CN109932533A - Pressure head and fingerprint mould group test device - Google Patents
Pressure head and fingerprint mould group test device Download PDFInfo
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- CN109932533A CN109932533A CN201910277594.3A CN201910277594A CN109932533A CN 109932533 A CN109932533 A CN 109932533A CN 201910277594 A CN201910277594 A CN 201910277594A CN 109932533 A CN109932533 A CN 109932533A
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- test
- pressure head
- wiring board
- mould group
- fingerprint mould
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- 238000012360 testing method Methods 0.000 title claims abstract description 94
- 239000011159 matrix material Substances 0.000 claims description 19
- 239000007787 solid Substances 0.000 claims 1
- 238000012423 maintenance Methods 0.000 abstract description 3
- 241000283070 Equus zebra Species 0.000 description 9
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The present invention discloses a kind of pressure head and fingerprint mould group test device, the pressure head includes fixed block and wiring board, which includes test department, and the wiring board includes opposite front and back, it is equipped with pattern at the positive test department, and is connected to the fixed block at the test department at the back side.In pressure head and fingerprint mould group test device of the invention, since by pattern setting, in the circuit board, pattern will not be compressed and is deformed when pressure head pushes, and would not also be impacted to test result, be ensure that the accuracy of test.Also, the wiring board and fixed block due to setting pattern are separate structure, and when pattern being had damage the problems such as, replaceable wiring board, fixed block is reusable, reduces maintenance cost.
Description
Technical field
The present invention relates to fingerprint identification technology field, in particular to a kind of pressure head and fingerprint mould group test device.
Background technique
Currently, the technical application of fingerprint recognition is very extensive, not only it can be seen that fingerprint recognition in gate inhibition, attendance checking system
The figure of technology has the application of more fingerprint recognitions in the market: such as laptop, mobile phone, automobile, bank paying.
Fingerprint mould group needs to test its performance before factory.Currently, generally using conductive black rubber block for substrate, in rubber block
With the concave-convex alternate zebra stripes pattern of setting on the surface of fingerprint module contact, fingerprint is pressed as pressure head using rubber block
Mould group, to obtain corresponding fingerprint test data and then evaluate the performance of fingerprint mould group.However, rubber block is more soft, pressed
Concave-convex zebra stripes have certain decrement when pressure, this decrement will affect tying as a result, causing to test for output signal
Fruit inaccuracy, moreover, fingerprint mould group also due to conductive rubber block and the data that test it generate common-mode noise, influence to survey
The accuracy of test result.
Summary of the invention
In view of this, the present invention provides a kind of higher pressure head of test accuracy and fingerprint mould group test device.
A kind of pressure head, including fixed block and wiring board, the wiring board include test department, and the wiring board include it is opposite just
Face and the back side are equipped with pattern at the positive test department, and are connected to the fixed block at the test department at the back side.
In an embodiment of the present invention, which is grounded.
In an embodiment of the present invention, the front of the wiring board is equipped with conductive layer, which further includes interconnecting piece
And flexible part, the flexible part are connected between the test department and the interconnecting piece, which passes through the conductive layer and the interconnecting piece
It is electrically connected, interconnecting piece ground connection.
In an embodiment of the present invention, the back side of the wiring board is equipped with conductive layer, which is equipped with via hole, should
The inner wall of via hole is equipped with conductive layer, the conductive layer at the front and the back side is connected, which is opened in the connection
In portion.
In an embodiment of the present invention, the region which corresponds to the test department is not provided with conductive layer.
In an embodiment of the present invention, which further includes matrix, which is installed on the matrix, which connects
It is connected to the matrix.
In an embodiment of the present invention, connecting hole is offered on the interconnecting piece, which passes through the connecting hole and the base
Body connection.
In an embodiment of the present invention, which includes bottom face, which is connected to the bottom face of the fixed column,
The shape of the bottom face and the cross sectional shape of the test department are corresponding.
A kind of fingerprint mould group test device, the test platform including above-mentioned pressure head and with the pressure head face.
In an embodiment of the present invention, which is equipped with the carrier with the pressure head face, for placing fingerprint mould
Group is additionally provided with attachment base on the test platform, which is electrically connected with the fingerprint mould group and the test platform respectively.
In pressure head and fingerprint mould group test device of the invention, since pattern to be arranged in the circuit board, when pressure head pushes
Pattern will not be compressed and is deformed, and would not also be impacted to test result, be ensure that the accuracy of test.Also,
Since the wiring board and fixed block of setting pattern are separate structure, when pattern being had damage the problems such as, replaceable wiring board is fixed
Block is reusable, reduces maintenance cost.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the fingerprint mould group test device of one embodiment of the invention；
Fig. 2 is the positive structure schematic of the wiring board of the group test device of fingerprint mould shown in Fig. 1；
Fig. 3 is the structure schematic diagram of the wiring board of the group test device of fingerprint mould shown in Fig. 1；
Fig. 4 is the structural schematic diagram of the fixed block of the group test device of fingerprint mould shown in Fig. 1.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to implementation of the invention
Mode is further described.
As shown in Figure 1 to Figure 3, in the present embodiment, fingerprint mould group test device includes pressure head 11 and test platform 13, pressure
First 11 include fixed block 111, wiring board 113 and matrix 15.Wiring board 113 includes test department 115 and interconnecting piece 117, and route
Plate 113 includes opposite front 1132 and the back side 1134.Pattern, and the back side 1134 are equipped at the test department 115 in front 1132
Fixed block 111 is connected at test department 115, test department 115 and interconnecting piece 117 are electrically connected, interconnecting piece 117 and test platform 13
Grounding ports be electrically connected, test department 115 is grounded.Fixed block 111 is installed on matrix 15, and interconnecting piece 117 is connected to
Matrix 15.
In the present embodiment, please with reference to Fig. 4, fixed block 111 is column comprising bottom face 1112, test department 115
It is connected to the bottom face 1112 of fixed block 111.Specifically, the shape of bottom face 1112 is corresponding with the cross sectional shape of test department 115.
More specifically, bottom face 1112 can be to be run-track shaped, accordingly, the section of test department 115 is also run-track shaped.It is appreciated that
The shape of bottom face 1112 and test department 115 can also be the other shapes such as circle, rectangle, ellipse, herein with no restrictions.It is fixed
Block 111 can be rubber block.For the ease of installation, the shape and the shape phase of bottom face 1112 of the top end face 1114 of fixed block 111
Together, it can arbitrarily be installed when in this way, installing, need not distinguish between top and bottom end.
In the present embodiment, wiring board 113 includes two interconnecting pieces 117, and test department 115 is located between two interconnecting pieces 117,
Two interconnecting pieces 117 are connect with the two sides of matrix 15 respectively.Specifically, flexibility is additionally provided between test department 115 and interconnecting piece 117
Portion 119 keeps wiring board 113 flexible, so that the side that interconnecting piece 117 bends to matrix 15 is attached thereto.On interconnecting piece 117
Connecting hole 120 is offered, fastener 122 passes through connecting hole 120 and connect with matrix 15.Fastener 122 can be screw.Wiring board
113 can be flexible circuit board.Wiring board 113 can specifically be made of flexible materials such as polyimides.
The front 1132 of wiring board 113 is equipped with conductive layer, and the back side 1134 of wiring board 113 is equipped with conductive layer, wiring board
113 are equipped with via hole, and the inner wall of via hole is equipped with conductive layer, and the conductive layer at front 1132 and the back side is connected, can be with
Understand, via hole can be above-mentioned connecting hole 120, can also separately open up other holes.When interconnecting piece 117 is connected to matrix 15,
The back side 1134 of wiring board 113 is contacted with the side of matrix 15, and front 1132 is exposed.Specifically, conductive layer is copper foil, copper foil
Thickness can be 16-20 microns.In the present embodiment, the region of the corresponding test department 115 in the back side 1134 is not provided with conductive layer.Wiring board
113 are electrically connected by the grounding ports of earth lead 124 and test platform 13, and specifically, earth lead 124 can be with wiring board
113 front 1132 contacts, and is grounded the electric connection of conducting wire 124 Yu wiring board 113.It is appreciated that matrix 15 is generally
Metal material is made, and is generally connected to the earth and is grounded, at this moment wiring board 113 can not be electrically connected to the ground connection of test platform 13
Port, certainly, test department 115 may be connected to other any ground terminals, and be not limited to the grounding ports of test platform 13,
This with no restrictions, as long as test department 115 be grounded.
In other embodiments, only front 1132 is equipped with conductive layer, the not set conductive layer in the back side 1134 to wiring board 113.?
In another embodiment, conductive layer is arranged in the front 1132 of wiring board 113, and conductive layer is arranged in 1134 whole face of the back side, but in contrast,
The region of the corresponding test department 115 in the back side 1134 is not provided in the embodiment of conductive layer, avoids front 1132 and the back side 1134
Conductive layer formed Charged Couple, improve test accuracy.
Pattern on the test department 115 of wiring board 113 can be zebra stripes pattern, specifically, the item of zebra stripes pattern
Line tilts 45 ° with respect to the edge of test department 115.It is appreciated that edge of the striped of zebra stripes pattern with respect to test department 115
Tilt angle can also be the other angles such as 30 °, 60 °.In the present embodiment, the experiment proved that, this fingerprint mould group test device
The striped of test department 115 can get good test effect using 45 ° of tilt angle.Area S > L of zebra stripes pattern2*
A*B, wherein L is the side length of the single pixel of fingerprint mould group, and pixel line-column matrix is A*B；The line width and line of zebra stripes pattern
Away from the sum of be 8 times of single pixel side length, and line width: line-spacing=7:13, wherein line width is the width of every zebra stripes, line-spacing
For the distance between two neighboring striped of zebra stripes.
In the present embodiment, the bottom of matrix 15 offers mounting groove 151, fixed block 111 do not connect with test department 115 one
End is installed in mounting groove 151.The top opposite with bottom of matrix 15 is equipped with last item 152, is pushed by applying to last item 152
Power can push entire pressure head 11.
In the present embodiment, test platform 13 is equipped with the carrier 132 with 11 face of pressure head, for placing fingerprint mould group 100.
Attachment base 134 is additionally provided on test platform 13, attachment base 134 is electrically connected with fingerprint mould group 100 and test platform 13 respectively, with
The signal that fingerprint mould group 100 incudes is transferred to test platform 13, obtains test data.
When test fingerprint mould group 100, fingerprint mould group 100 is placed on the carrier 132 of test platform 13, makes fingerprint mould group
100 are electrically connected at test platform 13, then push pressure head 11, and test department 115 presses fingerprint mould group 100, and fingerprint mould group 100 obtains
Fingerprint test data, test platform 13 evaluate the performance of fingerprint mould group 100 accordingly, are achieved in the test of fingerprint mould group 100.
Using this fingerprint mould group test device, since pattern to be arranged in assist side 113, when pressure head 11 pushes, pattern is not
It can be compressed and be deformed, test result would not also impacted, ensure that the accuracy of test.Also, due to setting
The wiring board 113 of placing graphic pattern and fixed block 111 are separate structure, when pattern being had damage the problems such as, replaceable wiring board 113,
Fixed block 111 is reusable, reduces maintenance cost.In addition, can remove common-mode noise since test department 115 is grounded,
Further increase the accuracy of test.
It is described the prefered embodiments of the present invention in detail above in conjunction with attached drawing, but the present invention is not limited to above-mentioned implementations
Detail in mode can carry out technical solution of the present invention a variety of simple within the scope of the technical concept of the present invention
Modification, these simple variants all belong to the scope of protection of the present invention.It is as described in the above specific embodiments each specific
Technical characteristic can be combined in any appropriate way in the case of no contradiction.In order to avoid unnecessary heavy
Multiple, the invention will not be further described in various possible combinations.
Claims (10)
1. a kind of pressure head, which is characterized in that including fixed block (111) and wiring board (113), which includes test
Portion (115), and the wiring board (113) includes opposite front (1132) and the back side (1134), the test in the front (1132)
It is equipped with pattern at portion (115), and is connected to the fixed block (111) at the test department (115) at the back side (1134).
2. pressure head as described in claim 1, which is characterized in that the test department (115) ground connection.
3. pressure head as claimed in claim 2, which is characterized in that the front (1132) of the wiring board (113) is equipped with conduction
Layer, which further includes interconnecting piece (117) and flexible part (119), which is connected to the test department
(115) between the interconnecting piece (117), which is electrically connected by the conductive layer and the interconnecting piece (117), should
Interconnecting piece (117) ground connection.
4. pressure head as claimed in claim 3, which is characterized in that the back side (1134) of the wiring board (113) is equipped with conductive layer,
The wiring board (113) is equipped with via hole, and the inner wall of the via hole is equipped with conductive layer, by the front (1132) and the back side
(1134) conductive layer conducting, the via hole are opened on the interconnecting piece (117).
5. pressure head as claimed in claim 4, which is characterized in that the region of the corresponding test department (115) in the back side (1134) is not
It is provided with conductive layer.
6. pressure head as claimed in claim 3, which is characterized in that the pressure head (11) further includes matrix (15), the fixed block (111)
It is installed on the matrix (15), which is connected to the matrix (15).
7. pressure head as claimed in claim 6, which is characterized in that offer connecting hole (120) on the interconnecting piece (117), this is solid
Determine part (122) to connect across the connecting hole (120) with the matrix (15).
8. pressure head as described in claim 1, which is characterized in that the fixed block (111) includes bottom face (1112), the test department
(115) bottom face (1112) of the fixed column (111), the shape of the bottom face (1112) and the test department (115) are connected to
Cross sectional shape is corresponding.
9. a kind of fingerprint mould group test device, which is characterized in that including pressure head (11) described in claim 1-8 any one and
With the test platform (13) of pressure head (11) face.
10. fingerprint mould group test device as claimed in claim 9, which is characterized in that the test platform (13) is equipped with and this
The carrier (132) of pressure head (11) face is additionally provided with attachment base on the test platform (13) for placing fingerprint mould group (100)
(134), which is electrically connected with the fingerprint mould group (100) and the test platform (13) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910277594.3A CN109932533A (en) | 2019-04-08 | 2019-04-08 | Pressure head and fingerprint mould group test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910277594.3A CN109932533A (en) | 2019-04-08 | 2019-04-08 | Pressure head and fingerprint mould group test device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109932533A true CN109932533A (en) | 2019-06-25 |
Family
ID=66989388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910277594.3A Pending CN109932533A (en) | 2019-04-08 | 2019-04-08 | Pressure head and fingerprint mould group test device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109932533A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205388776U (en) * | 2016-01-28 | 2016-07-20 | 南昌欧菲生物识别技术有限公司 | Test fingerprint sensor image quality's device |
| CN205484692U (en) * | 2016-01-27 | 2016-08-17 | 苏州韬盛电子科技有限公司 | Socket with conducting resin anthropomorphic dummy finger test fingerprint chip |
| KR101709305B1 (en) * | 2015-11-25 | 2017-02-23 | 주식회사 엔티에스 | Socket for testing finger scan sensor |
| CN107918065A (en) * | 2016-10-10 | 2018-04-17 | 京元电子股份有限公司 | Identification of fingerprint electronic assembly test device and its test equipment |
| WO2018094850A1 (en) * | 2016-11-26 | 2018-05-31 | 华为技术有限公司 | Test head for testing fingerprint sensor |
| CN208538115U (en) * | 2018-07-20 | 2019-02-22 | Oppo（重庆）智能科技有限公司 | Fingerprint mould group test fixture and fingerprint module group test system |
| CN210487807U (en) * | 2019-04-08 | 2020-05-08 | 昆山丘钛微电子科技有限公司 | Pressure head and fingerprint module testing arrangement |
-
2019
- 2019-04-08 CN CN201910277594.3A patent/CN109932533A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101709305B1 (en) * | 2015-11-25 | 2017-02-23 | 주식회사 엔티에스 | Socket for testing finger scan sensor |
| CN205484692U (en) * | 2016-01-27 | 2016-08-17 | 苏州韬盛电子科技有限公司 | Socket with conducting resin anthropomorphic dummy finger test fingerprint chip |
| CN205388776U (en) * | 2016-01-28 | 2016-07-20 | 南昌欧菲生物识别技术有限公司 | Test fingerprint sensor image quality's device |
| CN107918065A (en) * | 2016-10-10 | 2018-04-17 | 京元电子股份有限公司 | Identification of fingerprint electronic assembly test device and its test equipment |
| WO2018094850A1 (en) * | 2016-11-26 | 2018-05-31 | 华为技术有限公司 | Test head for testing fingerprint sensor |
| CN208538115U (en) * | 2018-07-20 | 2019-02-22 | Oppo（重庆）智能科技有限公司 | Fingerprint mould group test fixture and fingerprint module group test system |
| CN210487807U (en) * | 2019-04-08 | 2020-05-08 | 昆山丘钛微电子科技有限公司 | Pressure head and fingerprint module testing arrangement |
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Effective date of registration: 20201202 Address after: 3 / F, factory building No.1, No.3, Taihong Road, high tech Zone, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Kunshanqiu titanium biometric technology Co., Ltd Address before: 215300 No. 3 Rainbow Road, Kunshan hi tech Industrial Development Zone, Jiangsu, Suzhou Applicant before: KUNSHAN Q TECHNOLOGY Co.,Ltd. |