CN104869293A - Image obtaining apparatus for imaging target area - Google Patents
Image obtaining apparatus for imaging target area Download PDFInfo
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- CN104869293A CN104869293A CN201510260878.3A CN201510260878A CN104869293A CN 104869293 A CN104869293 A CN 104869293A CN 201510260878 A CN201510260878 A CN 201510260878A CN 104869293 A CN104869293 A CN 104869293A
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- imageing sensor
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Abstract
The invention relates to an image obtaining apparatus for imaging a target area. The image obtaining apparatus comprises a first circuit board, a plate-to-plate connector, an illumination light source, an aiming light source, a communication interface, a second circuit board, a control circuit, an image sensor based on complementary metal oxide semiconductors (CMOS) and a pedestal, wherein the communication interface and the control circuit are arranged on the first circuit board, and the communication interface is in communication connection with the image sensor based on CMOS, the illumination light source, the aiming light source and the control circuit, and communicates with the external. The structures of the module are integrated to form a small and special integral module, and the entire module communicates with the external through the communication interface to realize transmission of control signals and image data. The integral module is convenient for mass production, and the production efficiency is improved.
Description
Technical field
The present invention relates to automatic identification field, particularly relate to a kind of image acquiring device for target area imaging.
Background technology
Two-dimensional bar code is the chequered with black and white matrix area distributed in plane (on two-dimensional directional) according to certain rule with specific geometric figure, and this matrix area is in order to record symbol information.Quick Response Code can be divided into stack Quick Response Code and matrix two-dimensional code bar code.Stack Quick Response Code forms by the bar code of multirow cutting back is stacking; Matrix two-dimensional barcode forms with a matrix type, matrix respective element position represents binary one with " point ", represents binary zero with sky, rearranges data code by point and sky.In daily life and commercial Application, the use of bar code is more and more extensive, such as: the user demand to bar code of retail trade, logistic industry, financial industry is increasing.
Developing rapidly the requirement of bar code reading taking equipment of barcode technology is also more and more higher, and bar code reads the important component part of engine as bar code reading, and the bar code decoding engine volume circulated in existing market is large, poor compatibility, production efficiency are low, and cost is high.Camera lens and transducer are detachable components; From production aspect, need fix putting after lens focusing glue, increasing production process.
There is many-sided deficiency in the image-forming module circulated in existing market, its volume is large, uses spherical mirror head mould group, be limited to production requirement, the overall volume of product can not be reduced; Its poor optical properties, visual field is little, and impact uses, and aperture is little, and need extraneous light filling, power consumption is large; Its speed is slow, and the CMOS frame number of use is low, and reading speed is slow; Its power consumption is high, and the CMOS power consumption of use is large; Its life cycle is uncontrollable, and CMOS is early stage product, and production time is longer, is more easily eliminated and affects follow-up production; Its production efficiency is low, fixes after camera lens and CMOS first focus again, high to the requirement of production environment, and manually-injected error is large, and production efficiency is lower.
Summary of the invention
In order to solve the problems of the technologies described above, the invention provides a kind of volume little, structure is simple, image collection module easy for installation.
Present invention employs following technical scheme, a kind of image acquiring device for target area imaging is provided, comprises first circuit board, board to board connector, lighting source, aiming light source, communication interface, second circuit board, control circuit, the imageing sensor based on complementary metal oxide semiconductors (CMOS), pedestal; Described first circuit board is connected by board to board connector with second circuit board; The described imageing sensor based on complementary metal oxide semiconductors (CMOS) is bonded on second circuit board by gold thread, the described image sensor array based on complementary metal oxide semiconductors (CMOS) comprises multiple pixel, and each pixel comprises pixel amplifier, photosensitive area and an exhausted light shield memory block; The described imageing sensor based on complementary metal oxide semiconductors (CMOS) of described pedestal encapsulation, pedestal, based on the imageing sensor of complementary metal oxide semiconductors (CMOS) and second circuit board one-body molded; Described pedestal comprises base station and boss, and boss is arranged with on base station, and establish guide through hole in boss, guide through hole internal fixtion has lens; Described relative with the center of guide through hole based on the imageing sensor of complementary metal oxide semiconductors (CMOS), imageing sensor receives the light of the target area reflection of being conducted by guide through hole; Control circuit, controls the described imageing sensor based on complementary metal oxide semiconductors (CMOS) and exposes multiple pixel at an exposure cycle; Lighting source and aiming light source are located at around the imageing sensor based on complementary metal oxide semiconductors (CMOS); Lighting source, for projecting a lighting pattern, aims at the focusing patterns that light source is used for projecting in target area a geometries; Communication interface, control circuit are located on first circuit board, and described communication interface communicates to connect with based on the imageing sensor of complementary metal oxide semiconductors (CMOS), lighting source, aiming light source, control circuit, and communicates with the external world.
Wherein, the described image acquiring device for target area imaging also comprises a metallic support, and described metallic support comprises bracket shell and stent foot, and bracket shell and pedestal match, and is socketed on the outside of pedestal, is fixed on first circuit board by stent foot.
Wherein, the base station of described pedestal is square structure, and boss is cylindrical structural, and the base station edge of pedestal is provided with screwed hole, and pedestal is fixed on second circuit board by screwed hole.
Wherein, the lateral wall of described boss is provided with lug, and the corresponding position of metallic support is provided with breach, and lug is limited in the indentation, there of metallic support.
Wherein, described lighting source and aiming light source are located at homonymy or the heteropleural of imageing sensor.
Wherein, described first circuit board is flexible PCB, and image-forming assembly, at least one aiming light source and at least one lighting source described in the layout of its one end, the other end arranges communication interface.
Wherein, described first circuit board is pcb board, and described image-forming assembly and communication interface can be arranged at the same face or the antarafacial of PCB.
Wherein, described communication interface is FPC connector.
Beneficial effect of the present invention is:
One, by pedestal, based on the imageing sensor of complementary metal oxide semiconductors (CMOS) and second circuit board one-body molded, facilitate the assembling of whole image-forming module, save operation, improve installation effectiveness and can production cost be reduced;
Two, first circuit board is connected by board to board connector with second circuit board, not only achieves the communication function of the two, and is easy to operation by fixing structure installment, and communication efficiency is good, and loss is low;
The imageing sensor based on complementary metal oxide semiconductors (CMOS) three, described in application controls control circui carries out work, make imageing sensor can expose multiple image pixel within same exposure period simultaneously, improve image quality, the recognition efficiency of image, thus increase work efficiency.
Four, first circuit board is connected by board to board connector with second circuit board, imageing sensor and extraneous communication is realized by board to board connector, only need described first circuit board to possess corresponding interface and just can carry out random plug, be convenient for changing image sensor module, therefore be convenient to change imageing sensor according to the demand of user, meet the demand of many application.
They are five years old, in this module, between each structure, integrated design becomes a kind of small-sized, special integral module, whole module is communicated with outside by communication interface, realize the transmission of control signal and the transmission of view data, be designed to overall module be convenient to produce in batches, enhance productivity.
Accompanying drawing explanation
Figure 1 shows that a kind of image acquiring device structural representation for target area imaging of the present invention;
Figure 2 shows that the another embodiment structural representation of a kind of image acquiring device for target area imaging of the present invention;
Fig. 3 is the lateral plan of Fig. 2;
Fig. 4 is the overall structure schematic diagram of Fig. 2;
Label declaration:
Metallic support 1 bracket shell 101 stent foot 102 guide through hole 103
Image-forming assembly 2 pedestal 201 boss 202 board to board connector 3 aims at light source 4
Lighting source 5 first circuit board 6 communication interface 7
Embodiment
By describing technology contents of the present invention, structural feature in detail, realized object and effect, accompanying drawing is coordinated to be explained in detail below in conjunction with execution mode.
Consult shown in Fig. 1 to Fig. 4, for an image acquiring device for target area imaging, comprise first circuit board, board to board connector 3, lighting source 5, aim at light source 4, communication interface 7, second circuit board, control circuit, the imageing sensor based on complementary metal oxide semiconductors (CMOS), pedestal 201; Communication interface 7, control circuit are located on first circuit board 6, described communication interface 7 with based on complementary metal oxide semiconductors (CMOS) imageing sensor, lighting source 5, aim at light source 4, control circuit communicates to connect, and to communicate with the external world.
Described first circuit board 6 is connected by board to board connector 3 with second circuit board; Namely first circuit board 6 and second circuit board achieve based on the imageing sensor of complementary metal oxide semiconductors (CMOS) and extraneous communication function after being connected by board to board connector 3.In order to enable based on complementary metal oxide semiconductors (CMOS) imageing sensor, performance is more stable in use, filter circuit can be connected with between board to board connector 3 interface at the imageing sensor based on complementary metal oxide semiconductors (CMOS), thus improve the stability of imageing sensor, further raising image quality, reduce power consumption, described filter circuit is arranged with on second circuit board, saves locus, and does not affect the use of each device.
The described imageing sensor based on complementary metal oxide semiconductors (CMOS) is bonded on second circuit board by gold thread, the described image sensor array based on complementary metal oxide semiconductors (CMOS) comprises multiple pixel, and each pixel comprises pixel amplifier, photosensitive area and an exhausted light shield memory block; Described pedestal 201 encapsulates the described imageing sensor based on complementary metal oxide semiconductors (CMOS), and described pedestal 201 comprises base station and boss 202, and boss 202 is arranged with on base station, and establish guide through hole 103 in boss 202, guide through hole 103 internal fixtion has lens; The described imageing sensor based on complementary metal oxide semiconductors (CMOS) is relative with the center of guide through hole 103, and imageing sensor receives the light of the target area reflection of being conducted by guide through hole 103; In present embodiment, the described imageing sensor based on complementary metal oxide semiconductors (CMOS) can adopt special CMOS, and its volume is little, and power consumption is little, and stable performance is powerful; Described imageing sensor can be the imageing sensor of monochrome or colour, meets different user demands.Imageing sensor is fixed on second circuit board by the mode of gold thread bonding, the communication that this fixed form operation is simple and good both ensureing, is easy to produce manufacture in batches.The pedestal 201 of package image transducer can adopt light tight integrated material, as adopted the ABS plastic of black to obtain, the light focusing that in pedestal 201, the lens of carrying can make target area reflect is to based on the imageing sensor of complementary metal oxide semiconductors (CMOS).In present embodiment, the described imageing sensor based on complementary metal oxide semiconductors (CMOS) can generate image pixel clearly according to the light of target area reflection, and by described communication interface 7, image pixel is transferred to external equipment, and as: decoding chip, decoding software, high in the clouds etc. carry out further attempting the processing procedures such as decoding.
As mentioned above, pedestal 201, based on the imageing sensor of complementary metal oxide semiconductors (CMOS) and second circuit board one-body molded, form an image-forming assembly 2; Image-forming assembly 2 can generate digitized image pixel according to the signal of incident light.Image-forming assembly 2 can have kinds of schemes, and in an optional execution mode, described pedestal 201 comprises a substrate, described substrate is fixed an integrated image sensor; Establish guide through hole 103 in described pedestal 201 boss 202, an accommodating lens group in guide through hole 103, described lens group and pedestal 201 are fixed; Integrated image sensor receives the light of lens group reflection.This integrated image sensor can adopt special integrated image sensor, adopts special integration module, and its volume is little, stable performance, can provide image more clearly, for follow-up decoding improves feasibility; Integrated image sensor can adopt encapsulation or unpackaged form, and unpackaged form is fewer than common integrated unit a slice glass protection sheet can improve the quality of imaging, and reduce costs.The main body of lens group can adopt the material of plastics, and its quality is light, and the mode of available die sinking injection moulding is made, and yield is high, uniform quality, and lens group can adopt at least a slice eyeglass composition, and this eyeglass can adopt sphere or aspherical lens, improves its optical property; Eyeglass can use optical plastic or optical glass to make, and optical plastic weight is lighter, and be applicable to aspheric lens, optical glass stable performance, selectivity is higher; The lens surface of lens group can adopt coating process, and preferred anti-reflection film or the band of adopting leads to film, to improve the transmitance of light, reduces stray light, improves image quality; Lens group can be optical plastic mold pressing and makes, and machining accuracy is high, stable performance, and production efficiency is high, cheap; The optional aperture of lens group is 2-6, selects that F-number is little can improve luminous flux, reduces the requirement to bias light or floor light, namely can reduce the power consumption of floor light, more energy-saving and environmental protection; The lens combination mode of described lens group can be that positive lens and negative lens combine, two gummed mirror, positive lens and cemented doublet combine, two gummed mirror and positive lens combines, positive lens+positive lens+negative lens, positive lens+negative lens+positive lens, two gummed mirror+bis-gummed mirror or other; Before the stop position of lens group can be positioned over first lens, between first and second lens, between second and the 3rd lens or other.Lens group, by defocused, use some glue mode to be fixed in the guide through hole 103 of pedestal 201, improves the mechanical performance of camera lens.In another optional execution mode, the described imageing sensor based on complementary metal oxide semiconductors (CMOS) can be global electronic shutter imageing sensor; Global electronic shutter imageing sensor receives the light of lens group reflection.Adopt global electronic shutter imageing sensor, can in same exposure cycle the multiple image pixel of continuous exposure, improve image quality.In above-mentioned execution mode, based on complementary metal oxide semiconductors (CMOS) (CMOS), it receives the light of lens group reflection, and the overall pixel of cmos image sensor is used to carry out effective opto-electronic conversion and the pixel of output image signal is valid pixel.Light directly can produce voltage signal after the opto-electronic conversion of photodiode, signal charge does not need transfer, and the integrated level of MOS device is high, volume is little, and cmos image sensor uses and the identical basic fundamental and the technique that manufacture semiconductor device 90%, rate of finished products is high, low cost of manufacture; Cmos image sensor can integrated various signal and image processing module on the same chip, form monolithic high integration digital imaging system, cmos image sensor uses single operating voltage, chip adopts integrated circuit, circuit does not almost have static electric quantity consumption, the consumption of electricity is only just had when circuit ON, therefore low in energy consumption; One inherent characteristic of cmos circuit is high speed, the column bus of the driving imaging array that cmos image sensor can be exceedingly fast, the speed having and be exceedingly fast and ADC works in sheet, cmos image sensing chip in addition to visible light, also responds to the non-visible light wave such as infrared.In present embodiment, adopt cmos image sensor, improve the quality of imaging, and reduce the volume of device, facilitate layout.
Control circuit, this control circuit can be global electronic shutter formula control circuit, controls the described imageing sensor based on complementary metal oxide semiconductors (CMOS) and exposes multiple pixel at an exposure cycle; Control circuit accessible site is on second circuit board or on first circuit board 6.
Communication interface 7, control circuit are located on first circuit board 6, described communication interface 7 with based on complementary metal oxide semiconductors (CMOS) imageing sensor, lighting source 5, aim at light source 4, control circuit communicates to connect, and to communicate with the external world.The input of communication interface 7 for control command or the transmission for view data, as transmitted the control command of image-forming assembly 2, controlling lighting source 5 and carrying out light filling, illumination, controls to aim at the aiming that light source 4 carries out target area.Communication interface 7 can receive the control command of the parts such as imageing sensor, lighting source 5, aiming light source 4 from control modules such as switch, button, voice, communication interface 7 can adopt FPC connector, and FPC connector can use flexible winding displacement or other connecting lines to carry out being connected and transmission of control signals, view data etc. with external equipment.Described communication interface 7 can be the wired communication interface on first circuit board 6: as USB interface, FPC connector interface, MIPI interface etc., also can be wireless communication interface: as wireless communication interfaces 7 such as bluetooth, WIFI communications.Shown in Figure 1, described communication interface 7 can be arranged on the back side of first circuit board 6, adopts FPC connector to communicate with each device in circuit board front, and realizes communicating with the external world by this FPC connector.
Described metallic support 1 comprises bracket shell 101 and stent foot 102, bracket shell 101 and pedestal 201 match, be socketed on the outside of pedestal 201, be fixed on first circuit board 6 by stent foot 102, stent foot 102 can directly be fixedly welded on first circuit board 6, or arranges corresponding location hole to locate on first circuit board 6.As shown in Figure 4, described bracket shell 101 top is provided with through hole 103, and the boss 202 for pedestal 201 passes.Described metallic support 1 can also arrange the feature of error-proof structure, conveniently location is installed, prevent setup error, error-proof structure feature can arrange projection or depression or breach etc. at described bracket shell 101, as as described in the lateral wall of boss 202 be provided with lug, the corresponding position of metallic support 1 is provided with breach, and lug is limited in the indentation, there of metallic support 1.
The base station of described pedestal 201 is square structure, and boss 202 is cylindrical structural, and the base station edge of pedestal 201 is provided with screwed hole, and pedestal 201 is fixed on second circuit board by screwed hole.Adopting the mode be screwed makes whole product can be more firm, and each device is not easy to lose, and anti-seismic performance is good, extends the life-span of product.
Lighting source 5 and aiming light source 4 are located at around the imageing sensor based on complementary metal oxide semiconductors (CMOS); Lighting source 5, for projecting a lighting pattern, aims at light source 4 for projecting the focusing patterns of a geometries in target area; Described lighting source 5 can adopt LED light source, and its wavelength can be 380-750nm, and the lighting source 5 of different wave length can meet the different needs, and can set according to concrete service condition.The angle of divergence of lighting source 5 be 120 ° or other, the angle of divergence is applicable to greatly the large camera of the angle of visual field, is conducive to covering field range.LED illumination light source 5 can also be with optically focused ball cover or not be with, and the LED light source of band ball cover has the less angle of divergence, and be conducive to long distance illumination, the LED illumination light source 5 not with ball cover is conducive to the large lighting apparatus of field of view angle.Described aiming light source 4, for run-home region, forms the naked eyes visible light spot of geometry, the light that this aiming light source 4 can adopt the such as naked eyes such as ruddiness, green glow significantly to identify at reflecting surface.One preferred embodiment in, the angle of divergence of described aiming light source 4 equals greatly 15 °.
Lighting source 5 is located at homonymy or the heteropleural of imageing sensor with aiming at light source 4, as can as described in image-forming assembly 2 one side a lighting source 5 is set respectively and one aim at light source 4; Or all arrange lighting source 5 in the both sides of described image-forming assembly 2 and aim at light source 4, as image-forming assembly 2 arranges multiple lighting source 5, another side arranges multiple aiming light sources 4 etc.The wavelength of described lighting source 5 and aiming light source 4 is not identical,
In another embodiment, shown in accompanying drawing 2,3, described first circuit board 6 is flexible PCB, and image-forming assembly 2, at least one aiming light source 4 and at least one lighting source 5 described in the layout of its one end, the other end arranges communication interface 7.First circuit board 6 adopts flexible PCB can realize the connection with other devices very easily, and its restriction by locus is smaller, and versatility is wide.First circuit board 6 can also adopt pcb board, and pcb board is drawn materials easily, with low cost, and dimensionally stable, be not easy integral module is out of shape.
The embodiment of the present invention for the image acquiring device of target area imaging is only described in upper; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (8)
1. for an image acquiring device for target area imaging, it is characterized in that: comprise first circuit board, board to board connector, lighting source, aiming light source, communication interface, second circuit board, control circuit, the imageing sensor based on complementary metal oxide semiconductors (CMOS), pedestal;
Described first circuit board is connected by board to board connector with second circuit board;
The described imageing sensor based on complementary metal oxide semiconductors (CMOS) is bonded on second circuit board by gold thread, the described image sensor array based on complementary metal oxide semiconductors (CMOS) comprises multiple pixel, and each pixel comprises pixel amplifier, photosensitive area and an exhausted light shield memory block;
The described imageing sensor based on complementary metal oxide semiconductors (CMOS) of described pedestal encapsulation, pedestal, based on the imageing sensor of complementary metal oxide semiconductors (CMOS) and second circuit board one-body molded; Described pedestal comprises base station and boss, and boss is arranged with on base station, and establish guide through hole in boss, guide through hole internal fixtion has lens; Described relative with the center of guide through hole based on the imageing sensor of complementary metal oxide semiconductors (CMOS), imageing sensor receives the light of the target area reflection of being conducted by guide through hole;
Control circuit, controls the described imageing sensor based on complementary metal oxide semiconductors (CMOS) and exposes multiple pixel at an exposure cycle;
Lighting source and aiming light source are located at around the imageing sensor based on complementary metal oxide semiconductors (CMOS); Lighting source, for projecting a lighting pattern, aims at the focusing patterns that light source is used for projecting in target area a geometries;
Communication interface, control circuit are located on first circuit board, and described communication interface communicates to connect with based on the imageing sensor of complementary metal oxide semiconductors (CMOS), lighting source, aiming light source, control circuit, and communicates with the external world.
2. the image acquiring device for target area imaging according to claim 1, is characterized in that:
Also comprise a metallic support, described metallic support comprises bracket shell and stent foot, and bracket shell and pedestal match, and is socketed on the outside of pedestal, is fixed on first circuit board by stent foot.
3. the image acquiring device for target area imaging according to claim 2, it is characterized in that: the base station of described pedestal is square structure, boss is cylindrical structural, and the base station lateral wall of pedestal is provided with screwed hole, and pedestal is fixed on second circuit board by screwed hole.
4. the image acquiring device for target area imaging according to claim 3, is characterized in that: the outward flange of described boss is provided with lug, the corresponding position of metallic support is provided with breach, and lug is limited in the indentation, there of metallic support.
5. the image acquiring device for target area imaging according to claim 4, is characterized in that:
Described lighting source is located at homonymy or the heteropleural of imageing sensor with aiming at light source.
6. the image acquiring device for target area imaging according to claim 5, is characterized in that:
Described first circuit board is flexible PCB, and image-forming assembly, at least one aiming light source and at least one lighting source described in the layout of its one end, the other end arranges communication interface.
7. the image acquiring device for target area imaging according to claim 5, is characterized in that: described first circuit board is pcb board, and described image-forming assembly and communication interface can be arranged at the same face or the antarafacial of PCB.
8. the image acquiring device for target area imaging according to claim 6 or 7, is characterized in that: described communication interface is FPC connector.
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| CN201510260878.3A CN104869293A (en) | 2015-05-21 | 2015-05-21 | Image obtaining apparatus for imaging target area |
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| CN201510260878.3A CN104869293A (en) | 2015-05-21 | 2015-05-21 | Image obtaining apparatus for imaging target area |
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| CN106645149A (en) * | 2016-11-24 | 2017-05-10 | 歌尔科技有限公司 | Board-to-board connector test system and test method |
| CN107592462A (en) * | 2017-09-26 | 2018-01-16 | 周淦星 | Multichannel WIFI wireless numericals based on electric equipment physical button |
| CN109923849A (en) * | 2016-11-01 | 2019-06-21 | Lg伊诺特有限公司 | Camera module, dual camera module, Optical devices and and the method for manufacturing dual camera module |
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Application publication date: 20150826 |