CN109899695A - A kind of list LED and its processing technology - Google Patents
A kind of list LED and its processing technology Download PDFInfo
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- CN109899695A CN109899695A CN201910129098.3A CN201910129098A CN109899695A CN 109899695 A CN109899695 A CN 109899695A CN 201910129098 A CN201910129098 A CN 201910129098A CN 109899695 A CN109899695 A CN 109899695A
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Abstract
The invention discloses a kind of single LED and its processing technologys, including top substrate layer and underlying substrate, radiating copper sheet is provided between the top substrate layer and underlying substrate, the side of the separate radiating copper sheet of the top substrate layer is provided with upper substrate hard quartz plate, the side of the separate radiating copper sheet of the underlying substrate is provided with lower substrate hard quartz plate, the side of the upper substrate hard quartz plate is provided with upper substrate pad mounting groove, the side of the lower substrate hard quartz plate is provided with lower substrate pad mounting groove, upside pad is provided on the inside of the upper substrate pad mounting groove, downside pad is provided on the inside of the lower substrate pad mounting groove, the top of the upside pad is provided with upside LED die, the present invention connects two-sided LED die by conductor rod, when avoiding using single LED processing technology, The problem of single LED processing technology is not easy to the LED integrated circuit board of processing double-side, influences the effect of single LED processing technology light source for processing.
Description
Technical field
The invention belongs to LED processing method technical fields, and in particular to a kind of list LED and its processing technology.
Background technique
LED light source is exactly the light source that light emitting diode (LED) is illuminator.Light emitting diode invention was in 60 years 20th century
In generation, in subsequent many decades, basic purposes is the indicator light as electronic equipments such as radio cassette players, and this light bulb has efficiency
Feature high, the service life is long, can be used continuously 100,000 hours, steep than ordinary incandescent lamp 100 times long.Scientist's prediction, in future 5
Year, this light bulb is likely to become the main product of next-generation illumination, and single LED light source is that multiple low-power LEDs shine
Source pools together,.
When at present using single LED processing technology, the LED that single LED processing technology is not easy to processing double-side is integrated
Circuit board influences the effect of single LED processing technology light source for processing, meanwhile, when using single LED processing technology, single LED adds
Work technique is not easy to connect multiple LED dies to increase the brightness of single LED light source, influences single LED processing technology processing
Convenience.
Summary of the invention
The purpose of the present invention is to provide a kind of single LED and its processing technologys, to solve using existing using ice-cold
When formula list LED processing technology, single LED processing technology is not easy to the LED integrated circuit board of processing double-side, while single
LED processing technology is not easy to connect multiple LED dies to increase the brightness problem of single LED light source.
To achieve the above object, the invention provides the following technical scheme: a kind of list LED, including top substrate layer and lower layer
Substrate, it is characterised in that: radiating copper sheet is provided between the top substrate layer and underlying substrate, the separate of the top substrate layer dissipates
The side of hot copper sheet is provided with upper substrate hard quartz plate, and the side of the separate radiating copper sheet of the underlying substrate is provided with lower base
Plate hard quartz plate, the side of the upper substrate hard quartz plate are provided with upper substrate pad mounting groove, the lower substrate hard
The side of quartz plate is provided with lower substrate pad mounting groove, and upside pad is provided on the inside of the upper substrate pad mounting groove,
Downside pad is provided on the inside of the lower substrate pad mounting groove, the top of the upside pad is provided with upside LED die,
The bottom end of the downside pad is provided with downside LED die, and the anode of the upside LED die passes through connecting wire bar and downside
Pad connection.
Preferably, the corresponding position of the radiating copper sheet and conductor rod is provided with ceramic short tube, and the conductor rod runs through
In the inside of ceramic short tube.
Preferably, the side of the upside pad is connected with first electrode connecting rod, the side connection of the downside pad
There is second electrode connecting rod.
Preferably, the upside pad is provided with several, several described upside pads are according to rectangular array, institute
The pole for stating upside LED die is connected on installed upside pad, another pole of the upside LED die by gold thread with
The pad connection of adjacent and not connected gold thread, the downside pad are provided with several, several described upside pads according to
Rectangular array, a pole of the downside LED die are connected on installed downside pad, the downside LED die
Another pole is connect by gold thread with the pad of adjacent and not connected gold thread/conductor rod.
Preferably, the connection direction phase in the connection direction and the gold thread of downside LED die of the gold thread of the upside LED die
Instead.
A kind of list LED processing technology, comprising the following steps:
Step 1: processing radiating copper sheet, the inside of radiating copper sheet are embedded in ceramic short tube, ceramic short tube height and radiating copper sheet
Height it is identical；
Step 2: installation base plate is fitted with top substrate layer by hot pressing attaching process in the top of radiating copper sheet, described to dissipate
The lower section of hot copper sheet is sticked underlying substrate by hot pressing attaching process, and top substrate layer and underlying substrate are disposed as double-side copper-applying
Ceramic wafer；
Step 3: opening up bond pad trench, and the side of the separate radiating copper sheet of top substrate layer passes through in the fitting of hot pressing attaching process
The side of substrate hard quartz plate, the separate radiating copper sheet of underlying substrate is bonded lower substrate hard quartz by hot pressing attaching process
Plate, the surface of upper substrate hard quartz plate are etched with upper substrate pad mounting groove, and the surface of lower substrate hard quartz plate is lost
It is carved with lower substrate pad mounting groove corresponding in upper substrate pad mounting groove；
Step 4: installation pad and LED die, the inside installation upside pad of upper substrate pad mounting groove, lower substrate weldering
The inside installation downside pad of disk mounting groove, the top installation upside LED die of upside pad, under the bottom end installation of downside pad
Side LED die；
Step 5: connecting wire bar, the positive connecting wire bar of upside LED die, conductor rod is through ceramic short tube
Inside and the bottom end for extending to underlying substrate, the end of conductor rod are connected to downside pad.
Preferably, upside pad is provided with several, several upside pads can be according to rectangular array, upside LED
One pole of tube core is connected on installed upside pad, another pole of upside LED die by gold thread with it is adjacent and do not connect
The pad connection of gold thread is connect, the another of the upside LED die of least significant end can extremely connect without the pad of adjacent and not connected gold thread
It connects, at this point, the upside LED die of least significant end is according to the step 5 connecting wire bar.
Preferably, downside pad is provided with several, several upside pads are according to rectangular array, downside LED pipe
One pole of core is connected on installed downside pad, and another pole of downside LED die passes through gold thread and adjacent and not connected
The connection of the pad of gold thread or conductor rod.
Preferably, the connection direction of the gold thread of upside LED die is contrary with the connection of the gold thread of downside LED die.
Preferably, the inside of the upside pad far from conductor rod side is fitted into first electrode connecting rod, far from conductor rod one
The inside of the downside pad of side is fitted into second electrode connecting rod.
Compared with the prior art, the present invention has the following beneficial effects:
(1) present invention connects two-sided LED die by conductor rod, passes through hot pressing attaching process in the top of radiating copper sheet
It is fitted with top substrate layer, the lower section of radiating copper sheet is sticked underlying substrate, top substrate layer and underlying substrate by hot pressing attaching process
It is disposed as opening up bond pad trench for double-side copper-applying ceramic plate, the side of the separate radiating copper sheet of top substrate layer passes through hot pressing and is bonded
Technique is bonded upper substrate hard quartz plate, and the side of the separate radiating copper sheet of underlying substrate is bonded lower base by hot pressing attaching process
Plate hard quartz plate, the surface of upper substrate hard quartz plate are etched with upper substrate pad mounting groove, lower substrate hard quartz plate
Surface be etched with lower substrate pad mounting groove corresponding in upper substrate pad mounting groove, avoid and added using single LED
When work technique, single LED processing technology is not easy to the LED integrated circuit board of processing double-side, influences single LED processing technology
The problem of effect of light source for processing.
(2) present invention is provided with multiple LED dies being connected in series, and upside pad is provided with several, several upside welderings
Disk can be connected on installed upside pad according to rectangular array, a pole of upside LED die, upside LED die
Another pole is connect by gold thread with the pad of adjacent and not connected gold thread, the gold of the upside LED die anode connection of least significant end
Pad of the line without adjacent and not connected gold thread, at this point, the upside LED die of least significant end is according to step 5 connecting wire bar, under
Side pad is provided with several, and according to rectangular array, a pole of downside LED die is connected to is pacified several upside pads
It holds on the pad of side, the pad that another pole of downside LED die passes through gold thread and adjacent and not connected gold thread or conductor rod
Connection, when avoiding using single LED processing technology, single LED processing technology is not easy to connect multiple LED dies to increase list
The brightness of LED light source, the problem of influencing the convenience of single LED processing technology processing.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is top view of the invention；
Fig. 3 is two structural schematic diagram of the embodiment of the present invention.
In figure: 1- first electrode connecting rod, 2- top substrate layer, the upside 3- LED die, the downside 4- pad, the downside 5- LED pipe
Core, pad on the upside of 6-, 7- upper substrate hard quartz plate, 8- radiating copper sheet, 9- ceramics short tube, 10- conductor rod, 11- underlying substrate,
12- second electrode connecting rod, 13- upper substrate pad mounting groove, 14- lower substrate pad mounting groove, 15- lower substrate hard quartz
Plate.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
It please refers to shown in Fig. 1-3, the invention provides the following technical scheme: a kind of list LED, including top substrate layer 2 is under
Laminar substrate 11, it is characterised in that: be provided with radiating copper sheet 8 between top substrate layer 2 and underlying substrate 11, top substrate layer 2 it is separate
The side of radiating copper sheet 8 is provided with upper substrate hard quartz plate 7, and the side of the separate radiating copper sheet 8 of underlying substrate 11 is provided with
Lower substrate hard quartz plate 15, the side of upper substrate hard quartz plate 7 are provided with upper substrate pad mounting groove 13, lower substrate hard
The side of quartz plate 15 is provided with lower substrate pad mounting groove 14, and the inside of upper substrate pad mounting groove 13 is provided with upside pad
6, the inside of lower substrate pad mounting groove 14 is provided with downside pad 4, and the top of upside pad 6 is provided with upside LED die 3,
The bottom end of downside pad 4 is provided with downside LED die 5, and the anode of upside LED die 3 is welded by connecting wire bar 10 and downside
Disk 4 connects.
The corresponding position of radiating copper sheet 8 and conductor rod 10 is provided with ceramic short tube 9, and conductor rod 10 is through ceramic short tube
9 inside.
The side of upside pad 6 is connected with first electrode connecting rod 1, and the side of downside pad 4 is connected with second electrode company
Extension bar 12.
Upside pad 6 is provided with several, several upside pads 6 according to rectangular array, upside LED die 3
One pole is connected on installed upside pad 6, and another pole of upside LED die 3 passes through gold thread and adjacent and not connected gold
The pad of line connects, and downside pad 4 is provided with several, several upside pads 6 are according to rectangular array, downside LED pipe
One pole of core 5 is connected on installed downside pad 4, another pole of downside LED die 5 by gold thread with it is adjacent and do not connect
Connect the pad connection of gold thread/conductor rod 10.
The connection direction of the gold thread of upside LED die 3 is contrary with the connection of the gold thread of downside LED die 5.
A kind of list LED processing technology, comprising the following steps:
Step 1: processing radiating copper sheet 8, the inside of radiating copper sheet 8 are embedded in ceramic short tube 9, ceramic 9 height of short tube and heat dissipation
The height of copper sheet 8 is identical；
Step 2: installation base plate is fitted with top substrate layer 2 by hot pressing attaching process in the top of radiating copper sheet 8, heat dissipation
The lower section of copper sheet 8 is sticked underlying substrate 11 by hot pressing attaching process, and top substrate layer 2 and underlying substrate 11 are disposed as being two-sided
Apply copper ceramic wafer；
Step 3: opening up bond pad trench, and the side of the separate radiating copper sheet 8 of top substrate layer 2 is bonded by hot pressing attaching process
The side of upper substrate hard quartz plate 7, the separate radiating copper sheet 8 of underlying substrate 11 is hard by hot pressing attaching process fitting lower substrate
Matter quartz plate 15, the surface of upper substrate hard quartz plate 7 are etched with upper substrate pad mounting groove 13, lower substrate hard quartz plate
15 surface is etched in the corresponding lower substrate pad mounting groove 14 of upper substrate pad mounting groove 13；
Step 4: installation pad and LED die, the inside installation upside pad 6 of upper substrate pad mounting groove 13, lower substrate
The inside installation downside pad 4 of pad mounting groove 14, the top installation upside LED die 3 of upside pad 6, the bottom of downside pad 4
End installation downside LED die 5；
Step 5: connecting wire bar 10, the positive connecting wire bar 10 of upside LED die 3, conductor rod 10 is through ceramics
The inside of short tube 9 and the bottom end for extending to underlying substrate 11, the end of conductor rod 10 are connected to downside pad 4.
Upside pad 6 is provided with several, several upside pads 6 can be according to rectangular array, upside LED die 3
A pole be connected on installed upside pad 6, another pole of upside LED die 3 passes through gold thread and adjacent and not connected
The pad of gold thread connects, and the another of the upside LED die 3 of least significant end can extremely connect without the pad of adjacent and not connected gold thread
It connects, at this point, the upside LED die 3 of least significant end is according to step 5 connecting wire bar 10.
Downside pad 4 is provided with several, several upside pads 6 according to rectangular array, downside LED die 5
One pole is connected on installed downside pad 4, and another pole of downside LED die 5 passes through gold thread and adjacent and not connected gold
The connection of the pad of line or conductor rod 10.
The connection direction of the gold thread of upside LED die 3 is contrary with the connection of the gold thread of downside LED die 5.
The inside of upside pad 6 far from 10 side of conductor rod is fitted into first electrode connecting rod 1, far from 10 side of conductor rod
Downside pad 4 inside be fitted into second electrode connecting rod 12.
Embodiment one: application method and process of the invention, in use, user can connect first electrode connecting rod 1
To positive pole, second electrode connecting rod 12 is connected to power cathode, and when energization, electric current flows to it by a upside pad 6
In the upside LED die 3 of top installation, adjacent upside pad 6 is flowed to by the gold thread of the anode of upside LED die 3, until
Electric current flows to the upside pad 6 of least significant end, the anode stream that electric current passes through the upside LED die 3 on 6 top of upside pad of least significant end
Downside pad 4 is flowed to conductor rod 10, and by conductor rod 10, the electric current on downside pad 4 equally passes sequentially through downside LED pipe
Core 5 and gold thread are transmitted to second electrode connecting rod 12, so that entire LED integrated circuit shines.
Embodiment two: application method and process of the invention, in use, user can connect first electrode connecting rod 1
To positive pole, second electrode connecting rod 12 is connected to power cathode, and when energization, electric current flows to it by a upside pad 6
In the upside LED die 3 of top installation, conductor rod 10 is flowed to by the anode of upside LED die 3, and flow by conductor rod 10
To downside pad 4, the electric current on downside pad 4 is by being transmitted to second electrode connecting rod by downside LED die 5 and gold thread
12, so that entire LED integrated circuit shines.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element ".
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of list LED, including top substrate layer (2) and underlying substrate (11), it is characterised in that: the top substrate layer (2) and
It is provided between underlying substrate (11) radiating copper sheet (8), the side setting of the separate radiating copper sheet (8) of the top substrate layer (2)
There is upper substrate hard quartz plate (7), the side of the separate radiating copper sheet (8) of the underlying substrate (11) is provided with lower substrate hard
The side of quartz plate (15), the upper substrate hard quartz plate (7) is provided with upper substrate pad mounting groove (13), the lower substrate
The side of hard quartz plate (15) is provided with lower substrate pad mounting groove (14), the inside of the upper substrate pad mounting groove (13)
It is provided with upside pad (6), downside pad (4), the upside weldering are provided on the inside of the lower substrate pad mounting groove (14)
The top of disk (6) is provided with upside LED die (3), and the bottom end of the downside pad (4) is provided with downside LED die (5), institute
The anode for stating upside LED die (3) is connect by connecting wire bar (10) with downside pad (4).
2. a kind of single LED according to claim 1, it is characterised in that: the radiating copper sheet (8) and conductor rod (10)
Corresponding position is provided with ceramic short tube (9), inside of the conductor rod (10) through ceramic short tube (9).
3. a kind of single LED according to claim 2, it is characterised in that: the side of the upside pad (6) is connected with the
The side of one electrode connecting rod (1), the downside pad (4) is connected with second electrode connecting rod (12).
4. a kind of single LED according to claim 3, it is characterised in that: the upside pad (6) is provided with several,
According to rectangular array, a pole of the upside LED die (3) is connected to is installed several described upside pads (6)
On upside pad (6), another pole of the upside LED die (3) is connected by the pad of gold thread and adjacent and not connected gold thread
It connects, the downside pad (4) is provided with several, several described upside pads (6) are according to rectangular array, the downside
One pole of LED die (5) is connected on installed downside pad (4), and another pole of the downside LED die (5) passes through gold
Line is connect with the pad of adjacent and not connected gold thread/conductor rod (10).
5. a kind of single LED according to claim 4, it is characterised in that: the company of the gold thread of the upside LED die (3)
It is contrary with the connection of gold thread of downside LED die (5) to connect direction.
6. a kind of list LED processing technology, comprising the following steps:
Step 1: processing radiating copper sheet (8), the inside of radiating copper sheet (8) are embedded in ceramic short tube (9), the height of ceramic short tube (9)
It is identical as the height of radiating copper sheet (8)；
Step 2: installation base plate is fitted with top substrate layer (2) in the top of radiating copper sheet (8) by hot pressing attaching process, described
The lower section of radiating copper sheet (8) is sticked underlying substrate (11) by hot pressing attaching process, and top substrate layer (2) and underlying substrate (11) are equal
It is set as double-side copper-applying ceramic plate；
Step 3: opening up bond pad trench, and the side of the separate radiating copper sheet (8) of top substrate layer (2) is bonded by hot pressing attaching process
Upper substrate hard quartz plate (7), under the side of the separate radiating copper sheet (8) of underlying substrate (11) is bonded by hot pressing attaching process
Substrate hard quartz plate (15), the surface of upper substrate hard quartz plate (7) are etched with upper substrate pad mounting groove (13), lower base
The surface of plate hard quartz plate (15) is etched with lower substrate pad mounting groove corresponding in upper substrate pad mounting groove (13)
(14)；
Step 4: installation pad and LED die, the inside installation upside pad (6) of upper substrate pad mounting groove (13), lower substrate
The inside installation downside pad (4) of pad mounting groove (14), the top installation upside LED die (3) of upside pad (6), downside
The bottom end installation downside LED die (5) of pad (4)；
Step 5: connecting wire bar (10), the positive connecting wire bar (10) of upside LED die (3), conductor rod (10) through
In ceramic short tube (9) inside and extend to the bottom ends of underlying substrate (11), the end of conductor rod (10) is connected to downside pad
(4)。
7. a kind of single LED processing technology according to claim 6, it is characterised in that: upside pad (6) is provided with several
A, several upside pads (6) can be connected to installed upside according to rectangular array, a pole of upside LED die (3)
On pad (6), another pole of upside LED die (3) is connect by gold thread with the pad of adjacent and not connected gold thread, least significant end
The another of upside LED die (3) extremely can connect without the pad of adjacent and not connected gold thread, at this point, the upside of least significant end
LED die (3) is according to the step 5 connecting wire bar (10).
8. a kind of single LED processing technology according to claim 6, it is characterised in that: downside pad (4) is provided with several
A, for several upside pads (6) according to rectangular array, a pole of downside LED die (5) is connected to installed downside weldering
On disk (4), another pole of downside LED die (5) passes through gold thread and pad that is adjacent and being not connected with gold thread or conductor rod (10)
Connection.
9. a kind of single LED processing technology according to claim 7, it is characterised in that: the gold thread of upside LED die (3)
Connection direction it is contrary with the connection of gold thread of downside LED die (5).
10. a kind of single LED processing technology according to claim 8, it is characterised in that: far from conductor rod (10) side
The inside of upside pad (6) is fitted into first electrode connecting rod (1), the inside of the downside pad (4) far from conductor rod (10) side
Chimeric second electrode connecting rod (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910129098.3A CN109899695A (en) | 2019-02-21 | 2019-02-21 | A kind of list LED and its processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910129098.3A CN109899695A (en) | 2019-02-21 | 2019-02-21 | A kind of list LED and its processing technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109899695A true CN109899695A (en) | 2019-06-18 |
Family
ID=66945129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910129098.3A Pending CN109899695A (en) | 2019-02-21 | 2019-02-21 | A kind of list LED and its processing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109899695A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101707234A (en) * | 2009-11-18 | 2010-05-12 | 珠海晟源同泰电子有限公司 | LED luminescence module and manufacture method thereof |
| CN203176964U (en) * | 2013-04-12 | 2013-09-04 | 何永祥 | LED (Light Emitting Diode) lamp welded on glass |
| CN204739549U (en) * | 2015-07-09 | 2015-11-04 | 深圳亚信昌科技有限公司 | Adopt two -sided LED lamp plate of aluminium base board of composite ceramic |
| CN108790325A (en) * | 2018-08-17 | 2018-11-13 | 深圳市致竑光电有限公司 | Multilayer luminescent glass |
-
2019
- 2019-02-21 CN CN201910129098.3A patent/CN109899695A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101707234A (en) * | 2009-11-18 | 2010-05-12 | 珠海晟源同泰电子有限公司 | LED luminescence module and manufacture method thereof |
| CN203176964U (en) * | 2013-04-12 | 2013-09-04 | 何永祥 | LED (Light Emitting Diode) lamp welded on glass |
| CN204739549U (en) * | 2015-07-09 | 2015-11-04 | 深圳亚信昌科技有限公司 | Adopt two -sided LED lamp plate of aluminium base board of composite ceramic |
| CN108790325A (en) * | 2018-08-17 | 2018-11-13 | 深圳市致竑光电有限公司 | Multilayer luminescent glass |
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Application publication date: 20190618 |