CN207704031U - A kind of miniaturization TOF circuit modules and TOF modules - Google Patents

Abstract

A kind of miniaturization TOF circuit modules and TOF modules, belong to TOF technical fields.The utility model minimizes TOF circuit modules：Light source unit, for providing active light source to object；Photosensitive unit, the reflection signal for receiving object, to obtain range information of the object apart from the circuit module；Wherein, the light source unit and the photosensitive unit are set on the circuit board for stacking arrangement.The utility model TOF modules include lens assembly and above-mentioned TOF circuit modules；Light is projected to the TOF circuit modules by the lens assembly, to obtain the above-mentioned camera module of range information by the TOF circuit modules.The utility model uses new packing forms, and under the premise of ensuring electric property reliability, realizes the compact in size of module and module.

Description

A kind of miniaturization TOF circuit modules and TOF modules

Technical field

The utility model belongs to TOF technical fields more particularly to a kind of miniaturization TOF circuit modules and TOF modules.

Background technology

With optical measurement and the development of computer vision, optical three-dimensional measurement technology is gradually ripe, has gradually appeared In the consumer electronics industry such as mobile phone, security protection and monitoring, robot in medical treatment and the fields such as biology, also become current measure and lead Hot spot in domain, and these application processes all be unable to do without 3D camera modules.

TOF（Time-Of-Flight, flight time）Technology is more outstanding one in numerous three dimensional optical measuring technologies Kind.The basic principle of TOF technologies is that the light of active light source transmitting is captured after testee reflects by TOF device, then TOF device calculates the distance of testee according to light by sending out to the time difference of capture or phase difference, to generate depth letter Breath.In addition it is shot in conjunction with traditional camera, so that it may the three-D profile of object to be represented to the figure of different distance in different colors Shape mode shows.

TOF depth cameras are the application apparatus based on TOF technologies to grow up in recent years, can not only be to traditional 2D Camera obtains light intensity information like that, moreover it is possible to obtain in real time on sensor devices each pixel to target object it is corresponding away from From.But with the rapid development of smart machine, TOF depth cameras can not keep up with the hair of smart machine in 3D camera shootings etc. Step is opened up, the demand of smart machine is cannot be satisfied.

The integrated levels of existing TOF depth cameras is low, has a single function, and is an existing apparent problem.With depth camera For application in recognition detection, in detecting identification process, TOF depth cameras need and scanner, information processing equipment Etc. matching, measurement process is separated from each other with imaging, and process flow is complicated, and corresponding hardware device is more, is completely inappropriate for answering For existing smart machine, it cannot especially meet the lightening development of smart machine in the prior art, such as mobile phone, tablet computer Deng the 3D camera modules for needing to configure small volume for safety monitoring, robot, medical biological field cannot be met.

Utility model patent CN206532072U discloses a kind of optical projection apparatus and its depth camera, specific open Optical projection apparatus includes light source, and light source includes the light source battle array of semiconductor substrate and setting on the semiconductor substrate Row, for emitting light beam；Circuit board is installed on the semiconductor substrate and is provided with through-hole, and the through-hole makes the light beam Pass through；Light beam generator, on the circuit board and for projecting pattern beam outward after receiving the light beam.The reality It uses new patent to reduce the thickness of device by regarding the semiconductor substrate in light source as support base, and then meets intelligence and set Standby small demand.But the thickness of pedestal is only reduced to reach the purpose of optical projection apparatus thickness diminution, to inside The stability and reliability of signal processing do not have improvement.

Application for a patent for invention CN106817794A discloses a kind of TOF circuit modules and its application.This application will be by that will lead The driving and controlling circuits of dynamic light source are blended with TOF circuits to solve the problems, such as additionally to use driving circuit.This application passes through Improve circuit structure mode, mainly equipment compatibility is optimized, not to TOF circuit modules based on volume minimize and Carry out the optimization of circuit reliability.

Utility model content

The purpose of this utility model be to provide a kind of high electric property reliability, TOF circuit modules compact in size and TOF modules.

According to above-mentioned purpose, the utility model provides a kind of miniaturization TOF circuit modules, including：

Light source unit, for providing active light source to object；

Photosensitive unit, the reflection signal for receiving object, to obtain distance of the object apart from the circuit module Information；

Wherein, the light source unit and the photosensitive unit are set on the circuit board for stacking arrangement.

Preferred as the utility model, the circuit board for stacking arrangement is the circuit of the folded arrangement of 2 layer heaps or the folded arrangement of 3 layer heaps Plate.

Preferred as the utility model, the light source unit includes driving circuit, and the driving circuit is for driving TOF light Source works.

Preferred as the utility model, the driving circuit is set to the circuit board for stacking arrangement close to the position of TOF light sources.

Preferred as the utility model, the light source unit includes temperature sensing circuit, and the temperature sensing circuit is used for Detect TOF light-source temperatures.

Preferred as the utility model, the temperature sensing circuit is set to the circuit board for stacking arrangement close to TOF light sources Position.

It is preferred as the utility model, it stacks in the circuit board of arrangement between adjacent layer circuit board through disjunctor stack manner Or seperated stack manner stacks.

It is preferred as the utility model, it stacks in the circuit board of arrangement and is connected by connecting plate between adjacent layer circuit board.

Preferred as the utility model, the connecting plate is shaped on the upper layer circuit board of adjacent layer circuit board.

Preferred as the utility model, the upper layer circuit board is fixed on lower layer's electricity of adjacent layer circuit board by connecting plate On the plate of road.

Preferred as the utility model, the mode that the connecting plate is fixed on the lower circuit plate of adjacent layer circuit board is weldering Connect, rivet, being spirally connected, be bonded in any one.

Preferred as the utility model, the connecting plate is shaped between adjacent layer circuit board.

Preferred as the utility model, the connecting plate is made of Rigid Flex.

Preferred as the utility model, the hardboard of the connecting plate is connected to the lower circuit plate of adjacent circuit plate, described One end of soft board connects the hardboard, and the soft board other end is connected to the upper layer circuit board of adjacent circuit plate.

Preferred as the utility model, the junction that the soft board is connected to the upper layer circuit board of adjacent circuit plate is in arcuation Connection.

Preferred as the utility model, the connecting plate is made of soft board and stiffening plate.

Preferred as the utility model, the stiffening plate of the connecting plate is connected to the lower circuit plate of adjacent circuit plate, institute The one end for stating soft board connects the stiffening plate, the upper layer circuit board of the other end connection adjacent circuit plate of the soft board.

Preferred as the utility model, the spacing between the adjacent layer circuit board is more than 1.5 millimeters.

Preferred as the utility model, TOF light sources in the light source unit are naked to be packaged on the circuit module.

Preferred as the utility model, the TOF light sources are packaged in a manner of wafer on the circuit module.

Preferred as the utility model, the TOF light sources are externally provided with the active light source institute for providing different launch angles The optical element needed.

Preferred as the utility model, the optical element is optical glass.

Preferred as the utility model, the light source unit includes TOF light sources.

Preferred as the utility model, the TOF light sources are VCSEL.

It is preferred as the utility model, the light source driving circuit include buffer, switching device or have switching device Switching circuit；The photosensitive unit connects the buffer, and the buffer connects the switching device or switch electricity Road.

Preferred as the utility model, the switching device is mosfet transistor.

Preferred as the utility model, the temperature sensing circuit includes thermistor.

Preferred as the utility model, the light source unit includes protection circuit, and it is pre- that the protection circuit provides TOF light sources Fixed limitation power.

Preferred as the utility model, the protection circuit includes sample circuit, comparison circuit, current detection switch electricity Road；The sample circuit connects the current detection switch circuit through the comparison circuit.

Preferred as the utility model, the sample circuit includes current sense amplifier.

Preferred as the utility model, the comparison circuit includes comparator.

Preferred as the utility model, the current detection switch circuit includes current limiting load switch.

Preferred as the utility model, the light source unit further includes power supply circuit, and the power supply circuit is described photosensitive Sensitive chip power supply in unit.

Preferred as the utility model, the photosensitive unit includes sensitive chip.

Preferred as the utility model, the sensitive chip is CMOS sensitive chips.

Preferred as the utility model, the photosensitive unit further includes filter circuit, and the filter circuit is connected to described The power end of sensitive chip.

Preferred as the utility model, said supply unit includes being connected with external power source voltage-stablizer.

Preferred as the utility model, the voltage-stablizer is LDO voltage stabilizer.

Preferred as the utility model, the circuit module further includes storage unit, and the storage unit is for preserving TOF The nominal data of light source.

Preferred as the utility model, the storage unit includes memory.

Preferred as the utility model, the memory is FLASH storage chips.

Preferred as the utility model, the circuit module further includes interface unit, and the interface unit is believed for exporting Breath.

The utility model also provides a kind of miniaturization TOF modules, including lens assembly, and TOF circuits as described above Module；Light is projected to the TOF circuit modules by the lens assembly, to obtain distance letter by the TOF circuit modules Breath.

It is preferred as the utility model, adjacent layer circuit board is stacked in the circuit board of arrangement respectively by different shells.

Preferred as the utility model, the encapsulating housing size for stacking the bottom circuit board in the circuit board of arrangement is more than Encapsulating housing size outside other layer circuit boards.

The utility model has the advantages that:

A kind of miniaturization TOF circuit modules of the utility model and TOF modules, package dimension are small, it is ensured that electric property can Under the premise of property, saves electric components quantity and simplify wiring, further make module or module compact in size.

Description of the drawings

Fig. 1 is the structure chart that the utility model minimizes TOF circuit module inner light source units；

Fig. 2 is the circuit diagram that the utility model minimizes TOF circuit module inner light source driving circuits；

Fig. 3 is the circuit diagram that the utility model minimizes that TOF circuit modules really feel photon unit and its peripheral circuit；

Fig. 4 is the circuit diagram that the utility model minimizes voltage regulation unit in TOF circuit modules；

Fig. 5 is the circuit diagram that the utility model minimizes that eyeball in TOF circuit modules protects circuit；

Fig. 6 is the circuit diagram that the utility model minimizes storage circuit in TOF circuit modules；

Fig. 7 is the structural schematic diagram that the utility model minimizes TOF modules；

Fig. 8 is the internal structure schematic diagram that TOF modules remove after encapsulating shell in Fig. 7.

Specific implementation mode

It is described below for disclosing the utility model so that those skilled in the art can realize the utility model.It retouches below Preferred embodiment in stating is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It is retouched following The basic principle of the utility model defined in stating can be applied to other embodiments, variant scheme, improvement project, etc. Tongfangs The other technologies scheme of case and spirit and scope without departing from the utility model.

TOF is one of the main technical schemes that current 3D depth cameras use, and has and postpones advantage small, at low cost.TOF Technology has abundant application scenarios, in automobile, industry, recognition of face, health, game, amusement, film special efficacy, 3D printer There is application with numerous areas such as robots.In some specific fields, such as mobile phone consumer electronics industry, pass through TOF Module obtains rapidly depth information, and action detection, Expression Recognition, entertainment interactive are carried out in conjunction with corresponding APP；For another example security protection is supervised The machine vision of control, the detection object supervision application of sensitive area；For another example robot is in automatic Pilot field avoidance；It is for another example medical With the facial 3D identifications etc. in terms of biology, the image resolution ratio of 3D detections, precision, detection range all have higher requirements, and It is relatively high to the small form factor requirements of application size.

Currently, VCSEL（Vertical Cavity Surface Emitting Laser, Vertical Cavity Surface emit laser Device）Because having smaller far-field divergence angle, narrow transmitting beam and circle, coupling efficiency height is, it can be achieved that high packaging density and Low threshold Electric current；Active area dimensions are small, stablize, long lifespan etc. a little, as the Primary Component in optoelectronic applications, with photosensitive element knot It closes and realizes TOF technologies.

Existing TOF circuit modules include two parts, and a part is for providing light source list of the active light source to object Member, another part is the reflection signal for receiving object, to obtain the sense of range information of the object apart from circuit module Light unit.The TOF circuit modules constitute TOF modules with lens assembly encapsulation.TOF light sources in light source unit use VCSEL, COB encapsulation is carried out according to its specification.Size after general original package is 4.1mm*4.1mm, and the VCSEL of original package is in TOF Certain space, especially the module long positions * wide space are occupied on module.In non-enclosed package, naked DIE forms The size of VCSEL is about 0.557mm*0.673mm, it is seen that the size of the VCSEL of Die encapsulation is at least than original package VCSEL More than size is half as large.With reference to attached drawing 7 as it can be seen that naked encapsulation TOF light sources 50, due to eliminating outer enclosure shell so that module Interior device arrangement is more compact, and the overall dimensions of TOF modules greatly reduce.For this purpose, the utility model proposes a kind of small-sized Change TOF circuit modules, is packaged in the TOF light sources in light source unit are naked on circuit module.Preferably, the TOF light sources with VCSEL wafer modes encapsulate（Referring to Fig.1）, big quantity space can be saved.The TOF light sources of naked encapsulation, which cannot be satisfied, does not stop launch angle Requirement, for this purpose, the VCSEL of different launch angles is designed by different DOE outside TOF light sources, that is, outside TOF light sources Equipped with for providing the optical element needed for the active light source of different launch angles, such as optical glass, different fields can be suitble to thus Scape develops use demand, matches different types of optical element, and TOF modules use more flexible.

The light source unit, for providing active light source to object.Object will reflect signal project it is described photosensitive Unit, the photosensitive unit receive reflection signal and are handled, and then combine optical signal and the analysis of reflection signal, calculate Range information to object apart from circuit module, and then obtain the image information with depth information.

The light source unit includes light source driving circuit, for driving light source to generate modulation light.Fig. 2 shows light source drivings One embodiment of circuit, the light source driving circuit include buffer, switching device.The photosensitive unit connects the buffering Device, the buffer connect the switching device.Such as Fig. 2, the buffer is a buffer logic chip U3, the switching device Output end for mosfet transistor U4, the buffer logic chip U3 connects the grid of the mosfet transistor U4, described The drain electrode of mosfet transistor U4 is connect with the cathode of light emitting diode D1, the source electrode ground connection of the mosfet transistor U4.Institute The power end of buffer logic chip U3 is stated through the 25th capacitance C25 ground connection, the input terminal of the buffer logic chip U3 and institute It states photosensitive unit connection and input terminal is grounded through second resistance R2..Peak power when working in order to ensure VCSEL is improved and is visited Environment bright when depth information is surveyed, the 19th capacitance C19, the 20th capacitance are parallel on the supply lines of VCSEL connection power supplys C20.Wherein, the switching device can be replaced the switching circuit with switching device.For improve electric property reliability and Accuracy, the buffer, the switching device or the switching circuit with switching device, the neighbouring TOF light sources are arranged.

The light source unit further includes modulator, modulates the driving frequency of LED buffers in the LED drive circuit, makes It obtains the fiber-optic signal frequency that LED is generated by driving to change, to change measurable operating distance of the TOF circuit modules.

The light source unit further includes temperature sensing circuit, and the temperature sensing circuit is for detecting TOF light-source temperatures.With It is that TOF light sources are detected using the temperature sensing circuit with warming chip for temperature sensing circuit.Warming chip has certain Size, and need to read the temperature value that warming chip detects by I2C interface, then judge light source whether in normal work Otherwise state is not handled if then handling present image.The mode of this indirect thermometric needs to use more component, no Optimize conducive to circuit configuration, and signal-obtaining processing needs transfer, it is less efficient.For this purpose, the utility model temperature sensing circuit Including thermistor.The temperature sensing circuit is connected to the photosensitive unit, and specifically, the thermistor is connected to photosensitive Sensitive chip in unit.Directly thermistor NTC is used to detect TOF light-source temperatures in this way, the peripheries VCSEL can be directly obtained Temperature, measures more acurrate, not only saves number of devices, the space on circuit board in arrangement space and module, also saves I2C On data.To improve the reliability and detection accuracy of electric property, the thermistor is arranged adjacent to the TOF light sources.

The light source unit further includes protection circuit, and the protection circuit provides the scheduled limitation power of TOF light sources. Such as Fig. 5, the protection circuit includes sample circuit, comparison circuit, current detection switch circuit.The sample circuit is through the ratio The current detection switch circuit is connected compared with circuit.The sample circuit includes current sense amplifier.The comparison circuit packet Include comparator.The current detection switch circuit includes current limiting load switch.As Fig. 5, the current sense amplifier U5 will be examined Through comparator U6 multilevel iudges after the Current amplifier measured, judge whether the current value of VCSE light sources is more than the receivable electricity of human eye Secure threshold range is flowed, and current limiting load switch U7 outputs are controlled according to judging result, reaches protection eye to limit transmission power The purpose of ball.The protection circuit further includes shunt circuit, the shunt circuit include the 8th resistance R8, the 8th resistance with The current sense amplifier U5 is electrically connected side by side, to carry out separating flow sampling.The protection circuit further includes average low pass circuit, The average low pass circuit includes being connected between the current sense amplifier U5 output ends and the comparator U6 input terminals The tenth resistance R10, and be connected between the current sense amplifier U5 ground terminals and the comparator U6 input terminals 17th capacitance C17.When current sense amplifier U5 output current informations to the average low pass circuit, the average low pass electricity Road handles the current information and obtains current average.The protection circuit further includes wrong latch cicuit, and the mistake latches Circuit include two be connected in series between the shunt circuit and the current detection switch circuit the 9th resistance R9, the 11st Resistance R11.The shunt circuit is exported to the wrong latch cicuit, and the mistake latch cicuit exports the TOF light sources Status information is to the current detection switch circuit.The current detection switch circuit is according to the wrong latch cicuit and described The information of comparison circuit controls TOF light source workings.The protection circuit includes peak current limit circuit, the peak point current limit Circuit processed includes the twelfth resistor R12 for being connected to the current limiting load switch U7, and the peak current limit circuit can limit Circuit peak working load power.The protection circuit is equipped with also between the current detection switch circuit and the shunt circuit and connects Ground capacitance.Under foregoing circuit cooperation, scheduled different brackets output power, the protection circuit are hindered by adjusting in order to obtain Capacitance changes limitation power.

The light source unit further includes power supply circuit, and the power supply circuit is that the sensitive chip in the photosensitive unit supplies Electricity.The power supply circuit includes the first power supply sub-circuit and the second power supply sub-circuit.The first power supply sub-circuit includes first Voltage-stablizer, first voltage-stablizer connect external power supply.Specifically, first voltage-stablizer is LDO voltage stabilizer U8, described first The input terminal of voltage-stablizer U8 is grounded through the 21st capacitance C21 ground connection, output end through the 22nd capacitance C22.Described second Sub-circuit of powering includes the second voltage-stablizer, and second voltage-stablizer is connect with external power supply.Specifically, second voltage-stablizer is LDO voltage stabilizer U9.The input terminal of the second voltage-stablizer U9 is through the 23rd capacitance C23 ground connection, and output end is through the 24th Capacitance C24 ground connection.LDO voltage stabilizer can adjust output voltage, will fluctuate supply voltage larger and that electric appliance requirement is not achieved and stablize In the setting range of electric appliance, various circuits or electrical equipment is enable to be worked normally under rated operational voltage.

Such as Fig. 3, the photosensitive unit includes sensitive chip, such as CD sensors or cmos sensor.The sensitive chip is negative Image Acquisition is blamed, including opto-electronic conversion, frame of pixels are read and the operating process such as transfer, the amplification output of charge voltage conversion signal.

The photosensitive unit further includes filter circuit, and the filter circuit is connected to the power end of the sensitive chip.It is logical Setting LDO voltage stabilizer is crossed, the reliability of power supply is optimized, then increases the reliability of module.In the electricity of this optimization design The filter circuit quantity being connect with sensitive chip is further saved under road.In the case of external power supply reliability difference, need It uses a plurality of filter circuit or filter circuit needs more shunt capacitances to filter clutter.For example, 3V3 power supplys are original in Fig. 3 Two filter circuits are needed, and one needs the filter circuit being made of 5 shunt capacitances, another is by 3 shunt capacitance The filter circuit of composition.And it is present, after increasing LDO voltage stabilizer, a filter circuit can be omitted.As it can be seen that power supply Under optimization, not only improve power supply reliability, at the same can clipped filter capacitor, and then save number of devices, arrange on circuit board Space in cloth space and module.The TOF circuit modules further include storage unit.The storage unit includes memory.Institute It states storage unit and is connected to the photosensitive unit.The storage unit is used to preserve the nominal data of the TOF light sources, such as photosensitive The element time for exposure to carry out shutter control level conversion and the control of clamped level, and accurately controls the CCD time for exposure.Institute It includes FLASH chip and its peripheral circuit to state storage circuit（With reference to attached drawing 6）.Previous storage circuit using eeprom chip and its Peripheral circuit, and eeprom chip is I2C interface, eeprom chip size itself is quite big, and the time of data recording With data reliability not as good as FLASH chip.For this purpose, eeprom chip to be changed to the Flash chip of SPI interface, chip is reduced Size saves arrangement space, and improves the burning rate and data reliability of data.

The TOF circuit modules further include control unit（It is not shown in figure）.Described control unit controls the light source list The first and described photosensitive unit work.Light source driving circuit in the light source unit is communicatively coupled to described control unit, passes through Described control unit coordinates the interworking between control light source driving circuit and equipment.

The TOF circuit modules further include interface unit.Interface unit for TOF circuit modules internal unit with it is various outer Peripheral equipment is communicated in a serial fashion to exchange information.Peripheral equipment can be FLASHRAM, network controller, MCU etc..It is described to connect Mouthful unit includes SPI interface so that TOF circuit modules easily transmission data is easily communicated with external control host foundation.Institute It further includes power interface to state interface unit, for connecting external power supply.

In addition, the pcb board of integrated foregoing circuit had also been made on the spatial arrangement of TOF circuit modules or even TOF modules into One step is improved.In the past, the circuit in TOF circuit modules was integrated on one layer of PCB, such as one piece is set to TOF modules bottom Pcb board or two pieces of pcb boards for being set to TOF modules bottom different location.It is arranged so down, because of the circuit element needed for TOF modules It is more, it needs to arrange all circuit elements on one layer of plane where bottom, if you need to exist to TOF circuit modules or TOF modules Minification, becomes particularly difficult in the range of long * wide.For this purpose, the utility model proposes the structure that circuit board stacks arrangement, The light source unit and the photosensitive unit are set on the circuit board for stacking arrangement, and at least constitute stacking by two pieces of circuit boards Arrangement.The circuit board for stacking arrangement can be the circuit board of the folded arrangement of 2 layer heaps or the folded arrangement of 3 layer heaps.Such as Fig. 8, institute It states light source unit and the photosensitive unit is integrated on the circuit board of the folded arrangement of 2 layer heaps.Based on electric property reliability and accurately Property consider, by the light source unit driving circuit and/or temperature sensing circuit be set to stack arrangement circuit board close to TOF Driving circuit and/or temperature sensing circuit are placed on the upper layer circuit board in i.e. Fig. 8 in the position of light source.

When there is multiple-level stack, adjacent two layers stacked structure is divided into the upper and lower herein, and continue below with this Description.The thickness of general TOF modules can be accomplished within 6 millimeters, even more thin.For this purpose, when carrying out stacking arrangement, need to consider Pcb board is stacked into the thickness that the height after being arranged and being encapsulated is no more than TOF modules.It is found that the left side sense of TOF modules in figure Light part has occupied larger space on TOF module thickness directions, then stack design is more difficult and difficult on the photosensitive part in left side It is more than two layers of PCB with arrangement；Stack design is preferably carried out on right side source part thus.

Such as Fig. 8, for two layers, including 10 and of layer circuit board is gone up in upper layer circuit board 10, lower circuit plate 20 and connection The connecting plate 30 of lower circuit plate 20.Stack in the circuit board of arrangement between adjacent layer circuit board by disjunctor stack manner or point Body stack manner stacks.Disjunctor stack manner, the upper layer circuit board 10, lower circuit plate plate 20,30 three one of connecting plate It is body formed, in this way in order to which TOF circuit modules to be assemblied in TOF modules, and it is convenient for TOF module packagings.Seperated stack manner, The upper layer circuit board 10 is integrally formed with connecting plate 30, when needing to stack arrangement, the mode that can be matched, by it under Layer circuit board plate 20 connects.The connecting plate 30 be fixed on the lower circuit plate of adjacent layer circuit board mode be welding, riveting, Be spirally connected, be bonded in any one.Under one embodiment, the connecting plate 30 is made of Rigid Flex, including is connected to phase The hardboard 301 of the lower circuit plate of adjacent circuit plate, one end connect the upper layer of the hardboard 301 and other end connection adjacent circuit plate The soft board 302 of circuit board.Under another embodiment, the connecting plate is made of soft board and stiffening plate, including is connected to adjacent electricity The stiffening plate of the lower circuit plate of road plate, one end connect the upper layer circuit board of the stiffening plate and other end connection adjacent circuit plate Soft board.Wherein, the stiffening plate can be steel plate, also can help to radiate while connecting adjacent circuit plate.It is described soft The junction that plate 302 is connected to the upper layer circuit board 10 of adjacent circuit plate is connected in arcuation.

Under layer stack, the TOF modules have also been made adaptability encapsulation and improve.To lower circuit plate 20 and upper layer circuit Space is encapsulated by lower encapsulating shell 21 in conjunction with connecting plate 30 between plate 10；Upper envelope is passed through to 10 or more space of upper layer circuit board Dress shell 22 encapsulates.The encapsulating housing size for stacking the bottom circuit board in the circuit board of arrangement is more than other layer circuit boards Outer encapsulating housing size, such as size of the lower encapsulating shell 21 are more than the size of the upper encapsulating shell 22.Due to layer stack, Encapsulating housing is not original integral packaging so that there is the problems such as sealing, heat dissipation in the encapsulation between adjacent housings, for this purpose, this Location hole is also arranged in utility model on circuit boards, and positioning column is arranged on the package, and positioning column is positioned and fixed to positioning Kong Zhong；And it is packaged fixation using glue；In addition, increasing the heat sink materials such as heat-conducting silicone grease when packaged, further auxiliary dissipates Heat；Shell and welding circuit board are fixed after encapsulation, increasing protective rubber at solder joint prevents solder joint from aoxidizing and enhance encapsulation connection by force Degree.After the utility model carries out seperated encapsulation, the device on every layer circuit board can be entirely sealed in encapsulating shell plastic.It compares For integral packaging, fission encapsulation is more preferable for the protection of device and sealing performance, is influenced to further decrease by dust etc.； The size requirements of existing TOF modules are further reduced, realize miniaturization；Also completely cut off between device, as between multilayer circuit board Device mutually conducts the possibility of heat.

The utility model uses above-mentioned stack manner, can greatly save module space, improve the utilization rate in space.More into One step, not only naked encapsulation TOF light sources, and using under above-mentioned stack manner, the size of TOF circuit modules and TOF modules contracts significantly It is small, and also meet the diversified demand of configuration.

Above-mentioned TOF circuit modules are combined to form modular TOF and set with optical device by the utility model TOF modules It is standby.The TOF modules include lens assembly 40 and TOF circuit modules.The lens assembly 40 is installed on the TOF circuit modules Top, for the light for being incident in TOF modules to be modulated so that the light reflected by object is penetrated in TOF modules, To obtain the image and depth, the information of distance of target by light information.The TOF modules are realizing the target that is taken The depth information that target can be obtained while image capture, to realize 3D camera functions, and the circuit of the TOF modules The highly integrated and compact-sized arrangement with optical device of module so that TOF modules are achieved modularity, suitable for peace Smart machine loaded on different sizes and functional requirement.

The TOF modules are as follows in the concrete principle for the 3D rendering for absorbing the target：The light source of the TOF circuit modules Light source driving circuit driving light source in unit generates the optical signal of predetermined modulation frequency, and it is made to be projected to object；Projection Optical signal to object obtains reflection signal after object reflects；Reflection signal is received by TOF modules, passes through the mirror Head assembly enters the TOF module internals；The photosensitive units of the TOF circuit modules receives light and photosensitive, and optical signal is turned Become electronic signal and the incident light and reflected light signal that are projected to object are analyzed, handled, and then obtains object 3D rendering and range information.

It should be understood by those skilled in the art that the embodiments of the present invention shown in foregoing description and attached drawing are only used as It illustrates and is not intended to limit the utility model.The purpose of this utility model completely effectively realizes.The function of the utility model And structural principle shows and illustrates in embodiment, under without departing from the principle, the embodiment of the utility model can To have any deformation or modification.

Claims (45)

1. a kind of miniaturization TOF circuit modules, which is characterized in that including：

Light source unit, for providing active light source to object；

Photosensitive unit, the reflection signal for receiving object, to obtain range information of the object apart from the circuit module；

Wherein, the light source unit and the photosensitive unit are set on the circuit board for stacking arrangement.

2. a kind of miniaturization TOF circuit modules according to claim 1, which is characterized in that the circuit board for stacking arrangement is 2 The circuit board of the folded arrangement of layer heap or the folded arrangement of 3 layer heaps.

3. a kind of miniaturization TOF circuit modules according to claim 1, which is characterized in that the light source unit includes driving Dynamic circuit, the driving circuit is for driving TOF light source workings.

4. a kind of miniaturization TOF circuit modules according to claim 3, which is characterized in that the driving circuit is set to heap The circuit board of folded arrangement is close to the position of TOF light sources.

5. a kind of miniaturization TOF circuit modules according to claim 1, which is characterized in that the light source unit includes temperature Detection circuit is spent, the temperature sensing circuit is for detecting TOF light-source temperatures.

6. a kind of miniaturization TOF circuit modules according to claim 5, which is characterized in that the temperature sensing circuit is set In the circuit board that stacking is arranged close to the position of TOF light sources.

7. a kind of miniaturization TOF circuit modules according to claim 1, which is characterized in that in the circuit board for stacking arrangement It is stacked by disjunctor stack manner or seperated stack manner between adjacent layer circuit board.

8. a kind of miniaturization TOF circuit modules according to claim 1, which is characterized in that in the circuit board for stacking arrangement It is connected by connecting plate between adjacent layer circuit board.

9. a kind of miniaturization TOF circuit modules according to claim 8, which is characterized in that the connecting plate is integrally formed In on the upper layer circuit board of adjacent layer circuit board.

10. a kind of miniaturization TOF circuit modules according to claim 9, which is characterized in that the upper layer circuit board passes through Connecting plate is fixed on the lower circuit plate of adjacent layer circuit board.

11. a kind of miniaturization TOF circuit modules according to claim 10, which is characterized in that the connecting plate is fixed on The mode of the lower circuit plate of adjacent layer circuit board be weld, rivet, being spirally connected, be bonded in any one.

12. a kind of miniaturization TOF circuit modules according to claim 8, which is characterized in that the connecting plate is integrally formed Between adjacent layer circuit board.

13. a kind of miniaturization TOF circuit modules according to claim 8, which is characterized in that the connecting plate is by soft or hard knot Plywood is constituted.

14. a kind of miniaturization TOF circuit modules according to claim 13, which is characterized in that the hardboard of the connecting plate It is connected to the lower circuit plate of adjacent circuit plate, one end of the soft board of the connecting plate connects the hardboard, and the soft board is another The upper layer circuit board of end connection adjacent circuit plate.

15. a kind of miniaturization TOF circuit modules according to claim 14, which is characterized in that the soft board is connected to phase The junction of the upper layer circuit board of adjacent circuit plate is connected in arcuation.

16. a kind of miniaturization TOF circuit modules according to claim 8, which is characterized in that the connecting plate by soft board and Stiffening plate is constituted.

17. a kind of miniaturization TOF circuit modules according to claim 16, which is characterized in that the reinforcement of the connecting plate Plate is connected to the lower circuit plate of adjacent circuit plate, and one end of the soft board connects the stiffening plate, the other end of the soft board Connect the upper layer circuit board of adjacent circuit plate.

18. a kind of miniaturization TOF circuit modules according to claim 1, which is characterized in that between adjacent circuit plate Away from more than 1.5 millimeters.

19. a kind of miniaturization TOF circuit modules according to claim 1, which is characterized in that in the light source unit TOF light sources are naked to be packaged on the circuit module.

20. a kind of miniaturization TOF circuit modules according to claim 19, which is characterized in that the TOF light sources are with wafer Mode is packaged on the circuit module.

21. a kind of miniaturization TOF circuit modules according to claim 19, which is characterized in that the TOF light sources are externally provided with For providing the optical element needed for the active light source of different launch angles.

22. a kind of miniaturization TOF circuit modules according to claim 21, which is characterized in that the optical element is light Learn glass.

23. a kind of miniaturization TOF circuit modules according to claim 1, which is characterized in that the light source unit includes TOF light sources.

24. a kind of miniaturization TOF circuit modules according to claim 19 or 23, which is characterized in that the TOF light sources are VCSEL。

25. a kind of miniaturization TOF circuit modules according to claim 3, which is characterized in that the driving circuit includes slow Rush device, switching device or the switching circuit with switching device；The photosensitive unit connects the buffer, and the buffer connects Connect the switching device or the switching circuit.

26. a kind of miniaturization TOF circuit modules according to claim 25, which is characterized in that the switching device is Mosfet transistor.

27. a kind of miniaturization TOF circuit modules according to claim 5, which is characterized in that the temperature sensing circuit packet Include thermistor.

28. a kind of miniaturization TOF circuit modules according to claim 1, which is characterized in that the light source unit includes protecting Protection circuit, the protection circuit provide the scheduled limitation power of TOF light sources.

29. a kind of miniaturization TOF circuit modules according to claim 28, which is characterized in that the protection circuit includes Sample circuit, comparison circuit, current detection switch circuit；The sample circuit connects the current detecting through the comparison circuit Switching circuit.

30. a kind of miniaturization TOF circuit modules according to claim 29, which is characterized in that the sample circuit includes Current sense amplifier.

31. a kind of miniaturization TOF circuit modules according to claim 29, which is characterized in that the comparison circuit includes Comparator.

32. a kind of miniaturization TOF circuit modules according to claim 29, which is characterized in that the current detection switch Circuit includes current limiting load switch.

33. a kind of miniaturization TOF circuit modules according to claim 1, which is characterized in that the light source unit further includes Power supply circuit, the power supply circuit are the sensitive chip power supply in the photosensitive unit.

34. a kind of miniaturization TOF circuit modules according to claim 1, which is characterized in that the photosensitive unit includes sense Optical chip.

35. a kind of miniaturization TOF circuit modules according to claim 34, which is characterized in that the sensitive chip is CMOS sensitive chips.

36. a kind of miniaturization TOF circuit modules according to claim 34, which is characterized in that the photosensitive unit also wraps Filter circuit is included, the filter circuit is connected to the power end of the sensitive chip.

37. a kind of miniaturization TOF circuit modules according to claim 33, which is characterized in that the power supply circuit includes It is connected with external power source voltage-stablizer.

38. according to a kind of miniaturization TOF circuit modules described in claim 37, which is characterized in that the voltage-stablizer is that LDO is steady Depressor.

39. a kind of miniaturization TOF circuit modules according to claim 1, which is characterized in that the circuit module further includes Storage unit, the storage unit are used to preserve the nominal data of TOF light sources.

40. a kind of miniaturization TOF circuit modules according to claim 39, which is characterized in that the storage unit includes Memory.

41. a kind of miniaturization TOF circuit modules according to claim 40, which is characterized in that the memory is FLASH Storage chip.

42. a kind of miniaturization TOF circuit modules according to claim 1, which is characterized in that the circuit module further includes Interface unit, the interface unit are used for output information.

43. a kind of miniaturization TOF modules, which is characterized in that including lens assembly, and as described in one of claim 1-42 TOF circuit modules；Light is projected to the TOF circuit modules by the lens assembly, to be obtained by the TOF circuit modules Range information.

44. a kind of miniaturization TOF modules according to claim 43, which is characterized in that stack phase in the circuit board of arrangement Adjacent bed circuit board is encapsulated by different shells respectively.

45. a kind of miniaturization TOF modules according to claim 44, which is characterized in that in the circuit board for stacking arrangement The encapsulating housing size of bottom circuit board is more than the encapsulating housing size outside other layer circuit boards.