CN105098439B - Metal nano is molded air-tight electric connector and its manufacturing process - Google Patents
Metal nano is molded air-tight electric connector and its manufacturing process Download PDFInfo
- Publication number
- CN105098439B CN105098439B CN201510491401.6A CN201510491401A CN105098439B CN 105098439 B CN105098439 B CN 105098439B CN 201510491401 A CN201510491401 A CN 201510491401A CN 105098439 B CN105098439 B CN 105098439B
- Authority
- CN
- China
- Prior art keywords
- contact
- processing
- outer housing
- shell
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Connector Housings Or Holding Contact Members (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
A kind of manufacturing process of above-mentioned metal nano injection molding air-tight electric connector of disclosure of the invention, including following process：S1：Outer housing and contact mechanical processing molding；S2：To the surface plated with nickel and gold of the contact that mating stainless steel and titanium shell use, the contact of mating aluminium alloy and copper alloy shell is not plated；S3：To carrying out nano modification processing after the contact seal interface mechanical processing removal coating of nickel plating and gold, nano modification processing is directly carried out to stainless steel and titanium alloy shell；Nano surface modification is directly carried out to aluminium alloy, copper alloy shell and mating contact；S4：Contact is assembled by nanometer Shooting Technique in outer housing.The present invention can keep the high intensity of the contact of hermetic seal connector, improve plug contact reliability；Improve electroplating efficiency and electroplated layer quality；The weight of connector is greatly lowered to reduce the load of aircraft；The power load of hermetically-sealed electrical connector is substantially improved.
Description
Technical field
Invention is related to a kind of metal nano injection molding air-tight electric connector and its manufacturing process.
Background technology
Space and the electric connector industry used under water usually require that connector can have the performances such as hermetic seal, water-stop.
The sealing having had includes two kinds of glass sealing and crunch seal.Glass sealing is more conventional, is that can cut down conjunction using vitreum
The contact pin of the metal shells such as gold, stainless steel body and kovar alloy carries out sealing-in at high temperature, wherein outer housing be with contact pin can
Cut down the matched seal of alloy, the outer housing of other non-kovar alloy materials and can cut down or the non-sealing-in for cutting down class contact pin be compression seal
It connects；Vitreum can be glass plate or bead.Crunch seal is to replace glass high with the soldering sealing-in of ceramic metallization interface
Intermediate temperature sealing, outer housing using light material it is gold-plated or tin plating, inner wire using copper alloy nickel plating it is gold-plated, mounting plate be mounting hole and
The ceramic wafer of outer metallization.
Glass sealing mode has the drawback that：
1, be electroplated after glass high temperature sealed knot, the annealing of tiny kovar alloy contact pin softens, it is difficult to keep enough rigidity with
Support the plug connection of high intensity.
2, need tether wires that discrete contact pin is electroplated, coating continuity is bad or corrosion resistance is not strong；Even if using chemical plating
After nickel, chemical palladium-plating, immersion gilding plus the gold-plated tether wires that are also required to connect.
3, kovar alloy weight is big, and the electronic product for aerospace can be limited to.
4, production efficiency is extremely low.
5, the conductive capability of kovar alloy connector is not strong, gold-plated to reduce its sheet resistance value, and high current transmits meeting
Cause excessive Wen Sheng.
Crunch seal mode has the drawback that：
1, when ceramic mounting plate makes, base, dumping, sintering are needed；Then it needs to apply slurry, high temperature to soldering envelope interface
Sintering metal is optionally electroplated.Process flow is long, high energy consumption, of high cost.
2, ceramic mounting plate manufactured size precision is low, follow-up to be brazed sealing-in during connector, to need precision positioning work
Dress, further increases cost.
3, when being brazed envelope interface pasting to ceramic mounting plate, aperture, deep hole are difficult to apply uniformly, without in method device to hole
The smearing quality of sintering slurry is characterized, and the dispersion of corrresponding quality level is big, and controllability is low, and final product quality relies on full inspection control
System, can not do over again and reprocess, corrresponding quality is of high cost.
4, production efficiency is relatively low.
Utility model content
The purpose of invention is to provide a kind of metal nano injection molding air-tight electric connector and its manufacturing process, can keep hermetic seal
The high intensity of the contact of connector improves plug contact reliability；Improve electroplating efficiency and electroplated layer quality；It is greatly lowered
The weight of connector is to reduce the load of aircraft；The power load of hermetically-sealed electrical connector is substantially improved.Opposite crunch seal
Process is greatly decreased in connector, reduces energy consumption, improves production efficiency, and each process link quality can be characterized and be weighed, and have scale
Change the possibility and feasibility of automated production.
In order to solve the above technical problems, invention provides a kind of metal nano injection molding air-tight electric connector, including outer housing, with
And the contact by the sealing-in of nanometer injection molded layers in the outer housing；The both ends of the outer housing be respectively equipped with one with it is described
The matched inserts of outer housing, the inserts are equipped with several and matched contact hole of the contact；The outer housing by
Metal material mechanical processing molding；The metal includes aluminium alloy, titanium alloy, stainless steel and copper alloy.
Further, the inserts is by resin material injection molding；The resin is the equal resin with polar group, including
PBT, PPS, nylon-6 and nylon -66.
Further, glass fibre and filler are added in the resin.
A kind of manufacturing process of above-mentioned metal nano injection molding air-tight electric connector, including following process：
S1：By outer housing and contact mechanical processing molding；
S2：To the surface plated with nickel and gold of the contact that mating stainless steel and titanium shell use, to mating aluminium alloy and copper
The contact of alloy shell does not plate；
S3：To carrying out nano modification processing after the contact seal interface mechanical processing removal coating of nickel plating and gold, to not
Rust steel and titanium alloy shell directly carry out nano modification processing；To aluminium alloy, copper alloy shell and mating contact directly into
Row nano surface modification；
S4：Contact is assembled by nanometer Shooting Technique in outer housing.
Further, when the outer housing is using stainless steel, titanium alloy, aluminium alloy, the contact nickel plating plating
The zone machines combined to nanometer injection molding after gold carry out nano modification processing after being machined to base material exposure, then injection molding is airtight
Seal connector.
Further, when the outer housing is using copper alloy, nanometer is noted after first carrying out surface modification treatment respectively
It is moulded into connector, then carries out the gold-plated processing of nickel plating.
Further, the modification includes the following steps：Degreasing → microetch → neutralization → cleaning → amino containing silane water
Solve solution treatment → washing → 100~120 DEG C drying.
Advantageous effect of the invention is：The present invention can keep the high intensity of the contact of hermetic seal connector, improve plug and connect
Touch reliability；Improve electroplating efficiency and electroplated layer quality；The weight of connector is greatly lowered to reduce the load of aircraft；Greatly
Width promotes the power load of hermetically-sealed electrical connector.Opposite crunch seal connector, is greatly decreased process, reduces energy consumption, improves
Production efficiency, each process link quality can be characterized and be weighed, and have the possibility and feasibility of scale automated production.
Description of the drawings
Fig. 1 is the sectional view of invention most preferred embodiment；
Fig. 2 is the structural schematic diagram of the upper mold inserts of invention most preferred embodiment；
Fig. 3 is the structural schematic diagram of the lower die inserts of invention most preferred embodiment；
Fig. 4 is the vertical view of cylindrical connector；
Fig. 5 is the vertical view of Square Connector；
Wherein：1, outer housing；11, the first positioning table；2, contact；3, nanometer injection molded layers；4, upper mold inserts；41, first
Contact hole；42, the second positioning table；5, lower die inserts；51, the second contact hole.
Specific implementation mode
The specific implementation mode of invention is described below, is invented in order to facilitate understanding by those skilled in the art,
It should be apparent that invention is not limited to the range of specific implementation mode, for those skilled in the art, as long as respectively
In the spirit and scope for the invention that the attached claims limit and determine, these variations are it will be apparent that one for kind variation
The innovation and creation using inventive concept are cut in the row of protection.
As shown in Figure 1, a kind of metal nano injection molding air-tight electric connector, including outer housing 1, and be molded by nanometer
Contact of 3 sealing-in of layer in the outer housing 1；The both ends of the outer housing 1 are respectively equipped with one and match with the outer housing 1
The upper mold inserts 4 and lower die inserts 5 of conjunction.Wherein, as shown in Fig. 2, upper mold inserts 4 is equipped with the upper end phase with the contact
First contact hole 41 of cooperation, the top of upper mold inserts 4 is additionally provided with the second positioning table 42；As shown in figure 3, being set on lower die inserts 5
Have and matched second contact hole in the lower end of the contact.The outer housing 1 is machined by metal material and is molded；Institute
It includes aluminium alloy, titanium alloy, stainless steel and copper alloy to state metal.And the shape of outer housing is round or rectangular (such as Fig. 4
Shown in Fig. 5)
Above-mentioned upper mold inserts 4 and lower die inserts 5 are by resin material injection molding；The resin is equal with polar group
Resin, including PBT, PPS, nylon-6 and nylon -66 etc..
Further, glass fibre and filler are added in resin, it can preferably matched coefficients of thermal expansion.Make the heat of plastics
Telescopic level and metal it is consistent, be not the peeling-off destruction at combination interface.This combination neither bond, nor
Chemical bonding, but a kind of physical bond based on coupling.
A kind of manufacturing process of above-mentioned metal nano injection molding air-tight electric connector, including following process：
S1：By outer housing 1 and contact mechanical processing molding；
S2：To the surface plated with nickel and gold of the contact that mating stainless steel and titanium shell use, to mating aluminium alloy and copper
The contact of alloy shell does not plate；
S3：To carrying out nano modification processing after the contact seal interface mechanical processing removal coating of nickel plating and gold, to not
Rust steel and titanium alloy shell directly carry out nano modification processing；To aluminium alloy, copper alloy shell and mating contact directly into
Row nano surface modification；
S4：Contact is assembled by nanometer Shooting Technique in outer housing.
According to one embodiment of the application, when the outer housing 1 is using stainless steel, titanium alloy, aluminium alloy, institute
State 2 nickel plating of contact it is gold-plated after to nanometer injection molding combine zone machines be machined to base material exposure after carry out nano modification processing,
Injection molding is hermetic seal connector again.
According to one embodiment of the application, when the outer housing 1 is using copper alloy, can also first carry out respectively
Nanometer is molded into connector after surface modification treatment, then carries out the gold-plated processing of nickel plating.
According to one embodiment of the application, the modification includes the following steps：Degreasing → microetch → neutralization → clear
Wash → amino containing silane hydrating solution processing → washing → 100~120 DEG C drying.If process object is aluminium alloy, the specific steps are：
To need the metal surface that combines carry out base extraction, acid processing, the processing of amino containing silane hydrating solution, wash with water again it is clean after
It is dried.If process object is copper alloy, the specific steps are：To need the metal surface that combines carry out alkalilye degreasing processing,
Cleaning, the processing of sour microetch, cleaning, the processing of amino containing silane hydrating solution, wash with water again it is clean after be dried.If process object
For titanium alloy and stainless steel, the specific steps are：The metal surface combined will be needed to carry out alkalilye degreasing processing, cleaning, fluoric-containing acid
At the microetch processing (stainless steel and the specific microetch technique of titanium alloy can be variant), cleaning, amino containing silane hydrating solution of oxalic acid
Reason is dried after washing with water again totally.
Hermetic connector manufacturing theory of the present invention is：When the surface of connector shell body 1 is after microetch, it is immersed in one
When determining in amino containing silane solution, it is further formed the ultra-fine recess of diameter 20-40nm, the hydroxyl that silane molecule hydrolyzes to form and gold
Metal surface hydroxyl condensation, forms the chemisorbed film of strength on the surfaces externally and internally of nano-pore, and is moderately cross-linked with each other, water cleaning
100~120 DEG C of drying afterwards.The metal of chemical absorption of surface amino containing silane is embedded in injection molding, and PBT is (poly- to benzene two
Formic acid butanediol ester) or PPS (polyphenylene sulfide) isopolarity resins injected, heat release occurs between amine and polar group such as ester group
Reaction, they become amino acid and alcohols.Because reaction generates heat, the solidification for being plasticized material of condensation cured is not yet undergone
It is delayed by, the resin on interface cures later among therefore being injected into ultra-fine recess, polymeric material and aluminium alloy jail
Admittedly combine.
Claims (6)
1. a kind of metal nano is molded air-tight electric connector, which is characterized in that sealed including outer housing, and by nanometer injection molded layers
The contact being connected in the outer housing；The both ends of the outer housing are respectively equipped with one and the matched upper mold of the outer housing
Inserts and lower die inserts, the upper mold inserts is equipped with matched first contact hole in upper end with the contact, described
The second positioning table is additionally provided at the top of upper mold inserts, the lower die inserts is equipped with matched with the lower end of the contact
Second contact hole；The outer housing is machined by metal material and is molded；The metal be aluminium alloy, titanium alloy, stainless steel or
Copper alloy；
Wherein, the outer housing and contact carry out nanometer etching and chemical modification processing respectively；
When shell is aluminium alloy, processing procedure is specially：Base extraction → acid processing → amino containing silane hydrating solution processing →
→ 100 ~ 120 DEG C of drying of washing；
When shell is copper alloy, processing procedure is specially：Alkalilye degreasing processing → cleaning → acid microetch processing → cleaning → amine
Base silane hydrating solution processing → washing → 100 ~ 120 DEG C drying；
When shell is titanium alloy or stainless steel, processing procedure is specially：Alkalilye degreasing processing → cleaning → fluoric-containing acid and oxalic acid
Microetch processing → cleaning → amino containing silane hydrating solution processing → washing → 100 ~ 120 DEG C drying.
2. metal nano according to claim 1 is molded air-tight electric connector, which is characterized in that the inserts is by resinous wood
Expect injection molding；The resin is the equal resin with polar group, including PBT, PPS, nylon-6 and nylon -66.
3. metal nano according to claim 2 is molded air-tight electric connector, which is characterized in that be added in the resin
Glass fibre and filler.
4. a kind of manufacturing process of any metal nano injection molding air-tight electric connectors of claim 1-3, which is characterized in that
Including following process：
S1：By outer housing and contact mechanical processing molding；
S2：To the surface plated with nickel and gold of the contact that mating stainless steel or titanium alloy shell use, to mating aluminium alloy and copper
The contact of alloy shell does not plate；
S3：To carrying out nano modification processing after the contact seal interface mechanical processing removal coating of nickel plating and gold, to stainless steel
Nano modification processing is directly carried out with titanium alloy shell；Table is directly carried out to aluminium alloy, copper alloy shell and mating contact
Face nano modification processing；
The modification includes the following steps：Degreasing → microetch → neutralization → cleaning → amino containing silane hydrating solution processing → water
Wash → 100 ~ 120 DEG C of drying；
S4：The contact is assembled by nanometer Shooting Technique in the outer housing.
5. manufacturing process according to claim 4, which is characterized in that when the outer housing is closed using stainless steel, titanium
When gold, aluminium alloy, the zone machines combined to nanometer injection molding after the contact nickel plating is gold-plated are machined to carry out after base material exposes
Nano modification processing, then injection molding are hermetic seal connector.
6. manufacturing process according to claim 4, which is characterized in that when the outer housing is using copper alloy, first
Nanometer is molded into connector after carrying out surface modification treatment respectively, then carries out the gold-plated processing of nickel plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510491401.6A CN105098439B (en) | 2015-08-12 | 2015-08-12 | Metal nano is molded air-tight electric connector and its manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510491401.6A CN105098439B (en) | 2015-08-12 | 2015-08-12 | Metal nano is molded air-tight electric connector and its manufacturing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105098439A CN105098439A (en) | 2015-11-25 |
| CN105098439B true CN105098439B (en) | 2018-08-14 |
Family
ID=54578353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510491401.6A Active CN105098439B (en) | 2015-08-12 | 2015-08-12 | Metal nano is molded air-tight electric connector and its manufacturing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105098439B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106064446B (en) * | 2016-06-21 | 2018-10-16 | 珠海溥博化工有限公司 | By the method for stainless steel insert injection molding and stainless steel inserts |
| CN106505360A (en) * | 2016-11-29 | 2017-03-15 | 四川华丰企业集团有限公司 | Transitional type lightweight shell hermetically-sealed electrical connector |
| CN106783321A (en) * | 2016-12-19 | 2017-05-31 | 维沃移动通信有限公司 | One kind switch module and preparation method thereof |
| CN107502931A (en) * | 2017-08-08 | 2017-12-22 | 歌尔股份有限公司 | Nanometer moulding processing method and system of processing |
| CN114606560B (en) * | 2022-03-11 | 2024-07-23 | 东莞市慧泽凌化工科技有限公司 | Treatment method of titanium-aluminum composite part, preparation method of titanium-aluminum composite part and resin combination and product |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203774538U (en) * | 2014-03-19 | 2014-08-13 | 贵州航天电器股份有限公司 | Novel high-frequency and low-frequency combined electric connector |
| CN104630872A (en) * | 2015-02-27 | 2015-05-20 | 深圳市梦之坊通信产品有限公司 | Aluminum alloy surface nano hole processing method and method for bonding aluminum alloy to plastic |
| CN104682059A (en) * | 2015-03-19 | 2015-06-03 | 苏州华旃航天电器有限公司 | High-temperature resistance rectangular electrical connector |
-
2015
- 2015-08-12 CN CN201510491401.6A patent/CN105098439B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN105098439A (en) | 2015-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105098439B (en) | Metal nano is molded air-tight electric connector and its manufacturing process | |
| CN102529224B (en) | Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part | |
| KR101929250B1 (en) | Solid electrolytic capacitor for use in high voltage and high temperature applications | |
| CN104993041B (en) | A kind of LED flip chip die bond conductive adhesive structure and its installation method | |
| CN103177977B (en) | Expose the connector in packaging part by selective processing | |
| KR101827663B1 (en) | Method for manufacturing semiconductive branches for a thermoelectric module, and thermoelectric module | |
| JP2010167475A (en) | Metallic material joined with different kind of material and having airtightness in boundary therebetween, and method of manufacturing the same | |
| WO2007052652A1 (en) | Solid electrolytic capacitor and method for manufacturing same | |
| CN101842863A (en) | Anodes with corner and edge modified designs | |
| EP3731298A1 (en) | Case member with terminals, and method for manufacturing same | |
| JP2010080895A (en) | Lead frame type substrate and method for manufacturing the same, and semiconductor substrate | |
| CN103158226A (en) | Preparation method for metal-plastic complex and complex | |
| CN105977360A (en) | Manufacturing technology of LED bracket with good air-tightness | |
| CN202149469U (en) | Waterproof LED lamp | |
| TWI425542B (en) | Solid electrolytic capacitor and manufacturing method thereof | |
| CN104682059A (en) | High-temperature resistance rectangular electrical connector | |
| CN106057789A (en) | SMD high-voltage silicon stack and production process thereof | |
| CN106299823B (en) | Connection method of three-dimensional circuit and metal piece and LDS antenna | |
| CN103511890A (en) | LED injection molding module | |
| CN107104345B (en) | A kind of USB socket and preparation method thereof | |
| CN203312284U (en) | Intelligent power module | |
| CN112885787A (en) | Surface mount diode and packaging forming process thereof | |
| CN203788624U (en) | Clamp used for potting composite thermal conductive material | |
| JP2016056443A (en) | Method of preparing aluminum-resin complex | |
| CN104197970A (en) | Novel low-cost high-frequency ultrasonic sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 621000 No. 36 Yuejin Road, Sichuan, Mianyang Patentee after: Sichuan Huafeng Technology Co.,Ltd. Address before: 621000 No. 36 Yuejin Road, Sichuan, Mianyang Patentee before: SICHUAN HUAFENG ENTERPRISE GROUP Co.,Ltd. |