CN109894992A - One kind is for being bonded test material preparation process pressurization pressure quantitative control device - Google Patents
One kind is for being bonded test material preparation process pressurization pressure quantitative control device Download PDFInfo
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- CN109894992A CN109894992A CN201910271055.9A CN201910271055A CN109894992A CN 109894992 A CN109894992 A CN 109894992A CN 201910271055 A CN201910271055 A CN 201910271055A CN 109894992 A CN109894992 A CN 109894992A
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- 238000012360 testing method Methods 0.000 title claims abstract description 78
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 title claims abstract description 15
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 22
- 230000000712 assembly Effects 0.000 claims abstract description 8
- 238000000429 assembly Methods 0.000 claims abstract description 8
- 238000009864 tensile test Methods 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 5
- 238000007718 adhesive strength test Methods 0.000 abstract description 11
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 238000000034 method Methods 0.000 description 9
- 229920006335 epoxy glue Polymers 0.000 description 6
- 230000003014 reinforcing effect Effects 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
The invention discloses one kind for being bonded test material preparation process pressurization pressure quantitative control device, device is made of pedestal, the clamp assemblies being adapted with pedestal, pedestal is equipped with guide plate or limit plate, clamp assemblies include the screw rod to match with pedestal and the clamping face that is connected with screw rod through screw drive, force adjustment component is provided on the screw rod, which is equipped with dismountable control power device.When bonding, first the test specimen being bonded will be needed to be placed on device, by guide plate or limit plate accurate contraposition, prevent from misplacing；Adjusting screw rod pushes clamping face that test specimen is fixed again, then setting control power device is the numerical value for needing power, by the cooperation adjusting screw rod for controlling power device and force adjustment component, when the power for controlling power device reaches the numerical value of setting power, stop adjusting, influence of the experimentation human factor to adhesive strength test result can be effectively reduced to a certain extent, improve the repeatability of adhesive strength test result, reduce experimental error.
Description
Technical field
The present invention relates to bonding jig fields, are a kind of fixed for being bonded test material preparation process pressurization pressure specifically
Amount control device.
Background technique
Bonding belong to special process, in the production process of adhesive, in order to examine adhesive formulation, raw material quality and
Technique for sticking etc. needs to prepare test specimen and assesses its bonding quality.Usually bridging type tensile shear is prepared according to GB/T7124-2008
Strength test exemplar prepares tensile strength test sample according to GB/T6329-1996.
Adhesive strength test result by adhesive formulation, material quality other than being influenced, bond preparation process bonding plane
Product control, ambient temperature and humidity, open assembly time, pressurization pressure, condition of cure etc. can all influence to be bonded test result.It is assessed in examination
When influence of a certain factor to adhesive strength, if other influence factors cannot obtain effective consistency control, test result
Biggish fluctuation to occur, and interfere the accuracy to this factors assessment.
It is general so that clamping face is directly or indirectly applied pressure to test specimen bonding plane by rotary screw in test specimen bonding process
By force, bonding plane receiving pressure is excessive, then retention glue is less on bonding plane, and extra glue is excluded on non-adhesive interface, is deposited
Glue amount is less, and starved phenomenon locally even occurs in glue-line, and reducing effective bond area causes adhesive strength test result to be lower than
Actual value；Conversely, bonding plane bears too little pressure, then bondline thickness is big, and lesser stress can generate deformation, is easy to produce
Flowing and creep, the internal stress on bonding interface is big, and the probability for generating stomata and defect is larger, in adhesive strength test process
It then will appear glue-line fault location elder generation cracking phenomena.It can be seen that the size of bonding plane pressurization pressure directly affects adhesive strength
Test result, in order to obtain adhesive strength accurately true test result, needs quantitative control pressurization pressure in research and production
And it is controlled in proper range.
When measuring adhesive strength, pulling force or shearing force is obtained by Material Testing Machine first, then measure bond area, passed through
Tensile strength or shear strength is calculated, therefore, in bonding test material preparation and solidification process, control makes two bond standards
Really contraposition obtains accurate bond area, and an important factor for acquisition true adhesive strength value.
In research and production, when investigating influence of a certain factor to adhesive strength, other influence factors need to be kept as far as possible
State consistency obtains accurate true assessment result, during be bonded test material preparation, be bonded ambient temperature and humidity, open assembly time,
The technological parameters such as condition of cure can then need to pass through by installations and facilities strict control, the control of bond area and the pressure that pressurizes
Process unit control is realized.
Summary of the invention
The purpose of the present invention is to provide one kind for being bonded test material preparation process pressurization pressure quantitative control device, is used for
Solve the prior art pressurize during be bonded test material preparation pressure non-quantitation control and be bonded problem of misalignment.It is tried in bonding
In part preparation process, bonding plane receiving pressure is excessive or too small, causes adhesive strength test result relatively low；Bond is wrong simultaneously
Position can cause effective bond area to calculate inaccuracy, also will affect the accuracy of adhesive strength test result.
The present invention is solved the above problems by following technical proposals:
One kind is adapted for being bonded test material preparation process pressurization pressure quantitative control device, device by pedestal, with pedestal
Clamp assemblies composition, pedestal be equipped with guide plate or limit plate, clamp assemblies include the screw rod to match with pedestal and and spiral shell
Bar is connected through the clamping face of screw drive, is provided with force adjustment component on the screw rod, which is equipped with dismountable
Control power device.When bonding, first the test specimen being bonded will be needed to be placed on device, by guide plate or limit plate accurate contraposition, prevented
Only two bonds misplace；Adjusting screw rod pushes clamping face that test specimen is fixed again, and then setting control power device is to need power
Numerical value, by control power device and force adjustment component cooperation adjusting screw rod, when control power device power reach setting power numerical value when
It waits, stops adjusting, wait the bonding agent solidification among bond, the test specimen that can be completed later to bonding is tested.It uses
The present apparatus is bonded test specimen, and due to bond accurate contraposition and bonding plane pressurization pressure size can pass through control power device according to demand
Quantitative control has been well solved because of the pressure that pressurize caused by pressurization pressure cannot be controlled quantitatively, bonding plane is unable to accurate contraposition
The problems such as fluctuation and bond area calculate error avoids the accuracy and consistency that therefore influence adhesive strength test result, can
Influence of the experimentation human factor to adhesive strength test result to be effectively reduced to a certain extent, improves adhesive strength and survey
The repeatability of test result reduces experimental error.
Preferably, the control power device is power basis weight sensor device, which matches with the force adjustment component,
Then the numerical value of power needed for power basis weight sensor device is settable cooperates with force adjustment component and exerts a force, when power reaches setting numerical value
When stop force, convenient for pressurization pressure size be precisely controlled.
Preferably, the power batcher device is torque wrench or torque screwdriver, and torque screwdriver and torque wrench are
Common power basis weight sensor device, easy to operate, convenient and practical, during applied force, the numerical value of applied force, which reaches, to be set
Prompt can be issued when fixed number value, stop reinforcing, immediately convenient for being precisely controlled to power.
Preferably, the force adjustment component is at least one nut, is matched with the control power device, the quantity of nut can increase
Add, for multiple nuts without being auxiliarily fixed, being screwed on screw rod with this can be completed fixation, and control power device needs to match with nut
It can complete the adjusting of power.
Preferably, the adhering device includes tensile test specimen adhering device and tensile shear test specimen adhering device, the drawing
The pedestal for stretching shear test block adhering device is equipped with bottom plate, and bottom plate two sides are respectively equipped with moveable block, and bottom plate is for limiting
The tensile shear test specimen lap of splice is located at tensile shear bonding test specimen among block, force is prevented to be overlapped when compression
Bond misplaces because of unbalance stress, influences the accurate calculating of bond area.
Preferably, the pedestal of the tensile test specimen adhering device is equipped with guide plate, and guide plate is equipped with and the screw rod
The guiding compressor arm to match, the direction of compressor arm and guide plate control screw rod are docked for controlling tensile bond part in bonding
The constantly accurate contraposition of two test specimen bonding planes, bond misplaces when can prevent from being bonded and solidifying well.
Compared with prior art, the present invention have the following advantages that and the utility model has the advantages that
(1) present invention carries out the size for being applied to bonding plane power accurate by the matching of force adjustment component and control power device
Control, the size of power needed for being adjusted according to demands such as bonding agent, adhesives, bonded structures, to keep bonding plane pressurization pressure
Strong conformity provides a kind of short-cut method, eliminates interference of the sample preparation pressurization fluctuation of pressure to test result,
The consistency and repeatability of adhesive strength test result are improved, can more accurately reflect the result of appraisal to the shadow of adhesive strength
It rings.
(2) present invention realizes accurate contraposition of the control power device to bonding test specimen by designs such as positioning, guiding, limits, keeps away
Free sticky fitting dislocation, which influences adhesive strength, is worth accuracy.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that test specimen adhering device is cut in drawing of the invention；
Fig. 2 is the structural schematic diagram of tensile test specimen adhering device of the invention；
Fig. 3 is the stress analysis schematic diagram that the torsion of control power device of the invention is converted to the normal pressure of bond；
It is attached marked in the figure: 1- screw rod；2- clamping face；3- force adjustment component；4- guide plate/limit plate；5- pedestal；6- controls power dress
It sets.
Specific embodiment
The present invention is described in further detail below with reference to embodiment, embodiments of the present invention are not limited thereto.
Embodiment 1:
In conjunction with shown in attached Fig. 1 and 2, one kind for be bonded test material preparation process pressurization pressure quantitative control device, device by
Pedestal 5, with pedestal 5 be adapted clamp assemblies form, pedestal 5 be equipped with guide plate 4 or limit plate 4, clamp assemblies include with
The screw rod 1 that pedestal 5 matches and the clamping face 2 driven by screw rod 1 that is connected with screw rod 1, it is characterised in that: on the screw rod 1
It is provided with force adjustment component 3, which is equipped with dismountable control power device 6；The force adjustment component 3 be and the screw rod 1
Matched hex nut, and be fixedly connected with screw rod 1；The control power device 6 be torque wrench, the opening of torque wrench with it is described
Hex nut matches；The quantity of the nut is at least 1, the nut can by the modes such as processing, welding, interlocking, bonding with
Screw rod 1 securely connects.
As shown in figure 3, analyzing the normal pressure transformational relation born on the torsion and bonding test specimen of torque wrench:
When nut rises along screw rod inclined-plane constant speed, FaFor working resistance, F is driving force.Because frictional force is downward, thus it is total anti-
Power FRWith FnAngle be ρ.By the equilibrium condition of power it is found that FR, F and FaThree power form the polygon of force, can be obtained by Fig. 3:
F=Fa·tan(Ψ+ρ) 1)
Then respective drive torque are as follows:
T=Fd2/ 2=Fa·tan(Ψ+ρ)·d2/2 2)
Fa=2T/d2·tan(Ψ+ρ) 3)
P=Fa/ s=2T/d2·s·tan(Ψ+ρ) 4)
Formula 1), formula 2), formula 3), formula 4) in: T is driving moment；F is driving force；FRFor total reaction；FnFor normal reaction；Fa
For working resistance, that is, screw stretching power；ρ is angle of friction；ψ is lead angle；d2For the pitch diameter of thread；P is that test specimen bonding plane bears pressure
By force；S is bond area.
It can be obtained by Fig. 3:
Tg ψ=S/ π d2
ψ=arctg S/ π d2 5)
The adhering device clamping screw that this example uses be M12*2mm screw rod, screw rod nominal diameter 12mm, screw pitch S=2mm,
d2=11.0mm.
By formula 5) obtain ψ=3.31 °
Again because of ρ=arctgf
Coefficient of friction takes 0.3, i.e. f=0.3 between steel, then and ρ=arctgf=16.7 °
By formula 2) T=Fatan (ψ+ρ) d2/ 2 obtain
T=0.0055Fa*tg20.0=2.0 × 10-3Fa；
Bond area s=1.5 × 2=3cm of tensile shear bonding test specimen in this example2
Its bonding plane pressure P=Fa/s=10T/2.0*3=1.667T (MPa)；
As T=1N.m, P=1.667MPa
Based on above-mentioned for being bonded the transformational relation of test material preparation process pressurization pressure quantitative control device and power, such as Fig. 1
It is shown, for drawing cut and paste to connect test specimen pressurization pressure quantitative control device, 2 groups of drawing cut and pastes are completed with the device and connect test specimen, operation step
It is rapid as follows:
The first step, the adjustment of limit plate block spacing.Shear test block overall length is calculated according to the test piece lap of splice, adjusts limit plate
Block keeps distance between two blocks equal with shear test block overall length.
Limit plate is put into pedestal by second step, and bonding test specimen gluing is placed on limit plate, two test pieces respectively with limit plate
Both ends are close to.
Third step selects corresponding cushion block, turns clamping screw according to the screw stroke being connected with clamping face, until clamping
Face can directly or indirectly apply pressure in bonding plane.
Torque wrench is set to required force value by the 4th step, by torque wrench aid on hex nut, passes through torque
Spanner twists hex nut and applies pressurization pressure in bonding plane, and when torque reaches setting value, torque wrench issues prompting sound and is
Stop reinforcing.
5th step, whether there is or not inconsistent phenomenons for observation test specimen, if any that should unclamp screw rod, repeat the above steps 2~4 after adjustment.
Shear test block area control: in bonding, test specimen two ends are close to limit board ends block respectively, and shear test block is taken
It connects length variation mainly to be caused by the deviation of two test specimen processing lengths, deviation is can be controlled within 0.03mm, is being bonded
Its influence can be ignored when Strength co-mputation.
First group, test specimen is cut in the drawing for using viscosity to be bonded aluminium flake for 8.3Pa.s/25 DEG C of GX-1 epoxy glue, the power used
Square spanner range 0.5Nm~6Nm, resolution ratio 0.05Nm.Experimental data is as follows:
By manually clamping the sample of bonding, pressurization pressure cannot be accurately controlled, and the controllable property of bondline thickness is poor, thus shears strong
It is poor to spend consistency；Control pressurization pressure is reinforced by torque wrench, pressurization pressure is able to quantitative control, bondline thickness consistency
Good, the repeatability of bonding test specimen shear strength preferably, and with the increase of pressurization pressure, fall after rising by shear strength.It is right
In the larger GX-1 epoxy glue of viscosity, when the pressure that pressurizes is 2.5MPa~3.0MPa, shear strength is higher.The present apparatus can be effective
Ground avoids the inconsistent influence to bonding tensile-sbear strength of experimentation pressurization pressure, and can be improved bonding sample test result can
Repeatability.
Second group, test specimen is cut in the drawing for using viscosity to be bonded aluminium flake for 0.59Pa.s/25 DEG C of GX-2 epoxy glue, the power used
Square spanner range 0.5Nm~6Nm, scale division value 0.05Nm, experimental data are as follows:
By manually clamping the sample of bonding, shear strength consistency is poor；Control pressurization pressure is reinforced by torque wrench,
The consistency for being bonded test specimen shear strength is preferable, and with the increase of pressurization pressure, shear strength is fallen after rising.For viscosity
Lower GX-2 epoxy glue, when the pressure that pressurizes is 1.2MPa~1.5MPa, shear strength is higher.Added by torque wrench control
Pressure pressure can exclude influence of the bonding process because of reinforcing difference in size to bonding tensile-sbear strength substantially.
Embodiment 2
Using tensile test specimen adhering device as shown in Figure 2, the bonding of 1 group of tensile test specimen is completed.
The adhering device clamping screw that this example uses be M12*2mm screw rod, screw rod nominal diameter 12mm, screw pitch S=2mm,
d2=11.0mm.
By formula 5) obtain ψ=3.31 °
Again because of ρ=arctgf
Coefficient of friction takes 0.3, i.e. f=0.3 between steel, then and ρ=arctgf=16.7 °
By formula 2) T=Fatan (ψ+ρ) d2/ 2 obtain
T=0.0055Fa*tg20.0=2.0 × 10-3Fa；
Bond area s=4.90625 × 10 of tensile test specimen in this example-4m2When (diameter 25mm tensile test specimen)
Bonding plane pressure P=Fa/s=10T/2.0*4.90625=1.019T (MPa)；
As T=1N.m, P=1.019Mpa.
Tensile test specimen bonding step is as follows:
The first step is put into tensile test specimen adhering device after being bonded test specimen gluing；
Second step turns clamping screw 1, until two bonding face contacts, check two alignment conditions to viscous test specimen, pass through
Micrometer adjusting screw carries out contraposition adjustment.
Torque wrench is set to required force value by third step, by torque wrench aid on hex nut, uses torque
Spanner twists hex nut and applies pressurization pressure, and when torque reaches setting value, torque wrench issues prompting sound and stops reinforcing.
Two bonding test specimen concentricities are processed public by pedestal 5 and guide plate, the deviation of sliding seat and test specimen seat and two test specimens
Difference composition, the deviation of bottom plate and guide plate are less than 0.03mm, and the deviation of sliding seat and test specimen seat is less than 0.04mm, and two test specimens are processed
Tolerance can control within 0.02mm, and can be modified by micrometer adjusting screw, therefore two bonding test specimen concentricities can be with
Control is within 0.05mm, and when carrying out adhesive strength calculating, its influence be can be ignored.
Viscosity is used to be bonded the tensile strength test specimen of aluminium, the torque spanner used for 8.3Pa.s/25 DEG C of GX-1 epoxy glue
Range 0.5Nm~6Nm, scale division value 0.05Nm.Experimental data is as follows:
By manually clamping the sample of bonding, bondline thickness deviation 0.05mm or so, tensile strength test results dispersibility is big；
Control pressurization pressure is reinforced by torque wrench, bondline thickness consistency is preferable, and bonding test piece intensity test result dispersibility is small,
And with the increase of pressurization pressure, tensile strength is fallen after rising.For GX-1 epoxy glue, when pressurization pressure be 1.0MPa~
When 1.5MPa, tensile strength is higher.The present apparatus can guarantee that bond precisely aligns, and be effectively prevented from experimentation pressurization pressure
The inconsistent influence to bonding tensile strength test results, can be improved the repeatability of bonding sample test result.
In conclusion apparatus of the present invention can be effectively avoided experimentation pressurization pressure it is inconsistent to bonding tensile strength
The repeatability of bonding sample test result, and significant effect can be improved in the influence of test result.
Although reference be made herein to invention has been described for explanatory embodiment of the invention, and above-described embodiment is only this hair
Bright preferable embodiment, embodiment of the present invention are not limited by the above embodiments, it should be appreciated that those skilled in the art
Member can be designed that a lot of other modification and implementations, these modifications and implementations will fall in principle disclosed in the present application
Within scope and spirit.
Claims (6)
1. one kind is adapted for being bonded test material preparation process pressurization pressure quantitative control device, device by pedestal and pedestal
Clamp assemblies composition, pedestal are equipped with guide plate or limit plate, and clamp assemblies include the screw rod to match with pedestal and and screw rod
The clamping face being connected through screw drive, it is characterised in that: force adjustment component is provided on the screw rod, which is equipped with
Dismountable control power device.
2. according to claim 1 for being bonded test specimen pressurization pressure quantitative control device, it is characterised in that: the control power
Device is power basis weight sensor device, which matches with the force adjustment component.
3. according to claim 2 for being bonded test specimen pressurization pressure quantitative control device, it is characterised in that: the power is fixed
Vessel device is torque wrench or torque screwdriver.
4. according to claim 1 for being bonded test specimen pressurization pressure quantitative control device, it is characterised in that: the force adjustment
Component is at least one nut, is matched with the control power device.
5. according to claim 1 for being bonded test material preparation process pressurization pressure quantitative control device, it is characterised in that:
The adhering device includes tensile test specimen adhering device and tensile shear test specimen adhering device, the tensile shear test specimen bonding dress
The pedestal set is equipped with bottom plate, and bottom plate two sides are respectively equipped with moveable block.
6. according to claim 5 for being bonded test material preparation process pressurization pressure quantitative control device, it is characterised in that:
The pedestal of the tensile test specimen adhering device is equipped with guide plate, and guide plate is equipped with the guiding to match with the screw rod and compresses
Bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910271055.9A CN109894992A (en) | 2019-04-04 | 2019-04-04 | One kind is for being bonded test material preparation process pressurization pressure quantitative control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910271055.9A CN109894992A (en) | 2019-04-04 | 2019-04-04 | One kind is for being bonded test material preparation process pressurization pressure quantitative control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109894992A true CN109894992A (en) | 2019-06-18 |
Family
ID=66954360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910271055.9A Pending CN109894992A (en) | 2019-04-04 | 2019-04-04 | One kind is for being bonded test material preparation process pressurization pressure quantitative control device |
Country Status (1)
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| CN (1) | CN109894992A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5224386A (en) * | 1991-08-26 | 1993-07-06 | Curtis John M | Tensile testing grip apparatus |
| JP2008256561A (en) * | 2007-04-05 | 2008-10-23 | Fujitsu Microelectronics Ltd | Perpendicular tension type adhesion strength test machine |
| CN201681004U (en) * | 2010-01-19 | 2010-12-22 | 上海梅山钢铁股份有限公司 | Coating strength sample bonding fixture |
| CN106840872A (en) * | 2016-12-18 | 2017-06-13 | 内蒙古航天红岗机械有限公司 | A kind of making frock of adhesive tensile shear strength sample |
| CN107817148A (en) * | 2017-11-24 | 2018-03-20 | 三峡大学 | A kind of adhering device and application method for accurately controlling banjo fixing butt jointing bondline thickness |
| CN207336326U (en) * | 2017-05-24 | 2018-05-08 | 哈尔滨电机厂有限责任公司 | Adhesive adhesion test device |
| CN109142060A (en) * | 2018-09-29 | 2019-01-04 | 江西理工大学 | The loading experimental method and device of axial gradient static stress are realized to class rock material |
| CN210173350U (en) * | 2019-04-04 | 2020-03-24 | 中国工程物理研究院化工材料研究所 | Be used for bonding test piece preparation process pressurization pressure quantitative control device |
-
2019
- 2019-04-04 CN CN201910271055.9A patent/CN109894992A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5224386A (en) * | 1991-08-26 | 1993-07-06 | Curtis John M | Tensile testing grip apparatus |
| JP2008256561A (en) * | 2007-04-05 | 2008-10-23 | Fujitsu Microelectronics Ltd | Perpendicular tension type adhesion strength test machine |
| CN201681004U (en) * | 2010-01-19 | 2010-12-22 | 上海梅山钢铁股份有限公司 | Coating strength sample bonding fixture |
| CN106840872A (en) * | 2016-12-18 | 2017-06-13 | 内蒙古航天红岗机械有限公司 | A kind of making frock of adhesive tensile shear strength sample |
| CN207336326U (en) * | 2017-05-24 | 2018-05-08 | 哈尔滨电机厂有限责任公司 | Adhesive adhesion test device |
| CN107817148A (en) * | 2017-11-24 | 2018-03-20 | 三峡大学 | A kind of adhering device and application method for accurately controlling banjo fixing butt jointing bondline thickness |
| CN109142060A (en) * | 2018-09-29 | 2019-01-04 | 江西理工大学 | The loading experimental method and device of axial gradient static stress are realized to class rock material |
| CN210173350U (en) * | 2019-04-04 | 2020-03-24 | 中国工程物理研究院化工材料研究所 | Be used for bonding test piece preparation process pressurization pressure quantitative control device |
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