the second metal particle and the second metal reaction
The speed of displacement reaction occurs for layer, and the diameter of usual second metal particle is smaller, for example, the diameter of the second metal particle is
The number of 0.5mm to 1.5mm, the second metal particle can be thousands of to up to ten thousand, make the chamber of rotating member intracorporal each in this way
Position is distributed with several the second metal particles, makes the first metal reaction of the pin surface of the packaging body positioned at each position
Layer can occur displacement with the second metal particle and react, and it is possible to keep the first metal reaction layer and the second metal particle indirectly
Contacting surface product increases, and improves the speed and removal effect of the first metal reaction layer of removal.
The first above-mentioned metal reaction layer is, for example, to vulcanize silver layer, and the second metal particle is, for example, aluminum material particle, for
For silver-colored salient point is applicable in as the packaging body of pin, silver-colored salient point is easier to vulcanize, and vulcanizes silver layer in its Surface Creation, for
For vulcanizing silver layer, aluminum metal particle can be used.
It is as follows that above-mentioned silver sulfide and aluminum metal carry out the principle that displacement is reacted:
Since the affinity of aluminium and sulphur is greater than the affinity of silver with sulphur, when the pin surface of aluminum metal particle and packaging body
When silver sulfide contacts, the surface of aluminum metal particle has weak current, and aluminium loses electronics: Al → Al3++ 3e, the electronics that aluminium loses
Conducting solution can be entered, and the silver in silver sulfide can obtain the electronics into conducting solution: 3Ag++ 3e → 3Ag, entire displacement are anti-
The process answered are as follows: Al+3Ag+→Al3++ 3Ag replaces the chemical equation of reaction are as follows: 3Ag2S+2Al=6Ag+Al2S3。
By above-mentioned principle it is found that aluminium particle constantly loses electronics in conducting solution, the silver in silver sulfide is continuously available
The Al that sulphur generates in conjunction with aluminium after displacement is reacted occurs for electronics2S3Into in conducting solution, silver sulfide becomes elemental silver, packaging body
The silver sulfide of pin surface gradually removed.
Since aluminium is oxidized easily in aluminum metal particle Surface Creation aluminum oxide, above-mentioned solution is preferable
For alkaline solution, the aluminum oxide on aluminum metal particle surface can be removed by alkaline solution, aluminium is made to be exposed to conducting solution
In, constantly with vulcanization silver reaction, above-mentioned alkaline solution is, for example, the solution for including sodium carbonate solvent, and sodium carbonate ionizes in the solution
Sodium ion is generated afterwards and generates sodium hydroxide in conjunction with the hydroxyl in solution, makes conducting solution that there is alkalescent, to remove aluminium gold
Belong to the aluminum oxide of microparticle surfaces.
It also, may include sodium chloride in the conducting solution, sodium chloride plays the role of salt bridge in conducting solution, adds
The movement of electronics in fast above-mentioned displacement reaction process, further increases the speed and removal effect of removal vulcanization silver layer.
The mass ratio for example 400:1-100:1 of sodium carbonate and the sodium chloride in above-mentioned conducting solution, it is certainly, conductive molten
Liquid may be the solution of aqueous solution or other conductive matter, the preferred solvents of above-mentioned conducting solution be from
Sub- water, the volume of deionized water are, for example, 800ml, can increase the purity of conducting solution as solvent using deionized water, subtract
Impurity in small conducting solution improves the effect of the first metal reaction layer of removal, but above-mentioned conducting solution is not limited to
It states described in embodiment.
If the first above-mentioned metal reaction layer is copper oxide, the second metal particle is, for example, magnesium metal particle or iron
Metal particle etc. or above-mentioned first metal reaction layer are other metal oxide layers, and tool is arranged according to the principle of displacement reaction
Second metal particle of body, however it is not limited to described in above-described embodiment.
The embodiment of the present invention also provides a kind of conversion zone minimizing technology of packaging body, as shown in Fig. 2, this method comprises:
Step S100, packaging body is done over again and the second metal particle is placed in the cavity of a rotating member, envelope of doing over again for multiple
The pin surface for filling body has the first metal reaction layer；
Step S110, the second metal particle occurs to replace and react in the conducting solution of cavity with the first metal reaction layer,
To remove the first metal reaction layer.
The method of the present embodiment can effectively remove the first metal reaction layer of the pin surface of each packaging body, to plurality
The packaging body of amount carries out batch processing.
It will be appreciated by those skilled in the art that attached drawing is the schematic diagram of a preferred embodiment, module or stream in attached drawing
Journey is not necessarily implemented necessary to the present invention.The foregoing is merely a specific embodiment of the invention, but guarantor of the invention
Shield range is not limited thereto, and anyone skilled in the art in the technical scope disclosed by the present invention, can be light
It is readily conceivable that change or replacement, should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with described
Subject to scope of protection of the claims.
Claims (12)
1. a kind of conversion zone removal device of packaging body characterized by comprising
Rotating member, the rotating member have cavity and rotation axis, and the rotating member can be rotated around the rotation axis；
Multiple second metal particles are provided in the cavity, and for accommodating multiple packaging bodies of doing over again, the packaging body of doing over again
Pin surface have the first metal reaction layer；
Accommodate conducting solution in the cavity, second metal particle is in the conducting solution of the cavity with described first
Displacement reaction occurs for metal reaction layer, to remove the first metal reaction layer.
2. the apparatus according to claim 1, which is characterized in that further include:
Container is provided with the conducting solution in the container；
It is also set up on the rotating member from rotating member surface and is through to the intracorporal multiple holes of the chamber, at least portion of the rotating member
Quartile is in the conducting solution, and in rotating member rotation, the conducting solution can flow into the rotation by the hole
In the cavity of part.
3. the apparatus according to claim 1, which is characterized in that it further include power source, the power source and the rotation axis
Connection, the power source are rotated for controlling the rotating member around the rotation axis.
4. the apparatus according to claim 1, which is characterized in that the shape of the rotating member and the cavity is cylinder
Shape.
5. the apparatus of claim 2, which is characterized in that each hole is uniformly distributed on the rotating member.
6. device according to claim 1-5, which is characterized in that the diameter of second metal particle is
0.5mm to 1.5mm.
7. device according to claim 1-5, which is characterized in that the first metal reaction layer is silver sulfide
Layer, second metal particle are aluminum material particle.
8. device according to claim 7, which is characterized in that the conducting solution is alkaline solution.
9. device according to claim 7, which is characterized in that the conducting solution is the mixed of sodium carbonate and the sodium chloride
Close solution.
10. device according to claim 9, which is characterized in that the mass ratio of the sodium carbonate and the sodium chloride is
400:1-100:1。
11. device according to claim 1-5, which is characterized in that the solvent of the conducting solution is deionization
Water.
12. a kind of conversion zone minimizing technology of packaging body characterized by comprising
Packaging body is done over again and the second metal particle is placed in the cavity of a rotating member for multiple, and the packaging body to be done over again draws
Foot surface has the first metal reaction layer；
Second metal particle occurs displacement with the first metal reaction layer in the conducting solution of the cavity and reacts, with
Remove the first metal reaction layer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711368627.2A CN109935533B (en) | 2017-12-18 | 2017-12-18 | Device and method for removing reaction layer of packaging body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711368627.2A CN109935533B (en) | 2017-12-18 | 2017-12-18 | Device and method for removing reaction layer of packaging body |
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| CN109935533B CN109935533B (en) | 2021-09-21 |
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| US20050101144A1 (en) * | 2003-11-07 | 2005-05-12 | Industrial Technology Research Institute | Method and apparatus for treating a substrate surface by bubbling |
| US20060011224A1 (en) * | 2004-07-18 | 2006-01-19 | Chung-Chih Chen | Extrusion free wet cleaning process |
| US20150101683A1 (en) * | 2011-04-07 | 2015-04-16 | Intermolecular, Inc. | Touchless Site Isolation Using Gas Bearing |
| WO2016118551A1 (en) * | 2015-01-21 | 2016-07-28 | Sikorsky Aircraft Corporation | Cold spray process using treated metal powder |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002076640A1 (en) * | 2001-03-27 | 2002-10-03 | Semitool, Inc. | Vertical process reactor |
| US20050101144A1 (en) * | 2003-11-07 | 2005-05-12 | Industrial Technology Research Institute | Method and apparatus for treating a substrate surface by bubbling |
| US20060011224A1 (en) * | 2004-07-18 | 2006-01-19 | Chung-Chih Chen | Extrusion free wet cleaning process |
| US20150101683A1 (en) * | 2011-04-07 | 2015-04-16 | Intermolecular, Inc. | Touchless Site Isolation Using Gas Bearing |
| WO2016118551A1 (en) * | 2015-01-21 | 2016-07-28 | Sikorsky Aircraft Corporation | Cold spray process using treated metal powder |
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