CN109901179A - A kind of miniaturization TOF circuit module and TOF mould group - Google Patents
A kind of miniaturization TOF circuit module and TOF mould group Download PDFInfo
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- CN109901179A CN109901179A CN201711290878.3A CN201711290878A CN109901179A CN 109901179 A CN109901179 A CN 109901179A CN 201711290878 A CN201711290878 A CN 201711290878A CN 109901179 A CN109901179 A CN 109901179A
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Abstract
A kind of miniaturization TOF circuit module and TOF mould group, belong to TOF technical field.It includes: light source unit that the present invention, which minimizes TOF circuit module, for providing active light source to object;Photosensitive unit, for receiving the reflection signal of object, to obtain range information of the object apart from the circuit module;Wherein, the light source unit and the photosensitive unit are set on the circuit board for stacking arrangement.TOF mould group of the present invention includes lens assembly and above-mentioned TOF circuit module;Light is projected to the TOF circuit module by the lens assembly, to obtain the above-mentioned camera module of range information by the TOF circuit module.The present invention uses new packing forms, and under the premise of ensuring electric property reliability, realizes the compact in size of module and mould group.
Description
Technical field
The invention belongs to TOF technical field more particularly to a kind of miniaturization TOF circuit module and TOF mould groups.
Background technique
With optical measurement and the development of computer vision, optical three-dimensional measurement technology is graduallyd mature, has been gradually appeared
In the consumer electronics industry such as mobile phone, security protection and monitoring, robot in medical treatment and the fields such as biology, also become current measurement neck
Hot spot in domain, and these application processes all be unable to do without 3D camera module.
TOF(Time-Of-Flight, flight time) technology is more outstanding one in numerous three dimensional optical measuring technologies
Kind.The basic principle of TOF technology is that the light of active light source transmitting is captured after testee reflects by TOF device, then
TOF device calculates the distance of testee according to light by issuing to the time difference of capture or phase difference, to generate depth letter
Breath.Furthermore it is shot in conjunction with traditional camera, so that it may which the three-D profile of object is represented to the figure of different distance in different colors
Shape mode shows.
TOF depth camera is the application apparatus based on TOF technology to grow up in recent years, can not only be to traditional 2D
Camera obtains light intensity information like that, moreover it is possible in real time obtain sensor devices on each pixel to target object it is corresponding away from
From.But with the rapid development of smart machine, TOF depth camera can not keep up with the hair of smart machine in terms of 3D
Step is opened up, the demand of smart machine is unable to satisfy.
The integrated level of existing TOF depth camera is low, has a single function, and is an existing obvious problem.With depth camera
For application in recognition detection, in detection identification process, TOF depth camera needs and scanner, information processing equipment
Etc. matching, measurement process is separated from each other with imaging, and process flow is complicated, and corresponding hardware device is more, is completely inappropriate for answering
For existing smart machine, the lightening development of smart machine in the prior art is not able to satisfy especially, such as mobile phone, tablet computer
Deng not being able to satisfy the 3D camera module for needing to configure small volume for safety monitoring, robot, medical biological field.
Utility model patent CN206532072U discloses a kind of optical projection apparatus and its depth camera, specific open
Optical projection apparatus includes light source, and light source includes the light source battle array of semiconductor substrate and setting on the semiconductor substrate
Column, for emitting light beam;Circuit board is installed on the semiconductor substrate and is provided with through-hole, and the through-hole makes the light beam
Pass through;Light beam generator is mounted on the circuit board and for projecting pattern beam outward after receiving the light beam.The reality
It uses new patent by reducing the thickness of device using the semiconductor substrate in light source as support base, and then meets intelligence and set
Standby demand small in size.It but is only the thickness of reduction pedestal to reach the purpose of optical projection apparatus thickness diminution, to inside
The stability and reliability of signal processing do not have improvement.
Application for a patent for invention CN106817794A discloses a kind of TOF circuit module and its application.This application will be by that will lead
The driving and controlling circuits and TOF circuit of dynamic light source blend to solve the problems, such as additionally to use driving circuit.This application passes through
Improve circuit structure mode, mainly equipment compatibility is optimized, not to TOF circuit module be based on volume minimize and
Carry out the optimization of circuit reliability.
Summary of the invention
The object of the present invention is to provide a kind of electric property high reliablity, TOF circuit module and TOF mould compact in size
Group.
According to above-mentioned purpose, the present invention provides a kind of miniaturization TOF circuit module, comprising:
Light source unit, for providing active light source to object;
Photosensitive unit, for receiving the reflection signal of object, to obtain range information of the object apart from the circuit module;
Wherein, the light source unit and the photosensitive unit are set on the circuit board for stacking arrangement.
Preferably as the present invention, the circuit board that the circuit board of arrangement folds arrangement for the folded arrangement of 2 layer heaps or 3 layer heaps is stacked.
Preferably as the present invention, the light source unit includes driving circuit, and the driving circuit is for driving TOF light source work
Make.
Preferably as the present invention, the driving circuit is set to the circuit board for stacking arrangement close to the position of TOF light source.
Preferably as the present invention, the light source unit includes temperature sensing circuit, and the temperature sensing circuit is for detecting
TOF light-source temperature.
Preferably as the present invention, the temperature sensing circuit is set to the circuit board for stacking arrangement close to the position of TOF light source.
Preferably as the present invention, it stacks and passes through disjunctor stack manner in the circuit board of arrangement between adjacent layer circuit board or divide
Body stack manner stacks.
Preferably as the present invention, it stacks in the circuit board of arrangement and is connected between adjacent layer circuit board by connecting plate.
Preferably as the present invention, the connecting plate is shaped on the upper layer circuit board of adjacent layer circuit board.
Preferably as the present invention, the upper layer circuit board is fixed on the lower circuit plate of adjacent layer circuit board by connecting plate
On.
As it is of the invention preferably, the connecting plate be fixed on the mode of the lower circuit plate of adjacent layer circuit board for welding,
Any one in riveting, be spirally connected, being bonded.
Preferably as the present invention, the connecting plate is shaped between adjacent layer circuit board.
Preferably as the present invention, the connecting plate is made of Rigid Flex.
Preferably as the present invention, the hardboard of the connecting plate is connected to the lower circuit plate of adjacent circuit plate, the soft board
One end connect the hardboard, the soft board other end is connected to the upper layer circuit board of adjacent circuit plate.
Preferably as the present invention, the junction that the soft board is connected to the upper layer circuit board of adjacent circuit plate connects in arcuation
It connects.
Preferably as the present invention, the connecting plate is made of soft board and stiffening plate.
Preferably as the present invention, the stiffening plate of the connecting plate is connected to the lower circuit plate of adjacent circuit plate, described soft
One end of plate connects the stiffening plate, the upper layer circuit board of the other end connection adjacent circuit plate of the soft board.
Preferably as the present invention, the spacing between the adjacent layer circuit board is greater than 1.5 millimeters.
As it is of the invention preferably, TOF light source in the light source unit is naked to be packaged on the circuit module.
Preferably as the present invention, the TOF light source is packaged on the circuit module in a manner of wafer.
Preferably as the present invention, the TOF light source is externally provided with needed for the active light source for providing different launch angles
Optical element.
Preferably as the present invention, the optical element is optical glass.
Preferably as the present invention, the light source unit includes TOF light source.
Preferably as the present invention, the TOF light source is VCSEL.
Preferably as the present invention, the light source driving circuit includes buffer, switching device or opening with switching device
Powered-down road;The photosensitive unit connects the buffer, and the buffer connects the switching device or the switching circuit.
Preferably as the present invention, the switching device is mosfet transistor.
Preferably as the present invention, the temperature sensing circuit includes thermistor.
Preferably as the present invention, the light source unit includes protection circuit, and it is scheduled that the protection circuit provides TOF light source
Limit power.
Preferably as the present invention, the protection circuit includes sample circuit, comparison circuit, current detection switch circuit;Institute
It states sample circuit and connects the current detection switch circuit through the comparison circuit.
Preferably as the present invention, the sample circuit includes current sense amplifier.
Preferably as the present invention, the comparison circuit includes comparator.
Preferably as the present invention, the current detection switch circuit includes current limiting load switch.
Preferably as the present invention, the light source unit further includes power supply circuit, and the power supply circuit is the photosensitive unit
In sensitive chip power supply.
Preferably as the present invention, the photosensitive unit includes sensitive chip.
Preferably as the present invention, the sensitive chip is CMOS sensitive chip.
Preferably as the present invention, the photosensitive unit further includes filter circuit, and the filter circuit is connected to described photosensitive
The power end of chip.
Preferably as the present invention, said supply unit includes being connected with external power source voltage-stablizer.
Preferably as the present invention, the voltage-stablizer is LDO voltage stabilizer.
Preferably as the present invention, the circuit module further includes storage unit, and the storage unit is for saving TOF light source
Nominal data.
Preferably as the present invention, the storage unit includes memory.
Preferably as the present invention, the memory is FLASH storage chip.
Preferably as the present invention, the circuit module further includes interface unit, and the interface unit is used for output information.
The present invention also provides a kind of miniaturization TOF mould groups, including lens assembly, and TOF circuit module as described above;
Light is projected to the TOF circuit module by the lens assembly, to obtain range information by the TOF circuit module.
As it is of the invention preferably, stack in the circuit board of arrangement adjacent layer circuit board respectively by different shells.
Preferably as the present invention, the encapsulating housing size for stacking the bottom circuit board in the circuit board of arrangement is greater than other
Encapsulating housing size outside layer circuit board.
The invention has the following advantages:
A kind of miniaturization TOF circuit module of the present invention and TOF mould group, package dimension are small, it is ensured that before electric property reliability
It puts, save electric components quantity and simplifies wiring, further minimize module or mould packet size.
Detailed description of the invention
Fig. 1 is the structure chart of present invention miniaturization TOF circuit module inner light source unit;
Fig. 2 is the circuit diagram of present invention miniaturization TOF circuit module inner light source driving circuit;
Fig. 3 is the circuit diagram that present invention miniaturization TOF circuit module really feels photon unit and its peripheral circuit;
Fig. 4 is the circuit diagram of voltage regulation unit in present invention miniaturization TOF circuit module;
Fig. 5 is the circuit diagram that eyeball protects circuit in present invention miniaturization TOF circuit module;
Fig. 6 is the circuit diagram of storage circuit in present invention miniaturization TOF circuit module;
Fig. 7 is the structural schematic diagram of present invention miniaturization TOF mould group;
Fig. 8 is the schematic diagram of internal structure that TOF mould group removes after encapsulating shell in Fig. 7.
Specific embodiment
It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.It is excellent in being described below
Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It defines in the following description
Basic principle of the invention can be applied to other embodiments, variant schemes, improvement project, equivalent program and do not carry on the back
Other technologies scheme from the spirit and scope of the present invention.
TOF is one of the main technical schemes that current 3D depth camera uses, and has and postpones advantage small, at low cost.TOF
Technology has application scenarios abundant, in automobile, industry, recognition of face, health, game, amusement, film special efficacy, 3D printer
There is application with numerous areas such as robots.In some specific fields, such as mobile phone consumer electronics industry, pass through TOF
Mould group obtains rapidly depth information, carries out action detection, Expression Recognition, entertainment interactive in conjunction with corresponding APP;For another example security protection is supervised
The machine vision of control, the test object supervision application of sensitive area;For another example robot is in automatic Pilot field avoidance;It is for another example medical
With the facial 3D identification etc. in terms of biology, the image resolution ratio of 3D detection, precision, detection range all have higher requirements, and
It is relatively high to the small form factor requirements of application size.
Currently, VCSEL(Vertical Cavity Surface Emitting Laser, Vertical Cavity Surface emits laser
Device) because having lesser far-field divergence angle, narrow transmitting beam and circle, coupling efficiency height is, it can be achieved that high packaging density and Low threshold
Electric current;Active area dimensions are small, stablize, and the service life is long etc. a little, as the Primary Component in optoelectronic applications, with photosensitive element knot
It closes and realizes TOF technology.
Existing TOF circuit module includes two parts, and a part is for providing active light source to the light source list of object
Member, another part is the reflection signal for receiving object, to obtain the sense of range information of the object apart from circuit module
Light unit.The TOF circuit module and lens assembly encapsulation constitute TOF mould group.TOF light source in light source unit uses VCSEL,
COB encapsulation is carried out according to its specification.Size after general original package is 4.1mm*4.1mm, and the VCSEL of original package is in TOF
Certain space, the especially position mould group leader * wide space are occupied in mould group.In non-enclosed package, naked DIE form
The size of VCSEL is about 0.557mm*0.673mm, it is seen that the size of the VCSEL of Die encapsulation is at least than original package VCSEL
More than size is half.Referring to attached drawing 7 as it can be seen that naked encapsulation TOF light source 50, due to eliminating outer enclosure shell, so that mould group
Interior device arrangement is more compact, and the overall dimensions of TOF mould group greatly reduce.For this purpose, the invention proposes a kind of miniaturization TOF
Circuit module is packaged in the TOF light source in light source unit is naked on circuit module.Preferably, the TOF light source is with VCSEL crystalline substance
Circle mode encapsulates (referring to Fig.1), can save big quantity space.The TOF light source of naked encapsulation is unable to satisfy the requirement for not stopping launch angle,
For this purpose, the VCSEL of different launch angles is designed by different DOE outside TOF light source, that is, useful in TOF light source peripheral hardware
Optical element, such as optical glass needed for the active light source for providing different launch angles, can be suitble to different scenes to develop thus
Use demand, matches different types of optical element, and TOF mould group uses more flexible.
The light source unit, for providing active light source to object.Object will reflect signal project it is described photosensitive
Unit, the photosensitive unit receive reflection signal and are handled, and then combine optical signal and the analysis of reflection signal, calculate
Range information to object apart from circuit module, and then obtain the image information for having depth information.
The light source unit includes light source driving circuit, for driving light source to generate modulation light.Fig. 2 shows light source drivings
One embodiment of circuit, the light source driving circuit include buffer, switching device.The photosensitive unit connects the buffering
Device, the buffer connect the switching device.Such as Fig. 2, the buffer is a buffer logic chip U3, the switching device
Output end for mosfet transistor U4, the buffer logic chip U3 connects the grid of the mosfet transistor U4, described
The drain electrode of mosfet transistor U4 is connect with the cathode of light emitting diode D1, the source electrode ground connection of the mosfet transistor U4.Institute
The power end for stating buffer logic chip U3 is grounded through the 25th capacitor C25, the input terminal of the buffer logic chip U3 and institute
It states photosensitive unit connection and input terminal is grounded through second resistance R2.Peak power when in order to ensure VCSEL work, improves and visits
Environment bright when depth information is surveyed, is parallel with the 19th capacitor C19, the 20th capacitor on the supply lines of VCSEL connection power supply
C20.Wherein, the switching device can be replaced the switching circuit with switching device.For improve electric property reliability and
Accuracy, the buffer, the switching device or the switching circuit with switching device, the neighbouring TOF light source are arranged.
The light source unit further includes modulator, modulates the driving frequency of LED buffer in the LED drive circuit, makes
It obtains the fiber-optic signal frequency that LED is generated by driving to change, to change measurable operating distance of the TOF circuit module.
The light source unit further includes temperature sensing circuit, and the temperature sensing circuit is for detecting TOF light-source temperature.With
It is that TOF light source is detected using the temperature sensing circuit with warming chip for temperature sensing circuit.Warming chip has certain
Size, and need to read the temperature value that warming chip detects by I2C interface, then judge whether light source is in normal work
Otherwise state is not handled if then handling present image.The mode of this indirect thermometric, needs to use more component, no
Conducive to circuit configuration optimization, and signal-obtaining processing needs transfer, and efficiency is lower.For this purpose, temperature sensing circuit of the present invention includes
Thermistor.The temperature sensing circuit is connected to the photosensitive unit, and specifically, the thermistor is connected to photosensitive unit
Interior sensitive chip.Thermistor NTC detection TOF light-source temperature is directlyed adopt in this way, can directly obtain the temperature on the periphery VCSEL
Degree measures more acurrate, to not only save number of devices, arrange in space and mould group on circuit board space, also saves on I2C
Data.For the reliability and detection accuracy for improving electric property, the thermistor is arranged adjacent to the TOF light source.
The light source unit further includes protection circuit, and the protection circuit provides the scheduled limitation power of TOF light source.
Such as Fig. 5, the protection circuit includes sample circuit, comparison circuit, current detection switch circuit.The sample circuit is through the ratio
Compared with current detection switch circuit described in circuit connection.The sample circuit includes current sense amplifier.The comparison circuit packet
Include comparator.The current detection switch circuit includes current limiting load switch.As Fig. 5, the current sense amplifier U5 will be examined
Through comparator U6 multilevel iudge after the Current amplifier measured, judge whether the current value of VCSE light source is more than the receivable electricity of human eye
Secure threshold range is flowed, and current limiting load switch U7 output is controlled according to judging result, reaches protection eye to limit transmission power
The purpose of ball.The protection circuit further includes shunt circuit, the shunt circuit include the 8th resistance R8, the 8th resistance with
The current sense amplifier U5 is electrically connected side by side, to carry out separating flow sampling.The protection circuit further includes average low pass circuit,
The average low pass circuit includes being connected between the current sense amplifier U5 output end and the comparator U6 input terminal
The tenth resistance R10, and be connected between the current sense amplifier U5 ground terminal and the comparator U6 input terminal
17th capacitor C17.When current sense amplifier U5 output current information to the average low pass circuit, the average low pass electricity
Road handles the current information and obtains current average.The protection circuit further includes wrong latch cicuit, and the mistake latches
Circuit include two be connected in series between the shunt circuit and the current detection switch circuit the 9th resistance R9, the 11st
Resistance R11.The shunt circuit is exported to the wrong latch cicuit, and the mistake latch cicuit exports the TOF light source
Status information is to the current detection switch circuit.The current detection switch circuit is according to the wrong latch cicuit and described
The information of comparison circuit controls TOF light source working.The protection circuit includes peak current limit circuit, the peak point current limit
Circuit processed includes the twelfth resistor R12 for being connected to the current limiting load switch U7, and the peak current limit circuit can limit
Circuit peak working load power.The protection circuit is equipped with also between the current detection switch circuit and the shunt circuit and connects
Ground capacitor.Under foregoing circuit cooperation, scheduled different brackets output power, the protection circuit are hindered by adjusting in order to obtain
Capacitance changes limitation power.
The light source unit further includes power supply circuit, and the power supply circuit is that the sensitive chip in the photosensitive unit supplies
Electricity.The power supply circuit includes the first power supply sub-circuit and the second power supply sub-circuit.The first power supply sub-circuit includes first
Voltage-stablizer, first voltage-stablizer connect external power supply.Specifically, first voltage-stablizer be LDO voltage stabilizer U8, described first
The input terminal of voltage-stablizer U8 is grounded through the 21st capacitor C21, and output end is grounded through the 22nd capacitor C22.Described second
Sub-circuit of powering includes the second voltage-stablizer, and second voltage-stablizer is connect with external power supply.Specifically, second voltage-stablizer is
LDO voltage stabilizer U9.The input terminal of the second voltage-stablizer U9 is grounded through the 23rd capacitor C23, and output end is through the 24th
Capacitor C24 ground connection.LDO voltage stabilizer can adjust output voltage, will fluctuate supply voltage larger and that electric appliance requirement is not achieved and stablize
In the setting range of electric appliance, various circuits or electrical equipment is enable to work normally under rated operational voltage.
Such as Fig. 3, the photosensitive unit includes sensitive chip, such as CD sensor or cmos sensor.The sensitive chip is negative
Image Acquisition is blamed, including photoelectric conversion, frame of pixels are read and the operating process such as transfer, the amplification output of charge voltage conversion signal.
The photosensitive unit further includes filter circuit, and the filter circuit is connected to the power end of the sensitive chip.It is logical
Setting LDO voltage stabilizer is crossed, the reliability of power supply is optimized, then increases the reliability of mould group.In the electricity of this optimization design
The filter circuit quantity connecting with sensitive chip is further saved under road.In the case where external power supply reliability is poor, need
It uses a plurality of filter circuit or filter circuit needs more shunt capacitances to filter clutter.For example, 3V3 power supply is original in Fig. 3
Two filter circuits, and a filter circuit for needing to be made of 5 shunt capacitances are needed, another is by 3 shunt capacitance
The filter circuit of composition.And it is present, after increasing LDO voltage stabilizer, a filter circuit can be omitted.As it can be seen that power supply
Under optimization, not only improve power supply reliability, at the same can clipped filter capacitor, and then save number of devices, arrange on circuit board
Space in cloth space and mould group.The TOF circuit module further includes storage unit.The storage unit includes memory.Institute
It states storage unit and is connected to the photosensitive unit.The storage unit is used to save the nominal data of the TOF light source, such as photosensitive
The element time for exposure to carry out shutter control level conversion and the control of clamped level, and accurately controls the CCD time for exposure.Institute
Stating storage circuit includes FLASH chip and its peripheral circuit (referring to attached drawing 6).Previous storage circuit using eeprom chip and its
Peripheral circuit, and eeprom chip is I2C interface, eeprom chip size itself is quite big, and the time of data recording
With data reliability not as good as FLASH chip.For this purpose, eeprom chip to be changed to the Flash chip of SPI interface, chip is reduced
Size saves arrangement space, and improves the burning rate and data reliability of data.
The TOF circuit module further includes control unit (not shown).Described control unit controls the light source list
The first and described photosensitive unit work.Light source driving circuit in the light source unit is communicatively coupled to described control unit, passes through
Interworking between described control unit coordinated control light source driving circuit and equipment.
The TOF circuit module further includes interface unit.Interface unit is for TOF circuit module internal unit and various outer
Peripheral equipment is communicated in a serial fashion to exchange information.Peripheral equipment can be FLASHRAM, network controller, MCU etc..It is described to connect
Mouth unit includes SPI interface, so that TOF circuit module easily transmits data, is easily communicated with external control host foundation.Institute
Stating interface unit further includes power interface, for connecting external power supply.
In addition, the pcb board of integrated foregoing circuit had also been made on TOF circuit module or even the spatial arrangement of TOF mould group into
One step is improved.In the past, the circuit in TOF circuit module was integrated on one layer of PCB, such as one piece is set to TOF mould group bottom
Pcb board or two pieces of pcb boards set on TOF mould group bottom different location.It is arranged so down, because of circuit element needed for TOF mould group
It is more, need to arrange all circuit elements on one layer of plane where bottom, if you need to exist to TOF circuit module or TOF mould group
Minification, becomes particularly difficult in the range of long * wide.For this purpose, the invention proposes the structure that circuit board stacks arrangement, it is described
Light source unit and the photosensitive unit are set on the circuit board for stacking arrangement, and stacking arrangement is at least made of two pieces of circuit boards
Structure.The circuit board for stacking arrangement can be the circuit board of the folded arrangement of 2 layer heaps or the folded arrangement of 3 layer heaps.Such as Fig. 8, the light
Source unit and the photosensitive unit are integrated on the circuit board of the folded arrangement of 2 layer heaps.It is examined based on electric property reliability and accuracy
Consider, by the light source unit driving circuit and/or temperature sensing circuit be set to stack arrangement circuit board close to TOF light source
Position, i.e. place driving circuit and/or temperature sensing circuit on upper layer circuit board in Fig. 8.
When there is multiple-level stack, adjacent two layers stacked structure is divided into the upper and lower herein, and continue below with this
Description.The thickness of general TOF mould group can be accomplished within 6 millimeters, even more thin.For this purpose, needing to consider when carrying out stacking arrangement
Pcb board is stacked into the thickness that the height after being arranged and being encapsulated is no more than TOF mould group.It is found that the left side of TOF mould group is felt in figure
Light part has occupied larger space on TOF mould group thickness direction, then stack design is more difficult and difficult on the photosensitive part in left side
To arrange the PCB for being more than two layers;Stack design is preferably carried out on right side source part thus.
Such as Fig. 8, for two layers, including 10 and of layer circuit board is gone up in upper layer circuit board 10, lower circuit plate 20 and connection
The connecting plate 30 of lower circuit plate 20.It stacks and passes through disjunctor stack manner in the circuit board of arrangement between adjacent layer circuit board or divide
Body stack manner stacks.Disjunctor stack manner, the upper layer circuit board 10, lower circuit plate plate 20,30 three one of connecting plate
It is body formed, in this way in order to which TOF circuit module to be assemblied in TOF mould group, and it is convenient for TOF module packaging.Seperated stack manner,
The upper layer circuit board 10 is integrally formed with connecting plate 30, when needing to stack arrangement, the mode that can be matched, by it under
Layer circuit board plate 20 connects.The connecting plate 30 be fixed on the mode of the lower circuit plate of adjacent layer circuit board for welding, riveting,
Any one in being spirally connected, being bonded.Under one embodiment, the connecting plate 30 is made of Rigid Flex, including is connected to phase
The hardboard 301 of the lower circuit plate of adjacent circuit plate, one end connect the upper layer of the hardboard 301 and other end connection adjacent circuit plate
The soft board 302 of circuit board.Under another embodiment, the connecting plate is made of soft board and stiffening plate, including is connected to adjacent electricity
The stiffening plate of the lower circuit plate of road plate, one end connect the upper layer circuit board of the stiffening plate and other end connection adjacent circuit plate
Soft board.Wherein, the stiffening plate can be steel plate, also can help to radiate while connecting adjacent circuit plate.It is described soft
The junction that plate 302 is connected to the upper layer circuit board 10 of adjacent circuit plate is connected in arcuation.
Under layer stack, the TOF mould group has also been made adaptability encapsulation and improves.To lower circuit plate 20 and upper layer circuit
Space is encapsulated by lower encapsulating shell 21 in conjunction with connecting plate 30 between plate 10;Upper envelope is passed through to upper 10 or more space of layer circuit board
Dress shell 22 encapsulates.The encapsulating housing size for stacking the bottom circuit board in the circuit board of arrangement is greater than other layer circuit boards
The size that outer encapsulating housing size, such as size of the lower encapsulating shell 21 are greater than the upper encapsulating shell 22.Due to layer stack,
Encapsulating housing is not original integral packaging, so that there is the problems such as sealing, heat dissipation in the encapsulation between adjacent housings, for this purpose, this
Location hole is also arranged in invention on circuit boards, and positioning column is arranged on the package, and positioning column is positioned and fixed in location hole;
And fixation is packaged using glue;In addition, increasing the further auxiliary heat dissipations of heat sink materials such as heat-conducting silicone grease when packaged;Encapsulation
Shell and welding circuit board are fixed afterwards, increasing protective rubber at solder joint prevents solder joint from aoxidizing and enhance encapsulation bonding strength.This hair
After the seperated encapsulation of bright progress, the device on every layer circuit board can be entirely sealed in encapsulating shell plastic.Compared to integral packaging
For, fission encapsulation is more preferable for the protection of device and sealing performance, is influenced to further decrease by dust etc.;It further reduces
The size requirements of existing TOF mould group realize miniaturization;Also completely cut off between device, as device mutually passes between multilayer circuit board
A possibility that heat conduction amount.
The present invention uses above-mentioned stack manner, can greatly save mould group space, improve the utilization rate in space.More into one
It walks, not only naked encapsulation TOF light source, and using under above-mentioned stack manner, the size of TOF circuit module and TOF mould group is substantially reduced,
And also meet the diversified demand of configuration.
TOF mould group of the present invention combines above-mentioned TOF circuit module to form modular TOF device with optical device.Institute
Stating TOF mould group includes lens assembly 40 and TOF circuit module.The lens assembly 40 is installed on above the TOF circuit module,
For the light for being incident in TOF mould group to be modulated, so that penetrate by the light that object reflects in TOF mould group, thus
The image and depth, the information of distance of target are obtained by light information.The TOF mould group is in the image for realizing the target that is taken
The depth information of target can be obtained while intake, to realize 3D camera function, and the circuit module of the TOF mould group
Highly integrated and compact-sized arrangement with optical device so that TOF mould group is achieved modularity be suitable for being installed on
The smart machine of different sizes and functional requirement.
The TOF mould group is as follows in the concrete principle for the 3D rendering for absorbing the target: the light source of the TOF circuit module
Light source driving circuit driving light source in unit generates the optical signal of predetermined modulation frequency, and it is made to be projected to object;Projection
Optical signal to object obtains reflection signal after object reflects;It reflects signal to be received by TOF mould group, passes through the mirror
Head assembly enters the TOF module internal;The photosensitive unit of the TOF circuit module receives light and photosensitive, and optical signal is turned
Become electronic signal and the incident light and reflected light signal that are projected to object are analyzed, handled, and then obtains object
3D rendering and range information.
It should be understood by those skilled in the art that foregoing description and the embodiment of the present invention shown in the drawings are only used as illustrating
And it is not intended to limit the present invention.The purpose of the present invention completely effectively realizes.Function and structural principle of the invention is in reality
It applies and shows and illustrate in example, under without departing from the principle, embodiments of the present invention can have any deformation or modification.
Claims (45)
1. a kind of miniaturization TOF circuit module characterized by comprising
Light source unit, for providing active light source to object;
Photosensitive unit, for receiving the reflection signal of object, to obtain range information of the object apart from the circuit module;
Wherein, the light source unit and the photosensitive unit are set on the circuit board for stacking arrangement.
2. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the circuit board for stacking arrangement is 2
The circuit board of the folded arrangement of layer heap or the folded arrangement of 3 layer heaps.
3. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the light source unit includes driving
Dynamic circuit, the driving circuit is for driving TOF light source working.
4. a kind of miniaturization TOF circuit module according to claim 3, which is characterized in that the driving circuit is set to heap
The circuit board of folded arrangement is close to the position of TOF light source.
5. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the light source unit includes temperature
Detection circuit is spent, the temperature sensing circuit is for detecting TOF light-source temperature.
6. a kind of miniaturization TOF circuit module according to claim 5, which is characterized in that the temperature sensing circuit is set
In the circuit board that stacking is arranged close to the position of TOF light source.
7. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that stack in the circuit board of arrangement
It is stacked between adjacent layer circuit board by disjunctor stack manner or seperated stack manner.
8. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that stack in the circuit board of arrangement
It is connected between adjacent layer circuit board by connecting plate.
9. a kind of miniaturization TOF circuit module according to claim 8, which is characterized in that the connecting plate is integrally formed
In on the upper layer circuit board of adjacent layer circuit board.
10. a kind of miniaturization TOF circuit module according to claim 9, which is characterized in that the upper layer circuit board passes through
Connecting plate is fixed on the lower circuit plate of adjacent layer circuit board.
11. a kind of miniaturization TOF circuit module according to claim 10, which is characterized in that the connecting plate is fixed on
The mode of the lower circuit plate of adjacent layer circuit board is any one in welding, rivet, being spirally connected, being bonded.
12. a kind of miniaturization TOF circuit module according to claim 8, which is characterized in that the connecting plate is integrally formed
Between adjacent layer circuit board.
13. a kind of miniaturization TOF circuit module according to claim 8, which is characterized in that the connecting plate is by soft or hard knot
Plywood is constituted.
14. a kind of miniaturization TOF circuit module according to claim 13, which is characterized in that the hardboard of the connecting plate
It is connected to the lower circuit plate of adjacent circuit plate, one end of the soft board connects the hardboard, and the soft board other end connects phase
The upper layer circuit board of adjacent circuit plate.
15. a kind of miniaturization TOF circuit module according to claim 14, which is characterized in that the soft board is connected to phase
The junction of the upper layer circuit board of adjacent circuit plate is connected in arcuation.
16. a kind of miniaturization TOF circuit module according to claim 8, which is characterized in that the connecting plate by soft board and
Stiffening plate is constituted.
17. a kind of miniaturization TOF circuit module according to claim 16, which is characterized in that the reinforcement of the connecting plate
Plate is connected to the lower circuit plate of adjacent circuit plate, and one end of the soft board connects the stiffening plate, the other end of the soft board
Connect the upper layer circuit board of adjacent circuit plate.
18. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the adjacent layer circuit board it
Between spacing be greater than 1.5 millimeters.
19. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that in the light source unit
TOF light source is naked to be packaged on the circuit module.
20. a kind of miniaturization TOF circuit module according to claim 19, which is characterized in that the TOF light source is with wafer
Mode is packaged on the circuit module.
21. a kind of miniaturization TOF circuit module according to claim 19, which is characterized in that the TOF light source is externally provided with
Optical element needed for active light source for providing different launch angles.
22. a kind of miniaturization TOF circuit module according to claim 21, which is characterized in that the optical element is light
Learn glass.
23. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the light source unit includes
TOF light source.
24. a kind of miniaturization TOF circuit module described in 9 or 23 according to claim 1, which is characterized in that the TOF light source is
VCSEL。
25. a kind of miniaturization TOF circuit module according to claim 3, which is characterized in that the light source driving circuit packet
Include buffer, switching device or the switching circuit with switching device;The photosensitive unit connects the buffer, the buffering
Device connects the switching device or the switching circuit.
26. a kind of miniaturization TOF circuit module according to claim 25, which is characterized in that the switching device is
Mosfet transistor.
27. a kind of miniaturization TOF circuit module according to claim 5, which is characterized in that the temperature sensing circuit packet
Include thermistor.
28. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the light source unit includes protecting
Protection circuit, the protection circuit provide the scheduled limitation power of TOF light source.
29. a kind of miniaturization TOF circuit module according to claim 28, which is characterized in that the protection circuit includes
Sample circuit, comparison circuit, current detection switch circuit;The sample circuit connects the current detecting through the comparison circuit
Switching circuit.
30. a kind of miniaturization TOF circuit module according to claim 29, which is characterized in that the sample circuit includes
Current sense amplifier.
31. a kind of miniaturization TOF circuit module according to claim 29, which is characterized in that the comparison circuit includes
Comparator.
32. a kind of miniaturization TOF circuit module according to claim 29, which is characterized in that the current detection switch
Circuit includes current limiting load switch.
33. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the light source unit further includes
Power supply circuit, the power supply circuit are the sensitive chip power supply in the photosensitive unit.
34. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the photosensitive unit includes sense
Optical chip.
35. a kind of miniaturization TOF circuit module according to claim 34, which is characterized in that the sensitive chip is
CMOS sensitive chip.
36. a kind of miniaturization TOF circuit module according to claim 34, which is characterized in that the photosensitive unit also wraps
Filter circuit is included, the filter circuit is connected to the power end of the sensitive chip.
37. a kind of miniaturization TOF circuit module according to claim 33, which is characterized in that said supply unit includes
It is connected with external power source voltage-stablizer.
38. a kind of miniaturization TOF circuit module according to claim 37, which is characterized in that the voltage-stablizer is that LDO is steady
Depressor.
39. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the circuit module further includes
Storage unit, the storage unit are used to save the nominal data of TOF light source.
40. a kind of miniaturization TOF circuit module according to claim 39, which is characterized in that the storage unit includes
Memory.
41. a kind of miniaturization TOF circuit module according to claim 40, which is characterized in that the memory is FLASH
Storage chip.
42. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the circuit module further includes
Interface unit, the interface unit are used for output information.
43. a kind of miniaturization TOF mould group, which is characterized in that including lens assembly, and as described in one of claim 1-42
TOF circuit module;Light is projected to the TOF circuit module by the lens assembly, to be obtained by the TOF circuit module
Range information.
44. a kind of miniaturization TOF mould group according to claim 43, which is characterized in that stack phase in the circuit board of arrangement
Adjacent bed circuit board is encapsulated by different shells respectively.
45. a kind of miniaturization TOF mould group according to claim 44, which is characterized in that stack in the circuit board of arrangement
The encapsulating housing size of bottom circuit board is greater than the encapsulating housing size outside other layer circuit boards.
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0738185A (en) * | 1993-07-22 | 1995-02-07 | Fujitsu Ltd | Drive circuit for light emitting element |
CN101141048A (en) * | 2007-06-19 | 2008-03-12 | 中兴通讯股份有限公司 | Laser bias current current limiting circuit |
CN101341636A (en) * | 2005-12-20 | 2009-01-07 | 菲尼萨公司 | Modular transistor outline can with internal components |
CN103178441A (en) * | 2013-04-19 | 2013-06-26 | 苏州朗宽电子技术有限公司 | VCSEL (vertical cavity surface emitting laser) drive circuit |
CN103701033A (en) * | 2013-11-26 | 2014-04-02 | 上海华魏光纤传感技术有限公司 | Work protection system for DFB (distributed feed back) laser |
CN103780811A (en) * | 2012-10-19 | 2014-05-07 | 康耐视公司 | Carrier frame and circuit board for an electronic device |
CN103959086A (en) * | 2011-12-01 | 2014-07-30 | 莱卡地球系统公开股份有限公司 | Distance measuring device |
CN107454297A (en) * | 2017-09-12 | 2017-12-08 | 信利光电股份有限公司 | A kind of infrared photography module and camera device |
CN207704031U (en) * | 2017-12-08 | 2018-08-07 | 余姚舜宇智能光学技术有限公司 | A kind of miniaturization TOF circuit modules and TOF modules |
-
2017
- 2017-12-08 CN CN201711290878.3A patent/CN109901179A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0738185A (en) * | 1993-07-22 | 1995-02-07 | Fujitsu Ltd | Drive circuit for light emitting element |
CN101341636A (en) * | 2005-12-20 | 2009-01-07 | 菲尼萨公司 | Modular transistor outline can with internal components |
CN101141048A (en) * | 2007-06-19 | 2008-03-12 | 中兴通讯股份有限公司 | Laser bias current current limiting circuit |
CN103959086A (en) * | 2011-12-01 | 2014-07-30 | 莱卡地球系统公开股份有限公司 | Distance measuring device |
CN103780811A (en) * | 2012-10-19 | 2014-05-07 | 康耐视公司 | Carrier frame and circuit board for an electronic device |
CN103178441A (en) * | 2013-04-19 | 2013-06-26 | 苏州朗宽电子技术有限公司 | VCSEL (vertical cavity surface emitting laser) drive circuit |
CN103701033A (en) * | 2013-11-26 | 2014-04-02 | 上海华魏光纤传感技术有限公司 | Work protection system for DFB (distributed feed back) laser |
CN107454297A (en) * | 2017-09-12 | 2017-12-08 | 信利光电股份有限公司 | A kind of infrared photography module and camera device |
CN207704031U (en) * | 2017-12-08 | 2018-08-07 | 余姚舜宇智能光学技术有限公司 | A kind of miniaturization TOF circuit modules and TOF modules |
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